WO2019215806A1 - 配線部材及びこれを備えた半導体モジュール - Google Patents

配線部材及びこれを備えた半導体モジュール Download PDF

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Publication number
WO2019215806A1
WO2019215806A1 PCT/JP2018/017730 JP2018017730W WO2019215806A1 WO 2019215806 A1 WO2019215806 A1 WO 2019215806A1 JP 2018017730 W JP2018017730 W JP 2018017730W WO 2019215806 A1 WO2019215806 A1 WO 2019215806A1
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WO
WIPO (PCT)
Prior art keywords
wiring member
connection
connection portion
plate
conductive
Prior art date
Application number
PCT/JP2018/017730
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English (en)
French (fr)
Inventor
謙介 竹内
崇志 長尾
Original Assignee
三菱電機株式会社
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Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to US16/975,189 priority Critical patent/US11476224B2/en
Priority to PCT/JP2018/017730 priority patent/WO2019215806A1/ja
Priority to JP2020517650A priority patent/JP7065953B2/ja
Priority to EP18918204.1A priority patent/EP3792961A4/en
Priority to CN201880093084.4A priority patent/CN112074935A/zh
Publication of WO2019215806A1 publication Critical patent/WO2019215806A1/ja

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Definitions

  • the present application relates to a wiring member and a semiconductor module including the wiring member.
  • a wiring member such as a wire and a clip.
  • a wiring member which electrically connects three places the 1st leg part connected to each of a 1st electroconductive part, a 2nd electroconductive part, and a 3rd electroconductive part, a 2nd leg part And the third leg, the first connecting part that connects the first leg part and the second leg part, and the second connecting part that connects the second leg part and the third leg part are integrally formed.
  • a typical wiring member is disclosed.
  • the first leg portion, the second leg portion, and the third leg portion are arranged on a non-straight line so that three connection portions form a triangle, and three wiring members are formed by one wiring member.
  • the conductive parts are securely connected. Further, by connecting at three points, it is possible to suppress the occurrence of a failure in which the wiring member falls.
  • a plurality of wiring members having similar or identical shapes may be used. Therefore, in the process of mounting the wiring member, it is necessary to distinguish between the type and orientation of the wiring member, and also the front and back, which causes a reduction in work efficiency. Further, even in an automated line in which a wiring member can be detected by a camera, it is sometimes difficult to distinguish between similar wiring members, and there is a problem that the type, orientation, or front / back of the wiring member is mistakenly assembled.
  • the wiring member disclosed in Patent Document 1 is not devised for distinguishing a plurality of similar wiring members.
  • the present application discloses a technique for solving the above-described problems, makes it possible to easily distinguish the type, orientation, and front / back of a wiring member, and prevent erroneous assembly of the wiring member in a semiconductor module.
  • the purpose is to do.
  • a wiring member disclosed in the present application is a wiring member that electrically connects at least a first conductive portion and a second conductive portion, and includes a first connection portion connected to the first conductive portion, and a second conductive portion.
  • a second connection portion connected to the upper surface portion, an upper surface portion disposed between the first connection portion and the second connection portion, between the upper surface portion and the first connection portion, and between the upper surface portion and the second connection portion.
  • the first connecting portion, the second connecting portion, the upper surface portion, and the leg portion are integrally formed, and the upper surface portion has one or both of the projecting portion and the recessed portion. is there.
  • a semiconductor module disclosed in the present application includes a wiring member disclosed in the present application, a plurality of semiconductor elements, and a metal plate on which the semiconductor elements are mounted, and the first conductive portion is a semiconductor element.
  • the second conductive part is a plate.
  • the wiring member disclosed in the present application it is possible to easily determine the type, orientation, and front / back of the wiring member by providing one or both of the projecting portion and the recessed portion on the upper surface portion. It is possible to prevent erroneous assembly of the wiring member. Moreover, since the upper surface portion is a portion that is not connected to other portions, the degree of freedom in design is high with respect to the size and arrangement of the protrusions and the recesses.
  • FIG. 1 is a diagram illustrating a circuit configuration of a semiconductor module according to a first embodiment.
  • FIG. 3 is a diagram showing an internal structure of the semiconductor module according to the first embodiment.
  • 4 is a cross-sectional view showing a wiring member according to Embodiment 1.
  • FIG. 5 is a cross-sectional view showing another wiring member according to Embodiment 1.
  • FIG. 6 is a top view and a side view showing still another wiring member according to the first embodiment. 6 is a top view showing a wiring member according to Embodiment 2.
  • FIG. 6 is a top view showing another wiring member according to Embodiment 2.
  • FIG. 1 is a diagram illustrating a circuit configuration of a semiconductor module according to a first embodiment.
  • FIG. 3 is a diagram showing an internal structure of the semiconductor module according to the first embodiment.
  • 4 is a cross-sectional view showing a wiring member according to Embodiment 1.
  • FIG. 5 is a cross-sectional view showing another wiring member according to Embod
  • FIG. 1 is a diagram showing a circuit configuration of the semiconductor module according to the first embodiment
  • FIG. 2 is a top perspective view showing an internal structure of the semiconductor module according to the first embodiment.
  • the semiconductor module 1 according to the first embodiment incorporates a two-phase bridge circuit (so-called H bridge circuit) for driving a motor.
  • FIG. 1 A circuit configuration of the semiconductor module 1 according to the first embodiment will be described with reference to FIG.
  • circles (100a, 100b, etc.) indicate terminals of the semiconductor module 1.
  • the H bridge circuit is connected to the high-potential side switching elements 10a and 10b and the low-potential side switching elements 11a and 11b from the terminals 100a and 100b connected to the power sources 3a and 3b, and further has shunt resistors 13a and 13b downstream.
  • To the terminals 105a and 105b which are ground terminals.
  • semiconductor elements such as FET (Field Effect Transistor) are used as the switching elements 10a, 10b, 11a, and 11b.
  • a switching element 12a having a relay function is arranged on a line extending from an intermediate point between the switching element 10a and the switching element 11a, and is connected to a terminal 107a for motor output.
  • a terminal 108a is a connection point of the three switching elements 10a, 11a, and 12a.
  • the gates of the high-potential side switching elements 10a and 10b are connected to gate signal terminals 101a and 101b.
  • the gates of the switching elements 11a and 11b on the low potential side are connected to the terminals 102a and 102b, and the gate of the switching element 12a having the relay function is connected to the terminal 106a.
  • the terminals 103a and 104a are terminals for detecting a potential difference between both ends of the shunt resistor 13a.
  • the terminals 103b and 104b are terminals for detecting a potential difference between both ends of the shunt resistor 13b.
  • the alternate long and short dash line indicates a region covered with the mold resin 7.
  • the semiconductor module 1 has a plurality of terminals extending in the vertical direction, a control signal input / output control terminal on the upper side, and a power terminal through which a large current is passed on the lower side. Yes.
  • These terminals are formed by a plate 30 on which switching elements are mounted.
  • the plate 30 is a conductive plate made of a metal having as little electrical resistance as possible, for example, copper or a copper alloy.
  • a switching element 10a on the high potential side is mounted on a plate 30 from which a terminal 100a as a power supply terminal extends.
  • a source and a gate are disposed on the top surface, and a bottom surface is the drain.
  • the wiring member 4A connects the three sources of the source of the switching element 10a, the source of the switching element 12a having a relay function, and the plate 30.
  • the switching element 11a on the low potential side is mounted on the plate 30 to which the wiring member 4A is connected.
  • the wiring member 5 ⁇ / b> A connects the source of the switching element 11 a and the plate 30. Thereby, the switching element 11a and the one end part of the shunt resistor 13a are connected. The other end of the shunt resistor 13a is connected to the plate 30 from which the terminal 105a, which is a ground terminal, extends.
  • the drain of the switching element 12a is connected to the plate 30 from which the motor output terminal 107a extends.
  • the gates of the switching elements 10a, 11a, and 12a are connected to gate control terminals 101a, 102a, and 106a through wire bonds 6, respectively. Both ends of the shunt resistor 13a are connected to the terminals 103a and 104a.
  • the terminal 108a is a connection point of the three switching elements 10a, 11a, and 12a.
  • the circuit configuration of the right bridge circuit is similar to that of the left bridge circuit, so the description of the same parts is omitted.
  • the bridge circuit on the right side does not include a switching element corresponding to the switching element 12a having the relay function. For this reason, the shape of the right wiring member 4B is different from the left wiring member 4A.
  • the right wiring member 5B has the same shape as the left wiring member 5A.
  • the terminal 108b is a connection point between the two switching elements 10b and 11b.
  • the wiring members 4A, 4B, 5A, and 5B electrically connect at least the first conductive portion and the second conductive portion, and are formed of, for example, a copper plate.
  • the first conductive part is, for example, a switching element
  • the second conductive part is, for example, a plate.
  • the combination of the first conductive part and the second conductive part is not limited to this, and between the switching elements or between the plates In some cases, they are connected to each other.
  • any of the switching elements and the plates may be connected to each other, and the combination is free.
  • Each of the wiring members 4A, 4B, 5A, and 5B includes a first connection portion that is connected to the first conductive portion, a second connection portion that is connected to the second conductive portion, and a first connection portion and a second connection portion.
  • An upper surface portion disposed between the upper surface portion and the first connection portion; and a leg portion disposed between the upper surface portion and the second connection portion.
  • the upper surface portion and the leg portion are integrally formed. Further, the upper surface portion has a protrusion, and the first connection portion and the second connection portion have a through hole.
  • FIGS. 3 is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line BB in FIG.
  • the wiring member 4 ⁇ / b> A connects three locations of the two switching elements 10 a and 12 a and the plate 30.
  • the wiring member 4A is connected to the two upper surface portions 41, the element connection portion 42 that is the first connection portion connected to the source of the switching element 10a that is the first conductive portion, and the plate 30 that is the second conductive portion.
  • Leg portions 44 are disposed between the upper surface portion 41 and the element connection portion 42 and between the upper surface portion 41 and the plate connection portion 43, respectively, and the upper surface portion 41, the element connection portion 42, the plate connection portion 43, and the leg portion 44. Are integrally formed.
  • the wiring member 4 ⁇ / b> B connects three locations of one switching element 10 b and two plates 30.
  • the wiring member 4B includes two upper surface portions 41, an element connection portion 42 that is a first connection portion connected to the switching element 10b that is a first conductive portion, and two locations that are a second conductive portion and a third conductive portion.
  • a second connecting portion connected to the plate 30 and two plate connecting portions 43 serving as a third connecting portion.
  • Leg portions 44 are disposed between the upper surface portion 41 and the element connection portion 42 and between the upper surface portion 41 and the plate connection portion 43, respectively, and the upper surface portion 41, the element connection portion 42, the plate connection portion 43, and the leg portion 44. Are integrally formed.
  • the upper surface portion 41 protrudes in the opposite direction with respect to the connection surface of the element connection portion 42 with the switching element 10a and the connection surface of the plate connection portion 43 with the plate 30.
  • the upper surface portion 41 is provided in parallel with the element connection portion 42 and the plate connection portion 43, and the element connection portion 42, the plate connection portion 43, and the upper surface portion 41 are at different height positions.
  • the element connection part 42 has the through-hole 45 formed in the direction perpendicular
  • the plate connection portion 43 has a through hole 45 formed in a direction perpendicular to the connection surface with the plate 30.
  • the wiring members 4A and 4B have very similar shapes as viewed from the top, but have slightly different cross-sectional shapes. For this reason, in order to prevent incorrect assembly of the wiring members 4A and 4B, both must be used separately.
  • the assembly robot grasps (or adsorbs) the wiring members 4A and 4B in a top view and arranges them at predetermined positions.
  • the wiring members 4A and 4B are selected in a top view. Therefore, the protrusions 47 are used to distinguish the wiring members 4A and 4B from the top view.
  • the wiring members 4 ⁇ / b> A and 4 ⁇ / b> B have a protruding portion 47 formed integrally with the upper surface portion 41. Since the upper surface portion 41 is a portion that is not connected to other portions and is disposed at the highest position, there is an advantage that the degree of freedom in design is high with respect to the size and arrangement of the protrusions 47. Further, there is no need for a special process for forming the protrusion 47 on the upper surface portion 41, and the wiring having the protrusion 47 is obtained by cutting and bending the conductive plate simultaneously with other portions of the wiring members 4A and 4B. The members 4A and 4B can be manufactured.
  • the protrusions 47 of the wiring members 4A and 4B are provided symmetrically on both side surfaces of the upper surface part 41. However, the positions of the protrusions 47 are different between the wiring member 4A and the wiring member 4B. ing.
  • the wiring member 4A has a protrusion 47 on the upper surface 41 in the vicinity of the central switching element 12a.
  • the wiring member 4B has a protruding portion 47 on the upper surface portion 41 in the vicinity of the switching element 10b.
  • the wiring member 4A and the wiring member 4B can be distinguished by the difference in the position of the protrusion 47.
  • the wiring members 4A and 4B have a length more than double that of the wiring members 5A and 5B, and the plate connection portion 43, the element connection portion 42, and the upper surface portion 41 have different heights. Formed in position. For this reason, the wiring members 4A and 4B can be easily distinguished from each other, and can be recognized even if they are turned over.
  • the wiring member 5A includes an upper surface portion 51, an element connection portion 52 that is a first connection portion connected to the source of the switching element 11a that is a first conductive portion, and a plate 30 that is a second conductive portion. And a plate connecting portion 53 which is a two connecting portion.
  • Legs 54 are arranged between the upper surface part 51 and the element connection part 52 and between the upper surface part 51 and the plate connection part 53, respectively, and the upper surface part 51, the element connection part 52, the plate connection part 53, and the leg part 54. Are integrally formed.
  • the upper surface portion 51 protrudes in a direction opposite to the connection surface of the element connection portion 52 with the switching element 11 a and the connection surface of the plate connection portion 53 with the plate 30.
  • the upper surface part 51 is provided in parallel with the element connection part 52 and the plate connection part 53, and the element connection part 52, the plate connection part 53, and the upper surface part 51 are respectively different height positions.
  • the element connection part 52 has a through hole 55 formed in a direction perpendicular to the connection surface with the switching element 11a
  • the plate connection part 53 has a direction perpendicular to the connection surface with the plate 30. It has a through hole 55 formed in.
  • notches 56 are formed in the corners of the plate connecting portion 53.
  • the wiring member 5A is a small component whose width dimension is smaller than the width of the switching element 11a, for example, about several millimeters.
  • the direction of the wiring member 5A is determined by the notch 56. Can be determined. For example, in FIG. 5, it can be determined that the one with the notch 56 is the plate connecting portion 53, and the one without the notch is the element connecting portion 52.
  • the notch 56 is preferably larger from the viewpoint of visibility, but if the notch 56 is enlarged, the area of the plate connection portion 53 is reduced, and therefore, the smaller one is desirable from the viewpoint of connection strength. Further, the notch 56 is not limited to a linear shape as shown in FIG. Furthermore, in FIG. 5, the notches 56 are formed at both corners of the plate connecting portion 53, but they may be formed only at one corner.
  • the protrusions 57 provided asymmetrically on both side surfaces of the upper surface portion 51 can be used for discrimination between the front and back of the wiring member 5A.
  • the wiring member 5 ⁇ / b> A is a small component, the front and the back may be reversed, and it is difficult to distinguish the front and the back only by the notch 56. Since the positions of the two asymmetrically arranged protrusions 57 are switched when the wiring member 5A is turned over, the front and back sides can be discriminated by the positions of the two protrusions 57.
  • the protrusions 47 and 57 on the upper surface portions 41 and 51, the type, orientation, and front and back of the wiring members can be determined. Since it can be easily discriminated, it is possible to prevent erroneous assembly of the wiring member in the semiconductor module. Moreover, since the upper surface parts 41 and 51 are parts that are not connected to other parts, there is an advantage that the degree of freedom in design is high with respect to the size and arrangement of the protrusions 47 and 47. Further, since the protrusions 47 and 57 are formed integrally with the upper surface parts 41 and 51, they can be easily manufactured simultaneously with other parts of the wiring members 4A, 4B, 5A, and 5B.
  • FIG. 1 a modified example of the wiring members 4A, 4B, 5A, and 5B according to the first embodiment will be described. Since the circuit configuration of the semiconductor module according to the second embodiment is the same as that of the first embodiment, description thereof is omitted (see FIG. 1).
  • the wiring member according to the second embodiment is used for a semiconductor module 1 with a built-in H bridge circuit (see FIG. 2), a semiconductor module with a built-in bridge circuit for one phase, or a semiconductor module with other circuit configurations and component configurations. be able to.
