WO2019153149A1 - 柔性基板及其制作方法以及电子装置 - Google Patents
柔性基板及其制作方法以及电子装置 Download PDFInfo
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- WO2019153149A1 WO2019153149A1 PCT/CN2018/075645 CN2018075645W WO2019153149A1 WO 2019153149 A1 WO2019153149 A1 WO 2019153149A1 CN 2018075645 W CN2018075645 W CN 2018075645W WO 2019153149 A1 WO2019153149 A1 WO 2019153149A1
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- WIPO (PCT)
- Prior art keywords
- flexible substrate
- photoresist layer
- substrate
- photoresist
- flexible
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 227
- 238000002360 preparation method Methods 0.000 title abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 144
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 92
- 239000002346 layers by function Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000971 Silver steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000110 poly(aryl ether sulfone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Definitions
- the present invention relates to the field of display technologies, and in particular, to a flexible substrate, a method for fabricating the same, and an electronic device.
- the current flexible substrate is mainly produced by coating a flexible substrate material on a rigid substrate, and then curing the flexible substrate material to form a flexible substrate by heating and baking, and then fabricating an electronic element on the flexible substrate.
- the device finally separates the flexible substrate from the rigid substrate by a laser.
- the phenomenon that adhesion between the flexible substrate and the rigid substrate is likely to occur affects the peeling efficiency.
- an embodiment of the present invention discloses a flexible substrate that is easily peeled off from a rigid substrate, a manufacturing method thereof, and an electronic device.
- a method for manufacturing a flexible substrate comprising the steps of:
- the flexible substrate is further formed.
- each photoresist layer includes a trench penetrating the photoresist layer, each flexible substrate including a body and at least one extension extending from one side of the body, each extension being received in one of the trenches The slot is coupled to the rigid substrate.
- forming at least one patterned photoresist layer on the rigid substrate includes the following steps:
- the exposed photoresist material is developed to form the photoresist layer.
- forming a flexible substrate on each photoresist layer includes the following steps:
- the flexible material is cured to form the flexible substrate.
- the flexible substrate is made of polyimide.
- the laser has a wavelength of 308 nm.
- the rigid substrate is glass.
- the photoresist layer is made of a positive photoresist material.
- a flexible substrate includes a flexible substrate and a patterned photoresist layer, the flexible substrate being disposed on the photoresist layer.
- the flexible substrate comprises a body and an extension extending from a side of the body, the photoresist layer is disposed on one side of the body, and the photoresist layer comprises at least one through the photoresist layer a groove, each extension being received in one of the grooves.
- the photoresist layer includes a plurality of spaced-apart photoresist portions, and each of the two mutually spaced photoresist portions forms one of the trenches.
- An electronic device comprising a flexible substrate as described above.
- the photoresist layer includes at least one trench penetrating the photoresist layer, and each extension portion of the flexible substrate is accommodated in one of the trenches to be connected with the rigid substrate to ensure the flexible substrate and the flexible substrate
- the connection of the rigid substrate further makes the flexible substrate not easily detach from the rigid substrate in a subsequent high temperature process, thereby avoiding affecting subsequent processes of the flexible substrate. Since the photoresist layer reduces the contact area of the flexible substrate with the rigid substrate, the peeling of the flexible substrate from the rigid substrate is facilitated.
- FIG. 1 is a flowchart of a method for fabricating a flexible substrate according to an embodiment of the present invention.
- FIG 2 is a side view of a photoresist layer formed on a rigid substrate.
- FIG 3 is a side view of a flexible substrate formed on a photoresist layer.
- FIG. 4 is a side view of forming a functional layer on a flexible substrate.
- Figure 5 is a side elevational view of the laser irradiated rigid substrate away from the flexible substrate.
- Figure 6 is a side view of a flexible substrate.
- Figure 7 is a flow chart of the step 2 shown in Figure 1.
- Figure 8 is a top plan view of a photoresist material applied to at least one of the arrangement regions of the rigid substrate.
- Figure 9 is a side elevational view of the photoresist material applied to at least one of the arrangement regions of the rigid substrate.
- Figure 10 is a schematic illustration of light exposure of the photoresist material from one side of the reticle.
- FIG. 11 is a schematic view showing development of the photoresist material after exposure treatment to form the photoresist layer.
- Figure 12 is a flow chart of the step 3 shown in Figure 1.
- FIG. 13 is a schematic diagram of an electronic device according to an embodiment of the present invention.
- the present invention provides a method for fabricating a flexible substrate, including the following steps:
- Step 1 As shown in FIG. 2, a rigid substrate 200 is provided.
- the rigid substrate 200 includes a first surface 201 and a second surface 203 disposed opposite to each other, and the first surface 201 includes at least one arrangement region 205.
- Step 2 forming at least one patterned photoresist layer 30 on the rigid substrate 200.
- a patterned photoresist layer 30 is formed on each of the configuration regions 205.
- the number of the configuration regions 205 is greater than one
- the number of the at least one patterned photoresist layer 30 is greater than one
- the photoresist layers 30 disposed on the rigid substrate 200 are spaced apart, adjacent to each other.
- a spacer region 300 is formed between the resist layers 30.
- each photoresist layer 30 includes a plurality of trenches 33 penetrating through the photoresist layer 30 to partition the photoresist layer 30 into a plurality of photoresist portions 35.
- the patterned photoresist layer 30 is provided with a photomask at a plurality of positions corresponding to the photoresist portion 35, and then the photomask is removed by exposing the photoresist layer 30 from the mask side.
- the photoresist layer 30 is formed by partially forming the trenches 33.
- Step 3 As shown in FIG. 3, a flexible substrate 50 is formed on each of the photoresist layers 30. Obviously, when the number of the at least one patterned photoresist layer 30 is one, a flexible substrate 50 is formed on the one photoresist layer 30, and the number of the at least one patterned photoresist layer 30 is In a plurality of cases, a flexible substrate 50 is formed on each of the plurality of photoresist layers 30, respectively.
- each of the flexible substrates 50 includes a main body 51 and at least one extending portion 53 extending from one side of the main body 51.
- Each of the extending portions 53 is received in a groove 33 and connected to the rigid substrate 200 to ensure The flexible substrate 50 is adhered to the rigid substrate 200, so that the flexible substrate 50 is not easily detached from the rigid substrate 200 in a subsequent high-temperature process (about 350 to 400 degrees in the present embodiment), thereby avoiding affecting the flexible substrate 100.
- a subsequent high-temperature process about 350 to 400 degrees in the present embodiment
- the flexible substrate 50 may be formed after the flexible base material is cast on the patterned photoresist layer 30, including the main body 51 and the extension 53 poured in the groove 33. structure.
- Step 4 as shown in FIG. 4, a functional layer 70 is formed on the side of the flexible substrate 50 away from the rigid substrate 200.
- the functional layer 70 is an electronic component layer including a plurality of electronic components.
- the functional layer 70 is a thin film transistor layer including a gate, a source, a drain, etc., and is not used herein. Narration.
- electronic devices such as processors, memories, and the like may also be mounted on the functional layer 70.
- the functional layer 70 is of other structures.
- the functional layer 70 is a color film substrate.
- Step 5 as shown in FIG. 5, emitting laser light 501 toward the side of the rigid substrate 200 away from the flexible substrate 50, so that the laser light 501 is irradiated to the photoresist layer 30 through the rigid substrate 200, so that the The photoresist layer 30 and the flexible substrate 50 are peeled off from the rigid substrate 200 to form a flexible substrate 100 as shown in FIG.
- the rigid substrate 200 may be made of a light transmissive material, such as a transparent hard plastic, a transparent glass, a transparent resin, or the like.
- the flexible substrate 100 includes a flexible substrate 50 , a functional layer 70 , and a patterned photoresist layer 30 .
- the flexible substrate 50 is sandwiched between the functional layer 70 and the photoresist layer 30 .
- step 2 that is, forming at least one patterned photoresist layer 30 on the rigid substrate 200, includes the following steps:
- Step 201 referring to FIG. 8 and FIG. 9, coating the photoresist material 38 in at least one of the arrangement regions 205 of the rigid substrate 200.
- the number of the configuration areas 205 is four, and the arrangement areas 205 are spaced apart from each other, and the photoresist material 38 is applied to each of the arrangement areas 205.
- Step 202 curing the photoresist material 38.
- Step 203 referring to FIG. 10, the photoresist material 38 is exposed from one side of the reticle 39 by light 601.
- Step 204 referring to FIG. 11, the exposed photoresist material 38 is developed to form the patterned photoresist layer 30.
- the patterned photoresist layer 30 includes the photoresist portion 35 composed of the trenches 33, and the position of the photoresist portion 35 corresponds to the position of the photomask 39.
- step 3 that is, forming the flexible substrate 50 on each of the photoresist layers 30, comprises the following steps:
- Step 301 coating a flexible material on each of the photoresist layers 30.
- Step 302 curing the flexible material to form the flexible substrate 50.
- the flexible substrate 50 is made of a polyimide material, and the photoresist material 38 is a positive photoresist material.
- the rigid substrate 200 is glass, and the wavelength of the laser light is 308 nm.
- the thermochemical stability of the photoresist layer 30 and the flexible substrate 50 remains stable under laser irradiation at a wavelength of 308 nm.
- the flexible substrate 50 can be made of other materials, such as polyethylene terephthalate, polyaryl ether sulfone, polyethylene naphthalate or the like; or, aluminum, copper, It is composed of a metal material such as silver or stainless steel.
- the photoresist material 38 may be a negative photoresist material.
- the wavelength of the laser is selected to meet the needs. Peeling effect.
- the invention is not limited to the above materials and laser wavelengths. On the basis of not improving the process difficulty, by studying the physical and chemical properties of different materials and improving the process, the yield requirement of the flexible substrate required to peel off the rigid substrate can be obtained.
- the positive photoresist layer used in the current process can withstand the high temperature process of flexible materials (polyimide) (about 350 to 400 degrees high temperature), and is easily peeled off at 308 nm laser, which can be used to improve the peeling performance of the flexible substrate.
- the rigid substrate 200 is provided with at least one arrangement region 205, a photoresist layer 30 is formed in each of the arrangement regions 201, and a flexible substrate 50 is formed on the photoresist layer 30 of each of the arrangement regions 205, and a functional layer 70 is formed on each of the flexible substrates 50.
- the manufacturing efficiency of the flexible substrate 100 can be improved.
- the step 4 can be omitted, that is, the functional layer 70 is formed on the side of the flexible substrate 50 away from the rigid substrate 200.
- the manufacturing method of the flexible substrate includes the following steps: Providing a rigid substrate; forming at least one patterned photoresist layer on the rigid substrate; forming a flexible substrate on each of the photoresist layers; emitting laser light toward a side of the rigid substrate away from the flexible substrate, such that After the laser passes through the rigid substrate, the photoresist layer is irradiated, and the flexible substrate and the photoresist layer are peeled off from the rigid substrate to form the flexible substrate.
- the present invention further provides a flexible substrate 100 including a flexible substrate 50, a functional layer 70, and a patterned photoresist layer 30, the flexible substrate 50 being sandwiched between the functional layer 70 and the photoresist Between layers 30.
- the flexible substrate 50 includes a main body 51 and an extending portion 53 extending from a side of the main body 51.
- the functional layer 70 is disposed on a side of the main body 51 away from the extending portion 53.
- the resist layer 30 is disposed on a side of the main body 51 away from the functional layer 70, and the photoresist layer 30 includes at least one trench 33 penetrating the photoresist layer 30, and each of the extending portions 53 is accommodated in one of the Groove 33.
- the photoresist layer 30 includes a plurality of spaced-apart photoresist portions 35, and each of the two mutually spaced photoresist portions 35 forms one of the trenches 33.
- a photoresist layer 30 is formed on the first surface 201 of the rigid substrate 200, and then a flexible substrate 50 is formed on the photoresist layer 30, and then the function is formed on the flexible substrate 50.
