JP2020506537A - 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック - Google Patents
電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック Download PDFInfo
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- JP2020506537A JP2020506537A JP2019537334A JP2019537334A JP2020506537A JP 2020506537 A JP2020506537 A JP 2020506537A JP 2019537334 A JP2019537334 A JP 2019537334A JP 2019537334 A JP2019537334 A JP 2019537334A JP 2020506537 A JP2020506537 A JP 2020506537A
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- 239000004020 conductor Substances 0.000 title claims abstract description 113
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 38
- 230000003287 optical effect Effects 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 239000004826 Synthetic adhesive Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
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- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Manufacturing & Machinery (AREA)
- Lens Barrels (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (11)
- 電子モジュール接続用可撓性導体トラック(10)において、
‐導体トラック構造体(12)と、
‐前記導体トラック構造体(12)を電子モジュールの対応する導体トラックと電気的に接続するための2つの接続領域部(14、16)と、
‐前記導体トラック(10)において前記接続領域部(14、16)両方の間に位置する領域(11)に少なくとも1つの縦スロット(18、20)と、を備え、
‐前記接続領域部(14、16)の少なくとも1つは、異方性導電フィルム接着剤ボンディングを用いて電子モジュールの対応する接続領域部と接続されるように構成される、導体トラック。 - 縦スロット(18、20)は前記接続領域部(14、16)に対して所定の間隔(22)手前で終端することを特徴とする、請求項1に記載の導体トラック。
- 縦スロット(18、20)の幅(24)は前記接続領域部(14、16)の少なくとも1つに向かって減少することを特徴とする、請求項1または2に記載の導体トラック。
- 隣接する導体トラック構造体間の間隔および/または導体トラック構造体の幅は、前記接続領域部の少なくとも1つにおけるよりも縦スロット(18、20)の領域においてより小さいことを特徴とする、請求項1〜3のいずれか1項に記載の導体トラック。
- 前記導体トラック(10)は、合成樹脂、接着剤および金属からなる複数の層、特に第1カバー合成樹脂層、第1接着剤層、第1銅層、中間合成樹脂層、第2銅層、第2接着剤層および第2カバー合成樹脂層からなる積層構造を有することを特徴とする、請求項1〜4のいずれか1項に記載の導体トラック。
- 前記導体トラック(10)は、特に前記可撓性導体トラックに作用する曲げ力を相殺する、追加補強層(26、26‘、28、28‘)を有することを特徴とする、請求項1〜5のいずれか1項に記載の導体トラック。
- 前記追加補強層(26、26‘)は、前記可撓性導体トラック上に平坦に載置されるライングリッド、ドットマトリクスまたはクロスグリッド状に構成されることを特徴とする、請求項6に記載の導体トラック。
- 前記追加補強層(28)は、前記接続領域部(14、16)の少なくとも1つにおいて完全に平坦に構成されることを特徴とする、請求項6または7に記載の導体トラック。
- 前記接続領域部(14、16)の少なくとも1つは、前記導体トラックの前記少なくとも1つの縦スロットを有する前記領域よりも幅広に構成されることを特徴とする、請求項1〜8のいずれか1項に記載の導体トラック。
- 前記導体トラック(10)は、前記接続領域部(14、16)の少なくとも1つに1つまたは複数の調整用観察窓(15)を有することを特徴とする、請求項1〜9のいずれか1項に記載の導体トラック。
- 特に乗物搭載用に構成されるカメラ(50)の光学モジュール(58)において、
前記光学モジュール(58)は、画像センサモジュール(52)と、レンズ(58‘)と、請求項1〜10のいずれか1項に記載の可撓性導体トラック(10)と、を備え、
前記画像センサモジュール(52)は、前記可撓性導体トラック(10)の接続領域部(16)上で異方性導電フィルム接着剤ボンディングを用いて導体トラック構造体(12)と接続される画像センサ(52‘)と、前記画像センサ(52‘)が載置される背面板(52‘‘)と、を備え、
前記レンズ(58‘)は、前記レンズ(58‘)が前記画像センサ(52‘)上に光像を作成できるように、前記可撓性導体トラック(10)の前記接続領域部(16)に対して接着剤(52‘‘‘)を用いて固定される、光学モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017200817.2 | 2017-01-19 | ||
DE102017200817.2A DE102017200817A1 (de) | 2017-01-19 | 2017-01-19 | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
PCT/DE2017/200126 WO2018133893A1 (de) | 2017-01-19 | 2017-12-05 | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020506537A true JP2020506537A (ja) | 2020-02-27 |
JPWO2018133893A5 JPWO2018133893A5 (ja) | 2022-12-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019537334A Pending JP2020506537A (ja) | 2017-01-19 | 2017-12-05 | 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック |
Country Status (7)
Country | Link |
---|---|
US (1) | US11116076B2 (ja) |
EP (1) | EP3533301A1 (ja) |
JP (1) | JP2020506537A (ja) |
KR (1) | KR102474026B1 (ja) |
CN (1) | CN110178451A (ja) |
DE (2) | DE102017200817A1 (ja) |
WO (1) | WO2018133893A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017200817A1 (de) * | 2017-01-19 | 2018-07-19 | Conti Temic Microelectronic Gmbh | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
GB201910805D0 (en) | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
JP2021068795A (ja) * | 2019-10-23 | 2021-04-30 | ソニーセミコンダクタソリューションズ株式会社 | 光源装置 |
WO2022058006A1 (en) | 2020-09-16 | 2022-03-24 | Leonardo UK Ltd | Circuit board assembly |
CN113038696B (zh) * | 2021-03-02 | 2022-06-14 | 广德新三联电子有限公司 | 一种汽车用高耐弯性电路板及其制备方法 |
US11863695B2 (en) * | 2021-09-23 | 2024-01-02 | Motorola Mobility Llc | Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures |
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JPH11317130A (ja) * | 1998-04-30 | 1999-11-16 | Fujikura Ltd | メンブレンスイッチ |
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JP2007043129A (ja) * | 2005-07-08 | 2007-02-15 | Konica Minolta Opto Inc | プリント基板及び撮像装置並びにカメラ |
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US20140354900A1 (en) * | 2013-06-03 | 2014-12-04 | Apple Inc. | Flexible Printed Circuit Cables With Slits |
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DE102017200817A1 (de) * | 2017-01-19 | 2018-07-19 | Conti Temic Microelectronic Gmbh | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
-
2017
- 2017-01-19 DE DE102017200817.2A patent/DE102017200817A1/de not_active Withdrawn
- 2017-12-05 US US16/478,991 patent/US11116076B2/en active Active
- 2017-12-05 DE DE112017005644.6T patent/DE112017005644A5/de active Pending
- 2017-12-05 EP EP17832037.0A patent/EP3533301A1/de active Pending
- 2017-12-05 JP JP2019537334A patent/JP2020506537A/ja active Pending
- 2017-12-05 CN CN201780083640.5A patent/CN110178451A/zh active Pending
- 2017-12-05 KR KR1020197020149A patent/KR102474026B1/ko active IP Right Grant
- 2017-12-05 WO PCT/DE2017/200126 patent/WO2018133893A1/de unknown
Patent Citations (8)
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JPH1070344A (ja) * | 1996-08-26 | 1998-03-10 | Sony Corp | フレキシブル配線基板 |
JPH11317130A (ja) * | 1998-04-30 | 1999-11-16 | Fujikura Ltd | メンブレンスイッチ |
WO2005122656A1 (ja) * | 2004-06-10 | 2005-12-22 | Ibiden Co., Ltd. | フレックスリジッド配線板およびその製造方法 |
JP2007043129A (ja) * | 2005-07-08 | 2007-02-15 | Konica Minolta Opto Inc | プリント基板及び撮像装置並びにカメラ |
JP2009186796A (ja) * | 2008-02-07 | 2009-08-20 | Funai Electric Co Ltd | 撮像装置 |
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Also Published As
Publication number | Publication date |
---|---|
EP3533301A1 (de) | 2019-09-04 |
CN110178451A (zh) | 2019-08-27 |
WO2018133893A1 (de) | 2018-07-26 |
KR102474026B1 (ko) | 2022-12-02 |
DE102017200817A1 (de) | 2018-07-19 |
KR20190104539A (ko) | 2019-09-10 |
DE112017005644A5 (de) | 2019-08-22 |
US20190357352A1 (en) | 2019-11-21 |
US11116076B2 (en) | 2021-09-07 |
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