WO2019151434A1 - 部材接続方法及び接着テープ - Google Patents

部材接続方法及び接着テープ Download PDF

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Publication number
WO2019151434A1
WO2019151434A1 PCT/JP2019/003475 JP2019003475W WO2019151434A1 WO 2019151434 A1 WO2019151434 A1 WO 2019151434A1 JP 2019003475 W JP2019003475 W JP 2019003475W WO 2019151434 A1 WO2019151434 A1 WO 2019151434A1
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Prior art keywords
adhesive layer
adhesive tape
adhesive
cutting
segment
Prior art date
Application number
PCT/JP2019/003475
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English (en)
French (fr)
Inventor
哲之 白川
Original Assignee
日立化成株式会社
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Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to KR1020207024278A priority Critical patent/KR102678136B1/ko
Priority to CN201980009922.XA priority patent/CN111655810B/zh
Priority to JP2019569576A priority patent/JP7173055B2/ja
Priority to US16/965,774 priority patent/US11342303B2/en
Publication of WO2019151434A1 publication Critical patent/WO2019151434A1/ja

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29363—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/29369—Platinum [Pt] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29363—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/29384—Tungsten [W] as principal constituent
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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    • H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the present disclosure relates to a member connection method and an adhesive tape.
  • an adhesive tape having uses such as connection of members to be connected having a large number of electrodes and fixation of a lead frame.
  • an adhesive tape for example, an anisotropic conductive tape (ACF: Anisotropic Conductive Film) can be cited (see, for example, Patent Document 1).
  • Anisotropic conductive tape maintains the conductive state between opposing electrodes when connecting a member such as a semiconductor element such as an IC or LSI or a package to a substrate such as a printed wiring board, an LCD glass substrate, or a flexible printed circuit board.
  • it is a connection material that achieves both electrical connection and mechanical fixation so as to maintain an insulating state between adjacent electrodes.
  • Such adhesive tapes are also used for bonding between electronic components such as liquid crystal panels, PDPs (Plasma Display Panels), EL (Electroluminescence) panels, bare chip mounting, etc., and circuit boards, and bonding between circuit boards.
  • the conventional method described above has a problem that the degree of freedom of the shape of the adhesive layer disposed on the connected member is poor because the adhesive tape is half-cut in the attaching step. In addition, there is a problem that the accuracy of alignment of the adhesive layer with respect to the connected member is required at the time of pasting.
  • the present disclosure has been made in order to solve the above-described problem, and can reduce the requirement for accuracy of alignment of the adhesive layer with respect to the connected member, and can arrange the adhesive layer in an arbitrary shape with respect to the connected member. It is an object to provide a connection method and an adhesive tape applied to such a method.
  • a member connection method is a member connection method for connecting members to be connected to each other using an adhesive tape provided with an adhesive layer on one side of a separator, and at least the adhesive tape with respect to the adhesive layer
  • the heating and pressing tool having an arbitrary pattern shape is pressed against the adhesive tape from the separator side, and the adhesive layer segment corresponding to the pressing portion of the heating and pressing tool is selectively set to one.
  • the segments of the adhesive layer are previously connected in the longitudinal direction of the adhesive tape by the cutting line formed in the adhesive layer in the cutting step.
  • the segment of the adhesive layer is selectively transferred to one connected member using a heating and pressing tool.
  • the pattern shape of the segment of the adhesive layer transferred in the transfer process can be arbitrarily adjusted by the pattern shape of the heating and pressing tool. Therefore, the adhesive layer can be arranged in any shape with respect to the connected member. Further, in this member connecting method, since the segments of the adhesive layer are previously continuous in the longitudinal direction of the adhesive tape, strict alignment between one connected member and the adhesive layer is not required in the transfer process.
  • cutting lines are formed at predetermined intervals in the width direction and the longitudinal direction of the adhesive tape with respect to the adhesive layer, and the segments of the adhesive layer divided by the cutting lines are formed in the width direction and the longitudinal direction of the adhesive tape. It may be continuous. In this case, since the segment of the adhesive layer is formed two-dimensionally, the degree of freedom of arrangement of the adhesive layer with respect to the connected member can be improved.
  • the wound tape may be formed by winding the adhesive tape from the original fabric and forming a cutting line on the adhesive layer, and then winding the adhesive tape.
  • the cutting process and the transfer process are separated, it is possible to avoid an increase in size and complexity of the apparatus at the site where the transfer process is performed.
  • the adhesive layer may be provided on the entire surface of one side of the separator. In this case, it is possible to further ease the requirement for alignment accuracy between the one connected member and the adhesive layer in the transfer process.
  • the adhesive tape according to one aspect of the present invention is an adhesive tape in which an adhesive layer is provided on one side of the separator, and cutting lines are formed at predetermined intervals at least in the width direction of the adhesive tape with respect to the adhesive layer.
