JP7078194B2 - 電子部品の電極形成用導電性樹脂組成物 - Google Patents

電子部品の電極形成用導電性樹脂組成物 Download PDF

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Publication number
JP7078194B2
JP7078194B2 JP2022504007A JP2022504007A JP7078194B2 JP 7078194 B2 JP7078194 B2 JP 7078194B2 JP 2022504007 A JP2022504007 A JP 2022504007A JP 2022504007 A JP2022504007 A JP 2022504007A JP 7078194 B2 JP7078194 B2 JP 7078194B2
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conductive resin
resin composition
electrode
forming
mass
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JPWO2021220976A1 (https=
JPWO2021220976A5 (ja
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聡一郎 江崎
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Shoei Chemical Inc
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Shoei Chemical Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055—Etched foil electrodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2022504007A 2020-05-01 2021-04-23 電子部品の電極形成用導電性樹脂組成物 Active JP7078194B2 (ja)

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JP2020081191 2020-05-01
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JP2020081191 2020-05-01
JP2020081190 2020-05-01
JP2020087086 2020-05-19
JP2020087085 2020-05-19
JP2020087086 2020-05-19
JP2020087085 2020-05-19
PCT/JP2021/016514 WO2021220976A1 (ja) 2020-05-01 2021-04-23 導電性樹脂組成物及び電子部品の製造方法

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US (2) US12603192B2 (https=)
EP (1) EP4144801A4 (https=)
JP (2) JP7078194B2 (https=)
KR (1) KR102952186B1 (https=)
CN (1) CN115516589B (https=)
PH (1) PH12022553274A1 (https=)
TW (1) TWI896654B (https=)
WO (1) WO2021220976A1 (https=)

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WO2021220975A1 (ja) * 2020-05-01 2021-11-04 昭栄化学工業株式会社 電子部品の製造方法
CN115698379B (zh) * 2020-07-03 2024-12-20 三菱材料电子化成株式会社 金属包覆树脂粒子及其制造方法、包含金属包覆树脂粒子的导电性膏以及导电性膜
JP2022067931A (ja) * 2020-10-21 2022-05-09 Tdk株式会社 電子部品
KR102946083B1 (ko) * 2020-12-18 2026-04-01 삼성전기주식회사 적층형 전자 부품 및 그 제조방법
US20250066579A1 (en) * 2021-11-02 2025-02-27 Shoei Chemical Inc. Thermosetting conductive resin composition and method for producing electronic component
CN118475996A (zh) * 2021-12-22 2024-08-09 松下知识产权经营株式会社 固体电解电容器元件和固体电解电容器
JP7640489B2 (ja) * 2022-03-30 2025-03-05 ノリタケ株式会社 熱硬化性ペースト
US12592345B2 (en) * 2022-05-30 2026-03-31 Tdk Corporation Multilayer ceramic electronic device
TWI834389B (zh) * 2022-11-18 2024-03-01 國巨股份有限公司 陶瓷電容之金屬電極及其製造方法
CN118057558A (zh) 2022-11-18 2024-05-21 国巨股份有限公司 陶瓷电容的金属电极及其制造方法

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JP2000133043A (ja) 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
JP2000215729A (ja) 1998-08-28 2000-08-04 Matsushita Electric Ind Co Ltd 導電性ペ―スト、およびそれを用いた導電性構造、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法
WO2003035739A1 (fr) 2001-10-19 2003-05-01 Hitachi Chemical Co., Ltd. Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition
JP2004168966A (ja) 2002-11-22 2004-06-17 Hitachi Chem Co Ltd 導電性樹脂組成物及びこれを用いた電子部品
JP2007157434A (ja) 2005-12-02 2007-06-21 Shoei Chem Ind Co 導体形成方法

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JP6877750B2 (ja) * 2017-12-06 2021-05-26 ナミックス株式会社 導電性ペースト
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JP7565686B2 (ja) * 2019-12-20 2024-10-11 ノリタケ株式会社 導電性ペースト
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JP2000215729A (ja) 1998-08-28 2000-08-04 Matsushita Electric Ind Co Ltd 導電性ペ―スト、およびそれを用いた導電性構造、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法
JP2000133043A (ja) 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
WO2003035739A1 (fr) 2001-10-19 2003-05-01 Hitachi Chemical Co., Ltd. Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition
JP2004168966A (ja) 2002-11-22 2004-06-17 Hitachi Chem Co Ltd 導電性樹脂組成物及びこれを用いた電子部品
JP2007157434A (ja) 2005-12-02 2007-06-21 Shoei Chem Ind Co 導体形成方法

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CN115516589A (zh) 2022-12-23
US12603192B2 (en) 2026-04-14
EP4144801A4 (en) 2024-12-25
US20230343481A1 (en) 2023-10-26
TWI896654B (zh) 2025-09-11
EP4144801A1 (en) 2023-03-08
TW202213407A (zh) 2022-04-01
JPWO2021220976A1 (https=) 2021-11-04
KR20230006863A (ko) 2023-01-11
US20230170105A1 (en) 2023-06-01
KR102952186B1 (ko) 2026-04-15
PH12022553274A1 (en) 2024-04-22
JP2022106752A (ja) 2022-07-20
WO2021220976A1 (ja) 2021-11-04
US12205731B2 (en) 2025-01-21
JP7103543B1 (ja) 2022-07-20
CN115516589B (zh) 2025-05-30

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