WO2015000186A1 - Oled面板及其封装方法 - Google Patents

Oled面板及其封装方法 Download PDF

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Publication number
WO2015000186A1
WO2015000186A1 PCT/CN2013/079023 CN2013079023W WO2015000186A1 WO 2015000186 A1 WO2015000186 A1 WO 2015000186A1 CN 2013079023 W CN2013079023 W CN 2013079023W WO 2015000186 A1 WO2015000186 A1 WO 2015000186A1
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WO
WIPO (PCT)
Prior art keywords
substrate
oled
packaging cover
packaging
etching process
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PCT/CN2013/079023
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English (en)
French (fr)
Inventor
余威
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/982,510 priority Critical patent/US20150008819A1/en
Publication of WO2015000186A1 publication Critical patent/WO2015000186A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to the field of flat display, and in particular to an OLED panel and a packaging method thereof. Background technique
  • the flat display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the existing flat display device mainly includes a liquid crystal display device (LCD, Liquid Crystai Display) and an OLED (Organic Light Emitting Display).
  • LCD liquid crystal display device
  • OLED Organic Light Emitting Display
  • the organic light-emitting display device has the characteristics of self-luminous high brightness, wide viewing angle, high contrast, flexibility, low power consumption, etc., and thus has received extensive attention, and has begun to gradually replace the conventional liquid crystal display device as a new generation display mode. It is used in electronic products such as mobile phone screens, computer monitors, and full color TVs.
  • the OLED display technology is different from the traditional LCD display method. It does not require a backlight. It uses a very thin organic material coating and a glass substrate. When there is current passing through it, the oxygenation and ageing will be significantly attenuated. For organic display devices, OLED devices have very high requirements for packaging.
  • OLED components are required to have a lifetime ( lifetime:) greater than or equal to 10,000 hours; a water vapor transmission rate of less than or equal to 1 ( T 6 g/m 2 /day (days); oxygen permeability is less than or equal to 1 (T 5 cc / m 2 /day ( latm ) of the package effect requirements. It can be seen that the package is the most OLED device production process One of the important processes is the key to affecting product yield.
  • the conventional packaging method generally applies a sealant frame on the periphery of the flat OLED package cover, and then the OLED substrate is relatively attached thereto, and the cured sealant frame is completed, and the OLED package cover, the OLED substrate and the sealing frame are The crucible forms a closed space, and the organic light-emitting material layer is sealed in the sealed space.
  • the gap width is a micron-scale width
  • the thickness of the organic luminescent material layer is a nano-scale thickness
  • the OLED panel includes a first glass substrate 100 and an etching trench 200 .
  • the glass frit 300 is located between the first and second glass substrates 100 and 400 and is located at the OLED Within the outer edge of the device, a hermetic seal that protects the inner OLED element 500 is formed. Due to the arrangement of the etching groove 200, the strength of the frit bonding the first and second glass substrates 100, 400 is enhanced, thereby improving the sealing effect.
  • the OLED panel obtained by the sealing method still has a large gap between the first and second glass substrates 00 and 400, which increases the possibility of residual water oxygen in the sealing body, thereby affecting the service life of the OLED panel. . Summary of the invention
  • Another object of the present invention is to provide a method for packaging an OLED panel, which has a good sealing effect and a small residual amount of water and oxygen in the sealed space, thereby effectively extending the service life of the OLED panel.
  • the present invention provides an OLED panel, comprising: a substrate, a plurality of OLED elements formed on the substrate, a package cover disposed opposite to the substrate, and a substrate disposed between the substrate and the package cover and corresponding to the OLED a plurality of ejector frames disposed on the component, the package cover plate is provided with a plurality of convex portions corresponding to the plurality of OLED elements, a groove is formed around the convex portion, and the sealant frame is located in the groove The lower surface of the raised portion is adjacent to the upper surface of the OLED element.
  • the package cover is made of glass, and the groove is formed by an etching process.
  • the etching process is an acid etching process or a thousand etching process.
  • the base plate is a glass substrate; the OLED element comprises: an anode formed on the base plate.
  • the invention also provides a packaging method for an OLED panel, comprising the following steps:
  • Step 1 providing a package cover, the package cover is provided with a plurality of convex portions, and a groove is formed around the convex portion;
  • Step 2 the package cover is cleaned and dried
  • Step 3 applying a UV glue to the outer periphery of the plurality of protrusions in the groove of the package cover, the thickness of the UV glue being greater than the height of the protrusion;
  • Step 4 providing a substrate formed with an OLED element, wherein the OLED element is disposed corresponding to a convex portion of the package cover;
  • Step 5 the package cover plate and the substrate are aligned in a nitrogen atmosphere, the convex portion of the package cover plate faces the substrate, and the UV glue is cured by ultraviolet irradiation to form a sealant.
  • the plate is made of a glass substrate, and the groove is formed by an etching process, which is an acid etching process or a thousand etching process.
  • the OLED element includes: an anode formed on a substrate, and an organic material formed on the anode a layer, and a cathode formed on the layer of organic material
  • the invention also provides a packaging method for an OLED panel, comprising the following steps:
  • Step 101 providing a package cover, the package cover is provided with a plurality of protrusions, and a groove is formed around the protrusion;
  • Step 102 The package cover is cleaned and dried
  • Step 103 Apply a glass glue to an outer circumference of the plurality of protrusions in the groove of the package cover, the thickness of the glass glue is greater than the height of the protrusion, and is baked in a high temperature furnace to make the glass Glue hardening
  • Step 104 Apply a circle of ⁇ glue to the outermost edge of the package cover
  • Step 105 Providing a substrate formed with an OLED element, wherein the OLED element is disposed corresponding to a convex portion of the package cover;
  • Step 106 Aligning the package cover plate and the substrate in a nitrogen atmosphere, the convex portion of the package cover plate faces the OLED substrate, and cures the UV glue by ultraviolet irradiation; Step 107, passes the laser Irradiation, the glass glue is first melted to bond the package cover and the substrate to be cured to form a sealant frame, thereby completing the packaging of the OLED panel.
  • the package cover is made of a glass substrate, and the groove is formed by an etching process, and the etching process is an acid etching process or a thousand etching process.
  • the OLED element includes: an anode formed on a substrate, an organic material layer formed on the anode, and a cathode formed on the organic material layer.
  • the OLED panel of the present invention and the method for packaging the same the recess is etched on the package cover, and a plurality of protrusions are formed correspondingly, and the lower surface of the convex portion of the package cover is formed on the package
  • the upper surface of the OLED element on the substrate has almost no gap, which effectively reduces the size of the sealed space, greatly reduces the probability of residual water oxygen during packaging, prolongs the service life of the OLED element, and prolongs the service life of the OLED panel.
  • the figure is a partial cross-sectional view of an existing OLED panel
  • FIG. 2 is a schematic structural view of an OLED panel of the present invention
  • 3 is a schematic plan view showing a planar structure of a package cover plate in an OLED panel according to the present invention
  • FIG. 4 is a schematic perspective view showing a package cover plate in an OLED panel according to the present invention
  • FIG. 5 is a schematic view showing a positional relationship between a package cover and a sealant frame in an OLED panel according to the present invention
  • FIG. 6 is a flow chart of an embodiment of a method for packaging an OLED panel according to the present invention
  • FIG. 7 is a flow chart of still another embodiment of a method of packaging an OLED panel of the present invention. detailed description
  • the present invention provides an OLED panel, comprising: a substrate 40 , a plurality of OLED elements 42 formed on the substrate 40 , a package cover 20 disposed opposite to the substrate 40 , and a substrate 40 disposed on the substrate 40 . a plurality of ejector frames 20 disposed between the package cover 20 and the corresponding OLED elements 42 .
  • the package cover 20 is provided with a plurality of bulging portions 22 corresponding to the plurality of OLED elements 42 , and the protrusions 22 are formed around the protrusions 22 .
  • the sealant frame 60 is located in the groove 24, and a lower surface of the protrusion 22 is infinitely close to an upper surface of the OLED element 42 such that the package cover 20, the substrate 40 and the sealant frame
  • the sealed space 246 formed by 60 is small, and the OLED element 42 almost fills the entire sealed space 246 so that less water vapor remaining in the sealed space 246 during packaging can be reduced to reduce oxidative corrosion of the OLED element 42 by moisture.
  • the service life of the OLED element 42 is extended, thereby extending the service life of the OLED panel.
  • the package cover 20 is made of glass, and the groove 24 is formed by an etching process, which is an acid etching process or a thousand-in-one process.
  • the specific formation process can be:
  • a glass plate which has been cleaned and dried is provided; then, a photoresist is coated on the glass plate; then, the photoresist-coated glass plate is exposed under a designed mask; The exposed glass plate is developed in a developing machine to remove the exposed portion of the photoresist; then, baking is performed in a baking machine, and the photoresist remaining on the glass plate forms a plurality of etching protection blocks.
  • the etch protection block has a rectangular shape, and the glass substrate has an etched area corresponding to the outer periphery of the plurality of etch protection blocks, wherein the etched area is a plurality of intersecting etched grooves; and then, the glass plate is etched by acid etching or dry etching.
  • the substrate 40 is a glass substrate;
  • the OLED element 42 includes: an anode 422 formed on the substrate 40, an organic material layer 424 formed on the anode 422, and formed in an organic Cathode 428 on material layer 424.
  • the present invention further provides a OLED panel seal.
  • the loading method includes the following steps:
  • Step 1 A package cover 20 is provided.
  • the package cover 20 is provided with a plurality of convex portions 22, and a groove 24 is formed around the convex portion 22.
  • the package cover 20 is made of glass, and the groove 24 is formed by an etching process, which is an acid etching process or a thousand etching process.
  • the specific formation process can be:
  • a glass plate which has been cleaned and dried is provided; then, a photoresist is coated on the glass plate; then, the photoresist-coated glass plate is exposed under a designed mask; The exposed glass plate is developed in a developing machine to remove the exposed portion of the photoresist; then, baking is performed in a baking machine, and the photoresist remaining on the glass plate forms a plurality of etching protection blocks.
  • the etch protection block has a rectangular shape, and the glass substrate has an etched area corresponding to the outer periphery of the plurality of etch protection blocks, wherein the etched area is a plurality of intersecting etched grooves; and then, the glass plate is etched by acid etching or dry etching. , obtaining a semi-finished product of the package cover; finally, stripping the residual photoresist to obtain a package cover 20
  • Step 2 The cover plate 20 is cleaned and dried.
  • Step 3 Apply UV glue to the outer periphery of the plurality of protrusions 22 in the recess 24 of the package cover 20, and the thickness of the UV glue is greater than the height of the protrusion 22.
  • Step 4 A substrate 40 formed with an OLED element 42 is provided, which is disposed corresponding to the raised portion 22 of the package cover 20.
  • the substrate 40 is a glass substrate.
  • the OLED element 42 includes an anode 422 formed on the substrate 40, an organic material layer 424 formed on the anode 422, and a cathode 428 formed on the organic material layer 424.
  • Step 5 the package cover 20 and the substrate 40 are aligned in a nitrogen atmosphere, the convex portion 22 of the package cover 20 faces the substrate 40, and the UV glue is cured by ultraviolet irradiation to form a seal.
  • the plastic frame 60 completes the packaging of the OLED panel.
  • the package cover 20, the substrate 40 and the sealant frame 60 form a sealed space
  • the OLED element 42 is sealed in the sealed space 246, and a lower surface of the convex portion 22 of the OLED package cover 20 is almost in contact with an upper surface of the OLED element 42. There is substantially no gap between the substrates 40, and the probability of residual water oxygen in the sealed space 246 is greatly reduced, thereby prolonging the service life of the OLED element 42.
  • the OLED element 42 of the present invention almost fills the entire sealed space 246, so that less water vapor remaining in the sealed space 246 during packaging can be reduced to reduce the oxidative corrosion of the OLED element 42 by water vapor, and the OLED element is extended as shown in FIG.
  • the present invention also provides a method for packaging an OLED panel, comprising the following steps: Step 101: Providing a package cover plate 20, the package cover plate 20 is provided with a plurality of convex portions 22, and a 1H] groove 24 is formed around the convex portion 22.
  • the package cover 20 is made of glass, and the groove 24 is formed by an etching process, which is an acid etching process or a thousand etching process.
  • the specific formation process can be:
  • a glass plate which has been cleaned and dried is provided; then, a photoresist is coated on the glass plate; then, the photoresist-coated glass plate is exposed under a designed mask; The exposed glass plate is developed in a developing machine to remove the exposed portion of the photoresist; then, baking is performed in a baking machine, and the photoresist remaining on the glass plate forms a plurality of etching protection blocks.
  • the etch protection block has a rectangular shape, and the glass substrate has an etched area corresponding to the outer periphery of the plurality of etch protection blocks, wherein the etched area is a plurality of intersecting etched grooves; and then, the glass plate is etched by acid etching or thousand etching. A packaged cover semi-finished product is obtained; finally, the residual photoresist is peeled off to obtain a package cover 20.
  • Step 102 The package cover 20 is cleaned and dried.
  • Step 103 Apply a glass glue to the outer circumference of the plurality of protrusions 22 in the 1H] groove 24 of the package cover 20, the thickness of the glass glue is greater than the height of the protrusion 22, and is in a high temperature furnace. Bake, harden the glass glue.
  • Step 104 Apply a circle of UV glue to the outermost edge of the package cover 20.
  • Step 105 Providing a substrate on which the OLED element 42 is formed. 40.
  • the OLED element 42 is disposed corresponding to the convex portion 22 of the package cover 20.
  • the substrate 40 is a glass substrate.
  • the OLED element 42 includes an anode 422 formed on the substrate 40, an organic material layer 424 formed on the anode 422, and a cathode 428 formed on the organic material layer 424.
  • Step 106 The package cover 20 and the substrate 40 are aligned in a nitrogen atmosphere, and the convex portion 22 of the package cover 20 faces the OLED substrate 40, and the UV glue is cured by ultraviolet rays.
  • the package cover 20 and the substrate 40 are precisely aligned in a nitrogen atmosphere, and the convex portion 22 of the package cover 20 faces the substrate 40, and the UV glue is cured under ultraviolet irradiation to temporarily fix.
