WO2016112597A1 - 封装方法、显示面板及显示装置 - Google Patents

封装方法、显示面板及显示装置 Download PDF

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WO2016112597A1
WO2016112597A1 PCT/CN2015/077286 CN2015077286W WO2016112597A1 WO 2016112597 A1 WO2016112597 A1 WO 2016112597A1 CN 2015077286 W CN2015077286 W CN 2015077286W WO 2016112597 A1 WO2016112597 A1 WO 2016112597A1
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glass
substrate
layer
package
oxide layer
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PCT/CN2015/077286
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English (en)
French (fr)
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蒋志亮
嵇凤丽
盖人荣
玄明花
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京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US14/905,504 priority Critical patent/US10205120B2/en
Publication of WO2016112597A1 publication Critical patent/WO2016112597A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • At least one embodiment of the present invention is directed to a packaging method, a display panel, and a display device.
  • OLED organic light emitting diode
  • conventional OLED devices especially the low work function electrodes and organic functional layers located therein, are prone to performance degradation due to oxygen and moisture in the surrounding environment entering the OLED display, which seriously affects the service life of the OLED.
  • the packaging technology of the OLED device becomes a key process for improving the lifetime of the OLED display device, and research and development of effective packaging technology is Blocking water vapor and oxygen has become an urgent task.
  • Embodiments of the present invention provide a packaging method, a display panel, and a display device to improve the sealing effect of the package.
  • At least one embodiment of the present invention provides a packaging method, the method comprising: forming a frit layer on a package region of a first substrate; forming a glass network outer body oxide layer on a surface of the glass frit layer; The glass frit layer and the glass network outer body oxide layer are subjected to first sintering; and the first substrate and the second substrate are aligned to each other, and the package region is formed by laser irradiation to form a package structure.
  • At least one embodiment of the present invention also provides a display panel including a first substrate, a second substrate, and a package structure located in the package region to seal the first substrate and the second substrate.
  • the package structure includes a package glass layer between the first substrate and the second substrate and a glass network outer oxide layer between the package glass layer and the second substrate.
  • At least one embodiment of the present invention also provides a display device including the above display panel.
  • 1 is an enlarged schematic view showing the surface morphology of the glass frit after high-temperature sintering in the packaging process
  • FIG. 2a is a flowchart of a packaging method according to an embodiment of the present invention.
  • 2b is a flow chart of forming a frit layer in a package area of a package cover according to an embodiment of the present invention
  • FIG. 3 is a schematic view showing the formation of a glass network outer oxide layer on the surface of a glass frit according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present invention.
  • a frit is usually used to complete the package between the package cover and the array substrate.
  • the inventors of the present application have noticed that, in the specific packaging process, when the glass frit formed on the package cover is subjected to high-temperature sintering, as shown in FIG. 1, the surface of the glass frit is usually uneven. This causes the surface of the frit to be elastically displaced during subsequent laser irradiation, thereby causing many holes in the OLED device near the surface of the frit, thereby reducing the sealing effect.
  • the packaging method includes: step S21: forming a frit layer on a package region of a first substrate; and step S22: forming a surface of the frit layer a glass network outer body oxide layer; step S23: performing first sintering on the glass frit layer and the glass network outer body oxide layer; and step S24: aligning the first substrate and the second substrate And irradiating the package area with a laser to form a package structure.
  • the encapsulation method provided by the embodiment of the invention can improve the fluidity of the surface of the glass frit layer by forming a glass network outer body oxide on the surface of the glass frit layer, and the glass frit layer is subjected to high temperature sintering.
  • the surface is flattened to reduce the occurrence of voids on the surface of the frit layer during laser encapsulation and to improve the encapsulation effect.
  • the first substrate can be a package cover (which can be a glass substrate) or an array substrate (TFT substrate).
  • the second substrate is an array substrate, and when the first substrate is an array substrate, the second substrate is a package cover.
  • the above-described encapsulation method may include steps S31 to S34, which are described one by one below.
  • Step S31 forming a frit layer on the package area of the package cover. As shown in FIG. 2b, the step may include the following steps S311 to S313, for example.
