DE102017200817A1 - Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera - Google Patents

Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera Download PDF

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Publication number
DE102017200817A1
DE102017200817A1 DE102017200817.2A DE102017200817A DE102017200817A1 DE 102017200817 A1 DE102017200817 A1 DE 102017200817A1 DE 102017200817 A DE102017200817 A DE 102017200817A DE 102017200817 A1 DE102017200817 A1 DE 102017200817A1
Authority
DE
Germany
Prior art keywords
flexible
connection
layer
trace
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102017200817.2A
Other languages
German (de)
English (en)
Inventor
Konrad Rothenhäusler
Franz Pfeiffer
Thilo Berg
Jos Becher
Andreas Schleinkofer
Martin Vallendor
Matthias Dropmann
Oscar Torres Alsina
Steffen Görmer
Patrick Albrecht
Hendrik Powileit
Dieter Krökel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE102017200817.2A priority Critical patent/DE102017200817A1/de
Priority to PCT/DE2017/200126 priority patent/WO2018133893A1/de
Priority to US16/478,991 priority patent/US11116076B2/en
Priority to EP17832037.0A priority patent/EP3533301A1/de
Priority to CN202411182411.7A priority patent/CN119093038A/zh
Priority to JP2019537334A priority patent/JP7562257B2/ja
Priority to DE112017005644.6T priority patent/DE112017005644A5/de
Priority to CN201780083640.5A priority patent/CN110178451A/zh
Priority to KR1020197020149A priority patent/KR102474026B1/ko
Publication of DE102017200817A1 publication Critical patent/DE102017200817A1/de
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • H05K1/0281Reinforcement details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Lens Barrels (AREA)
  • Combinations Of Printed Boards (AREA)
DE102017200817.2A 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera Withdrawn DE102017200817A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102017200817.2A DE102017200817A1 (de) 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
PCT/DE2017/200126 WO2018133893A1 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
US16/478,991 US11116076B2 (en) 2017-01-19 2017-12-05 Flexible conductor track for connecting electronic modules, particularly modules of a camera to be installed in a vehicle
EP17832037.0A EP3533301A1 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
CN202411182411.7A CN119093038A (zh) 2017-01-19 2017-12-05 连接电子模块、尤其是安装在车辆中的摄像机的模块的柔性的印制导线
JP2019537334A JP7562257B2 (ja) 2017-01-19 2017-12-05 電子モジュール、特に乗物搭載用に構成されるカメラのモジュール接続用可撓性導体トラック
DE112017005644.6T DE112017005644A5 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
CN201780083640.5A CN110178451A (zh) 2017-01-19 2017-12-05 连接电子模块、尤其是安装在车辆中的摄像机的模块的柔性的印制导线
KR1020197020149A KR102474026B1 (ko) 2017-01-19 2017-12-05 전자 모듈을, 특히 차량 장착용으로 계획한 모듈을 연결하기 위한 가요성 인쇄회로기판 트랙

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102017200817.2A DE102017200817A1 (de) 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Publications (1)

Publication Number Publication Date
DE102017200817A1 true DE102017200817A1 (de) 2018-07-19

Family

ID=61002771

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102017200817.2A Withdrawn DE102017200817A1 (de) 2017-01-19 2017-01-19 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
DE112017005644.6T Pending DE112017005644A5 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112017005644.6T Pending DE112017005644A5 (de) 2017-01-19 2017-12-05 Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

Country Status (7)

Country Link
US (1) US11116076B2 (https=)
EP (1) EP3533301A1 (https=)
JP (1) JP7562257B2 (https=)
KR (1) KR102474026B1 (https=)
CN (2) CN119093038A (https=)
DE (2) DE102017200817A1 (https=)
WO (1) WO2018133893A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera
GB201910805D0 (en) 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
JP2021068795A (ja) * 2019-10-23 2021-04-30 ソニーセミコンダクタソリューションズ株式会社 光源装置
WO2022058006A1 (en) 2020-09-16 2022-03-24 Leonardo UK Ltd Circuit board assembly
CN113038696B (zh) * 2021-03-02 2022-06-14 广德新三联电子有限公司 一种汽车用高耐弯性电路板及其制备方法
WO2023036295A1 (zh) * 2021-09-10 2023-03-16 宁波舜宇光电信息有限公司 用于摄像模组的线路板及相应的摄像模组
US11863695B2 (en) * 2021-09-23 2024-01-02 Motorola Mobility Llc Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures

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US20090257626A1 (en) 2005-10-18 2009-10-15 Authentec, Inc. Thinned finger sensor and associated methods
US20130032381A1 (en) 2011-08-02 2013-02-07 Kabushiki Kaisha Toshiba Flexible wiring module and flexible wiring device
WO2017003531A1 (en) 2015-06-30 2017-01-05 Apple Inc. Electronic devices with soft input-output components

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JPH1070344A (ja) * 1996-08-26 1998-03-10 Sony Corp フレキシブル配線基板
JPH11317130A (ja) * 1998-04-30 1999-11-16 Fujikura Ltd メンブレンスイッチ
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US6998721B2 (en) * 2002-11-08 2006-02-14 Stmicroelectronics, Inc. Stacking and encapsulation of multiple interconnected integrated circuits
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JP2007043129A (ja) * 2005-07-08 2007-02-15 Konica Minolta Opto Inc プリント基板及び撮像装置並びにカメラ
JP4753749B2 (ja) 2006-03-03 2011-08-24 日東電工株式会社 配線回路基板集合体シートおよびその製造方法
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DE102017200817A1 (de) * 2017-01-19 2018-07-19 Conti Temic Microelectronic Gmbh Flexible leiterbahn zur verbindung elektronischer module, insbesondere von modulen einer für den einbau in ein fahrzeug vorgesehenen kamera

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Publication number Priority date Publication date Assignee Title
US20090257626A1 (en) 2005-10-18 2009-10-15 Authentec, Inc. Thinned finger sensor and associated methods
US20130032381A1 (en) 2011-08-02 2013-02-07 Kabushiki Kaisha Toshiba Flexible wiring module and flexible wiring device
WO2017003531A1 (en) 2015-06-30 2017-01-05 Apple Inc. Electronic devices with soft input-output components

Also Published As

Publication number Publication date
EP3533301A1 (de) 2019-09-04
US11116076B2 (en) 2021-09-07
JP2020506537A (ja) 2020-02-27
US20190357352A1 (en) 2019-11-21
WO2018133893A1 (de) 2018-07-26
JP7562257B2 (ja) 2024-10-07
KR102474026B1 (ko) 2022-12-02
CN110178451A (zh) 2019-08-27
CN119093038A (zh) 2024-12-06
DE112017005644A5 (de) 2019-08-22
KR20190104539A (ko) 2019-09-10

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R163 Identified publications notified
R118 Application deemed withdrawn due to claim for domestic priority