  • the cover plate 20 and the substrate 40 are sealed and water vapor is isolated.
  • Step 107 The glass glue is first melted by laser irradiation to bond the package cover 20 and the substrate 40 to form a sealant frame 60, thereby completing the packaging of the OLED panel.
  • the package cover 20, the substrate 40 and the sealant frame 60 form a sealed space 246, and the OLED element 42 is sealed in the sealed space 246, and the convex portion 22 of the OLED package cover 20 is
  • the lower surface is almost in contact with the upper surface of the OLED element 42.
  • the probability ratio is greatly reduced and reduced, and the length of the long OOLLEEDD element component 4422 is extended to extend the service life. .
  • the OOLLEEDD element component 4422 of the invention has almost filled and filled the entire sealed sealed space 224466, so that when it is packaged, it can remain in the sealed seal.
  • the water vapor in the empty space 224466 is less and less, in order to reduce the oxygen oxidation and corrosion of the OOLLEEDD element component 4422 by reducing the water vapor vapor, and extending the long OOLLEEDD element component 4422 It is the use life life life of the long-term OOLLEEDD face panel. .
  • the present invention discloses an OOLLEEDD face panel and a method for sealing and packaging the same, and etches a concave groove groove on the sealing and packaging cover plate.
  • the corresponding shape should be formed into a plurality of convex protruding portions, and when the package is assembled, the lower surface surface of the convex convex portion of the sealing cover plate is
  • the upper surface surface of the OOLLEEDD element component formed on the base substrate plate has almost no gaps, and has an effective effect to reduce the space between the small dense closed space. Large and small, extremely large and large drop reduces the probability ratio of residual water and oxygen in the packaged package, and prolongs the life of the OOLLEEDD component. In the end of life, it is life-saving life. .
  • the general technical personnel of the field of the present invention may be based on the technical solution according to the present invention.
  • the case and the technique are conceived to make changes and deformations corresponding to their various other species, and all of them have changed and deformed.

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Abstract

一种OLED面板及其封装方法，所述OLED面板包括：基板（40）、形成于基板（40）上的数个OLED元件（42）、与基板（40）相对贴合设置的封装盖板（20）及设于基板（40）与封装盖板（20）之间且对应OLED元件（42）设置的数个密封胶框（60），所述封装盖板（20）对应数个OLED元件（42）设有数个凸起部（22），所述凸起部（22）周围形成有凹槽（24），所述密封胶框（60）位于所述凹槽（24）内，所述凸起部（22）的下表面接近OLED元件（42）的上表面。

Description

本发明涉及平面显示领域， 尤其涉及一种 OLED面板及其封装方法。 背景技术
平面显示装置具有机身薄、 省电、 无辐射等众多优点， 得到了广泛的 应用。 现有的平面显示装置主要包括液晶显示装置 （LCD, Liquid Crystai Display ) 及有 发光.显示 I置 ( OLED , Organic Light Emitting Display ) 。
有机发光显示装置具备自发光 高亮度、 宽视角、 高对比度、 可挠 曲， 低能耗等特性， 因此受到广泛的关注， 并作为新一代的显示方式， 已 开始逐渐取代传统液晶显示装置， 被广泛应用于手机屏幕、 电脑显示器、 全彩电视等电子产品上。 OLED显示技术与传统的 LCD显示方式不同， 无 需背光灯， 采用非常薄的有机材料涂层和玻璃基板， 当有电流通过时， 这 氧 i生老化变性「 度和寿命会出现明显衰减， 因此作 基 有机材 的 显示设备， OLED器件对封装的要求非常高。 为了实现商业化的应用， OLED元件要求达到使用寿命 ( lifetime：) 大于或等于 10,000小时； 需满足 水汽穿透率小于或等于 l (T6g/m2/day (天） ； 氧气穿透率小于或等于 1(T 5cc/m2/day ( latm ) 的封装效果的要求。 由此可见封装是整个 OLED器件生 产过程中最重要的制程之一 , 是影响产品良率的关键。
现有的封装方式一般为在平板状的 OLED封装盖板的周缘涂布密封胶 框， 然后 OLED基板与其相对贴合， 固化密封胶框完成封装， 该 OLED封 装盖板、 OLED基板及密封框之闾形成一密闭空间， 有机发光材料层密封 于该密闭空间内。 然而， 该方式形成的 OLED 面板， OLED 封装盖板与 OLED 基板之间存在一定间隙， 该间隙宽度为微米级的宽度， 而有机发光 材料层的厚度为纳米级的厚度， 该间隙的存在增大了残留水氧的可能， 从 而影响 OLED面板的使用寿命。
如图 1所示， 为现有的一种 OLED面板的局部剖视图， 该 OLED面板 包括第一玻璃 ^基板 100、 腐蚀槽 200。 玻璃料 300、 第二玻璃基板 400、 至 少一个 OLED 元件 500 以及与该 OLED 元件 500接触的至少一个电极 600。 玻璃料 300位于第一、 第二玻璃基板 100、 400之间， 且位于 OLED 器件的外边缘之内， 形成保护内部 OLED元件 500的气密式密封体。 由于 腐蚀槽 200 的设置， 增强了玻璃料粘合第一、 第二玻璃基板 100、 400 的 力度， 从而提高了密封效果。 然而， 该密封方式所得到的 OLED面板其第 一、 第二玻璃基板 〗00、 400之间仍存在较大的间隙， 导致密封体内残留 水氧的可能性增大， 从而影响 OLED面板的使用寿命。 发明内容
本发明的目的在于提供一种 OLED面板， 其结构简单， 密封空间小， 残留水氧量少， OLED面板的使用寿命长。
本发明的另一目的在于提供一种 OLED 面板的封装方法， 密封效果 好， 密封空间水氧残留量少， 有效延长 OLED面板的使用寿命。
为实现上述目的， 本发明提供一种 OLED面板， 包括： 基板， 形成于 基板上的数个 OLED元件、 与基板相对贴合设置的封装盖板及设于基板与 封装盖板之间且对应 OLED元件设置的数个密封胶框， 所述封装盖板对应 数个 OLED元件设有数个凸起部， 所述凸起部周围形成有凹槽， 所述密封 胶框位于所述凹槽内， 所述凸起部的下表面接近 OLED元件的上表面。
所述封装盖板由玻璃制成， 所述凹槽通过蚀刻制程形成。
所述蚀刻制程为酸蚀刻制程或千蚀刻制程。
所述基.板为玻璃基板； 所述 OLED元件包括： 形成于基.板上的阳极。 本发明还提供一种 OLED面板的封装方法， 包括以下步骤:
步骤 1、 提供封装盖板， 所述封装盖板设有数个凸起部， 所述凸起部 周围形成有凹槽；
步骤 2、 将所述.封装盖板进行清洗烘千；
步骤 3、 在所述封装盖板的 槽内对应数个凸起部的外周缘涂布 UV 胶， 该 UV胶的厚度大于该凸起部的高度；
步骤 4、 提供形成有 OLED元件的基板， 所述 OLED元件对应所述封 装盖板的凸起部设置；
步骤 5、 在氮气环境下将所述封装盖板和所述基板对位贴合， 所述封 装盖板的凸起部朝向所述基板， 并通过紫外线照射固化 UV胶形成密封胶 所述封装盖板由玻璃基板制成， 所述凹槽通过蚀刻制程形成， 所述蚀 刻制程为酸蚀刻制程或千蚀刻制程。
所述 OLED元件包括： 形成于基板上的阳极， 形成于阳极上的有机材 料层、 及形成于有机材料层上的阴极„
本发明还提供一种 OLED面板的封装方法， 包括以下步骤：
步骤 101、 提供封装盖板， 所述封装盖板设有数个凸起部， 所述凸起 部周围形成有凹槽；
步骤 102、 将所述封装盖板进行清洗烘千；
步骤 103、 在所述封装盖板的凹槽内对应数个凸起部的外周缘涂布玻 璃胶， 该玻璃胶的厚度大于该凸起部的高度， 并在高温炉中烘烤， 使玻璃 胶硬化；
步骤 104、 在所述封装盖板的最外侧边缘涂布一圈 υν胶；
步骤 105、 提供形成有 OLED元件的基板， 所述 OLED元件对应所述 封装盖板的凸起部设置；
步骤 106、 在氮气环境下将所述封装盖板和所述基板对位贴合， 所述 封装盖板的凸起部朝向所述 OLED基板， 并通过紫外线照射固化 UV胶； 步骤 107、 通过激光照射， 使玻璃胶先熔化以粘合封装盖板与基板再 固化形成密封胶框， 从而完成 OLED面板的封装。
所述封装盖板由玻璃基板制成， 所述凹槽通过蚀刻制程形成， 所述蚀 刻制程为酸蚀刻制程或千蚀刻制程。
所述 OLED元件包括： 形成于基板上的阳极、 形成于阳极上的有机材 料层、 及形成于有机材料层上的阴极。
本发明的有益效果： 本发明 OLED面板及其封装方法， 在封装盖板上 蚀刻出凹槽， 相应形成数个凸起部， 封装时， 该封装盖板的凸起部的下表 面与形成于基板上的 OLED元件的上表面几乎无间隙， 有效减小密闭空间 的大小， 极大降低了封装时残留水氧的概率， 延长了 OLED元件的使用寿 命， 进而延长了 OLED面板的使用寿命„
为了能更进一步了解本发明的特征以及技术内容， 请参阔以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 为现有的一种 OLED面板的局部剖视图；
图 2为本发明 OLED面板的结构示意图； 图 3为本发明 OLED面板中封装盖板的平面结构示意图； 图 4为本发明 OLED面板中封装盖板的立体结构示意图；
图 5为本发明 OLED面板中封装盖板与密封胶框的位置关系示意图； 图 6为本.发明 OLED面板的封装方法的一实施例的流程图；
图 7为本发明 OLED面板的封装方法的又一实施例的流程图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 2及图 5 , 本发明提供一种 OLED面板， 包括： 基板 40、 形 成于基板 40上的数个 OLED元件 42、 与基板 40相对贴合设置的封装盖 板 20及设于基板 40与封装盖板 20之间且对应 OLED元件 42设置的数个 密封胶框 60 , 所述封装盖板 20对应数个 OLED元件 42设有数个凸起部 22 , 所述凸起部 22 周围形成有凹槽 24， 所述密封胶框 60位于所述凹槽 24 内， 所述凸起部 22的下表面无限接近 OLED元件 42的上表面， 使得 所述封装盖板 20、 基板 40与密封胶框 60所形成的密封空间 246较小， 所 述 OLED元件 42几乎填充整个密封空间 246， 使得在封装时， 能残留在 密封空间 246 内的水汽较少， 以减少水汽对 OLED元件 42的氧化腐蚀， 延长 OLED元件 42的使用寿命， 进而延长 OLED面板的使用寿命。
请参阅图 3及图 4, 所述封装盖板 20由玻璃制成， 所述凹槽 24通过 蚀刻制程形成， 所述蚀刻制程为酸蚀刻制程或千独刻制程。 其具体形成工 艺可为：
首先， 提供一已清洗烘千的玻璃板； 然后， 在该玻璃板上涂布光刻 胶； 接着， 将该涂布有光刻胶的玻璃板在设计好的光罩下进行曝光； 再将 该曝光好的玻璃板在显影机中显影， 去除曝光部分光刻胶； 然后， 在烘烤 机中做烘烤坚膜处理， 残留于所述玻璃板上的光刻胶形成数个蚀刻保护 块， 该些蚀刻保护块呈矩形， 所述玻璃基板在该数个蚀刻保护块外周缘对 应形成蚀刻区， 该蚀刻区为数条交叉分布的蚀刻槽； 接着， 通过酸蚀刻或 干蚀刻蚀刻玻璃板， 得到封装盖板半成品； 最后， 剥离残留的光刻胶， 得 到封装盖板 20„
值得一提的是， 请参阅图 2， 所述基板 40 为玻璃基板； 所述 OLED 元件 42包括： 形成于基板 40上的阳极 422、 形成于阳极 422上的有机材 料层 424、 及形成于有机材料层 424上的阴极 428。
请参阅图 6, 并参考图 2至图 5 , 本发明还提供一种 OLED面板的封 装方法， 包括以下步骤：
步骤 1、 提供封装盖板 20, 所述封装盖板 20设有数个凸起部 22, 所 述凸起部 22周围形成有凹槽 24。
所述封装盖板 20由玻璃制成， 所述凹槽 24通过蚀刻制程形成， 所述 蚀刻制程为酸蚀刻制程或千蚀刻制程。 其具体形成工艺可为：
首先， 提供一已清洗烘千的玻璃板； 然后， 在该玻璃板上涂布光刻 胶； 接着， 将该涂布有光刻胶的玻璃板在设计好的光罩下进行曝光； 再将 该曝光好的玻璃板在显影机中显影， 去除曝光部分光刻胶； 然后， 在烘烤 机中做烘烤坚膜处理， 残留于所述玻璃板上的光刻胶形成数个蚀刻保护 块， 该些蚀刻保护块呈矩形， 所述玻璃基板在该数个蚀刻保护块外周缘对 应形成蚀刻区， 该蚀刻区为数条交叉分布的蚀刻槽； 接着， 通过酸独刻或 干蚀刻蚀刻玻璃板， 得到封装盖板半成品； 最后， 剥离残留的光刻胶， 得 到封装盖板 20„
步骤 2、 将所述 装盖板 20进行清洗烘千。
步骤 3、 在所述封装盖板 20的凹槽 24内对应数个凸起部 22的外周缘 涂布 UV胶， 该 UV胶的厚度大于该凸起部 22的高度。
步骤 4、 提供形成有 OLED元件 42的基板 40， 所述 OLED元件 42对 应所述封装盖板 20的凸起部 22设置。
所述基板 40为玻璃基板； 所述 OLED元件 42 包括： 形成于基板 40 上的阳极 422、 形成于阳极 422 上的有机材料层 424、 及形成于有机材料 层 424上的阴极 428。
步骤 5、 在氮气环境下将所述封装盖板 20和所述基板 40对位贴合， 所述封装盖板 20 的凸起部 22朝向所述基板 40, 并通过紫外线照射固化 UV胶形成密封胶框 60, 从而完成 OLED面板的封装。
所述封装盖板 20 , 所述基板 40及所述密封胶框 60形成一密封空间
246， 所述 OLED元件 42密封于该密封空间 246内, 所述 OLED封装盖板 20的凸起部 22的下表面几乎与所述 OLED元件 42的上表面接触， 所述 封装盖板 20与所述基板 40之间基本无间隙， 该密封空间 246残留水氧的 概率大大减小， 进而延长 OLED元件 42的使用寿命。 本发明的 OLED元 件 42几乎填充整个密封空间 246, 使得在封装时， 能残留在密封空间 246 内的水汽较少， 以减少水汽对 OLED元件 42的氧化腐蚀， 延长 OLED元 请参 图 7， 并 ^考图 至图 5 , 本发明还提供一种 OLED面板的封 装方法， 包括以下步骤： 步骤 101、 提供封装盖板 20, 所述封装盖板 20设有数个凸起部 22, 所述凸起部 22周围形成有 1H]槽 24。
所述封装盖板 20由玻璃制成， 所述凹槽 24通过蚀刻制程形成， 所述 蚀刻制程为酸蚀刻制程或千蚀刻制程。 其具体形成工艺可为：
首先， 提供一已清洗烘千的玻璃板； 然后， 在该玻璃板上涂布光刻 胶； 接着， 将该涂布有光刻胶的玻璃板在设计好的光罩下进行曝光； 再将 该曝光好的玻璃板在显影机中显影， 去除曝光部分光刻胶； 然后， 在烘烤 机中做烘烤坚膜处理， 残留于所述玻璃板上的光刻胶形成数个蚀刻保护 块， 该些蚀刻保护块呈矩形， 所述玻璃基板在该数个蚀刻保护块外周缘对 应形成蚀刻区， 该蚀刻区为数条交叉分布的蚀刻槽； 接着， 通过酸蚀刻或 千蚀刻蚀刻玻璃板， 得到封装盖板半成品； 最后， 剥离残留的光刻胶， 得 到封装盖板 20。
步骤 102、 将所述封装盖板 20进行清洗烘千。
步骤 103、 在所述封装盖板 20的 1H]槽 24内对应数个凸起部 22的外周 缘涂布玻璃胶， 该玻璃胶的厚度大于该凸起部 22 的高度， 并在高温炉中 烘烤， 使玻璃胶硬化。
步骤 104 在所述封装盖板 20的最外侧边缘涂布一圈 UV胶。
步骤 105、 提供形成有 OLED元件 42的基板 . 40， 所述 OLED元件 42 对应所述封装盖板 20的凸起部 22设置。
所述基板 40为玻璃基板； 所述 OLED元件 42 包括： 形成于基板 40 上的阳极 422、 形成于阳极 422 上的有机材料层 424、 及形成于有机材料 层 424上的阴极 428。
步骤 106、 在氮气环境下将所述封装盖板 20 和所述基板 40 对位贴 合， 所述封装盖板 20的凸起部 22朝向所述 OLED基板 40, 并通过紫外 线照射固化 UV胶。
在氮气环境下将所述封装盖板 20和所述基板 40精密对位贴合， 所述 封装盖板 20的凸起部 22朝向所述基板 40, 在紫外线照射下固化 UV胶， 以暂时固定所述封装盖板 20和基板 40并隔离水汽。
步骤 107、 通过激光照射， 使玻璃胶先熔化以粘合封装盖板 20与基板 40再固化形成密封胶框 60, 从而完成 OLED面板的封装。
所述封装盖板 20、 所述基板 40及所述密封胶框 60形成一密封空间 246， 所述 OLED元件 42密封于该密封空间 246内， 所述 OLED封装盖板 20的凸起部 22 的下表面几乎与所述 OLED元件 42的上表面接触， 所述 封装盖板 20与所述基板 40之间基本无间隙， 该密封空间 246残留水氧的 概概率率大大大大减减小小，， 进进而而延延长长 OOLLEEDD元元件件 4422的的使使用用寿寿命命。。 本本发发明明的的 OOLLEEDD元元 件件 4422几几乎乎填填充充整整个个密密封封空空间间 224466,, 使使得得在在封封装装时时，， 能能残残留留在在密密封封空空间间 224466 内内的的水水汽汽较较少少，， 以以减减少少水水汽汽对对 OOLLEEDD元元件件 4422的的氧氧化化腐腐蚀蚀，， 延延长长 OOLLEEDD元元 件件 4422的的使使..用用寿寿命命，， 进进^^延延长长 OOLLEEDD面面板板的的使使用用寿寿命命。。
综综上上所所述述，， 本本发发明明 OOLLEEDD面面板板及及其其封封装装方方法法，， 在在封封装装盖盖板板上上蚀蚀刻刻出出凹凹 槽槽，， 相相应应形形成成数数个个凸凸起起部部，， 封封装装时时，， 该该封封装装盖盖板板的的凸凸起起部部的的下下表表面面与与形形成成 于于基基板板..上上的的 OOLLEEDD元元件件的的上上表表面面几几乎乎无无间间隙隙，， 有有效效减减小小密密闭闭空空间间的的大大小小 ,, 极极大大降降低低了了封封装装时时残残留留水水氧氧的的概概率率，， 延延长长了了 OOLLEEDD元元件件的的使使用用寿寿命命，， 进进而而 延延长长了了 OOLLEEII))面面板板的的使使用用寿寿命命。。
以以上上所所述述，， 对对于于本本领领域域的的普普通通技技术术人人员员来来说说，， 可可以以根根据据本本发发明明的的技技术术 方方案案和和技技术术构构思思作作出出其其他他各各种种相相应应的的改改变变和和变变形形，， 而而所所有有这这些些改改变变和和变变形形
Figure imgf000008_0001

Claims

权 利 要 求
一种 OLED 面板， 包括: 基板、 形成于基板上的数个 OLED 元 件、 与基板相对贴合设置的封装盖板及设于基板与封装盖板之间且对应 OLED元件设置的数个密封胶框， 所述封装盖板对应数个 OLED元件设有 数个凸起部， 所述凸起部周围形成有凹槽， 所述密封胶框位于所述凹槽 内， 所述凸起部的下表面接近 OLE.D元件的上表面。
2、 如权利要求 1 所述的 OLED面板， 其中， 所述封装盖板由玻璃制 成， 所述凹槽通过蚀刻制程形成。
3、 如权利要求 2所述的 OLED 面板， 其中， 所述蚀刻制程为酸蚀刻 制程或千蚀刻制程。
4、 如权利要求 i 所述的 OLED面板， 其中， 所述基板为玻璃基板； 所述 OLED 元件包括： 形成于基板上的阳极、 形成于阳极上的有机材料 层。 及形成于有机材料层上的阴极。
5、 一种 OLED面板的封装方法， 包括以下步骤：
步骤 1、 提供封装盖板， 所述封装盖板设有数个凸起部， 所述凸起部 周围形成有 槽；
步骤 2、 将所述封装盖板进行清洗烘千；
步骤 3、 在所述封装盖板的 槽内对应数个凸起部的外周缘涂布 UV 胶， 该 UV胶的厚度大于该凸起部的高度；
步糠 4、 提供形成有 OLED元件的基板， 所述 OLED元件对应所述封 装盖板的凸起部设置；
步骤 5、 在氮气环境下将所述封装盖板和所述基板对位贴合， 所述封 装盖板的凸起部朝向所述基板， 并通过紫外线照射固化 UV 胶形成密封胶 框， 从而完成 OLED面板的封装。
6、 如权利要求 5所述的 OLED面板的封装方法， 其中， 所述封装盖 板由玻璃基板制成， 所述凹槽通过蚀刻制程形成， 所述蚀刻制程为酸蚀刻 制程或千蚀刻制程。
7 , 如权利要求 5所述.的 OLED面板的封装方法， 其中， 所述 OLED 元件包括： 形成于基板上的阳极、 形成于阳极上的有机材料层、 及形成于 有机材料层上的阴极。
8、 一种 OLED面板的封装方法， 包括以下步骤：
步骤 101、 提供封装盖板， 所述封装盖板设有数个凸起部， 所述凸起 部周围形成有 槽；
步骤 102 , 将所述封装盖板进行清洗烘千；
步骤 103、 在所述封装盖板的 槽内对应数个凸起部的外周缘涂布玻 璃胶， 该玻璃胶的厚度大于该凸起部的高度， 并在高温炉中烘烤， 使玻璃 胶硬化；
步骤 104、 在所述封装盖板的最外侧边缘涂布一圈 UV胶；
步骤 105、 提供形成有 OLED元件的基板， 所述 OLED元件对应所述 封装盖板的凸起部设置；
步骤 106、 在氮气环境下将所述封装盖板和所述基板对位贴合， 所述 封装盖板的凸起部朝向所述 OLED基板， 并通过紫外线照射固化 UV胶； 步骤 107、 通过激光照射， 使玻璃胶先熔化以粘合封装盖板与基板再 固化形成密封胶框， 从而完成 OLED面板的封装。
9 , 如权利要求 8所述的 OLED面板的封装方法， 其中， 所述封装盖 板由玻璃基板制成， 所述 IHJ槽通过蚀刻制程形成， 所述蚀刻制程为酸蚀刻 制程或千蚀刻制程。
】0、 如权利要求 8所述的 OLED面板的封装方法， 其中， 所述 OLED 元件包括： 形成于基板上的阳极、 形成于阳极上的有机材料层、 及形成于 有机材料层上的阴极„
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