WO2020188946A1 - スクリーン印刷装置およびスクリーン印刷方法 - Google Patents

スクリーン印刷装置およびスクリーン印刷方法 Download PDF

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Publication number
WO2020188946A1
WO2020188946A1 PCT/JP2019/051000 JP2019051000W WO2020188946A1 WO 2020188946 A1 WO2020188946 A1 WO 2020188946A1 JP 2019051000 W JP2019051000 W JP 2019051000W WO 2020188946 A1 WO2020188946 A1 WO 2020188946A1
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WO
WIPO (PCT)
Prior art keywords
printing
cleaning
paste
mask
substrate
Prior art date
Application number
PCT/JP2019/051000
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
萬谷　正幸
満 河内
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2020549731A priority Critical patent/JP6846609B2/ja
Priority to CN201980092925.4A priority patent/CN113474172B/zh
Priority to DE112019007039.8T priority patent/DE112019007039T5/de
Publication of WO2020188946A1 publication Critical patent/WO2020188946A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F35/00—Cleaning arrangements or devices
    • B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
    • B41F35/005—Cleaning arrangements or devices for screen printers or parts thereof for flat screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2235/00—Cleaning
    • B41P2235/10—Cleaning characterised by the methods or devices
    • B41P2235/20—Wiping devices
    • B41P2235/24—Wiping devices using rolls of cleaning cloth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present disclosure relates to a screen printing apparatus and a screen printing method for printing a paste on a substrate.
  • the screen printing device brings the substrate into contact with the lower surface of the mask having a plurality of openings, moves the squeegee on the mask, pushes a paste such as cream solder into the plurality of openings, and transfers the paste to the substrate.
  • the screen printing apparatus prints on a predetermined number of substrates, it performs cleaning to remove the paste adhering to the mask. It is known that the transfer amount of the paste printed on the substrate is reduced in printing immediately after cleaning (see, for example, Patent Document 1).
  • the attack angle of the squeegee is tilted from that in normal printing to increase the transfer amount so that there is no difference in the paste transfer amount from normal printing. There is.
  • the printing apparatus of the present disclosure includes a mask, a substrate holding portion, a substrate positioning mechanism, a printing head, and a cleaning mechanism.
  • the mask has multiple openings for printing the paste.
  • the board holding part holds the board.
  • the board positioning mechanism moves the board holding part to align the board held by the board holding part with the lower surface of the mask.
  • the print head prints the paste on the mask onto the substrate through multiple openings.
  • the cleaning mechanism can use multiple cleaning methods for cleaning the underside of the mask.
  • the printing conditions for the print head to print the paste on the substrate are changed based on the cleaning method executed among the multiple cleaning methods.
  • the screen printing method of the present disclosure is A screen printing method that prints paste on a substrate.
  • a substrate contacting process in which the substrate is brought into contact with the lower surface of a mask having a plurality of openings.
  • the printing process of pushing the paste into multiple openings with the print head A cleaning process that uses one of several cleaning methods to remove the paste on the mask, After the cleaning step, the print condition change step of changing the print condition in which the print head prints the paste on the substrate according to the executed cleaning method, Have.
  • FIG. 1 is a configuration explanatory view of the screen printing system of the embodiment.
  • FIG. 2 is a plan view showing the structure of the screen printing apparatus of the embodiment.
  • FIG. 3 is a side view showing the structure of the screen printing apparatus of the embodiment.
  • FIG. 4 is a functional explanatory view of a print head included in the screen printing apparatus of the embodiment.
  • FIG. 5 is a functional explanatory view of a cleaning mechanism included in the screen printing apparatus of the embodiment.
  • FIG. 6 is a block diagram showing a configuration of a control system of the screen printing apparatus of the embodiment.
  • FIG. 7 is a diagram showing an example of a print condition correction information input screen in the screen printing apparatus of the embodiment.
  • FIG. 8 is a flow chart of the screen printing method of the embodiment.
  • FIG. 9A is a diagram illustrating a transition of the volume fraction of the printed paste in the screen printing apparatus of the embodiment.
  • FIG. 9B is a diagram illustrating a transition of the volume fraction of the printed paste in the
  • a wet cleaning method that uses a solvent and a dry cleaning method that does not use a solvent may be executed at predetermined printing intervals.
  • the degree of reduction in the amount of paste transferred in printing immediately after cleaning differs depending on the cleaning method.
