WO2020195847A1 - Dispositif électronique et son procédé de fabrication - Google Patents

Dispositif électronique et son procédé de fabrication Download PDF

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Publication number
WO2020195847A1
WO2020195847A1 PCT/JP2020/010600 JP2020010600W WO2020195847A1 WO 2020195847 A1 WO2020195847 A1 WO 2020195847A1 JP 2020010600 W JP2020010600 W JP 2020010600W WO 2020195847 A1 WO2020195847 A1 WO 2020195847A1
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Prior art keywords
region
electronic device
grooves
composition
liquid
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PCT/JP2020/010600
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English (en)
Japanese (ja)
Inventor
和則 富士
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ローム株式会社
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Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to JP2021509011A priority Critical patent/JP7312814B2/ja
Priority to DE112020001452.5T priority patent/DE112020001452T5/de
Priority to US17/430,995 priority patent/US20220148944A1/en
Priority to CN202080024496.XA priority patent/CN113632215A/zh
Publication of WO2020195847A1 publication Critical patent/WO2020195847A1/fr
Priority to JP2023113325A priority patent/JP2023126979A/ja

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Definitions

  • the present disclosure relates to electronic devices and methods for manufacturing electronic devices.
  • Patent Document 1 describes a conventional electronic device.
  • the electronic device described in Patent Document 1 includes a lead frame (metal member), a semiconductor element (electronic component), and a mold resin (resin member).
  • the semiconductor element is mounted on the lead frame, for example, by soldering.
  • the mold resin covers a part of the lead frame and the semiconductor element.
  • soldering for example, there is a reflow method.
  • the solder temporarily becomes liquid. At this time, the liquid solder may flow out to an unintended place.
  • Such outflow of solder causes short-circuit abnormalities in electronic devices, deterioration of electrical characteristics and thermal characteristics, bonding abnormalities of semiconductor elements, and the like, resulting in deterioration of reliability of electronic devices.
  • the present disclosure has been conceived in view of the above problems, and an object of the present disclosure is to provide an electronic device with improved reliability and a method for manufacturing the electronic device.
  • the electronic device provided by the first aspect of the present disclosure comprises an electronic component, a support member having a mounting surface on which the electronic component is mounted, and the electronic component and the support member.
  • a bonding material for fixing the component to the support member is provided, and the mounting surface surrounds the first region in which a plurality of grooves are formed and the first region when viewed in the first direction. It has a region, and the bonding material is in contact with the first region and not in contact with the second region.
  • the method for manufacturing an electronic device includes a first step of preparing a support member having a mounting surface, a first region on the mounting surface, and the above when viewed in the first direction.
  • the first region is formed by forming, and the bonding material after the fifth step is in contact with the first region and not in contact with the second region.
  • the electronic device of the present disclosure reliability can be improved. Further, according to the manufacturing method of the present disclosure, it is possible to manufacture an electronic device with improved reliability.
  • FIG. 16 is a cross-sectional view taken along the line XVII-XVII of FIG. It is a top view which shows the electronic device which concerns on 4th Embodiment. It is sectional drawing which follows the XIX-XIX line of FIG. It is a top view which shows the electronic device which concerns on 5th Embodiment. It is an enlarged view of the main part which enlarged a part of FIG. It is a side view (right side view) which shows the electronic device which concerns on 5th Embodiment. It is sectional drawing which follows the line XXIII-XXIII of FIG. It is a top view which shows the 1st region concerning the modification. It is a top view which shows the 1st region concerning the modification.
  • the electronic device A1 of the first embodiment includes an electronic component 1, a lead frame 2, a joining material 3, a connecting member 4, and a resin member 5.
  • FIG. 1 is a plan view showing the electronic device A1, and the resin member 5 is shown by an imaginary line (dashed line).
  • FIG. 2 in the plan view of FIG. 1, the joining material 3 and the connecting member 4 are omitted, and the electronic component 1 is shown by an imaginary line.
  • FIG. 3 is a bottom view showing the electronic device A1.
  • FIG. 4 is a side view (right side view) showing the electronic device A1.
  • FIG. 5 is a cross-sectional view taken along the line VV of FIG.
  • FIG. 6 is a partially enlarged cross-sectional view of the region VI of FIG.
  • FIG. 7 is an enlarged partially enlarged cross-sectional view of the region VII of FIG.
  • the z direction is the thickness direction of the electronic device A1.
  • the x direction is the left-right direction in the plan view (see FIG. 1) of the electronic device A1.
  • the y direction is the vertical direction in the plan view (see FIG. 1) of the electronic device A1.
  • one in the z direction (upper in the cross-sectional view shown in FIG. 5) may be referred to as upper, and the other in the z direction (lower in the cross-sectional view shown in FIG. 5) may be referred to as lower. It does not limit the posture.
  • the z direction corresponds to the "first direction" described in the claims.
  • the electronic device A1 is a surface mount package type. As shown in FIGS. 1 to 7, the electronic device A1 is composed of a package in which a lead wire (terminal lead portion 23 described later) does not protrude from the resin member 5 in a plan view.
  • the electronic component 1 is a functional center in the electronic device A1.
  • the electronic component 1 is an integrated circuit (IC) such as an LSI (Large Scale Integration).
  • IC integrated circuit
  • the electronic component 1 is not limited to an IC, but may be a voltage control element such as an LDO (Low Drop Out), an amplification element such as an operational capacitor, or a discrete component such as a transistor, a diode, an LED, or a terahertz element. You may.
  • the electronic component 1 may be, for example, a resistor, an inductor, a capacitor, or the like.
