CN112074935A - 布线构件及具备布线构件的半导体模块 - Google Patents

布线构件及具备布线构件的半导体模块 Download PDF

Info

Publication number
CN112074935A
CN112074935A CN201880093084.4A CN201880093084A CN112074935A CN 112074935 A CN112074935 A CN 112074935A CN 201880093084 A CN201880093084 A CN 201880093084A CN 112074935 A CN112074935 A CN 112074935A
Authority
CN
China
Prior art keywords
wiring member
connection
connection portion
conductive
member according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880093084.4A
Other languages
English (en)
Inventor
竹内谦介
长尾崇志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN112074935A publication Critical patent/CN112074935A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/35—Manufacturing methods
    • H01L2224/352—Mechanical processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37012—Cross-sectional shape
    • H01L2224/37013—Cross-sectional shape being non uniform along the connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/40139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous strap daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73221—Strap and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8412—Aligning
    • H01L2224/84121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/84122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8412—Aligning
    • H01L2224/84121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/84122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H01L2224/84129—Shape or position of the other item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8412—Aligning
    • H01L2224/84121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/84132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/35—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)

Abstract

在布线构件(5A)中，元件连接部(52)、板连接部(53)以及上表面部(51)分别在不同高度的位置。元件连接部(52)具有贯通孔(55)，板连接部(53)具有贯通孔(55)和缺口(56)。另外，不与其他部位连接的部位即上表面部(51)具有非对称地配置在两个侧面的突起部(57)。由此，能够较容易地对布线构件的种类、方向以及表里进行判别，因此能防止半导体模块中的布线构件的误组装。

Description

布线构件及具备布线构件的半导体模块
技术领域
本申请涉及布线构件以及具备该布线构件的半导体模块。
背景技术
以往，在半导体模块中，利用导线和夹具等布线构件对半导体元件彼此间或半导体元件与板等进行连接。另外，专利文献1中公开了一种立体的布线构件，该布线构件将与第1导电部、第2导电部及第3导电部分别连接的第1脚部、第2脚部及第3脚部、连结第1脚部与第2脚部的第1连结部、以及连结第2脚部与第3脚部的第2连结部形成为一体，以作为将三个部位进行电连接的布线构件。
在该现有例中，将第1脚部、第2脚部及第3脚部配置在非直线上，从而利用一个布线构件将三个导电部可靠地进行连接以使得三个部位的连接部形成三角形。另外，通过利用三点来进行连接，从而抑制了布线构件倒下的不良的发生。
现有技术文献
专利文献
专利文献1：日本专利特许第5569555号公报
发明内容
发明所要解决的技术问题
有时在内置于半导体模块的电路中使用相似或相同形状的多个布线构件。因此，在安装布线构件的工序中，需要对布线构件的种类、方向、以及表里进行区分，从而成为导致工作效率降低的原因。另外，在能通过摄像头来检测布线构件的自动化线上，也存在难以区分相似的布线构件的情况，存在将布线构件的种类或方向或表里错误地安装这样的问题。专利文献1中所公开的布线构件中没有在区分相似的多个布线构件上下功夫。
本申请公开了为了解决上述那样的问题的技术，其目的在于能较容易地对布线构件的种类、方向以及表里进行判别，从而防止半导体模块中的布线构件的误组装。
解决技术问题所采用的技术方案
本申请所公开的布线构件为至少将第1导电部与第2导电部进行电连接的布线构件，包含：连接至第1导电部的第1连接部；连接至第2导电部的第2连接部；配置在第1连接部与第2连接部之间的上表面部；以及分别配置在上表面部与第1连接部之间、以及上表面部与第2连接部之间的脚部，第1连接部、第2连接部、上表面部以及脚部形成为一体，上表面部具有突起部和凹部中的任意一个或两个。
另外，本申请所公开的半导体模块包括本申请所公开的布线构件、多个半导体元件、以及安装有半导体元件的金属制的板，第1导电部为半导体元件，第2导电部为板。
发明效果
根据本申请所公开的布线构件，通过在上表面部设置突起部和凹部中的任意一个或两个，从而能够较容易地对布线构件的种类、方向以及表里进行判别，因此能防止半导体模块中的布线构件的误组装。另外，上表面部为不与其他部位连接的部位，因此关于突起部和凹部的大小和配置，设计的自由度较高。
本申请的上述以外的目的、特征、观点及效果通过参照附图的以下详细说明将变得更明确。
附图说明
图1是表示实施方式1所涉及的半导体模块的电路结构的图。
图2是表示实施方式1所涉及的半导体模块的内部结构的图。
图3是表示实施方式1所涉及的布线构件的剖视图。
图4是表示实施方式1所涉及的其他布线构件的剖视图。
图5是表示实施方式1所涉及的另一个其他布线构件的俯视图和侧视图。
图6是表示实施方式2所涉及的布线构件的俯视图。
图7是表示实施方式2所涉及的其他布线构件的俯视图。
具体实施方式
实施方式1.
下面，基于附图对实施方式1所涉及的半导体模块进行说明。图1是表示实施方式1所涉及的半导体模块的电路结构的图，图2是表示实施方式1所涉及的半导体模块的内部结构的俯视透视图。各图中，对相同或相当部分标注相同符号。实施方式1所涉及的半导体模块1内置了对电动机进行驱动的桥式电路的两相(所谓H桥式电路)。
对于实施方式1所涉及的半导体模块1的电路结构，使用图1来进行说明。此外，图1中，圆圈标记(100a、100b等)示出了半导体模块1的端子。H桥式电路从与电源3a、3b相连接的端子100a、100b起连接至高电位侧的开关元件10a、10b和低电位侧的开关元件11a、11b，并在下游处经由分流电阻13a、13b而连接至作为接地端子的端子105a、105b。作为开关元件10a、10b、11a、11b，例如，使用FET(Field effect transistor：场效应晶体管)等半导体元件。
在图1中，左侧的桥式电路中，将有继电器功能的开关元件12a配置在从开关元件10a与开关元件11a的中间点延伸出的线路上，并连接至电动机输出用的端子107a。另外，端子108a为三个开关元件10a、11a、12a的连接点。可以通过对端子108a的电压进行监控，来检测开关元件10a、11a、12a的故障。另一方面，右侧的桥式电路不具有有继电器功能的开关元件，从开关元件10b与开关元件11b的中间点延伸出的线路连接至电动机输出用的端子107b。
高电位侧的开关元件10a、10b的栅极连接至栅极信号用的端子101a、101b。同样地，低电位侧的开关元件11a、11b的栅极连接至端子102a、102b，有继电器功能的开关元件12a的栅极连接至端子106a。另外，端子103a、104a为用于对分流电阻13a的两端的电位差进行检测的端子。同样地，端子103b、104b为用于对分流电阻13b的两端的电位差进行检测的端子。
对于构成上述电路的半导体模块1的内部结构，使用图2来进行说明。此外，图2中，单点划线示出了被模塑树脂7覆盖的区域。半导体模块1中，沿图中的上下方向延伸出多个端子，上侧排列有控制信号的输入输出用的控制端子，下侧排列有对大电流进行通电的功率端子。这些端子由搭载开关元件的板30形成。板30为电阻抗极小的金属，例如为由铜或铜合金构成的导电板。
图2中，对左侧的桥式电路进行说明。在作为电源端子的端子100a延伸出的板30上，搭载有高电位侧的开关元件10a。开关元件10a、11a、12a的上表面配置有源极和栅极，底面为漏极。布线构件4A将开关元件10a的源极、有继电器功能的开关元件12a的源极、以及板30这三个部位进行连接。
