WO2016180079A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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WO2016180079A1
WO2016180079A1 PCT/CN2016/076591 CN2016076591W WO2016180079A1 WO 2016180079 A1 WO2016180079 A1 WO 2016180079A1 CN 2016076591 W CN2016076591 W CN 2016076591W WO 2016180079 A1 WO2016180079 A1 WO 2016180079A1
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substrate
layer
display panel
oled device
panel according
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PCT/CN2016/076591
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English (en)
French (fr)
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李发顺
崔富毅
白雪飞
阮士薪
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京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US15/511,288 priority Critical patent/US10199576B2/en
Publication of WO2016180079A1 publication Critical patent/WO2016180079A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • An exemplary embodiment of the present invention is directed to a display panel, a method of fabricating the same, and a display device.
  • OLED organic light emitting diode
  • a package between a package cover and an array substrate on which an organic light-emitting material is evaporated is usually implemented using glass glue.
  • the glass glue is first coated on the package cover plate, and then subjected to a series of heat treatment to remove the solvent such as moisture in the glass glue, and then vacuum-bonded to the array substrate on which the organic light-emitting material is evaporated, and is used. Laser sintering.
  • the organic light-emitting material and the glass paste for packaging are respectively formed on two different glass substrates, when the two glass substrates are vacuum-bonded, if the alignment is deviated during the bonding process, Then, the coated glass adhesive layer and the evaporated organic light-emitting layer are offset, resulting in poor packaging, thereby reducing the efficiency of the entire packaging process.
  • the present invention aims to provide a display panel, a manufacturing method thereof, and a display device to solve the existing In the OLED packaging process, the alignment deviation causes the glass paste layer and the evaporated organic light-emitting layer to be offset, thereby causing a problem of poor packaging.
  • a method of fabricating a display panel including:
  • the first substrate and the second substrate are aligned, and a sealing structure is formed between the first substrate and the second substrate by irradiating the package region with a laser.
  • the OLED device includes a first electrode layer, an organic light emitting layer, and a second electrode layer sequentially formed on the first substrate, wherein the OLED is formed after the glass paste layer is formed The organic light-emitting layer of the device.
  • the organic light-emitting layer of the OLED device is formed by vacuum evaporation of an organic material.
  • the method for fabricating the display panel further includes: after forming the glass paste layer, and before forming the organic light emitting layer of the OLED device, performing high temperature processing on the first substrate, The solvent in the glass layer is removed.
  • the glass glue layer has a thickness of from 3 ⁇ m to 8 ⁇ m.
  • the method for fabricating the display panel further includes: forming a desiccant layer on the second substrate before the first substrate and the second substrate are bonded to each other.
  • the desiccant layer is transparent.
  • the desiccant layer has a thickness of from 50 angstroms to 100 angstroms.
  • a display panel includes a first substrate and a second substrate disposed opposite to each other, and the first substrate is provided with an OLED device, the first substrate and the second substrate A sealing structure formed by a glass paste layer is disposed therebetween, wherein the glass glue layer is formed on the first substrate.
  • the OLED device includes a first electrode layer, an organic light emitting layer, and a second electrode layer which are sequentially formed on the first substrate.
  • the glass glue layer has a thickness of from 3 ⁇ m to 8 ⁇ m.
  • a desiccant layer is further disposed on the second substrate.
  • the desiccant layer is transparent.
  • the desiccant layer has a thickness of from 50 angstroms to 100 angstroms.
  • a display device comprising the display panel of any of the above.
  • a method for fabricating a display panel according to an embodiment of the present invention by forming a glass paste layer on a substrate for forming an OLED device, so that a coated glass paste layer and an evaporated organic light-emitting layer are prevented from occurring in a subsequent packaging process.
  • the phenomenon of offset thereby improving the production efficiency of the entire packaging process; forming an organic light-emitting layer of the OLED device after forming the glass paste layer, thereby preventing residues on the evaporation mask from causing poor display of the OLED display device or foreign matter (
  • the form of the particle is present in the display; the substrate in which the glass paste layer is formed is subjected to a high temperature treatment after the formation of the glass paste layer and before the formation of the organic light-emitting layer of the OLED device to remove the solvent in the glass paste layer; Forming a desiccant layer on the package cover plate can prevent damage to the OLED device caused by moisture not removed in the glass paste, thereby further protecting the OLED device.
  • FIG. 1 is a flow chart of a method of fabricating a display panel according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a process of fabricating an organic light-emitting layer in accordance with an embodiment of the present invention.
  • first, second, and third are used for descriptive purposes only, and are not to be construed as indicating or implying relative importance.
  • plurality refers to two or more, unless specifically defined otherwise.
  • the first substrate and the second substrate are aligned, and the package region is irradiated with a laser to form a sealing structure between the first substrate and the second substrate.
  • a method for fabricating a display panel according to an embodiment of the present invention by forming a glass paste layer on a substrate for forming an OLED device, so that a coated glass paste layer and an evaporated organic light-emitting layer are prevented from occurring in a subsequent packaging process.
  • the phenomenon of offset thereby increasing the production efficiency of the entire packaging process.
  • the first substrate may be a glass substrate on which a TFT (Thin Film Transistor) is formed, and an OLED device may be formed thereon, thereby obtaining an array substrate of the OLED display panel, and the second substrate may be a transparent glass substrate.
  • TFT Thin Film Transistor
  • the first electrode layer, the organic light emitting layer, and the second electrode layer may be sequentially formed on the first substrate to form an OLED device, wherein the organic light emitting layer may be formed.
  • Evaporation process Specifically, the organic small molecular material can be sublimated or melted into vapor by heating in a vacuum chamber, and the formed organic material vapor is deposited on the display area of the first substrate through the opening of the metal mask to form An organic light-emitting layer of the desired pattern.
  • the metal mask and the first substrate are easily contacted by the action of the peripheral force, thereby causing the residual organic material on the metal mask to adhere to the first substrate, and the residue may be
  • the resulting OLED device is rendered poorly or exists as a foreign particle.
  • the step of forming the organic light-emitting layer of the OLED device is after the step of forming a glass paste layer.
  • FIG. 1 is a flowchart of a method for fabricating a display panel according to an embodiment of the present invention.
  • the method for fabricating the display panel includes the following steps:
  • step S2 since a glass adhesive layer 110 has been formed on the package region around the first substrate 100 during the fabrication of the organic light-emitting layer, the metal mask layer can be effectively used by the glass paste layer 110.
  • the substrate 200 is spaced apart from the first substrate 100 to prevent the metal mask 200 from directly contacting the display area of the first substrate 100, thereby preventing the residual organic material on the metal mask from adhering to the display area of the first substrate 100.
  • the glass paste layer formed as described above may have a thickness of from 3 ⁇ m to 8 ⁇ m, and may be, for example, 5 ⁇ m, 6 ⁇ m or the like.
  • the glass paste may be first coated on the package region of the first substrate, and then the first substrate is subjected to a high temperature treatment to remove a solvent such as moisture in the glass paste, and then an organic light emitting layer of the OLED device is formed thereon. After the other structures are fabricated to obtain the array substrate, they are bonded to the second substrate, and then the glass paste is irradiated with a laser to form a sealing structure between the first substrate and the second substrate.
  • the method further includes forming a desiccant layer on the second substrate, wherein the desiccant layer may have a thickness of 50 angstroms to 100 angstroms, for example, 60 angstroms, 80 angstroms, or the like.
  • a transparent desiccant material may be used to form a transparent desiccant layer on the surface of the second substrate and the first substrate, and further, the film-shaped dry structure may be directly used, and the film may be directly pasted. It may be attached to the surface of the second substrate.
  • a display panel including a first substrate and a second substrate disposed opposite to each other, wherein the first substrate is provided with an OLED device, and the first substrate and the second substrate are disposed between A sealing structure formed by a glass glue layer, wherein a glass glue layer is formed on the first substrate.
  • the glass glue layer has a thickness of from 3 ⁇ m to 8 ⁇ m.
  • the OLED device is prevented from being damaged by a solvent such as moisture not removed in the glass paste, and the second substrate is further provided with a desiccant layer, wherein the desiccant layer has a thickness of 50 angstroms - 100 angstroms, for example, may be 60 angstroms, 80 angstroms, and the like.
  • a display device comprising the above display panel.
  • the display device may be any product or component having a display function such as a notebook computer display screen, a television, a digital photo frame, a mobile phone, a tablet computer, or the like.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制作方法、显示装置，显示面板的制作方法包括：在第一基板（100）的封装区域上形成玻璃胶层（110）；在第一基板的显示区域上形成OLED器件；以及将第一基板与第二基板对位贴合，并采用激光照射封装区域在第一基板与第二基板之间形成密封结构。通过将玻璃胶层制作在用于形成OLED器件的基板上，使得在后续的封装过程中避免出现涂布的玻璃胶层和蒸镀的有机发光层偏移的现象，从而提高整个封装工艺的生产效率。

Description

显示面板及其制作方法、显示装置
本申请要求于2015年5月8日递交的中国专利申请第201510232793.4号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明的示例性实施例涉及一种显示面板及其制作方法、显示装置。
背景技术
近年来，有机发光二极管(OLED)显示器作为一种新兴的平板显示器，被引起广泛的关注。由于OLED器件本身对水汽和氧气非常敏感，因此在实际应用中需要对OLED器件进行封装以隔绝水汽和氧气从而延长OLED器件的使用寿命。
在目前的OLED显示器制作工艺中，通常采用玻璃胶实现封装盖板与蒸镀有有机发光材料的阵列基板之间的封装。具体地，首先将玻璃胶涂布在封装盖板上，然后经过一系列的加热处理，除去玻璃胶中的水分等溶剂，再与蒸镀有有机发光材料的阵列基板进行真空贴合，并采用激光烧结。然而，在上述工艺中，由于有机发光材料与用于封装的玻璃胶分别形成在两个不同的玻璃基板上，当将两玻璃基板进行真空贴合时，如果贴合过程中对位发生偏差，则涂布的玻璃胶层和蒸镀的有机发光层就会偏移，从而造成封装不良，进而降低整个封装工艺的效率。
发明内容
本发明旨在提供一种显示面板及其制作方法、显示装置，以解决现有 的OLED封装过程中对位偏差造成玻璃胶层和蒸镀的有机发光层偏移，从而造成封装不良的问题。
根据本发明的一方面，提供了一种显示面板的制作方法，包括：
在第一基板的封装区域上形成玻璃胶层；
在所述第一基板的显示区域上形成OLED器件；以及
将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域在所述第一基板与所述第二基板之间形成密封结构。
根据本发明的实施例，所述OLED器件包括依次形成在所述第一基板上的第一电极层、有机发光层和第二电极层，其中，在形成所述玻璃胶层之后形成所述OLED器件的有机发光层。
根据本发明的实施例，所述OLED器件的有机发光层通过有机材料的真空蒸镀形成。
根据本发明的实施例，所述显示面板的制作方法还包括：在形成所述玻璃胶层之后，以及在形成所述OLED器件的有机发光层之前，对所述第一基板进行高温处理，以去除所述玻璃胶层中的溶剂。根据本发明的实施例，所述玻璃胶层的厚度为3μm-8μm。
根据本发明的实施例，所述显示面板的制作方法还包括：所述将所述第一基板与所述第二基板对合贴合之前，在所述第二基板上形成干燥剂层。
根据本发明的实施例，所述干燥剂层为透明的。
根据本发明的实施例，所述干燥剂层的厚度为50埃米-100埃米。
根据本发明的第二方面，还提供了一种显示面板，包括相对设置的第一基板和第二基板，所述第一基板上设置有OLED器件，所述第一基板与所述第二基板之间设置有通过玻璃胶层形成的密封结构，其中，所述玻璃胶层制作在所述第一基板上。
根据本发明的实施例，所述OLED器件包括依次形成在所述第一基板上的第一电极层、有机发光层和第二电极层。
根据本发明的实施例，所述玻璃胶层的厚度为3μm-8μm。
根据本发明的实施例，所述第二基板上还设置有干燥剂层。
根据本发明的实施例，所述干燥剂层为透明的。
根据本发明的实施例，所述干燥剂层的厚度为50埃米-100埃米。
根据本发明的第三方面，还提供了一种显示装置，包括上述任一的显示面板。
根据本发明实施例的显示面板的制作方法，通过将玻璃胶层制作在用于形成OLED器件的基板上，使得在后续的封装过程中避免出现涂布的玻璃胶层和蒸镀的有机发光层偏移的现象，从而提高整个封装工艺的生产效率；通过形成玻璃胶层之后形成OLED器件的有机发光层，从而能够防止蒸镀掩膜板上的残留物造成OLED显示器件显示不良或者以异物(particle)的形式存在于显示器中；通过在形成玻璃胶层之后，以及在形成OLED器件的有机发光层之前，对形成有玻璃胶层的基板进行高温处理，以去除玻璃胶层中的溶剂；通过在封装盖板上形成干燥剂层，能够防止玻璃胶中未去除的水分对OLED器件的损害，进而起到保护作用。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是根据本发明实施例的一种显示面板的制作方法的流程图；以及
图2是根据本发明实施例的制作有机发光层时的示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“上”、“下”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，在本发明中，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
根据本发明实施例的一种显示面板的制作方法，包括：
在第一基板的封装区域上形成玻璃胶层；
在第一基板的显示区域上形成OLED器件；以及
将第一基板与第二基板对位贴合，并采用激光照射封装区域，在第一基板与第二基板之间形成密封结构。
根据本发明实施例的显示面板的制作方法，通过将玻璃胶层制作在用于形成OLED器件的基板上，使得在后续的封装过程中避免出现涂布的玻璃胶层和蒸镀的有机发光层偏移的现象，从而提高整个封装工艺的生产效率。
其中，上述的第一基板可以为形成有TFT(薄膜晶体管)的玻璃基板，通过再在其上形成OLED器件，从而可以得到OLED显示面板的阵列基板，上述的第二基板可以采用透明的玻璃基板，作为OLED显示面板的封装盖板。
具体地，在上述的显示面板制作方法中，可在通过所述第一基板上依次制作第一电极层、有机发光层和第二电极层，从而形成OLED器件，其中，制作有机发光层可以采用蒸镀工艺。具体地，可通过在真空腔体内加热有机小分子材料，使其升华或者熔融气化成蒸汽，形成的有机材料蒸汽透过金属掩膜板的开孔沉积在第一基板的显示区域上，从而形成所需图案的有机发光层。
然而，在上述蒸镀的过程中，金属掩膜板和第一基板由于周边力的作用容易发生接触，从而导致金属掩膜板上残留的有机材料附着在第一基板上，该残留物可能会造成最终形成的OLED器件显示不良或者以异物(particle)的形式存在其中。根据本发明的实施例，为了避免在蒸镀过程中蒸镀用的金属掩膜板与第一基板接触造成不良或者以异物(particle)的形式存在于显示器中，在上述显示面板制作方法中，形成OLED器件的有机发光层的步骤位于形成玻璃胶层的步骤之后。
参见图1如图1所示，根据本发明实施例的图1是本发明实施方式提供的一种显示面板的制作方法的流程图，该显示面板的制作方法包括以下步骤：
S1：在第一基板的封装区域上形成玻璃胶层；
S2：在所述第一基板的显示区域上形成OLED器件；以及
S3：将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域，在所述第一基板与所述第二基板之间形成密封结构。
如图2所示，在步骤S2中，由于在制作有机发光层时，第一基板100周边的封装区域上已经形成有玻璃胶层110，通过该玻璃胶层110可以有效地将金属掩膜板200与第一基板100相隔开，防止金属掩膜板200与第一基板100的显示区域直接接触，进而避免金属掩膜板上残留的有机材料粘附到第一基板100的显示区域上，其中，上述形成的玻璃胶层的厚度可以为3μm-8μm，例如，可以为5μm、6μm等。
具体地，可以首先在第一基板的封装区域涂布玻璃胶，而后对该第一基板进行高温处理，以除去玻璃胶中的水分等溶剂，再在其上制作OLED器件的有机发光层，并待其他结构制作完毕得到阵列基板之后，将其与第二基板贴合，而后采用激光照射玻璃胶，在第一基板与第二基板之间形成密封结构。
根据本发明的实施例，为了避免玻璃胶中的溶剂去除不彻底从而对OLED器件造成不良影响，在上述的封装过程中，在将所述第一基板与所述第二基板对合贴合之前还包括：在所述第二基板上形成干燥剂层，其中，该干燥剂层的厚度可以为50埃米-100埃米，例如，可以为60埃米、80埃米等。具体地，可以采用透明的干燥剂材料在第二基板与第一基板贴合的表面涂覆形成一层透明的干燥剂层，此外，还可以直接采用薄膜型状的干燥结构，将其直接贴附在第二基板的表面即可。通过上述方式，可以防止玻璃胶中未去除的水分等溶剂对OLED器件的损害，进而起到保护作用。
此外，根据本发明实施例，还提供了一种显示面板，包括相对设置的第一基板和第二基板，第一基板上设置有OLED器件，第一基板与所述第二基板之间设置有通过玻璃胶层形成的密封结构，其中，玻璃胶层制作在第一基板上。
根据本发明的实施例，所述玻璃胶层的厚度为3μm-8μm。
根据本发明的实施例，防止玻璃胶中未去除的水分等溶剂对OLED器件的损害，所述第二基板上还设置有干燥剂层，其中，所述干燥剂层的厚度为50埃米-100埃米，例如，可以为60埃米、80埃米等。
此外，根据本发明实施例，还提供了一种显示装置，包括上述的显示面板。
根据本发明实施例的显示装置可以是笔记本电脑显示屏、电视、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。
以上实施例仅用于说明本发明，而并非对本发明的限制，有关技术领域的普通技术人员，在不脱离本发明的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明的范畴，本发明的专利保护范围应由权利要求限定。

Claims (15)

  1. 一种显示面板的制作方法，包括：
    在第一基板的封装区域上形成玻璃胶层；
    在所述第一基板的显示区域上形成OLED器件；以及
    将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域，在所述第一基板与所述第二基板之间形成密封结构。
  2. 根据权利要求1所述的显示面板的制作方法，其中，所述OLED器件包括依次形成在所述第一基板上的第一电极层、有机发光层和第二电极层，其中，在形成所述玻璃胶层之后形成所述OLED器件的有机发光层。
  3. 根据权利要求2所述的显示面板的制作方法，其中，所述OLED器件的有机发光层通过有机材料的真空蒸镀形成。
  4. 根据权利要求2或者3所述的显示面板的制作方法，还包括：在形成所述玻璃胶层之后，以及在形成所述OLED器件的有机发光层之前，对所述第一基板进行高温处理，以去除所述玻璃胶层中的溶剂。
  5. 根据权利要求1-4任一所述的显示面板的制作方法，其中，所述玻璃胶层的厚度为3μm-8μm。
  6. 根据权利要求1-5任一所述的显示面板的制作方法，还包括：将所述第一基板与所述第二基板对合贴合之前，在所述第二基板上形成干燥剂层。
  7. 根据权利要求6所述的显示面板的制作方法，其中，所述干燥剂层为透明的。
  8. 根据权利要求6或者7所述的显示面板的制作方法，其中，所述干燥剂层的厚度为50埃米-100埃米。
  9. 一种显示面板，包括相对设置的第一基板和第二基板，所述第一基 板上设置有OLED器件，所述第一基板与所述第二基板之间设置有通过玻璃胶层形成的密封结构，其中，所述玻璃胶层制作在所述第一基板上。
  10. 根据权利要求9所述的显示面板，其中，所述OLED器件包括依次形成在所述第一基板上的第一电极层、有机发光层和第二电极层。
  11. 根据权利要求9或者10所述的显示面板，其中，所述玻璃胶层的厚度为3μm-8μm。
  12. 根据权利要求9-11任一所述的显示面板，其中，所述第二基板上还设置有干燥剂层。
  13. 根据权利要求12所述的显示面板，其中，所述干燥剂层为透明的。
  14. 根据权利要求12或者13所述的显示面板，其中，所述干燥剂层的厚度为50埃米-100埃米。
  15. 一种显示装置，包括根据权利要求9-14任一所述的显示面板。
PCT/CN2016/076591 2015-05-08 2016-03-17 显示面板及其制作方法、显示装置 WO2016180079A1 (zh)

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