CN101233655B - 各向异性导电膜及其制造方法 - Google Patents

各向异性导电膜及其制造方法 Download PDF

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CN101233655B
CN101233655B CN2006800282694A CN200680028269A CN101233655B CN 101233655 B CN101233655 B CN 101233655B CN 2006800282694 A CN2006800282694 A CN 2006800282694A CN 200680028269 A CN200680028269 A CN 200680028269A CN 101233655 B CN101233655 B CN 101233655B
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anisotropic conductive
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conductive film
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CN101233655A (zh
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立泽贵
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Resonac Corp
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Hitachi Chemical Co Ltd
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Abstract

本发明涉及各向异性导电膜及其制造方法。各向异性导电膜是将支撑体(13)和各向异性导电性粘接剂层(14)叠层而成的各向异性导电膜(10)，在上述支撑体(13)的宽度方向的两端部具有未形成上述各向异性导电性粘接剂层(14)的区域(14′)。

Description

各向异性导电膜及其制造方法
技术领域
本发明涉及各向异性导电膜。更详细地说，涉及抑制了因粘接剂从在膜状支撑体上以膜状形成了异性导电性粘接剂而成的卷带体的侧端部渗出引起的阻滞的各向异性导电膜及其制造方法。
背景技术
作为用于连接具有相对的多个电极的被连接部件的连接材料，使用各向异性导电膜(以下，有时称为ACF)。ACF是在连接印制电路布线基板、LCD用玻璃衬底、柔性印制电路板等的基板，或者IC、LSI等半导体元件及组件等的被连接部件时，进行电连接和机械固定以保持相对的电极彼此的导通状态、保持邻接的电极彼此的绝缘的连接材料。
ACF包含含有热硬化性树脂的粘接剂成分和根据需要配合的导电性粒子，做成在PET(聚对苯二甲酸二乙醇酯)膜等支撑体(分离装置)上形成膜状，并呈同心圆状地卷绕在芯材上的卷轴形状的窄幅长尺寸带(卷带体)并已产品化。
然而，在做成卷轴形状的窄幅长尺寸的带中，在使用含有自由基-丙烯酸酯粘接剂之类的低粘度成分(单体等)的ACF的场合，有时低粘度成分从长尺寸带的宽度方向端部渗出到支撑体的外部。因此，粘接剂附着在用于保持长尺寸带的卷轴侧板上并与之结合，成为ACF在施工时引起阻滞的原因。
另外，在ACF的窄幅产品(例如，宽度为0.8mm以下)中，由于卷轴的卷崩坏，因支撑体的强度不足导致的伸长、断裂等，存在生产率降低的问题。再有，窄幅产品的场合，由于ACF的宽度值和厚度值相近，存在识别性差之类的问题。
