WO2020158758A1 - 窒化ホウ素粉末及び樹脂組成物 - Google Patents
窒化ホウ素粉末及び樹脂組成物 Download PDFInfo
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- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C08K7/00—Use of ingredients characterised by shape
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- C08K7/18—Solid spheres inorganic
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- C08L101/00—Compositions of unspecified macromolecular compounds
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C01P2004/50—Agglomerated particles
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- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C08K7/00—Use of ingredients characterised by shape
Definitions
- the present invention relates to a boron nitride powder and a resin composition.
- the challenge is to efficiently dissipate the heat generated during use.
- the insulating layer of the printed wiring board that mounts the electronic component has high thermal conductivity, and the electronic component or the printed wiring board is attached to the heat sink via electrically insulating thermal interface materials (Thermal Interface Materials). Things have been done. Ceramic powder having high thermal conductivity is used for the insulating layer and the thermal interface material.
- Boron nitride powder which has characteristics such as high thermal conductivity, high insulation, and low relative dielectric constant, has been attracting attention as the ceramic powder.
- the shape of the agglomerate is made more spherical to improve the filling property, the powder strength is improved, and the purification is performed to improve the insulating property of the heat transfer sheet or the like filled with the powder.
- a hexagonal boron nitride powder that has achieved improvement and stabilization of withstand voltage, the ratio of the major axis of the primary particles to the thickness is 5 to 10 on average, and the size of the aggregate of primary particles is 2 ⁇ m in terms of the average particle diameter (D50).
- a hexagonal boron nitride powder having a bulk density of 0.5 to 1.0 g/cm 3 in a range of 200 ⁇ m or less.
- the present invention aims to improve the thermal conductivity of the boron nitride powder.
- the present inventors have studied to solve the above problems, in addition to increasing the average diameter of the boron nitride powder is effective, surprisingly, in the boron nitride powder having a large average diameter. Found that the average sphericity smaller than a predetermined value is advantageous for improving the thermal conductivity.
- one aspect of the present invention is a boron nitride powder obtained by aggregating primary particles of boron nitride, the boron nitride powder having an average diameter of 40 ⁇ m or more and an average sphericity of less than 0.70. ..
- the crushing strength of the boron nitride powder may be 5 MPa or more.
- Another aspect of the present invention is a resin composition containing a resin and the above boron nitride powder.
- the thermal conductivity of boron nitride powder can be improved.
- the boron nitride powder is a boron nitride powder formed by aggregating primary particles of boron nitride.
- the boron nitride powder contains a plurality of lumped boron nitride particles, and each lumped boron nitride particle is an aggregate of a plurality of boron nitride primary particles.
- the primary particles of boron nitride may be, for example, flaky hexagonal boron nitride particles.
- the length of the primary particles of boron nitride in the longitudinal direction may be, for example, 1 ⁇ m or more and 10 ⁇ m or less.
- Boron nitride powder has an average diameter (average particle diameter) of 40 ⁇ m or more.
- the average diameter of the boron nitride powder means the volume average diameter measured by the laser diffraction scattering method.
- the average diameter of the boron nitride powder is preferably 50 ⁇ m or more, more preferably 55 ⁇ m or more, 60 ⁇ m or more, or 65 ⁇ m or more, more preferably 70 ⁇ m or more, 75 ⁇ m or more, from the viewpoint of further improving the thermal conductivity. Alternatively, it is 80 ⁇ m or more, particularly preferably 85 ⁇ m or more.
- the average diameter of the boron nitride powder may be, for example, 150 ⁇ m or less, 120 ⁇ m or less, or 100 ⁇ m or less.
- the thermal conductivity can be improved by setting the average sphericity to less than 0.70.
- the particle size of boron nitride measured by the total particle measurement is 5 in cumulative frequency. Only lumped boron nitride particles having a particle size equal to or greater than the particle size (5% cumulative size) to be used are used in calculating the average sphericity.
- the average sphericity of the boron nitride powder is preferably 0.65 or less, more preferably 0.60 or less, still more preferably 0.55 or less, and particularly preferably 0. 5 or less from the viewpoint that the thermal conductivity can be further improved. It is 50 or less.
- the average sphericity of the boron nitride powder may be, for example, 0.30 or more, 0.35 or more, or 0.40 or more.
- the crushing strength of the boron nitride powder is, for example, when using the boron nitride powder mixed with a resin, the boron nitride powder collapses due to stress during kneading or pressing with the resin, and from the viewpoint of suppressing a decrease in thermal conductivity. , Preferably 5.0 MPa or more, more preferably 5.5 MPa or more, still more preferably 6.0 MPa or more.
