WO2016033888A1 - 封装方法、显示面板及其制作方法、显示装置 - Google Patents

封装方法、显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2016033888A1
WO2016033888A1 PCT/CN2014/092941 CN2014092941W WO2016033888A1 WO 2016033888 A1 WO2016033888 A1 WO 2016033888A1 CN 2014092941 W CN2014092941 W CN 2014092941W WO 2016033888 A1 WO2016033888 A1 WO 2016033888A1
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Prior art keywords
substrate
display panel
sealant
package
package region
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PCT/CN2014/092941
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English (en)
French (fr)
Inventor
吴海东
金泰逵
马群
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US14/770,918 priority Critical patent/US20160372529A1/en
Publication of WO2016033888A1 publication Critical patent/WO2016033888A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures

Definitions

  • the present disclosure relates to the field of packaging technologies, and in particular, to a packaging method, a display panel, a method of fabricating the same, and a display device.
  • the Organic Light-Emitting Diode (OLED) display device has become a promising new flat panel display device due to its advantages of high brightness, wide viewing angle, active illumination, high contrast, and ultra-thin portability.
  • the OLED comprises a metal anode, a hole transport layer, an organic light-emitting layer, an electron transport layer and a metal cathode formed between the two pairs of the substrate, the periphery of the two pairs of the substrate is sealed by a sealant, the metal anode and The metal cathodes act together to drive the organic light-emitting layer to emit light.
  • OLED display devices there are some technical bottlenecks in OLED display devices, one of which is the lifetime of OLED display devices. Since the organic light-emitting layer of the OLED is very sensitive to pollutants, oxygen and water vapor in the atmosphere, at the same time, the water vapor in the atmosphere may cause electrochemical corrosion to the metal electrode, which seriously affects the life of the OLED display device. Therefore, the packaging technology of OLED display devices has become a key process for improving the lifetime of OLED display devices, and research and development of effective packaging techniques to block H 2 O and O 2 has become an urgent task to be solved.
  • the present disclosure provides a packaging method, a display panel, a manufacturing method thereof, and a display device for ensuring a good sealing property of the display panel.
  • the present disclosure provides a method for packaging a display panel, the display panel including a first substrate and a second substrate, the first substrate including a first package region, and the second substrate includes a second package area, where the location of the first package area corresponds to the location of the second package area, the method includes:
  • Step A performing at least one surface of the first package area and the second package area Roughening treatment to form a non-smooth surface
  • Step B applying a sealant on the surface of the first package region and/or the second package region processed in step A;
  • Step C the first substrate and the second substrate processed by the step B are processed
  • Step D Curing the sealant.
  • step A at least one surface of the first package region and the second package region is roughened by a chemical etchant.
  • the chemical etchant is a mixture of H 2 O 2 having a molar concentration of about 20% to about 40% and H 2 SO 4 having a molar concentration of about 60% to about 80%, and a molar concentration of about 40%.
  • the chemical etchant is coated on the at least one surface of the first package region and the second package region by a spraying method.
  • the spray method has an accuracy of about 20 microns.
  • the non-smooth surface is a uniform continuous geometry.
  • the method further includes:
  • Step E removing the chemical etchant.
  • the chemical etchant is removed by water washing.
  • the method further comprises: performing heat treatment at a temperature of about 80 ° C to about 100 ° C.
  • the heat treatment time is from about 20 minutes to about 30 minutes.
  • the sealant is a glass glue
  • the step of curing the sealant comprises:
  • the glass paste is irradiated with a laser to be solidified after being melted.
  • the sealant is a frame sealant
  • the step of curing the sealant comprises:
  • the frame sealant is irradiated with ultraviolet light to cure it.
  • the present disclosure also provides a method of fabricating a display panel, the display panel including a first substrate and a second substrate, the first substrate includes a first package region, and the second substrate includes a second package region, the first The location of a package area corresponds to the location of the second package area, the method comprising packaging the first substrate and the second substrate using the method as described above.
  • the present disclosure also provides a display panel, including:
  • the first substrate includes a first package region
  • the second substrate includes a second package region, a position of the first package region and a position of the second package region correspond;
  • At least one of the first encapsulation region and the second encapsulation region is a non-smooth surface, and the sealant cures on the non-smooth surface.
  • the sealant is a glass glue or a frame sealant.
  • the display panel is an organic light emitting diode display panel or a liquid crystal display panel.
  • the present disclosure also provides a display device including the display panel as described above.
  • FIG. 1 is a schematic structural view of a display panel in an embodiment of the present disclosure
  • FIG. 2 is a plan view showing a first substrate in an embodiment of the present disclosure
  • 3a and 3b are partial schematic views showing a non-smooth surface formed after the surface of the package region is roughened in the embodiment of the present disclosure
  • FIG. 4 is a schematic structural view of a first substrate of an OLED display panel according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a second substrate of an OLED display panel according to an embodiment of the present disclosure
  • FIG. 6 is a schematic view 1 showing the curing of the sealant after the first substrate and the second substrate are in the embodiment of the present disclosure
  • FIG. 7 is a second schematic view showing the curing of the sealant after the first substrate and the second substrate are in the embodiment of the present disclosure.
  • FIG. 8 shows a flow chart of a method for packaging a display panel in one embodiment of the present disclosure
  • Figure 9 is a flow chart showing a method for packaging a display panel in another embodiment of the present invention.
  • the present disclosure provides a packaging method for a pair of box packages of two substrates of a display panel.
  • the encapsulation method forms a non-smooth surface by roughening the surface of at least one of the package regions of the two pairs of the substrate, thereby increasing the contact area between the sealant and the substrate, so that the seal formed in the package region.
  • the adhesion between the glue and the substrate is enhanced, and the barrier property against water vapor and oxygen is greatly improved, and the display panel has a good sealing property, thereby improving the life of the display device.
  • the technical solution of the present disclosure is specifically described by taking a pair of the package of the two substrates of the display panel as an example, but the technical solution of the present disclosure is not limited to the display panel.
  • a method for packaging a display panel including a first substrate and a second substrate is provided in an embodiment of the present disclosure.
  • the first substrate includes a first package area
  • the second substrate includes a second package area
  • a position of the first package area corresponds to a position of the second package area.
  • the method includes:
  • Step A roughening at least one surface of the first package region and the second package region to form a non-smooth surface
  • Step B applying a sealant on the surface of the first package region and/or the second package region processed in step A;
  • Step C the first substrate and the second substrate processed by the step B are processed
  • Step D Curing the sealant.
  • the sealant is cured to enhance the adhesion between the sealant and the substrate between the first package region and the second package region having a non-smooth surface, and the barrier property against water vapor and oxygen is obtained. Greatly improved to ensure good sealing of the display panel, thus extending the life of the display device.
  • the first substrate includes a first package area
  • the second substrate includes a first And a second package area, where a location of the first package area corresponds to a location of the second package area.
  • the manufacturing method includes packaging the first substrate and the second substrate by using the above-described packaging method, so that at least one of the opposite surfaces of the first package region and the second package region when facing the cartridge is a non-smooth surface, and the sealant cures on the non-smooth surface, enhancing The adhesion between the sealant and the substrate greatly improves the barrier properties of water vapor and oxygen, and ensures good sealing of the display panel.
  • the present disclosure also provides a display device including the above display panel, which extends the life of the display device due to the good sealing property of the display panel.
  • the display device is classified into a liquid crystal display device, an organic light emitting diode display device, and the like according to different display principles.
  • the OLED display device has the advantages of high brightness, wide viewing angle, active illumination, high contrast, ultra-thin and portable, and has become a novel flat panel display device researched and developed in recent years.
  • One of them is that the lifetime of OLED display devices is easily affected by the surrounding moisture and oxygen. Therefore, the packaging technology of OLED display devices has become a key process for improving the lifetime of OLED display devices.
  • the packaging method of the present disclosure can ensure the sealing of the OLED display panel is good, it can be used for the packaging of the OLED display panel, and the service life of the OLED display device can be greatly extended.
  • the display panel is packaged with a sealant or a glass glue.
  • the specific packaging process is:
  • At least one surface of the first package region of the first substrate and the second package region of the second substrate is roughened to form a non-smooth surface
  • a liquid sealant is applied on the surface of the first package region and/or the second package region subjected to the above treatment, and the sealant is dried.
  • the liquid sealant is usually a mixture of a glass frit and a solvent, and the solvent is used. Dispersing the glass frit to make it easy to coat, and the solvent will volatilize during the drying process;
  • the first substrate and the second substrate subjected to the above treatment are processed, and the sealant on the first substrate and the second substrate is irradiated with laser light to be melted;
  • At least one surface of the first package region of the first substrate and the second package region of the second substrate is roughened to form a non-smooth surface
  • first substrate and the second substrate subjected to the above treatment are subjected to the above, and the sealant is irradiated with ultraviolet light to be cured.
  • the sealant can be a UV curable adhesive.
  • the first package area and the second package area of the two substrates of the display panel are roughened to form a non-smooth surface, that is, the first package area has a non-smooth surface, and the second package area is also Having a non-smooth surface, the sealant is cured on the non-smooth surface of the first substrate and the second substrate, so that the adhesion of the sealant to the two substrates of the cartridge is enhanced to better block water vapor and oxygen, Make sure the display panel has a good seal.
  • the surfaces of the first package region and the second package region are roughened by a chemical etchant to avoid impact in the physical method without causing damage to the substrate.
  • the chemical etchant can be applied to at least one surface of the first package region and the second package region by spraying, and the precision of the spraying method can reach ⁇ 20 ⁇ m, and the width of the corrosion can be controlled by the spray amount of the nozzle.
  • the method can etch a rough surface having a continuous geometry as shown in Figures 3a and 3b, thereby increasing the contact area between the sealant and the substrate and further enhancing the adhesion between the sealant and the substrate.
  • the substrate material of the display panel is generally glass, quartz or an organic resin
  • the chemical etchant may be selected from a molar concentration of from about 20% to about 40% of H 2 O 2 and a molar concentration of from about 60% to about 80% of H.
  • a mixture of 2 SO 4 having a molar concentration of from about 40% to about 60% of HF and a molar concentration of from about 40% to about 60% of H 2 SO 4 , or a molar concentration of from about 65% to about 85%
  • a mixture of HNO 3 and a molar concentration of from about 15% to about 35% HCl
  • the chemical etchant needs to be removed after the roughening treatment and before the sealant is applied to the package region of the substrate.
  • the substrate can be cleaned by washing to remove the chemical etchant.
  • heat treatment is carried out at a temperature of about 80 ° C to about 100 ° C for about 10 min to about 30 min, and the residual chemical etching liquid and distilled water are volatilized and cleaned.
  • the first substrate and the second substrate are separately washed with distilled water, and are at about 80 ° C to about 100 ° C.
  • the heat treatment is carried out at a temperature for about 10 minutes to about 30 minutes, and the residual chemical etching liquid and distilled water are volatilized.
  • the packaging method of the present disclosure will be described below by taking the packaging process of the OLED display panel as an example.
  • the OLED display panel includes a first substrate 10 and a second substrate 20, and the substrate substrate 100 of the first substrate 10 (which is a quartz substrate, a glass substrate or a transparent substrate such as an organic resin) includes a display area 201. And a non-display area located at the periphery of the display area 201, the display area 201 is formed with an OLED, and the non-display area includes the first package area 200.
  • the second substrate 20 includes a second package A region (not shown) whose position corresponds to the position of the first package region 200 and is opposite to the cartridge.
  • the packaging process of the OLED display panel is:
  • Step S1 performing acid etching treatment on the surface of the first package region 200 of the base substrate 100 of the first substrate 10 (the surface opposite to the second package region of the second substrate) at a normal temperature to form a non-smooth surface , as shown in Figure 4.
  • the surface of the second package region of the second substrate 20 (the surface opposite to the case where the first package region 200 is opposed to the case) is subjected to an acid etching treatment to form a non-smooth surface, as shown in FIG.
  • the acid etching solution may be selected from a mixture having a molar concentration of about 20% to about 40% of H 2 O 2 and a molar concentration of about 60% to about 80% of H 2 SO 4 , and a molar concentration of about 40% to about 60% HF and a mixture of H 2 SO 4 having a molar concentration of from about 40% to about 60%, or a molar concentration of from about 65% to about 85% of HNO 3 and a molar concentration of from about 15% to about 35%
  • the HCl mixture is applied to the substrate substrate 100 by a spray coating process.
  • the precision of the spray process can be up to ⁇ 20 ⁇ m, and the width of the corrosion can be controlled by the spray amount of the nozzle.
  • Step S2 The first substrate 10 and the second substrate 20 subjected to the acid etching treatment in the step S1 are cleaned with distilled water, and heat-treated at a temperature of about 80 ° C to about 100 ° C for about 10 min to about 30 min to remove residual corrosion. The liquid and distilled water are washed and evaporated.
  • Step S3 After the acid etching solution is removed in step S2, the substrate 100 of the first substrate 10 is sent to a vacuum evaporation apparatus, and each layer of the organic light emitting diode is sequentially vapor-deposited in the display region 201, including the metal anode 101.
  • the organic light emitting diode may further include other structures such as a hole transport layer 103 and an electron transport layer 104 layer.
  • Step S4 After forming the organic light emitting diode on the base substrate 100 of the first substrate 10, applying a liquid sealant (glass glue) 30 to the second package region of the second substrate 20, as shown in FIG. 5, and sealing Glue drying.
  • a liquid sealant glass glue
  • sealing Glue drying it is also possible to apply a sealant to the first package region of the first substrate or to apply a sealant to both the first package region of the first substrate and the second package region of the second substrate.
  • Step S5 the second substrate 20 coated with the glass paste 30 is paired with the substrate substrate 100 processed in step S3, and then the first substrate 10 and the second substrate after the pair of boxes are aligned by the laser from top to bottom. 20 is irradiated, as shown in FIG. 6, or by irradiating the first substrate 10 and the second substrate 20 after the pair of boxes with laser light from the bottom to melt the glass paste 30, as shown in FIG.
  • Step S6 pressing the first substrate 10 and the second substrate 20 with sufficient force to extrude air, taking care not to extrude the glass glue 30, and placing the bonded first substrate 10 and the second substrate 20 at room temperature, The glass glue 30 is cured.
  • the glass paste 30 is cured on the two non-smooth surfaces, and the first substrate is packaged on the package. 10 and the second substrate 20 ensure good sealing performance of the OLED display panel, solve the life bottleneck of the OLED display device, and prolong the service life of the OLED display device.
  • the display panel may also be a liquid crystal display panel, and the packaging process is similar to the packaging process of the OLED display panel described above, except that in the step S3, a thin film transistor and a pixel electrode are formed on the first substrate and the second substrate.
  • the structure of the common electrode and the color film, the structure and the preparation method, and the method for forming the liquid crystal layer can all adopt structures and methods known to those skilled in the art, and are not described herein again.
  • the packaging process of the liquid crystal display panel and the above The difference of the packaging process of the OLED display panel further includes that the sealant used for the liquid crystal display panel package is usually a frame sealant (ultraviolet curable adhesive), and in the above step S4, the seal may be applied to the first package region of the first substrate.
  • a sealant or a sealant is applied to the second package region of the second substrate, or a sealant is applied to both the first package region of the first substrate and the second package region of the second substrate, in the above step S5
  • the first substrate and the second substrate after the pair of boxes are irradiated with ultraviolet light to cure the frame sealant. Other similarities are not repeated here.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种用于封装显示面板的方法、显示面板及其制作方法、显示装置。该显示面板包括第一基板（10）和第二基板（20），第一基板（10）包括第一封装区域，第二基板（20）包括第二封装区域，第一封装区域的位置和第二封装区域的位置相对应。所述方法包括：步骤A：对第一封装区域和第二封装区域的至少一个的表面进行粗糙化处理，形成非光滑表面；步骤B：在经过步骤A处理后的第一封装区域和/或第二封装区域的表面上涂布密封胶；步骤C：对盒在经过步骤B处理后的第一基板和第二基板；步骤D：固化密封胶。

Description

封装方法、显示面板及其制作方法、显示装置
相关申请的交叉引用
本申请主张在2014年09月01日在中国提交的中国专利申请号No.201410441251.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及封装技术领域，特别是涉及封装方法、显示面板及其制作方法、显示装置。
背景技术
有机发光二极管(Organic Light-Emitting Diode，简称OLED)显示器件由于具有高亮度、宽视角、主动发光、高对比度、超薄便携等优点，成为极具发展前景的新型平板显示器件。
其中，OLED包括形成在两个对盒基板之间的金属阳极、空穴传输层、有机发光层、电子传输层和金属阴极，所述两个对盒基板的四周通过密封胶密封，金属阳极和金属阴极共同作用驱动有机发光层发光。
但是，OLED显示器件也存在一些技术瓶颈，其中之一便是OLED显示器件的寿命问题。由于OLED的有机发光层对大气中的污染物、氧气及水汽都十分敏感，同时，大气中的水汽还会对金属电极造成电化学腐蚀，严重影响OLED显示器件的寿命。因此，OLED显示器件的封装技术成为提高OLED显示器件寿命的关键制程，而研究和开发有效的封装技术来阻隔H2O和O2成为亟待解决的任务。
发明内容
本公开提供一种封装方法、显示面板及其制作方法、显示装置，用以保证显示面板具有良好的密封性。
为解决上述技术问题，本公开提供一种用于封装显示面板的方法，所述显示面板包括第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应，所述方法包括：
步骤A：对所述第一封装区域和所述第二封装区域的至少一个表面进行 粗糙化处理，形成非光滑表面；
步骤B：在经过步骤A处理的第一封装区域和/或第二封装区域的表面涂布密封胶；
步骤C：对盒经过步骤B处理的第一基板和第二基板；
步骤D：固化所述密封胶。
可选的，在步骤A中，利用化学腐蚀剂对所述第一封装区域和所述第二封装区域所述至少一个表面进行粗糙化处理。
可选的，所述化学腐蚀剂为摩尔浓度为约20％-约40％的H2O2和摩尔浓度为约60％-约80％的H2SO4的混合液、摩尔浓度为约40％-约60％的HF和摩尔浓度为约40％-约60％的H2SO4的混合液或摩尔浓度为约65％-约85％的HNO3和摩尔浓度为约15％-约35％的HCl的混合液。可选的，所述化学腐蚀剂通过喷涂方法涂布在所述第一封装区域和所述第二封装区域的所述至少一个表面。
可选的，所述喷涂方法的精度为约20微米。
可选的，所述非光滑表面为均匀连续的几何形状。
可选的，在步骤A之后和步骤B之前所述方法还包括：
步骤E：去除所述化学腐蚀剂。
可选的，通过水洗的方式来去除所述化学腐蚀剂。
可选的，去除所述化学腐蚀剂之后，还包括：在约80℃～约100℃的温度下进行热处理。
可选的，所述热处理的时间为约20min～约30min。
可选的，所述密封胶为玻璃胶，所述固化所述密封胶的步骤包括：
采用激光照射所述玻璃胶使其熔融后固化。
可选的，所述密封胶为封框胶，所述固化所述密封胶的步骤包括：
采用紫外光照射所述封框胶使其固化。
本公开还提供一种制作显示面板的方法，所述显示面板包括第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应，所述方法包括采用如上所述的方法对所述第一基板和所述第二基板进行封装。
本公开还提供一种显示面板，包括：
第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相 对应；
固化在所述第一基板和所述第二基板之间的密封胶，其中，
所述第一封装区域和所述第二封装区域中的至少一个表面为非光滑表面，所述密封胶固化在所述非光滑表面上。
可选的，所述密封胶为玻璃胶或者封框胶。
可选的，所述显示面板为有机发光二极管显示面板或液晶显示面板。
本公开还提供一种显示装置，包括如上所述的显示面板。
本公开的上述技术方案的有益效果如下：
上述技术方案中，通过对两个对盒基板的封装区域中的至少一个的表面进行粗糙化处理，形成非光滑表面，增大了密封胶与基板之间的接触面积，使得在封装区域形成的密封胶和基板之间的粘着性增强，对水蒸气和氧气的阻隔性能有了很大提高，保证显示面板具有良好的密封性，从而提高了显示器件的寿命。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示本公开实施例中显示面板的结构示意图；
图2表示本公开实施例中第一基板的俯视图；
图3a和图3b表示本公开实施例中封装区域的表面经过粗糙化处理后，形成的非光滑表面的局部示意图；
图4表示本公开实施例中OLED显示面板的第一基板的结构示意图；
图5表示本公开实施例中OLED显示面板的第二基板的结构示意图；
图6表示本公开实施例中第一基板和第二基板对盒后对密封胶进行固化的示意图一；
图7表示本公开实施例中第一基板和第二基板对盒后对密封胶进行固化的示意图二；
图8表示本公开一个实施例中一种用于封装显示面板的方法的流程图；
图9表示本发明另一个实施例中一种用于封装显示面板的方法的流程图。
具体实施方式
本公开提供一种封装方法，用于显示面板的两个基板的对盒封装。所述封装方法通过对两个对盒基板的封装区域中的至少一个的表面进行粗糙化处理，形成非光滑表面，增大了密封胶与基板之间的接触面积，使得在封装区域形成的密封胶和基板之间的粘着性增强，对水蒸气和氧气的阻隔性能有了很大提高，保证显示面板具有良好的密封性，从而提高了显示器件的寿命。
下面将结合附图和实施例，对本公开的具体实施方式作进一步详细描述。以下实施例用于说明本公开，但不用来限制本公开的范围。
本公开实施例中以显示面板的两个基板的对盒封装为例，来对本公开的技术方案进行具体描述，但并不限定本公开的技术方案只适用于显示面板。
本公开实施例中提供一种用于封装显示面板的的方法，所述显示面板包括第一基板和第二基板。其中，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应。
参见图8，所述方法包括：
步骤A：对所述第一封装区域和所述第二封装区域的至少一个表面进行粗糙化处理，形成非光滑表面；
步骤B：在经过步骤A处理的第一封装区域和/或第二封装区域的表面涂布密封胶；
步骤C：对盒经过步骤B处理的第一基板和所述第二基板；
步骤D：固化所述密封胶。
通过上述封装方法，使得密封胶固化在具有非光滑表面的第一封装区域和所述第二封装区域之间增强了密封胶和基板之间的粘着性，对水蒸气和氧气的阻隔性能有了很大提高，保证显示面板具有良好的密封性，从而延长了显示器件的寿命。
相应地，本公开实施例中还提供一种显示面板及其制作方法，所述显示面板包括第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应。所述制作方法包括采用上述的封装方法对所述第一基板和所述第二基板进行封装，使得所述第一封装区域和所述第二封装区域对盒时相对的表面中的至少一个为非光滑表面，而密封胶固化在所述非光滑表面上，增强 了密封胶和基板之间的粘着性，对水蒸气和氧气的阻隔性能有了很大提高，保证显示面板具有良好的密封性。
本公开还提供一种显示装置，其包括上述的显示面板，由于显示面板具有良好的密封性，从而延长了显示装置的寿命。
现有技术中，显示器件根据显示原理不同分为液晶显示器件、有机发光二极管显示器件等。其中，OLED显示器件具有高亮度、宽视角、主动发光、高对比度、超薄便携等优点，成为近年来研究和开发的新型平板显示器件。但是，OLED显示器件也存在一些技术瓶颈，其中之一便是OLED显示器件的寿命易受周围水气与氧气所影响而缩短。因此，OLED显示器件的封装技术成为提高OLED显示器件寿命的关键制程。
由于本公开的封装方法能够确保OLED显示面板的密封良好，将其用于OLED显示面板的封装，可以大大延长OLED显示器件的使用寿命。
一般地，采用封框胶或玻璃胶对显示面板进行封装。当使用玻璃胶对显示面板进行封装时，具体的封装过程为：
首先，对第一基板的第一封装区域和第二基板的第二封装区域的至少一个表面进行粗糙化处理，形成非光滑表面；
之后，在经过上述处理的第一封装区域和/或第二封装区域的表面涂布液体密封胶，并将密封胶烘干，液体密封胶通常为玻璃料和溶剂形成的混合物，溶剂是起到分散玻璃料使其易于涂布作用的，烘干的过程中溶剂会挥发；
然后，对盒经过上述处理的第一基板和第二基板，并用激光照射位于第一基板和第二基板的密封胶，使其熔融；
最后，用足够的力按压第一基板和第二基板，挤出空气，但不要挤出玻璃胶，并将粘接的所述第一基板和所述第二基板置于室温下，待玻璃胶固化。
至此完成第一基板和第二基板的封装。
当使用封框胶对显示面板进行封装时，具体的封装过程为：
首先，对第一基板的第一封装区域和第二基板的第二封装区域的至少一个表面进行粗糙化处理，形成非光滑表面；
然后，在经过上述处理的第一封装区域和/或第二封装区域的表面涂布液体封框胶；
最后，对盒经过上述处理的第一基板和第二基板，并用紫外光照射封框胶，使其固化。
至此完成第一基板和第二基板的封装。
其中，所述封框胶可以为紫外固化胶。
可选的，对显示面板的两个基板的第一封装区域和第二封装区域的表面均进行粗糙化处理，形成非光滑表面，即，第一封装区域具有非光滑表面，第二封装区域也具有非光滑表面，密封胶固化在第一基板和第二基板的所述非光滑表面上，使得密封胶与对盒的两个基板的粘着性均得到增强，更好地阻隔水蒸气和氧气，确保显示面板具有良好的密封性。
其中，对基板的表面进行粗糙化处理的方式很多，可以是物理方法或化学方法。例如，在一个具体的实施方式中，通过化学腐蚀剂对第一封装区域和第二封装区域的表面进行粗糙化处理，避免了物理方法中的冲击，不会对基板造成损伤。其中，化学腐蚀剂可以通过喷涂的方式涂布在所述第一封装区域和第二封装区域的至少一个表面，喷涂方法的精度可以达到±20μm，而腐蚀的宽度可以由喷头喷涂量来控制，通过该方法可以腐蚀出如图3a和3b所示的具有连续几何形状的粗糙表面，从而增大了密封胶与基板之间的接触面积，并进一步增强了密封胶与基板之间的粘附性。由于显示面板的基板材料一般为玻璃、石英或有机树脂，则所述化学腐蚀剂可以选择摩尔浓度为约20％-约40％的H2O2和摩尔浓度为约60％-约80％的H2SO4的混合液、摩尔浓度为约40％-约60％的HF和摩尔浓度为约40％-约60％的H2SO4的混合液，或摩尔浓度为约65％-约85％的HNO3和摩尔浓度为约15％-约35％的HCl的混合液。
当通过化学腐蚀剂对基板的封装区域的表面进行粗糙化处理时，参见图9，在粗糙化处理后，并在基板的封装区域涂布密封胶之前，需要去除化学腐蚀剂。具体可以用水洗的方式对基板进行清洗，来去除化学腐蚀剂。并在约80℃～约100℃的温度下进行热处理约10min～约30min，将残留的化学腐蚀液和蒸馏水挥发干净。例如，当对第一基板和第二基板的封装区域的表面均进行化学腐蚀的粗糙化处理时，用蒸馏水对第一基板和第二基板分别进行清洗，并在约80℃～约100℃的温度下进行热处理约10min～约30min，将残留的化学腐蚀液和蒸馏水挥发干净。
下面以OLED显示面板的封装过程为例，来介绍本公开的封装方法。
结合图1和图2所示，OLED显示面板包括第一基板10和第二基板20，第一基板10的衬底基板100(为石英基板、玻璃基板或有机树脂等透明基板)包括显示区域201和位于显示区域201外围的非显示区域，显示区域201形成有OLED，非显示区域包括第一封装区域200。第二基板20包括第二封装 区域(图中未示出)，其位置与第一封装区域200的位置对应且对盒时相对。
示例性的，OLED显示面板的封装过程为：
步骤S1：在常温下，对第一基板10的衬底基板100的第一封装区域200表面(与第二基板的第二封装区域对盒时相对的表面)进行酸腐蚀处理，形成非光滑表面，结合图4所示。并对第二基板20的第二封装区域表面(与第一封装区域200对盒时相对的表面)进行酸腐蚀处理，形成非光滑表面，结合图5所示。其中，酸腐蚀液可以选择摩尔浓度为约20％-约40％的H2O2和摩尔浓度为约60％-约80％的H2SO4的混合液、摩尔浓度为约40％-约60％的HF和摩尔浓度为约40％-约60％的H2SO4的混合液，或摩尔浓度为约65％-约85％的HNO3和摩尔浓度为约15％-约35％的HCl的混合液，将酸腐蚀液涂布在在衬底基板100上可以通过喷涂工艺来实现，喷涂工艺的精度可以达到±20μm，而腐蚀的宽度可以由喷头喷涂量来控制。
步骤S2：将经过步骤S1酸腐蚀处理后的第一基板10和第二基板20用蒸馏水清洗干净，并在约80℃～约100℃的温度下进行热处理约10min～约30min，将残留的腐蚀液和蒸馏水清洗并挥发干净。
步骤S3：经过步骤S2的去除酸腐蚀液处理后，将第一基板10的衬底基板100送入真空蒸镀设备，在显示区域201依次蒸镀有机发光二极管的各个层，包括金属阳极101、有机发光层105和金属阴极102等，其中，金属阳极102为透明导电层，如ITO和IZO，金属阴极101则为反射层，如镁银合金、锂铝合金、铝等，如图4所示。有机发光二极管还可以包括空穴传输层103和电子传输层104层等其他结构。
步骤S4：在第一基板10的衬底基板100上形成有机发光二极管后，在第二基板20的第二封装区域涂布液体密封胶(玻璃胶)30，如图5所示，并将密封胶烘干。当然，也可以在第一基板的第一封装区域涂布密封胶，或者在第一基板的第一封装区域和第二基板的第二封装区域均涂布密封胶。
步骤S5：将涂布有玻璃胶30的第二基板20与经过步骤S3处理后的衬底基板100对盒，然后通过从上而下的激光对对盒后的第一基板10和第二基板20进行照射，如图6所示，或通过从下而上的激光对对盒后的第一基板10和第二基板20进行照射，使玻璃胶30熔融，如图7所示。
步骤S6：用足够的力按压第一基板10和第二基板20，挤出空气，注意不要挤出玻璃胶30，并将粘接的第一基板10和第二基板20置于室温下，待玻璃胶30固化。
至此完成OLED显示面板的封装。
经过上述步骤对OLED显示面板进行封装后，由于第一基板10和第二基板20的内侧表面均具有非光滑表面，玻璃胶30固化在所述两个非光滑表面上，对盒封装第一基板10和第二基板20，保证了OLED显示面板的密封性良好，解决了OLED显示器件的寿命瓶颈，延长了OLED显示器件的使用寿命。
所述显示面板还可以为液晶显示面板，其封装过程与上述OLED显示面板的封装过程类似，其区别在于，在所述步骤S3中，在第一基板和第二基板上形成薄膜晶体管、像素电极、公共电极以及彩膜等结构，这些结构及制备方法以及液晶层的形成方法均可以采用本领域技术人员所知的结构和方法，此处不再赘述；此外，液晶显示面板的封装过程和上述OLED显示面板的封装过程的区别还包括，液晶显示面板封装所用的密封胶通常为封框胶(紫外固化胶)，则在上述步骤S4中，可以在第一基板的第一封装区域涂布封框胶，或者在第二基板的第二封装区域涂布封框胶，或者在第一基板的第一封装区域和第二基板的第二封装区域均涂布封框胶，在上述步骤S5中，对对盒后的第一基板和第二基板进行紫外光照射，使得封框胶固化。其他相同之处不再赘述。
本公开的技术方案中，通过对两个对盒基板的封装区域中的至少一个的表面进行粗糙化处理，形成非光滑表面，使得在封装区域形成的密封胶和基板之间的粘着性增强，对水蒸气和氧气的阻隔性能有了很大提高，保证显示面板具有良好的密封性，从而延长了显示器件的寿命。
以上所述仅是本公开的示例性实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视本公开的保护范围。

Claims (17)

  1. 一种用于封装显示面板的方法，其中所述显示面板包括第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应，所述封装方法包括：
    步骤A：对所述第一封装区域和所述第二封装区域的至少一个表面进行粗糙化处理，形成非光滑表面；
    步骤B：在经过步骤A处理的第一封装区域和/或第二封装区域的表面涂布密封胶；
    步骤C：对盒经过步骤B处理的第一基板和第二基板；
    步骤D：固化所述密封胶。
  2. 根据权利要求1所述的方法，其中在步骤A中，利用化学腐蚀剂对所述第一封装区域和所述第二封装区域的所述至少一个表面进行粗糙化处理。
  3. 根据权利要求2所述的方法，其中所述化学腐蚀剂为摩尔浓度为约20％-约40％的H2O2和摩尔浓度为约60％-约80％的H2SO4的混合液、摩尔浓度为约40％-约60％的HF和摩尔浓度为约40％-约60％的H2SO4的混合液或摩尔浓度为约65％-约85％的HNO3和摩尔浓度为约15％-约35％的HCl的混合液。
  4. 根据权利要求2或3所述的方法，其中所述化学腐蚀剂通过喷涂方法涂布在所述第一封装区域和所述第二封装区域的所述至少一个表面。
  5. 权利要求4所述的方法，其中所述喷涂方法的精度为约20微米。
  6. 根据权利要求1-5任一项所述的方法，其中所述非光滑表面为均匀连续的几何形状。
  7. 根据权利要求2-6任一项所述的方法，其中在步骤A之后和步骤B之前所述方法还包括：
    步骤E：去除所述化学腐蚀剂。
  8. 根据权利要求7所述的方法，其中通过水洗的方式来去除所述化学腐蚀剂。
  9. 根据权利要求7或8所述的方法，其中去除所述化学腐蚀剂之后，还包括：
    在约80℃～约100℃的温度下进行热处理。
  10. 根据权利要求9所述的方法，其中所述热处理的时间为约20min～约30min。
  11. 根据权利要求1-10任一项所述的方法，其中
    所述密封胶为玻璃胶，所述固化所述密封胶的步骤包括：
    采用激光照射所述玻璃胶使其熔融后固化。
  12. 根据权利要求1-10任一项所述的方法，其中
    所述密封胶为封框胶，所述固化所述密封胶的步骤包括：
    采用紫外光照射所述封框胶使其固化。
  13. 一种制作显示面板的方法，所述显示面板包括第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应，所述方法包括：采用权利要求1-12任一项所述的方法对所述显示面板进行封装。
  14. 一种显示面板，包括：
    第一基板和第二基板，所述第一基板包括第一封装区域，所述第二基板包括第二封装区域，所述第一封装区域的位置和所述第二封装区域的位置相对应；
    固化在所述第一基板和所述第二基板之间的密封胶，
    其中所述第一封装区域和所述第二封装区域中的至少一个表面为非光滑表面，所述密封胶固化在所述非光滑表面上。
  15. 根据权利要求14所述的显示面板，其中所述密封胶为玻璃胶或者封框胶。
  16. 根据权利要求14或15所述的显示面板，其中所述显示面板为有机发光二极管显示面板或液晶显示面板。
  17. 一种显示装置，其包括权利要求14-16任一项所述的显示面板。
PCT/CN2014/092941 2014-01-09 2014-12-03 封装方法、显示面板及其制作方法、显示装置 WO2016033888A1 (zh)

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