  • Patent Document 1 the same printing conditions are applied immediately after cleaning regardless of the cleaning method. Therefore, the transfer amount of the printed paste may vary, and the print quality may vary.
  • the transport direction of the substrate (horizontal direction in FIG. 2) is the X direction
  • the direction orthogonal to the X direction in the horizontal plane is the Y direction
  • the X direction and the direction orthogonal to the Y direction is defined as the Z direction.
  • the screen printing system 1 is configured by connecting the screen printing device M1 and the print inspection device M2 in series from the upstream side (left side of the paper surface) to the downstream side (right side of the paper surface) in the substrate transport direction.
  • the screen printing device M1 and the printing inspection device M2 are connected to the management computer 3 via the communication network 2.
  • the management computer 3 stores production data including a control program used by the screen printing device M1 and the printing inspection device M2, work history of the screen printing device M1 and the printing inspection device M2, inspection result information, and the like. Then, the management computer 3 transmits information between the screen printing device M1 and the print inspection device M2, transmits information to other devices, and the like.
  • the screen printing system 1 is arranged upstream of the mounting board manufacturing line for mounting components on the board, and the board that has been inspected by the printing inspection device M2 is transported to the component mounting device downstream thereof.
  • the screen printing device M1 prints the paste on the substrate carried in from the upstream side through the mask in which a plurality of openings are formed.
  • the print inspection device M2 includes an inspection camera and a three-dimensional sensor. The print inspection device M2 inspects the state of the paste printed on the upper surface of the substrate conveyed from the screen printing device M1 and the amount of the paste. The inspection result is transmitted to the management computer 3 and also to the screen printing device M1.
  • the screen printing device M1 includes a pair of conveyors 5 extending in the X direction on the base 4.
  • the base 4 is provided with a control unit C.
  • the transport conveyor 5 is controlled by the control unit C, transports the substrate 6 received from the upstream side of the screen printing device M1 in the X direction, and carries it out to the downstream side of the screen printing device M1.
  • a substrate holding unit 7 controlled by the control unit C is provided near the center of the conveyor 5 in the X direction. The substrate holding unit 7 receives the substrate 6 transported by the transport conveyor 5 and holds it at a predetermined clamp position.
  • the mask 8 has a rectangular flat plate shape that extends in an XY plane, and its outer circumference is supported by a frame member 8w.
  • an XY table 9, a ⁇ table 10, and a board elevating mechanism 11 are provided on the base 4 in this order from the bottom.
  • the XY table 9 moves the ⁇ table 10 in the horizontal plane (X direction, Y direction).
  • the ⁇ table 10 rotates the substrate elevating mechanism 11 by ⁇ degrees around the Z axis.
  • the substrate elevating mechanism 11 supports the substrate holding portion 7 from below and elevates it.
  • the XY table 9, the ⁇ table 10, and the substrate elevating mechanism 11 are controlled by the control unit C.
  • a camera unit 13 incorporating a substrate recognition camera and a mask recognition camera is provided below the mask 8.
  • the camera unit 13 moves in the horizontal plane by the camera moving mechanism 14 (see FIG. 6) controlled by the control unit C (arrow a1).
  • the camera unit 13 moves between the substrate 6 and the mask 8 to take an image of the alignment substrate side mark formed on the substrate 6 and the alignment mask side mark 8m formed on the mask 8.
  • the control unit C recognizes the positions of the mask side mark 8m and the substrate side mark based on the image captured by the camera unit 13.
  • control unit C sets the XY table 9 and ⁇ so that the plurality of openings 8a formed in the mask 8 and the electrodes formed on the substrate 6 held by the substrate holding unit 7 match based on the recognition result.
  • the position and orientation of the table 10 and the board elevating mechanism 11 are controlled.
  • the control unit C raises the substrate holding unit 7 to bring the substrate 6 into contact with the mask 8 from below. In this way, the substrate holding portion 7 is provided below the mask 8, and the XY table 9, the ⁇ table 10, and the substrate elevating mechanism 11 move the substrate holding portion 7 and are held by the substrate holding portion 7.
  • a substrate positioning mechanism 12 for aligning 6 with the mask 8 is configured.
  • a print head 20 that moves in the Y direction by the print head moving mechanism 15 (see FIG. 6) is provided above the mask 8.
  • the print head 20 includes a movement base 21 that moves in a horizontal plane by a print head movement mechanism 15.
