JP7562257B2 - 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック - Google Patents
電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック Download PDFInfo
- Publication number
- JP7562257B2 JP7562257B2 JP2019537334A JP2019537334A JP7562257B2 JP 7562257 B2 JP7562257 B2 JP 7562257B2 JP 2019537334 A JP2019537334 A JP 2019537334A JP 2019537334 A JP2019537334 A JP 2019537334A JP 7562257 B2 JP7562257 B2 JP 7562257B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor track
- connection
- flexible conductor
- image sensor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Structure Of Printed Boards (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Manufacturing & Machinery (AREA)
- Lens Barrels (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017200817.2 | 2017-01-19 | ||
| DE102017200817.2A DE102017200817A1 (de) | 2017-01-19 | 2017-01-19 | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
| PCT/DE2017/200126 WO2018133893A1 (de) | 2017-01-19 | 2017-12-05 | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020506537A JP2020506537A (ja) | 2020-02-27 |
| JP2020506537A5 JP2020506537A5 (https=) | 2022-12-12 |
| JP7562257B2 true JP7562257B2 (ja) | 2024-10-07 |
Family
ID=61002771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019537334A Active JP7562257B2 (ja) | 2017-01-19 | 2017-12-05 | 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11116076B2 (https=) |
| EP (1) | EP3533301A1 (https=) |
| JP (1) | JP7562257B2 (https=) |
| KR (1) | KR102474026B1 (https=) |
| CN (2) | CN119093038A (https=) |
| DE (2) | DE102017200817A1 (https=) |
| WO (1) | WO2018133893A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017200817A1 (de) * | 2017-01-19 | 2018-07-19 | Conti Temic Microelectronic Gmbh | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
| GB201910805D0 (en) | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
| JP2021068795A (ja) * | 2019-10-23 | 2021-04-30 | ソニーセミコンダクタソリューションズ株式会社 | 光源装置 |
| WO2022058006A1 (en) | 2020-09-16 | 2022-03-24 | Leonardo UK Ltd | Circuit board assembly |
| CN113038696B (zh) * | 2021-03-02 | 2022-06-14 | 广德新三联电子有限公司 | 一种汽车用高耐弯性电路板及其制备方法 |
| WO2023036295A1 (zh) * | 2021-09-10 | 2023-03-16 | 宁波舜宇光电信息有限公司 | 用于摄像模组的线路板及相应的摄像模组 |
| US11863695B2 (en) * | 2021-09-23 | 2024-01-02 | Motorola Mobility Llc | Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007043129A (ja) | 2005-07-08 | 2007-02-15 | Konica Minolta Opto Inc | プリント基板及び撮像装置並びにカメラ |
| JP2007235067A (ja) | 2006-03-03 | 2007-09-13 | Nitto Denko Corp | 配線回路基板集合体シートおよびその製造方法 |
| JP2010040720A (ja) | 2008-08-04 | 2010-02-18 | Sharp Corp | フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器 |
| JP2011193339A (ja) | 2010-03-16 | 2011-09-29 | Ricoh Co Ltd | 撮像装置の組み立て方法および撮像装置 |
| US20140354900A1 (en) | 2013-06-03 | 2014-12-04 | Apple Inc. | Flexible Printed Circuit Cables With Slits |
| WO2015033736A1 (ja) | 2013-09-05 | 2015-03-12 | 株式会社村田製作所 | 多層基板 |
| JP2015087741A (ja) | 2013-09-27 | 2015-05-07 | 日東電工株式会社 | 光電気混載基板およびその製法 |
| JP2015528133A (ja) | 2012-07-27 | 2015-09-24 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングConti Temic microelectronic GmbH | ステレオ・カメラの二つの画像撮影エレメントを揃えるための方法 |
| JP2016522596A (ja) | 2013-03-19 | 2016-07-28 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH | ステレオ・カメラ・モジュール、並びに、その製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5752851A (en) * | 1996-02-05 | 1998-05-19 | Ford Motor Company | Circuit clip connector |
| JPH1070344A (ja) * | 1996-08-26 | 1998-03-10 | Sony Corp | フレキシブル配線基板 |
| JPH11317130A (ja) * | 1998-04-30 | 1999-11-16 | Fujikura Ltd | メンブレンスイッチ |
| JP3980933B2 (ja) * | 2002-05-23 | 2007-09-26 | ローム株式会社 | イメージセンサモジュールの製造方法 |
| US6998721B2 (en) * | 2002-11-08 | 2006-02-14 | Stmicroelectronics, Inc. | Stacking and encapsulation of multiple interconnected integrated circuits |
| JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
| US8358816B2 (en) | 2005-10-18 | 2013-01-22 | Authentec, Inc. | Thinned finger sensor and associated methods |
| JP5003113B2 (ja) * | 2006-11-16 | 2012-08-15 | 三菱電機株式会社 | フレキシブル配線基板の接続構造 |
| US8511229B2 (en) * | 2007-05-09 | 2013-08-20 | Amish Desai | Multilayered microcavities and actuators incorporating same |
| JP5380849B2 (ja) * | 2008-02-07 | 2014-01-08 | 船井電機株式会社 | 撮像装置 |
| JP5622443B2 (ja) * | 2010-06-08 | 2014-11-12 | 日本電産サンキョー株式会社 | 振れ補正機能付き光学ユニット |
| JP2013033851A (ja) | 2011-08-02 | 2013-02-14 | Toshiba Corp | フレキシブル配線モジュール及びフレキシブル配線装置 |
| KR102103792B1 (ko) * | 2012-11-08 | 2020-04-24 | 삼성디스플레이 주식회사 | 회로 기판의 접속 구조 |
| CN104995906B (zh) * | 2013-04-26 | 2018-01-26 | 株式会社村田制作所 | 摄像头模块的制造方法 |
| CN203840633U (zh) * | 2014-04-22 | 2014-09-17 | 华为技术有限公司 | 一种柔性电路板及信号传输装置 |
| WO2017003531A1 (en) | 2015-06-30 | 2017-01-05 | Apple Inc. | Electronic devices with soft input-output components |
| DE102017200817A1 (de) * | 2017-01-19 | 2018-07-19 | Conti Temic Microelectronic Gmbh | Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera |
-
2017
- 2017-01-19 DE DE102017200817.2A patent/DE102017200817A1/de not_active Withdrawn
- 2017-12-05 JP JP2019537334A patent/JP7562257B2/ja active Active
- 2017-12-05 KR KR1020197020149A patent/KR102474026B1/ko active Active
- 2017-12-05 EP EP17832037.0A patent/EP3533301A1/de active Pending
- 2017-12-05 US US16/478,991 patent/US11116076B2/en active Active
- 2017-12-05 CN CN202411182411.7A patent/CN119093038A/zh active Pending
- 2017-12-05 DE DE112017005644.6T patent/DE112017005644A5/de active Pending
- 2017-12-05 CN CN201780083640.5A patent/CN110178451A/zh active Pending
- 2017-12-05 WO PCT/DE2017/200126 patent/WO2018133893A1/de not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007043129A (ja) | 2005-07-08 | 2007-02-15 | Konica Minolta Opto Inc | プリント基板及び撮像装置並びにカメラ |
| JP2007235067A (ja) | 2006-03-03 | 2007-09-13 | Nitto Denko Corp | 配線回路基板集合体シートおよびその製造方法 |
| JP2010040720A (ja) | 2008-08-04 | 2010-02-18 | Sharp Corp | フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器 |
| JP2011193339A (ja) | 2010-03-16 | 2011-09-29 | Ricoh Co Ltd | 撮像装置の組み立て方法および撮像装置 |
| JP2015528133A (ja) | 2012-07-27 | 2015-09-24 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングConti Temic microelectronic GmbH | ステレオ・カメラの二つの画像撮影エレメントを揃えるための方法 |
| JP2016522596A (ja) | 2013-03-19 | 2016-07-28 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH | ステレオ・カメラ・モジュール、並びに、その製造方法 |
| US20140354900A1 (en) | 2013-06-03 | 2014-12-04 | Apple Inc. | Flexible Printed Circuit Cables With Slits |
| WO2015033736A1 (ja) | 2013-09-05 | 2015-03-12 | 株式会社村田製作所 | 多層基板 |
| JP2015087741A (ja) | 2013-09-27 | 2015-05-07 | 日東電工株式会社 | 光電気混載基板およびその製法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3533301A1 (de) | 2019-09-04 |
| US11116076B2 (en) | 2021-09-07 |
| JP2020506537A (ja) | 2020-02-27 |
| US20190357352A1 (en) | 2019-11-21 |
| DE102017200817A1 (de) | 2018-07-19 |
| WO2018133893A1 (de) | 2018-07-26 |
| KR102474026B1 (ko) | 2022-12-02 |
| CN110178451A (zh) | 2019-08-27 |
| CN119093038A (zh) | 2024-12-06 |
| DE112017005644A5 (de) | 2019-08-22 |
| KR20190104539A (ko) | 2019-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7562257B2 (ja) | 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック | |
| US9618828B2 (en) | Camera with heating element | |
| EP3829156B1 (en) | Anti-shake light-sensing assembly, fabrication method therefor and electronic device | |
| CN1321481C (zh) | 连接结构和半导体装置、显示模块和电子部件 | |
| US20150358605A1 (en) | Stereo camera module and method for the production thereof | |
| US9401379B2 (en) | Image sensor module and method for producing such a module | |
| EP3951494B1 (en) | Heating device and camera module | |
| EP2876873B1 (en) | Grounding part, electronic device, imaging device, and grounding part production method | |
| US10962847B2 (en) | Display device having an inclined side surface | |
| JP2009295821A (ja) | 基板間接続構造を有する複合基板、これを用いた固体撮像装置およびその製造方法 | |
| US12445703B2 (en) | Vehicular camera module | |
| KR20180129204A (ko) | 카메라 모듈 | |
| CN112714239B (zh) | 感光组件和摄像模组及其方法和电子设备 | |
| CN105308945B (zh) | 尤其用于车辆的摄像机系统及用于其制造的方法 | |
| US12128649B2 (en) | Laminated glass pane for a vehicle | |
| CN213693868U (zh) | 感光组件、摄像模组及电子设备 | |
| US20120012159A1 (en) | Solar cell module and method for manufacturing the solar cell module, and mobile device with the solar cell module and method for manufacturing the mobile device | |
| KR20180017590A (ko) | 카메라 모듈 | |
| US8803002B2 (en) | Electronic device preventing damage to circuit terminal portion and method of manufacturing the same | |
| KR20240142017A (ko) | 카메라 모듈 | |
| KR20080005733A (ko) | 이미지 센서 모듈과 카메라 모듈 | |
| US20220279094A1 (en) | Molded circuit board and camera module, and manufacturing method thereof and electronic device | |
| CN113226727A (zh) | 玻璃质玻璃板 | |
| JP2023526300A (ja) | レンズモジュール及びカメラモジュール | |
| US20230126847A1 (en) | Lens module and electronic device having the lens module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20200703 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201118 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20211126 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211215 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220310 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20220803 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20221124 |
|
| C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20221124 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20221201 |
|
| C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20221207 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20230224 |
|
| C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20230301 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240301 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240925 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7562257 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |