WO2016095643A1 - 柔性显示基板母板及柔性显示基板的制备方法 - Google Patents

柔性显示基板母板及柔性显示基板的制备方法 Download PDF

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WO2016095643A1
WO2016095643A1 PCT/CN2015/094785 CN2015094785W WO2016095643A1 WO 2016095643 A1 WO2016095643 A1 WO 2016095643A1 CN 2015094785 W CN2015094785 W CN 2015094785W WO 2016095643 A1 WO2016095643 A1 WO 2016095643A1
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substrate
flexible display
carrier substrate
flexible
display substrate
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PCT/CN2015/094785
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English (en)
French (fr)
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孙力
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京东方科技集团股份有限公司
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Priority to EP15869152.7A priority Critical patent/EP3236493A4/en
Priority to US15/128,997 priority patent/US10205095B2/en
Publication of WO2016095643A1 publication Critical patent/WO2016095643A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present invention relate to the field of flexible display technologies, and in particular, to a flexible display substrate mother board and a method of manufacturing the flexible display substrate.
  • the flexible display device includes electronic paper (flexible electrophoretic display), a flexible organic light-emitting diode display (OLED), a flexible LCD, and the like.
  • a display substrate used in a flexible display device is a flexible display substrate, and a substrate of the flexible display substrate is made of a flexible material such as plastic, which makes the flexible display substrate Processing has become very difficult.
  • a substrate of the flexible display substrate is made of a flexible material such as plastic, which makes the flexible display substrate Processing has become very difficult.
  • it is usually required to bond a flexible substrate on a hard and flat rigid carrier substrate, and then form a film layer constituting the display structure on the flexible substrate, etc., and finally complete the flexibility of the fabrication.
  • the display substrate is peeled off from the carrier substrate. The reason for this is that the mounting error of the display component can only be calculated in micrometers so that the electronic components are not misaligned.
  • the flexible substrate can be firmly combined with the carrier substrate, and when the flexible display substrate is peeled off from the carrier substrate after fabrication, the flexible substrate is required to be easily detached from the carrier substrate.
  • Such a requirement is difficult to achieve in actual operation because the flexible display substrate tends to be slightly deformed when peeled off from the carrier substrate, thereby causing the electronic component line to be misaligned, and the yield is lowered, and the cost of the single-piece panel is correspondingly large.
  • the peeling problem of the flexible display substrate has become one of the difficulties in the preparation of the flexible display substrate.
  • the intensity and depth of focus of the laser beam can be controlled, the pattern layers of the flexible substrate and the display element formed on the flexible substrate are very Thin, laser light from the laser beam will inevitably damage the display components.
  • the beam area of the laser beam is limited, it is necessary to gradually peel the flexible substrate and the rigid carrier substrate by moving the laser beam during peeling, which may cause uneven peeling of the flexible substrate and the carrier substrate.
  • Embodiments of the present invention provide a method of fabricating a flexible display substrate mother board and a flexible display substrate, thereby, for example, at least reducing deformation of the flexible display substrate when peeled off.
  • Embodiments of the present invention provide a method for fabricating a flexible display substrate, the method comprising the steps of:
  • the separation pattern layer includes a plurality of separation units arranged at intervals;
  • Stripping pretreatment is performed on the carrier substrate, and the flexible substrate is peeled off from the carrier substrate to form the flexible display substrate.
  • the separation pattern layer is formed on an upper surface of the carrier substrate, and the separation unit is made of a heat deformation material.
  • the step of performing stripping pretreatment on the carrier substrate comprises: heating the carrier substrate, the bonding layer is deteriorated by thermal viscosity, and the separation pattern layer occurs in various directions. Deformation, a gap is uniformly generated between the flexible display substrate and the carrier substrate.
  • the separation pattern layer is formed under the upper surface of the carrier substrate, and the separation unit contains a gas or a liquid.
  • the separation unit includes a formation in the carrier substrate The groove.
  • the step of performing the stripping pretreatment on the carrier substrate comprises: applying pressure to the carrier substrate, and the gas or liquid in the separation unit is squeezed between the flexible display substrate and the carrier substrate, A uniform separation state is formed between the flexible display substrate and the carrier substrate.
  • the area of the separation pattern layer is not greater than the area of the carrier substrate.
  • the area of the separation unit of the separation pattern layer is not larger than the area of the carrier substrate.
  • Embodiments of the present invention also provide a flexible display substrate mother board, the flexible display substrate mother board comprising: a carrier substrate, a separation pattern layer, a bonding layer, and a flexible substrate, wherein:
  • the separation pattern layer is formed on the carrier substrate, wherein the separation pattern layer comprises a plurality of separation units arranged at intervals;
  • the bonding layer is formed on a carrier substrate on which the separation pattern layer is formed;
  • the flexible substrate is formed on the bonding layer, and the flexible substrate is formed with a display element on a side of the bonding layer.
  • the separation pattern layer is formed on an upper surface of the carrier substrate, and the separation unit is made of a heat deformation material.
  • the separation pattern layer is formed under the upper surface of the carrier substrate, and the separation unit contains a gas or a liquid.
  • the separation unit comprises a groove formed in the carrier substrate.
  • the area of the separation pattern layer is not greater than the area of the carrier substrate.
  • the area of the separation unit of the separation pattern layer is not larger than the area of the carrier substrate.
  • the bonding layer is made of an adhesive which is inferior in viscosity after being heated.
  • the embodiment of the present invention by providing a separation pattern layer between the carrier substrate and the bonding layer, it is required to be separated from the carrier substrate after the flexible display substrate is completed.
  • the gap between the flexible display substrate and the carrier substrate can be uniformly generated, thereby more easily peeling off the flexible display substrate from the carrier substrate, thereby reducing or even eliminating the flexible display substrate.
  • the deformation generated at the time of peeling improves the yield of the flexible display substrate and reduces the manufacturing cost of the flexible display substrate.
  • the technical solution according to the embodiment of the present invention has the advantages of being simple, easy to implement, and the like.
  • FIG. 1 is a flow chart of a method of fabricating a flexible display substrate in accordance with an embodiment of the present invention
  • FIG. 2 is a plan view of a carrier substrate on which a separation pattern layer is formed, in accordance with an embodiment of the present invention
  • FIG. 3 is a plan view of a carrier substrate on which a separation pattern layer is formed, in accordance with another embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a carrier substrate on which a separation pattern layer is formed, in accordance with an embodiment of the present invention
  • FIG. 5 is a schematic view showing the effect of generating a gap between the carrier substrate and the flexible display substrate after heating
  • FIG. 6 is a cross-sectional view of a carrier substrate on which a separation pattern layer is formed, in accordance with another embodiment of the present invention.
  • Fig. 7 is a view showing the effect of generating a gap between the carrier substrate and the flexible display substrate.
  • An embodiment of the present invention provides a method for preparing a flexible display substrate. As shown in FIG. 1 and FIG. 2, the preparation method includes the following steps:
  • Step 1 forming a separation pattern layer 2 on the carrier substrate 1, wherein the separation pattern layer 2 includes a plurality of separation units arranged at intervals;
  • the carrier substrate 1 is a rigid and flat substrate, which may be a substrate or a composite structure composed of at least two substrates. Regardless of the carrier substrate 1 One or more layers are formed, and the carrier substrate 1 as a whole needs to be a hard substrate and has good flatness.
  • the carrier substrate 1 includes at least one metal substrate to improve its thermal conductivity.
  • the metal substrate may be, for example, a substrate made of a metal having good thermal conductivity such as an iron plate or a steel plate.
  • the thickness of the carrier substrate 1 is not limited.
  • the thickness ratio of the metal substrate and other substrates except the metal substrate is not limited. As long as the heat generated by the metal substrate can be applied to the adhesive layer 3, the effect of heating the adhesive layer 3 can be achieved.
  • the separation unit may take any shape, such as a strip shape, a circular shape, a star shape, a dot shape, or the like; further, the separation unit may form the separation pattern layer 2 in any possible interval arrangement, such as Arrangement of sequential arrangement, staggered arrangement, radioactive arrangement, dispersive arrangement, etc., for example, the separation unit forms the separation pattern layer 2 in a uniformly distributed manner; further, the cross section of the separation unit may present any possibility Shapes such as rectangles, circles, semicircles, trapezoids, and even irregular shapes.
  • Fig. 2 shows the separation pattern layer 2 obtained by staggering the strip separation units
  • Fig. 3 shows the separation pattern layer 2 which is sequentially arranged according to the circular separation unit.
  • the separation pattern layer 2 is formed on the upper surface of the carrier substrate 1, and a cross-sectional view of the carrier substrate 1 on which the separation pattern layer 2 is formed on the upper surface is as shown in FIG.
  • the separation unit of the separation pattern layer 2 is made of a heat deformation material such as a thermal expansion material, a thermal vaporization material, and a heat deformation pipeline.
  • the separation pattern layer 2 can be deformed in various directions by heating, especially in a direction perpendicular to the carrier substrate 1, so that the A gap is uniformly formed between the flexible display substrate and the carrier substrate 1, as shown in FIG. 5, so that the flexible display substrate can be more easily peeled off from the carrier substrate, thereby reducing or even eliminating deformation of the flexible display substrate during peeling.
  • the yield of the flexible display substrate is improved, and the manufacturing cost of the flexible display substrate is reduced.
  • the separation pattern layer 2 is formed under the upper surface of the carrier substrate 1, for example, in the carrier substrate 1 in the form of a groove having a certain pressure bearing property.
  • a cross-sectional view of the carrier substrate 1 on which the separation pattern layer 2 is formed under the upper surface is as shown in FIG.
  • the separation unit of the separation pattern layer 2 contains a gas or a liquid
  • the gas or liquid has no corrosion to the separation pattern layer 2 and the bonding layer 3, and has no influence on an inert process environment, and may be selected from nitrogen, argon, helium, silicone oil, etc.
  • the gas or liquid contained in the separation unit is squeezed between the flexible display substrate and the carrier substrate by applying a certain pressure, the flexible display substrate and the carrier substrate.
  • a uniform separation state is formed between 1 , as shown in FIG. 7 , so that the flexible display substrate can be more easily peeled off from the carrier substrate, thereby reducing or even eliminating the deformation of the flexible display substrate during peeling, and improving the flexible display substrate.
  • the yield rate reduces the manufacturing cost of the flexible display substrate.
  • the specific shape of the separation unit, the specific arrangement of the separation unit, and the specific cross-sectional shape of the separation unit are not limited, as long as Any form of implementation of the separation unit that separates the flexible display substrate from the carrier substrate described above is within the scope of the present invention.
  • the area of the separation pattern layer 2 should be no more than the area of the carrier substrate 1 or the area of the separation unit of the separation pattern layer 2 should be no larger than the area of the carrier substrate 1 to avoid unnecessary resources. waste.
  • Step 2 forming a bonding layer 3 on the carrier substrate 1 on which the separation pattern layer 2 is formed;
  • the adhesive layer is made of an adhesive, and the adhesive is poor in viscosity after being heated, and the adhesive may be, for example, a silane adhesive, a polyimide adhesive, or an acrylate adhesive. At least one of the gels.
  • adhesion between the bonding layer 3 and the separation pattern layer 2 is less than the adhesion between the bonding layer 3 and the flexible substrate 4.
  • the bonding layer 3 functions to fix the flexible substrate 4 and the carrier substrate 1 together, so that the position of the flexible substrate 4 can be accurately fixed, so that the flexible substrate 4 is formed on the flexible substrate 4.
  • the misalignment between the electronic components does not occur, resulting in the unfavorable consequences of the final use of the flexible display substrate.
  • Step 3 forming a flexible substrate 4 on the bonding layer 3, and forming a display element on a side of the flexible substrate 4 opposite to the bonding layer 3;
  • the flexible substrate 4 may be a plastic film, and the material thereof may include, for example, at least one of polyimide, polycarbonate, polyacrylate, and polyetherimide.
  • the institute The flexible substrate 4 may be a single layer film or a multilayer film structure.
  • the display element refers to, according to the type of the flexible display substrate, corresponding to a minimum display unit of the flexible display substrate, which is indispensable for realizing a corresponding display function and composed of layers of layers structure.
  • the flexible display substrate is an array substrate of a flexible liquid crystal display
  • the display element includes at least a thin film transistor and is electrically connected to a drain of the thin film transistor.
  • the pixel electrode can also form a common electrode or the like.
  • the display element is a color film substrate of a flexible LCD, for a minimum display unit of the color film substrate, the display element includes a color layer and a black matrix, and of course, a common electrode or the like may be formed.
  • the display element comprises at least a cathode, an anode and a functional layer of organic material between the cathode and the anode. More specifically, when the manufactured flexible display substrate is a flexible passive OLED display panel, flexibility can be formed on the flexible substrate by forming an anode, a cathode, and an organic material functional layer between the anode and the cathode.