- the layer 70 is then emitted toward the second surface 203 of the rigid substrate 200 such that the flexible substrate 100 and the photoresist layer 30 peel off the rigid substrate 200 to form the flexible substrate 100. Since the photoresist layer 30 is more easily laser ablated than the flexible substrate 50, the flexible substrate 100 is more easily peeled off, the peeling efficiency of the flexible substrate 100 is improved, and the functional layer 70 is prevented from being caused during the peeling process. The damage further improves the process yield of the flexible substrate 100.
- the photoresist layer 30 includes at least one trench 33 penetrating the photoresist layer 30, and each of the extending portions 53 is received in one of the trenches 33, and the photoresist layer 30 reduces the flexible substrate 50 and the The contact area of the rigid substrate 200, the photoresist layer 30 facilitates the adhesion of the flexible substrate 100 from the rigid substrate 200 while ensuring adhesion of the flexible substrate 50 to the rigid substrate 200.
- the photoresist layer 30 is made of a positive photoresist material
- the flexible substrate 50 is made of polyimide
- the functional layer 70 is a thin film transistor layer including a gate and a source. Structures such as drains are not described here.
- the flexible substrate 100 can omit the functional layer 70.
- the flexible substrate 100 can be used as a substrate of other structures, such as a flexible substrate of a color film substrate, or can be used as a substrate when making other components or structures. limited.
- a flexible substrate 100 includes a flexible substrate 50 and a patterned photoresist layer 30.
- the flexible substrate 50 is disposed on the photoresist layer 30.
- the flexible substrate 50 includes a main body 51 and a side of the main body 51.
- An extension portion 53 is formed, the photoresist layer 30 is disposed on one side of the main body 51, and the photoresist layer 30 includes at least one groove 33 penetrating the photoresist layer, and each extension portion 53 is accommodated in One of the grooves 33.
- FIG. 13 is a schematic diagram of an electronic device 200 according to an embodiment of the present invention.
- the electronic device 200 includes the flexible substrate 100 described above.
- the electronic device 200 can be a mobile phone, a tablet computer, a display, or the like.
- the laser ablation makes the flexible substrate 100 more easily peeled off from the rigid substrate 200, avoiding damage to the functional layer 70 during the peeling process, improving the peeling efficiency of the flexible substrate 100, and further improving the flexible substrate 100. Process yield.
- the photoresist layer 30 includes at least one trench 33 penetrating the photoresist layer 30, and each extension portion 53 of the flexible substrate 50 is accommodated in one of the trenches 33 to ensure the flexible substrate 50 and
- the adhesion of the rigid substrate 200 further makes the flexible substrate 50 not easily detach from the rigid substrate 200 in a subsequent high-temperature process (about 350 to 450 degrees in the present embodiment), thereby avoiding the subsequent process of affecting the flexible substrate 100. Since the photoresist layer 30 reduces the contact area of the flexible substrate 50 with the rigid substrate 200, the peeling of the flexible substrate 100 from the rigid substrate 200 is facilitated.
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Abstract
本发明公开一种柔性基板的制作方法，包括以下步骤：提供一刚性基板；在所述刚性基板上形成至少一个图案化的光阻层；在每个光阻层上形成柔性基底；朝向所述刚性基板远离所述柔性基底一侧发射激光，使得所述激光通过所述刚性基板后照射到所述光阻层，所述柔性基底及所述光阻层从所述刚性基板剥离，进而形成所述柔性基板。由于在刚性基板形成光阻层，使得所述柔性基板更容易剥离，提高了所述柔性基板的剥离效率，避免在剥离过程中对所述柔性基底上的结构造成损坏，进而提高了柔性基板的制程良率。本发明亦提供一种柔性基板和电子装置。
Description
本发明涉及一种显示技术领域，特别涉及一种柔性基板及其制作方法以及电子装置。
柔性显示领域中，当前柔性基板主要的制作过程是：将柔性基底材料涂布在刚性基板上，再通过对柔性基底材料进行加热烘烤使其固化形成柔性基底，然后在柔性基底上制作电子元器件，最后通过镭射激光使柔性基底与刚性基板分离。然而，在通过镭射激光将柔性基底剥离刚性基板时，柔性基底与刚性基底之间容易出现粘连的现象影响剥离效率。
发明内容
为解决上述问题，本发明实施例公开一种易从刚性基板剥离的柔性基板及其制作方法以及电子装置。
一种柔性基板的制作方法，包括以下步骤：
提供一刚性基板；
在所述刚性基板上形成至少一个图案化的光阻层；
在每个光阻层上形成柔性基底；
朝向所述刚性基板远离所述柔性基底一侧发射激光，使得所述激光通过所述刚性基板后照射到所述光阻层，所述柔性基底及所述光阻层从所述刚性基板剥离，进而形成所述柔性基板。
进一步地，每个光阻层包括贯穿所述光阻层的沟槽，每个柔性基底包括主体及由所述主体一侧延伸形成的至少一个延伸部，每个延伸部容纳于一个所述沟槽并与所述刚性基板连接。
进一步地，“在所述刚性基板上形成至少一个图案化的光阻层”，包括以下步骤：
在所述刚性基板的至少一个配置区上涂布光阻材料；
对所述光阻材料进行固化处理；
通过光从光罩的一侧对所述光阻材料进行曝光；及
对经曝光处理后的光阻材料进行显影，形成所述光阻层。
进一步地，所述“在每个光阻层上形成柔性基底”，包括以下步骤：
在所述光阻层上涂布柔性材料；
对所述柔性材料进行固化形成所述柔性基底。
进一步地，所述柔性基底由聚酰亚胺制成。
进一步地，所述激光的波长为308nm。
进一步地，所述刚性基板为玻璃。
进一步地，所述光阻层由正性光阻材料制成。
一种柔性基板，包括柔性基底及图案化的光阻层，所述柔性基底设于所述光阻层上。
进一步地，所述柔性基底包括主体及由所述主体一侧延伸形成的延伸部，所述光阻层设于所述主体的一侧，所述光阻层包括至少一个贯穿所述光阻层的沟槽，每个延伸部容纳于一个所述沟槽。
进一步地，所述光阻层包括多个间隔设置的光阻部，每两个相互间隔设置的光阻部形成一个所述沟槽。
一种电子装置，包括如上所述的柔性基板。
本发明提供的柔性基板及其制作方法以及电子装置，在所述刚性基板形成图案化的所述光阻层，再在所述光阻层上形成所述柔性基底，使得所述柔性基板更容易从所述刚性基板上剥离，提高了所述柔性基板的剥离效率。此外，能够避免在剥离过程中对设于所述柔性基底上的结构/元件(例如电子元器件)造成损坏。另外，所述光阻层包括至少一个贯穿所述光阻层的沟槽，所述柔性基底的每个延伸部容纳于一个所述沟槽以与所述刚性基板连接，保证所述柔性基底与所述刚性基板的连接，进而使所述柔性基底在后续的高温制程中不易脱离所述刚性基板，避免影响所述柔性基板的后续制程。由于所述光阻层减少了所述柔性基底与所述刚性基板的接触面积，方便了所述柔性基板从所述刚性基板的剥离。
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的柔性基板的制作方法的流程图。
图2为在刚性基板上形成光阻层的侧视图。
图3为在光阻层上形成柔性基底的侧视图。
图4为在柔性基底上形成功能层的侧视图。
图5为激光照射刚性基板远离柔性基底一侧的侧视图。
图6为柔性基板的侧视图。
图7为图1所示步骤2的流程图。
图8为在刚性基板的至少一个配置区涂布光阻材料的俯视图。
图9为在刚性基板的至少一个配置区涂布光阻材料的侧视图。
图10为光从光罩的一侧对所述光阻材料进行曝光的示意图。
图11为对经曝光处理后的光阻材料进行显影，形成所述光阻层的示意图。
图12为图1所示步骤3的流程图。
图13为本发明实施例提供的电子装置的示意图。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图6，本发明提供一种柔性基板的制作方法，包括以下步骤：
步骤1，如图2所示，提供一刚性基板200。
具体的，所述刚性基板200包括相对设置的第一表面201及第二表面203，第一表面201包括至少一个配置区205。
步骤2，在所述刚性基板200上形成至少一个图案化的光阻层30。
进一步地，在每个配置区205上形成一个图案化的光阻层30。当所述配置区205的数量大于一个时，所述至少一个图案化的光阻层30的数量大于一个，所述设置于所述刚性基板200上的光阻层30间隔设置，相邻的光阻层30之间形成间隔区域300。
进一步地，每个光阻层30包括贯穿所述光阻层30的多个沟槽33而将所述光阻层30分隔成多个光阻部35。
更进一步的，所述图案化的光阻层30为在对应光阻部35的多个位置分别设置光罩，然后通过从所述光罩侧对所述光阻层30进行曝光而去除光罩之外的光阻层30部分形成所述沟槽33而得到。
步骤3，如图3所示，在每个光阻层30上形成柔性基底50。显然，当所述至少一个图案化的光阻层30的数量为一个时，为在所述一个光阻层30上形成一个柔性基底50，当所述至少一个图案化的光阻层30的数量为多个时，为在多个光阻层30中的每一个上分别形成一个柔性基底50。
进一步地，每个柔性基底50包括主体51及由所述主体51一侧延伸形成的至少一个延伸部53，每个延伸部53容纳于一个沟槽33并与所述刚性基板200连接，以保证所述柔性基底50粘附于所述刚性基板200，进而使柔性基底50在后续的高温制程(本实施方式中约350～400度高温)中不易脱离所述刚性基板200，避免影响柔性基板100的后续制程。由于光阻层30减少了所述柔性基底50与所述刚性基板200的接触面积，方便后续所述柔性基底50从所述刚性基板200剥离。在一些实施例中，所述柔性基底50可为柔性基底材料浇筑在所述图案化的光阻层30上后形成的包括所述主体51以及灌注于所述沟槽33中的延伸部53的结构。
步骤4，如图4所示，在所述柔性基底50远离所述刚性基板200一侧形成功能层70。