  • the wiring members 5C and 4C according to the second embodiment all have upper surface portions 51 and 41, element connection portions 52 and 42, and plate connection portions 53. , 43 and legs 54, 44.
  • the element connection parts 52 and 42 and the plate connection parts 53 and 43 have through holes 45.
  • a wiring member 5C shown in FIG. For the discrimination between the front and back sides of the wiring member 5C, the concave portions 58 provided asymmetrically on both side surfaces of the upper surface portion 51 can be used. That is, since the positions of the two recesses 58 arranged asymmetrically are switched when the wiring member 5C is turned over, the front and back sides can be discriminated by the positions of the two recesses 58. In addition, by providing the concave portions 58 symmetrically on both side surfaces of the upper surface portion 51, it is also possible to use for determining the orientation of the wiring member 5C.
  • the recess 58 is used in the same manner as the protrusion 57 (see FIG. 5) of the wiring member 5A described in the first embodiment.
  • the protrusion 57 contacts the wire bond 6 or other components.
  • the concave portion 58 may be used when it is easy to do or when the stability of the wiring member is lowered by the protrusion 57.
  • the shape of the recessed part 58 is not limited to the semicircle shape shown in FIG. 6, A rectangle, a triangle, etc. may be sufficient. No special process is required to form the recess 58, and the wiring member 5C having the recess 58 can be manufactured by cutting and bending the conductive plate simultaneously with other portions of the wiring member 5C.
  • a pair of protrusions 47 is provided symmetrically on both side surfaces of one upper surface portion 41, and a pair of concave portions 48 is provided symmetrically on both side surfaces of another upper surface portion 41. It may be. Alternatively, the protrusion 47 and the recess 48 may be paired and provided symmetrically or asymmetrically. As described above, by arranging the protrusions 47 and the recesses 48 in various patterns, it is possible to easily determine the type of the wiring member even in a semiconductor module having a complicated circuit configuration using many types of wiring members.
  • the upper surface portions 51 and 41 are provided with the recesses 58 and 48, the type, orientation, and front and back of the wiring member can be easily determined. It is possible to prevent erroneous assembly of the wiring members in the module. Furthermore, by arranging the protrusion 47 and the recess 48 in combination, it is possible to discriminate more types of wiring members. Further, since the upper surface portions 51 and 41 are portions that are not connected to other portions, there is an advantage that the degree of freedom in design is high with respect to the size and arrangement of the recesses 58 and 48.

Abstract

配線部材（５Ａ）において、素子接続部（５２）、プレート接続部（５３）、及び上面部（５１）は、それぞれ異なる高さ位置である。素子接続部（５２）は貫通穴（５５）を有し、プレート接続部（５３）は、貫通穴（５５）と切り欠き（５６）を有している。また、他の部位と接続されない部位である上面部（５１）は、両側面に非対称に配置された突起部（５７）を有している。これらにより、配線部材の種類、向き、及び表裏を容易に判別することができるため、半導体モジュールにおける配線部材の誤組み付けを防止することが可能である。

Description

配線部材及びこれを備えた半導体モジュール
　本願は、配線部材及びこれを備えた半導体モジュールに関するものである。
　従来、半導体モジュールにおいては、半導体素子相互間、または半導体素子とプレート等を、ワイヤ及びクリップ等の配線部材で接続している。また、特許文献１には、３箇所を電気的に接続する配線部材として、第１導電部、第２導電部、及び第３導電部のそれぞれに接続される第１脚部、第２脚部、及び第３脚部と、第１脚部と第２脚部を連結する第１連結部、及び第２脚部と第３脚部とを連結する第２連結部が一体に形成された立体的な配線部材が開示されている。
　この先行例では、第１脚部、第２脚部、及び第３脚部を非直線上に配置することにより、３箇所の接続部が三角形を形成するようにし、１つの配線部材で３つの導電部を確実に接続するようにしている。また、３点で接続することにより、配線部材が倒れる不良が発生するのを抑制している。
特許第５５６９５５５号公報
　半導体モジュールに内蔵された回路では、類似あるいは同一形状の複数の配線部材が用いられることがある。そのため、配線部材を装着する工程では、配線部材の種類、向き、さらには裏表の区別をする必要があり、作業効率の低下を招く原因となっていた。また、配線部材をカメラにより検出可能な自動化ラインにおいても、類似した配線部材の区別が困難な場合があり、配線部材の種類、または向き、または表裏を誤って組み付けてしまうという問題があった。特許文献１に開示された配線部材には、類似した複数の配線部材を見分けるための工夫はなされていない。
　本願は、上記のような課題を解決するための技術を開示するものであり、配線部材の種類、向き、及び表裏を容易に判別することを可能とし、半導体モジュールにおける配線部材の誤組み付けを防止することを目的とする。
　本願に開示される配線部材は、少なくとも第１導電部と第２導電部とを電気的に接続する配線部材であって、第１導電部に接続される第１接続部と、第２導電部に接続される第２接続部と、第１接続部と第２接続部の間に配置された上面部と、上面部と第１接続部の間、及び上面部と第２接続部の間にそれぞれ配置された脚部とを含み、第１接続部、第２接続部、上面部、及び脚部は一体に形成され、上面部は、突起部及び凹部のいずれか一方または両方を有するものである。
　また、本願の開示される半導体モジュールは、本願に開示される配線部材と、複数の半導体素子と、半導体素子が装着される金属製のプレートとを備え、第１導電部は半導体素子であり、第２導電部はプレートである。
　本願に開示される配線部材によれば、上面部に突起部及び凹部のいずれか一方または両方を設けることにより、配線部材の種類、向き、及び表裏を容易に判別することができるため、半導体モジュールにおける配線部材の誤組み付けを防止することが可能である。また、上面部は、他の部位と接続されない部位であるため、突起部及び凹部の大きさ及び配置に関し、設計の自由度が高い。
　本願の上記以外の目的、特徴、観点及び効果は、図面を参照する以下の詳細な説明から、さらに明らかになるであろう。
実施の形態１による半導体モジュールの回路構成を示す図である。 実施の形態１による半導体モジュールの内部構造を示す図である。 実施の形態１による配線部材を示す断面図である。 実施の形態１による別の配線部材を示す断面図である。 実施の形態１によるさらに別の配線部材を示す上面図及び側面図である。 実施の形態２による配線部材を示す上面図である。 実施の形態２による別の配線部材を示す上面図である。
実施の形態１．
　以下に、実施の形態１による半導体モジュールについて、図面に基づいて説明する。図１は、実施の形態１による半導体モジュールの回路構成を示す図であり、図２は、実施の形態１による半導体モジュールの内部構造を示す上面透視図である。各図において、同一または相当部分には、同一符号を付している。実施の形態１による半導体モジュール１は、モータを駆動するブリッジ回路２相分（所謂Ｈブリッジ回路）を内蔵している。
　実施の形態１による半導体モジュール１の回路構成について、図１を用いて説明する。なお、図１において、丸印（１００ａ、１００ｂ等）は、半導体モジュール１の端子を示している。Ｈブリッジ回路は、電源３ａ、３ｂに接続された端子１００ａ、１００ｂから高電位側のスイッチング素子１０ａ、１０ｂ及び低電位側のスイッチング素子１１ａ、１１ｂに接続され、さらに下流にシャント抵抗１３ａ、１３ｂを介してグランド端子である端子１０５ａ、１０５ｂに接続されている。スイッチング素子１０ａ、１０ｂ、１１ａ、１１ｂとして、例えばＦＥＴ（Ｆｉｅｌｄ　ｅｆｆｅｃｔ　ｔｒａｎｓｉｓｔｏｒ）等の半導体素子が用いられる。
　図１中、左側のブリッジ回路は、スイッチング素子１０ａとスイッチング素子１１ａの中間点から延びたラインにリレー機能のスイッチング素子１２ａが配置され、モータ出力用の端子１０７ａに接続されている。また、端子１０８ａは３個のスイッチング素子１０ａ、１１ａ、１２ａの接続点である。端子１０８ａの電圧をモニタすることにより、スイッチング素子１０ａ、１１ａ、１２ａの故障を検出することができる。一方、右側のブリッジ回路は、リレー機能のスイッチング素子を有しておらず、スイッチング素子１０ｂとスイッチング素子１１ｂの中間点から延びたラインは、モータ出力用の端子１０７ｂに接続されている。