  • the layer may further include an electron injection layer disposed between the cathode and the electron transport layer, and a hole injection layer disposed between the anode and the hole transport layer.
  • step 4 the carrier substrate 1 is subjected to stripping pretreatment, and the flexible substrate 4 is peeled off from the carrier substrate 1 to obtain the flexible display substrate.
  • the stripping pretreatment comprises a treatment such as heating or pressing.
  • the separation pattern layer 2 is formed on the upper surface of the carrier substrate 1, and the separation unit of the separation pattern layer 2 is heated
  • the carrier substrate 1 is subjected to a heat treatment, and the carrier substrate 1 sequentially transfers heat to the separation pattern layer 2 and the bonding layer 3,
  • the separation pattern layer 2 is deformed in various directions while the adhesive layer 3 is deteriorated by thermal viscosities, particularly in a direction perpendicular to the carrier substrate 1, so that the flexible display substrate and the flexible display substrate can be
  • the gap between the carrier substrates 1 is uniformly generated, as shown in FIG. 5, so that the flexible display substrate can be easily peeled off from the carrier substrate 1 to prevent the flexible display substrate from being deformed during the peeling process, thereby improving
  • the yield of the flexible display substrate reduces the manufacturing cost of the flexible display substrate.
  • the separation pattern layer 2 is formed under the upper surface of the carrier substrate 1, and the separation unit of the separation pattern layer 2 contains a gas or a liquid, for
  • the carrier substrate 1 is subjected to a pressing process such that gas or liquid contained in the separation unit is squeezed between the flexible display substrate and the carrier substrate, and the flexible display substrate and the carrier A uniform separation state is formed between the substrates 1 as shown in FIG. 7 , so that the flexible display substrate can be easily peeled off from the carrier substrate 1 to prevent the flexible display substrate from being deformed during the peeling process, thereby improving The yield of the flexible display substrate reduces the manufacturing cost of the flexible display substrate.
  • the adhesive layer 3 may be left on the flexible display substrate, or the adhesive layer 3 may be left on the carrier substrate 1 In the embodiment of the present invention, the manner of processing the bonding layer 3 is not limited.
  • heating and pressing in this step may adopt various processing manners.
  • the specific manner of heating and pressing is not limited, and any applicable and non-supporting substrate is not used.
  • the manner in which the damage is caused falls within the scope of protection of the present invention.
  • An embodiment of the present invention further provides a flexible display substrate motherboard, the flexible display substrate motherboard comprising: a carrier substrate 1, a separation pattern layer 2, a bonding layer 3, and a flexible substrate 4, wherein:
  • the separation pattern layer 2 is formed on the carrier substrate 1, wherein the separation pattern
  • the layer 2 includes a plurality of separation units arranged at intervals;
  • the carrier substrate 1 is a rigid and flat substrate, which may be a substrate or a composite structure composed of at least two substrates. Regardless of whether the carrier substrate 1 is composed of one or more layers, the carrier substrate 1 as a whole needs to be a rigid substrate and has good flatness.
  • the carrier substrate 1 includes at least one metal substrate to improve its thermal conductivity.
  • the metal substrate may be, for example, a substrate made of a metal having good thermal conductivity such as an iron plate or a steel plate.
  • the thickness of the carrier substrate 1 is not limited.
  • the thickness ratio of the metal substrate and other substrates except the metal substrate is not limited. As long as the heat generated by the metal substrate can be applied to the adhesive layer 3, the effect of heating the adhesive layer 3 can be achieved.
  • the separation unit may take any shape, such as a strip shape, a circular shape, a star shape, a dot shape, or the like; further, the separation unit may form the separation pattern layer 2 in any possible interval arrangement, such as Arrangement of sequential arrangement, staggered arrangement, radioactive arrangement, dispersive arrangement, etc., for example, the separation unit forms the separation pattern layer 2 in a uniformly distributed manner; further, the cross section of the separation unit may present any possibility Shapes such as rectangles, circles, semicircles, trapezoids, and even irregular shapes.
  • Fig. 2 shows the separation pattern layer 2 obtained by staggering the strip separation units
  • Fig. 3 shows the separation pattern layer 2 which is sequentially arranged according to the circular separation unit.
  • the separation pattern layer 2 is formed on the upper surface of the carrier substrate 1, and a cross-sectional view of the carrier substrate 1 on which the separation pattern layer 2 is formed on the upper surface is as shown in FIG.
  • the separation unit of the separation pattern layer 2 is made of a heat deformation material such as a thermal expansion material, a thermal vaporization material, and a heat deformation pipeline.
  • the separation pattern layer 2 can be deformed in various directions by heating, especially in a direction perpendicular to the carrier substrate 1, so that the A gap is uniformly formed between the flexible display substrate and the carrier substrate 1, as shown in FIG. 5, so that the flexible display substrate can be more easily peeled off from the carrier substrate, thereby reducing or even eliminating deformation of the flexible display substrate during peeling.
  • the yield of the flexible display substrate is improved, and the manufacturing cost of the flexible display substrate is reduced.
  • the separation pattern layer 2 is formed on the carrier substrate Below the upper surface of 1, for example, in the form of a groove having a certain pressure bearing property, it is formed in the carrier substrate 1.
  • a cross-sectional view of the carrier substrate 1 on which the separation pattern layer 2 is formed under the upper surface is as shown in FIG.
  • the separation unit of the separation pattern layer 2 contains a gas or a liquid, so that when the flexible display substrate is required to be peeled off from the carrier substrate, a certain pressure is applied to cause the gas or liquid contained in the separation unit to be squeezed into the separation unit.
  • a uniform separation state is formed between the flexible display substrate and the carrier substrate 1, as shown in FIG. 7, so that the flexible display substrate can be more easily peeled off from the carrier substrate, thereby reducing Even the deformation of the flexible display substrate during peeling is eliminated, the yield of the flexible display substrate is improved, and the manufacturing cost of the flexible display substrate is reduced.
  • the specific shape of the separation unit, the specific arrangement of the separation unit, and the specific cross-sectional shape of the separation unit are not limited, as long as Any form of implementation of the separation unit that separates the flexible display substrate from the carrier substrate described above is within the scope of the present invention.
  • the area of the separation pattern layer 2 should be no more than the area of the carrier substrate 1 or the area of the separation unit of the separation pattern layer 2 should be no larger than the area of the carrier substrate 1 to avoid unnecessary resources. waste.