  • the segment of the adhesive layer divided by the cutting line is continuous at least in the longitudinal direction of the adhesive tape.
  • the segments of the adhesive layer are continuous in the longitudinal direction of the adhesive tape by the cutting line formed in the adhesive layer.
  • the segment of the adhesive layer can be selectively transferred to one connected member using a heating and pressing tool.
  • the pattern shape of the segment of the adhesive layer transferred to one connected member can be arbitrarily adjusted by the pattern shape of the heating and pressing tool. Therefore, the adhesive layer can be arranged in any shape with respect to the connected member. Further, in this adhesive tape, since the segments of the adhesive layer are previously continuous in the longitudinal direction of the adhesive tape, strict alignment between one connected member and the adhesive layer is not required at the time of transfer.
  • the present disclosure it is possible to relax the requirement of the alignment accuracy of the adhesive layer with respect to the connected member, and it is possible to arrange the adhesive layer in an arbitrary shape with respect to the connected member.
  • FIG. 7 is a schematic cross-sectional view showing a step subsequent to FIG. 6.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive tape.
  • FIG. 2 is a schematic plan view showing an adhesive layer of the adhesive tape shown in FIG.
  • the adhesive tape 1 has a two-layer structure including a separator 2 and an adhesive layer 3 formed on the entire surface of the separator 2 on the one surface 2a side.
  • the adhesive tape 1 is, for example, an anisotropic conductive tape used for connecting the connected members 11A and 11B (see FIG. 5) having a large number of electrodes.
  • the length of the adhesive tape 1 is, for example, 10 m or more and 1000 m or less. In this embodiment, it is 300 m, for example, and is preserve
  • the width of the adhesive tape 1 is, for example, not less than 0.5 mm and not more than 25.0 mm, preferably not less than 0.5 mm and not more than 3.0 mm, and more preferably not less than 0.5 mm and not more than 2.0 mm.
  • the thickness of the adhesive tape 1 is, for example, 5 ⁇ m to 250 ⁇ m, preferably 10 ⁇ m to 40 ⁇ m, and more preferably 10 ⁇ m to 20 ⁇ m.
  • stretched polypropylene OPP
  • PET polyethylene terephthalate
  • PET polyethylene naphthalate
  • polyethylene isophthalate polybutylene terephthalate
  • polyolefin Polyacetate polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, and the like can be used.
  • the other surface 2b side of the separator 2 may be subjected to a mold release process.
  • the release agent for performing the release treatment for example, low melting point wax such as olefin release agent, ethylene glycol montanate ester, carnauba wax, petroleum wax, low molecular weight fluororesin, silicone type or fluorine type surfactant, Silicone resins such as oil, wax, resin, and polyester-modified silicone resin can be used.
  • the mold release agent a silicone resin is generally used.
  • an adhesive containing a resin such as a thermoplastic resin, a thermosetting resin, or a mixed system (mixed resin) of a thermoplastic resin and a thermosetting resin can be used.
  • a resin such as a thermoplastic resin, a thermosetting resin, or a mixed system (mixed resin) of a thermoplastic resin and a thermosetting resin
  • Representative thermoplastic resins include, for example, styrene resin and polyester resin.
  • Typical thermosetting resins include, for example, epoxy resin systems, acrylic resin systems, and silicone resin systems.
  • the adhesive layer 3 can include an adhesive component and conductive particles contained as necessary.
  • the adhesive component for example, a material showing curability by heat or light can be widely applied, and since it is excellent in heat resistance and moisture resistance after connection, it is preferable to use a crosslinkable material.
  • An epoxy adhesive containing an epoxy resin, which is a thermosetting resin, as a main component can be cured for a short time, has good connection workability, and is excellent in adhesion due to its molecular structure.
  • the epoxy adhesive for example, a high molecular weight epoxy, a solid epoxy or a liquid epoxy, or an epoxy whose main component is an epoxy modified with urethane, polyester, acrylic rubber, nitrile rubber (NBR), synthetic linear polyamide or the like is used. Can be used.
  • the epoxy adhesive is generally obtained by adding a curing agent, a catalyst, a coupling agent, a filler, or the like to the above-mentioned epoxy which is a main component.
  • the conductive particles include metal such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, or carbon particles. Further, coated particles in which non-conductive glass, ceramic, plastic, or the like is used as a core and the core is coated with the above metal or carbon may be used.
  • the average particle diameter of the conductive particles is preferably 1 ⁇ m or more and 18 ⁇ m or less from the viewpoint of dispersibility and conductivity. Insulating coating particles formed by coating conductive particles with an insulating layer may be used, and conductive particles and insulating particles may be used in combination from the viewpoint of improving the insulation between adjacent electrodes.
  • cutting lines C are formed in the adhesive layer 3 at predetermined intervals in the width direction and the longitudinal direction of the adhesive tape 1.
  • the cutting line C is formed so as to reach the one surface 2a of the separator 2 from the adhesive layer 3 side (see FIG. 1).
  • the segments 4 separated by these cutting lines C are continuous in the width direction and the longitudinal direction of the adhesive tape 1.
  • linear cutting lines C are formed at intervals of 0.5 mm in the width direction and the longitudinal direction of the adhesive tape 1.
  • This member connection method includes a cutting step of forming a cutting line C in the adhesive layer 3 of the adhesive tape 1, a transfer step of transferring the adhesive layer 3 to one connected member 11 ⁇ / b> A, and a transfer target through the transferred adhesive layer 3.
  • a transport device 12 that transports the adhesive tape 1 at a constant speed and a cutting device 13 that forms a cutting line on the adhesive tape 1 transported by the transport device 12 are used.
  • the transport device 12 includes a feeding roller 12A that feeds the adhesive tape 1 from the original fabric 14, and a winding roller 12B that winds the adhesive tape 1 fed from the original fabric 14.
  • the cutting device 13 includes a first cutting device 13A that forms cutting lines C in the adhesive layer 3 at a predetermined interval in the width direction of the adhesive tape 1, and an adhesive layer 3 at a predetermined interval in the longitudinal direction of the adhesive tape 1.
  • a second cutting device 13B for forming a cutting line C. Any of the first cutting device 13A and the second cutting device 13B may be arranged on the upstream side in the transport direction.
  • the adhesive tape 1 fed out from the raw roll 14 of the feed roller 12A passes through the first cutting device 13A and the second cutting device 13B in the process of being conveyed toward the winding roller 12B.
  • cutting lines C are formed at predetermined intervals in the width direction and the longitudinal direction of the adhesive tape 1 with respect to the adhesive layer 3, and the segments 4 of the adhesive layer 3 divided by the cutting lines C are formed in the width direction of the adhesive tape 1. And it will be in the state which continued in the longitudinal direction (refer FIG. 2).
  • the adhesive tape 1 is wound up by the winding roller 12 ⁇ / b> B and becomes a wound body 15.
  • the adhesive tape 1 is preserve
  • the slit processing apparatus is arrange
  • the adhesive tape 1 is disposed on one connected member 11A so that the segment 4 of the adhesive layer 3 faces the connecting surface 11a of the one connected member 11A.
  • the adhesive tape 1 may be used by being pulled out from the wound body 15 or may be used by cutting a portion pulled out from the wound body 15.
  • a heating and pressing tool 16 is used.
  • the heating and pressing tool 16 is formed of, for example, stainless steel, ceramic, or the like, and has an arbitrary pattern shape on the heating and pressing surface 16a side.
  • the heating and pressing surface 16a of the heating and pressing tool 16 is pressed against the adhesive tape 1 from the separator 2 side, and the adhesive layer 3 is connected to the connecting surface 11a of one connected member 11A. Adhere to. Accordingly, as shown in FIG. 4B, only the segment 4 of the adhesive layer 3 corresponding to the pressing portion of the heating and pressing tool 16 is selectively transferred to the connection surface 11a of the one connected member 11A. .
  • the pressure by the heating and pressing tool 16 is, for example, about 0.5 MPa to 5 MPa, and the temperature by the heating and pressing tool 16 is about 25 ° C. to 90 ° C.
  • the segment 4 of the adhesive layer 3 is continuously provided in the longitudinal direction of the adhesive tape 1 by the cutting line C formed in the adhesive layer 3 in the cutting process.
  • the segment 4 of the adhesive layer 3 is selectively transferred to one connected member 11 ⁇ / b> A using the heating and pressing tool 16.
  • the pattern shape of the segment 4 of the adhesive layer 3 transferred in the transfer process can be arbitrarily adjusted by the pattern shape of the heating and pressing tool 16. Therefore, the adhesive layer 3 can be arranged in an arbitrary shape with respect to the one connected member 11A.
  • the cutting line C is formed at predetermined intervals in the width direction and the longitudinal direction of the adhesive tape 1 with respect to the adhesive layer 3 in the cutting step, and the segment of the adhesive layer 3 divided by the cutting line C. 4 is continued in the width direction and the longitudinal direction of the adhesive tape 1.
  • the adhesive tape 1 in the cutting step, the adhesive tape 1 is unwound from the original fabric 14, the cutting line C is formed on the adhesive layer 3, and then the adhesive tape 1 is wound to form the wound body 15.
  • the cutting process and the transfer process are separated, it is possible to avoid an increase in size and complexity of the apparatus at the site where the transfer process is performed.
  • the adhesive layer 3 is provided on the entire surface of the separator 2 on the one surface 2a side.
  • the cutting lines C are formed in the adhesive layer 3 at predetermined intervals in the width direction and the longitudinal direction of the adhesive tape 1, but the cutting lines C may be formed only in the width direction of the adhesive tape 1.