　高電位側のスイッチング素子１０ａ、１０ｂのゲートは、ゲート信号用の端子１０１ａ、１０１ｂに接続されている。同様に、低電位側のスイッチング素子１１ａ、１１ｂのゲートは端子１０２ａ、１０２ｂに接続され、リレー機能のスイッチング素子１２ａのゲートは端子１０６ａに接続されている。また、端子１０３ａ、１０４ａは、シャント抵抗１３ａの両端の電位差を検出するための端子である。同様に、端子１０３ｂ、１０４ｂは、シャント抵抗１３ｂの両端の電位差を検出するための端子である。
　以上の回路を構成する半導体モジュール１の内部構造について、図２を用いて説明する。なお、図２において、一点鎖線はモールド樹脂７で覆われる領域を示している。半導体モジュール１は、図中、上下方向に複数の端子が延出されており、上側には制御信号の入出力用の制御端子、下側には大電流が通電されるパワー端子が配列されている。これらの端子は、スイッチング素子を搭載するプレート３０により形成されている。プレート３０は、電気抵抗が極力小さい金属、例えば銅または銅合金からなる導電板である。
　図２中、左側のブリッジ回路について説明する。電源端子である端子１００ａが延びたプレート３０上に、高電位側のスイッチング素子１０ａが搭載されている。スイッチング素子１０ａ、１１ａ、１２ａは、上面にソースとゲートが配置され、底面がドレインである。配線部材４Ａは、スイッチング素子１０ａのソース、リレー機能のスイッチング素子１２ａのソース、及びプレート３０の３箇所を接続している。
　また、配線部材４Ａが接続されたプレート３０には、低電位側のスイッチング素子１１ａが搭載されている。配線部材５Ａは、スイッチング素子１１ａのソースとプレート３０とを接続している。これにより、スイッチング素子１１ａとシャント抵抗１３ａの一端部が接続されている。また、シャント抵抗１３ａの他端部は、グランド端子である端子１０５ａが延びたプレート３０と接続されている。
　スイッチング素子１２ａのドレインは、モータ出力用の端子１０７ａが延びたプレート３０に接続されている。スイッチング素子１０ａ、１１ａ、１２ａのゲートは、ワイヤボンド６を介してゲート制御用の端子１０１ａ、１０２ａ、及び１０６ａにそれぞれ接続されている。シャント抵抗１３ａの両端は、端子１０３ａ、１０４ａに接続されている。端子１０８ａは、３個のスイッチング素子１０ａ、１１ａ、１２ａの接続点である。
　図２中、右側のブリッジ回路は、左側のブリッジ回路と回路構成が類似しているので、同じ部分については説明を省略する。右側のブリッジ回路は、リレー機能のスイッチング素子１２ａに該当するスイッチング素子を備えていない。このため、右側の配線部材４Ｂの形状は、左側の配線部材４Ａとは異なっている。一方、右側の配線部材５Ｂは、左側の配線部材５Ａと同一形状である。端子１０８ｂは、２個のスイッチング素子１０ｂ、１１ｂの接続点である。
　実施の形態１による配線部材４Ａ、４Ｂ、５Ａ、５Ｂは、少なくとも第１導電部と第２導電部とを電気的に接続するものであり、例えば銅製の板により形成されている。第１導電部は例えばスイッチング素子であり、第２導電部は例えばプレートであるが、第１導電部と第２導電部の組み合わせはこれに限定されるものではなく、スイッチング素子相互間、またはプレート相互間を接続する場合もある。さらに、第１導電部、第２導電部、及び第３導電部を含む３箇所以上が接続される場合、それぞれにスイッチング素子またはプレートのいずれであっても良く、組み合わせは自在である。
　配線部材４Ａ、４Ｂ、５Ａ、５Ｂはいずれも、第１導電部に接続される第１接続部と、第２導電部に接続される第２接続部と、第１接続部と第２接続部の間に配置された上面部と、上面部と第１接続部の間、及び上面部と第２接続部の間にそれぞれ配置された脚部とを含み、第１接続部、第２接続部、上面部、及び脚部は一体に形成されている。さらに、上面部は突起部を有し、第１接続部及び第２接続部は貫通穴を有している。
　配線部材４Ａ、４Ｂについて、図３及び図４を用いて詳細に説明する。図３は、図２中Ａ－Ａで示す箇所で切断した断面図、図４は、図２中Ｂ－Ｂで示す箇所で切断した断面図である。配線部材４Ａは、図３に示すように、２つのスイッチング素子１０ａ、１２ａとプレート３０の３箇所を接続している。
　配線部材４Ａは、２つの上面部４１と、第１導電部であるスイッチング素子１０ａのソースに接続された第１接続部である素子接続部４２と、第２導電部であるプレート３０に接続された第２接続部であるプレート接続部４３と、第３導電部であるスイッチング素子１２ａのソースに接続された第３接続部である素子接続部４２とを有している。上面部４１と素子接続部４２の間、及び上面部４１とプレート接続部４３の間にはそれぞれ脚部４４が配置され、上面部４１、素子接続部４２、プレート接続部４３、及び脚部４４は一体に形成されている。
　一方、配線部材４Ｂは、図４に示すように、１つのスイッチング素子１０ｂと２箇所のプレート３０の３箇所を接続している。配線部材４Ｂは、２つの上面部４１と、第１導電部であるスイッチング素子１０ｂに接続された第１接続部である素子接続部４２と、第２導電部及び第３導電部である２箇所のプレート３０に接続された第２接続部及び第３接続部である２つのプレート接続部４３とを有している。上面部４１と素子接続部４２の間、及び上面部４１とプレート接続部４３の間にはそれぞれ脚部４４が配置され、上面部４１、素子接続部４２、プレート接続部４３、及び脚部４４は一体に形成されている。
　配線部材４Ａ、４Ｂにおいて、上面部４１は、素子接続部４２のスイッチング素子１０ａとの接続面、及びプレート接続部４３のプレート３０との接続面に対して、反対側の方向に突出している。また、上面部４１は、素子接続部４２及びプレート接続部４３と平行に設けられ、素子接続部４２、プレート接続部４３、及び上面部４１は、それぞれ異なる高さ位置である。
　また、素子接続部４２は、スイッチング素子１０ａ、１０ｂ、１２ａとの接続面に対して垂直な方向に形成された貫通穴４５を有している。同様に、プレート接続部４３は、プレート３０との接続面に対して垂直な方向に形成された貫通穴４５を有している。貫通穴４５を有することにより、配線部材４Ａ、４Ｂをスイッチング素子１０ａ、１０ｂ、１２ａまたはプレート３０とはんだ等の接合部材で接続する際に、接合部材が貫通穴４５を抜けて配線部材４Ａ、４Ｂの上面まで塗布されるため、接続強度が向上する。
　このように、配線部材４Ａ、４Ｂは、上面から見た形状は非常に似ているが、断面形状は微妙に異なっている。このため、配線部材４Ａ、４Ｂの誤組み付けを防止するために、両者を区別して使用しなければならない。通常、組立用ロボットは、図２に示すように上面視で配線部材４Ａ、４Ｂを掴み（あるいは吸着し）、所定の位置に配置する。また、人手で組み立てる場合も同様に、配線部材４Ａ、４Ｂを上面視で選択する。そこで、上面視で配線部材４Ａ、４Ｂを区別するために、突起部４７を利用する。
　配線部材４Ａ、４Ｂは、上面部４１と一体に形成された突起部４７を有している。上面部４１は、他の部位と接続されない部位であり、且つ最も高い位置に配置されるため、突起部４７の大きさ及び配置に関し設計の自由度が高いという利点がある。また、上面部４１に突起部４７を形成するための特別な工程は必要なく、配線部材４Ａ、４Ｂの他の部位と同時に導電板を切断し、曲げ加工することによって、突起部４７を有する配線部材４Ａ、４Ｂを製作することができる。
　図２に示すように、配線部材４Ａ、４Ｂの突起部４７は、上面部４１の両側面に対称に設けられているが、配線部材４Ａと配線部材４Ｂとでは、突起部４７の位置が異なっている。配線部材４Ａは、中央のスイッチング素子１２ａの近傍の上面部４１に突起部４７を有している。一方、配線部材４Ｂは、スイッチング素子１０ｂの近傍の上面部４１に突起部４７を有している。このように、突起部４７の位置の違いにより、配線部材４Ａと配線部材４Ｂを区別することができる。
　なお、配線部材４Ａ、４Ｂは、配線部材５Ａ、５Ｂと比較して倍以上の長さを有しており、さらにプレート接続部４３、素子接続部４２、及び上面部４１は、それぞれ異なる高さ位置に形成されている。このため、配線部材４Ａ、４Ｂは、裏表の判別が容易であり、裏返しになっていても認識可能である。
　次に、配線部材５Ａ、５Ｂについて、図５を用いて詳細に説明する。図５において、右側の図は、左側の上面図を矢印Ｃで示す方向から見た側面図であり、一点鎖線はモールド樹脂７を示している。なお、配線部材５Ａ、５Ｂは同一形状であるため、図５では配線部材５Ａのみを示している。配線部材５Ａは、上面部５１と、第１導電部であるスイッチング素子１１ａのソースに接続された第１接続部である素子接続部５２と、第２導電部であるプレート３０に接続された第２接続部であるプレート接続部５３とを有している。上面部５１と素子接続部５２の間、及び上面部５１とプレート接続部５３の間にはそれぞれ脚部５４が配置され、上面部５１、素子接続部５２、プレート接続部５３、及び脚部５４は一体に形成されている。
　配線部材５Ａにおいて、上面部５１は、素子接続部５２のスイッチング素子１１ａとの接続面、及びプレート接続部５３のプレート３０との接続面に対して、反対側の方向に突出している。また、上面部５１は、素子接続部５２及びプレート接続部５３と平行に設けられ、素子接続部５２、プレート接続部５３、及び上面部５１は、それぞれ異なる高さ位置である。さらに、素子接続部５２は、スイッチング素子１１ａとの接続面に対して垂直な方向に形成された貫通穴５５を有し、プレート接続部５３は、プレート３０との接続面に対して垂直な方向に形成された貫通穴５５を有している。
　また、プレート接続部５３の角部には、切り欠き５６が形成されている。配線部材５Ａは、幅寸法がスイッチング素子１１ａの幅よりも小さく例えば数ミリメートル程度の小型部品であるが、カメラまたは目視により切り欠き５６が認識可能な場合、切り欠き５６によって配線部材５Ａの向きを判別することができる。例えば、図５では、切り欠き５６のある方がプレート接続部５３、切り欠きの無い方が素子接続部５２であると判別することができる。
　なお、切り欠き５６は、視認性の観点からは大きい方が好ましいが、切り欠き５６を大きくするとプレート接続部５３の面積が小さくなるため、接続強度の観点からは小さい方が望ましい。また、切り欠き５６は、図５に示すような直線的な形状に限らず、曲線的な形状あってもよい。さらに、図５ではプレート接続部５３の両方の角部に切り欠き５６を形成しているが、片方の角部のみに形成してもよい。
　また、配線部材５Ａの表裏の判別には、上面部５１の両側面に非対称に設けられた突起部５７を利用することができる。前述のように、配線部材５Ａは小さい部品であるため、表裏が反転することがあり、切り欠き５６のみでは表裏の判別が難しい。非対称に配置された２つの突起部５７は、配線部材５Ａが裏返しになると位置が入れ替わるため、２つの突起部５７の位置によって表裏を判別することができる。
　以上のように、実施の形態１に係る配線部材４Ａ、４Ｂ、５Ａ、５Ｂによれば、上面部４１、５１に突起部４７、５７を設けることにより、配線部材の種類、向き、及び表裏を容易に判別することができるため、半導体モジュールにおける配線部材の誤組み付けを防止することが可能である。また、上面部４１、５１は、他の部位と接続されない部位であるため、突起部４７、４７の大きさ及び配置に関し設計の自由度が高いという利点がある。また、突起部４７、５７は、上面部４１、５１と一体に形成されるため、配線部材４Ａ、４Ｂ、５Ａ、５Ｂの他の部位と同時に、容易に製作することができる。
実施の形態２．
　実施の形態２では、上記実施の形態１による配線部材４Ａ、４Ｂ、５Ａ、５Ｂの変形例について説明する。実施の形態２による半導体モジュールの回路構成は、上記実施の形態１と同様であるので説明を省略する（図１参照）。実施の形態２による配線部材は、Ｈブリッジ回路を内蔵した半導体モジュール１（図２参照）の他、ブリッジ回路１相分を内蔵した半導体モジュール、あるいはその他の回路構成及び部品構成の半導体モジュールに用いることができる。
　図６及び図７は、実施の形態２による配線部材を示している。実施の形態２による配線部材５Ｃ、４Ｃはいずれも、上記実施の形態１による配線部材４Ａ、４Ｂ、５Ａ、５Ｂと同様に、上面部５１、４１、素子接続部５２、４２、プレート接続部５３、４３、及び脚部５４、４４を有している。また、素子接続部５２、４２及びプレート接続部５３、４３は、貫通穴４５を有している。