  • the bonding layer 3 is formed on the carrier substrate 1 on which the separation pattern layer 2 is formed;
  • the adhesive layer 3 is made of an adhesive, and the adhesive is poor in viscosity after being heated, and the adhesive may be, for example, a silane adhesive, a polyimide adhesive, or an acrylate. At least one of the adhesives.
  • the bonding layer 3 functions to fix the flexible substrate 4 and the carrier substrate 1 together, so that the position of the flexible substrate 4 can be accurately fixed, so that the flexible substrate 4 is formed on the flexible substrate 4.
  • the misalignment between the electronic components does not occur, resulting in the unfavorable consequences of the final use of the flexible display substrate.
  • the flexible substrate 4 is formed on the adhesive layer 3, and the flexible substrate 4 is formed with a display element on a side of the adhesive layer 3.
  • the flexible substrate 4 may be a plastic film, and the material thereof may include, for example, at least one of polyimide, polycarbonate, polyacrylate, and polyetherimide.
  • the flexible substrate 4 may be a single layer film or a multilayer film structure.
  • the display element refers to, according to the type of the flexible display substrate, corresponding to a minimum display unit of the flexible display substrate, which is indispensable for realizing a corresponding display function and composed of layers of layers structure.
  • the flexible display substrate is an array substrate of a flexible liquid crystal display
  • the display element includes at least a thin film transistor and is electrically connected to a drain of the thin film transistor.
  • the pixel electrode can also form a common electrode or the like.
  • the display element is a color film substrate of a flexible LCD, for a minimum display unit of the color film substrate, the display element includes a color layer and a black matrix, and of course, a common electrode or the like may be formed.
  • the display element comprises at least a cathode, an anode and a functional layer of organic material between the cathode and the anode. More specifically, when the manufactured flexible display substrate is a flexible passive OLED display panel, flexibility can be formed on the flexible substrate by forming an anode, a cathode, and an organic material functional layer between the anode and the cathode.
  • the layer may further include an electron injection layer disposed between the cathode and the electron transport layer, and a hole injection layer disposed between the anode and the hole transport layer.
  • the carrier substrate 1 is subjected to stripping pretreatment, and the flexible substrate 4 is peeled off from the carrier substrate 1 to obtain the flexible display.
  • the peeling pretreatment comprises a treatment such as heating or pressing.
  • the separation pattern layer 2 is formed on the upper surface of the carrier substrate 1, and the separation unit of the separation pattern layer 2 is heated
  • the carrier substrate 1 is subjected to a heat treatment, and the carrier substrate 1 sequentially transfers heat to the separation pattern layer 2 and the bonding layer 3,
  • the separation pattern layer 2 is deformed in various directions while the adhesive layer 3 is deteriorated by thermal viscosities, particularly in a direction perpendicular to the carrier substrate 1, so that the flexible display substrate and the flexible display substrate can be
  • the gap between the carrier substrates 1 is uniformly generated, as shown in FIG. 5, so that the flexible display substrate can be easily peeled off from the carrier substrate 1 to prevent the flexible display substrate from being deformed during the peeling process, thereby improving
  • the yield of the flexible display substrate reduces the manufacturing cost of the flexible display substrate.
  • the separation pattern layer 2 is formed under the upper surface of the carrier substrate 1, and the separation unit of the separation pattern layer 2 contains a gas or a liquid, for
  • the carrier substrate 1 is subjected to a pressing process such that gas or liquid contained in the separation unit is squeezed between the flexible display substrate and the carrier substrate, and the flexible display substrate and the carrier A uniform separation state is formed between the substrates 1 as shown in FIG. 7 , so that the flexible display substrate can be easily peeled off from the carrier substrate 1 to prevent the flexible display substrate from being deformed during the peeling process, thereby improving The yield of the flexible display substrate reduces the manufacturing cost of the flexible display substrate.
  • the adhesive layer 3 may be left on the flexible display substrate, or the adhesive layer 3 may be left on the carrier substrate 1 In the embodiment of the present invention, the manner of processing the bonding layer 3 is not limited.
  • heating and pressing in this step may adopt various processing manners.
  • the specific manner of heating and pressing is not limited, and any applicable and non-supporting substrate is not used.
  • the manner in which the damage is caused falls within the scope of protection of the present invention.
  • the present invention provides a separation pattern layer between the carrier substrate and the bonding layer, so that the flexible display substrate and the carrier are heated by heating when the flexible display substrate needs to be separated from the carrier substrate. Spaces can be uniformly generated between the substrates, thereby making it easier to peel off the flexible display substrate from the carrier substrate, and further The deformation of the flexible display substrate during peeling is reduced or eliminated, the yield of the flexible display substrate is improved, and the manufacturing cost of the flexible display substrate is reduced.