  • the electronic component 1 has, for example, a rectangular shape in a plan view.
  • the electronic component 1 is joined to a part of the lead frame 2 (die pad portion 21 described later) by the joining material 3.
  • the electronic component 1 has a main surface 11 and a back surface 12 as shown in FIGS. 4 and 5.
  • the main surface 11 and the back surface 12 are separated in the z direction.
  • the main surface 11 is the upper surface of the electronic component 1
  • the back surface 12 is the lower surface of the electronic component 1. Both the main surface 11 and the back surface 12 are flat.
  • the electronic component 1 has a plurality of electrode pads 13. Each electrode pad 13 is a terminal of the electronic component 1. Each electrode pad 13 is exposed from the main surface 11.
  • the lead frame 2 forms a conduction path between the electronic component 1 and the circuit board by being mounted on a circuit board of an electronic device or the like.
  • the lead frame 2 supports the electronic component 1.
  • the lead frame 2 contains a conductive material.
  • This conductive material is, for example, a metal containing Cu (copper).
  • the lead frame 2 may be a metal plate of Cu or a Cu alloy, or Cu may be formed on the surface of an organic substrate.
  • the surface layer of the lead frame 2 is a metal containing Cu.
  • the lead frame 2 corresponds to the "support member" described in the claims.
  • the lead frame 2 includes a die pad portion 21, a plurality of suspension lead portions 22, and a plurality of terminal lead portions 23.
  • the lead frame 2 includes one die pad portion 21, two suspension lead portions 22, and eight terminal lead portions 23, as shown in FIG.
  • the electronic component 1 is fixed to the die pad portion 21 via the bonding material 3, and the electronic component 1 is mounted on the die pad portion 21.
  • the die pad portion 21 has, for example, a rectangular shape in a plan view. As shown in FIG. 5, the die pad portion 21 has a main surface 211 and a back surface 212.
  • the main surface 211 and the back surface 212 are separated from each other in the z direction.
  • the main surface 211 is the upper surface of the die pad portion 21.
  • the back surface 212 is the lower surface of the die pad portion 21.
  • the back surface 212 is exposed from the resin member 5 as shown in FIGS. 3 to 5.
  • the back surface 212 may be covered with the resin member 5. However, by exposing the back surface 212 from the resin member 5, the effect of dissipating heat from the electronic component 1 is enhanced.
  • the main surface 211 has a first region 211a and a second region 211b. Details of the first region 211a and the second region 211b will be described later.
  • the main surface 211 corresponds to the "mounting surface" described in the claims.
  • the plurality of hanging lead portions 22 are connected to the die pad portion 21 as shown in FIGS. 1 and 5, respectively.
  • the plurality of hanging lead portions 22 extend one by one from each end edge of the die pad portion 21 in the y direction.
  • a part of each suspension lead portion 22 is bent in the z direction.
  • the edge on the side connected to the die pad portion 21 is located lower in the z direction than the edge on the opposite side in the y direction, but the opposite is true. It may be located above in the z direction.
  • each terminal lead portion 23 is separated from the die pad portion 21 and the hanging lead portion 22. As shown in FIGS. 1 to 4, each terminal lead portion 23 includes a pad portion 231 and a terminal portion 232, respectively.
  • One end of the connecting member 4 is joined to the pad portion 231. A part of the terminal portion 232 is exposed from the resin member 5.
  • the pad portion 231 and the terminal portion 232 are connected and integrally formed.
  • the joining material 3 is interposed between the electronic component 1 and the die pad portion 21 (lead frame 2) to join them.
  • the constituent material of the bonding material 3 contains the solid of the first composition.
  • the first composition is, for example, solder.
  • the solder may be lead-free solder or lead-containing solder.
  • the bonding material 3 may be a conductive bonding material different from the solder. Further, the bonding material 3 may be an insulating bonding material instead of the conductive bonding material.
  • the first composition is a material that undergoes a phase transition to a liquid state when heated.
  • the joining material 3 has a first surface 31, a second surface 32, and a third surface 33.
  • the first surface 31 faces upward in the z direction and is in contact with the electronic component 1.
  • the second surface 32 faces downward in the z direction and is in contact with the die pad portion 21 of the lead frame 2.
  • the second surface 32 substantially coincides with the first region 211a in a plan view.
  • the third surface 33 is connected to the first surface 31 and the second surface 32.
  • the third surface 33 is a curved surface. In the present embodiment, a part of the third surface 33 (the outer peripheral portion in the plan view) overlaps the second region 211b in the plan view as shown in FIG.
  • the third surface 33 does not have to overlap the second region 211b in a plan view.
  • Each of the plurality of connecting members 4 conducts the electronic component 1 and the lead frame 2 (each terminal lead portion 23).
  • Each connecting member 4 is, for example, a bonding wire.
  • the connecting member 4 is not limited to the bonding wire, and may be a bonding ribbon or a plate-shaped clip member.
  • the constituent material of each connecting member 4 may be Cu, Au (gold) or Al (aluminum).
  • each connecting member 4 is joined to the electrode pad 13 of the electronic component 1, and the other end is joined to the pad portion 231 of each terminal lead portion 23.
  • each connecting member 4 is a bonding wire, which is bonded to the electrode pad 13 by ball bonding and to the pad portion 231 by wedge bonding.
  • the pad portion 231 may be ball-bonded and the electrode pad 13 may be wedge-bonded.
  • the resin member 5 is a sealing material in the electronic device A1. As shown in FIGS. 4 and 5, the resin member 5 covers the electronic component 1, a part of the lead frame 2, the joining material 3, and the plurality of connecting members 4.
  • the constituent material of the resin member 5 contains the solid of the second composition.
  • the second composition is, for example, an epoxy resin.
  • the resin member 5 has, for example, a rectangular shape in a plan view. As shown in FIGS. 1 to 5, the resin member 5 has a resin main surface 51, a resin back surface 52, and a plurality of resin side surfaces 53.
  • the resin main surface 51 and the resin back surface 52 are separated from each other in the z direction.
  • the resin main surface 51 is the upper surface of the resin member 5.
  • the resin back surface 52 is the lower surface of the resin member 5.
  • a part of the lead frame 2 (the back surface 212 of the die pad portion 21 and a part of each terminal portion 232) is exposed from the resin back surface 52.
  • the plurality of resin side surfaces 53 are connected to both the resin main surface 51 and the resin back surface 52, and are sandwiched between them in the z direction.
  • the resin member 5 has a pair of resin side surfaces 531 separated in the x direction and a pair of resin side surfaces 532 separated in the y direction.
  • a part of the terminal portion 232 of each terminal lead portion 23 is exposed on the resin back surface 52 and is exposed on any one of the pair of resin side surfaces 531.
  • the first region 211a is in contact with the joining material 3 as shown in FIG.
  • the first region 211a has, for example, a rectangular shape in a plan view. In a plan view, the electronic component 1 overlaps the first region 211a.
  • the first region 211a has a plurality of grooves 711, a plurality of raised portions 712, and a plurality of intervening portions 713.
  • Each of the plurality of grooves 711 is recessed downward in the z direction from each intervening portion 713.
  • the plurality of grooves 711 can be formed, for example, by laser processing for irradiating a laser beam.
  • the method for forming the plurality of grooves 711 is not limited to laser processing, and may be etching or the like.
  • the plurality of grooves 711 have the following arrangement pattern.
  • Each groove 711 extends linearly along a direction orthogonal to the z direction. In the present embodiment, each groove 711 extends along the x direction as shown in FIG. 2, but may extend along the y direction.
  • the plurality of grooves 711 are arranged in parallel with each other.
  • the width W1 see FIG.
  • each groove 711 is, for example, about 20 to 40 ⁇ m.
  • the depth d1 (see FIG. 6) of each groove 711 is, for example, about 5 to 20 ⁇ m.
  • the distance P1 (see FIG. 6) between the two adjacent grooves 711 is, for example, about 30 to 200 ⁇ m.
  • the distance P1 is the distance at the center of each of the two adjacent grooves 711 in the width direction.
  • each of the plurality of raised portions 712 is connected to each end edge of one groove 711 in the y direction. Of the two edges in the y direction, one of the raised portions 712 is connected to the groove 711 and the other is connected to the intervening portion 713. Each raised portion 712 protrudes upward in the z direction from each intervening portion 713.
  • Each of the plurality of intervening portions 713 is arranged between two adjacent grooves 711, as shown in FIG. Each intervening portion 713 is sandwiched between two adjacent grooves 711 via a raised portion 712 in the y direction. Each intervening portion 713 is formed so that the laser beam is not irradiated at the time of forming each groove 711. As shown in FIG. 8, the intervening portion 713 may not be formed due to the width W1 and the interval P1 of the plurality of grooves 711 formed by laser processing. For example, when the interval P1 is smaller than the width W1 of each groove 711, the intervening portion 713 is not formed. In this case, as shown in FIG. 8, each raised portion 712 is sandwiched between two adjacent grooves 711, and each end edge in the y direction is connected to the groove 711.
  • the first region 211a is undulated by a plurality of grooves 711, a plurality of raised portions 712, and a plurality of intervening portions 713. Therefore, the first region 211a is a rough surface. Further, each surface of the plurality of grooves 711 and the plurality of raised portions 712 has fine irregularities by laser processing. Therefore, each of these surfaces is rough due to the fine irregularities. The rough surface roughness of each of these surfaces is finer than the rough surface roughness of the first region 211a.
  • the first region 211a exhibits liquid friendliness with respect to the liquid of the first composition (for example, solder).
  • the plurality of grooves 711 formed in the first region 211a make the first region 211a liable to the liquid of the first composition.
  • the first region 211a in which the plurality of grooves 711 are formed has higher liquid friendliness to the liquid of the first composition than in the case where the plurality of grooves 711 are not formed.
  • the second region 211b is not in contact with the bonding material 3 but in contact with the resin member 5.
  • the second region 211b is, for example, a rectangular ring in a plan view.
  • the second region 211b surrounds the first region 211a in a plan view.
  • the inner edge of the second region 211b is in contact with the outer edge of the first region 211a in a plan view.
  • the second region 211b has a plurality of grooves 721, a plurality of raised portions 722, and a plurality of intervening portions 723.
  • each of the plurality of grooves 721 is recessed downward in the z direction from each intervening portion 723.
  • the plurality of grooves 721 can be formed by, for example, laser processing.
  • the method of forming the plurality of grooves 721 is not limited to laser processing, and may be, for example, etching.
  • the plurality of grooves 721 have the following arrangement pattern.
  • Each groove 721 extends linearly along a direction orthogonal to the z direction. In the present embodiment, each groove 721 extends along the x direction as shown in FIG. 2, but may extend along the y direction.
  • the plurality of grooves 721 are arranged parallel to each other.
  • the width W2 (see FIG. 7) of each groove 721 is, for example, about 5 to 10 ⁇ m.
  • each groove 721 is, for example, about 5 to 10 ⁇ m.
  • the distance P2 (see FIG. 7) between the two adjacent grooves 721 is, for example, about 10 to 20 ⁇ m.