　図６に示す配線部材５Ｃは、上面部５１に凹部５８を有している。配線部材５Ｃの表裏の判別には、上面部５１の両側面に非対称に設けられた凹部５８を利用することができる。すなわち、非対称に配置された２つの凹部５８は、配線部材５Ｃが裏返しになると位置が入れ替わるため、２つの凹部５８の位置によって表裏を判別することができる。また、凹部５８を上面部５１の両側面に対称に設けることにより、配線部材５Ｃの向きの判別に利用することも可能である。
　このように、凹部５８は、上記実施の形態１で説明した配線部材５Ａの突起部５７（図５参照）と同様に用いられるが、特に、突起部５７ではワイヤボンド６または他の部品に接触しやすい場合、または突起部５７により配線部材の安定性が低下する場合に、凹部５８を用いるとよい。なお、凹部５８の形状は、図６に示す半円状に限定されるものではなく、矩形、三角形等であってもよい。凹部５８を形成するために特別な工程は必要なく、配線部材５Ｃの他の部位と同時に導電板を切断し、曲げ加工することによって、凹部５８を有する配線部材５Ｃを製作することができる。
　また、図７に示す配線部材４Ｃは、上面部４１に突起部４７と凹部４８を有している。図７に示す例では、１つの上面部４１の両側面に突起部４７の対を対称に設け、別の上面部４１の両側面に凹部４８の対を対称に設けているが、これらは非対称であってもよい。あるいは、突起部４７と凹部４８を対にして、対称または非対称に設けてもよい。このように、様々なパターンで突起部４７と凹部４８を配置することにより、多種類の配線部材を用いる複雑な回路構成の半導体モジュールにおいても、配線部材の種類の判別が容易に行える。
　実施の形態２に係る配線部材５Ｃ、４Ｃによれば、上面部５１、４１に凹部５８、４８を設けることにより、配線部材の種類、向き、及び表裏を容易に判別することができるため、半導体モジュールにおける配線部材の誤組み付けを防止することが可能である。さらに、突起部４７と凹部４８を組み合わせて配置することにより、さらに多種類の配線部材の判別が可能となる。また、上面部５１、４１は、他の部位と接続されない部位であるため、凹部５８、４８の大きさ及び配置に関し設計の自由度が高いという利点がある。
　本開示は、様々な例示的な実施の形態及び実施例が記載されているが、１つ、または複数の実施の形態に記載された様々な特徴、態様、及び機能は特定の実施の形態の適用に限られるのではなく、単独で、または様々な組み合わせで実施の形態に適用可能である。従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも１つの構成要素を変形する場合、追加する場合または省略する場合、さらには、少なくとも１つの構成要素を抽出し、他の実施の形態の構成要素と組み合わせる場合が含まれるものとする。
　１　半導体モジュール、２　モータ、３ａ、３ｂ　電源、４Ａ、４Ｂ、４Ｃ、５Ａ、５Ｂ、５Ｃ　配線部材、６　ワイヤボンド、７　モールド樹脂、１０ａ、１０ｂ、１１ａ、１１ｂ、１２ａ　スイッチング素子、１３ａ、１３ｂ　シャント抵抗、３０　プレート、４１、５１　上面部、４２、５２　素子接続部、４３、５３　プレート接続部、４４、５４　脚部、４５、５５　貫通穴、５６　切り欠き、４７、５７　突起部、４８、５８　凹部、１００ａ、１００ｂ、１０１ａ、１０１ｂ、１０２ａ、１０２ｂ、１０３ａ、１０３ｂ、１０４ａ、１０４ｂ、１０５ａ、１０５ｂ、１０６ａ、１０７ａ、１０７ｂ、１０８ａ、１０８ｂ　端子

Claims (11)

  1. 　少なくとも第１導電部と第２導電部とを電気的に接続する配線部材であって、
    前記第１導電部に接続される第１接続部と、
    前記第２導電部に接続される第２接続部と、
    前記第１接続部と前記第２接続部の間に配置された上面部と、
    前記上面部と前記第１接続部の間、及び前記上面部と前記第２接続部の間にそれぞれ配置された脚部とを含み、
    前記第１接続部、前記第２接続部、前記上面部、及び前記脚部は一体に形成され、
    前記上面部は、突起部及び凹部のいずれか一方または両方を有することを特徴とする配線部材。
  2. 　前記上面部は、前記第１接続部の前記第１導電部との接続面、及び前記第２接続部の前記第２導電部との接続面に対して、反対側の方向に突出していることを特徴とする請求項１記載の配線部材。
  3. 　前記上面部は、前記第１接続部及び前記第２接続部と平行に設けられていることを特徴とする請求項１または請求項２に記載の配線部材。
  4. 　前記第１接続部、前記第２接続部、及び前記上面部は、それぞれ異なる高さ位置であることを特徴とする請求項１から請求項３のいずれか一項に記載の配線部材。
  5. 　前記突起部及び前記凹部のいずれか一方または両方は、前記上面部の両側面に対称に設けられていることを特徴とする請求項１から請求項４のいずれか一項に記載の配線部材。
  6. 　前記突起部及び前記凹部のいずれか一方または両方は、前記上面部の両側面に非対称に設けられていることを特徴とする請求項１から請求項４のいずれか一項に記載の配線部材。
  7. 　前記第１接続部は、前記第１導電部との接続面に対して垂直な方向に形成された貫通穴を有することを特徴とする請求項１から請求項６のいずれか一項に記載の配線部材。
  8. 　前記第２接続部は、前記第２導電部との接続面に対して垂直な方向に形成された貫通穴を有することを特徴とする請求項１から請求項７のいずれか一項に記載の配線部材。
  9. 　前記突起部は、前記上面部と一体に形成されていることを特徴とする請求項１から請求項８のいずれか一項に記載の配線部材。
  10. 　前記第１接続部または前記第２接続部は、角部に切り欠きが形成されていることを特徴とする請求項１から請求項９のいずれか一項に記載の配線部材。
  11. 　請求項１から請求項１０のいずれか一項に記載の配線部材と、複数の半導体素子と、前記半導体素子が装着される金属製のプレートとを備え、前記第１導電部は前記半導体素子であり、前記第２導電部は前記プレートであることを特徴とする半導体モジュール。
PCT/JP2018/017730 2018-05-08 2018-05-08 配線部材及びこれを備えた半導体モジュール WO2019215806A1 (ja)

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