发明内容
本发明就是鉴于上述问题而提出的，其目的在于提供一种ACF，可以抑制构成ACF的粘接成分向宽度方向的渗出，降低ACF在放出时的阻滞，并防止在窄幅产品场合因支撑体的强度不足导致的伸长、断裂以及提高厚度方向和宽度方向的辨认性。
为实现上述目的，根据本发明的第一实施方式提供的各向异性导电膜，是将支撑体和各向异性导电性粘接剂层叠层而成的各向异性导电膜，并在上述支撑体的宽度方向上具有未形成上述各向异性导电性粘接剂层的区域。
过去，作为ACF的制造方法，通常是在支撑体上将各向异性导电性粘接剂层形成宽度10～50cm左右后，暂时卷绕而制成卷筒体后，将该卷筒体开卷并用切割机的切刀等连续地裁断成宽度0.5～5mm的窄幅并再次卷绕的方法。因此，支撑体和各向异性导电性粘接剂层的宽度相同，在支撑体的一面的整个面上形成了各向异性导电性粘接剂层。
另一方面，本发明中，将支撑体的宽度做成比各向异性导电性粘接剂层的宽度更宽。这样，通过在支撑体的宽度方向两端部设置未形成各向异性导电性粘接剂层的区域，从而可抑制粘接剂成分超过支撑体的宽度而从宽度方向端部渗出。因此，可降低各向异性导电膜使用时的阻滞。
作为上述各向异性导电膜的一例，可提供一种各向异性导电膜，上述支撑体具有将具有与上述各向异性导电性粘接剂层的宽度相同宽度的第一支撑体层和具有宽度比上述各向异性导电性粘接剂层的宽度更宽的第二支撑体层叠层而成的构造。
这样，通过将支撑体做成第一支撑体层和第二支撑体层的叠层构造，可以有效利用上述各向异性导电膜的现有的制造方法，得到将支撑体的宽度做成比各向异性导电性粘接剂层的宽度更宽的各向异性导电膜。
另外，通过将支撑体做成叠层构造，由于可提高支撑体的强度，因而，可以防止在窄幅产品的情况下因支撑体的强度不足导致的伸长、断裂等。
本发明中，也可以做成位于上述支撑体的宽度方向的两端部的未形成上述各向异性导电性粘接剂层的区域的宽度互不相同。
例如，被连接对象的额缘部狭窄的场合，通过将各向异性导电性粘接剂14靠近支撑体的任一端侧形成，从而可提高各向异性导电膜的处理性能。
根据本发明的第二实施方式，提供一种各向异性导电膜的制造方法，该方法具有以下工序：将对第一支撑体层和各向异性导电性粘接剂层进行叠层的第一叠层体和具有将第二支撑体层和粘接上述第一支撑体层和第二支撑体层的粘接剂层进行叠层了的构造且宽度比上述各向异性导电性粘接剂层的宽度更宽的第二叠层体进行叠层以上述第一支撑体层与上述粘接剂层接触的方式进行叠层，并将上述第一支撑体层和第二支撑体层进行粘接。
在这种制造方法中，作为第一叠层体，由于可以使用支撑体与各向异性导电性粘接剂的宽度相同的现有各向异性导电膜，因而，可以有效利用现有的各向异性导电膜的制造方法。此外，第二叠层体除了所使用的粘接剂不同之外，也可以与第一叠层体同样地制造。通过将这样得到的第一叠层体和第二叠层体以第一支撑体和粘接剂层接触的方式叠层，并使第一支撑体层和第二支撑体层粘接，从而可以容易地制造本发明的各向异性导电膜。
作为上述各向异性导电膜的制造方法的一例，可提供具有以下工序的各向异性导电膜的制造方法，即：将上述第一叠层体的卷带体的卷筒体裁断成规定宽度的第一分切工序；将上述第二叠层体的卷带体的卷筒体裁断成宽度比上述第一叠层体的裁断宽度更宽的第二分切工序；将由上述第一分切工序裁断的第一叠层体和由上述第二分切工序裁断的第二叠层体进行叠层，通过卷绕在同一芯材上从而将上述第一支撑体层和第二支撑体层粘接的工序。
本发明的制造方法，通过分别从上述两种卷筒体中裁断规定宽度的第一叠层体和宽度比第一叠层体的裁断宽度更宽的第二叠层体，并将它们卷绕在同一芯材上，从而将第一支撑体层和第二支撑体层粘接。
这样，通过有效充分地利用通常进行的各向异性导电膜的制造方法(从卷筒体中裁断一定宽度的叠层体的工序和再卷绕工序)，则可抑制新的设备投资。
本发明的各向异性导电膜即使各向异性导电性粘接剂层的粘接剂成分从粘接剂层流出，由于在支撑体的宽度方向端部具有未形成各向异性导电性粘接剂层的区域，因而也可以减少粘接成分超过支撑体的宽度而从宽度方向端部的渗出量。因此，可以减少各向异性导电膜在使用时的阻滞。再有，由于可以提高支撑体的强度，因而可以防止支撑体的伸长、断裂，还可以提高厚度方向和宽度方向的识别性。
附图说明
图1是表示本发明的第一实施方式的各向异性导电膜的图，(a)是各向异性导电膜的外观立体图，(b)是各向异性导电膜的宽度方向剖视图。
图2是表示本发明的第二实施方式的各向异性导电膜的宽度方向剖视图。
图3是表示本发明的各向异性导电膜的使用例的图。
图4是表示本发明的各向异性导电膜的制造方法的概要图。
具体实施方式
以下，参照附图对本发明的各向异性导电膜进行说明。
对第一实施方式进行说明。
图1是表示本发明的第一实施方式的各向异性导电膜的图，(a)是各向异性导电膜的外观立体图，(b)是各向异性导电膜的宽度方向剖视图。
本实施方式的各向异性导电膜10是呈同心状地重合在具有卷轴侧板11的芯材12上形成卷带体(卷重体)，具有将支撑体13及各向异性导电性粘接剂层14叠层而成的结构。在支撑体13的宽度方向两端部形成有未形成各向异性导电性粘接剂层14的未形成区域14’。
各向异性导电性粘接剂层14在使用时予以加热、加压，通过流动、固化而连接作为被粘接部件的衬底等。使用前，就作为卷带体状的各向异性导电膜的各向异性导电性粘接剂层14而言，由于在卷绕工序时所加的压力或者因时效变化导致的尺寸变动等，有时形成各向异性导电性粘接剂层14的粘接剂的一部分在支撑体的宽度方向流动。其结果，有时粘接剂超过了支撑体的宽度而渗出到卷带体的侧面。因此，由于各向异性导电膜10粘贴在卷轴侧板11上或者重叠卷绕的各向异性导电膜10彼此通过渗出的粘接剂相互粘贴，因而，在将各向异性导电膜10从卷带体放出时而产生了阻滞(ブロツキング)。
本实施方式通过设置未形成区域14’，由于即使粘接剂成分流动也留在未形成区域14’，因而可以抑制超过支撑体13的宽度而从宽度方向端部渗出。因此，可以抑制因粘接剂成分的渗出导致的各向异性导电膜10在放出时的阻滞的发生。
此外，未形成区域14’的宽度，可根据支撑体14的总宽度以及构成各向异性导电性粘接剂层14的粘接剂的种类及厚度适当调整。
对第二实施方式进行说明。
图2是表示本发明的第二实施方式的各向异性导电膜的宽度方向剖视图。
就本实施方式的各向异性导电膜20而言，除了支撑体13具有将第一支撑体13-1和与之相比宽度更宽的第二支撑体13-2叠层而成的构造外，与上述第一实施方式相同。
这样，通过将支撑体13做成第一支撑体13-1和第二支撑体13-2的叠层构造，有效利用各向异性导电膜的一般制造方法，可得到使支撑体13的宽度比各向异性导电性粘接剂层14的宽度更宽的各向异性导电膜20。
另外，通过将支撑体13做成叠层构造，由于可以提高支撑体的强度，因而尤其是可以防止窄幅产品的场合因支撑体的强度不足导致的伸长、断裂。
此外，作为粘接第一支撑体层13-1和第二支撑体层13-2的方法有在第一支撑体层13-1和第二支撑体层13-2之间形成粘接层15的方法。
在第一支撑体层13-1和第二支撑体层13-2之间形成粘接层15的场合，粘接层15所使用的粘接剂与各向异性导电性粘接剂层14不同，在衬底等的连接时不必流动。因此，即使将粘接剂涂覆在第一支撑体层13-1的整个面上也不会渗出。
此外，就上述的实施方式的各向异性导电膜而言，虽然在支撑体13的两端部形成了相同宽度的未形成区域14’，但本发明并不限于此。图3表示在形成了彩色膜52的玻璃衬底上复制各向异性导电膜状态的剖视图。例如，如(a)所示，在作为被连接对象的玻璃衬底51的额缘部51-1较宽的场合，虽可以在支撑体13的两端部形成相同宽度的未形成区域，但如(b)所示，在额缘部51-1较窄的场合等，可以将各向异性导电性粘接剂层14靠支撑体13的任一端形成。
在本发明的各向异性导电膜中，作为支撑体可以使用以下各种膜，例如：一般市场上出售的脱型处理后的聚对苯二甲酸乙二酯膜，聚萘二甲酸乙二酯膜，聚间苯二甲酸乙二醇酯膜，聚对苯二甲酸丁二酯膜，聚烯烃系膜，聚乙酸酯膜，聚碳酸酯膜，聚苯硫膜，聚酰胺膜，乙烯-醋酸乙烯共聚物膜，聚氯乙烯膜，聚偏氯乙烯膜，合成橡胶系膜，液晶聚合物膜等。为了能较容易地除去设置于支撑体上的各向异性导电性粘接剂层，可以在支撑体表面上涂覆剥离处理剂。
支撑体的厚度虽无特别限定，但最好是4μm～200μm。另外，支撑体的宽度只要设定为比各向异性导电性粘接剂层的宽度宽即可，例如，最好是500μm～30mm。
作为支撑体，在做成第一支撑体层和第二支撑体层的叠层结构的场合，为了提高这些粘接面的粘接强度，可以对各自的与粘接剂层15接触的面进行各种处理。例如，可列举在粘接剂层15和各面之间形成底涂层，或者对支撑体层表面进行等离子处理，或者实施物理上做成粗面的处理。
作为各向异性导电性粘接剂可以广泛使用利用热或光显示硬化性的材料。由于连接后的耐热性及耐潮性良好，因而最好使用交联性材料。其中，环氧(树脂)系粘接剂由于可短时间硬化且连接作业好，分子构造方面粘接性优异等特征而为理想。环氧(树脂)系粘接剂通常以例如高分子量环氧、固体环氧和液状环氧、氨基甲酸乙酯和聚酯、丙烯酸酯橡胶、NBR、尼龙等改性了的环氧为主要成分，并添加硬化剂及偶合剂、填充剂等构成。作为用作连接部件的导电材料的导电粒子，有Au、Ag、Pt、Ni、Cu、W、Sb、Sn、软钎料等金属粒子及碳等，另外也可以是在将这些导电粒子作为核材，或者在由非导电性玻璃、陶瓷、塑料等的高分子等构成的核材上包覆由如上所述的材质构成的导电层形成的粒子。再有，也可以采用由绝缘层包覆导电材料而成的绝缘包覆粒子或者导电粒子与绝缘粒子并用等。
各向异性导电性粘接剂层的厚度没有特别限定，可以与所使用的粘接剂及包覆对象相吻合地适当选择，但最好为5μm～100μm。另外，各向异性导电性粘接剂层的宽度虽可以按照使用用途调整，但一般为0.5mm～5mm左右。
作为第一支撑体层和第二支撑体层之间的粘接剂，可以使用第一支撑体层和第二支撑体层之间的粘接强度大于第一支撑体层13-1和各向异性导电性粘接剂层之间的粘接强度的粘接剂，或者可以在第一支撑体层和各向异性导电性粘接剂之间进行较强的脱型处理，使剥离力小于第二支撑体层和第一支撑体层之间的粘接强度。
第一支撑体层和第二支撑体层的厚度没有特别限定，但最好是两层的合计厚度为20μm～300μm。
接着，对本发明的各向异性导电膜的制造方法进行说明。
图4是表示本发明的各向异性导电膜的制造方法的概要图。
本发明的制造方法具有以下工序：将第一支撑体层13-1和各向异性导电性粘接剂层14叠层而成的第一叠层体31和具有将第二支撑体层13-2和对第一支撑体层和第二支撑体层进行粘接的粘接剂层15叠层而成的构造且宽度比第一叠层体31的宽度更宽的第二叠层体32以粘接剂层15与第一叠层体13-1接触的方式予以叠层，从而将第一支撑体层13-1和第二支撑体层13-2粘接。
第一叠层体31和第二叠层体32可以用一般的各向异性导电膜的制造方法制作。即，使用滚涂机等各种涂敷机将各向异性导电性粘接剂或对第一支撑体层13-1和第二支撑体层13-2进行粘接的粘接剂以宽度为10～50cm左右涂敷在宽度较宽的支撑体(分离装置)上并干燥后制作为卷带体作成卷筒体(原反)。并且，可以使用开卷切割机的刀具等从该卷筒体中连续地切断成宽度为0.5～5mm左右的较窄宽度。
随后，将第一叠层体31和第二叠层体32以粘接剂层15与第一支撑体层13-1接触的方式叠层，并粘接第一支撑体层13-1和第二支撑体层13-2。
作为粘接第一支撑体层13-1和第二支撑体层13-2的方法，可列举例如通过利用将第一叠层体31和第二叠层体32卷绕在同一芯材上而产生的卷绕时的压力进行粘接的方法。卷绕时的压力可通过控制施加到第一叠层体31和第二叠层体32上的拉伸力(张力)，即控制第一叠层体31和第二叠层体32的放出速度及向芯材的卷绕速度来进行调整。
产业上的可利用性
本发明的各向异性导电膜可以抑制各向异性导电性粘接剂向宽度方向的渗出，可以减少各向异性导电膜在放出时的阻滞，并可防止窄幅产品场合的因支撑体的强度不足导致的伸长、断裂，进而可提高厚度方向与宽度方向的识别性。因此，由于各向异性导电膜使用时的处理性能好，因而可以提高在将IC芯片、LSI芯片、电阻、电容等零部件安装在电路基板上时的成品率。

Claims (9)

1.一种各向异性导电膜，是将支撑体和各向异性导电性粘接剂层叠层而成的各向异性导电膜，其特征在于，
在上述支撑体的宽度方向上的两个端部具有未形成上述各向异性导电性粘接剂层的区域，
所述异性导电性粘接剂层的宽度为0.5mm～5mm，
并且，该异性导电膜呈同心状地重合在具有卷轴侧板的芯材上。
2.一种各向异性导电膜，是将支撑体和各向异性导电性粘接剂层叠层而成的各向异性导电膜，其特征在于，
在上述支撑体的宽度方向上的两个端部具有未形成上述各向异性导电性粘接剂层的区域，
上述支撑体具有将具有与上述各向异性导电性粘接剂层的宽度相同的宽度的第一支撑体层和具有宽度比上述各向异性导电性粘接剂层的宽度更宽的第二支撑体层叠层而成的构造。
3.一种各向异性导电膜，是将支撑体和各向异性导电性粘接剂层叠层而成的各向异性导电膜，其特征在于，
在上述支撑体的宽度方向上的两个端部具有未形成上述各向异性导电性粘接剂层的区域，
所述异性导电性粘接剂包含自由基-丙烯酸酯粘接剂。
4.根据权利要求2或3所述的各向异性导电膜，其特征在于，
呈同心状地重合在具有卷轴侧板的芯材上。
5.根据权利要求2或3所述的各向异性导电膜，其特征在于，
所述异性导电性粘接剂层的宽度为0.5mm～5mm。
6.根据权利要求1-3中任意一项所述的各向异性导电膜，其特征在于，
所述异性导电性粘接剂层的宽度为0.8mm以下。
7.根据权利要求1-3中任意一项所述的各向异性导电膜，其特征在于，
位于上述支撑体的宽度方向的两端部的未形成上述各向异性导电性粘接剂层的区域的宽度互不相同。
8.一种各向异性导电膜的制造方法，其特征在于，
具有以下工序：将对第一支撑体层和各向异性导电性粘接剂层进行叠层的第一叠层体、和具有将第二支撑体层和粘接上述第一支撑体层和第二支撑体层的粘接剂层进行叠层的构造且宽度比上述各向异性导电性粘接剂层的宽度更宽的第二叠层体以上述第一支撑体层与上述粘接剂层接触的方式进行叠层，并将上述第一支撑体层和第二支撑体层粘接。
9.根据权利要求8所述的各向异性导电膜的制造方法，其特征在于，
具有以下工序：将上述第一叠层体的卷带体的卷筒体裁断成规定宽度的第一分切工序；
将上述第二叠层体的卷带体的卷筒体裁断成宽度比上述第一叠层体的裁断宽度更宽的第二分切工序；以及
将由上述第一分切工序裁断的第一叠层体和由上述第二分切工序裁断的第二叠层体进行叠层，通过卷绕在同一芯材上从而将上述第一支撑体层和第二支撑体层进行粘接的工序。
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