  • Two squeegee holding portions 22 (first squeegee holding portion 221 and second squeegee holding portion 222) are arranged side by side in the Y direction on the moving base 21.
  • the squeegee holding portion 22 holds the squeegees 23 (first squeegee 231 and the second squeegee 232) extending in the X direction at the lower ends, and moves up and down by the elevating mechanism 24 provided on the moving base 21.
  • the squeegee holding unit 22 has a built-in attack angle adjusting unit 25 that adjusts the attack angle ⁇ (see FIG. 4), which is the inclination when the squeegee 23 abuts on the mask 8.
  • the print head moving mechanism 15 and the print head 20 are controlled by the control unit C.
  • the moving operation is executed in a state where the substrate 6 held by the substrate holding unit 7 is aligned with the mask 8.
  • the control unit C controls the attack angle adjusting unit 25 to set the squeegee 23 to a predetermined attack angle ⁇ .
  • the control unit C controls the elevating mechanism 24 to lower one squeegee 23 (first squeegee 231) (arrow b) to bring it into contact with the front side of the region where the plurality of openings 8a are formed.
  • the control unit C adjusts the contact force F that brings the squeegee 23 into contact with the upper surface of the mask 8 according to the amount of descent of the squeegee 23.
  • the control unit C controls the print head moving mechanism 15 to move the squeegee 23 to the rear side in the Y direction at a moving speed V.
  • the paste Pst supplied to the upper surface of the mask 8 is pushed into the plurality of openings 8a with a predetermined printing pressure (pressure).
  • the printing pressure when the paste Pst is pushed into the plurality of openings 8a can be adjusted by the attack angle ⁇ of the squeegee 23, the contact force F, and the moving speed V.
  • the pressure at the time of pushing can be increased by at least one of reducing the attack angle ⁇ , increasing the contact force F, and increasing the moving speed V.
  • the pressure at the time of pushing can be reduced by at least one of increasing the attack angle ⁇ , reducing the contact force F, and decreasing the moving speed V.
  • the control unit C raises one squeegee 23 (for example, the first squeegee 231). Similar to one squeegee 23, the control unit C lowers the other squeegee 23 (for example, the second squeegee 232) to bring it into contact with the mask 8, moves it forward in the Y direction, and pastes it into the plurality of openings 8a.
  • the movement operation of pushing Pst is executed.
  • the print head 20 has a squeegee 23 that moves while abutting on the upper surface of the mask 8 to push the paste Pst into the plurality of openings 8a, and by moving on the mask 8, the paste Pst on the mask 8 is moved. Printing is performed on the substrate 6 through the plurality of openings 8a.
  • a cleaning mechanism 30 for cleaning the paste Pst remaining on the back surface of the mask 8 is provided below the mask 8 and on the front side in the Y direction.
  • the cleaning mechanism 30 is moved in the Y direction by the cleaning moving mechanism 16 (see FIG. 6) controlled by the control unit C (arrow a2).
  • the cleaning mechanism 30 includes a wiping head 31 that extends in the X direction and moves up and down in the Z direction (arrow a3).
  • the cleaning mechanism 30 paper rolls 33A around which unused cleaning paper 32 is wound and paper rolls 33B for collecting used cleaning paper 32 are mounted before and after the wiping head 31 in the Y direction. ..
  • the cleaning paper 32 drawn from the paper roll 33A goes around the upper surface of the wiping head 31 and is wound around the paper roll 33B rotated by the roll rotation mechanism 34 controlled by the control unit C.
  • the cleaning mechanism 30 is controlled by the control unit C, and includes a cleaning liquid application unit 35 that applies a solvent that dissolves the paste Pst to the cleaning paper 32.
  • the control unit C executes mask cleaning by a wet cleaning method in which a solvent is applied to the cleaning paper 32 by the cleaning liquid application unit 35 in a preset pattern, or a dry cleaning method in which no solvent is used. To do.
  • the control unit C raises the wiping head 31 that orbits the cleaning paper 32 coated with the solvent by the cleaning liquid application unit 35 on the upper surface and brings it into contact with the back surface of the mask 8 (arrow). c1).
  • the control unit C controls the cleaning moving mechanism 16 to move the cleaning mechanism 30 in the Y direction (arrow c2).
  • the control unit C brings the cleaning paper 32, which is not coated with the solvent, into contact with the back surface of the mask 8 with the wiping head 31 to move the cleaning mechanism 30 in the Y direction.
  • the cleaning mechanism 30 uses a plurality of cleaning methods (wet cleaning method, dry cleaning method) to remove the paste Pst adhering to the mask 8.
  • the wiping head 31 may be provided with a vacuum suction mechanism, and a suction cleaning method of performing mask cleaning while vacuum suction may also be executed.
  • FIG. 9A the amount (volume fraction) of the paste Pst which is conveyed after screen printing and transferred to the substrate 6 measured by the printing inspection apparatus M2 is displayed in the order of work for each substrate 6.
  • the screen printing apparatus M1 when screen printing is repeatedly executed without performing mask cleaning, the amount of paste Pst protruding from the plurality of openings 8a of the mask 8 to the back surface gradually increases, and the paste Pst transferred to the substrate 6 The amount gradually increases. If screen printing is continued as it is, the amount of paste Pst transferred to the substrate 6 exceeds the specified value, so mask cleaning is performed periodically.
  • the amount of paste Pst transferred to the substrate 6 after mask cleaning is smaller than the amount transferred to the substrate 6 immediately before mask cleaning.
  • wet cleaning using a solvent has a higher effect of removing a flux component that plays a role of lubricating oil on the surface of the opening 8a than dry cleaning, and this tendency appears strongly. Therefore, in the screen printing immediately after the wet cleaning, the amount of paste Pst remaining in the opening 8a without being transferred to the substrate increases, and as a result, the amount of paste Pst transferred to the substrate 6 decreases.
  • the reduction rate Dw after wet cleaning is larger than the reduction rate Dd after dry cleaning.
  • the volume fraction of the paste Pst transferred by the reduction rate Dd is smaller in the fifth substrate 6 after the dry cleaning than in the fourth substrate 6 immediately before.
  • the volume fraction of the paste Pst transferred by the reduction rate Dw is smaller than that of the eighth substrate 6 immediately before.
  • the reduction rate of the paste Pst printed on the substrate immediately after that differs depending on the cleaning method.
  • the control unit C included in the screen printing device M1 includes a conveyor 5, a substrate holding unit 7, a substrate positioning mechanism 12, a camera unit 13, a camera moving mechanism 14, a printing head moving mechanism 15, a cleaning moving mechanism 16, a touch panel 17, and printing.
  • the head 20 and the cleaning mechanism 30 are connected.
  • the touch panel 17 has a display function for displaying an operation screen of the screen printing device M1 on the liquid crystal panel, and an input function for inputting commands and various information by operating the displayed operation screen.
  • the control unit C includes a storage unit 40, a printing work processing unit 41, a cleaning processing unit 42, and a correction information setting processing unit 43.
  • the storage unit 40 is a storage device, and includes a print condition storage unit 40a and a correction information storage unit 40b.
  • the print condition storage unit 40a stores the print conditions for the print head 20 to print the paste Pst on the substrate 6, the mask cleaning conditions including the timing for executing the mask cleaning, and the like for each type of the substrate 6.
  • the printing conditions include the pressure (printing pressure) at which the print head 20 pushes the paste Pst into the plurality of openings 8a, the contact force F that brings the squeegee 23 into contact with the upper surface of the mask 8, the moving speed V of the squeegee 23, and the mask 23.
  • the attack angle ⁇ which is the inclination when the surface is in contact with 8, is included.
  • the mask cleaning condition stores the timing for executing the mask cleaning, the cleaning method, and the like.
  • mask cleaning is performed after continuous screen printing on four substrates 6. Specifically, mask cleaning is executed after screen printing on the fourth, eighth, twelfth, 16th, and twentieth substrates 6.
  • mask cleaning a pattern in which dry cleaning is performed twice and then wet cleaning is performed once is repeated. Specifically, dry cleaning is performed before the first sheet and after the fourth sheet, and wet cleaning is performed after the eighth sheet. Then, after the 12th sheet, the dry cleaning is executed after the 16th sheet, and the wet cleaning is executed after the 20th sheet.
  • the correction information setting processing unit 43 displays a print condition correction information input screen for inputting print condition correction information for correcting the paste Pst that decreases after cleaning on the touch panel 17, and displays the input information on the touch panel 17. It is stored in the correction information storage unit 40b.
  • the management computer 3 may include a correction information setting processing unit 43, and the print condition correction information input in the management computer 3 may be transferred to the correction information storage unit 40b and stored.