  • the distance P2 is the distance at the center of each of the two adjacent grooves 721 in the width direction.
  • each of the plurality of raised portions 722 is connected to each end edge of one groove 721 in the y direction. Of the two edges in the y direction, one of the raised portions 722 is connected to the groove 721 and the other is connected to the intervening portion 723. Each raised portion 722 projects upward in the z direction with respect to each intervening portion 723.
  • each of the plurality of intervening portions 723 is arranged between two adjacent grooves 721.
  • Each intervening portion 723 is sandwiched between two adjacent grooves 721 via a raised portion 722 in the y direction.
  • Each intervening portion 723 is formed so that the laser beam is not irradiated at the time of forming each groove 721.
  • the intervening portion 723 may not be formed as in the intervening portion 713 due to the width W2 and the interval P2 of the plurality of grooves 721 formed by laser processing (see FIG. 8).
  • the intervening portion 723 is not formed.
  • each raised portion 722 is sandwiched between two adjacent grooves 721, and each end edge in the y direction is connected to the groove 721.
  • the second region 211b is undulated by a plurality of grooves 721, a plurality of raised portions 722, and a plurality of intervening portions 723. Therefore, the second region 211b is a rough surface. Further, each surface of the plurality of grooves 721 and the plurality of raised portions 722 has fine irregularities by laser processing. Therefore, each of these surfaces is rough due to the fine irregularities. The rough surface roughness of each of these surfaces is finer than the rough surface roughness of the second region 211b.
  • the second region 211b exhibits positivity with respect to the liquid of the second composition (for example, epoxy resin).
  • the plurality of grooves 721 formed in the second region 211b make the second region 211b liable to the liquid of the second composition.
  • the first region 211a is more liquid-friendly to the liquid of the first composition than the second region 211b.
  • the first region 211a since the first composition is solder, the first region 211a has higher solder wettability than the second region 211b. For example, adjusting the width W1, spacing P1 and depth d1 of the groove 711 formed in the first region 211a and the width W2, spacing P2 and depth d2 of the groove 721 formed in the second region 211b. Therefore, there is a difference between the positivity of the first composition with respect to the liquid and the positivity of the second composition with respect to the liquid.
  • the width W1 of the groove 711 is larger than the width W2 of the groove 721, and the interval P1 of the grooves 711 is larger than the interval P2 of the groove 721.
  • the positivity of the first composition of the first region 211a with respect to the liquid is made higher than that of the first composition of the second region 211b with respect to the liquid.
  • FIGS. 9 to 13 are plan views showing one step in the manufacturing method of the electronic device A1.
  • the lead frame 2 is prepared. This step corresponds to the "first step" described in the claims.
  • the lead frame 2 to be prepared can be formed by, for example, punching or bending a copper plate.
  • the lead frame 2 at this point includes a die pad portion 21, a plurality of suspension lead portions 22, a plurality of terminal lead portions 23, and a plurality of tie bars 25, and the die pad portion 21 and a plurality of suspensions.
  • the lead portion 22 and the plurality of terminal lead portions 23 are connected by a plurality of tie bars 25.
  • the first region 211a and the second region 211b are formed on the die pad portion 21 of the lead frame 2.
  • This step corresponds to the "second step" described in the claims.
  • the first region 211a is a portion that forms the bonding material 3 and mounts the electronic component 1.
  • the second region 211b is a region in which the bonding material 3 is not formed.
  • the main surface 211 of the die pad portion 21 of the lead frame 2 is irradiated with a laser beam to excavate the main surface 211 to form a plurality of grooves 711 and a plurality of grooves 721.
  • a well-known laser irradiation device is used for irradiating the laser beam.
  • the plurality of grooves 711 are formed in, for example, a rectangular region in a plan view.
  • the region in which the plurality of grooves 711 are formed is the first region 211a.
  • the plurality of grooves 721 are formed in a rectangular annular region in a plan view surrounding the region (first region 211a) in which the plurality of grooves 711 are formed.
  • the region in which the plurality of grooves 721 are formed is the second region 211b.
  • Each arrangement pattern of the plurality of grooves 711 and the plurality of grooves 721 is as described above. Either the first region 211a or the second region 211b may be formed first, or may be formed at the same time. In the following drawings (FIGS. 11 to 13), the grooves 711 and 721 are omitted.
  • the paste-like bonding material 3 is applied to the region (first region 211a) in which the plurality of grooves 711 are formed, and the electronic component 1 is placed on the paste-like bonding material 3. Place.
  • the step of applying the paste-like bonding material 3 corresponds to the "third step” described in the claims, and the process of placing the electronic component 1 on the paste-like bonding material 3 is claimed.
  • the constituent material of the bonding material 3 is the first composition.
  • the first composition is, for example, solder. Therefore, the solder paste is applied to the first region 211a.
  • reflow processing is performed.
  • This step corresponds to the "fifth step” described in the claims.
  • the paste-like bonding material 3 becomes liquid and has high fluidity due to the heating during the reflow treatment.
  • the liquid bonding material 3 spreads over the first region 211a. This is because the first region 211a exhibits liquid friendliness with respect to the liquid bonding material 3 due to the plurality of grooves 711. At this time, the liquid bonding material 3 spreads evenly in the first region 211a due to the liquidity of the bonding material 3 in the first region 211a with respect to the liquid. Further, the liquid bonding material 3 stays in the first region 211a and does not flow out to the second region 211b.
  • the second region 211b has a lower liquidity to the liquid bonding material 3 than the first region 211a, and the force for retaining the liquid bonding material 3 in the first region 211a works to form the second region 211a.