  • the linear cutting line C was illustrated in the said embodiment, the cutting line C is not restricted to a linear shape, Other forms, such as curved shape, meandering line shape, zigzag shape, may be sufficient.
  • the interval between the cutting lines C is not limited to a fixed value, and may vary with periodicity, for example.
  • the interval between the cutting lines C may be different between the width direction and the longitudinal direction of the adhesive tape 1.
  • the shape of the segment 4 of the adhesive layer 3 is square, but may be other shapes such as a rectangle, a rhombus, a triangle, a polygon, a circle, and an ellipse.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

この部材接続方法は、接着層３に対して少なくとも接着テープ１の幅方向に所定の間隔で切断線Ｃを形成し、切断線Ｃによって区分された接着層３のセグメント４を少なくとも接着テープ１の長手方向に連続させる切断工程と、セグメント４が一の被接続部材１１Ａの接続面１１ａと対向するように配置し、任意のパターン形状を有する加熱加圧ツール１６をセパレータ２側から接着テープ１に押し当て、セグメント４を選択的に一の被接続部材１１Ａに転写する転写工程と、一の被接続部材１１Ａに転写されたセグメント４を介して一の被接続部材１１Ａに他の被接続部材１１Ｂを接続する接続工程と、を備える。

Description

部材接続方法及び接着テープ
　本開示は、部材接続方法及び接着テープに関する。
　従来、多数の電極を有する被接続部材同士の接続、リードフレームの固定などの用途を有する接着テープが知られている。このような接着テープとしては、例えば異方導電性テープ（ＡＣＦ：Anisotropic Conductive Film）が挙げられる（例えば特許文献１参照）。異方導電テープは、例えばプリント配線基板、ＬＣＤ用ガラス基板、フレキシブルプリント基板等の基板に、ＩＣ、ＬＳＩ等の半導体素子やパッケージなどの部材を接続する際、相対する電極同士の導通状態を保つ一方で、隣接する電極同士の絶縁状態を保つように電気的接続と機械的固着とを両立させる接続材料である。このような接着テープは、液晶パネル、ＰＤＰ（Plasma Display Panel）、ＥＬ（Electroluminescence）パネル、ベアチップ実装などの電子部品と回路基板との接着や、回路基板同士の接着等にも用いられている。
　接着テープを用いた一般的な部材接続方法では、接着層３を被接続部材１１１に貼り付ける貼付工程において、まず、図６（ａ）に示すように、接着テープ１０１の先端側の接着層１０３をハーフカットする。ここでは、接着テープ１０１のセパレータ１０２に刃痕が残る程度に接着層１０３に刃Ｂを入れる。次に、図６（ｂ）に示すように、ハーフカットした位置よりも先端側の接着層１０３に対し、セパレータ１０２側からヒートツール１１６を押し当てる。これにより、図７（ａ）に示すように、ハーフカットした位置よりも先端側の接着層１０３３がセパレータ１０２から剥離し、図７（ｂ）に示すように、被接続部材１１１への接着層１０３の貼り付けがなされる。
特開２００１－２８４００５号公報
　上述した従来の手法では、貼付工程において接着テープに対するハーフカットを行っているため、被接続部材に配置される接着層の形状の自由度が乏しいという問題があった。また、貼り付けの際に被接続部材に対する接着層のアライメントの精度が要求されるという問題もあった。
　本開示は、上記課題の解決のためになされたものであり、被接続部材に対する接着層のアライメントの精度の要求を緩和でき、かつ被接続部材に対して任意の形状で接着層を配置できる部材接続方法、及びこのような方法に適用される接着テープを提供することを目的とする。
　本開示の一側面に係る部材接続方法は、セパレータの一面側に接着層が設けられた接着テープを用いて被接続部材同士を接続する部材接続方法であって、接着層に対して少なくとも接着テープの幅方向に所定の間隔で切断線を形成し、切断線によって区分された接着層のセグメントを少なくとも接着テープの長手方向に連続させる切断工程と、接着層のセグメントが一の被接続部材の接続面と対向するように配置し、任意のパターン形状を有する加熱加圧ツールをセパレータ側から接着テープに押し当て、加熱加圧ツールの押当部分に対応する接着層のセグメントを選択的に一の被接続部材に転写する転写工程と、一の被接続部材に転写された接着層のセグメントを介して一の被接続部材に他の被接続部材を接続する接続工程と、を備える。