- the crush strength of the boron nitride powder means the crush strength (particle strength, also referred to as single granule crush strength) measured according to JIS R1639-5:2007.
- the boron nitride powder having the above average diameter and average sphericity is, for example, a pulverizing step of pulverizing massive boron carbide and a nitriding step of nitriding the pulverized boron carbide to obtain boron carbonitride. And a decarburizing step of decarburizing boron carbonitride.
- lumpy carbon boron (boron carbide lump) is crushed using a general crusher or crusher.
- boron carbide powder having an average diameter of 40 ⁇ m or more and an average sphericity of less than 0.70 is obtained.
- the average diameter and the average sphericity of the boron carbide powder are measured in the same manner as the average diameter and the average sphericity of the boron nitride powder described above.
- the average diameter (particle size distribution) and average sphericity (particle shape) of the boron carbide powder are adjusted. can do.
- boron carbonitride is obtained by firing the boron carbide powder under an atmosphere for promoting the nitriding reaction and under a pressure condition.
- the atmosphere in the nitriding step is an atmosphere in which the nitriding reaction proceeds, and may be, for example, nitrogen gas, ammonia gas, or the like, and may be one kind alone or a combination of two or more kinds.
- the atmosphere is preferably nitrogen gas from the viewpoint of nitridability and cost.
- the nitrogen gas content in the atmosphere is preferably 95% by volume or more, more preferably 99.9% by volume or more.
- the pressure in the nitriding step is preferably 0.6 MPa or more, more preferably 0.7 MPa or more, preferably 1.0 MPa or less, more preferably 0.9 MPa or less.
- the pressure is more preferably 0.7 to 1.0 MPa.
- the firing temperature in the nitriding step is preferably 1800°C or higher, more preferably 1900°C or higher, preferably 2400°C or lower, more preferably 2200°C or lower.
- the firing temperature is more preferably 1800 to 2200°C.
- the pressure conditions and the firing temperature are preferably 1800° C. or higher and 0.7 to 1.0 MPa, because nitriding of boron carbide is further favorably performed and the conditions are industrially appropriate.
- the firing time in the nitriding step is appropriately selected within a range where nitriding proceeds sufficiently, and is preferably 6 hours or longer, more preferably 8 hours or longer, preferably 30 hours or shorter, and more preferably 20 hours or shorter.
- the boron carbonitride obtained in the nitriding process is subjected to a heat treatment in which it is held at a predetermined holding temperature for a certain time in an atmosphere of atmospheric pressure or higher.
- the atmosphere in the decarburization process is a normal pressure (atmospheric pressure) atmosphere or a pressurized atmosphere.
- the pressure may be, for example, 0.5 MPa or less, preferably 0.3 MPa or less.
- the temperature is raised to a predetermined temperature (the temperature at which decarburization can be started) and then further raised to the holding temperature at a predetermined rate.
- the predetermined temperature (the temperature at which decarburization can start) can be set according to the system, and for example, may be 1000°C or higher, 1500°C or lower, and preferably 1200°C or lower.
- the rate of raising the temperature from the predetermined temperature (temperature at which decarburization can be started) to the holding temperature may be, for example, 5° C./min or less, preferably 4° C./min or less, 3° C./min or less, or 2° C. It may be less than or equal to /minute.
- the holding temperature is preferably 1800° C. or higher, more preferably 2000° C. or higher from the viewpoint that grain growth is likely to occur easily and the thermal conductivity of the obtained boron nitride powder can be further improved.
- the holding temperature may be preferably 2200°C or lower, more preferably 2100°C or lower.
- the holding time at the holding temperature is appropriately selected within a range where crystallization is sufficiently advanced, and may be, for example, more than 0.5 hours, and preferably 1 hour or more, more preferably from the viewpoint of favorably causing grain growth. Is 3 hours or more, more preferably 5 hours or more, particularly preferably 10 hours or more.
- the holding time at the holding temperature may be, for example, less than 40 hours, and it is possible to reduce the decrease in the grain strength due to excessive progress of grain growth. Further, from the viewpoint of reducing industrial inconvenience, preferably 30 hours or less, It is more preferably 20 hours or less.
- a boron source may be mixed for decarburization and crystallization.
- Boron sources include boric acid, boron oxide, or mixtures thereof. In this case, other additives used in the technical field may be further used if necessary.
- the mixing ratio of boron carbonitride and boron source is appropriately selected.
- the ratio of boric acid or boron oxide may be, for example, 100 parts by mass or more, and preferably 150 parts by mass or more, relative to 100 parts by mass of boron carbonitride. Further, it may be, for example, 300 parts by mass or less, preferably 250 parts by mass or less.
- the step (classifying step) of classifying the boron nitride powder obtained as described above into a boron nitride powder having a desired size (diameter) by a sieve may be carried out.
- a boron nitride powder having a desired size (diameter) in a range where the average diameter is 40 ⁇ m or more can be obtained more suitably.
- the boron nitride powder described above is suitable for use as a heat dissipation member, for example.
- the boron nitride powder is used for a heat dissipation member, it is used as a resin composition mixed with a resin, for example.
- another embodiment of the present invention is a resin composition containing a resin and the above boron nitride powder.
- the resin examples include epoxy resin, silicone resin, silicone rubber, acrylic resin, phenol resin, melamine resin, urea resin, unsaturated polyester, fluororesin, polyimide, polyamideimide, polyetherimide, polybutylene terephthalate, polyethylene terephthalate, Polyphenylene ether, polyphenylene sulfide, wholly aromatic polyester, polysulfone, liquid crystal polymer, polyether sulfone, polycarbonate, maleimide modified resin, ABS (acrylonitrile-butadiene-styrene) resin, AAS (acrylonitrile-acrylic rubber/styrene) resin, AES (acrylonitrile) -Ethylene/propylene/diene rubber-styrene) resin or the like can be used.
- ABS acrylonitrile-butadiene-styrene
- AAS acrylonitrile-acrylic rubber/styrene
- AES acrylonitrile
- the resin is preferably an epoxy resin, more preferably a bisphenol A type epoxy resin or a naphthalene type, from the viewpoint of excellent heat resistance and adhesive strength to a circuit. It is an epoxy resin.
- the resin composition is used as a thermal interface material, the resin is preferably a silicone resin from the viewpoint of excellent heat resistance, flexibility and adhesion to a heat sink and the like.
- the content of the resin may be, for example, 15% by volume or more, 20% by volume or more, 30% by volume or more, or 40% by volume or more, and 70% by volume or less, 60% by volume, based on the total volume of the resin composition. % Or less, or 50% by volume or less.
- the content of the boron nitride powder is preferably 30% by volume or more, more preferably from the viewpoint of improving the thermal conductivity of the resin composition and easily obtaining excellent heat dissipation performance, based on the total volume of the resin composition. It is 40% by volume or more, more preferably 50% by volume or more, particularly preferably 60% by volume or more, and preferably 85% by volume or less from the viewpoint of suppressing the occurrence of voids during molding and the deterioration of insulating properties and mechanical strength. , And more preferably 80% by volume or less.
- the resin composition may further contain a curing agent that cures the resin.
- the curing agent is appropriately selected depending on the type of resin.
- a curing agent used together with an epoxy resin a phenol novolac compound, an acid anhydride, an amino compound, an imidazole compound and the like can be mentioned, and an imidazole compound is preferably used.
- the content of the curing agent may be, for example, 0.5 parts by mass or more or 1.0 parts by mass or more, and 15 parts by mass or less or 10 parts by mass or less with respect to 100 parts by mass of the resin.
- Example 1 A carbon crucible was filled with boron carbide powder having an average diameter of 55 ⁇ m and an average sphericity of less than 0.70, and carbonitriding was performed by using a resistance heating furnace and heating in a nitrogen gas atmosphere at 2000° C. and 0.8 MPa for 20 hours. Boron (B 4 CN 4 ) was obtained. 100 parts by mass of the obtained boron carbonitride and 200 parts by mass of boric acid were mixed using a Henschel mixer, and then the mixture was charged into a boron nitride crucible, and a resistance heating furnace was used under a normal pressure and a nitrogen gas atmosphere. By heating at a holding temperature of 2000° C.
- boron nitride particles in which primary particles were aggregated and formed into lumps were obtained.
- the obtained boron nitride particles were crushed in a mortar for 10 minutes, and then classified with a nylon sieve having a mesh size of 109 ⁇ m.
- lumpy boron nitride particles boron nitride powder in which primary particles were aggregated to form lumps were obtained.
- Example 2 A boron nitride powder having an average diameter of 30 ⁇ m and an average sphericity of less than 0.70 was used, and the boron nitride powder was classified under the same conditions as in Example 1 except that the size of the sieve when classifying the boron nitride powder was changed to 75 ⁇ m. Obtained.