  • the outflow to the region 211b is suppressed.
  • the liquid bonding material 3 is solidified by cooling during the reflow treatment to become a solid bonding material 3.
  • the electronic component 1 is joined to the lead frame 2 (die pad portion 21) by the solid bonding material 3.
  • each electrode pad 13 on the main surface 11 of the electronic component 1 and the pad portion 231 of each terminal lead portion 23 of the lead frame 2 are made conductive by the connecting member 4, respectively.
  • the connecting member 4 is, for example, a bonding wire, and the forming of the connecting member 4 is performed using, for example, a wire bonding device provided with a capillary.
  • the resin member 5 is formed.
  • the resin member 5 is formed by, for example, transfer molding.
  • the constituent material of the resin member 5 contains the solid of the second composition.
  • This second composition is, for example, an epoxy resin.
  • the lead frame 2 and the resin member 5 are cut into individual pieces for each electronic component 1. For example, it is separated by blade dicing.
  • the electronic device A1 shown in FIGS. 1 to 7 is formed.
  • the above-mentioned manufacturing method is an example.
  • the electronic component 1 is fixed to the lead frame 2 (die pad portion 21) by the bonding material 3 (solid).
  • the lead frame 2 (die pad portion 21) has a main surface 211 on which the electronic component 1 is mounted.
  • the main surface 211 has a first region 211a in which a plurality of grooves 711 are formed, and a second region 211b that surrounds the first region 211a in a plan view.
  • the bonding material 3 is in contact with the first region 211a and not in contact with the second region 211b. According to this configuration, since the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, the thickness of the bonding material 3 becomes thin or non-uniform in the first region 211a.
  • the electronic device A1 can suppress the thickness of the bonding material 3 from becoming non-uniform, it is possible to suppress each of the above-mentioned bonding defects. Therefore, the electronic device A1 can improve the reliability.
  • the bonding material 3 is a solid of the first composition (for example, solder), and the first region 211a is more liquid-friendly to the liquid of the first composition than the second region 211b. ..
  • the liquid bonding material 3 has a relatively liquid affinity for the liquid of the first composition. Attempting to stay in the high first region 211a prevents the first composition from spreading to the second region 211b, which has a relatively low liquid affinity for the liquid.
  • the electronic device A1 is a liquid bonding material because the liquid-friendly property of the first composition of the first region 211a is higher than that of the liquid of the first composition of the second region 211b. 3 can be suppressed from flowing out to the second region 211b.
  • a plurality of grooves 711 are formed in the first region 211a. According to this configuration, since the bonding material 3 is filled in the plurality of grooves 711 of the first region 211a, the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) is increased by the anchor effect. Further, since the plurality of grooves 711 are formed by laser processing, fine irregularities are formed on the surface of the plurality of grooves 711. Therefore, the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) can be further improved by the anchor effect.
  • the resin member 5 is a solid of the second composition (for example, epoxy resin).
  • a plurality of grooves 721 are formed in the second region 211b, and the plurality of grooves 721 make the second region 211b liable to the liquid of the second composition.
  • the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) is increased by the anchor effect.
  • the plurality of grooves 721 are formed by laser processing, the surface of the plurality of grooves 721 is formed with fine irregularities. Therefore, the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) can be further improved by the anchor effect.
  • FIG. 14 and 15 show the electronic device according to the second embodiment.
  • the electronic device A2 of the second embodiment is different from the electronic device A1 in that the main surface 211 of the die pad portion 21 further includes a third region 211c.
  • FIG. 14 is a plan view showing the electronic device A2.
  • the electronic component 1, the joining material 3, and the resin member 5 are shown by imaginary lines, and the connecting member 4 is omitted.
  • FIG. 15 is a cross-sectional view taken along the line XV-XV of FIG.
  • the third region 211c is interposed between the first region 211a and the second region 211b in a plan view.
  • the third region 211c is, for example, a rectangular ring in a plan view. In a plan view, the third region 211c has an inner edge in contact with the outer edge of the first region 211a and an outer edge in contact with the inner edge of the second region 211b.
  • the third region 211c is flat with no grooves formed.
  • the third region 211c is, for example, Ag-plated (silver-plated).
  • the third region 211c is in contact with the bonding material 3 as shown in FIG.
  • the second surface 32 of the joining material 3 is in contact with both the first region 211a and the third region 211c, and the second surface 32 of the joining material 3 is the first surface 32 in a plan view. It overlaps the region 211a and the third region 211c.
  • the third region 211c may have a configuration in which a plurality of grooves 711 continuing from the first region 211a are formed and Ag plating is applied.
  • the third region 211c is formed in the step of forming the first region 211a and the second region 211b on the die pad portion 21 of the lead frame 2.
  • the third region 211c exhibits positivity with respect to the liquid of the first composition by the formed Ag plating.
  • the third region 211c is more liquid-friendly to the liquid of the first composition than the first region 211a.
  • the third region 211c is higher than the liquid of the first composition than the second region 211b. Highly positivity to.
  • the manufacturing method of the electronic device A2 is different from the manufacturing method of the electronic device A1 in that the third region 211c is formed. Others are substantially the same as the manufacturing method of the electronic device A1.
  • the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. ing.
  • the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, so that the bonding material 3 is formed in the first region 211a. It is possible to prevent the thickness from becoming thin and non-uniform. Therefore, the electronic device A2 can improve the reliability in the same manner as the electronic device A1.
  • the main surface 211 of the die pad portion 21 is formed with a third region 211c interposed between the first region 211a and the second region 211b in a plan view.
  • the third region 211c is more liquid-friendly to the liquid of the first composition than the second region 211b.
