JP5636849B2 - 移載システム - Google Patents
移載システム Download PDFInfo
- Publication number
- JP5636849B2 JP5636849B2 JP2010221953A JP2010221953A JP5636849B2 JP 5636849 B2 JP5636849 B2 JP 5636849B2 JP 2010221953 A JP2010221953 A JP 2010221953A JP 2010221953 A JP2010221953 A JP 2010221953A JP 5636849 B2 JP5636849 B2 JP 5636849B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- gripping
- mounting
- position information
- transported object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
- B66C13/22—Control systems or devices for electric drives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Description
このように構成すれば、機差データとして、把持位置情報及びずれ量情報の2つのデータから構成し、記憶手段のデータ容量を最小限に抑えることも可能である。
=(X**1,Y**1,Z**1,Θ**1)+(σX,σY,σZ,σΘ) (2)
<実施形態>
<実施形態の構成>
始めに、図1を参照し、本発明の実施形態に係る移載システム100の構成について説明する。ここに、図1は、移載システム100の構成及び移載システム100におけるビークル2の構造を模式的に表す正面図である。
ここで、メモリ101、ビークルコントローラ102及び送受信部103を説明する前に、図2を参照し、移載システム100における横移載について説明する。ここに、図2は、横移載を行うビークル2の状態を説明する正面図である。
本実施形態では、把持動作を行う際に、グリッパ21中心とフランジ3a中心とが同一鉛直線上にあれば移載位置の変更を必要としないのに対し、載置動作を行う際には、FOUP3(言い換えれば、グリッパ21)の傾き角度Φ1及び高さhに基づくずれ量σY分、移載位置をずらす。即ち、把持動作時の移載位置と、載置動作時の移載位置とは、横方向にずれ量σYだけ差異を有することとなる。
次に、図5から図7を参照し、移載位置を表すデータについて説明する。ここに、図5は、当該移載システムに設置される各種載置台4を説明する上面図であり、図6及び図7は、メモリ101に記憶されるデータの構造を説明する表である。
次に、図9を参照し、本発明の本実施形態に係る移載システム100の動作について説明する。ここに、図9は、移載システム100における移載処理を示すフローチャートである。尚、移載システム100における全てのビークル2は、送受信部103を介してビークル2間で共通データを教示し、常時最新の共通データを保持するものとする。
Claims (6)
- 天井又は該天井側に敷設された軌道に沿って走行しつつ被搬送物を搬送する搬送車と、前記軌道より下方に設けられており前記被搬送物を載置可能である載置台との間で前記被搬送物が移載可能である移載システムであって、
(i)前記搬送車に把持される前記被搬送物を前記載置台の所定位置に載置する載置動作を行う際の前記被搬送物の移載位置を表す載置位置情報、及び(ii)前記載置台上の前記被搬送物を前記搬送車が把持する把持動作を行う際の前記被搬送物の移載位置を表す把持位置情報を記憶する記憶手段と、
前記載置動作を行う場合、前記記憶される載置位置情報の移載位置で移載が行われるように、他方、前記把持動作を行う場合、前記記憶される把持位置情報の移載位置で移載が行われるように前記搬送車を制御する制御手段と
を備え、
前記搬送車は、
前記被搬送物を把持する把持状態及び前記被搬送物を解放する解放状態の間で変位可能な把持部と、
前記把持部を鉛直方向に昇降可能な鉛直移動部と、
前記把持部を前記軌道の方向に直交する横方向に水平移動可能な横水平移動部と
を有し、
前記横方向に前記被搬送物を移動可能であり、前記搬送車本体の横方向に設置される前記載置台との間で前記被搬送物を移載可能である
ことを特徴とする移載システム。 - 前記載置位置情報及び前記把持位置情報の各々は、複数の前記搬送車に共通する移載位置を表す共通データと、前記搬送車に固有の移載位置を表す機差データとの和として示される
ことを特徴とする請求項1に記載の移載システム。 - 当該移載システムは、
複数の前記搬送車の間で相互に前記共通データを教示する教示手段
を更に備えることを特徴とする請求項2に記載の移載システム。 - 前記載置位置情報の前記機差データと前記把持位置情報の前記機差データとの差は、前記移載位置での前記被搬送物の傾き度合い及び前記被搬送物の高さに基づく、前記被搬送物のずれ量に相当する
ことを特徴とする請求項2又は3に記載の移載システム。 - 前記搬送車は、前記把持部をその鉛直軸を中心とする鉛直軸回転方向に回転可能な回転移動部を備え、
前記載置位置情報及び前記把持位置情報の各々は、前記軌道の方向、前記横方向、前記鉛直方向及び前記鉛直軸回転方向の四方向での位置を表す
ことを特徴とする請求項1から4のいずれか一項に記載の移載システム。 - 前記被搬送物は、その底面に規定の凹部を有し、
前記載置台は、その上面に前記凹部に係合可能な凸部を有し、
前記載置動作では、前記凹部及び前記凸部の係合により前記載置台に対し前記被搬送物が位置決めされる前記所定位置に前記被搬送物が載置される
ことを特徴とする請求項1から5のいずれか一項に記載の移載システム。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010221953A JP5636849B2 (ja) | 2010-09-30 | 2010-09-30 | 移載システム |
SG2013022504A SG189109A1 (en) | 2010-09-30 | 2011-08-29 | Transfer system |
CN201180046057.XA CN103118962B (zh) | 2010-09-30 | 2011-08-29 | 移载系统 |
EP11828671.5A EP2623437B1 (en) | 2010-09-30 | 2011-08-29 | Transfer system |
KR1020137007802A KR101425105B1 (ko) | 2010-09-30 | 2011-08-29 | 이송 시스템 |
US13/876,471 US9117853B2 (en) | 2010-09-30 | 2011-08-29 | Transfer system |
PCT/JP2011/069434 WO2012043110A1 (ja) | 2010-09-30 | 2011-08-29 | 移載システム |
TW100134999A TWI513639B (zh) | 2010-09-30 | 2011-09-28 | Transfer system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010221953A JP5636849B2 (ja) | 2010-09-30 | 2010-09-30 | 移載システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012076852A JP2012076852A (ja) | 2012-04-19 |
JP5636849B2 true JP5636849B2 (ja) | 2014-12-10 |
Family
ID=45892584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010221953A Active JP5636849B2 (ja) | 2010-09-30 | 2010-09-30 | 移載システム |
Country Status (8)
Country | Link |
---|---|
US (1) | US9117853B2 (ja) |
EP (1) | EP2623437B1 (ja) |
JP (1) | JP5636849B2 (ja) |
KR (1) | KR101425105B1 (ja) |
CN (1) | CN103118962B (ja) |
SG (1) | SG189109A1 (ja) |
TW (1) | TWI513639B (ja) |
WO (1) | WO2012043110A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121765A1 (ja) | 2018-12-14 | 2020-06-18 | 村田機械株式会社 | 搬送車 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201605180TA (en) * | 2014-01-07 | 2016-08-30 | Murata Machinery Ltd | Transfer device and control method of transfer device |
US9852934B2 (en) | 2014-02-14 | 2017-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor wafer transportation |
JP6119699B2 (ja) * | 2014-08-27 | 2017-04-26 | 村田機械株式会社 | 移載位置決定方法 |
JP6544434B2 (ja) | 2015-08-28 | 2019-07-17 | 村田機械株式会社 | ティーチング装置、搬送システム、及び位置決めピンの測定方法 |
JP6641926B2 (ja) * | 2015-11-26 | 2020-02-05 | 株式会社ダイフク | 物品搬送設備 |
US11027949B2 (en) * | 2016-05-20 | 2021-06-08 | Murata Machinery, Ltd. | Transport vehicle and transport method |
JP6586936B2 (ja) * | 2016-09-21 | 2019-10-09 | 株式会社ダイフク | 物品搬送設備 |
WO2018055883A1 (ja) * | 2016-09-26 | 2018-03-29 | 村田機械株式会社 | 天井搬送システム、及び天井搬送車 |
CN110248878B (zh) * | 2017-02-07 | 2021-03-12 | 村田机械株式会社 | 输送系统和输送方法 |
WO2018186021A1 (ja) * | 2017-04-06 | 2018-10-11 | 村田機械株式会社 | 天井搬送車システム及びティーチングユニット |
JP6809612B2 (ja) * | 2017-07-24 | 2021-01-06 | 村田機械株式会社 | 自動倉庫システム、及び自動倉庫システムの制御方法 |
EP3670389A4 (en) * | 2017-08-16 | 2021-04-14 | Murata Machinery, Ltd. | AIR TRANSPORT VEHICLE, TRANSPORT SYSTEM, AND AIR TRANSPORT VEHICLE CONTROL METHOD |
JP6910597B2 (ja) * | 2017-09-01 | 2021-07-28 | 村田機械株式会社 | 天井搬送車システム及び天井搬送車でのティーチング方法 |
CN113753757B (zh) | 2020-06-05 | 2023-02-17 | 长鑫存储技术有限公司 | Amhs轨道条形码自动安装系统和方法 |
TWI718078B (zh) * | 2020-07-13 | 2021-02-01 | 環球晶圓股份有限公司 | 晶片承載裝置 |
KR102534256B1 (ko) * | 2020-12-18 | 2023-05-17 | 세메스 주식회사 | 물품의 진동을 억제하기 위한 반송 차량 및 이를 포함하는 제조 공장의 물품 반송 시스템 |
KR102579642B1 (ko) * | 2021-11-24 | 2023-09-15 | 세메스 주식회사 | Oht 비히클 및 이의 동작 제어 방법 |
CN117142330B (zh) * | 2023-10-31 | 2024-01-05 | 上海新创达半导体设备技术有限公司 | 具有锁定功能的天车及其控制方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6286308U (ja) * | 1985-11-19 | 1987-06-02 | ||
JPH08188379A (ja) * | 1995-01-10 | 1996-07-23 | Kobe Steel Ltd | クレーンの鉛直地切り制御装置 |
JP4151002B2 (ja) | 2001-10-19 | 2008-09-17 | 株式会社ダイフク | 吊下搬送設備とその学習装置 |
JP3991229B2 (ja) * | 2004-01-13 | 2007-10-17 | 村田機械株式会社 | 搬送台車システム |
JP4074999B2 (ja) * | 2004-01-13 | 2008-04-16 | 村田機械株式会社 | 搬送台車システム |
JP4148194B2 (ja) * | 2004-07-22 | 2008-09-10 | 村田機械株式会社 | 搬送台車システム |
JP2006051886A (ja) * | 2004-08-12 | 2006-02-23 | Murata Mach Ltd | 天井走行車システム |
JP2007191235A (ja) | 2006-01-17 | 2007-08-02 | Murata Mach Ltd | 天井走行車システム |
JP5332223B2 (ja) * | 2008-02-12 | 2013-11-06 | 株式会社Ihi | 自動倉庫及び自動倉庫の荷搬送方法 |
JP4688004B2 (ja) * | 2008-04-22 | 2011-05-25 | 株式会社ダイフク | 物品搬送装置 |
JP2010208816A (ja) * | 2009-03-11 | 2010-09-24 | Murata Machinery Ltd | 移載装置 |
-
2010
- 2010-09-30 JP JP2010221953A patent/JP5636849B2/ja active Active
-
2011
- 2011-08-29 SG SG2013022504A patent/SG189109A1/en unknown
- 2011-08-29 WO PCT/JP2011/069434 patent/WO2012043110A1/ja active Application Filing
- 2011-08-29 CN CN201180046057.XA patent/CN103118962B/zh active Active
- 2011-08-29 KR KR1020137007802A patent/KR101425105B1/ko active IP Right Grant
- 2011-08-29 EP EP11828671.5A patent/EP2623437B1/en active Active
- 2011-08-29 US US13/876,471 patent/US9117853B2/en active Active
- 2011-09-28 TW TW100134999A patent/TWI513639B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121765A1 (ja) | 2018-12-14 | 2020-06-18 | 村田機械株式会社 | 搬送車 |
Also Published As
Publication number | Publication date |
---|---|
CN103118962B (zh) | 2014-12-10 |
EP2623437B1 (en) | 2018-08-15 |
TW201213215A (en) | 2012-04-01 |
US9117853B2 (en) | 2015-08-25 |
EP2623437A1 (en) | 2013-08-07 |
JP2012076852A (ja) | 2012-04-19 |
US20130197691A1 (en) | 2013-08-01 |
TWI513639B (zh) | 2015-12-21 |
KR20130066674A (ko) | 2013-06-20 |
SG189109A1 (en) | 2013-05-31 |
CN103118962A (zh) | 2013-05-22 |
EP2623437A4 (en) | 2015-03-11 |
KR101425105B1 (ko) | 2014-08-04 |
WO2012043110A1 (ja) | 2012-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5636849B2 (ja) | 移載システム | |
TWI694043B (zh) | 物品搬送設備 | |
US7762754B2 (en) | Storage apparatus for transported object | |
US20110245964A1 (en) | Self Aligning Automated Material Handling System | |
US10699928B2 (en) | Transport system with crane | |
JP4636379B2 (ja) | 懸垂式昇降搬送台車における物品の授受方法並びに装置 | |
WO2018055883A1 (ja) | 天井搬送システム、及び天井搬送車 | |
JP2017105586A (ja) | 物品搬送設備 | |
KR102302007B1 (ko) | 직동 회동 장치 | |
JP2017154840A (ja) | 物品搬送設備 | |
IL271508A (en) | Transport system and transportation method | |
JP5151276B2 (ja) | 搬送システム | |
KR20200079031A (ko) | 이송 로봇 및 이를 포함하는 이송 장치 | |
WO2021220582A1 (ja) | 天井搬送車及び天井搬送システム | |
JP7323059B2 (ja) | 搬送車システム | |
WO2024070624A1 (ja) | 保管システム | |
JP2023128568A (ja) | 保管装置及び保管方法 | |
JP2023074704A (ja) | 物品搬送装置 | |
JP2021178711A (ja) | 容器取扱設備 | |
KR20210157257A (ko) | 컨테이너 반송 장치 및 이를 구비하는 컨테이너 반송 시스템 | |
KR20200128517A (ko) | 반송 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120420 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130627 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140513 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140710 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140924 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141007 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5636849 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |