WO2017199593A1 - 搬送車及び搬送方法 - Google Patents
搬送車及び搬送方法 Download PDFInfo
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- WO2017199593A1 WO2017199593A1 PCT/JP2017/013244 JP2017013244W WO2017199593A1 WO 2017199593 A1 WO2017199593 A1 WO 2017199593A1 JP 2017013244 W JP2017013244 W JP 2017013244W WO 2017199593 A1 WO2017199593 A1 WO 2017199593A1
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- WIPO (PCT)
- Prior art keywords
- sensor
- drive unit
- correction mechanism
- main body
- correction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/04—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack
- B66C13/06—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack for minimising or preventing longitudinal or transverse swinging of loads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C1/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
- B66C1/10—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
- B66C1/12—Slings comprising chains, wires, ropes, or bands; Nets
- B66C1/16—Slings with load-engaging platforms or frameworks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
Definitions
- a transport vehicle includes a main body, a lift having a holding section for holding an article and capable of moving up and down with respect to the main body, and a lifting base by feeding and winding a flexible suspension member.
- a lift drive unit that lifts and lowers the sensor, a sensor that radiates a detection wave having directivity toward a predetermined position below the lift drive unit, and a side of the main body with the lift drive unit being cantilevered
- a correction mechanism that corrects a deviation in the irradiation direction of the detection wave caused by the bending of the lateral ejection mechanism in a state where the elevation drive unit is projected to the side of the main body by the lateral ejection mechanism.
- the conveyance method according to the present invention corrects the deviation in the irradiation direction of the detection wave caused by the deflection of the laterally extending mechanism, the erroneous detection by the sensor is suppressed, and the lifting and lowering of the lifting platform and the delivery of articles are appropriately performed. And the articles can be transported stably.
- the transfer device 40 includes a main body 41, a lifting platform 42, a lifting drive unit 43, a sensor 44, a lateral mechanism 45, and a correction mechanism 46.
- the main body 41 is connected to the travel drive unit 10 via the connecting unit 30.
- the main body 41 moves along the rail R together with the travel drive unit 10.
- the lifting platform 42 can be moved up and down (movable in the Z direction) with respect to the main body 41.
- the elevator 42 has a gripper 42a as a holding part for holding the article FP.
- the article FP is, for example, a container (FOUP) for storing a semiconductor wafer or a reticle pod for storing a reticle.
- the gripper 42a can grip or release a flange FPa provided on the top (+ Z side surface) of the article FP.
- the elevating drive unit 43 moves the elevating table 42 up and down (moves in the Z direction).
- the elevating drive unit 43 suspends the elevating table 42 via a plurality of (for example, four) flexible belts (suspension members) 43a.
- the raising / lowering drive part 43 raises / lowers the raising / lowering stand 42 by extending
- the inclination adjusting unit 64 adjusts the inclination of the shake detection sensor 47 with respect to the support member 63b.
- the inclination adjustment unit 64 includes a sensor fixing member 64a, a screw portion 64b, and a nut 64c.
- the sensor fixing member 64a fixes the shake detection sensor 47 with a predetermined fixing member.
- the sensor fixing member 64a is a U-shaped member as viewed from the Z direction.
- the distance between the sensor fixing member 64a and the support member 63b is individually adjusted, and the inclination of the vibration detection sensor 47 in the ⁇ Y direction (irradiation direction of the laser light L1) is vertical. It can be adjusted to be downward ( ⁇ Z direction).
- the amount of protrusion in the X direction by the lateral projection mechanism 45 is substantially constant at a preset value. For this reason, in the state where the laterally extending mechanism 45 protrudes, the inclination of the elevating drive unit 43 in the ⁇ Y direction becomes a substantially constant value. Therefore, in the present embodiment, when the lateral movement mechanism 45 protrudes, the first correction drive unit 66 is driven, and the movable unit 63 is rotated and held at the predetermined position by the rotation restricting unit 65 as described above.
- the irradiation direction of the laser beam L1 emitted from the shake detection sensor 47 can be set to irradiate the reflection plate 49.
- the action piece 73b is disposed on the + X side with respect to the shaft portion 72 (see FIG. 5).
- the drive piece 73a and the action piece 73b are integrally rotatable about the central axis AX2 in the ⁇ Y direction.
- the drive piece 73a supports the look-down sensor 48 via a sensor fixing member 74a described later.
- the adjusting screw 74c is attached to the lower end of the sensor fixing member 74a.
- the adjustment screw 74c fixes the look-down sensor 48 to the sensor fixing member 74a, and adjusts the inclination of the look-down sensor 48 with respect to the sensor fixing member 74a in the ⁇ Y direction.
- FIG. 4 in this embodiment, when viewed in the + X direction, for example, the ⁇ Y side and + Z side corners of the look-down sensor 48 and the + Y side and ⁇ Z side corners are two.
- An adjustment screw 74c is disposed at the location.
- the rotation restricting portion 75 defines a rotation range in the ⁇ Y direction of the movable portion 73 around the central axis AX2.
- the rotation restricting portion 75 includes a base portion 75a, a screw portion 75b, and a nut 75c.
- the base portion 75a is fixed above the shaft portion 72 in the belt-like portion 71a.
- the two screw portions 75 b are arranged at two locations that sandwich the base portion 75 a in the X direction.
- One screw portion 75b is disposed on the action piece 73b, and the other screw portion 75b is disposed on the upper end of the sensor fixing member 74a.
- Each screw portion 75b is fixed by a nut 75c in a state in which the tip projects toward the base portion 75a.
- the protruding amount of the screw portion 75b can be adjusted by the screw coupling position with the nut 75c.
- the rotation range of the movable portion 73 is defined by the tip of the screw portion 75b coming into contact with the base portion 75a. Note that the position of the tip of the screw portion 75b is preset according to the angle at which the elevating drive unit 43 is inclined in the ⁇ Y direction.
- the second correction driving unit 76 when the lateral movement mechanism 45 protrudes, the second correction driving unit 76 is driven, and the movable unit 73 is rotated and held at the predetermined position by the rotation regulating unit 75 as described above.
- the irradiation direction of the laser light L2 emitted from the look-down sensor 48 can be corrected.
- the second correction driving unit 76 can correct the irradiation direction of the laser light L2 from the look-down sensor 48 according to the inclination of the lifting / lowering driving unit 43 by only two types of control such as driving or not driving.
- the transmission mechanism 76b is held at a predetermined position by an elastic body such as a spring disposed in the solenoid that is the second correction driving unit 76.
- the movable part 73 is hold
- actuators 66a and 76a described above are not limited to solenoids.
- a ball screw mechanism using an electric motor, a hydraulic or pneumatic cylinder mechanism, a linear motor, or the like may be used.
- FIG. 6 is a flowchart illustrating an example of the operation of the transport method according to the present embodiment.
- FIG. 6 shows an example of the lifting / lowering operation of the lifting / lowering platform 42 among the operations of the transport vehicle 100.
- the control device causes the transport vehicle 100 to travel along the rail R by driving the travel drive unit 10.
- the control device is in a state of being housed in the main body portion 41 without protruding the laterally extending mechanism 45 to the + X side or the ⁇ X side.
- step S01 the stop position of the conveyance vehicle 100 is, for example, above a position shifted laterally from the position of the conveyance destination or the reception destination of the article mounting table S or the like.
- step S02 the control device causes the elevating drive unit 43 to protrude to the side of the main body unit 41 by the laterally extending mechanism 45 (step S02).
- step S02 the control device has previously acquired information that the conveyance destination or the receiving destination of the article FP is shifted laterally from below the rail, and based on this information, the lower stage portion 53 and the middle stage portion 52 of the lateral feeding mechanism 45 are obtained. Project to the + X side or the -X side.
- the lateral projection mechanism 45 is in a state where the tip end side in the X direction is bent downward, and the elevating drive unit 43 is inclined in the ⁇ Y direction.
- the belt 43a has flexibility, even when the elevating drive unit 43 is inclined in the ⁇ Y direction, the elevating platform 42 is positioned vertically below the elevating drive unit 43 ( ⁇ Z direction).
- the control device corrects the deviation in the irradiation direction of the detection wave by the sensor after the raising / lowering drive unit 43 protrudes to the side of the main body 41 or during the protrusion (step S03).
- the control device drives the actuator 66a of the first correction drive unit 66 to rotate the movable unit 63 in the ⁇ Y direction about the central axis AX1.
- the movable portion 63 is further rotated by the rotation restricting portion 65 at a position rotated by a predetermined angle, and the inclination of the shake detection sensor 47 is adjusted.
- the laser beam L1 emitted from the shake detection sensor 47 is emitted downward or substantially downward and directed toward the reflection plate 49 (see FIG. 1).
- step S04 the control device raises and lowers the lifting platform 42 (step S04).
- the control device drives the elevating drive unit 43 to send out the belt 43a and lower the elevating table 42.
- the article FP gripped by the gripper 42a can be placed on the article placing table S, or the article FP placed on the article placing table S can be gripped by the gripper 42a.
- the first correction driving unit 66 and the second correction driving unit 76 perform laser beam irradiation.
- the deviation in the irradiation direction of L1 and L2 is corrected.
- it can suppress that laser beam L1, L2 is irradiated to the position which remove
- the erroneous detection by the shake detection sensor 47 or the look-down sensor 48 can be suppressed, and the delivery of the article FP can be performed appropriately.
- the present invention is not limited to this.
- FIG. 8 is a perspective view showing another example of the correction mechanism.
- FIG. 9 is a diagram illustrating an example of the correction mechanism of FIG. 8 viewed from the + Y side.
- the same members as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.
- the correction mechanism 60A shown in FIGS. 8 and 9 is described as another example of the first correction mechanism 60 described above, the same applies to other examples of the second correction mechanism 70.
- a look-down sensor 48 is arranged in place of the shake detection sensor 47. The same applies to FIGS. 10 and 11 described later.
- the correction mechanism 60A also tilts, but the movable unit 63 moves downward ( ⁇ Z Direction) is maintained. Thereby, the state in which the shake detection sensor 47 is also directed downward is maintained, and the irradiation direction of the laser light L1 is corrected.
- the laser light L1 can be generated with a simple configuration using gravity without using an actuator or the like. Irradiation direction can be corrected.
- FIGS. 10A to 10C are perspective views showing other examples of the correction mechanism.
- 10A and 10C are views of the correction mechanism 60B viewed from the + Y side
- FIG. 10B is a view of the correction mechanism 60B viewed from the + Z side.
- the elevation drive unit 43 is omitted.
- the correction mechanism 60B includes a movable portion 81, a shaft portion 82, fixed pieces 83 and 84, sliders 85 and 86, and connecting portions 87 and 88.
- the movable portion 81 is supported so as to be rotatable in the ⁇ Y direction about the central axis AX3 of the shaft portion 82.
- the fixed pieces 83 and 84 are fixed to the lower surface side of the lower step portion 53 with the movable portion 81 sandwiched in the X direction. Note that the fixing pieces 83 and 84 may be fixed to the elevating drive unit 43.
- the fixing pieces 83 and 84 have guide grooves 83a and 84a along the X direction. As shown in FIG. 10B, the + X side fixing piece 83 and the ⁇ X side fixing piece 84 are arranged at positions shifted in the Y direction.
- FIG. 10C is a diagram showing an example of the correction mechanism 60B in the case where the lateral protrusion mechanism 45 is driven and the middle step portion 52 and the lower step portion 53 protrude to the ⁇ X side.
- the block portion 55 of the middle step portion 52 comes into contact with the slider 85 and moves the slider 85 in the + X direction.
- the protruding portion 81a of the movable portion 81 is pulled in the + X direction via the elastic member 87a.
- the elastic member 88a is pulled in the + X direction.
- the movable part 81 rotates in the ⁇ Y direction about the central axis AX3 of the shaft part 82 to the position where the elastic members 87a and 88a extend.
- 11A to 11C are perspective views showing other examples of the correction mechanism.
- 11A and 11C are views of the correction mechanism 60C viewed from the + Y side
- FIG. 11B is a view of the correction mechanism 60C viewed from the + Z side.
- the lifting drive unit 43 is not shown.
- the correction mechanism 60 ⁇ / b> C includes a movable portion 91, a shaft portion 92, rollers 93 and 94, and a connecting portion 95.
- the movable portion 91 is provided to be rotatable in the ⁇ Y direction about the central axis AX4 of the shaft portion 92.
- the rollers 93 and 94 are arranged with the movable part 91 sandwiched in the X direction, and can contact the block parts 57 and 58 provided in the middle stage part 52, respectively.
- the rollers 93 and 94 are disposed away from the lower surface of the middle step portion 52, but may be disposed in contact with the lower surface of the middle step portion 52.
- the connecting portion 95 has a rod shape that holds the rollers 93 and 94, and is fixed to the upper end of the protruding portion 91a.
- the connection part 95 may be connected with the raising / lowering drive part 43 through an elastic member, for example.
- the elastic member can hold the connecting portion 95 in the horizontal direction.
- the connecting portion 95 is in a horizontal state, the shake detection sensor 47 fixed to the movable portion 91 is adjusted so as to irradiate the laser beam L1 downward.
- the block parts 57 and 58 are respectively arranged at both ends in the X direction in the middle stage part 52.
- the block part 57 and the block part 58 are arranged at positions shifted in the Y direction.
- the block portions 57 and 58 have slopes 57a and 58a.
- the slope 57a is inclined downward ( ⁇ Z side) toward the ⁇ X direction.
- the slope 58a is inclined downward in the + X direction.
- the movable portion 91 rotates in the ⁇ Y direction around the central axis AX4 of the shaft portion 92, and the sensor fixing portion 91b also rotates in the ⁇ Y direction, so that the laser light L1 emitted from the shake detection sensor 47 is in a predetermined position. Correction is performed so as to irradiate (the reflecting plate 49 shown in FIG. 1 and the like).
- the case where the lower step portion 53 protrudes to the ⁇ X side is described as an example.
- the present invention is not limited to this, and the middle step portion 52 and the lower step portion 53 protrude to the + X side.
- the + X side block part 58 of the middle stage part 52 pushes down the ⁇ X side roller 94 to move the connecting part 95 to the horizontal state.
- the movable portion 91 rotates in the ⁇ Y direction, and the irradiation direction of the laser light L1 irradiated from the shake detection sensor 47 is corrected.
- FIG. 12 shows another example of the correction mechanism.
- a tilt sensor AS that detects the tilt of the lift drive unit 43 is attached to the lift drive unit 43.
- a control device (not shown) transmits control signals to the first correction mechanism 60D and the second correction mechanism 70D, respectively.
- the inclination sensor AS detects the inclination of the elevation drive unit 43 and adjusts the attitude of the oscillation detection sensor 47 and the inclination of the look-down sensor 48 according to the inclination of the elevation drive unit 43.
- the deviation in the irradiation direction of the laser beams L1 and L2 irradiated from the look-down sensor 48 can be easily corrected.
- the correction mechanism described above is an example, and a correction mechanism having another configuration may be applied.
- the sensor 44 is not limited to the shake detection sensor 47 and the look-down sensor 48, and may be any sensor that emits a detection wave having directivity.
- Japanese Patent Application No. 2016-101338 and all the references cited in this specification are incorporated as part of the description of this text.
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
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- Length Measuring Devices By Optical Means (AREA)
- Manipulator (AREA)
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Abstract
Description
FP・・・物品
40・・・移載装置
41・・・本体部
42・・・昇降台
42a・・・グリッパ(保持部)
43・・・昇降駆動部
43a・・・ベルト(吊持部材)
44・・・センサ
45・・・横出し機構
46、60A、60B、60C・・・補正機構
47・・・揺れ検出センサ(センサ)
48・・・ルックダウンセンサ(センサ)
60、60D・・・第1補正機構(補正機構)
66a、76a・・・アクチュエータ
70、70D・・・第2補正機構(補正機構)
100・・・搬送車
Claims (7)
- 本体部と、
物品を保持する保持部を有しかつ前記本体部に対して昇降可能な昇降台と、
可撓性を有する吊持部材の繰り出し及び巻き取りにより前記昇降台を昇降させる昇降駆動部と、
前記昇降駆動部に設けられ、下方の所定位置に向けて指向性を有する検出波を照射するセンサと、
前記昇降駆動部を片持ち支持した状態で前記本体部の側方に突出させる横出し機構と、
前記横出し機構により前記昇降駆動部を前記本体部の側方に突出させた状態において、前記横出し機構の撓みにより生じる前記検出波の照射方向のズレを補正する補正機構と、を備える搬送車。 - 前記補正機構は、前記昇降駆動部に対する前記センサの角度を変化させる、請求項1に記載の搬送車。
- 前記補正機構は、前記センサの角度を変化させるアクチュエータを有する、請求項2に記載の搬送車。
- 前記補正機構は、重力によって前記センサの角度を変化させる、請求項2に記載の搬送車。
- 前記補正機構は、前記横出し機構による前記昇降駆動部の突出動作に連動して前記センサの角度を変化させる、請求項2に記載の搬送車。
- 前記センサは、前記昇降台を昇降させる際に前記検出波が前記昇降台の所定範囲に照射されるか否かを検出する揺れ検出センサ、及び前記昇降台の降下先の近傍に向けて前記検出波を照射して異物が存在するか否かを検出するルックダウンセンサのうち、少なくとも一方である、請求項1~5のいずれか一項に記載の搬送車。
- 本体部と、
物品を保持する保持部を有しかつ前記本体部に対して昇降可能な昇降台と、
可撓性を有する吊持部材の繰り出し及び巻き取りにより前記昇降台を昇降させる昇降駆動部と、
前記昇降駆動部に設けられ、下方の所定位置に向けて指向性を有する検出波を照射するセンサと、
前記昇降駆動部を片持ち支持した状態で前記本体部の側方に突出させる横出し機構と、を備える搬送車により物品を搬送する方法であって、
前記横出し機構により前記昇降駆動部を前記本体部の側方に突出させる場合に、前記横出し機構の撓みにより生じる前記検出波の照射方向のズレを補正することを含む、搬送方法。
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CN109155269B (zh) | 2023-04-21 |
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