  • the liquid bonding material 3 when the bonding material 3 becomes liquid in the manufacturing process (reflow processing) of the electronic device A2, the liquid bonding material 3 has a relatively liquid affinity for the liquid of the first composition. Attempting to stay in the high third region 211c prevents the first composition from spreading to the second region 211b, which has a relatively low liquid affinity for the liquid.
  • the electronic device A2 is a liquid bonding material because the liquid-friendly property of the first composition in the third region 211c is higher than the liquid-friendly property of the first composition in the second region 211b. 3 can be suppressed from flowing out to the second region 211b.
  • the third region 211c has higher liquidity to the liquid of the first composition than the first region 211a.
  • the difference in liquidity of the first composition with respect to the liquid at the boundary between the third region 211c and the second region 211b is the first composition at the boundary between the first region 211a and the second region 211b.
  • the electronic device A2 can more effectively suppress the liquid bonding material 3 from flowing out to the second region 211b than the electronic device A1. That is, the electronic device A2 can further improve the reliability as compared with the electronic device A1.
  • the same effect as that of the electronic device A1 can be obtained by the configuration common to the electronic device A1.
  • the third region 211c by subjecting the third region 211c to Ag plating, the third region 211c exhibits positivity with respect to the liquid of the first composition (bonding material 3), and the positivity is exhibited.
  • the third region 211c is made higher than the first region 211a is shown, but the present invention is not limited to this. If the liquidarity of the first composition of the third region 211c to the liquid is higher than that of the first composition of the first region 211a to the liquid, instead of Ag plating, other coating agents and the like can be used. May be substituted.
  • FIG. 16 and 17 show the electronic device according to the third embodiment.
  • the electronic device A3 of the third embodiment is different from the electronic device A2 in that the third region 211c is recessed from the first region 211a and the second region 211b.
  • FIG. 16 is a plan view showing the electronic device A3.
  • the electronic component 1, the joining material 3, and the resin member 5 are shown by imaginary lines, and the connecting member 4 is omitted.
  • FIG. 17 is a cross-sectional view taken along the line XVII-XVII of FIG.
  • the third region 211c is recessed from the first region 211a and the second region 211b as described above.
  • a groove 731 surrounding the first region 211a is formed in the third region 211c.
  • the third region 211c of the present embodiment is not in contact with the bonding material 3.
  • the second surface 32 of the bonding material 3 is in contact with the first region 211a and not in contact with the third region 211c.
  • a part of the third surface 33 of the bonding material 3 does not overlap the second region 211b but overlaps the third region 211c.
  • the groove 731 is, for example, a rectangular ring in a plan view, and the inner edge is connected to the outer edge of the first region 211a, and the outer edge is connected to the inner edge of the second region 211b.
  • the width of the groove 731 is, for example, about 50 to 200 ⁇ m, and the depth of the groove 731 is, for example, about 30 to 100 ⁇ m.
  • Grooves 731 can be formed, for example, by laser processing or etching.
  • the manufacturing method of the electronic device A3 is different from the manufacturing method of the electronic device A2 in the method of forming the third region 211c. Others are substantially the same as the manufacturing method of the electronic device A2.
  • the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. ing.
  • the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, so that the bonding material 3 is formed in the first region 211a. It is possible to prevent the thickness from becoming thin and non-uniform. Therefore, the electronic device A3 can improve the reliability in the same manner as the electronic device A1.
  • the main surface 211 of the die pad portion 21 is formed with a third region 211c interposed between the first region 211a and the second region 211b in a plan view.
  • a groove 731 is formed in the third region 211c, and the groove 731 is recessed downward in the z direction from the first region 211a and the second region 211b.
  • the same effect as that of the electronic device A1 (A2) can be obtained by the configuration common to the electronic device A1 (A2).
  • FIG. 18 and 19 show the electronic device according to the fourth embodiment.
  • the electronic device A4 of the fourth embodiment is different from the electronic device A2 in that the third region 211c exhibits liquid repellency to the liquid of the first composition.
  • FIG. 18 is a plan view showing the electronic device A4. In FIG. 18, the electronic component 1, the joining material 3, and the resin member 5 are shown by imaginary lines, and the connecting member 4 is omitted.
  • FIG. 19 is a cross-sectional view taken along the line XIX-XIX of FIG.
  • the third region 211c is not in contact with the bonding material 3, as shown in FIG.
  • the second surface 32 of the bonding material 3 is in contact with the first region 211a and not in contact with the third region 211c.
  • a part of the third surface 33 of the bonding material 3 does not overlap the second region 211b but overlaps the third region 211c in the plan view.
  • the third region 211c exhibits liquid repellency to the liquid of the first composition. That is, since the first composition is solder, the third region 211c has low solder wettability.
  • a groove 731 is formed in the third region 211c, and a plurality of protrusions protruding upward in the z direction from the bottom surface of the groove 731 are formed in the groove 731. Therefore, the third region 211c is a rough surface having a plurality of protrusions.
  • the surface structure (shape) of the third region 211c is similar to the surface structure (shape) of, for example, a lotus leaf or a taro leaf.
  • the third region 211c exhibits liquid repellency to the liquid of the first composition due to its surface structure.
  • Grooves 731 can be formed, for example, by laser processing or etching.
  • the manufacturing method of the electronic device A4 is different from the manufacturing method of the electronic device A2 in the method of forming the third region 211c. Others are substantially the same as the manufacturing method of the electronic device A2.
  • the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. ing.
  • the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, so that the bonding material 3 is formed in the first region 211a. It is possible to prevent the thickness from becoming thin and non-uniform. Therefore, the electronic device A4 can improve the reliability in the same manner as the electronic device A1.
