WO2018061754A1 - 架橋性オルガノポリシロキサン組成物、その硬化物及びled装置 - Google Patents
架橋性オルガノポリシロキサン組成物、その硬化物及びled装置 Download PDFInfo
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- WO2018061754A1 WO2018061754A1 PCT/JP2017/032915 JP2017032915W WO2018061754A1 WO 2018061754 A1 WO2018061754 A1 WO 2018061754A1 JP 2017032915 W JP2017032915 W JP 2017032915W WO 2018061754 A1 WO2018061754 A1 WO 2018061754A1
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- alkenyl
- carbon atoms
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 98
- 239000000203 mixture Substances 0.000 title claims abstract description 83
- -1 biphenylyl group Chemical group 0.000 claims abstract description 48
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 44
- 125000003118 aryl group Chemical group 0.000 claims abstract description 44
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 23
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 46
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 26
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 125000000962 organic group Chemical group 0.000 claims description 8
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 7
- 125000004429 atom Chemical group 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000010703 silicon Substances 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 52
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 15
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 7
- 125000001624 naphthyl group Chemical group 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 4
- 125000006038 hexenyl group Chemical group 0.000 description 4
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 4
- 229910002808 Si–O–Si Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002683 reaction inhibitor Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a crosslinkable organopolysiloxane composition, a cured product obtained by curing the composition, and an LED device having the cured product.
- the silicone composition forms a cured product having excellent rubber properties such as weather resistance, heat resistance, hardness, and elongation, it is used for the purpose of protecting LED elements, electrodes, substrates and the like in LED devices.
- a high refractive index type addition silicone composition having a small shrinkage at the time of curing and good light extraction efficiency is preferably used.
- the LED device may use silver or a silver-containing alloy having good conductivity as an electrode, and the substrate may be silver-plated in order to improve luminance.
- the silicone composition is a general name for a composition containing a compound having a chemical structure of organopolysiloxane, and is synonymous in this technical field.
- a cured product made of a silicone composition has high gas permeability, and when used for a high-brightness LED with high light intensity and large heat generation, a sealing material due to the invasion of corrosive gas or water vapor in the environment. There is a problem that the brightness is lowered due to the discoloration of silver, the corrosion of silver plated on the electrodes and the substrate, and the adhesive strength.
- Patent Document 1 (A) a diorganopolysiloxane containing at least two alkenyl groups bonded to a silicon atom, (B) SiO 4/2 unit, Vi (R 2 ) 2 SiO 1/2 unit and R 2 3 Organopolysiloxane having a resin structure composed of SiO 1/2 units, (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule, and (D) a platinum group metal catalyst
- A a diorganopolysiloxane containing at least two alkenyl groups bonded to a silicon atom
- B SiO 4/2 unit, Vi (R 2 ) 2 SiO 1/2 unit and R 2 3
- Organopolysiloxane having a resin structure composed of SiO 1/2 units
- C an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule
- D platinum group metal catalyst
- Patent Document 2 (A) an organopolysiloxane represented by an average unit formula, any (B) a straight chain having at least two alkenyl groups in one molecule and having no silicon-bonded hydrogen atom
- a curable silicone composition comprising at least an organopolysiloxane, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and (D) a catalyst for hydrosilylation reaction.
- the curable silicone composition described in Patent Document 2 is an organopolysiloxane that has a high hydrosilylation reactivity and forms a cured product having a low gas permeability, a high reactivity, and a low gas permeability. It is said that a curable silicone composition that forms a cured product and a cured product with low gas permeability are provided.
- the present invention has been made in view of the above circumstances, and the object of the present invention is to maintain heat-resistant transparency and adhesion to an LED substrate, and in a harsh environment of 80 ° C. atmosphere where sulfur exists.
- Another object of the present invention is to provide a crosslinkable organopolysiloxane composition in which silver plating is not corroded, a cured product obtained by curing the composition, and an LED device having the cured product.
- the cured product of the present invention is obtained by curing the crosslinkable organopolysiloxane composition.
- the cured product preferably has a refractive index of 1.58 or more at 25 ° C., more preferably 1.59 or more, and particularly preferably 1.60 or more.
- the LED device of the present invention is characterized in that the LED element is sealed with a cured product of the crosslinkable organopolysiloxane composition.
