KR102474026B1 - 전자 모듈을, 특히 차량 장착용으로 계획한 모듈을 연결하기 위한 가요성 인쇄회로기판 트랙 - Google Patents

전자 모듈을, 특히 차량 장착용으로 계획한 모듈을 연결하기 위한 가요성 인쇄회로기판 트랙 Download PDF

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Publication number
KR102474026B1
KR102474026B1 KR1020197020149A KR20197020149A KR102474026B1 KR 102474026 B1 KR102474026 B1 KR 102474026B1 KR 1020197020149 A KR1020197020149 A KR 1020197020149A KR 20197020149 A KR20197020149 A KR 20197020149A KR 102474026 B1 KR102474026 B1 KR 102474026B1
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South Korea
Prior art keywords
circuit board
printed circuit
flexible printed
board track
track
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Korean (ko)
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KR20190104539A (ko
Inventor
콘라트 로트헨헤우슬러
프란츠 파이퍼
틸로 베르크
요스 베허
안드레아스 슐라인코퍼
마르틴 팔렌도어
마티아스 드로프만
알시나 오스카르 토레스
슈테펜 괴르머
파트릭 알브레히트
헨드릭 포빌라이트
디터 크뢰켈
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콘티 테믹 마이크로일렉트로닉 게엠베하
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Publication of KR20190104539A publication Critical patent/KR20190104539A/ko
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Lens Barrels (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020197020149A 2017-01-19 2017-12-05 전자 모듈을, 특히 차량 장착용으로 계획한 모듈을 연결하기 위한 가요성 인쇄회로기판 트랙 Active KR102474026B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017200817.2 2017-01-19
DE102017200817.2A DE102017200817A1 (de) 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
PCT/DE2017/200126 WO2018133893A1 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Publications (2)

Publication Number Publication Date
KR20190104539A KR20190104539A (ko) 2019-09-10
KR102474026B1 true KR102474026B1 (ko) 2022-12-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197020149A Active KR102474026B1 (ko) 2017-01-19 2017-12-05 전자 모듈을, 특히 차량 장착용으로 계획한 모듈을 연결하기 위한 가요성 인쇄회로기판 트랙

Country Status (7)

Country Link
US (1) US11116076B2 (https=)
EP (1) EP3533301A1 (https=)
JP (1) JP7562257B2 (https=)
KR (1) KR102474026B1 (https=)
CN (2) CN119093038A (https=)
DE (2) DE102017200817A1 (https=)
WO (1) WO2018133893A1 (https=)

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DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
GB201910805D0 (en) 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
JP2021068795A (ja) * 2019-10-23 2021-04-30 ソニーセミコンダクタソリューションズ株式会社 光源装置
WO2022058006A1 (en) 2020-09-16 2022-03-24 Leonardo UK Ltd Circuit board assembly
CN113038696B (zh) * 2021-03-02 2022-06-14 广德新三联电子有限公司 一种汽车用高耐弯性电路板及其制备方法
WO2023036295A1 (zh) * 2021-09-10 2023-03-16 宁波舜宇光电信息有限公司 用于摄像模组的线路板及相应的摄像模组
US11863695B2 (en) * 2021-09-23 2024-01-02 Motorola Mobility Llc Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures

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JP2007043129A (ja) * 2005-07-08 2007-02-15 Konica Minolta Opto Inc プリント基板及び撮像装置並びにカメラ
US20140354900A1 (en) * 2013-06-03 2014-12-04 Apple Inc. Flexible Printed Circuit Cables With Slits

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JPH1070344A (ja) * 1996-08-26 1998-03-10 Sony Corp フレキシブル配線基板
JPH11317130A (ja) * 1998-04-30 1999-11-16 Fujikura Ltd メンブレンスイッチ
JP3980933B2 (ja) * 2002-05-23 2007-09-26 ローム株式会社 イメージセンサモジュールの製造方法
US6998721B2 (en) * 2002-11-08 2006-02-14 Stmicroelectronics, Inc. Stacking and encapsulation of multiple interconnected integrated circuits
US8358816B2 (en) 2005-10-18 2013-01-22 Authentec, Inc. Thinned finger sensor and associated methods
JP4753749B2 (ja) 2006-03-03 2011-08-24 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
JP5003113B2 (ja) * 2006-11-16 2012-08-15 三菱電機株式会社 フレキシブル配線基板の接続構造
US8511229B2 (en) * 2007-05-09 2013-08-20 Amish Desai Multilayered microcavities and actuators incorporating same
JP5380849B2 (ja) * 2008-02-07 2014-01-08 船井電機株式会社 撮像装置
JP2010040720A (ja) 2008-08-04 2010-02-18 Sharp Corp フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器
JP5574157B2 (ja) 2010-03-16 2014-08-20 株式会社リコー 撮像装置の組み立て方法および撮像装置
JP5622443B2 (ja) * 2010-06-08 2014-11-12 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット
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CN203840633U (zh) * 2014-04-22 2014-09-17 华为技术有限公司 一种柔性电路板及信号传输装置
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DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122656A1 (ja) * 2004-06-10 2005-12-22 Ibiden Co., Ltd. フレックスリジッド配線板およびその製造方法
JP2007043129A (ja) * 2005-07-08 2007-02-15 Konica Minolta Opto Inc プリント基板及び撮像装置並びにカメラ
US20140354900A1 (en) * 2013-06-03 2014-12-04 Apple Inc. Flexible Printed Circuit Cables With Slits

Also Published As

Publication number Publication date
EP3533301A1 (de) 2019-09-04
US11116076B2 (en) 2021-09-07
JP2020506537A (ja) 2020-02-27
US20190357352A1 (en) 2019-11-21
DE102017200817A1 (de) 2018-07-19
WO2018133893A1 (de) 2018-07-26
JP7562257B2 (ja) 2024-10-07
CN110178451A (zh) 2019-08-27
CN119093038A (zh) 2024-12-06
DE112017005644A5 (de) 2019-08-22
KR20190104539A (ko) 2019-09-10

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