  • a third region 211c interposed between the first region 211a and the second region 211b is formed on the main surface 211 of the die pad portion 21 in a plan view.
  • the third region 211c exhibits liquid repellency to the liquid of the first composition.
  • the liquid bonding material 3 becomes the first region 211a due to the action of surface tension at the boundary between the first region 211a and the third region 211c. It stays and the outflow to the third region 211c is suppressed. Therefore, the bonding material 3 is not in contact with the third region 211c. Therefore, the electronic device A4 can prevent the liquid bonding material 3 from flowing out to the second region 211b. That is, the electronic device A4 can improve the reliability.
  • the same effect as that of the electronic device A1 (A2, A3) can be obtained by the configuration common to the electronic device A1 (A2, A3).
  • the electronic device A5 of the fifth embodiment is different from the electronic device A1 mainly in the configuration of the lead frame 2.
  • FIG. 20 is a plan view showing the electronic device A5.
  • the resin member 5 is shown by an imaginary line.
  • FIG. 21 is an enlarged view of a main part obtained by enlarging a part of FIG. 20.
  • the electronic component 1 and the resin member 5 are shown by imaginary lines, and the joining member 3 and the connecting member 4 are omitted.
  • FIG. 22 is a side view (right side view) showing the electronic device A5.
  • the resin member 5 is shown by an imaginary line.
  • FIG. 23 is a cross-sectional view taken along the line XXIII-XXIII of FIG.
  • the electronic device A5 is composed of a so-called TO (Transistor Outline) package.
  • the electrode pad 13 of the electronic component 1 includes a main surface electrode 131 and a back surface electrode 132, as shown in FIG. 23.
  • the main surface electrode 131 is exposed on the main surface 11, and the back surface electrode 132 is exposed on the back surface 12.
  • the back surface electrode 132 conducts to the die pad portion 21 (lead frame 2) via the bonding material 3. Therefore, the bonding material 3 in this embodiment is conductive.
  • one of the plurality of terminal lead portions 23 is connected to the die pad portion 21.
  • the terminal lead portion 23 arranged at the center in the x direction is connected to the die pad portion 21.
  • the terminal lead portion 23 connected to the die pad portion 21 does not include the pad portion 231 but includes the terminal portion 232. Further, each terminal lead portion 23 protrudes from the resin member 5.
  • the main surface 211 of the die pad portion 21 has a first region 211a and a second region 211b, similarly to the electronic device A1.
  • the configurations of the first region 211a and the second region 211b are the same as those of the electronic device A1.
  • the plurality of grooves 711 formed in the first region 211a are linear extending in the y direction and are arranged in parallel with each other.
  • the plurality of grooves 721 formed in the second region 211b are linear extending in the y direction and are arranged in parallel with each other.
  • the plurality of grooves 711 and the plurality of grooves 721 may be linear extending in the x direction, similarly to the electronic device A1.
  • the manufacturing method of the electronic device A5 is different from the manufacturing method of the electronic device A1 in that the lead frame 2 to be prepared is different. Others are substantially the same as the manufacturing method of the electronic device A1.
  • the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. ing.
  • the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, so that the bonding material 3 is formed in the first region 211a. It is possible to prevent the thickness from becoming thin and non-uniform. Therefore, the electronic device A5 can improve the reliability in the same manner as the electronic device A1.
  • the same effect as that of the electronic device A1 can be obtained by the configuration common to the electronic device A1.
  • each third region 211c according to any of the second embodiment to the fourth embodiment may be further formed on the main surface 211. In this case, the same effect as that of any of the second embodiment to the fourth embodiment can be obtained.
  • the plurality of grooves 711 formed in the first region 211a are linear in a plan view and arranged in parallel with each other is shown.
  • the plurality of grooves 711 may be arranged in a linear shape and a mesh shape in a plan view.
  • FIG. 24 shows the first region 211a when a plurality of grooves 711 having a linear view in a plan view are arranged in a mesh shape.
  • the widths W11 and W12 see FIG. 24
  • the intervals P11 and P12 see FIG. 24
  • the first region 211a is liable to the liquid of the first composition.
  • the plurality of grooves 721 formed in the second region 211b may be linear and may be arranged in a mesh shape in a plan view.
  • the plurality of grooves 711 formed in the first region 211a are linear in a plan view
  • the present invention is not limited to this.
  • the plurality of grooves 711 may have a circular shape (dotted shape) and may be arranged in a matrix shape in a plan view.
  • FIG. 25 shows the first region 211a when a plurality of circular grooves 711 in a plan view are arranged in a matrix.
  • W1 width of each groove 711
  • Px and Py see FIG. 25
  • the first region 211a is liable to the liquid of the first composition.
  • the plurality of grooves 721 formed in the second region 211b may have a circular shape and may be arranged in a matrix in a plan view.
  • each of the plurality of grooves 711 may be a wavy or crank-shaped curve in a plan view.
  • the wavy or crank-shaped groove 711 can be formed in a plan view by moving the laser beam in a wavy or crank shape instead of moving the laser beam linearly.
  • crank-shaped is not limited to the one in which the bending angle of the bent portion is a right angle, and includes the one having an acute angle and the one having an obtuse angle.
  • the first region 211a is liable to the liquid of the first composition.
  • the plurality of grooves 721 formed in the second region 211b may have a wavy or crank-shaped curve in a plan view.
  • the arrangement of the plurality of grooves 711 formed in the first region 211a, the plurality of grooves 721 formed in the second region 211b, and the grooves 731 formed in the third region 211c is not limited to the one described above.