  • Step S311 Dispersing the glass frit in a carrier (which may be an organic solvent) to form a glass paste.
  • a carrier which may be an organic solvent
  • the composition of the glass frit may be a V 2 O 5 -P 2 O 5 system, which mainly includes: V 2 O 5 , P 2 O 5 , ZnO, Fe 2 O 3 , TiO 2 , and the like.
  • the glass frit may also be doped with a non-conductive high-temperature ceramic powder, thereby reducing the overall fluidity of the glass frit layer during melting, so that the thickness reduction of the glass frit strip before and after laser encapsulation is reduced, thereby enhancing the subsequent OLED device. Sealing performance.
  • a small amount of glass network exosome oxide may be incorporated into the glass frit.
  • the glass network exosome oxide is a good flux of glass.
  • the viscosity of the glass in the liquid can be reduced, the fluidity in the liquid can be increased, the crystallization property can be improved, and the glass can be easily melted;
  • it can also increase the thermal expansion coefficient of the glass and reduce the thermal stability, chemical stability and mechanical strength of the glass, in order to avoid adverse effects on the chemical and physical properties of the glass frit and avoid the whole of the glass frit during melting
  • the high fluidity causes the thickness of the glass frit before and after laser encapsulation to decrease significantly, thereby reducing the sealing effect, and the content in the frit should not be too high, for example, 1% to 3%.
  • Step S312 forming the glass paste on a package area of the package cover.
  • the package cover can be first cleaned, then blown dry, and the glass paste can be transferred to the package cover by screen printing.
  • Step S313 performing second sintering on the glass glue.
  • the second sintering temperature may be 120 ° C - 150 ° C, for example, may be 125 ° C, 130 ° C, 135 ° C, etc., by the second sintering, the organic solvent in the glass paste can be evaporated, thereby encapsulating the cover plate A frit is formed on the package area.
  • Step S32 forming a glass network outer body oxide layer on the surface of the glass frit.
  • the material of the outer layer oxide layer of the glass network may be at least one of Na 2 O and K 2 O.
  • the above material may be formed on the surface of the glass frit by vapor deposition or sputtering to obtain the outer layer oxide layer of the glass network.
  • a glass mesh outer oxide material 100 may be formed on the package cover 300 through a mask 200.
  • the glass network outer body oxide layer has a thickness of 0.5 nm to 10 nm, and may be, for example, 1 nm, 3 nm, 5 nm, 8 nm, or the like.
  • Step S33 performing first sintering on the glass frit and the outer layer oxide layer of the glass network.
  • the first sintering temperature may range from 350 °C to 550 °C, such as 380 °C, 450 °C, 500 °C, and the like.
  • the package cover can be sintered at a high temperature in an environment of the above temperature to melt the glass frit and the glass network outer oxide layer, thereby enhancing the connectivity of the two.
  • Step S34 aligning the package cover plate and the array substrate, and irradiating the package material with a laser to melt and sinter the glass frit to form a package structure.
  • the encapsulation method provided by the embodiment of the present invention firstly reduces the overall fluidity of the glass frit layer during melting by incorporating only a small amount of the glass network exosome oxide in the glass frit and incorporating the non-conductive high-temperature ceramic powder.
  • the thickness reduction of the glass frit strip is reduced before and after the encapsulation, and then a layer of the glass network outer oxide layer is added to the surface of the frit layer when the frit layer is formed, thereby avoiding the increase of the fluidity of the glass frit layer as much as possible.
  • the surface fluidity the surface of the glass frit layer is flattened after high-temperature sintering, and the surface of the glass frit layer is reduced during the laser encapsulation to improve the encapsulation effect.
  • FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present invention
  • the display panel includes a first substrate 1, a second substrate 2, and a package area to be used to connect the first substrate 1 and the a package structure 3 sealed by the second substrate 2, the package structure comprising a package glass layer 31 between the first substrate 1 and the second substrate 2, and the package glass layer 31 and the second substrate 2 An outer glass oxide layer 32 between the layers.
  • the display panel provided by the above embodiments of the present invention may be an OLED display panel, and may further include an OLED device between the first substrate and the second substrate.
  • the first substrate may be a package cover or an array substrate, which is not limited herein.
  • the second substrate is an array substrate.
  • the second substrate is a package cover.
  • the material of the above-mentioned glass network outer body oxide layer is one or more of the following: Na 2 O, K 2 O.
  • an embodiment of the present invention further provides a display device including the above display panel.
  • the display device provided by the embodiment of the present invention may be any product or component having a display function, such as a notebook computer display screen, a liquid crystal display, an OLED display, a liquid crystal television, a digital photo frame, a mobile phone, a tablet computer, and the like.

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  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种封装方法、显示面板及显示装置，该封装方法包括：在第一基板（1）的封装区域上形成玻璃料层（31）；在所述玻璃料层的表面形成玻璃网络外体氧化物层（32）；对所述玻璃料层（31）和所述玻璃网络外体氧化物层（32）进行第一烧结；将所述第一基板（1）与所述第二基板（2）对位贴合，并采用激光照射所述封装区域形成封装结构（3）。该方法可以改善玻璃料表面的流动性，使玻璃料经过高温烧结后表面平坦化，从而在进行激光封装时减少玻璃料表面孔洞的产生，提高封装效果。

Description

封装方法、显示面板及显示装置 技术领域
本发明的至少一个实施例涉及一种封装方法、显示面板及显示装置。
背景技术
近年来，有机发光二极管(OLED)显示器作为一种新兴的平板显示器，被广泛关注。然而传统的OLED器件，特别是位于其中的低功函电极和有机功能层，很容易因周围环境中的氧气和湿气进入OLED显示器中而性能劣化，这严重影响OLED的使用寿命。如果将OLED器件密封于无水无氧的环境中，那么该显示器的寿命可以得到显著延长，因此，OLED器件的封装技术成为提高OLED显示器件寿命的关键制程，而研究和开发有效的封装技术来阻隔水汽和氧气成为亟待解决的任务。
发明内容
本发明实施例提供一种封装方法、显示面板及显示装置，以提高封装的密封效果。
本发明的至少一个实施例提供了一种封装方法，该方法包括：在第一基板的封装区域上形成玻璃料层；在所述玻璃料层的表面形成玻璃网络外体氧化物层；对所述玻璃料层和所述玻璃网络外体氧化物层进行第一烧结；以及将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域形成封装结构。
本发明的至少一个实施例还提供了一种显示面板，其包括第一基板、第二基板以及位于封装区域以将所述第一基板与所述第二基板密封的封装结构。所述封装结构包括位于所述第一基板与第二基板之间的封装玻璃层以及位于所述封装玻璃层与所述第二基板之间的玻璃网络外体氧化物层。
本发明的至少一个实施例还提供了一种显示装置，其包括上述显示面板。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1是封装过程中高温烧结后玻璃料表面的形貌放大示意图；
图2a是本发明实施例提供的一种封装方法的流程图；
图2b是本发明实施例提供的一种在封装盖板的封装区域形成玻璃料层的流程图；
图3是本发明实施例提供的在玻璃料的表面形成玻璃网络外体氧化物层的示意图；
图4是本发明实施例提供的一种显示面板的示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
目前，在传统的盖板封装中，通常采用玻璃料完成封装盖板与阵列基板之间的封装。然而，在研究中，本申请的发明人注意到，在具体的封装过程中，当对封装盖板上形成的玻璃料进行高温烧结后，如图1所示，玻璃料的表面通常会凹凸不平，这使得在进行后续的激光照射时，玻璃料的表面产生弹性位移，进而使OLED器件中靠近玻璃料表面一侧出现很多孔洞，从而降低密封效果。
图2a是本发明实施例提供的一种封装方法的流程图，该封装方法包括：步骤S21：在第一基板的封装区域上形成玻璃料层；步骤S22：在所述玻璃料层的表面形成玻璃网络外体氧化物层；步骤S23：对所述玻璃料层和所述玻璃网络外体氧化物层进行第一烧结；以及步骤S24：将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域形成封装结构。
本发明实施例提供的封装方法，通过在玻璃料层的表面形成玻璃网络外体氧化物，可以改善玻璃料层表面的流动性，使玻璃料层经过高温烧结后表 面平坦化，从而在进行激光封装时减少玻璃料层表面孔洞的产生，提高封装效果。
本发明实施例提供的上述的封装方法可以适用于OLED显示面板的封装，且在上述的封装方法中，第一基板可以为封装盖板(可以为玻璃基板)，也可以为阵列基板(TFT基板)，在此不作具体限定，然而，当第一基板为封装盖板时，第二基板为阵列基板，当第一基板为阵列基板时，第二基板为封装盖板。
例如，当玻璃料层形成在封装盖板时，上述的封装方法可以包括步骤S31～步骤S34，下面逐一介绍这些步骤。
步骤S31：在封装盖板的封装区域上形成玻璃料层。如图2b所示，该步骤例如可包括以下步骤S311～步骤S313。
步骤S311：将玻璃料分散于载体(可以为有机溶剂)中形成玻璃胶。例如，该玻璃料的成分可以为V2O5-P2O5体系，其主要包括有：V2O5，P2O5，ZnO，Fe2O3，TiO2等。此外，例如，该玻璃料还可以掺入不导电高温陶瓷粉末，从而降低玻璃料层在融化时整体的流动性，使得激光封装前后玻璃料条带的厚度降低幅度减少，进而增强后续OLED器件的密封性能。此外，例如，该玻璃料中也可掺入少量的玻璃网络外体氧化物。玻璃网络外体氧化物是玻璃良好的助熔剂，通过将其掺入玻璃料中，能够降低玻璃在液体时的粘度，并增加液体时的流动性，改善析晶性能，使玻璃易于熔融；然而，由于其还能提高玻璃的热膨胀系数，降低玻璃的热稳定性、化学稳定性和机械强度，因此，为避免对玻璃料整体的化学及物理性能造成不良影响并且避免玻璃料层在融化时整体的流动性过高造成激光封装前后玻璃料条带的厚度降幅明显从而降低密封效果，其在玻璃料中的含量不宜过高，例如可以为1％～3％。
步骤S312：将所述玻璃胶形成在封装盖板的封装区域上。例如，可首先对封装盖板进行清洗，而后吹干，并通过丝网印刷将玻璃胶转印至封装盖板上。
步骤S313：对所述玻璃胶进行第二烧结。例如，该第二烧结的温度可以为120℃-150℃，例如可以为125℃、130℃、135℃等，通过该第二烧结可将玻璃胶中的有机溶剂蒸发，从而在封装盖板的封装区域上形成玻璃料。
步骤S32：在所述玻璃料的表面形成玻璃网络外体氧化物层。
例如，该玻璃网络外体氧化物层的材料可以为Na2O和K2O中的至少一种。例如，可以采用蒸镀或者溅射的方式将上述材料形成在玻璃料的表面得到所述玻璃网络外体氧化物层。例如，如图3所示，玻璃网络外体氧化物材料100可通过掩膜版200形成在封装盖板300上。例如，所述玻璃网络外体氧化物层的厚度为0.5nm～10nm，例如可以为1nm、3nm、5nm、8nm等。
步骤S33：对所述玻璃料和所述玻璃网络外体氧化物层进行第一烧结。在至少一个示例中，该第一烧结的温度可以为350℃-550℃，例如可以为380℃、450℃、500℃等。例如，可以将封装盖板置于上述温度的环境中高温烧结，从而将玻璃料和玻璃网络外体氧化物层熔融，进而增强两者的连接性。
步骤S34：将上述的封装盖板与阵列基板对位贴合，并采用激光照射封装区域将玻璃料熔融烧结从而形成封装结构。
本发明实施例提供的封装方法，首先通过在玻璃料中仅掺入少量的玻璃网络外体氧化物并掺入不导电高温陶瓷粉末，从而降低玻璃料层在融化时整体的流动性，使得激光封装前后玻璃料条带的厚度降低幅度减少，而后当玻璃料层形成在封装盖板时再在其表面增加一层玻璃网络外体氧化物层，从而在尽量避免增加玻璃料层整体的流动性的情况下实现其表面流动性的提高，进而使玻璃料层经过高温烧结后表面平坦化，在进行激光封装时减少玻璃料层表面孔洞的产生，提高封装效果。
此外，参见图4，图4是本发明实施例提供的一种显示面板的示意图，该显示面板包括第一基板1、第二基板2以及位于封装区域以将所述第一基板1与所述第二基板2密封的封装结构3，所述封装结构包括位于所述第一基板1与第二基板2之间的封装玻璃层31以及位于所述封装玻璃层31与所述第二基板2之间的玻璃网络外体氧化物层32。
本发明上述实施例提供的显示面板可以为OLED显示面板，此时其还可以包括位于第一基板和第二基板之间的OLED器件。且在上述的显示面板中，第一基板可以为封装盖板，也可以为阵列基板，在此不作具体限定，然而，当第一基板为封装盖板时，第二基板为阵列基板，当第一基板为阵列基板时，第二基板为封装盖板。
例如，上述的玻璃网络外体氧化物层的材料为以下的一种或多种：Na2O、K2O。
此外，本发明实施例还提供了一种显示装置，其包括上述的显示面板。本发明实施例提供的显示装置可以是笔记本电脑显示屏、液晶显示器、OLED显示器、液晶电视、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年1月13日递交的中国专利申请第201510016717.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (11)

  1. 一种封装方法，包括：
    在第一基板的封装区域上形成玻璃料层；
    在所述玻璃料层的表面形成玻璃网络外体氧化物层；
    对所述玻璃料层和所述玻璃网络外体氧化物层进行第一烧结；以及
    将所述第一基板与第二基板对位贴合，并采用激光照射所述封装区域形成封装结构。
  2. 根据权利要求1所述的封装方法，其中，在第一基板的封装区域上形成玻璃料层包括：
    将玻璃料分散于载体中形成玻璃胶；
    将所述玻璃胶形成在所述第一基板的封装区域上；以及
    对所述玻璃胶进行第二烧结。
  3. 根据权利要求2所述的封装方法，其中，所述第二烧结的温度为120℃-150℃。
  4. 根据权利要求1-3任一项所述的封装方法，其中，所述玻璃网络外体氧化物层的材料为以下的一种或多种：Na2O、K2O。
  5. 根据权利要求4所述的封装方法，其中，所述玻璃网络外体氧化物层的材料以蒸镀或者溅射的方式形成在所述玻璃料层的表面得到所述玻璃网络外体氧化物层。
  6. 根据权利要求1-5任一项所述的封装方法，其中，所述第一烧结的温度为350℃-550℃。
  7. 根据权利要求1-6任一所述的封装方法，其中，所述玻璃网络外体氧化物层的厚度为0.5nm～10nm。
  8. 一种显示面板，包括第一基板、第二基板以及位于封装区域以将所述第一基板与所述第二基板密封的封装结构，其中，所述封装结构包括位于所述第一基板与第二基板之间的封装玻璃层以及位于所述封装玻璃层与所述第二基板之间的玻璃网络外体氧化物层。
  9. 根据权利要求8所述的显示面板，其中，所述玻璃网络外体氧化物层的材料为以下的一种或多种：Na2O、K2O。
  10. 根据权利要求8或9所述的显示面板，其中，所述玻璃网络外体氧化物层的厚度为0.5nm～10nm。
  11. 一种显示装置，包括如权利要求8-10任一所述的显示面板。
PCT/CN2015/077286 2015-01-13 2015-04-23 封装方法、显示面板及显示装置 WO2016112597A1 (zh)

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CN105655273B (zh) * 2016-03-18 2019-03-12 京东方科技集团股份有限公司 一种封装方法和一种封装装置
CN106056099A (zh) * 2016-06-23 2016-10-26 京东方科技集团股份有限公司 一种指纹识别显示面板及显示装置
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