WO2018105388A1 - Ｓｎめっき材およびその製造方法 - Google Patents

Ｓｎめっき材およびその製造方法 Download PDF

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Publication number
WO2018105388A1
WO2018105388A1 PCT/JP2017/041827 JP2017041827W WO2018105388A1 WO 2018105388 A1 WO2018105388 A1 WO 2018105388A1 JP 2017041827 W JP2017041827 W JP 2017041827W WO 2018105388 A1 WO2018105388 A1 WO 2018105388A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
plating
plating layer
thickness
alloy
Prior art date
Application number
PCT/JP2017/041827
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
宏人 成枝
悠太 園田
龍大 土井
隆夫 冨谷
Original Assignee
Ｄｏｗａメタルテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016236780A external-priority patent/JP6734185B2/ja
Priority claimed from JP2017221415A external-priority patent/JP6940380B2/ja
Application filed by Ｄｏｗａメタルテック株式会社 filed Critical Ｄｏｗａメタルテック株式会社
Priority to KR1020197019265A priority Critical patent/KR102385215B1/ko
Priority to US16/462,695 priority patent/US10985485B2/en
Priority to CN201780075131.8A priority patent/CN110036142B/zh
Priority to MX2019006540A priority patent/MX2019006540A/es
Priority to DE112017005628.4T priority patent/DE112017005628B4/de
Publication of WO2018105388A1 publication Critical patent/WO2018105388A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Definitions

  • electric wires made of aluminum or aluminum alloys having a specific gravity smaller than that of copper or copper alloys have been used as electric wires for wire harnesses for vehicles in order to improve fuel efficiency by reducing the weight of vehicles.
  • the electric wire connecting terminal according to the present invention is a connecting terminal using a Sn plating material in which an Sn-containing layer is formed on the surface of a base material made of copper or a copper alloy, and the Sn-containing layer is Cu—Sn. It is composed of an alloy layer and an Sn layer made of Sn having a thickness of 5 ⁇ m or less formed on the surface of the Cu—Sn alloy layer, and a Ni plating layer is formed on the surface of the Sn-containing layer at a portion other than the connection portion with the electric wire.
  • the Zn plating layer is formed on the surface of the Ni plating layer.
  • the Sn plating material thus produced was evaluated for adhesion and corrosion resistance by the same method as in Example 9. As a result, there was no peeling of the Zn plating layer, the adhesion was good, and the gas was removed. The generation time was as long as 144 hours, and the corrosion resistance was good. Further, when the Vickers hardness HV, arithmetic average roughness Ra, glossiness, and arithmetic average roughness Ra of the surface of the bent portion of the fold-folded portion were obtained, the Vickers hardness HV was 62.5, the arithmetic average. The roughness Ra was 0.11 ⁇ m, the glossiness was 0.17, and the arithmetic average roughness Ra of the surface of the bent portion of the mountain fold was 1.0 ⁇ m.
  • said Cu plating layer has a current density of 5 A / dm 2 , a liquid in a Cu plating solution containing 110 g / L of copper sulfate and 100 g / L of sulfuric acid, with the base material as the cathode and the Cu electrode plate as the anode. It was formed by performing electroplating at a temperature of 30 ° C. for 40 seconds.
  • the Sn plating material thus produced was evaluated for corrosion resistance by the same method as in Example 9. As a result, the time until gas was generated was very short, 24 hours, and the corrosion resistance was poor.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
PCT/JP2017/041827 2016-12-06 2017-11-21 Ｓｎめっき材およびその製造方法 WO2018105388A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020197019265A KR102385215B1 (ko) 2016-12-06 2017-11-21 Sn 도금재 및 그의 제조 방법
US16/462,695 US10985485B2 (en) 2016-12-06 2017-11-21 Tin-plated product and method for producing same
CN201780075131.8A CN110036142B (zh) 2016-12-06 2017-11-21 Sn镀覆材料及其制造方法
MX2019006540A MX2019006540A (es) 2016-12-06 2017-11-21 Producto estañado y método para producir el mismo.
DE112017005628.4T DE112017005628B4 (de) 2016-12-06 2017-11-21 Verzinntes Produkt und elektrische Drahtanschlussklemme mit einem verzinnten Produkt

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2016236780A JP6734185B2 (ja) 2016-12-06 2016-12-06 Ｓｎめっき材およびその製造方法
JP2016-236780 2016-12-06
JP2017-056366 2017-03-22
JP2017056366 2017-03-22
JP2017221415A JP6940380B2 (ja) 2017-03-22 2017-11-17 Ｓｎめっき材およびその製造方法
JP2017-221415 2017-11-17

Publications (1)

Publication Number Publication Date
WO2018105388A1 true WO2018105388A1 (ja) 2018-06-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/041827 WO2018105388A1 (ja) 2016-12-06 2017-11-21 Ｓｎめっき材およびその製造方法

Country Status (3)

Country Link
KR (1) KR102385215B1 (ko)
TW (1) TWI719270B (ko)
WO (1) WO2018105388A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109149199A (zh) * 2018-08-10 2019-01-04 北京小米移动软件有限公司 Type-C USB插头的生产方法及Type-C USB插头
CN109149317A (zh) * 2018-08-10 2019-01-04 北京小米移动软件有限公司 Micro USB插头的生产方法及Micro USB插头

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7415287B2 (ja) * 2019-04-26 2024-01-17 住友電気工業株式会社 アルミニウム基線材、撚り線、及びアルミニウム基線材の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013134891A (ja) * 2011-12-26 2013-07-08 Yazaki Corp 端子
JP2015053251A (ja) * 2013-02-24 2015-03-19 古河電気工業株式会社 端子の製造方法、端子、電線の終端接続構造体の製造方法、および電線の終端接続構造体
JP2016044346A (ja) * 2014-08-25 2016-04-04 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5385683B2 (ja) * 2009-05-22 2014-01-08 矢崎総業株式会社 コネクタ端子
TWI485930B (zh) * 2012-10-04 2015-05-21 Jx Nippon Mining & Metals Corp Metal material for electronic parts and manufacturing method thereof
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP2015110829A (ja) * 2013-10-30 2015-06-18 三菱マテリアル株式会社 錫めっき銅合金端子材
US20170283910A1 (en) * 2014-08-25 2017-10-05 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Conductive material for connection parts which has excellent minute slide wear resistance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013134891A (ja) * 2011-12-26 2013-07-08 Yazaki Corp 端子
JP2015053251A (ja) * 2013-02-24 2015-03-19 古河電気工業株式会社 端子の製造方法、端子、電線の終端接続構造体の製造方法、および電線の終端接続構造体
JP2016044346A (ja) * 2014-08-25 2016-04-04 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109149199A (zh) * 2018-08-10 2019-01-04 北京小米移动软件有限公司 Type-C USB插头的生产方法及Type-C USB插头
CN109149317A (zh) * 2018-08-10 2019-01-04 北京小米移动软件有限公司 Micro USB插头的生产方法及Micro USB插头

Also Published As

Publication number Publication date
TW201825284A (zh) 2018-07-16
KR102385215B1 (ko) 2022-04-08
TWI719270B (zh) 2021-02-21
KR20190087623A (ko) 2019-07-24

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