　この部材接続方法では、切断工程において接着層に形成した切断線により、接着層のセグメントを予め接着テープの長手方向に連続させる。そして、転写工程では、加熱加圧ツールを用いて接着層のセグメントを選択的に一の被接続部材に転写する。転写工程で転写される接着層のセグメントのパターン形状は、加熱加圧ツールのパターン形状によって任意に調整できる。したがって、被接続部材に対して任意の形状で接着層を配置できる。また、この部材接続方法では、接着層のセグメントが予め接着テープの長手方向に連続しているため、転写工程において一の被接続部材と接着層との厳密なアライメントが要求されることもない。
　また、切断工程において、接着層に対して接着テープの幅方向及び長手方向に所定の間隔で切断線を形成し、切断線によって区分された接着層のセグメントを接着テープの幅方向及び長手方向に連続させてもよい。この場合、接着層のセグメントが二次元的に形成されるため、被接続部材に対する接着層の配置の自由度を向上できる。
　また、切断工程において、接着テープを原反から繰り出し、接着層に切断線を形成した後、接着テープを巻き回して巻回体を形成してもよい。この場合、切断工程と転写工程とが分離されるので、転写工程を行う現場での装置の大型化・複雑化を回避できる。
　また、接着層は、セパレータの一面側の全面に設けられていてもよい。この場合、転写工程において一の被接続部材と接着層との間のアライメントの精度の要求を一層緩和できる。
　また、本発明の一側面に係る接着テープは、セパレータの一面側に接着層が設けられた接着テープであって、接着層に対して少なくとも接着テープの幅方向に所定の間隔で切断線が形成され、切断線によって区分された接着層のセグメントが少なくとも接着テープの長手方向に連続している。
　この接着テープでは、接着層に形成した切断線により、接着層のセグメントが接着テープの長手方向に連続している。この接着テープでは、加熱加圧ツールを用いて接着層のセグメントを選択的に一の被接続部材に転写することができる。一の被接続部材に転写される接着層のセグメントのパターン形状は、加熱加圧ツールのパターン形状によって任意に調整できる。したがって、被接続部材に対して任意の形状で接着層を配置できる。また、この接着テープでは、接着層のセグメントが予め接着テープの長手方向に連続しているため、転写の際に一の被接続部材と接着層との厳密なアライメントが要求されることもない。
　本開示によれば、被接続部材に対する接着層のアライメントの精度の要求を緩和でき、かつ被接続部材に対して任意の形状で接着層を配置できる。
接着テープの一実施形態を示す模式的な断面図である。 図１に示した接着テープの接着層を示す模式的な平面図である。 切断工程の一例を示す模式図である。 転写工程の一例を示す模式的な断面図である。 接続工程の一例を示す模式的な断面図である。 接着テープを用いた一般的な部材接続方法を示す模式的な断面図である。 図６の後続の工程を示す模式的な断面図である。
　以下、図面を参照しながら、本開示の一側面に係る部材接続方法及び接着テープの好適な実施形態について詳細に説明する。
［接着テープの構成］
　図１は、接着テープの一実施形態を示す模式的な断面図である。また、図２は、図１に示した接着テープの接着層を示す模式的な平面図である。同図に示すように、接着テープ１は、セパレータ２と、セパレータ２の一面２ａ側の全面に形成された接着層３とによる二層構造をなしている。接着テープ１は、例えば多数の電極を有する被接続部材１１Ａ，１１Ｂ（図５参照）同士の接続に用いられる異方導電性テープである。
　接着テープ１の長さは、例えば１０ｍ以上１０００ｍ以下となっている。本実施形態では、例えば３００ｍであり、巻回体の状態で保存及び搬送される。接着テープ１の幅は、例えば０．５ｍｍ以上２５．０ｍｍ以下となっており、０．５ｍｍ以上３．０ｍｍ以下であることが好ましく、０．５ｍｍ以上２．０ｍｍ以下であることが更に好ましい。接着テープ１の厚さは、例えば５μｍ以上２５０μｍ以下となっており、１０μｍ以上４０μｍ以下であることが好ましく、１０μｍ以上２０μｍ以下であることが更に好ましい。
　セパレータ２の材料としては、接着テープ１の強度及び接着層３の剥離性の観点から、例えば、延伸ポリプロピレン（ＯＰＰ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート、ポリエチレンイソフタレート、ポリブチレンテレフタレート、ポリオレフィン、ポリアセテート、ポリカーボネート、ポリフェニレンサルファイド、ポリアミド、エチレン・酢酸ビニル共重合体、ポリ塩化ビニル、ポリ塩化ビニリデン、合成ゴム系、液晶ポリマー等を用いることができる。
　セパレータ２の他面２ｂ側には、離型処理が施されていてもよい。離型処理を行う離型剤としては、例えばオレフィン系離型剤、エチレングリコールモンタン酸エステル、カルナウバロウ、石油系ワックス等の低融点ワックス、低分子量フッ素樹脂、シリコーン系又はフッ素系の界面活性剤、オイル、ワックス、レジン、ポリエステル変性シリコーン樹脂等のシリコーン樹脂などを用いることができる。離型剤としては、一般的には、シリコーン樹脂が用いられる。