另外，与布线构件4A相连接的板30上搭载有低电位侧的开关元件11a。布线构件5A将开关元件11a的源极与板30进行连接。由此，开关元件11a与分流电阻13a的一个端部相连接。另外，分流电阻13a的另一个端部与作为接地端子的端子105a所延伸出的板30相连接。
开关元件12a的漏极连接至电动机输出用的端子107a所延伸出的板30。开关元件10a、11a、12a的栅极经由焊线6分别连接至栅极控制用的端子101a、102a以及106a。分流电阻13a的两端连接至端子103a、104a。端子108a为三个开关元件10a、11a、12a的连接点。
图2中，右侧的桥式电路的电路结构与左侧的桥式电路类似，因此，对于相同的部分省略说明。右侧的桥式电路不具备相当于有继电器功能的开关元件12a的开关元件。因此，右侧的布线构件4B的形状与左侧的布线构件4A不同。另一方面，右侧的布线构件5B为与左侧的布线构件5A相同的形状。端子108b为两个开关元件10b、11b的连接点。
实施方式1所涉及的布线构件4A、4B、5A、5B为至少将第1导电部与第2导电部进行电连接的构件，例如由铜制的板形成。第1导电部例如是开关元件，第2导电部例如是板，但第1导电部与第2导电部的组合并不限于此，有时也将开关元件彼此间、或者板彼此间进行连接。此外，在对包含第1导电部、第2导电部以及第3导电部在内的三个部位以上进行连接的情况下，可以分别为开关元件和板中的某一个，能自由组合。
布线构件4A、4B、5A、5B均包含连接至第1导电部的第1连接部、连接至第2导电部的第2连接部、配置在第1连接部与第2连接部之间的上表面部、以及分别配置在上表面部与第1连接部之间以及上表面部与第2连接部之间的脚部，第1连接部、第2连接部、上表面部以及脚部形成为一体。此外，上表面部具有突起部，第1连接部和第2连接部具有贯通孔。
使用图3和图4对布线构件4A、4B进行详细说明。图3是在图2中A-A所示的部位处进行切割而得的剖视图，图4是在图2中B-B所示的部位处进行切割而得的剖视图。如图3所示，布线构件4A将两个开关元件10a、12a和板30这三个部位进行连接。
布线构件4A具有两个上表面部41、与作为第1导电部的开关元件10a的源极相连接的第1连接部即元件连接部42、与作为第2导电部的板30相连接的第2连接部即板连接部43、以及与作为第3导电部的开关元件12a的源极相连接的第3连接部即元件连接部42。在上表面部41与元件连接部42之间、以及上表面部41与板连接部43之间分别配置有脚部44，上表面部41、元件连接部42、板连接部43以及脚部44形成为一体。
另一方面，如图4所示，布线构件4B将一个开关元件10b和两处的板30这三个部位进行连接。布线构件4B具有两个上表面部41、与作为第1导电部的开关元件10b相连接的第1连接部即元件连接部42、以及与作为第2导电部和第3导电部即两处的板30相连接的第2连接部和第3连接部即两个板连接部43。在上表面部41与元件连接部42之间、以及上表面部41与板连接部43之间分别配置有脚部44，上表面部41、元件连接部42、板连接部43以及脚部44形成为一体。
在布线构件4A、4B中，上表面部41朝相对于与元件连接部42的开关元件10a连接的连接面、以及与板连接部43的板30连接的连接面相反一侧的方向突出。另外，上表面部41与元件连接部42和板连接部43平行地进行设置，元件连接部42、板连接部43以及上表面部41分别在不同高度的位置。
另外，元件连接部42具有贯通孔45，该贯通孔45沿相对于与开关元件10a、10b、12a连接的连接面垂直的方向形成。同样地，板连接部43具有贯通孔45，该贯通孔45沿相对于与板30连接的连接面垂直的方向形成。具有贯通孔45，从而在利用焊料等接合构件来将开关元件10a、10b、12a或者板30与布线构件4A、4B进行连接时，将接合构件穿过贯通孔45而涂布到布线构件4A、4b的上表面，因此连接强度得到提高。
由此，布线构件4A、4B从上表面看到的形状非常相似，但剖面形状微妙地不同。因此，必须将两者进行区分来使用，以防止布线构件4A、4B的误组装。通常，在俯视下组装用机器人如图2所示那样抓住(或者吸附)布线构件4A、4B，并配置在规定位置。另外，通过人手来进行组装的情况也同样，在俯视下选择布线构件4A、4B。因此，为了在俯视下对布线构件4A、4B进行区分，利用突起部47。
布线构件4A、4B具有与上表面部41形成为一体的突起部47。上表面部41为不与其他部位相连接的部位，且配置在最高位置，因此关于突起部47的大小和配置，具有设计的自由度较高这样的优点。另外，无需用于在上表面部41形成突起部47的特殊工序，通过对导电板进行切割并进行弯曲加工，能够与布线构件4A、4B的其他部位同时制成具有突起部47的布线构件4A、4B。
如图2所示，布线构件4A、4B的突起部47对称地设置在上表面部41的两个侧面，但布线构件4A的突起部47的位置与布线构件4B的突起部47的位置不同。布线构件4A在中央的开关元件12a的附近的上表面部41具有突起部47。另一方面，布线构件4B在开关元件10b的附近的上表面部41具有突起部47。由此，能够根据突起部47位置的不同，来对布线构件4A与布线构件4B进行区分。
此外，布线构件4A、4B与布线构件5A、5B相比较具有成倍以上的长度，并且板连接部43、元件连接部42以及上表面部41分别形成在不同高度的位置。因此，布线构件4A、4B中，对表里的判别较为容易，即使翻转也能识别出。
接着，使用图5对布线构件5A、5B进行详细说明。图5中，右侧的图为从用箭头C表示的方向对左侧的俯视图进行观察的侧视图，单点划线示出了模塑树脂7。此外，布线构件5A、5B为相同形状，因此图5中仅示出了布线构件5A。布线构件5A具有上表面部51、与作为第1导电部的开关元件11a的源极相连接的第1连接部即元件连接部52、以及与作为第2导电部的板30相连接的第2连接部即板连接部53。在上表面部51与元件连接部52之间、以及上表面部51与板连接部53之间分别配置有脚部54，上表面部51、元件连接部52、板连接部53以及脚部54形成为一体。
在布线构件5A中，上表面部51朝相对于与元件连接部52的开关元件11a连接的连接面、以及与板连接部53的板30连接的连接面相反一侧的方向突出。另外，上表面部51与元件连接部52和板连接部53平行地进行设置，元件连接部52、板连接部53以及上表面部51分别在不同高度的位置。此外，元件连接部52具有沿相对于与开关元件11a连接的连接面垂直的方向形成的贯通孔55，板连接部53具有沿相对于与板30连接的连接面垂直的方向形成的贯通孔55。
另外，板连接部53的角部形成有切口56。布线构件5A为宽度尺寸小于开关元件11a的宽度的、例如几毫米左右的小型部件，但通过摄像头或肉眼观察能识别出缺口56，在这种情况下，能够根据缺口56对布线构件5A的朝向进行判别。例如，图5中，能够将具有切口56的那个判定为板连接部53，将没有缺口的那个判定为元件连接部52。
此外，从视觉识别性的观点来看，优选缺口56越大越好，但当缺口56较大时，板连接部53的面积变小，因此从连接强度的观点来看期望缺口56较小。另外，缺口56并不限于图5所示那样的直线形状，也可以为曲线形状。此外，图5中，在板连接部53的两个角部形成有缺口56，但也可以仅形成在一个角部。
另外，对于布线构件5A的表里的判别，能够利用非对称地设置在上表面部51的两个侧面的突起部57。如上所述，布线构件5A为较小的部件，因此，有时表里会反转，仅通过缺口56难以判别表里。当布线构件5A翻转时，非对称配置的两个突起部57的位置互换，因此能够通过两个突起部57的位置来对表里进行判别。
如上所述，根据实施方式1所涉及的布线构件4A、4B、5A、5B，在上表面部41、51设置突起部47、57，从而能够较容易地对布线构件的种类、朝向以及表里进行判别，因此，能防止半导体模块中的布线构件的误组装。另外，上表面部41、51为不与其他部位连接的部位，因此关于突起部47、47的大小和配置存在设计的自由度较高这样的优点。另外，突起部47、57与上表面部41、51形成为一体，因此能够较容易地与布线构件4A、4B、5A、5B的其他部位同时进行制作。
实施方式2.
实施方式2中，对上述实施方式1所涉及的布线构件4A、4B、5A、5B的变形例进行说明。实施方式2所涉及的半导体模块的电路结构与上述实施方式1同样，因此省略说明(参照图1)。实施方式2所涉及的布线构件除内置有H桥式电路的半导体模块1(参照图2)以外，还能够用于内置有桥式电路的1相的半导体模块、或其他电路结构和部件结构的半导体模块。
图6和图7示出了实施方式2所涉及的布线构件。实施方式2所涉及的布线构件5C、4C均与上述实施方式1所涉及的布线构件4A、4B、5A、5B同样，具有上表面部51、41、元件连接部52、42、板连接部53、43、以及脚部54、44。另外，元件连接部52、42和板连接部53、43具有贯通孔45。
在图6所示的布线构件5C的上表面部51具有凹部58。对于布线构件5C的表里的判别，能够利用非对称地设置在上表面部51的两个侧面的凹部58。即，当布线构件5C翻转时，非对称配置的两个凹部58的位置互换，因此能够通过两个凹部58的位置来对表里进行判别。另外，通过将凹部58对称地设置在上表面部51的两个侧面，从而也能用于判别布线构件5C的朝向。
由此，与上述实施方式1中所说明的布线构件5A的突起部57(参照图5)同样地使用凹部58，尤其是在突起部57较容易地与焊线6或其他部件相接触的情况下，或在布线构件的稳定性因突起部57而降低的情况下，也可以使用凹部58。此外，凹部58的形状并不限于图6所示的半圆形，也可以为长方形、三角形等。无需特殊工序来形成凹部58，通过对导电板进行切割并进行弯曲加工，从而能够与布线构件5C的其他部位同时制成具有凹部58的布线构件5C。
另外，在图7所示的布线构件4C的上表面部41具有突起部47和凹部48。图7所示的示例中，在一个上表面部41的两个侧面对称地设置一对突起部47，在另一个上表面部41的两个侧面对称地设置一对凹部48，但也可以非对称地设置上述结构。或者，将突起部47和凹部48设为一对，可以对称或非对称地进行设置。由此，通过利用各种各样的模式来配置突起部47和凹部48，从而即使在使用多种布线构件的复杂的电路结构的半导体模块中，也能较容易地进行布线构件种类的判别。
根据实施方式2所涉及的布线构件5C、4C，在上表面部51、41设置凹部58、48，从而能够较容易地对布线构件的种类、朝向以及表里进行判别，因此，能防止半导体模块中的布线构件的误组装。此外，通过对突起部47和凹部48进行组合来进行配置，从而能进一步判别多种布线构件。另外，上表面部51、41为不与其他部位连接的部位，因此关于凹部58、48的大小和配置具有设计自由度较高这样的优点。
本公开记载了各种例示性的实施方式及实施例，但1个或多个实施方式中记载的各种特征、形态及功能并不限于特定实施方式的应用，可单独或以各种组合来应用于实施方式。由此，可以认为未示例的无数变形例也包含在本申请说明书所公开的技术范围内。例如，假设包括对至少一个构成要素进行变形、添加或省略的情况，以及提取至少一个构成要素并与其他实施方式的构成要素进行组合的情况。
标号说明
1 半导体模块
2 电动机
3a、3b 电源
4A、4B、4C、5A、5B、5C 布线构件
6 焊线
7 模塑树脂
10a、10b、11a、11b、12a 开关元件
13a、13b 分流电阻
30 板
41、51 上表面部
42、52 元件连接部
43、53 板连接部
44、54 脚部
45、55 贯通孔
56 切口
47、57 突起部
48、58 凹部
100a、100b、101a、101b、102a、102b、103a、103b、104a、104b、105a、105b、106a、107a、107b、108a、108b 端子

