JPWO2019215806A1 - 配線部材及びこれを備えた半導体モジュール - Google Patents
配線部材及びこれを備えた半導体モジュール Download PDFInfo
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- JPWO2019215806A1 JPWO2019215806A1 JP2020517650A JP2020517650A JPWO2019215806A1 JP WO2019215806 A1 JPWO2019215806 A1 JP WO2019215806A1 JP 2020517650 A JP2020517650 A JP 2020517650A JP 2020517650 A JP2020517650 A JP 2020517650A JP WO2019215806 A1 JPWO2019215806 A1 JP WO2019215806A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
Description
また、本願の開示される半導体モジュールは、本願に開示される配線部材と、複数の半導体素子と、半導体素子が装着される金属製のプレートとを備え、第1導電部は半導体素子であり、第2導電部はプレートである。
本願の上記以外の目的、特徴、観点及び効果は、図面を参照する以下の詳細な説明から、さらに明らかになるであろう。
以下に、実施の形態1による半導体モジュールについて、図面に基づいて説明する。図1は、実施の形態1による半導体モジュールの回路構成を示す図であり、図2は、実施の形態1による半導体モジュールの内部構造を示す上面透視図である。各図において、同一または相当部分には、同一符号を付している。実施の形態1による半導体モジュール1は、モータを駆動するブリッジ回路2相分(所謂Hブリッジ回路)を内蔵している。
実施の形態2では、上記実施の形態1による配線部材4A、4B、5A、5Bの変形例について説明する。実施の形態2による半導体モジュールの回路構成は、上記実施の形態1と同様であるので説明を省略する(図1参照)。実施の形態2による配線部材は、Hブリッジ回路を内蔵した半導体モジュール1(図2参照)の他、ブリッジ回路1相分を内蔵した半導体モジュール、あるいはその他の回路構成及び部品構成の半導体モジュールに用いることができる。
Claims (11)
- 少なくとも第1導電部と第2導電部とを電気的に接続する配線部材であって、
前記第1導電部に接続される第1接続部と、
前記第2導電部に接続される第2接続部と、
前記第1接続部と前記第2接続部の間に配置された上面部と、
前記上面部と前記第1接続部の間、及び前記上面部と前記第2接続部の間にそれぞれ配置された脚部とを含み、
前記第1接続部、前記第2接続部、前記上面部、及び前記脚部は一体に形成され、
前記上面部は、突起部及び凹部のいずれか一方または両方を有することを特徴とする配線部材。 - 前記上面部は、前記第1接続部の前記第1導電部との接続面、及び前記第2接続部の前記第2導電部との接続面に対して、反対側の方向に突出していることを特徴とする請求項1記載の配線部材。
- 前記上面部は、前記第1接続部及び前記第2接続部と平行に設けられていることを特徴とする請求項1または請求項2に記載の配線部材。
- 前記第1接続部、前記第2接続部、及び前記上面部は、それぞれ異なる高さ位置であることを特徴とする請求項1から請求項3のいずれか一項に記載の配線部材。
- 前記突起部及び前記凹部のいずれか一方または両方は、前記上面部の両側面に対称に設けられていることを特徴とする請求項1から請求項4のいずれか一項に記載の配線部材。
- 前記突起部及び前記凹部のいずれか一方または両方は、前記上面部の両側面に非対称に設けられていることを特徴とする請求項1から請求項4のいずれか一項に記載の配線部材。
- 前記第1接続部は、前記第1導電部との接続面に対して垂直な方向に形成された貫通穴を有することを特徴とする請求項1から請求項6のいずれか一項に記載の配線部材。
- 前記第2接続部は、前記第2導電部との接続面に対して垂直な方向に形成された貫通穴を有することを特徴とする請求項1から請求項7のいずれか一項に記載の配線部材。
- 前記突起部は、前記上面部と一体に形成されていることを特徴とする請求項1から請求項8のいずれか一項に記載の配線部材。
- 前記第1接続部または前記第2接続部は、角部に切り欠きが形成されていることを特徴とする請求項1から請求項9のいずれか一項に記載の配線部材。
- 請求項1から請求項10のいずれか一項に記載の配線部材と、複数の半導体素子と、前記半導体素子が装着される金属製のプレートとを備え、前記第1導電部は前記半導体素子であり、前記第2導電部は前記プレートであることを特徴とする半導体モジュール。
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