　接着層３の材料としては、例えば熱可塑性樹脂、熱硬化性樹脂、或いは熱可塑性樹脂と熱硬化性樹脂との混合系（混合樹脂）等の樹脂を含む接着剤を用いることができる。代表的な熱可塑性樹脂としては、例えばスチレン樹脂系、ポリエステル樹脂系が挙げられる。代表的な熱硬化性樹脂としては、例えばエポキシ樹脂系、アクリル樹脂系、シリコーン樹脂系が挙げられる。
　接着テープ１が異方導電性テープである場合、接着層３は、接着剤成分と、必要により含有される導電粒子とを含んで構成され得る。接着剤成分としては、例えば、熱や光により硬化性を示す材料を広く適用でき、接続後の耐熱性や耐湿性に優れていることから、架橋性材料を使用することが好ましい。熱硬化性樹脂であるエポキシ樹脂を主成分として含有するエポキシ系接着剤は、短時間硬化が可能で接続作業性がよく、分子構造上接着性に優れている。エポキシ系接着剤としては、例えば高分子量エポキシ、固形エポキシ又は液状エポキシ、或いはこれらをウレタン、ポリエステル、アクリルゴム、ニトリルゴム（ＮＢＲ）、合成線状ポリアミド等で変性したエポキシを主成分とするものを用いることができる。エポキシ系接着剤は、主成分をなす上記エポキシに硬化剤、触媒、カップリング剤、充填剤等を添加してなるものが一般的である。
　導電粒子としては、例えばＡｕ、Ａｇ、Ｐｔ、Ｎｉ、Ｃｕ、Ｗ、Ｓｂ、Ｓｎ、はんだ等の金属、或いはカーボンの粒子が挙げられる。また、非導電性のガラス、セラミック、プラスチック等を核とし、この核を上記の金属やカーボンで被覆した被覆粒子を使用してもよい。導電粒子の平均粒径は、分散性、導電性の観点から例えば１μｍ以上１８μｍ以下であることが好ましい。導電粒子を絶縁層で被覆してなる絶縁被覆粒子を使用してもよく、隣接する電極同士の絶縁性を向上させる観点から導電粒子と絶縁性粒子とを併用してもよい。
　接着層３には、図２に示すように、接着テープ１の幅方向及び長手方向に所定の間隔で切断線Ｃが形成されている。切断線Ｃは、接着層３側からセパレータ２の一面２ａに到達するように形成されている（図１参照）。接着層３には、これらの切断線Ｃによって区分されたセグメント４が接着テープ１の幅方向及び長手方向に連続した状態となっている。本実施形態では、接着テープ１の幅方向及び長手方向にそれぞれ０．５ｍｍ間隔で直線状の切断線Ｃが形成されている。これにより、接着層３には、一辺が０．５ｍｍの略正方形状のセグメント４がセパレータ２の一面２ａの全面にわたってマトリクス状に配列されている。
［部材接続方法］
　次に、上述した接着テープ１を用いた部材接続方法について説明する。
　この部材接続方法を適用する被接続部材１１Ａ，１１Ｂに特に制限はなく、任意の電子部品用の部材に適用可能である。ここでは、多数の電極を有する被接続部材１１Ａ，１１Ｂ同士の接続を例示する。この部材接続方法は、接着テープ１の接着層３に切断線Ｃを形成する切断工程と、接着層３を一の被接続部材１１Ａに転写する転写工程と、転写した接着層３を介して被接続部材１１Ａ，１１Ｂ同士を接続する接続工程とを備えている。
　切断工程では、例えば図３に示すように、接着テープ１を一定速度で搬送する搬送装置１２と、搬送装置１２によって搬送される接着テープ１に切断線を形成する切断装置１３とを用いる。搬送装置１２は、原反１４から接着テープ１を繰り出す繰出ローラ１２Ａと、原反１４から繰り出された接着テープ１を巻き回す巻回ローラ１２Ｂとを備えている。また、切断装置１３は、接着テープ１の幅方向に所定の間隔で接着層３に切断線Ｃを形成する第１の切断装置１３Ａと、接着テープ１の長手方向に所定の間隔で接着層３に切断線Ｃを形成する第２の切断装置１３Ｂとを有している。第１の切断装置１３Ａ及び第２の切断装置１３Ｂは、いずれが搬送方向の上流側に配置されていてもよい。
　繰出ローラ１２Ａの原反１４から繰り出された接着テープ１は、巻回ローラ１２Ｂに向かって搬送される過程で第１の切断装置１３Ａ及び第２の切断装置１３Ｂを通過する。これにより、接着層３に対して接着テープ１の幅方向及び長手方向に所定の間隔で切断線Ｃが形成され、切断線Ｃによって区分された接着層３のセグメント４が接着テープ１の幅方向及び長手方向に連続した状態となる（図２参照）。切断線Ｃの形成後、接着テープ１は、巻回ローラ１２Ｂによって巻き取られ、巻回体１５となる。接着テープ１は、巻回体１５の状態で保存され、転写工程の実施現場に搬送される。
　なお、第１の切断装置１３Ａ及び第２の切断装置１３Ｂの後段側にスリット加工装置を配置し、スリット加工装置で幅細に加工した複数条の接着テープ１を複数の巻回ローラ１２Ｂでそれぞれ巻き回すようにしてもよい。
　転写工程では、例えば図４に示すように、接着層３のセグメント４が一の被接続部材１１Ａの接続面１１ａと対向するように接着テープ１を一の被接続部材１１Ａに対して配置する。接着テープ１は、巻回体１５から引き出して用いてもよく、巻回体１５から引き出した部分を切断して用いてもよい。また、転写工程では、加熱加圧ツール１６を用いる。加熱加圧ツール１６は、例えばステンレス鋼、セラミック等によって形成され、加熱加圧面１６ａ側に任意のパターン形状を有している。
　転写工程では、図４（ａ）に示すように、加熱加圧ツール１６の加熱加圧面１６ａをセパレータ２側から接着テープ１に押し当て、接着層３を一の被接続部材１１Ａの接続面１１ａに密着させる。これにより、図４（ｂ）に示すように、加熱加圧ツール１６の押当部分に対応する接着層３のセグメント４のみが選択的に一の被接続部材１１Ａの接続面１１ａに転写される。加熱加圧ツール１６による圧力は、例えば０．５ＭＰａ～５ＭＰａ程度であり、加熱加圧ツール１６による温度は、２５℃～９０℃程度である。
　接続工程では、例えば図５に示すように、接着層３のセグメント４が選択的に転写された一の被接続部材１１Ａに他の被接続部材１１Ｂを接続する。これにより、接着層３のセグメント４を介して一の被接続部材１１Ａに他の被接続部材１１Ｂを接続した接続構造体１７が得られる。
［作用効果］
　以上説明したように、この部材接続方法では、切断工程において接着層３に形成した切断線Ｃにより、接着層３のセグメント４を予め接着テープ１の長手方向に連続させる。そして、転写工程では、加熱加圧ツール１６を用いて接着層３のセグメント４を選択的に一の被接続部材１１Ａに転写する。転写工程で転写される接着層３のセグメント４のパターン形状は、加熱加圧ツール１６のパターン形状によって任意に調整できる。したがって、一の被接続部材１１Ａに対して任意の形状で接着層３を配置できる。また、この部材接続方法では、接着層３のセグメント４が予め接着テープ１の長手方向に連続しているため、貼付工程において接着層のハーフカットを実施する手法（図６及び図７参照）に比べて、転写工程において一の被接続部材１１Ａと接着層３との厳密なアライメントが要求されることもない。
　また、本実施形態では、切断工程において、接着層３に対して接着テープ１の幅方向及び長手方向に所定の間隔で切断線Ｃを形成し、切断線Ｃによって区分された接着層３のセグメント４を接着テープ１の幅方向及び長手方向に連続させている。これにより、接着層３のセグメント４が二次元的に形成されるため、一の被接続部材１１Ａに対する接着層３の配置の自由度を向上できる。
　また、本実施形態では、切断工程において、接着テープ１を原反１４から繰り出し、接着層３に切断線Ｃを形成した後、接着テープ１を巻き回して巻回体１５を形成している。この場合、切断工程と転写工程とが分離されるので、転写工程を行う現場での装置の大型化・複雑化を回避できる。
　また、本実施形態では、接着層３がセパレータ２の一面２ａ側の全面に設けられている。これにより、転写工程において一の被接続部材１１Ａと接着層３との間のアライメントの精度の要求を一層緩和できる。
［変形例］
　本発明は、上記実施形態に限られるものではない。例えば上記実施形態では、接着テープ１の幅方向及び長手方向に所定の間隔で接着層３に切断線Ｃを形成したが、切断線Ｃを接着テープ１の幅方向のみに形成してもよい。また、上記実施形態では、直線状の切断線Ｃを例示したが、切断線Ｃは、直線状に限られず、曲線状、蛇行線状、ジグザグ状などの他の態様であってもよい。切断線Ｃの間隔も一定に限られず、例えば周期性をもって変化していてもよい。切断線Ｃの間隔は、接着テープ１の幅方向と長手方向とで互いに異なっていてもよい。また、例えば上記実施形態では、接着層３のセグメント４の形状が正方形状となっているが、長方形、ひし形、三角形、多角形、円形、楕円形といった他の形状であってもよい。
　１…接着テープ、２…セパレータ、２ａ…一面、３…接着層、４…セグメント、１１Ａ，１１Ｂ…被接続部材、１１ａ…接続面、１４…原反、１５…巻回体、１６…加熱加圧ツール、Ｃ…切断線。

Claims (5)

  1. 　セパレータの一面側に接着層が設けられた接着テープを用いて被接続部材同士を接続する部材接続方法であって、
    　前記接着層に対して少なくとも前記接着テープの幅方向に所定の間隔で切断線を形成し、前記切断線によって区分された前記接着層のセグメントを少なくとも前記接着テープの長手方向に連続させる切断工程と、
    　前記接着層のセグメントが一の被接続部材の接続面と対向するように配置し、任意のパターン形状を有する加熱加圧ツールを前記セパレータ側から前記接着テープに押し当て、前記加熱加圧ツールの押当部分に対応する前記接着層のセグメントを選択的に前記一の被接続部材に転写する転写工程と、
    　前記一の被接続部材に転写された前記接着層のセグメントを介して前記一の被接続部材に他の被接続部材を接続する接続工程と、を備える部材接続方法。
  2. 　前記切断工程において、前記接着層に対して前記接着テープの幅方向及び長手方向に所定の間隔で前記切断線を形成し、前記切断線によって区分された前記接着層のセグメントを前記接着テープの幅方向及び長手方向に連続させる請求項１記載の部材接続方法。
  3. 　前記切断工程において、前記接着テープを原反から繰り出し、前記接着層に前記切断線を形成した後、前記接着テープを巻き回して巻回体を形成する請求項１又は２記載の部材接続方法。
  4. 　前記接着層は、前記セパレータの一面側の全面に設けられている請求項１～３のいずれか一項記載の部材接続方法。
  5. 　セパレータの一面側に接着層が設けられた接着テープであって、
    　前記接着層に対して少なくとも前記接着テープの幅方向に所定の間隔で切断線が形成され、前記切断線によって区分された前記接着層のセグメントが少なくとも前記接着テープの長手方向に連続している接着テープ。
