Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/028—Bending or folding regions of flexible printed circuits
  • H05K1/0281—Reinforcement details thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0393—Flexible materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09218—Conductive traces
  • H05K2201/09236—Parallel layout
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10121—Optical component, e.g. opto-electronic component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

• the invention relates to a flexible printed circuit for connecting electronic modules, in particular of modules of a camera intended for installation in a vehicle, such as a driver assistance system camera, and an optical module for a camera, which is designed in particular for installation in a vehicle is, according to the independent claims.
• ADAS Advanced Driver Assistance System
• Such cameras are used, for example, for detecting the surroundings of a vehicle in order to realize driver assistance functions such as lane detection, object detection, distance detection and the like camera-based functions.
• Cameras are also used to complement radar systems used in vehicles such as a distance radar and also for so-called surround and top-view systems, which allow a 360 ° all-round view of the vehicle.
• Another field of application for cameras in vehicles is rain sensing by detecting raindrops on a vehicle window.
• Cameras, especially those for use in driver assistance systems typically consist of a housing, for example a two-part plastic housing, an optical module and a motherboard.
• the optics module typically includes the image sensor, a lens, a sturdy backplate on which the image sensor may be mounted, and a flexible trace to electrically connect the image sensor to the motherboard.
• Such flexible interconnects are often used in particular for small electronic devices such as just cameras for vehicles or smartphones for connecting electronic modules.
• the interface between the image sensor and an electronic module for distinguishing other interfaces is referred to as CIF (Camera Interface).
• a CIF interface must be designed in particular for the transmission of video data from the image sensor in a video data memory of an electronic module, typically in the form of a 16-bit parallel interface, and therefore has a correspondingly complex connector with a large number of contacts in a small space. This makes them susceptible to metal particles, moisture condensation, which can occur especially when installed behind a vehicle window, and whisker formation, which can lead to a weakening of the signal transmission or even to short circuits.
• the object of the present invention is now to propose an improved electrical connection of electronic modules, in particular of modules of a camera intended for installation in a vehicle, for example a driver assistance system camera.
• the present invention initially proposes to use ACFA (Anisotropic Conductive Film Adhesive) Bonding instead of a CIF plug-in connection of a flexible conductor track and an electronic module as connection technology.
• ACFA Advanced Conductive Film Adhesive
• the invention also proposes to introduce longitudinal slots into the flexible track connection, which In particular, such a large distance from the connection region of the conductor track connection may have, that the connection region may lie as flat as possible on the electronic module, so that a complete ACFA bonding of the connection areas can be accomplished.
• a longitudinal slot can increase the load capacity of the printed conductor connection according to the invention, in particular with respect to bending forces, which can typically occur during roll-angle mounting of a camera on the printed conductor connection between the image sensor and the motherboard. Therefore, flexible interconnect according to the invention is particularly suitable for use in cameras that are used in vehicles, such as driver assistance system cameras.
• ACFA can be applied, for example, as an adhesive tape or liquid adhesive.
• An embodiment of the invention now relates to a flexible interconnect for connecting electronic modules comprising interconnect structures, two connection regions for electrically connecting the interconnect structures to corresponding interconnects of electronic modules, and at least one longitudinal slot in an area located in the interconnect between the two connection regions, wherein at least one of the connection regions is formed to be connected by means of anisotropy Conductive Film Adhesive Bonding with a corresponding terminal region of an electronic module.
• a longitudinal slot may terminate, in particular, at a predetermined distance in front of the connection areas, in order to allow as planar a connection of the connection areas as possible to respectively corresponding connection areas of electronic modules.
• the width of a longitudinal slot may decrease towards at least one of the terminal areas.
• Distances between adjacent and / or the widths of interconnect structures may be less in the region of a longitudinal slot than in at least one of the connection regions. Due to the increased spacing of the conductor track structures in the connection area, the risk of whisker formation and short circuits due to metal particles can be further reduced. Wider interconnect structures in a connection region can facilitate and improve the contacting with interconnect structures of a corresponding connection region of an electronic module, in particular reduce a contact resistance in the contact region.
• the flexible conductor track can have a layered construction of several layers of plastics, adhesives and metals, in particular a first covering plastic layer, a first adhesive layer, a first copper layer, a middle plastic layer, a second copper layer, one second adhesive layer and a second covering plastic would be.
• the flexible conductor track can also have an additional reinforcement layer, which counteracts, in particular, bending forces acting on the flexible conductor track.