本实施方式中，所述功能层70为一电子元器件层，其包括若干电子元器件，所述功能层70为薄膜晶体管层，其包括栅极、源极、漏极等结构，在此不作赘述。在一些实施例中，所述功能层70上也可安装处理器、存储器等电子器件。在一实施例中，所述功能层70为其他结构，例如，所述功能层70为彩膜基板。
步骤5，如图5所示，朝向所述刚性基板200远离所述柔性基底50一侧发射激光501，使得所述激光501通过刚性基板200后照射到所述光阻层30，而使得所述光阻层30及所述柔性基底50从所述刚性基板200剥离，进而形成如图6所示的柔性基板100。其中，所述刚性基板200可为透光性材料制成，例如透明硬塑料、透明玻璃、透明树脂等等材料制成。
如图6所示，所述柔性基板100包括柔性基底50、功能层70及图案化的光阻层30，所述柔性基底50夹设于所述功能层70及光阻层30之间。
请参阅图7，为前述的步骤2的更具体的流程图。进一步地，所述步骤2，即，在所述刚性基板200上形成至少一个图案化的光阻层30，包括以下步骤：
步骤201，请参阅图8及图9，在所述刚性基板200的至少一个配置区205涂布光阻材料38。
本实施方式中，配置区205的数量为4个，配置区205之间间隔设置，在每个配置区205涂布光阻材料38。
步骤202，对所述光阻材料38进行固化处理。
步骤203，请参阅图10，通过光601从光罩39的一侧对所述光阻材料38进行曝光。
步骤204，请参阅图11，对经曝光处理后的光阻材料38进行显影，形成所述图案化的光阻层30。
在每个配置区205的固化的光阻材料38的未被光罩39遮盖的部分进行蚀刻形成沟槽33，而形成所述图案化的光阻层30。如前所述，所述图案化的光阻层30包括由沟槽33构成的光阻部35，且光阻部35的位置与所述光罩39的位置对应。
请参阅图12，为前述的步骤3的更具体的流程图。进一步地，所述步骤3，即，在每个光阻层30上形成柔性基底50，包括以下步骤：
步骤301，在每个光阻层30上涂布柔性材料。
步骤302，对所述柔性材料进行固化形成所述柔性基底50。
本实施方式中，所述柔性基底50由聚酰亚胺材料制成，所述光阻材料38为正性光阻材料。所述刚性基板200为玻璃，所述激光的波长为308nm。在波长为308nm的激光照射下，所述光阻层30与所述柔性基底50的热化学稳定性保持稳定。
可以理解，所述柔性基底50可以由其它材料制成，例如聚对苯二甲酸乙二酯、聚芳醚砜、聚萘二甲酸乙二酯等高分子材料构成；或者，由铝、铜、银、不锈钢等金属材料构成，所述光阻材料38可以为负性光阻材料；依据柔性基底50的材料、光阻层30的材料、刚性基板200的材料，选用激光的波长，以达到需要的剥离效果。本发明不局限上述材料及激光波长，在不提升工艺难度的基础上，通过研究不同材料的物理及化学性能，改善工艺，可以得到所要求柔性基底剥离所述刚性基板的良率要求。
当前工艺所用的正性光阻层能承受柔性材料(聚酰亚胺)的高温制程(约350～400度高温)，同时在308nm镭射时容易被剥离，可以用于改善柔性基底的剥离性能。
刚性基板200设至少一个配置区205，在每一配置区201形成光阻层30，在每一配置区205的光阻层30上形成柔性基底50，每一柔性基底50上均形成功能层70，以能够在同一制程中，同时制作至少一个柔性基板100，进而能够提高柔性基板100的制作效率。
可以理解，所述柔性基板的制作方法，可以省略步骤4，即省略：在所述柔性基底50远离所述刚性基板200一侧形成功能层70，所述柔性基板的制作方法，包括以下步骤：提供一刚性基板；在所述刚性基板上形成至少一个图案化的光阻层；在每个光阻层上形成柔性基底；朝向所述刚性基板远离所述柔性基底一侧发射激光，使得所述激光通过所述刚性基板后照射到所述光阻层，所述柔性基底及所述光阻层从所述刚性基板剥离，进而形成所述柔性基板。
请再次参阅图6，本发明还提供一种柔性基板100，其包括柔性基底50、功能层70及图案化的光阻层30，所述柔性基底50夹设于所述功能层70及光阻层30之间。
进一步地，所述柔性基底50包括主体51及由所述主体51一侧延伸形成的延伸部53，所述功能层70设于所述主体51远离所述延伸部53的一侧，所述光阻层30设于所述主体51远离所述功能层70的一侧，所述光阻层30包括至少一个贯穿所述光阻层30的沟槽33，每个延伸部53容纳于一个所述沟槽33。
进一步地，所述光阻层30包括多个间隔设置的光阻部35，每两个相互间隔设置的光阻部35形成一个所述沟槽33。
在制作所述柔性基板100时，于刚性基板200的第一表面201形成光阻层30，再在所述光阻层30上形成柔性基底50，然后在所述柔性基底50上形成所述功能层70，之后再朝向所述刚性基板200的第二表面203发射激光，使得所述柔性基板100及光阻层30剥离所述刚性基板200，形成所述柔性基板100。由于光阻层30相比于柔性基底50更容易被激光烧蚀，使得所述柔性基板100更容易剥离，提高了所述柔性基板100的剥离效率，亦避免在剥离过程中对功能层70造成损坏，进而提高了柔性基板100的制程良率。
另外，所述光阻层30包括至少一个贯穿所述光阻层30的沟槽33，每个延伸部53容纳于一个所述沟槽33，光阻层30减少了所述柔性基底50与所述刚性基板200的接触面积，光阻层30在保证柔性基底50与刚性基板200的粘附的同时，又方便了柔性基板100从刚性基板200的剥离。
本实施方式中，所述光阻层30由正性光阻材料制成，所述柔性基底50由聚酰亚胺制成，所述功能层70为薄膜晶体管层，其包括栅极、源极、漏极等结构，在此不作赘述。
可以理解，柔性基板100可以省略功能层70，柔性基板100能够作为其他结构的衬底使用，例如彩膜基板的柔性衬底，亦可以在制作其他元件或结构时作为衬底使用，在此不作限定。
一种柔性基板100，包括柔性基底50及图案化的光阻层30，所述柔性基底50设于所述光阻层30上，所述柔性基底50包括主体51及由所述主体51一侧延伸形成的延伸部53，所述光阻层30设于所述主体51的一侧，所述光阻层30包括至少一个贯穿所述光阻层的沟槽33，每个延伸部53容纳于一个所述沟槽33。
请参阅图13，为本发明实施例提供的电子装置200的示意图，所述电子装置200包括前述的柔性基板100。其中，所述电子装置200可为手机、平板电脑、显示器等。
本发明提供的柔性基板及其制作方法，在刚性基板200的第一表面201形成光阻层30，再在所述光阻层30上形成柔性基底50，由于所述光阻层30更容易被激光烧蚀，使得所述柔性基板100更容易从所述刚性基板200上剥离，避免在剥离过程中对功能层70造成损坏，提高了所述柔性基板100的剥离效率，进而提高了柔性基板100的制程良率。另外，所述光阻层30包括至少一个贯穿所述光阻层30的沟槽33，所述柔性基底50的每个延伸部53容纳于一个所述沟槽33，保证所述柔性基底50与所述刚性基板200的粘连，进而使柔性基底50在后续的高温制程(本实施方式中约350～450度高温)中不易脱离所述刚性基板200，避免影响柔性基板100的后续制程。由于光阻层30减少了所述柔性基底50与所述刚性基板200的接触面积，方便了柔性基板100从刚性基板200的剥离。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。
Claims (14)
- 一种柔性基板的制作方法，其特征在于，包括以下步骤：提供一刚性基板；在所述刚性基板上形成至少一个图案化的光阻层；在每个光阻层上形成柔性基底；及朝向所述刚性基板远离所述柔性基底一侧发射激光，使得所述激光通过所述刚性基板后照射到所述光阻层，所述柔性基底及所述光阻层从所述刚性基板剥离，进而形成所述柔性基板。
- 如权利要求1所述的制作方法，其特征在于，所述光阻层包括贯穿所述光阻层的沟槽，每个柔性基底包括主体及由所述主体一侧延伸形成的至少一个延伸部，每个延伸部容纳于一个所述沟槽并与所述刚性基板连接。
- 如权利要求1所述的制作方法，其特征在于，所述“在所述刚性基板上形成至少一个图案化的光阻层”，包括以下步骤：在所述刚性基板的至少一个配置区上涂布光阻材料；对所述光阻材料进行固化处理；通过光从光罩的一侧对所述光阻材料进行曝光；及对经曝光处理后的光阻材料进行显影，形成所述光阻层。
- 如权利要求1所述的制作方法，其特征在于，所述“在每个光阻层上形成柔性基底”，包括以下步骤：在所述光阻层上涂布柔性材料；对所述柔性材料进行固化形成所述柔性基底。
- 如权利要求1所述的制作方法，其特征在于，所述柔性基底由聚酰亚胺制成。
- 如权利要求1所述的制作方法，其特征在于，所述激光的波长为308nm。
- 如权利要求1所述的制作方法，其特征在于，所述刚性基板为玻璃。
- 如权利要求1所述的制作方法，其特征在于，所述光阻层由正性光阻材料制成。
- 一种柔性基板，其特征在于，所述柔性基板包括柔性基底及图案化的光阻 层，所述柔性基底设于所述光阻层上。
- 如权利要求9所述的柔性基板，其特征在于，所述柔性基底包括主体及由所述主体一侧延伸形成的延伸部，所述光阻层设于所述主体的一侧，所述光阻层包括至少一个贯穿所述光阻层的沟槽，每个延伸部容纳于一个所述沟槽。
- 如权利要求10所述的柔性基板，其特征在于，所述光阻层包括至少多个间隔设置的光阻部，每两个相互间隔设置的光阻部形成一个所述沟槽。
- 如权利要求9所述的柔性基板，其特征在于，所述光阻层由正性光阻材料制成。
- 如权利要求9所述的柔性基板，其特征在于，所述柔性基底由聚酰亚胺制成。
- 一种电子装置，其特征在于，包括如权利要求9至13项任意一项所述的柔性基板。
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| CN103985665A (zh) * | 2014-05-15 | 2014-08-13 | 深圳市华星光电技术有限公司 | 一种柔性显示器的制作方法 |
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