  • an increase button “ ⁇ ” and a decrease button “ ⁇ ” are used to assist input. Is set on the print condition correction information input screen 17a.
  • the "correction after cleaning” field 50 it is selected and input whether to correct the printing conditions after mask cleaning (valid) or not (invalid).
  • stepwise correction field 51, whether or not to perform the correction of the printing conditions stepwise (valid) or not (invalid) is selected and input.
  • the "gradual correction” column 51 is (valid)
  • the printing condition is gradually corrected by the number of times entered in the "applied number of times” column 55.
  • the "contact pressure correction” column 52 the correction amount of the contact force F of the squeegee 23 is input as a percentage.
  • the "movement speed correction” column 53 the correction amount of the movement speed V of the squeegee 23 is input as a percentage.
  • attack angle correction column 54, the correction amount of the attack angle ⁇ of the squeegee 23 is input as an angle.
  • the printing conditions changed after cleaning are the pressure at which the print head 20 pushes the paste Pst into the plurality of openings 8a (contact force F), the moving speed V at which the print head 20 moves on the mask 8, and the squeegee 23. It is at least one of the inclinations (attack angle ⁇ ) when it comes into contact with the mask 8.
  • the printing work processing unit 41 is a screen printing apparatus M1 including a print head 20 based on the print conditions stored in the print condition storage unit 40a and the print condition correction information stored in the correction information storage unit 40b. Control each part to execute screen printing work.
  • the printing work processing unit 41 corrects the printing conditions by a predetermined number of times (applied times) after mask cleaning based on the printing condition correction information, and causes the screen printing work to be executed.
  • the cleaning processing unit 42 controls the cleaning mechanism 30 and the cleaning moving mechanism 16 based on the mask cleaning conditions stored in the print condition storage unit 40a to execute mask cleaning at a predetermined timing and in a predetermined method after screen printing. .. In this way, after cleaning by the cleaning mechanism 30, the printing work processing unit 41 changes the printing conditions for the printing head 20 to print the paste Pst on the substrate 6 according to the executed cleaning method, and causes screen printing to be executed.
  • the printing work processing unit 41 conveys the 43rd substrate 6 carried in from the upstream side by the transfer conveyor 5 to the substrate holding unit 7, and holds the substrate 6 conveyed by the substrate holding unit 7.
  • ST1 Substrate loading process
  • the printing work processing unit 41 corrects the position based on the image captured by the camera unit 13 and brings the substrate 6 held by the substrate holding unit 7 into contact with the lower surface of the mask 8 in which the plurality of openings 8a are formed.
  • ST2 Substrate contact process
  • the printing work processing unit 41 moves the print head 20 based on the printing conditions stored in the printing condition storage unit 40a to push the paste Pst into the plurality of openings 8a (ST3: printing process).
  • the printing work processing unit 41 lowers the substrate holding unit 7 to separate the substrate 6 from the mask 8 (ST4: substrate separation step).
  • the printing work processing unit 41 causes the substrate holding unit 7 to release the substrate 6, and causes the transfer conveyor 5 to carry out the substrate 6 after screen printing to the downstream side (ST5: substrate unloading step).
  • ST6 substrate unloading step
  • the cleaning processing unit 42 determines whether or not the mask cleaning timing is based on the mask cleaning conditions stored in the printing condition storage unit 40a (No).
  • ST7 Mask cleaning judgment process). In FIG. 9B, it is not the timing of mask cleaning after printing the 43rd substrate 6 (No in ST7). Therefore, returning to the substrate carry-in step (ST1), the 44th substrate 6 is carried in, and the printing step (ST3) is executed under the printing conditions stored in the printing condition storage unit 40a.
  • FIG. 9B after printing the 44th substrate 6, it is the timing of dry cleaning (Yes in ST7).
  • the cleaning processing unit 42 uses a dry cleaning method to remove the paste Pst adhering to the mask 8 (ST8: cleaning step). ).
  • the printing work processing unit 41 determines whether or not the executed cleaning method is wet cleaning (ST9: cleaning method determination step). Since the executed cleaning method was the dry cleaning method (No in ST9), the printing work processing unit 41 corrects the printing conditions based on the printing condition correction information after the dry cleaning stored in the correction information storage unit 40b. (ST10: Dry-type post-printing condition correction step).
  • the 45th substrate 6 is then carried in by returning to the substrate carry-in step (ST1), and the printing step (ST3) is executed under the printing conditions corrected in the dry post-printing condition correction step (ST9).
  • the corrected volume fraction Cd is added to correct the reduction rate Dd after the dry cleaning, and the transferred paste Pst has a volume fraction close to the target value.
  • the cleaning step (ST8) is executed using the wet cleaning method.
  • the cleaning method determination step (ST9) it is determined that the wet cleaning method is used (Yes), and the printing work processing unit 41 sets the printing conditions based on the print condition correction information after the wet cleaning stored in the correction information storage unit 40b.
  • the board returns to the substrate loading step (ST1), the 49th substrate 6 is carried in, and the printing step (ST3) is executed under the printing conditions corrected in the wet post-printing condition correction step (ST11).
  • the corrected volume fraction Cw is added to correct the reduction rate Dw after wet cleaning, and the transferred paste Pst has a volume fraction close to the target value.
  • the paste Pst adhering to the mask 8 is removed by using any of a plurality of cleaning methods.
  • the cleaning method determination step (ST9), the dry post-printing condition correction step (ST10), and the wet post-printing condition correction step (ST11) after the cleaning step (ST8), the print head 20 is used as a substrate according to the cleaning method executed.
  • the moving speed V at which the print head 20 moves on the mask 8 in the printing step (ST3), and at least one of the inclinations (attack angle ⁇ ) when the squeegee 23 abuts on the mask 8 in the printing step (ST3). Is changed.
  • the printing step (ST3) is executed under the print condition that is stepwise corrected by the specified number of times of application. After that, the printing step (ST3) is executed under the printing conditions stored in the printing condition storage unit 40a.
  • the mask 8 having a plurality of openings 8a for printing the paste Pst, the substrate holding portion 7, and the substrate holding portion 7 are moved. It has a substrate positioning mechanism 12 for aligning the substrate 6 held by the substrate holding portion 7 with the lower surface of the mask 8. Further, the screen printing apparatus M1 uses a printing head 20 that prints the paste Pst on the mask 8 on the substrate 6 through the plurality of openings 8a, and a plurality of cleaning methods (wet cleaning method, dry cleaning method). It has a cleaning mechanism 30 capable of cleaning the lower surface of the surface.
  • the screen printing apparatus M1 changes the printing conditions for the printing head 20 to print the paste Pst on the substrate 6 according to the executed cleaning method. As a result, it is possible to reduce the variation in the paste Pst printed on the substrate 6 even if a plurality of cleaning methods are used in combination.
  • the screen printing apparatus M1 provided with the printing head 20 having the squeegee 23.
  • the screen printing apparatus is not limited to this form.
  • it may be a screen printing apparatus provided with a pressure type printing head having a pressure portion for pushing the paste Pst stored in the storage chamber onto the mask 8.
  • the printing conditions changed after cleaning in order to correct the paste Pst that decreases after cleaning are the force (pressurized pressure) applied by the pressurizing unit to the paste Pst in the storage chamber, or the pressurizing print head masks 8. It is a moving speed V that moves on.
  • control unit C of the screen printing device M1 has set printing condition correction information based on the state, area, height, volume ratio, etc. of the paste Pst printed on the substrate 6 inspected by the printing inspection device M2.
  • a printing condition learning unit may be provided for automatically learning and adjusting. In that case, the print condition learning unit adjusts the print conditions so that the paste Pst state becomes a preset target state based on the change in the paste Pst state of the plurality of substrates 6 printed after cleaning. Further, the print condition learning unit 66 sets the paste Pst state to a preset target state based on the paste Pst state (volume fraction) of the plurality of substrates 6 having the same cleaning method executed immediately before. Adjust the print conditions.
  • the screen printing apparatus and screen printing method of the present disclosure have an effect of being able to reduce variations in the paste printed on the substrate even when a plurality of cleaning methods are used in combination, and mount electronic components on the substrate. Useful in the field.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Printing Methods (AREA)
PCT/JP2019/051000 2019-03-20 2019-12-25 スクリーン印刷装置およびスクリーン印刷方法 WO2020188946A1 (ja)

Priority Applications (3)

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JP2020549731A JP6846609B2 (ja) 2019-03-20 2019-12-25 スクリーン印刷装置およびスクリーン印刷方法
CN201980092925.4A CN113474172B (zh) 2019-03-20 2019-12-25 丝网印刷装置以及丝网印刷方法
DE112019007039.8T DE112019007039T5 (de) 2019-03-20 2019-12-25 Siebdruckvorrichtung und Siebdruckverfahren

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JP2019052055 2019-03-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075223A1 (ja) * 2022-10-05 2024-04-11 ヤマハ発動機株式会社 印刷処理支援システム
JP7539082B2 (ja) 2020-11-09 2024-08-23 パナソニックＩｐマネジメント株式会社 印刷装置及び印刷方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789208A (ja) * 1993-09-22 1995-04-04 Sony Corp ハンダのスクリーン印刷方法
JPH10202827A (ja) * 1997-01-27 1998-08-04 Matsushita Electric Ind Co Ltd スクリーン印刷機及びその印刷方法
JP2005067059A (ja) * 2003-08-26 2005-03-17 Matsushita Electric Ind Co Ltd スクリーン印刷装置およびスクリーン印刷方法
US20060180037A1 (en) * 2002-11-27 2006-08-17 Thieme Gmbh & Co. Kg Method for cleaning the screen stencil of a silk-screen printing device and silk-screen printing machine for said method
JP2007237668A (ja) * 2006-03-10 2007-09-20 Yamaha Motor Co Ltd スクリーン印刷装置
JP2010194911A (ja) * 2009-02-26 2010-09-09 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
JP2010284874A (ja) * 2009-06-11 2010-12-24 Fuji Mach Mfg Co Ltd スクリーン印刷機およびスクリーン印刷方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4584766B2 (ja) * 2005-05-12 2010-11-24 ヤマハ発動機株式会社 スキージの角度制御方法およびスクリーン印刷装置
JP5594864B2 (ja) * 2009-09-30 2014-09-24 富士機械製造株式会社 スクリーンマスク用クリーニング装置
JP5288633B2 (ja) * 2010-03-24 2013-09-11 パナソニック株式会社 太陽電池の電極形成システムおよび太陽電池の電極形成方法
JP5753699B2 (ja) * 2011-02-09 2015-07-22 富士機械製造株式会社 印刷作業支援装置
JP2013043418A (ja) * 2011-08-26 2013-03-04 Panasonic Corp スクリーン印刷機及びスクリーン印刷方法
JP5829494B2 (ja) * 2011-11-14 2015-12-09 富士機械製造株式会社 マスク印刷方法および装置
JP5903542B2 (ja) * 2012-05-07 2016-04-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置
JP6142290B2 (ja) * 2013-10-01 2017-06-07 パナソニックＩｐマネジメント株式会社 スクリーン印刷機、部品実装ライン及びスクリーン印刷方法
JP2018176439A (ja) * 2017-04-04 2018-11-15 Juki株式会社 クリーニングユニット、スクリーン印刷装置、生産システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789208A (ja) * 1993-09-22 1995-04-04 Sony Corp ハンダのスクリーン印刷方法
JPH10202827A (ja) * 1997-01-27 1998-08-04 Matsushita Electric Ind Co Ltd スクリーン印刷機及びその印刷方法
US20060180037A1 (en) * 2002-11-27 2006-08-17 Thieme Gmbh & Co. Kg Method for cleaning the screen stencil of a silk-screen printing device and silk-screen printing machine for said method
JP2005067059A (ja) * 2003-08-26 2005-03-17 Matsushita Electric Ind Co Ltd スクリーン印刷装置およびスクリーン印刷方法
JP2007237668A (ja) * 2006-03-10 2007-09-20 Yamaha Motor Co Ltd スクリーン印刷装置
JP2010194911A (ja) * 2009-02-26 2010-09-09 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
JP2010284874A (ja) * 2009-06-11 2010-12-24 Fuji Mach Mfg Co Ltd スクリーン印刷機およびスクリーン印刷方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7539082B2 (ja) 2020-11-09 2024-08-23 パナソニックＩｐマネジメント株式会社 印刷装置及び印刷方法
WO2024075223A1 (ja) * 2022-10-05 2024-04-11 ヤマハ発動機株式会社 印刷処理支援システム

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DE112019007039T5 (de) 2022-01-05
JP2021075060A (ja) 2021-05-20
JP7108827B2 (ja) 2022-07-29
CN113474172A (zh) 2021-10-01
JP6846609B2 (ja) 2021-03-24
JPWO2020188946A1 (ja) 2021-04-01
CN113474172B (zh) 2023-06-20

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