Claims (11)

1.一种布线构件，该布线构件至少将第1导电部与第2导电部进行电连接，其特征在于，包含：
第1连接部，该第1连接部连接至所述第1导电部；
第2连接部，该第2连接部连接至所述第2导电部；
上表面部，该上表面部配置在所述第1连接部与所述第2连接部之间；以及
脚部，该脚部分别配置在所述上表面部与所述第1连接部之间、以及所述上表面部与所述第2连接部之间，
所述第1连接部、所述第2连接部、所述上表面部以及所述脚部形成为一体，
所述上表面部具有突起部和凹部中的任意一个或两个。
2.如权利要求1所述的布线构件，其特征在于，
所述上表面部朝相对于与所述第1连接部的所述第1导电部连接的连接面、以及与所述第2连接部的所述第2导电部连接的连接面相反一侧的方向突出。
3.如权利要求1或2所述的布线构件，其特征在于，
所述上表面部与所述第1连接部和所述第2连接部平行地进行设置。
4.如权利要求1至3的任一项所述的布线构件，其特征在于，
所述第1连接部、所述第2连接部以及所述上表面部分别在不同高度的位置。
5.如权利要求1至4的任一项所述的布线构件，其特征在于，
所述突起部和所述凹部中的任意一个或两个对称地设置在所述上表面部的两个侧面。
6.如权利要求1至4的任一项所述的布线构件，其特征在于，
所述突起部和所述凹部中的任意一个或两个非对称地设置在所述上表面部的两个侧面。
7.如权利要求1至6的任一项所述的布线构件，其特征在于，
所述第1连接部具有沿相对于与所述第1导电部连接的连接面垂直的方向形成得到的贯通孔。
8.如权利要求1至7的任一项所述的布线构件，其特征在于，
所述第2连接部具有沿相对于与所述第2导电部连接的连接面垂直的方向形成的贯通孔。
9.如权利要求1至8的任一项所述的布线构件，其特征在于，
所述突起部与所述上表面部形成为一体。
10.如权利要求1至9的任一项所述的布线构件，其特征在于，
在所述第1连接部或所述第2连接部的角部形成有缺口。
11.一种半导体模块，其特征在于，
包括如权利要求1至10的任一项所述的布线构件、多个半导体元件、以及安装有所述半导体元件的金属制的板，所述第1导电部为所述半导体元件，所述第2导电部为所述板。
CN201880093084.4A 2018-05-08 2018-05-08 布线构件及具备布线构件的半导体模块 Pending CN112074935A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/017730 WO2019215806A1 (ja) 2018-05-08 2018-05-08 配線部材及びこれを備えた半導体モジュール