PCT/JP2019/003475 2018-02-01 2019-01-31 部材接続方法及び接着テープ WO2019151434A1 (ja)

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
TW202335556A (zh) * 2022-01-20 2023-09-01 美商阿爾發金屬化工公司 使用層壓模組化預製件接合電組件及機械組件之方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665948U (ja) * 1979-10-22 1981-06-02
JPH09111196A (ja) * 1995-10-16 1997-04-28 Nitto Denko Corp 両面粘着材
JPH09137136A (ja) * 1995-11-14 1997-05-27 Nitto Denko Corp 両面接着テープ及びその加工方法
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2016003314A (ja) * 2014-06-19 2016-01-12 株式会社村田製作所 部品用粘着部材配設シート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4307889C2 (de) * 1993-03-12 1997-04-10 Axel Donat Verfahren zum automatischen Entgittern und Übertragen computergeschnittener Selbstklebefolien und Folie zur Durchführung des Verfahrens
JPH0820178A (ja) * 1994-07-08 1996-01-23 Lintec Corp 薄膜シート片の転写方法及び転写シート
JPH10140096A (ja) 1996-11-08 1998-05-26 Lintec Corp 転写マーキング用シート
JP4465788B2 (ja) 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
US20130115408A1 (en) * 2000-07-24 2013-05-09 High Voltage Graphics, Inc. Processes for precutting laminated flocked articles
JP3994809B2 (ja) * 2002-07-09 2007-10-24 株式会社日立ハイテクノロジーズ 電子回路部品の打ち抜き装置及びその供給リール交換方法
JP2004042943A (ja) * 2002-07-10 2004-02-12 Seed:Kk マーク転写具およびマーク転写テープ
JP2009260272A (ja) * 2008-03-25 2009-11-05 Panasonic Corp 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法
JP5537789B2 (ja) * 2008-10-01 2014-07-02 日東電工株式会社 レーザー加工用粘着シート及びレーザー加工方法
JP2010129700A (ja) * 2008-11-26 2010-06-10 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体装置の製造方法
US8829360B2 (en) * 2010-11-26 2014-09-09 Schlenk Metallfolien Gmbh & Co. Kg Connector for PV cells and method for its production
JP5681749B2 (ja) * 2013-05-02 2015-03-11 株式会社東芝 歪みセンサ、圧力センサ、血圧センサ及び構造物ヘルスモニタセンサ
JP5665948B1 (ja) * 2013-11-14 2015-02-04 株式会社フジクラ 携帯型電子機器の冷却構造
JP6365377B2 (ja) * 2015-03-31 2018-08-01 ブラザー工業株式会社 テープカセット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665948U (ja) * 1979-10-22 1981-06-02
JPH09111196A (ja) * 1995-10-16 1997-04-28 Nitto Denko Corp 両面粘着材
JPH09137136A (ja) * 1995-11-14 1997-05-27 Nitto Denko Corp 両面接着テープ及びその加工方法
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2016003314A (ja) * 2014-06-19 2016-01-12 株式会社村田製作所 部品用粘着部材配設シート

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