• a reinforcing layer can be formed, for example, by an additional metal layer, for example made of copper, which is not used for printed conductors, but is configured such that the flexible printed circuit can withstand deformations, in particular bending and the forces occurring during a roll angle adjustment when used in a camera ,
• the additional reinforcing layer may be in the form of a line grid, dot matrix or cross grating applied flat on the flexible printed conductor.
• the additional reinforcing layer may be formed over its entire area in at least one of the terminal regions, whereby a stable and planar design of a connection region of a connection produced by means of anisotropic conductive film adhesive bonding can be ensured.
• the reinforcing layer can also allow, for example, the image sensor of a camera to be glued directly onto one of the terminal regions of the flexible printed circuit by means of anisotropic conductive film adhesive bonding.
• connection regions can also be formed wider than the region of the conductor track having the at least one longitudinal slot, in particular a connection region which is provided for connection by means of anisotropic conductive film adhesive bonding.
• the load capacity of the connection of this connection region with a corresponding connection region of an electronic module can be increased due to the larger connection surface.
• the flexible conductor track can have one or more sighting windows for alignment in at least one of the connection regions.
• a viewing window can be used, for example, together with so-called vias in the motherboard for aligning a connection area.
• a backlight and a photosensitive sensor can be used for alignment. The backlight light passes through the viewing window and the vias and may be detected by the sensor, which controls, for example, the orientation of the lead portion of the flexible trace or motherboard to detect a maximum amount of light when the vias and viewing windows are accurately aligned ,
• an embodiment of the invention relates to an optical module for a camera, which is designed in particular for installation in a vehicle, wherein the optical module comprises an image sensor module, an objective and a flexible conductor track according to one of the preceding claims, wherein the An image sensor module has an image sensor connected to a connection region of the flexible interconnect by means of anisotropy Conductive Film Adhesive Bonding with interconnect structures and a back plate on which the image sensor rests, and wherein the lens is attached to the connection region of the flexible interconnect by means of adhesive such that it is mounted on the Image sensor can produce an optical image.
• Fig. 1 and 2 an embodiment of a driver assistance system camera with an optical module according to the invention, which is connected by a flexible conductor to the main board of the camera;
• FIG. 3 substrate and printed conductor structures of an embodiment of a flexible printed circuit according to the invention in the bent state;
• Fig. 4 different states of the flexible trace during assembly of the camera shown in Figures 1 and 2;
• Fig. 5 shows two embodiments of reinforcing layers of a flexible printed circuit according to the invention
• Fig. 6 shows four views of an embodiment of a flexible printed circuit according to the invention.
• Fig. 7 is an alignment method in the assembly of the flexible printed circuit according to the invention.
• identical, functionally identical and functionally connected elements may be provided with the same reference numerals. Absolute values are given below by way of example only and are not to be construed as limiting the invention.
• FIG. 1 and 2 show a driver assistance system camera 50 for use in a vehicle, in particular for mounting behind a windshield of the vehicle, for example, integrated into the base of the central rearview mirror.
• the camera 50 comprises an optical module 58 and a motherboard 54, which are arranged in a plastic or metal housing composed of two housing halves 56 and 58 '.
• the main circuit board 54 fixed in the housing half 56 is electrically connected to an optical sensor module 52 of the optical module 58 via a flexible printed circuit 10 according to the invention.
• the photosensor module 52 includes an image sensor 52 ", such as a CMOS image sensor, and a stable back plate 52" (stiffener) for supporting the image sensor 52 '.
• the image sensor 52 ' is electrically connected by means of AGFA bonding to the corresponding connection region 16 of the flexible conductor track.
• the connection area 16 with the image sensor 52 ! is affixed to the stable back plate 52 ", for example glued on the thus formed Biidsensormodul 52 by means of adhesive 52 '" a lens 58' of the optics module 58 directly, ie without a separate reivhaiter attached so that the optical modulus 58 is formed as a tightly assembled unit is.
• the other connection region 14 of the flexible conductor 10 is electrically connected by means of AGFA bonding to a corresponding connection region of the main circuit board 54.
• an adhesive strip is applied to the motherboard 54 in the pre-bonding step.
• Housing 56 with optics module 58, or only optics module 58 (with subsequent package placement), is positioned to mainboard 54 and conductively connected to a hot stamp in the contacting areas while the areas remain without contacts as an insulator, because the conductive particles were not sufficiently compressed in the adhesive to produce a conductive connection.
• the compound thus created shows advantages in robustness for metaiparticles after bonding and by the large contact surfaces very low contact resistance. In addition, a major price advantage over a connector can be achieved.
• the optical module! 58 screwed in a direction indicated by the arrows Roilwinkeijustage process step in a corresponding opening in the housing half 58, wherein the motherboard 54 is fixed to or in the housing half 58, for example, is clamped, glued or screwed.
• the housing half 58 has features for unambiguous orientation in the vehicle.
• the aim of the Roilwinkeijustage step is to achieve the smallest possible scattering of the roll angle of the sensor 52 "of the optical module 58 to the Anlagenmerkmaien.
• the optical module 58 is fixed in the housing half 58 by a permanent joining process, for example by gluing the Rollwinkeijustage can also be done before the ACFA bonding.
• the flexible conductor 10 preferably has a layered structure of various plastics including adhesives and metals in order to be able to withstand the stresses of the roll-angle coating (applies in both cases since a torsional / bending resistance moment is applied across the flexible conductor: final assembly with AGFA bonding before Rollwinkeijustage or Rollwinkeijustage).
• the flexible conductor track may have an average base layer of 25 ⁇ m thick made from a P-1 plastic, on top of which a first 12.5 ⁇ m thick copper layer and on the underside of which a second 12.5 ⁇ m thick copper layer is applied.
• the first copper layer is covered by a first 12.5 pm thick Pl plastic layer fastened by a middle layer of a 15 ⁇ m thick layer of adhesive material.
• the second copper layer is covered by a second 12.5 ⁇ m thick Pl plastic material fastened by means of a 15 pm thick layer of adhesive material.
• one or more longitudinal slots 18, 20 may be introduced in a region between the connection regions 14 and 16.
• the chute 18, 20 are in this case introduced between the conductor track structures 12, and the conductor track structures 12 are formed so that the individual web structures run around the slots.
• Fig. 3 shows a carrier substrate 13 and the printed conductor structures 12 of a flexible printed conductor with two longitudinal slots 18 and 20 running parallel in a region 11 between the terminal regions 14 and 16.
• the longitudinal slots 18 and 20 are cutouts from the carrier substrate 13 and the printed conductor structures 12 are designed such that they surround them Cutouts 1 8 and 20 run around or the cutouts 1 8 and 20 are located in areas which are recessed by printed conductor structures 1 2.
• the longitudinal sections 18 and 20 terminate in front of the connection areas 14 and 16 in order to obtain a design which is as planar as possible for the ACFA bonding at one end and the gluing of the image sensor at the other end.
• the conductor track structures 1 2 run as shown in FIG. 3 - in the cutout areas of the slots 1 8, 20 closer together, d .h. with a smaller distance, while they are carried out at the end again with a greater distance.
• FIG. 4 shows the bending states of the flexible conductor 1 0 during the assembly of the device shown in FIG. 1 and 2 shown camera.
• the starting position is shown at A, at B a bend for mounting a connection region of the conductor track 1 0 to the motherboard, at C the bending occurring when the motherboard is displaced in the housing and at D the bending occurring at the roll angle adjustment.
• the resilience of the flexible trace can be further optimized if the flexible trace is provided with an additional reinforcement layer.
• the additional reinforcing layer can be formed, for example, in the form of a second metal layer (eg copper), which is not used for printed conductors, but is designed such that the flexible printed circuit can withstand extreme deformations, in particular the bending and the forces acting on the roll angle adjustment.
• a second metal layer eg copper
• line segments, dot patterns and / or cross gratings can be configured in the second metal layer.
• the second copper layer in the connection area 28, the second copper layer over the entire surface running and the Schl etze are not drawn through to a stable and flat as possible execution of the areas for the ACFA bonding and gluing the image sensor to ermögl ichen.
• the second copper layer In region 26 of the slots, the second copper layer is configured in the form of a cross lattice.
• the second copper layer In the left in Fig.
• the second copper layer is configured throughout as a dot matrix, that is to say both in the connection region 28 'and in the region 26' of the slots.
• the slots are designed to be very wide in order to ensure the best possible load capacity with appropriate roll angle adjustment.
• FIG. 6 shows four views of an exemplary embodiment of the flexible printed conductor 1 0 according to the invention, in which further details of the possible embodiment of the printed conductor 1 0 are shown.
• the two longitudinal slots 1 8 and 20 terminate at a distance 20 in front of the connection areas 14 and 16 provided for an ACFA bonding, as a result of which a possibly planar contact of the connection areas 14, 16 for the bonding can be ensured.
• the width 24 of the L Lucassschl itze 1 8 and 20 is also reduced to the connection areas 14, 1 6, so that the contact surface for the ACFA bonding increases and thus can be the load capacity of the bonding compound.
• the conductor track structures 1 2 and their course can be recognized, in particular, how the spacings of the individual structures in the connection areas 14 and 16 increase in contrast to the distances in the area 11.
• the illustration at the bottom right in FIG. 6 shows an additional reinforcing layer 26, 28 of the conductor track 1 0, which is formed over its entire area in the connection areas 1 4 and 1 6 (area 28) and in the area 11 of the longitudinal slots 1 8, 20 in the form of a cross grid (area 26).
• FIG. 7 shows an alignment method in assembling the flexible printed circuit 10 according to the invention, in which through holes 55 of a printed circuit board 54 (so-called VIAs are used in the standard production process in printed circuit board manufacturing) to be used in the alignment process for the ACFA bonding between a terminal region 14 of the flexible Conductor 10 and a motherboard 54 by a backlight by means of a lamp 60 and a punching 15 in the connection region 14 of the flexible conductor 10 to allow a reproducible position control for alignment.
• the punch-out 15 forms a viewing window in the connection region 14 or a transparent window for at least part of the wavelengths of the backlighting of the lamp 60.
• FIG. 7 shows a plan view of an exemplary embodiment of the flexible conductor track 10 with viewing windows 15 in the connection region 14