Publications (1)

Publication Number Publication Date
CN112074935A true CN112074935A (zh) 2020-12-11

Family

ID=68467399

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880093084.4A Pending CN112074935A (zh) 2018-05-08 2018-05-08 布线构件及具备布线构件的半导体模块

Country Status (5)

Country Link
US (1) US11476224B2 (zh)
EP (1) EP3792961A4 (zh)
JP (1) JP7065953B2 (zh)
CN (1) CN112074935A (zh)
WO (1) WO2019215806A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023058211A1 (zh) * 2021-10-08 2023-04-13

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910244A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 樹脂封止半導体装置
JPS6355537U (zh) * 1986-09-29 1988-04-14
JPH05299566A (ja) * 1992-04-21 1993-11-12 Mitsubishi Electric Corp 半導体装置用リードフレーム
JP4471555B2 (ja) 2002-04-22 2010-06-02 三洋電機株式会社 半導体装置
JP3869755B2 (ja) 2002-05-16 2007-01-17 三洋電機株式会社 半導体装置
JP2010136407A (ja) 2003-10-23 2010-06-17 Nippon Dempa Kogyo Co Ltd 水晶発振器の製造方法
JP4380419B2 (ja) 2004-05-31 2009-12-09 京セラキンセキ株式会社 電子装置の製造方法
JP5076440B2 (ja) 2006-10-16 2012-11-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP4967701B2 (ja) 2007-02-19 2012-07-04 三菱電機株式会社 電力半導体装置
JP2011204886A (ja) * 2010-03-25 2011-10-13 Panasonic Corp 半導体装置及びその製造方法
SG180052A1 (en) * 2010-10-28 2012-05-30 Rockwell Automation Asia Pacific Business Ctr Pte Ltd Programmable controller component with assembly alignment features
JP5175989B1 (ja) 2012-03-09 2013-04-03 福島双羽電機株式会社 平板形状の半導体装置
JP5569555B2 (ja) 2012-05-17 2014-08-13 株式会社デンソー 配線部材、および、これを用いた半導体モジュール
WO2013179638A1 (ja) 2012-05-29 2013-12-05 日本精工株式会社 半導体モジュール及びその製造方法
EP3024024B1 (en) 2013-10-21 2020-03-18 NSK Ltd. Semiconductor module
DE202014003171U1 (de) 2014-04-15 2014-05-14 Ixys Semiconductor Gmbh Leistungshalbleitermodul

Also Published As

Publication number Publication date
JPWO2019215806A1 (ja) 2021-02-12
JP7065953B2 (ja) 2022-05-12
EP3792961A1 (en) 2021-03-17
EP3792961A4 (en) 2021-04-07
US11476224B2 (en) 2022-10-18
WO2019215806A1 (ja) 2019-11-14
US20200395329A1 (en) 2020-12-17

Similar Documents

Publication Publication Date Title
KR100867263B1 (ko) 전자 제어 장치
US9263722B2 (en) Connection structure for a wiring member
JP4878520B2 (ja) 半導体装置
KR101351737B1 (ko) 반도체 릴레이
CN107851630B (zh) 半导体装置
JPH07230934A (ja) 電子部品及びその基板実装構造
CN112074935A (zh) 布线构件及具备布线构件的半导体模块
CN112204678B (zh) 分流电阻器以及分流电阻器安装结构
JP2005101283A (ja) 表面実装型発光ダイオード
JP7367154B2 (ja) 半導体装置
JP4787749B2 (ja) コンデンサモジュールおよびその製造方法
US20190013267A1 (en) Packaged IC Component
US6838830B2 (en) Half-bridge
US6111758A (en) Electronic component having alternate functionalities
JP4113142B2 (ja) 電子装置
JP3889690B2 (ja) 電子部品内蔵コネクタの製造方法
KR20190112097A (ko) 전자 장치 및 접속체
US6386926B1 (en) Serial bus connector terminal main body
JP7052601B2 (ja) 回路構成体
WO2023013388A1 (ja) 半導体モジュール
JP5491894B2 (ja) 半導体リレー
JP2006313821A (ja) 半導体装置
JPH0413849Y2 (zh)
CN113424286A (zh) 开关装置及开关装置的制造方法
JP2004031663A (ja) ジャンパ線の配線構造

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination