JP7562257B2 - 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック - Google Patents

電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック Download PDF

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Publication number
JP7562257B2
JP7562257B2 JP2019537334A JP2019537334A JP7562257B2 JP 7562257 B2 JP7562257 B2 JP 7562257B2 JP 2019537334 A JP2019537334 A JP 2019537334A JP 2019537334 A JP2019537334 A JP 2019537334A JP 7562257 B2 JP7562257 B2 JP 7562257B2
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Prior art keywords
conductor track
connection
flexible conductor
image sensor
layer
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JP2019537334A
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Japanese (ja)
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JP2020506537A (ja
JP2020506537A5 (https=
Inventor
ローテンホイスラー・コンラート
プファイファー・フランツ
ベルク・ティーロ
ベーヒャー・ヨス
シュラインコーファー・アンドレアス
ファレンドル・マルティン
ドロプマン・マティアス
トレス・アルシナ・オスカル
ゲルマー・シュテッフェン
アルプレヒト・パトリック
ポーヴィライト・ヘンドリク
クレーケル・ディーター
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Aumovio Microelectronic GmbH
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Conti Temic Microelectronic GmbH
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • H05K1/0281Reinforcement details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Lens Barrels (AREA)
  • Combinations Of Printed Boards (AREA)
JP2019537334A 2017-01-19 2017-12-05 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック Active JP7562257B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017200817.2 2017-01-19
DE102017200817.2A DE102017200817A1 (de) 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
PCT/DE2017/200126 WO2018133893A1 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Publications (3)

Publication Number Publication Date
JP2020506537A JP2020506537A (ja) 2020-02-27
JP2020506537A5 JP2020506537A5 (https=) 2022-12-12
JP7562257B2 true JP7562257B2 (ja) 2024-10-07

Family

ID=61002771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019537334A Active JP7562257B2 (ja) 2017-01-19 2017-12-05 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック

Country Status (7)

Country Link
US (1) US11116076B2 (https=)
EP (1) EP3533301A1 (https=)
JP (1) JP7562257B2 (https=)
KR (1) KR102474026B1 (https=)
CN (2) CN119093038A (https=)
DE (2) DE102017200817A1 (https=)
WO (1) WO2018133893A1 (https=)

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* Cited by examiner, † Cited by third party
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DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
GB201910805D0 (en) 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
JP2021068795A (ja) * 2019-10-23 2021-04-30 ソニーセミコンダクタソリューションズ株式会社 光源装置
WO2022058006A1 (en) 2020-09-16 2022-03-24 Leonardo UK Ltd Circuit board assembly
CN113038696B (zh) * 2021-03-02 2022-06-14 广德新三联电子有限公司 一种汽车用高耐弯性电路板及其制备方法
WO2023036295A1 (zh) * 2021-09-10 2023-03-16 宁波舜宇光电信息有限公司 用于摄像模组的线路板及相应的摄像模组
US11863695B2 (en) * 2021-09-23 2024-01-02 Motorola Mobility Llc Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures

Citations (9)

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JP2007043129A (ja) 2005-07-08 2007-02-15 Konica Minolta Opto Inc プリント基板及び撮像装置並びにカメラ
JP2007235067A (ja) 2006-03-03 2007-09-13 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
JP2010040720A (ja) 2008-08-04 2010-02-18 Sharp Corp フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器
JP2011193339A (ja) 2010-03-16 2011-09-29 Ricoh Co Ltd 撮像装置の組み立て方法および撮像装置
US20140354900A1 (en) 2013-06-03 2014-12-04 Apple Inc. Flexible Printed Circuit Cables With Slits
WO2015033736A1 (ja) 2013-09-05 2015-03-12 株式会社村田製作所 多層基板
JP2015087741A (ja) 2013-09-27 2015-05-07 日東電工株式会社 光電気混載基板およびその製法
JP2015528133A (ja) 2012-07-27 2015-09-24 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングConti Temic microelectronic GmbH ステレオ・カメラの二つの画像撮影エレメントを揃えるための方法
JP2016522596A (ja) 2013-03-19 2016-07-28 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH ステレオ・カメラ・モジュール、並びに、その製造方法

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JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
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JP5003113B2 (ja) * 2006-11-16 2012-08-15 三菱電機株式会社 フレキシブル配線基板の接続構造
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JP5380849B2 (ja) * 2008-02-07 2014-01-08 船井電機株式会社 撮像装置
JP5622443B2 (ja) * 2010-06-08 2014-11-12 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット
JP2013033851A (ja) 2011-08-02 2013-02-14 Toshiba Corp フレキシブル配線モジュール及びフレキシブル配線装置
KR102103792B1 (ko) * 2012-11-08 2020-04-24 삼성디스플레이 주식회사 회로 기판의 접속 구조
CN104995906B (zh) * 2013-04-26 2018-01-26 株式会社村田制作所 摄像头模块的制造方法
CN203840633U (zh) * 2014-04-22 2014-09-17 华为技术有限公司 一种柔性电路板及信号传输装置
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DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007043129A (ja) 2005-07-08 2007-02-15 Konica Minolta Opto Inc プリント基板及び撮像装置並びにカメラ
JP2007235067A (ja) 2006-03-03 2007-09-13 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
JP2010040720A (ja) 2008-08-04 2010-02-18 Sharp Corp フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器
JP2011193339A (ja) 2010-03-16 2011-09-29 Ricoh Co Ltd 撮像装置の組み立て方法および撮像装置
JP2015528133A (ja) 2012-07-27 2015-09-24 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングConti Temic microelectronic GmbH ステレオ・カメラの二つの画像撮影エレメントを揃えるための方法
JP2016522596A (ja) 2013-03-19 2016-07-28 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH ステレオ・カメラ・モジュール、並びに、その製造方法
US20140354900A1 (en) 2013-06-03 2014-12-04 Apple Inc. Flexible Printed Circuit Cables With Slits
WO2015033736A1 (ja) 2013-09-05 2015-03-12 株式会社村田製作所 多層基板
JP2015087741A (ja) 2013-09-27 2015-05-07 日東電工株式会社 光電気混載基板およびその製法

Also Published As

Publication number Publication date
EP3533301A1 (de) 2019-09-04
US11116076B2 (en) 2021-09-07
JP2020506537A (ja) 2020-02-27
US20190357352A1 (en) 2019-11-21
DE102017200817A1 (de) 2018-07-19
WO2018133893A1 (de) 2018-07-26
KR102474026B1 (ko) 2022-12-02
CN110178451A (zh) 2019-08-27
CN119093038A (zh) 2024-12-06
DE112017005644A5 (de) 2019-08-22
KR20190104539A (ko) 2019-09-10

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