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Multimedia (AREA)
• Signal Processing (AREA)
• Structure Of Printed Boards (AREA)
• Studio Devices (AREA)
• Camera Bodies And Camera Details Or Accessories (AREA)
• Manufacturing & Machinery (AREA)
• Lens Barrels (AREA)
• Combinations Of Printed Boards (AREA)

Priority Applications (7)

Applications Claiming Priority (2)

Publications (1)

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ID=61002771

Family Applications (1)

Country Status (7)

Cited By (3)

Families Citing this family (4)

Citations (4)

Family Cites Families (22)

• 2017
  • 2017-01-19 DE DE102017200817.2A patent/DE102017200817A1/de not_active Withdrawn
  • 2017-12-05 JP JP2019537334A patent/JP7562257B2/ja active Active
  • 2017-12-05 KR KR1020197020149A patent/KR102474026B1/ko active Active
  • 2017-12-05 EP EP17832037.0A patent/EP3533301A1/de active Pending
  • 2017-12-05 US US16/478,991 patent/US11116076B2/en active Active
  • 2017-12-05 CN CN202411182411.7A patent/CN119093038A/zh active Pending
  • 2017-12-05 DE DE112017005644.6T patent/DE112017005644A5/de active Pending
  • 2017-12-05 CN CN201780083640.5A patent/CN110178451A/zh active Pending
  • 2017-12-05 WO PCT/DE2017/200126 patent/WO2018133893A1/de not_active Ceased

Patent Citations (4)

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