- Example 3 A boron nitride powder having an average diameter of 33 ⁇ m and an average sphericity of less than 0.70 was used, and the boron nitride powder was prepared under the same conditions as in Example 1, except that the sieve opening of the sieve when classifying the boron nitride powder was changed to 86 ⁇ m. Obtained.
- Example 4 A boron nitride powder having an average diameter of 37 ⁇ m and an average sphericity of less than 0.70 was used, and the boron nitride powder was prepared under the same conditions as in Example 1 except that the size of the sieve when classifying the boron nitride powder was changed to 86 ⁇ m. Obtained.
- a hexagonal boron nitride powder having a particle size of 12.8 ⁇ m, calcium carbonate (“PC-700” manufactured by Shiraishi Industry Co., Ltd.) and water were mixed using a Henschel mixer, and then pulverized with a ball mill to obtain a water slurry. ..
- the average diameter (volume average diameter) of each of the obtained boron nitride powders was measured using a laser diffraction/scattering particle size distribution analyzer (LS-13320) manufactured by Beckman Coulter.
- the particle size of boron nitride measured by the total particle measurement is 5 in cumulative frequency. Only lumped boron nitride particles having a particle size equal to or larger than the particle size (5% cumulative size) to be used were used when calculating the average sphericity.
- the crush strength of each of the obtained boron nitride powders was measured according to JIS R1639-5:2007.
- a micro compression tester (“MCT-W500”, manufactured by Shimadzu Corporation) was used.
- a measurement sample having a size of 10 mm ⁇ 10 mm was cut out from the obtained sheet, and a thermal diffusivity A (m 2 /sec) of the measurement sample was measured by a laser flash method using a xenon flash analyzer (NETZSCH, LFA447NanoFlash).
- NETZSCH xenon flash analyzer
- the specific gravity B (kg/m 3 ) of the measurement sample was measured by the Archimedes method.
- the specific heat capacity C (J/(kg ⁇ K)) of the measurement sample was measured using a differential scanning calorimeter (DSC; ThermoPlusEvo DSC8230, manufactured by Rigaku Corporation).
- DSC differential scanning calorimeter
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Abstract
Description
球形度=(円形度)2
に従って求められる各塊状窒化ホウ素粒子の球形度の平均値として算出される。
ただし、粒子像分析装置を用いた測定では、塊状窒化ホウ素粒子から脱離した窒化ホウ素の一次粒子も測定対象となるため、全粒子測定により測定される窒化ホウ素の粒子径が頻度の累積で5%になる粒子径(5%累積径)以上の粒子径を有する塊状窒化ホウ素粒子のみを、平均球形度を算出する際に使用する。
