JP6544434B2 - ティーチング装置、搬送システム、及び位置決めピンの測定方法 - Google Patents
ティーチング装置、搬送システム、及び位置決めピンの測定方法 Download PDFInfo
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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Description
また、本発明は、物品を搬送可能な搬送車によって搬送され、物品の載置位置に設けられた複数の位置決めピンの位置を測定するティーチング装置であって、装置本体と、複数の位置決めピンにそれぞれ接触可能でありかつ装置本体に対して独立して昇降可能な複数のタッチパネルと、水平面に対する装置本体の傾きを検出する水準器と、を備える。
実施形態に係るティーチング装置について、図面を参照して説明する。図1及び図2は、本実施形態に係るティーチング装置100の一例を示す斜視図である。図2は、図1に示すティーチング装置100を斜め下方から見た斜視図である。図3は、ティーチング装置100を−Z側から見たときを示す図である。
次に、上記のように構成されたティーチング装置100を用いて位置決めピンPの位置を測定する方法を説明する。図6は、位置決めピンPの位置を測定する手順を示すフローチャートである。図7は、位置決めピンPを測定する手順を示す工程図である。以下では適宜図7を参照しつつ、図6に示すフローチャートを用いて説明する。なお、ティーチング装置100は、上記した図1に示すティーチング装置100を用いている。
次に、本実施形態に係る搬送システムSYSを説明する。図8は、搬送システムSYSの一例を示す図である。図8に示すように、搬送システムSYSは、搬送車101と、上記したティーチング装置100とを備える。搬送システムSYSは、建屋内において、例えば、半導体ウエハあるいはレチクル等を収容した容器(物品)Cを、不図示の各種基板処理装置とストッカ104との間で搬送する。図8では、ストッカ104の入出庫口である載置位置Rにティーチング装置100を搬送している状態を示している。
L・・・検出光
SYS・・・搬送システム
CL・・・天井部
R・・・載置位置
10・・・装置本体
20・・・タッチパネル
21・・・昇降機構
22・・・タッチプレート
23・・・昇降機構
30・・・昇降量検出部
40・・・水準器
50・・・フランジ部(被支持部)
100・・・ティーチング装置
101・・・搬送車
Claims (7)
- 物品を搬送可能な搬送車によって搬送され、前記物品の載置位置に設けられた複数の位置決めピンの位置を測定するティーチング装置であって、
装置本体と、
複数の前記位置決めピンにそれぞれ接触可能でありかつ前記装置本体に対して独立して昇降可能な複数のタッチパネルと、を備え、
前記タッチパネルは、複数の前記位置決めピンのうち2つに対応して配置され、
前記装置本体は、他の前記位置決めピンに接触可能でありかつ前記装置本体に対して昇降可能なタッチプレートを備える、ティーチング装置。 - 物品を搬送可能な搬送車によって搬送され、前記物品の載置位置に設けられた複数の位置決めピンの位置を測定するティーチング装置であって、
装置本体と、
複数の前記位置決めピンにそれぞれ接触可能でありかつ前記装置本体に対して独立して昇降可能な複数のタッチパネルと、
水平面に対する前記装置本体の傾きを検出する水準器と、を備える、ティーチング装置。 - 前記装置本体に対する前記タッチパネルの昇降量を計測する昇降量検出部を備える、請求項1又は請求項2に記載のティーチング装置。
- 前記タッチパネルは、自重によって前記装置本体から吊り下げられた状態で配置され、前記位置決めピンに当たることにより前記装置本体に対して上昇可能である、請求項1〜請求項3のいずれか1項に記載のティーチング装置。
- 前記装置本体は、前記搬送車が支持可能な被支持部を有する、請求項1〜請求項4のいずれか1項に記載のティーチング装置。
- 物品を支持して移動可能であり、複数の位置決めピンが設けられた載置位置に対して前記物品を上方から下降させて移載する搬送車と、
前記搬送車によって搬送可能であり、複数の前記位置決めピンの位置を測定する、請求項1〜請求項5のいずれか1項に記載のティーチング装置と、を備える搬送システム。 - 搬送車による物品の載置位置に設けられた複数の位置決めピンの位置を測定する方法であって、
装置本体に対して独立して昇降可能に設けられる複数のタッチパネルを、前記搬送車により前記載置位置の上方から下降させて複数の前記位置決めピンに個別に接触させることと、
前記タッチパネルによる検出結果に基づいて複数の前記位置決めピンの位置を算出することと、を含み、
複数の前記タッチパネルの上昇量に基づいて、複数の前記位置決めピンの上端を含んだ平面の傾きを算出することを含む、位置決めピンの測定方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2015168970 | 2015-08-28 | ||
JP2015168970 | 2015-08-28 | ||
PCT/JP2016/070854 WO2017038268A1 (ja) | 2015-08-28 | 2016-07-14 | ティーチング装置、搬送システム、及び位置決めピンの測定方法 |
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JPWO2017038268A1 JPWO2017038268A1 (ja) | 2018-07-05 |
JP6544434B2 true JP6544434B2 (ja) | 2019-07-17 |
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US (1) | US10494178B2 (ja) |
JP (1) | JP6544434B2 (ja) |
CN (1) | CN107922117B (ja) |
TW (1) | TWI685049B (ja) |
WO (1) | WO2017038268A1 (ja) |
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JP6217598B2 (ja) | 2014-11-12 | 2017-10-25 | 株式会社ダイフク | 物品収納設備 |
US10714368B2 (en) * | 2017-04-06 | 2020-07-14 | Murata Machinery, Ltd. | Ceiling transport vehicle system and teaching unit |
JP6825464B2 (ja) * | 2017-04-07 | 2021-02-03 | 村田機械株式会社 | ティーチングユニット及び天井搬送車システム |
US10532884B2 (en) * | 2017-05-24 | 2020-01-14 | Hall Labs Llc | Mechanical end effector for planar motion mechanism |
JP6852688B2 (ja) * | 2018-02-09 | 2021-03-31 | 村田機械株式会社 | ティーチングシステム、ティーチングユニット、ターゲットプレート、及びティーチング方法 |
US20230108771A1 (en) * | 2020-03-09 | 2023-04-06 | Murata Machinery, Ltd. | Flatness measurement unit |
KR20220150968A (ko) * | 2020-03-13 | 2022-11-11 | 무라다기카이가부시끼가이샤 | 그리퍼 장치, 반송차, 및 반송 방법 |
CN113238241B (zh) * | 2021-06-02 | 2024-06-04 | 长春奔腾瑞马自动化有限公司 | 一种定位销三维偏差激光测量装置 |
US12026658B2 (en) * | 2022-04-23 | 2024-07-02 | Daniel Judge Villamar | System and method for automated delivery of refrigerated perishable items |
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JP2000072378A (ja) | 1998-08-28 | 2000-03-07 | Tsubakimoto Chain Co | 物品把持機構を有する昇降体の物品位置検出装置 |
JP4264778B2 (ja) * | 1999-07-26 | 2009-05-20 | 東芝機械株式会社 | 作業用ロボットおよび教示点位置・姿勢データ測定方法 |
JP3479969B2 (ja) | 1999-09-06 | 2003-12-15 | 村田機械株式会社 | 搬送システムのティーチング方法とその装置 |
US20030110649A1 (en) * | 2001-12-19 | 2003-06-19 | Applied Materials, Inc. | Automatic calibration method for substrate carrier handling robot and jig for performing the method |
JP4122521B2 (ja) * | 2005-01-17 | 2008-07-23 | 村田機械株式会社 | 天井走行車システム |
CN2803998Y (zh) * | 2005-07-11 | 2006-08-09 | 天津市源峰科技发展公司 | 物流作业培训系统 |
JP2010087358A (ja) * | 2008-10-01 | 2010-04-15 | Muratec Automation Co Ltd | 搬送システム及びズレ検出用治具 |
CN201294056Y (zh) * | 2008-10-17 | 2009-08-19 | 上海卡泊仓储设备有限公司 | 教学用双立柱货物堆垛机 |
JP5636849B2 (ja) * | 2010-09-30 | 2014-12-10 | 村田機械株式会社 | 移載システム |
JP6206088B2 (ja) * | 2013-10-28 | 2017-10-04 | 村田機械株式会社 | 教示システム |
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- 2016-07-14 JP JP2017537635A patent/JP6544434B2/ja active Active
- 2016-07-14 WO PCT/JP2016/070854 patent/WO2017038268A1/ja active Application Filing
- 2016-07-14 US US15/755,617 patent/US10494178B2/en active Active
- 2016-07-14 CN CN201680049176.3A patent/CN107922117B/zh active Active
- 2016-08-26 TW TW105127432A patent/TWI685049B/zh active
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US10494178B2 (en) | 2019-12-03 |
TWI685049B (zh) | 2020-02-11 |
JPWO2017038268A1 (ja) | 2018-07-05 |
CN107922117A (zh) | 2018-04-17 |
US20180251299A1 (en) | 2018-09-06 |
CN107922117B (zh) | 2019-08-06 |
WO2017038268A1 (ja) | 2017-03-09 |
TW201724324A (zh) | 2017-07-01 |
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