  • the first region 211a, the second region 211b, and the third region 211c may be configured so as to exhibit the above-mentioned lipophilicity or liquid repellent property, respectively.
  • each groove 711, 721, 731 may have an arrangement pattern showing positivity or liquid repellency based on well-known biomimetics.
  • the case where one electronic component 1 is provided is shown, but a plurality of electronic components 1 may be provided.
  • the first region 211a may be formed below each electronic component 1, and each electronic component 1 may be joined onto the first region 211a via the bonding material 3.
  • the present invention is not limited to this.
  • the second region 211b may be flat.
  • the electronic device and the method for manufacturing the electronic device according to the present disclosure are not limited to the above-described embodiment.
  • the specific configuration of each part of the electronic device of the present disclosure and the specific processing of each step of the manufacturing method of the electronic device of the present disclosure can be variously redesigned.
  • the electronic devices and methods of manufacturing the electronic devices of the present disclosure include embodiments relating to the following appendices.
  • Appendix 1 With electronic components A support member having a mounting surface on which the electronic component is mounted, and It is provided with a joining material that is interposed between the electronic component and the support member and fixes the electronic component to the support member.
  • the mounting surface has a first region in which a plurality of grooves are formed, and a second region that surrounds the first region when viewed in the first direction.
  • An electronic device in which the bonding material is in contact with the first region and not in contact with the second region.
  • the bonding material contains the solid of the first composition and contains.
  • the first region is described in Appendix 1, wherein the first region exhibits positivity with respect to the liquid of the first composition, and is more liable to the liquid of the first composition than the second region.
  • Electronic device [Appendix 3] The electronic device according to Appendix 2, wherein the first composition is solder.
  • Appendix 4 The electron according to any one of Appendix 2 or Appendix 3, wherein the mounting surface further has a third region interposed between the first region and the second region when viewed in the first direction. apparatus.
  • Appendix 5 The electronic device according to Appendix 4, wherein the third region is in contact with the bonding material.
  • [Appendix 6] The electronic device according to Appendix 5, wherein the third region has a higher liquid friendliness to the liquid of the first composition than the first region.
  • [Appendix 7] The electronic device according to Appendix 5 or Appendix 6, wherein the third region is Ag-plated.
  • [Appendix 8] The electronic device according to Appendix 4, wherein the third region is not in contact with the bonding material.
  • [Appendix 9] The electronic device according to Appendix 8, wherein the third region is recessed from the first region and the second region.
  • [Appendix 10] The electronic device according to Appendix 8, wherein the third region exhibits liquid repellency to the liquid of the first composition.
  • [Appendix 11] It further includes the electronic component and a resin member that covers the mounting surface.
  • [Appendix 16] The electronic device according to Supplementary Note 14 or 15, further comprising a connecting member for conducting the electronic component and the terminal lead portion.
  • [Appendix 17] A plurality of grooves are formed in the second region.
  • [Appendix 18] The electronic device according to Appendix 17, wherein the width of the plurality of grooves in the first region is larger than the width of the plurality of grooves in the second region.
  • [Appendix 19] The electronic device according to Appendix 17 or Appendix 18, wherein the arrangement interval of the plurality of grooves in the first region is larger than the arrangement interval of the plurality of grooves in the second region.
  • [Appendix 20] The electronic device according to any one of Appendix 17 to Appendix 19, wherein the plurality of grooves in the first region are linear and arranged in parallel with each other.
  • [Appendix 21] The electronic device according to any one of Supplementary note 17 to Appendix 20, wherein the plurality of grooves in the second region are linear and arranged in parallel with each other.
  • [Appendix 22] The electronic device according to any one of Supplementary note 1 to Supplementary note 21, wherein the first region has a rectangular shape when viewed in the first direction.

Abstract

La présente invention porte sur un dispositif électronique (A1) comprenant : un composant électronique (1) ; un élément de support (une partie pastille de puce (21) d'une grille de connexion (2)) présentant une surface de montage (surface principale (211)) sur laquelle est monté le composant électronique (1) ; et un matériau de liaison (3) qui est interposé entre le composant électronique (1) et l'élément de support (partie pastille de puce (21)), et qui fixe à demeure le composant électronique (1) sur l'élément de support (partie pastille de puce (21)). La surface de montage (surface principale (211)) comprend une première zone (211a) dans laquelle une pluralité de rainures (711) sont formées, et une seconde zone (211b) entourant la première zone (211a) telle qu'observée dans la direction z. Le matériau de liaison (3) est adjacent à la première zone (211a) et n'est pas adjacent à la seconde zone (211b). Cette configuration permet d'augmenter la fiabilité du dispositif électronique.
PCT/JP2020/010600 2019-03-26 2020-03-11 Dispositif électronique et son procédé de fabrication WO2020195847A1 (fr)

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JP2021509011A JP7312814B2 (ja) 2019-03-26 2020-03-11 電子装置および電子装置の製造方法
DE112020001452.5T DE112020001452T5 (de) 2019-03-26 2020-03-11 Elektronikbauteil und verfahren zum herstellen eines elektronikbauteils
US17/430,995 US20220148944A1 (en) 2019-03-26 2020-03-11 Electronic device and method for manufacturing electronic device
CN202080024496.XA CN113632215A (zh) 2019-03-26 2020-03-11 电子装置以及电子装置的制造方法
JP2023113325A JP2023126979A (ja) 2019-03-26 2023-07-10 電子装置

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CN113632215A (zh) 2021-11-09
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JP7312814B2 (ja) 2023-07-21
US20220148944A1 (en) 2022-05-12

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