- the crosslinkable organopolysiloxane composition of the present invention should be stored separately from the component (D) and the component (C) in order to prevent the curing reaction from proceeding during storage.
- the crosslinkable organopolysiloxane composition of the present invention is prepared by, for example, mixing a solution containing the component (A) and the component (C) with a solution containing the component (B) and the component (D). Can be prepared.
- the crosslinkable organopolysiloxane composition of the present invention forms a cured product excellent in high refractive index and corrosive gas shielding property (sulfuration resistance) while maintaining the heat-resistant transparency and excellent adhesion of the organopolysiloxane. Therefore, it is useful as a sealing material for LED.
- the LED device in which the LED element is sealed with a cured product of the crosslinkable organopolysiloxane composition according to the present invention is characterized by excellent reliability in an atmosphere containing sulfur. Such an LED device can be expected to have a high light extraction effect.
- Siloxane A compound having a Si—O—Si bond.
- Polysiloxane A compound having a plurality of Si—O—Si bonds.
- Organopolysiloxane A polysiloxane having a structure in which organic groups are bonded to Si atoms constituting Si—O—Si bonds.
- Organopolysiloxane composition A composition containing at least an organopolysiloxane and formulated for specific performance.
- the linear organopolysiloxane is an organo having no structure in which the siloxane chain is connected to the main chain of the polysiloxane (—Si—O—Si—O—chain) via an atom linking group on the Si atom. It refers to polysiloxane. Also called linear component.
- the branched organopolysiloxane refers to an organopolysiloxane containing at least one T-type or cross-shaped branch point.
- the component (A) is an important component that is combined with the component (B) and affects the physical properties of the crosslinked organopolysiloxane composition.
- This component (A) contains an aryl group containing at least one biphenylyl group, corrosion gas resistance, refractive index, and dicing properties can be improved.
- R 1 is a monovalent hydrocarbon group having 1 to 14 carbon atoms, and among the monovalent hydrocarbon groups, at least one is an alkenyl group having 2 to 6 carbon atoms and at least one is An aryl group, and at least one of the aryl groups is a biphenylyl group.
- the plurality of R 1 may be the same as or different from each other.
- monovalent hydrocarbon groups include alkyl groups having 1 to 6 carbon atoms, alkenyl groups having 2 to 6 carbon atoms, aryl groups having 6 to 14 carbon atoms, and the like.
- Examples of the group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are preferable.
- Examples of the aryl group having 6 to 14 carbon atoms include a biphenylyl group as an essential component, and a substituted or unsubstituted phenyl group, naphthyl group, and anthracenyl group.
- Examples of the alkenyl group having 2 to 6 carbon atoms include vinyl group, allyl group, butenyl group, pentenyl group and hexenyl group.
- R 2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, preferably a methyl group, an ethyl group It is.
- the plurality of R 2 may be the same as or different from each other.
- a represents a number indicating the ratio of siloxane units represented by the general formula: R 1 3 SiO 1/2 and satisfies 0 ⁇ a ⁇ 0.1, preferably 0 ⁇ a ⁇ 0.08. Is a number. This is because sufficient strength and hardness at room temperature of a cured product obtained by excessively high fluidity when a exceeds the upper limit of the above range (in this specification, cured product is synonymous with crosslinked product) can be obtained. Because it disappears.
- b represents a number indicating the ratio of the siloxane unit represented by the general formula: R 1 2 SiO 2/2 , and a number satisfying 0.2 ⁇ b ⁇ 0.9, preferably 0.3 ⁇ b ⁇ 0.7. It is.
- c represents a number indicating the ratio of siloxane units represented by the general formula: R 1 SiO 3/2 , and 0.1 ⁇ c ⁇ 0.6, preferably 0.2 ⁇ c ⁇ 0. It is a number satisfying 6. This is because when c is less than the lower limit of the above range, sufficient hardness at room temperature of the obtained cured product cannot be obtained, whereas when the upper limit of the above range is exceeded, the obtained cured product is acceptable.
- D represents a number indicating the ratio of the siloxane unit represented by the general formula: SiO 4/2 , and is a number satisfying 0 ⁇ d ⁇ 0.2, preferably 0 ⁇ d ⁇ 0.1. This is because when d exceeds the upper limit of the above range, the flexibility of the obtained cured product becomes insufficient.
- E represents a number indicating the proportion of the end of the branched organosiloxane represented by the general formula: R 2 O 1/2 and is a number satisfying 0 ⁇ e ⁇ 0.1. This is because sufficient hardness at room temperature of the cured product obtained when e exceeds the upper limit of the above range cannot be obtained.
- the sum of a, b, c, d and e is 1.
- the component (A) is represented by an average unit formula: (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c .
- the component (B) is an important second component that is combined with the component (A) and determines the physical properties of the crosslinked organopolysiloxane composition, and includes at least two alkenyl groups and at least one aryl group in one molecule. And having at least three terminal siloxane units of polysiloxane represented by the general formula (1): R 3 3 SiO 1/2 in one molecule, and having a viscosity of 20 Pa ⁇ s or less at 25 ° C. An alkenyl-functional branched organopolysiloxane containing an aryl group.
- the component (B) preferably has fluidity with a viscosity of 20 Pa ⁇ s or less at 25 ° C.
- R 3 represents a substituted or unsubstituted monovalent hydrocarbon group.
- monovalent hydrocarbon groups include alkyl groups having 1 to 6 carbon atoms, alkenyl groups having 2 to 6 carbon atoms, aryl groups having 6 to 14 carbon atoms, and the like.
- the group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are preferable.
- Examples of the aryl group having 6 to 14 carbon atoms include a substituted or unsubstituted biphenylyl group, a phenyl group, a naphthyl group, and an anthracenyl group.
- Examples of the alkenyl group having 2 to 6 carbon atoms include vinyl group, allyl group, butenyl group, pentenyl group and hexenyl group.
- a plurality of R 3 may be the same as or different from each other. Even in the branched organopolysiloxane, by having at least three terminal siloxane units of polysiloxane represented by the general formula: R 3 3 SiO 1/2 in one molecule, the viscosity is 100 Pa ⁇ s at 25 ° C.
- a polysiloxane having the following fluidity can be obtained. Further, by controlling the production method of the component (B), the molecular weight of the alkenyl functional branched organopolysiloxane having a three-dimensional structure can be controlled within a preferable range, and the fluidity at a viscosity of 25 ° C. or less is preferable. A polysiloxane having While having this branched structure and having fluidity at 25 ° C., a composition having a high curing speed and no surface tack of the cured product can be obtained.
- the component (B) has a viscosity of preferably 50000 mPa ⁇ s or less at 25 ° C., more preferably 30000 mPa ⁇ s or less, and particularly preferably 20000 mPa ⁇ s or less.
- R 4 is a monovalent hydrocarbon group having 1 to 14 carbon atoms, and at least two of the monovalent hydrocarbon groups are alkenyl groups having 2 to 6 carbon atoms and at least one is aryl. It is a group.
- Examples of monovalent hydrocarbon groups include alkyl groups having 1 to 6 carbon atoms, alkenyl groups having 2 to 6 carbon atoms, aryl groups having 6 to 14 carbon atoms, and the like.
- Examples of the group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are preferable.
- Examples of the aryl group having 6 to 14 carbon atoms include a substituted or unsubstituted biphenylyl group, a phenyl group, a naphthyl group, and an anthracenyl group.
- alkenyl group having 2 to 6 carbon atoms examples include vinyl group, allyl group, butenyl group, pentenyl group and hexenyl group.
- the plurality of R 4 may be the same as or different from each other.
- f is a number that defines the amount of terminal siloxane units of the polysiloxane represented by the general formula: R 4 3 SiO 1/2 for obtaining fluidity of 20 Pa ⁇ s or less at 25 ° C.
- h and i Is a number that defines the component for the organopolysiloxane to take a branched structure, and both f and h + i must be greater than zero.
- the ratio of the amount of terminal siloxane units of the polysiloxane represented by the general formula: R 3 3 SiO 1/2 with respect to the branch point f / (h + i) Must be greater than or equal to 0.5, with a maximum of 4.
- the linear component represented by the general formula: R 4 2 SiO 2/2 is not necessarily an essential component, but may be introduced as a component in the polymer in order to obtain a necessary viscosity, and 0 ⁇ g ⁇ 0. Although it may be in the range of 96, it is preferable that 0 ⁇ g ⁇ 0.90.
- (B) component is an average composition formula (R 4 3 SiO (R 4 2 SiO) m ) e SiR 4 (4-e) (wherein R 4 is a monovalent hydrocarbon group having 1 to 14 carbon atoms ) Among the monovalent hydrocarbon groups, at least two are alkenyl groups having 2 to 6 carbon atoms and at least one is an aryl group, m represents an integer of 0 to 200, and e is 3 Or an alkenyl-functional branched organopolysiloxane containing an aryl group represented by (4).
- m represents the number of linear siloxane units, and is an integer satisfying 0 ⁇ m ⁇ 200, preferably 0 ⁇ m ⁇ 100.
- e represents 3 or 4, and is a number that defines the structure for forming the branch point of the branched organopolysiloxane.
- e When e is 3, it becomes a T-type branch point, and when e is 4. It becomes a cross-shaped branch point.
- R 5 represents an alkenyl group having 2 to 6 carbon atoms, and examples thereof include a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexenyl group
- R 6 represents the number of carbon atoms in which at least one is an aryl group.
- alkyl group 6 examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are preferable.
- aryl group having 6 to 14 carbon atoms include a substituted or unsubstituted phenyl group, biphenylyl group, naphthyl group, and anthracenyl group.
- the plurality of R 5 , R 6 and R 7 may be the same as or different from each other.
- n represents the number of linear siloxane units, and is an integer satisfying 0 ⁇ n ⁇ 200, preferably 0 ⁇ n ⁇ 100. This is because when n exceeds the upper limit of the above range, the viscosity of the obtained branched organopolysiloxane exceeds 20 Pa ⁇ s at 25 ° C.
- R 7 represents a monovalent hydrocarbon group having 1 to 14 carbon atoms which does not contain an alkenyl group, and is a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, substituted or unsubstituted
- aryl groups such as biphenylyl, phenyl, naphthyl, and anthracenyl groups.
- j represents 3 or 4, and is a number defining a structure for forming a branch point of the branched organopolysiloxane. When j is 3, a T-type branch point is obtained, and j is 4 In this case, it becomes a cross-shaped branch point.
- the mixing ratio of the component (A) and the component (B) is such that the weight ratio of A / B is 1/100 to 100/1, and 1/50 to 50/1. It is preferable that the ratio is 1/20 to 20/1.
- the amounts of the component (A) and the component (B) are described in parts by weight, and those skilled in the art will show the mixing ratio of the component (A) and the component (B) in the present specification in a weight ratio. It is self-evident.
- Component (C) is a crosslinking agent of the crosslinkable organopolysiloxane composition of the present invention (hereinafter also referred to as the present composition), and has at least two silicon atom-bonded hydrogen atoms in one molecule.
- Organopolysiloxane in which 12 to 70 mol% of the combined organic groups are aryl groups.
- an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group, a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, a phenyl group
- Examples include aryl groups such as a tolyl group, a naphthyl group, an anthracenyl group, and a biphenylyl group.
- 12 to 70 mol% of the silicon-bonded organic group is an aryl group.
- a silicon atom-bonded hydrogen atom is synonymous with Si—H.
- R 8 is a monovalent hydrocarbon group having 1 to 14 carbon atoms, and at least one of the monovalent hydrocarbon groups is an aryl group, and the monovalent hydrocarbon group includes a carbon atom. Examples thereof include alkyl groups having 1 to 6 carbon atoms and aryl groups having 6 to 14 carbon atoms.
- alkyl groups having 1 to 6 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples thereof include a methyl group and an ethyl group.
- Examples of the aryl group having 6 to 14 carbon atoms include substituted or unsubstituted biphenylyl group, phenyl group, naphthyl group, and anthracenyl group.
- a plurality of R 8 may be the same as or different from each other. Of R 8 , the aryl group content is in the range of 12 to 70 mol%.
- the content of component (C) is such that the molar ratio of silicon-bonded hydrogen atoms in this component to the total of alkenyl groups in component (A) and component (B) is 0.5-2.
- the component (D) is a hydrosilylation reaction catalyst for accelerating the hydrosilylation reaction between the alkenyl groups of the components (A) and (B) and the silicon atom-bonded hydrogen atom in the component (C).
- the component (D) include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, and platinum-based catalysts are preferred because they can significantly accelerate the crosslinking of the composition.
- a platinum-alkenylsiloxane complex is preferable because of its high catalytic activity, and since the stability of the complex is good, it has 1,3-divinyl-1,1,3,3-tetramethyldisiloxane as a ligand. Platinum complexes are preferred.
- the content of the component (D) is an amount sufficient to promote the hydrosilylation reaction between the alkenyl group of the component (A), the component (B), and the silicon atom-bonded hydrogen atom of the component (C).
- the amount of the metal atom in component (D) in the composition (D) is in the range of 0.1 ppm to 100 ppm in terms of weight (usually synonymous with mass). This is because if the content of component (D) is less than the lower limit of the above range, the resulting composition will not be sufficiently crosslinked, or will not be crosslinked at a sufficient rate, while exceeding the upper limit of the above range. This is because problems such as coloring may occur in the obtained cured product.
- the present composition contains the above components (A) to (D), but a reaction inhibitor may be added as an optional component for the purpose of arbitrarily changing the curing rate.
- Reaction inhibitors include 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, alkyne alcohols such as ethynylcyclohexanol, 1,3,5,7-tetramethyl-1 , 3,5,7-tetravinylcyclotetrasiloxane, benzotriazole and the like.
- the content of these reaction inhibitors is not particularly limited, but is preferably in the range of 1 ppm to 1000 ppm with respect to the weight of the present composition.
- an adhesion promoter may be contained in the present composition when adhesion to a substrate is required depending on the use.
- the adhesion promoter include trialkoxysilyl groups (for example, trimethoxysilyl group and triethoxysilyl group), hydrosilyl groups, epoxy groups (for example, 3-glycidoxypropyl group), alkenyl groups (for example, vinyl group and allyl group). Group) in one molecule, and the like.
- the present composition includes, as the other optional components, organopolysiloxanes other than the components (A) to (C), inorganic fillers (for example, silica, glass, alumina), as long as the object of the present invention is not impaired. , Zinc oxide, etc.), organic resin fine powder such as polymethacrylate resin, heat-resistant agent, dye, pigment, phosphor, flame retardant, solvent and the like.
- organopolysiloxane other than the component (A) to the component (C) include linear alkenyl functional organopolysiloxanes.
- the crosslinkable organopolysiloxane composition of the present invention has a straight chain of alkenyl functional groups.
- a crosslinkable organopolysiloxane composition having good characteristics can be obtained by using the component (B) without using a linear alkenyl functional organopolysiloxane which has been conventionally considered an essential component. can get.
- the preferable range of the viscosity of the present composition is the same as the preferable range of the viscosity of the component (B).
- the composition is rapidly cross-linked by heating, has no surface tack, forms a cured product having sufficient flexibility, and preferably can form a hard cured product. When the composition is completely cured by heating, the composition can be made to have a more preferable hardness depending on the application, and particularly high hardness can be obtained.
- the crosslinkable organopolysiloxane composition of the present invention preferably has a type D durometer hardness of 45 or more as defined in JIS K 6253 when heated at 150 ° C. for 3 hours, depending on the desired application.
- the Type D durometer hardness can be 45-60, and the Type D durometer hardness can be 60-80 depending on other desired applications.
- this composition can have a type A durometer hardness of 30 to 60 as defined in JIS K 6253 when completely cured by heating.
- the type A durometer hardness can be 60-90 depending on the desired application.
- the composition can form a stable cured product in which mechanical properties, hardness and the like are not changed by heating.
- the heating temperature is preferably within the range of 80 ° C to 200 ° C.
- the present composition is not limited to a molding method, and can be used as an adhesive application, film formation, potting agent, coating agent, and underfill agent by ordinary mixing and oven heating. In particular, since it has a high refractive index and a high light transmittance, it is suitable for use in lens materials for optical applications, potting agents, coating agents, protective materials for semiconductor elements such as LEDs.
- the cured product of the present invention is obtained by curing the crosslinkable organopolysiloxane composition.
- the shape of the cured product is not particularly limited, and may be various, such as a lump shape, a sheet shape, and a film shape.
- the cured product can be handled alone, but can also be handled in a state where the optical semiconductor element or the like is covered or sealed.
- the crosslinkable organopolysiloxane composition of the present invention will be described in detail with reference to examples.
- the viscosity is a value at 25 ° C.
- Me, Ph, Vi, and BPP represent a methyl group, a phenyl group, a vinyl group, and a biphenylyl group, respectively.
- the hardness of the cured product was measured with JIS K 6253 “Method for testing hardness of vulcanized rubber and thermoplastic rubber” using a type A and type D durometer. JIS is an abbreviation for Japan Industrial Standards.
- the refractive index of the cured product was measured with a laser having a wavelength of 550 nm using a prism coupler model 2010 manufactured by Metricon.
- Example 1 Average unit formula: (MeViSiO 2/2 ) 0.3 (Ph 2 SiO 2/2 ) 0.25 (BPPSiO 3/2 ) 0.25 (PhSiO 3/2 ) Branched methyl vinyl represented by 0.2 62 parts by weight of biphenylylphenylpolysiloxane, 17 parts by weight of branched methylvinylphenylpolysiloxane having a viscosity of 1200 mPa ⁇ s at 25 ° C.
- Example 1 When the composition obtained in Example 1 was heated to 150 ° C., curing was completed in 3 hours, and a cured product having a Type D durometer hardness of 80 was obtained at 25 ° C. There was no surface tack, and hardness did not change even after heating.
- the obtained cured product had a refractive index of 1.6024, and a high refractive index was obtained.
- Example 2 Average unit formula: (MeViSiO 2/2 ) 0.3 (PhBPPSiO 2/2 ) 0.25 (PhSiO 3/2 ) 62 parts by weight of branched methylvinylbiphenylylphenylpolysiloxane represented by 0.45 , formula: (ViMe 2 SiO (SiPhMeO) 15 ) 3 SiPh, a viscosity of 6000 mPa ⁇ s at 25 ° C.
- Example 2 When the composition obtained in Example 2 was heated to 150 ° C., curing was completed in 3 hours, and a cured product having a Type D durometer hardness of 80 was obtained at 25 ° C. There was no surface tack, and hardness did not change even after heating.
- the obtained cured product had a refractive index of 1.5901, and a high refractive index was obtained.
- Example 1 and Example 2 and Comparative Example 1 and Comparative Example 2 The composition obtained in Example 1 and Example 2 and Comparative Example 1 and Comparative Example 2 was applied to an LED substrate equipped with a silver-plated electrode and an LED element, and the composition was heated in an oven at 150 ° C. for 3 hours. An LED device in which the LED element was sealed with a cured product was produced. The produced LED device was put in an oven at 80 ° C. under a sulfur atmosphere, and after 24 hours, the silver-plated electrode was observed with a microscope. A case where no discoloration is observed in the silver plating electrode is determined as “ ⁇ ”, and a case where the silver plating electrode is changed into black is determined as “x”.
- Example 1 and Example 2 and Comparative Example 1 and Comparative Example 2 were applied to a thickness of 0.5 mm, 1.0 mm, 2.0 mm and 3.0 mm, The composition was cured by heating at 150 ° C. for 3 hours in an oven, and then the whole glass substrate was cut using a dicing saw. The case where the glass substrate could be cut without causing cracks or the like in the cured product was determined as “ ⁇ ”, and the case where the cured material was cracked and the glass substrate could not be cut was determined as “ ⁇ ”. The results are shown in Table 1.
- the crosslinkable organopolysiloxane composition of the present invention can be used as a material that can be stress-reduced because it has a fast cross-linking, does not have a surface tack of a cured product, and has sufficient flexibility. It can be used as an adhesive, potting agent, protective coating agent, and underfill agent.
- the cured product of the composition is a material having a high refractive index and a high light transmittance, it is suitable for uses such as lens materials for optical applications, potting agents, coating agents, and protective materials for semiconductor elements.
- the cured product of the composition is excellent in corrosion resistance, it is particularly suitable for an LED device used outdoors or in an environment that is easily affected by exhaust gas.
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