Abstract

提供一种柔性显示基板的制备方法，所述制备方法包括以下步骤：在承载基板（1）上形成分离图案层（2），其中，分离图案层（2）包括间隔排列的多个分离单元；在形成有分离图案层（2）的承载基板（1）上形成粘结层（3）；在粘结层（3）上形成柔性基底（4），并在柔性基底（4）相对粘结层（3）的一侧形成显示元件；对承载基板（1）进行剥离预处理，将柔性基底（4）与承载基板（1）剥离，形成柔性显示基板。还提供了一种柔性显示基板母板。通过加热或施压使得柔性显示基板与承载基板之间均匀地产生空隙，易于剥离柔性显示基板，减轻甚至消除柔性显示基板产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本，并且简单、易于实施。

Description

柔性显示基板母板及柔性显示基板的制备方法 技术领域
本发明的实施例涉及柔性显示技术领域，尤其涉及一种柔性显示基板母板及柔性显示基板的制备方法。
背景技术
柔性显示装置包括电子纸(柔性电泳显示)、柔性有机电致发光二极管显示装置(Organic Light-Emitting Diode，OLED)、以及柔性LCD等。
柔性显示装置中使用的显示基板(如柔性有机发光二极管显示装置的柔性阵列基板)是柔性显示基板，而柔性显示基板的基底由塑料等可弯曲的柔性材料制成，这就使得柔性显示基板的加工变得难度很大。在柔性显示基板的制备过程中，通常需要在一个坚硬而平坦的硬质承载基板上粘合一层柔性基底，再在柔性基底上形成构成显示结构的各膜层等，最后把制作完成的柔性显示基板从承载基板上剥离下来。这样做的原因是，显示组件的安装误差只能以微米来计算，才能使得电子元件之间不致错位，因此，在精细的显示组件制作过程中，需要精确固定柔性显示基板的位置和平坦度。这就要求柔性基底能够稳固地与承载基板相结合，而在制作完成之后把柔性显示基板从承载基板上剥离下来时，又要求柔性基底能够很容易地脱离承载基板。这样的要求在实际操作中很难达到，因为，柔性显示基板在从承载基板上剥离时往往会产生轻微的变形，从而导致电子元件线路错位，良品率降低，而单件面板的成本则相应大幅增加；另外，考虑到柔性显示基板的温度、张力等影响因素，柔性显示基板的剥离问题，成为目前柔性显示基板制备中的困难之一。
对于柔性显示基板制备过程中出现的上述困难，存在一些传统的解决方案，例如在承载基板上真空沉积一层薄膜，再在这层薄膜上放置柔性基底和显示组件，待柔性显示基板制备完成之后，连同薄膜一同撕离承载基板；或者用激光从侧面蒸发一整层承载基板以方便承载 基板与柔性基板的剥离等等。但是这些方法或者耗时过长，或者容易对柔性显示基板造成损伤，因此一直没有获得商品化的广泛应用。比如，当使用激光束用于承载基板与柔性基板的剥离处理时，尽管可以对激光束的强度和聚焦深度进行控制，但是由于柔性基底和在柔性基底上形成的显示元件的各图案层都非常薄，激光束发出的激光还是会不可避免的损坏显示元件。此外，由于激光束的光束面积有限，在剥离时，需要通过移动激光束来将所述柔性基底与硬质的承载基板逐渐剥离，这样的话会导致柔性基底和承载基板出现剥离不均的现象。
发明内容
本发明的实施例提出一种柔性显示基板母板及柔性显示基板的制备方法，由此例如至少减轻柔性显示基板在剥离时产生的形变。
本发明的实施例提出一种柔性显示基板的制备方法，所述制备方法包括以下步骤：
在承载基板上形成分离图案层，其中，所述分离图案层包括间隔排列的多个分离单元；
在形成有分离图案层的承载基板上形成粘结层；
在所述粘结层上形成柔性基底，并在所述柔性基底相对所述粘结层的一侧形成显示元件；
对所述承载基板进行剥离预处理，将所述柔性基底与所述承载基板剥离，形成所述柔性显示基板。
根据本发明的实施例，所述分离图案层形成在所述承载基板的上表面上，且所述分离单元由热形变材料制成。
根据本发明的实施例，所述对所述承载基板进行剥离预处理的步骤包括：对于所述承载基板进行加热，所述粘结层受热粘性变差的同时，分离图案层在各个方向上发生形变，所述柔性显示基板与承载基板之间均匀地产生空隙。
根据本发明的实施例，所述分离图案层形成在所述承载基板的上表面下方，且分离单元中容纳有气体或液体。
根据本发明的实施例，所述分离单元包括形成在所述承载基板中 的沟槽。
根据本发明的实施例，所述对所述承载基板进行剥离预处理的步骤包括：对于所述承载基板进行施压，分离单元中的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板之间形成均匀的分离状态。
根据本发明的实施例，所述分离图案层的面积不大于所述承载基板的面积。
根据本发明的实施例，所述分离图案层的分离单元的面积不大于所述承载基板的面积。
本发明的实施例还提出一种柔性显示基板母板，所述柔性显示基板母板包括：承载基板、分离图案层、粘结层和柔性基底，其中：
所述分离图案层形成在所述承载基板上，其中，所述分离图案层包括间隔排列的多个分离单元；
所述粘结层形成在形成有分离图案层的承载基板上；
所述柔性基底形成在所述粘结层上，且所述柔性基底相对所述粘结层的一侧形成有显示元件。
根据本发明的实施例，所述分离图案层形成在所述承载基板的上表面上，且所述分离单元由热形变材料制成。
根据本发明的实施例，所述分离图案层形成在所述承载基板的上表面下方，且分离单元中容纳有气体或液体。
根据本发明的实施例，所述分离单元包括形成在所述承载基板中的沟槽。
根据本发明的实施例，所述分离图案层的面积不大于所述承载基板的面积。
根据本发明的实施例，所述分离图案层的分离单元的面积不大于所述承载基板的面积。
根据本发明的实施例，所述粘结层由粘结胶制成，所述粘结胶在受热之后粘性变差。
根据本发明的实施例，通过在所述承载基板与所述粘结层之间设置分离图案层，达到在柔性显示基板制作完成需要与承载基板剥离 时，通过加热或施压等剥离预处理使得所述柔性显示基板与承载基板之间能够均匀地产生空隙，从而更容易地将柔性显示基板从承载基板上剥离下来，进而减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。另外，根据本发明的实施例的技术方案还具有简单、易于实施等优点。
附图说明
图1是根据本发明的实施例的柔性显示基板制备方法的流程图；
图2是根据本发明一实施例的形成有分离图案层的承载基板的俯视图；
图3是根据本发明另一实施例的形成有分离图案层的承载基板的俯视图；
图4是根据本发明一实施例的形成有分离图案层的承载基板的截面图；
图5是对承载基板加热后与柔性显示基板之间产生空隙的效果示意图；
图6是根据本发明另一实施例的形成有分离图案层的承载基板的截面图；
图7是对承载基板施压后与柔性显示基板之间产生空隙的效果示意图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。本发明的实施例提出一种柔性显示基板的制备方法，如图1、2所示，所述制备方法包括以下步骤：
步骤1，在承载基板1上形成分离图案层2，其中，所述分离图案层2包括间隔排列的多个分离单元；
其中，所述承载基板1为坚硬而平坦的基板，其可以为一层基板，也可以是由至少两层基板构成的复合结构。不管所述承载基板1是由 一层或多层构成，对于所述承载基板1整体来说，其需为硬质基板且具有良好的平坦度。例如，所述承载基板1至少包括一层金属基板，以提高其导热能力，所述金属基板例如可以为铁板、钢板等由导热性好的金属制成的基板。
另外，本发明的实施例中，不对所述承载基板1的厚度进行限定，当所述承载基板1包括至少两层基板时，金属基板和除金属基板外的其他基板的厚度比例也不进行限定，只要能使金属基板产生的热量施加在粘结层3上，从而起到加热粘结层3的效果即可。
所述分离单元可呈现任何可能的形状，比如条形、圆环形、星形、点形等形状；进一步地，所述分离单元可以任何可能的间隔排列方式形成所述分离图案层2，比如顺序排列、交错排列、放射性排列、分散性排列等排列方式，例如，所述分离单元以均匀分布的方式形成所述分离图案层2；更进一步地，所述分离单元的横截面可呈现任何可能的形状，比如矩形、圆形、半圆形、梯形甚至不规则形状。图2示出了根据条形分离单元交错排列得到的分离图案层2，图3示出了根据圆环形分离单元顺序排列得到的分离图案层2。
在本发明一实施例中，所述分离图案层2形成在所述承载基板1的上表面上，上表面上形成有分离图案层2的承载基板1的截面图如图4所示。其中，所述分离图案层2的分离单元由热形变材料制成，比如热膨胀材料、热气化材料，以及热形变管线等。这样在柔性显示基板制作完成需要与承载基板剥离时，通过加热可使得所述分离图案层2在各个方向上发生形变，尤其是在垂直于所述承载基板1方向上的形变，可使得所述柔性显示基板与承载基板1之间均匀地产生空隙，如图5所示，从而能够更容易地将柔性显示基板从承载基板上剥离下来，进而减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
在本发明另一实施例中，所述分离图案层2形成在所述承载基板1的上表面下方，比如以具有一定承压性的沟槽形式形成在所述承载基板1中。上表面下方形成有分离图案层2的承载基板1的截面图如图6所示。其中，所述分离图案层2的分离单元中容纳有气体或液体， 在本发明一实施例中，所述气体或液体对于所述分离图案层2和粘结层3无腐蚀，对于惰性的工艺环境不产生影响，可选为氮气，氩气，氦气，硅油等，这样在柔性显示基板制作完成需要与承载基板剥离时，通过施加一定的压力，使得分离单元中容纳的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板1之间形成均匀的分离状态，如图7所示，从而能够更容易地将柔性显示基板从承载基板上剥离下来，进而减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
需要说明的是，本发明的实施例中，对于所述分离单元所呈现出的具体形状、所述分离单元的具体排列方式以及所述分离单元的具体横截面形状均不作任何的限定，只要能实现上文描述的将所述柔性显示基板与承载基板分离开来的所述分离单元的任何存在形式都落入本发明的保护范围之内。
另外，所述分离图案层2的面积应不大于所述承载基板1的面积或所述分离图案层2的分离单元的面积应不大于所述承载基板1的面积，以避免造成不必要的资源浪费。
步骤2，在形成有分离图案层2的承载基板1上形成粘结层3；
其中，所述粘结层由粘结胶制成，所述粘结胶在受热之后粘性变差，所述粘结胶例如可以为硅烷粘结胶、聚酰亚胺粘结胶、丙烯酸酯粘结胶中的至少一种。
其中，所述粘结层3与所述分离图案层2之间的粘附性小于所述粘结层3与柔性基底4之间的粘附性。
其中，所述粘结层3的作用是将柔性基底4与所述承载基板1固定在一起，这样就可以对于所述柔性基底4的位置进行精确固定，从而使得形成在所述柔性基底4上的电子元件之间不致于发生错位，导致最终制得的柔性显示基板无法使用的不利后果。
步骤3，在所述粘结层3上形成柔性基底4，并在所述柔性基底4相对所述粘结层3的一侧形成显示元件；
其中，所述柔性基底4可以是塑料膜，其材料例如可以包括聚酰亚胺、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺中的至少一种。另外，所 述柔性基底4可以是单层膜或多层膜结构。
其中，所述显示元件是指，根据所述柔性显示基板的类型，对应所述柔性显示基板的一个最小的显示单元来说，实现相应显示功能的必不可少的、且由各层图案组成的结构。例如，当所述柔性显示基板为柔性液晶显示器的阵列基板时，则对于该阵列基板的一个最小显示单元来说，该显示元件至少包括薄膜晶体管、以及与所述薄膜晶体管的漏极电连接的像素电极，当然还可以形成公共电极等。当所述柔性显示基板为柔性LCD的彩膜基板时，则对于该彩膜基板的一个最小显示单元来说，该显示元件包括色层以及黑矩阵，当然还可以形成公共电极等，对于所述色层，其包括红色光阻、绿色光阻和蓝色光阻，也可以包括白色光阻；当所述柔性显示基板为柔性有机电致发光二极管的阵列基板时，则对于该阵列基板的一个最小显示单元来说，该显示元件至少包括阴极、阳极和位于阴极和阳极之间的有机材料功能层。更为具体地，当制作的柔性显示基板为柔性无源OLED显示面板时，在所述柔性基底上形成阳极、阴极、位于阳极和阴极之间的有机材料功能层的基础上，还可形成柔性封装层；对于所述有机材料功能层，其至少包括电子传输层、发光层和空穴传输层，为了能够提高所述电子和所述空穴注入发光层的效率，例如，所述有机材料功能层还可以包括设置在所述阴极与所述电子传输层之间的电子注入层，以及设置在所述阳极与所述空穴传输层之间的空穴注入层。当制作的柔性显示基板为柔性有源OLED显示面板时，在所述柔性基底上形成薄膜晶体管、阳极、阴极、以及位于阳极和阴极之间的有机材料功能层的基础上，还形成柔性封装层。
当然除此之外，还可以包括一些必要的图案层，例如保护层等或为改善显示效果或克服某些缺陷增加的一些图案层。
步骤4，对所述承载基板1进行剥离预处理，将所述柔性基底4与所述承载基板1剥离，从而得到所述柔性显示基板。
其中，所述剥离预处理包括加热或者施压等处理方式。
具体地，上文提及，在本发明一实施例中，所述分离图案层2形成在所述承载基板1的上表面上，所述分离图案层2的分离单元由热 形变材料制成，对于该实施例，在柔性显示基板制作完成之后，对于所述承载基板1进行加热处理，所述承载基板1将热量依次传递给所述分离图案层2和粘结层3，在所述粘结层3受热粘性变差的同时，所述分离图案层2在各个方向上发生形变，尤其是在垂直于所述承载基板1方向上的形变，可使得所述柔性显示基板与承载基板1之间均匀地产生空隙，如图5所示，这样就可以容易地将所述柔性显示基板从承载基板1上剥离下来，避免所述柔性显示基板在剥离过程中发生形变，从而提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
上文提及，在本发明另一实施例中，所述分离图案层2形成在所述承载基板1的上表面下方，所述分离图案层2的分离单元中容纳有气体或液体，对于该实施例，在柔性显示基板制作完成之后，对于所述承载基板1进行施压处理，使得分离单元中容纳的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板1之间形成均匀的分离状态，如图7所示，这样就可以容易地将所述柔性显示基板从承载基板1上剥离下来，避免所述柔性显示基板在剥离过程中发生形变，从而提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
另外，在剥离所述柔性显示基板和承载基板1的过程中，可将所述粘结层3留在所述柔性显示基板上，也可以将所述粘结层3留在所述承载基板1上，本发明的实施例中，对于所述粘结层3的处理方式不作任何限定。
需要说明的是，该步骤中的加热和施压可采用多种处理方式，本发明的实施例中，对于加热和施压的具体方式不作任何限定，任何可采用的、且不会对于承载基板造成损害的处理方式均落入本发明的保护范围内。
本发明的实施例还提出一种柔性显示基板母板，所述柔性显示基板母板包括：承载基板1、分离图案层2、粘结层3和柔性基底4，其中：
所述分离图案层2形成在所述承载基板1上，其中，所述分离图 案层2包括间隔排列的多个分离单元；
其中，所述承载基板1为坚硬而平坦的基板，其可以为一层基板，也可以是由至少两层基板构成的复合结构。不管所述承载基板1是由一层或多层构成，对于所述承载基板1整体来说，其需为硬质基板且具有良好的平坦度。例如，所述承载基板1至少包括一层金属基板，以提高其导热能力，所述金属基板例如可以为铁板、钢板等由导热性好的金属制成的基板。
另外，本发明的实施例中，不对所述承载基板1的厚度进行限定，当所述承载基板1包括至少两层基板时，金属基板和除金属基板外的其他基板的厚度比例也不进行限定，只要能使金属基板产生的热量施加在粘结层3上，从而起到加热粘结层3的效果即可。
所述分离单元可呈现任何可能的形状，比如条形、圆环形、星形、点形等形状；进一步地，所述分离单元可以任何可能的间隔排列方式形成所述分离图案层2，比如顺序排列、交错排列、放射性排列、分散性排列等排列方式，例如，所述分离单元以均匀分布的方式形成所述分离图案层2；更进一步地，所述分离单元的横截面可呈现任何可能的形状，比如矩形、圆形、半圆形、梯形甚至不规则形状。图2示出了根据条形分离单元交错排列得到的分离图案层2，图3示出了根据圆环形分离单元顺序排列得到的分离图案层2。
在本发明一实施例中，所述分离图案层2形成在所述承载基板1的上表面上，上表面上形成有分离图案层2的承载基板1的截面图如图4所示。其中，所述分离图案层2的分离单元由热形变材料制成，比如热膨胀材料、热气化材料，以及热形变管线等。这样在柔性显示基板制作完成需要与承载基板剥离时，通过加热可使得所述分离图案层2在各个方向上发生形变，尤其是在垂直于所述承载基板1方向上的形变，可使得所述柔性显示基板与承载基板1之间均匀地产生空隙，如图5所示，从而能够更容易地将柔性显示基板从承载基板上剥离下来，进而减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
在本发明另一实施例中，所述分离图案层2形成在所述承载基板 1的上表面下方，比如以具有一定承压性的沟槽形式形成在所述承载基板1中。上表面下方形成有分离图案层2的承载基板1的截面图如图6所示。其中，所述分离图案层2的分离单元中容纳有气体或液体，这样在柔性显示基板制作完成需要与承载基板剥离时，通过施加一定的压力，使得分离单元中容纳的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板1之间形成均匀的分离状态，如图7所示，从而能够更容易地将柔性显示基板从承载基板上剥离下来，进而减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
需要说明的是，本发明的实施例中，对于所述分离单元所呈现出的具体形状、所述分离单元的具体排列方式以及所述分离单元的具体横截面形状均不作任何的限定，只要能实现上文描述的将所述柔性显示基板与承载基板分离开来的所述分离单元的任何存在形式都落入本发明的保护范围之内。
另外，所述分离图案层2的面积应不大于所述承载基板1的面积或所述分离图案层2的分离单元的面积应不大于所述承载基板1的面积，以避免造成不必要的资源浪费。
所述粘结层3形成在形成有分离图案层2的承载基板1上；
其中，所述粘结层3由粘结胶制成，所述粘结胶在受热之后粘性变差，所述粘结胶例如可以为硅烷粘结胶、聚酰亚胺粘结胶、丙烯酸酯粘结胶中的至少一种。
其中，所述粘结层3的作用是将柔性基底4与所述承载基板1固定在一起，这样就可以对于所述柔性基底4的位置进行精确固定，从而使得形成在所述柔性基底4上的电子元件之间不致于发生错位，导致最终制得的柔性显示基板无法使用的不利后果。
所述柔性基底4形成在所述粘结层3上，且所述柔性基底4相对所述粘结层3的一侧形成有显示元件。
其中，所述柔性基底4可以是塑料膜，其材料例如可以包括聚酰亚胺、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺中的至少一种。另外，所述柔性基底4可以是单层膜或多层膜结构。
其中，所述显示元件是指，根据所述柔性显示基板的类型，对应所述柔性显示基板的一个最小的显示单元来说，实现相应显示功能的必不可少的、且由各层图案组成的结构。例如，当所述柔性显示基板为柔性液晶显示器的阵列基板时，则对于该阵列基板的一个最小显示单元来说，该显示元件至少包括薄膜晶体管、以及与所述薄膜晶体管的漏极电连接的像素电极，当然还可以形成公共电极等。当所述柔性显示基板为柔性LCD的彩膜基板时，则对于该彩膜基板的一个最小显示单元来说，该显示元件包括色层以及黑矩阵，当然还可以形成公共电极等，对于所述色层，其包括红色光阻、绿色光阻和蓝色光阻，也可以包括白色光阻；当所述柔性显示基板为柔性有机电致发光二极管的阵列基板时，则对于该阵列基板的一个最小显示单元来说，该显示元件至少包括阴极、阳极和位于阴极和阳极之间的有机材料功能层。更为具体地，当制作的柔性显示基板为柔性无源OLED显示面板时，在所述柔性基底上形成阳极、阴极、位于阳极和阴极之间的有机材料功能层的基础上，还可形成柔性封装层；对于所述有机材料功能层，其至少包括电子传输层、发光层和空穴传输层，为了能够提高所述电子和所述空穴注入发光层的效率，例如，所述有机材料功能层还可以包括设置在所述阴极与所述电子传输层之间的电子注入层，以及设置在所述阳极与所述空穴传输层之间的空穴注入层。当制作的柔性显示基板为柔性有源OLED显示面板时，在所述柔性基底上形成薄膜晶体管、阳极、阴极、以及位于阳极和阴极之间的有机材料功能层的基础上，还形成柔性封装层。
当然除此之外，还可以包括一些必要的图案层，例如保护层等或为改善显示效果或克服某些缺陷增加的一些图案层。根据上述实施例的技术方案制得所述柔性显示基板母板之后，对所述承载基板1进行剥离预处理，将所述柔性基底4与所述承载基板1剥离，就可以得到所述柔性显示基板，其中，所述剥离预处理包括加热或者施压等处理方式。
具体地，上文提及，在本发明一实施例中，所述分离图案层2形成在所述承载基板1的上表面上，所述分离图案层2的分离单元由热 形变材料制成，对于该实施例，在柔性显示基板制作完成之后，对于所述承载基板1进行加热处理，所述承载基板1将热量依次传递给所述分离图案层2和粘结层3，在所述粘结层3受热粘性变差的同时，所述分离图案层2在各个方向上发生形变，尤其是在垂直于所述承载基板1方向上的形变，可使得所述柔性显示基板与承载基板1之间均匀地产生空隙，如图5所示，这样就可以容易地将所述柔性显示基板从承载基板1上剥离下来，避免所述柔性显示基板在剥离过程中发生形变，从而提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
上文提及，在本发明另一实施例中，所述分离图案层2形成在所述承载基板1的上表面下方，所述分离图案层2的分离单元中容纳有气体或液体，对于该实施例，在柔性显示基板制作完成之后，对于所述承载基板1进行施压处理，使得分离单元中容纳的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板1之间形成均匀的分离状态，如图7所示，这样就可以容易地将所述柔性显示基板从承载基板1上剥离下来，避免所述柔性显示基板在剥离过程中发生形变，从而提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
另外，在剥离所述柔性显示基板和承载基板1的过程中，可将所述粘结层3留在所述柔性显示基板上，也可以将所述粘结层3留在所述承载基板1上，本发明的实施例中，对于所述粘结层3的处理方式不作任何限定。
需要说明的是，该步骤中的加热和施压可采用多种处理方式，本发明的实施例中，对于加热和施压的具体方式不作任何限定，任何可采用的、且不会对于承载基板造成损害的处理方式均落入本发明的保护范围内。
根据上述技术方案，本发明通过在所述承载基板与所述粘结层之间设置分离图案层，达到在柔性显示基板制作完成需要与承载基板剥离时，通过加热使得所述柔性显示基板与承载基板之间能够均匀地产生空隙，从而更容易地将柔性显示基板从承载基板上剥离下来，进而 减轻甚至消除柔性显示基板在剥离时产生的形变，提高柔性显示基板的良品率，降低柔性显示基板的制作成本。
需要说明的是，基于上述描述，本领域技术人员应当了解，本发明实施例中提及的所有附图均是柔性显示基板制备过程中简略的示意图或者柔性显示基板母板的结构示意图，其只为清楚地描述本发明技术方案中与本发明点相关的结构，对于其他的与本发明点无关的结构属于现有结构，在附图中并未体现或者只体现部分。
以上实施方式仅用于说明本发明，而并非对本发明的限制，有关技术领域的普通技术人员，在不脱离本发明的范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明的范畴，本发明的专利保护范围应由权利要求限定。

Claims (15)

  1. 一种柔性显示基板的制备方法，所述制备方法包括以下步骤：
    在承载基板上形成分离图案层，其中，所述分离图案层包括间隔排列的多个分离单元；
    在形成有分离图案层的承载基板上形成粘结层；
    在所述粘结层上形成柔性基底，并在所述柔性基底相对所述粘结层的一侧形成显示元件；
    对所述承载基板进行剥离预处理，将所述柔性基底与所述承载基板剥离，形成所述柔性显示基板。
  2. 根据权利要求1所述的方法，其中，所述分离图案层形成在所述承载基板的上表面上，且所述分离单元由热形变材料制成。
  3. 根据权利要求2所述的方法，其中，所述对所述承载基板进行剥离预处理的步骤包括：对于所述承载基板进行加热，所述粘结层受热粘性变差的同时，分离图案层在各个方向上发生形变，所述柔性显示基板与承载基板之间均匀地产生空隙。
  4. 根据权利要求1所述的方法，其中，所述分离图案层形成在所述承载基板的上表面下方，且分离单元中容纳有气体或液体。
  5. 根据权利要求4所述的方法，其中，所述分离单元包括形成在所述承载基板中的沟槽。
  6. 根据权利要求4或5所述的方法，其中，所述对所述承载基板进行剥离预处理的步骤包括：对于所述承载基板进行施压，分离单元中的气体或液体挤入至柔性显示基板与承载基板之间，所述柔性显示基板与承载基板之间形成均匀的分离状态。
  7. 根据权利要求1所述的方法，其中，所述分离图案层的面积不大于所述承载基板的面积。
  8. 根据权利要求1所述的方法，其中，所述分离图案层的分离单元的面积不大于所述承载基板的面积。
  9. 一种柔性显示基板母板，所述柔性显示基板母板包括：承载基板、分离图案层、粘结层和柔性基底，其中：
    所述分离图案层形成在所述承载基板上，其中，所述分离图案层包括间隔排列的多个分离单元；
    所述粘结层形成在形成有分离图案层的承载基板上；
    所述柔性基底形成在所述粘结层上，且所述柔性基底相对所述粘结层的一侧形成有显示元件。
  10. 根据权利要求9所述的柔性显示基板母板，其中，所述分离图案层形成在所述承载基板的上表面上，且所述分离单元由热形变材料制成。
  11. 根据权利要求9所述的柔性显示基板母板，其中，所述分离图案层形成在所述承载基板的上表面下方，且分离单元中容纳有气体或液体。
  12. 根据权利要求11所述的柔性显示基板母板，其中，所述分离单元包括形成在所述承载基板中的沟槽。
  13. 根据权利要求9所述的柔性显示基板母板，其中，所述分离图案层的面积不大于所述承载基板的面积。
  14. 根据权利要求9所述的柔性显示基板母板，其中，所述分离图案层的分离单元的面积不大于所述承载基板的面积。
  15. 根据权利要求9所述的柔性显示基板母板，其中，所述粘结层由粘结胶制成，所述粘结胶在受热之后粘性变差。
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