平均径55μm、平均球形度0.70未満の炭化ホウ素粉末をカーボンルツボに充填し、抵抗加熱炉を用い、窒素ガス雰囲気で、2000℃、0.8MPaの条件で20時間加熱することにより炭窒化ホウ素(B4CN4)を得た。得られた炭窒化ホウ素100質量部と、ホウ酸200質量部とをヘンシェルミキサーを用いて混合した後、混合物を窒化ホウ素ルツボに充填し、抵抗加熱炉を用いて、常圧、窒素ガス雰囲気で、保持温度2000℃、保持時間10時間で加熱することにより、一次粒子が凝集して塊状になった窒化ホウ素粒子を得た。得られた窒化ホウ素粒子を乳鉢により10分間解砕した後、篩目109μmのナイロン篩にて分級を行った。これにより、一次粒子が凝集して塊状になった塊状窒化ホウ素粒子(窒化ホウ素粉末)を得た。
平均径30μm、平均球形度0.70未満の炭化ホウ素粉末を用い、窒化ホウ素粉末を分級する際の篩の篩い目を75μmに変更した以外は、実施例1と同様の条件で窒化ホウ素粉末を得た。
平均径33μm、平均球形度0.70未満の炭化ホウ素粉末を用い、窒化ホウ素粉末を分級する際の篩の篩い目を86μmに変更した以外は、実施例1と同様の条件で窒化ホウ素粉末を得た。
平均径37μm、平均球形度0.70未満の炭化ホウ素粉末を用い、窒化ホウ素粉末を分級する際の篩の篩い目を86μmに変更した以外は、実施例1と同様の条件で窒化ホウ素粉末を得た。
酸素含有量が2.4%、窒化ホウ素純度96.3%、及び平均粒径が3.8μmであるアモルファス窒化ホウ素粉末、酸素含有量が0.1%、BN純度98.8%、及び平均粒径が12.8μmである六方晶窒化ホウ素粉末、炭酸カルシウム(「PC-700」白石工業社製)及び水を、ヘンシェルミキサーを用いて混合した後、ボールミルで粉砕し、水スラリーを得た。さらに、水スラリー100質量部に対して、ポリビニルアルコール樹脂(「ゴーセノール」日本合成化学工業社製)を0.5質量部添加し、溶解するまで50℃で加熱撹拌した後、噴霧乾燥機にて乾燥温度230℃で球状化処理を行った。なお、噴霧乾燥機の球状化装置としては、回転式アトマイザーを使用した。得られた処理物をバッチ式高周波炉にて焼成した後、焼成物に解砕及び分級処理を行い、窒化ホウ素粉末を得た。
得られた各窒化ホウ素粉末について、ベックマンコールター製レーザー回折散乱法粒度分布測定装置(LS-13 320)を用いて、平均径(体積平均径)を測定した。
得られた各窒化ホウ素粉末について、粒子像分析装置(「PITA-4」(セイシン企業社製))を用いて、5000個の塊状窒化ホウ素粒子について円形度を自動計測し、下記式:
球形度=(円形度)2
に従って求められる各塊状窒化ホウ素粒子の球形度の平均値として、窒化ホウ素粉末の平均球形度を算出した。
ただし、粒子像分析装置を用いた測定では、塊状窒化ホウ素粒子から脱離した窒化ホウ素の一次粒子も測定対象となるため、全粒子測定により測定される窒化ホウ素の粒子径が頻度の累積で5%になる粒子径(5%累積径)以上の粒子径を有する塊状窒化ホウ素粒子のみを、平均球形度を算出する際に使用した。
得られた各窒化ホウ素粉末について、JIS R1639-5:2007に従って圧壊強度を測定した。測定装置としては、微小圧縮試験器(「MCT-W500」、島津製作所社製)を用いた。圧壊強度(σ:MPa)は、粒子内の位置によって変化する無次元数(α=2.48:-)と圧壊試験力(P:N)と粒子径(d:μm)から、σ=α×P/(π×d2)の式を用いて算出した。
ナフタレン型エポキシ樹脂(DIC社製、HP4032)100質量部と、硬化剤としてイミダゾール類(四国化成社製、2E4MZ-CN)10質量部との混合物に対し、得られた窒化ホウ素粉末を50体積%となるように混合して樹脂組成物を得た。この樹脂組成物を、PET製シート上に厚みが1.0mmになるように塗布した後、500Paの減圧脱泡を10分間行った。その後、温度150℃、圧力160kg/cm2条件で60分間のプレス加熱加圧を行って、0.5mmのシートを作製した。
得られたシートから10mm×10mmの大きさの測定用試料を切り出し、キセノンフラッシュアナライザ(NETZSCH社製、LFA447NanoFlash)を用いたレーザーフラッシュ法により、測定用試料の熱拡散率A(m2/秒)を測定した。また、測定用試料の比重B(kg/m3)をアルキメデス法により測定した。また、測定用試料の比熱容量C(J/(kg・K))を、示差走査熱量計(DSC;リガク社製、ThermoPlusEvo DSC8230)を用いて測定した。これらの各物性値を用いて、熱伝導率H(W/(m・K))をH=A×B×Cの式から求めた。結果を表1に示す。
Claims (3)
- 窒化ホウ素の一次粒子が凝集してなる窒化ホウ素粉末であって、
平均径が40μm以上であり、平均球形度が0.70未満である、窒化ホウ素粉末。 - 圧壊強度が5MPa以上である、請求項1に記載の窒化ホウ素粉末。
- 樹脂と、請求項1又は2に記載の窒化ホウ素粉末と、を含有する樹脂組成物。
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WO2022071240A1 (ja) * | 2020-09-29 | 2022-04-07 | デンカ株式会社 | 炭窒化ホウ素粉末及びその製造方法、粉末組成物、窒化ホウ素焼結体及びその製造方法、並びに複合体及びその製造方法 |
WO2022186191A1 (ja) * | 2021-03-02 | 2022-09-09 | 株式会社トクヤマ | 六方晶窒化ホウ素凝集粒子および六方晶窒化ホウ素粉末、樹脂組成物、樹脂シート |
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