WO2018080222A3 - 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름 - Google Patents

폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름 Download PDF

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WO2018080222A3
WO2018080222A3 PCT/KR2017/011975 KR2017011975W WO2018080222A3 WO 2018080222 A3 WO2018080222 A3 WO 2018080222A3 KR 2017011975 W KR2017011975 W KR 2017011975W WO 2018080222 A3 WO2018080222 A3 WO 2018080222A3
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polyimide film
polyimide
forming composition
film forming
same
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PCT/KR2017/011975
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French (fr)
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WO2018080222A2 (ko
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신보라
서준식
윤철민
정혜원
김경준
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주식회사 엘지화학
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Priority to CN201780061202.9A priority Critical patent/CN109843980B/zh
Priority to US16/345,523 priority patent/US11261304B2/en
Priority to JP2019509469A priority patent/JP6756424B2/ja
Priority to EP17863849.0A priority patent/EP3505556B1/en
Publication of WO2018080222A2 publication Critical patent/WO2018080222A2/ko
Publication of WO2018080222A3 publication Critical patent/WO2018080222A3/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

본 발명은 분자내 이미드기를 포함하는 디아민으로부터 제조된 폴리아믹산 또는 폴리이미드를 올리고머 또는 저분자량의 형태로 포함하는 폴리이미드 필름 형성용 조성물을 제공함으로써, 광학적 특성을 유지하면서 필름의 내열성이 향상된 폴리이미드 필름을 제공할 수 있다. 또한, 본 발명에 따른 폴리이미드 필름은 레이저 박리 공정시 필요한 레이저 에너지 밀도(E/D)의 감소뿐만 아니라 박리공정에 의해 발생되는 재(ash)가 현저히 감소될 수 있어, 디스플레이 제조공정에서의 소자의 신뢰성을 보다 향상시킬 수 있다.
PCT/KR2017/011975 2016-10-31 2017-10-27 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름 WO2018080222A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201780061202.9A CN109843980B (zh) 2016-10-31 2017-10-27 形成聚酰亚胺膜的组合物和通过使用其制造的聚酰亚胺膜
US16/345,523 US11261304B2 (en) 2016-10-31 2017-10-27 Polyimide film forming composition and polyimide film produced by using same
JP2019509469A JP6756424B2 (ja) 2016-10-31 2017-10-27 ポリイミドフィルム形成用組成物及びそれを用いて製造されたポリイミドフィルム
EP17863849.0A EP3505556B1 (en) 2016-10-31 2017-10-27 Polyimide film forming composition and polyimide film produced by using same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0143297 2016-10-31
KR1020160143297A KR102079423B1 (ko) 2016-10-31 2016-10-31 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름

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WO2018080222A2 WO2018080222A2 (ko) 2018-05-03
WO2018080222A3 true WO2018080222A3 (ko) 2018-11-22

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Country Link
US (1) US11261304B2 (ko)
EP (1) EP3505556B1 (ko)
JP (1) JP6756424B2 (ko)
KR (1) KR102079423B1 (ko)
CN (1) CN109843980B (ko)
TW (1) TWI648315B (ko)
WO (1) WO2018080222A2 (ko)

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KR102008766B1 (ko) * 2017-01-31 2019-08-09 주식회사 엘지화학 가요성 기판 제조용 적층체 및 이를 이용한 가요성 기판의 제조방법
KR102333188B1 (ko) * 2018-05-14 2021-11-30 주식회사 엘지화학 방열특성이 우수한 플렉서블 디스플레이 소자 기판용 폴리이미드 필름
KR102289812B1 (ko) * 2018-08-20 2021-08-13 주식회사 엘지화학 폴리이미드 전구체 조성물, 이를 이용하여 제조된 폴리이미드 필름 및 플렉서블 디바이스
US20210193519A1 (en) * 2019-12-19 2021-06-24 Intel Corporation Inorganic dies with organic interconnect layers and related structures
KR20210086114A (ko) 2019-12-31 2021-07-08 주식회사 동진쎄미켐 폴리이미드 필름, 폴리이미드 조성물 및 이를 이용한 필름 제조 방법
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EP3505556B1 (en) 2020-04-15
CN109843980B (zh) 2021-06-15
JP2019528354A (ja) 2019-10-10
US20190276618A1 (en) 2019-09-12
WO2018080222A2 (ko) 2018-05-03
JP6756424B2 (ja) 2020-09-16
EP3505556A4 (en) 2019-10-23
TWI648315B (zh) 2019-01-21
KR20180047322A (ko) 2018-05-10
TW201817777A (zh) 2018-05-16
CN109843980A (zh) 2019-06-04
KR102079423B1 (ko) 2020-02-19
EP3505556A2 (en) 2019-07-03
US11261304B2 (en) 2022-03-01

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