WO2017117931A1 - Oled显示面板的封装方法、oled显示面板及oled显示装置 - Google Patents

Oled显示面板的封装方法、oled显示面板及oled显示装置 Download PDF

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WO2017117931A1
WO2017117931A1 PCT/CN2016/087891 CN2016087891W WO2017117931A1 WO 2017117931 A1 WO2017117931 A1 WO 2017117931A1 CN 2016087891 W CN2016087891 W CN 2016087891W WO 2017117931 A1 WO2017117931 A1 WO 2017117931A1
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Prior art keywords
cover layer
substrate
cover
oled display
display panel
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PCT/CN2016/087891
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English (en)
French (fr)
Inventor
王利娜
王子峰
张亮
李兵
王选生
肖昂
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US15/325,992 priority Critical patent/US10205132B2/en
Publication of WO2017117931A1 publication Critical patent/WO2017117931A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technology, and in particular to the field of OLEDs. More specifically, the present disclosure relates to a method of fabricating an OLED display panel, an OLED display panel, and an OLED display device.
  • OLED display devices Compared with other types of display devices (for example, liquid crystal display units), OLED display devices have been widely studied and applied as a next-generation display due to their advantages such as thinness, low power consumption, high contrast, and high color gamut. Another advantage of OLED display devices over liquid crystal display devices is that they do not require backlighting.
  • OLED display devices are their sensitivity to air and humidity. Most organic substances in the OLED luminescent layer are very sensitive to atmospheric pollutants, O 2 and water vapor, which directly cause the organic luminescent material to deteriorate, reduce luminous efficiency, emit light abnormally or fail to emit light, and cause oxidation of the metal electrode. And corrosion, so packaging technology directly affects the stability and longevity of OLED display devices.
  • the OLED display device package often adopts a cover plate on the surface of the back plate, and the adhesion between the back plate and the cover plate is usually made of resin, glass glue, etc., but the packaging effect is not satisfactory.
  • a first aspect of the present disclosure provides a packaging method of an OLED display panel, comprising: providing a substrate and a cap plate, forming a cap layer on the substrate, wherein the cap layer has a concave structure.
  • forming the cover layer on the substrate comprises: forming a cover layer patterned on the substrate as a frame structure; removing a central portion of the frame of the frame structure to form the concave structure .
  • forming the cover layer on the substrate comprises: forming a first cover layer patterned into a frame-like structure; and providing a second cover layer on an edge portion of the first cover layer, such that the first A cover layer and the second cover layer form the concave structure.
  • the packaging method of the OLED display panel further comprises forming a further cover layer on the cover plate, the further cover layer having a convex structure.
  • forming the further cover layer on the cover plate comprises: forming a further cover layer patterned on the cover plate as a frame structure; removing an edge portion of the frame of the frame structure, To form the convex structure.
  • forming the further cover layer on the cover plate comprises: forming a third cover layer patterned on the cover plate as a frame-like structure; and providing a fourth portion on a central portion of the third cover layer The cover layer is such that the third cover layer and the fourth cover layer form the convex structure.
  • the packaging method of the OLED display panel further includes forming the cover layer or the further cover layer by using a mask having a hollow portion, wherein the cover layer is deposited at the hollow portion or The further cover layer.
  • the packaging method of the OLED display panel further includes forming an adhesive on the cover plate, wherein a recess of the concave structure corresponds to a position and a size of the adhesive, such that the After the substrate and the cover are joined, the adhesive is contained in the recess.
  • the adhesive comprises a glass glue.
  • the packaging method of the OLED display panel further includes: forming an adhesive on the cover plate, wherein the recess of the concave structure corresponds to a position and a size of the adhesive, such that the substrate is to be After bonding with the cover, the adhesive is contained in the recess.
  • the method of manufacturing the OLED display panel further includes: wherein the recess of the concave structure corresponds to a position and a size of the protrusion of the convex structure, such that the substrate and the cover plate are bonded Thereafter, the projection is received in the recess.
  • the cover layer is formed from a low melting material.
  • the substrate is an array substrate
  • the substrate and the cover plate are formed of glass
  • the cover layer is an oxide containing silicon
  • the method further comprises: disposing an organic luminescent material on the cover layer Engaging the substrate with the cover sheet; performing sintering; cutting the bonded substrate and cover sheet into a panel; providing a curable auxiliary adhesive around the joint position of the panel; forming an auxiliary adhesive layer by curing .
  • Another object of the present disclosure is to provide an OLED display panel.
  • a second aspect of the present disclosure provides an OLED display panel having a substrate, a cover layer formed on the substrate, and a cover plate, the cover layer having a concave structure.
  • the OLED display panel further includes a further cover layer between the cover plate and the cover layer, wherein the further cover layer has a convex structure, and the convex structure is convex It is accommodated in the recess of the concave structure.
  • the OLED display panel further includes an adhesive between the cover and the cover layer, wherein the adhesive is received in the recess of the concave structure.
  • the substrate and the cover plate are formed of glass, and the cover layer is formed of an oxide containing silicon.
  • a third aspect of the present disclosure provides an OLED display device, wherein the system includes the OLED display panel described above.
  • FIG. 1 is a schematic view showing a substrate after depositing a cap layer in accordance with one embodiment of the present disclosure
  • FIG. 2 is a schematic view showing a structure after performing a first etching according to an embodiment of the present disclosure
  • FIG. 3 is a schematic view showing a structure after performing a second etching according to an embodiment of the present disclosure
  • FIG. 4 is a schematic view showing engagement of a substrate and a cover plate in accordance with one embodiment of the present disclosure
  • FIG. 5 is a schematic view showing a partial shape of a mask and an oxide layer structure according to another embodiment of the present disclosure
  • FIG. 6 is a schematic view showing engagement of a substrate and a cover plate in accordance with another embodiment of the present disclosure
  • FIG. 7 is a schematic view showing engagement of a substrate and a cover plate in accordance with still another embodiment of the present disclosure.
  • the terms “upper”, “lower”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom” and The derivative should refer to the public text.
  • the terms “overlay”, “on top of”, “positioned on” or “positioned on top of” mean that a first element, such as a first structure, exists in a second element, such as a second structure. Above, wherein an intermediate element such as an interface structure may exist between the first element and the second element.
  • the term “contacting” means connecting a first element such as a first structure and a second element such as a second structure, with or without other elements at the interface of the two elements.
  • FIG. 1 illustrates a substrate after depositing a cap layer in accordance with an embodiment of the present disclosure.
  • the cover plate is similarly treated, and the obtained cover plate after depositing the cover layer is similar to the structure of the substrate after depositing the cover layer, so that the schematic diagram is not separately drawn.
  • a cover layer is formed on the surfaces of the substrate and the cover plate before the organic light-emitting material is disposed.
  • the substrate and the cover plate may be of any material commonly used in the art, such as glass.
  • the substrate can be an array substrate and it contains at least one panel.
  • an array substrate will be exemplified as an example.
  • the thermal expansion coefficient and adhesion of the film can be controlled by adjusting the composition and proportion of the cover layer.
  • the cover layer may be formed of a low melting point material in consideration of sintering.
  • the cover layer may be composed of an amorphous material in consideration of the material of the substrate.
  • the cover layer is an oxide layer, e.g., silicon oxide containing SiO x, SiO x or plus other metal oxides and non-metal oxides.
  • the cover layer is an oxide layer, which is merely exemplary, and any other material suitable for the cover layer may be provided, and is not limited to only oxides.
  • the oxide layer as the cap layer may be deposited by a vapor deposition method such as physical vapor deposition or chemical vapor deposition, or may be deposited by other processes known in the art.
  • FIG. 2 and 3 are subsequent processing of the structure of FIG. 1 to respectively generate a concave structure Schematic representation of the cover of the cover layer and the cover of a further cover layer having a convex structure.
  • the substrate on which the cover layer is formed is processed, and a cover layer patterned into a frame structure is formed on the substrate.
  • the cover plate formed with the cover layer is similarly treated, and the resulting patterned cover plate is similar in structure to the patterned substrate, so that the schematic view is not separately drawn.
  • the substrate and the cap are separately etched for the first time.
  • a pattern as shown in FIG. 2 may be formed at the substrate by applying photolithography (PR) glue, mask exposure, development, etching, lift-off, etc., and the pattern may be a rectangular pattern formed at the edge of the panel.
  • PR photolithography
  • the frame structure of the cover layer may be continuous or discontinuous frame shape, and the figure is not limited to the rectangle.
  • the central portion of the frame of the cover layer patterned into a frame shape is removed to form a cover layer having a concave structure; for the cover plate, the edge of the frame of the cover layer is patterned into a frame shape The portion is removed to form a further cover layer having a convex structure.
  • the substrate and the cap plate may be separately etched a second time.
  • a pattern as shown in FIG. 3 is formed at the panel by applying photolithography (PR) glue, mask exposure, development, etching, peeling, and the like.
  • PR photolithography
  • the central portion of the bezel of its frame-like cover layer is removed such that it forms a concave cover layer with depressions at the edge of the panel.
  • the edge portion of the bezel of the frame-like cover layer is removed such that it forms a convex cover layer with a projection at the edge of the panel.
  • the recess of the concave cover layer corresponds to the position and size of the projection of the convex cover layer such that the projection can be received and recessed after the substrate and the cover are joined.
  • the organic light-emitting material is plated to complete a subsequent process such as vapor deposition.
  • a subsequent process such as vapor deposition.
  • the substrate and the cover are joined, and then sintering is preferably performed.
  • the substrate and the cover are joined together, and then the cover layer may be sintered on the side of the cover by a laser.
  • the cover layer is melted at an instant high temperature, and as described above, the cover layer on the substrate and the cover plate can be engaged correspondingly, so that the cover layer on the substrate and the cover plate are bonded together, followed by cooling and solidification.
  • a curable auxiliary adhesive is disposed around the bonding position of the panel (ie, the position at which the cover plate is bonded to the substrate), for example, heat curing Or a photocurable auxiliary adhesive (for example, an ultraviolet adhesive) that forms an auxiliary adhesive layer by curing to enhance the protection of the inside of the display device.
  • FIG. 5 illustrates another embodiment in accordance with the present disclosure.
  • a first cover layer patterned into a frame-like structure is formed; and a second cover layer is disposed on an edge portion of the first cover layer such that the first cover layer and the second cover layer are concave structure.
  • a third cover layer patterned into a frame-like structure is formed on the cover plate; a fourth cover layer is disposed on a central portion of the third cover layer such that the third cover layer and the fourth cover layer are convex structure.
  • the cover layer may be composed of any material suitable for use as a cover layer, and the substrate may be an array substrate.
  • the cover layer is an oxide layer
  • the substrate is an array substrate
  • the substrate and the cover material are exemplified as glass.
  • both the substrate and the cover are glass plates.
  • the materials of the substrate and cover may be any material known to those skilled in the art and are not limited to glass. Also, the materials of the substrate and the cover may be the same or different.
  • different masks may be covered on the glass plates of the array substrate and the cover plate, respectively, by two vapor deposition (for example, physical vapor deposition) to obtain a substrate having a cover layer having a concave structure and A cover plate of a further covering layer having a convex structure.
  • two vapor deposition for example, physical vapor deposition
  • a deposition is first performed on the substrate and the cover plate with a mask.
  • a cover layer is deposited at the hollowed out portion. In the non-hollowed portion, the cover layer is not deposited due to the masking.
  • the deposition result is as shown in FIG. 5.
  • a first cover layer is formed on the substrate by one deposition, and the first cover layer has a frame-like structure similar to that of FIG. 2, and the frame structure may be continuous or discontinuous.
  • the shape of the frame the shape of the frame structure includes but is not limited to a rectangle.
  • a third cover layer is formed on the cover plate by one deposition, and the third cover layer has a frame-like structure similar to that of FIG. 2, and the frame structure may be a continuous or discontinuous frame shape, a frame structure Shapes include, but are not limited to, rectangles.
  • the substrate and the cover plate are separately deposited by using a mask. That is, the cover layer is again deposited on the substrate on which the first cover layer is deposited and the cover plate on which the third cover layer is deposited.
  • the shape of the second deposited mask is designed such that after the secondary deposition, a second cover layer can be deposited on the edge of the first cover layer, and the first cover layer and the second cover layer form a concave structure.
  • the shape of the secondary deposited mask is designed such that after the secondary deposition, A fourth cover layer can be deposited on a central portion of the third cover layer, and the third cover layer and the fourth cover layer form a convex structure.
  • the dotted frame portion of the top view ie, the color emphasis area
  • the recess of the concave structure corresponds to the position and size of the protrusion of the convex structure, so that the protrusion can be accommodated in the recess after the substrate and the cover are joined.
  • the organic light-emitting material is plated to complete a subsequent process such as vapor deposition.
  • a subsequent process such as vapor deposition.
  • FIG. 6 The substrate and the cover are joined and then sintered.
  • the substrate and the cover are joined together, and then the cover layer may be sintered on the side of the cover by a laser.
  • the cover layer is melted at an instant high temperature, and as described above, the cover layer on the substrate and the cover plate can be engaged correspondingly, so that the cover layer on the substrate and the cover plate are bonded together, followed by cooling and solidification.
  • a curable auxiliary adhesive such as a heat curable or photocurable auxiliary adhesive (eg, ultraviolet glue) is disposed around the bonding position of the panel (ie, the position where the cover is bonded to the substrate), and is formed by curing.
  • An adhesive layer that enhances the protection of the inside of the display device.
  • FIG. 7 illustrates yet another embodiment in accordance with the present disclosure.
  • a cover layer having a concave structure may be formed on the substrate in accordance with the method as shown in FIGS. 2-3 or 5.
  • the cover layer can be composed of any material suitable for use as a cover layer, including but not limited to an oxide layer.
  • the substrate can be an array substrate.
  • the substrate will be exemplified as an array substrate.
  • a cover layer having a concave structure is formed on the back sheet. Apply adhesive to the cover. Wherein the recess of the concave structure corresponds to the position and size of the adhesive such that after the substrate and the cover are joined, the adhesive can be received in the recess.
  • the binder can be any suitable material known to those skilled in the art including, but not limited to, glass glue.
  • the substrate and the cover are joined to each other for sintering.
  • the adhesive collects in the depressions of the concave structure on the substrate.
  • the laser can be sintered on the side of the cover plate.
  • the depression of the recessed structure may be insulative for the adhesive during the sintering process.
  • the projections or adhesives described herein can be accommodated in the depressions, including the projections.
  • the adhesive can be partially contained in the recess, also including protrusions or adhesives that can be completely received in the recess.
  • the size relationship of the protrusion or the adhesive and the recess can be determined according to actual needs.
  • the concave structure of the cover layer can reduce the air transmission space, so that the transmission of oxygen and water vapor is greatly reduced.
  • the toothed design increases the contact area of the bond location, making the bond stronger.
  • the cover layer is separately deposited onto the substrate and the cover by vapor deposition, overcoming the defects caused by the unevenness of the adhesive (for example, glass glue). And for the film layer formed by vapor deposition, the pattern can be better controlled by the mask. If the process required on the cover plate is reduced, the spatial limitation of the recess of the concave structure on the substrate can control the flow direction of the adhesive under pressure, so that the adhesive distribution is more uniform, and the depression has better heat preservation effect.
  • a relatively low laser energy can be used to provide a better sintering effect for the adhesive, reducing the stress of the laser sealing.

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Abstract

一种OLED显示面板的封装方法、OLED显示面板及OLED显示装置。其中，该OLED显示面板的封装方法包括：提供基板和盖板，在所述基板上形成覆盖层，其中，所述覆盖层具有凹状结构。所述方法进一步包括在所述盖板上形成具有凸状结构的又一覆盖层或者形成粘合剂，其中所述凸状结构的凸起或者所述粘合剂能够容纳于所述凹状结构的凹陷中。

Description

OLED显示面板的封装方法、OLED显示面板及OLED显示装置
相关申请的交叉引用
本申请要求于2016年01月04日递交的中国专利申请第201610003820.5号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开文本涉及显示技术领域，尤其涉及OLED领域。更具体地，本公开文本涉及一种OLED显示面板的制造方法、OLED显示面板及OLED显示装置。
背景技术
相比于其它类型的显示器件(例如，液晶显示单元)，OLED显示器件因其轻薄、低功耗、高对比度、高色域等优点，作为下一代显示器被广泛研究并得到初步应用。相比于液晶显示器件，OLED显示器件的另一个优势是，其不需要背光照明。
然而，OLED显示器件的一个缺点为其对空气和湿度的敏感性。OLED发光层的多数有机物质对于大气中的污染物、O2以及水汽都十分敏感，会直接造成有机发光材料发生变质，发光效率降低、发光异常或无法发光等问题，同时会引起金属电极的氧化和腐蚀，因此封装技术直接影响到OLED显示器件的稳定性和寿命。
目前OLED显示器件封装常采用背板表面加装盖板，背板与盖板之间的粘合通常使用树脂、玻璃胶等，但封装效果不理想。
发明内容
从而，本公开文本的一个目的在于提供一种OLED显示面板的封装方 法。
本公开文本的第一方面提供了一种OLED显示面板的封装方法，包括：提供基板和盖板，在所述基板上形成覆盖层，其中，所述覆盖层具有凹状结构。
可选地，在所述基板上形成所述覆盖层包括：在所述基板上形成被构图为框状结构的覆盖层；去除所述框状结构的边框的中心部分，以形成所述凹状结构。
可选地，在所述基板上形成所述覆盖层包括：形成被构图为框状结构的第一覆盖层；在所述第一覆盖层的边缘部分上设置第二覆盖层，使得所述第一覆盖层和所述第二覆盖层形成所述凹状结构。
可选地，所述OLED显示面板的封装方法还包括在所述盖板上形成又一覆盖层，所述又一覆盖层具有凸状结构。
可选地，在所述盖板上形成所述又一覆盖层包括：在所述盖板上形成被构图为框状结构的又一覆盖层；去除所述框状结构的边框的边缘部分，以形成所述凸状结构。
可选地，在所述盖板上形成所述又一覆盖层包括：在盖板上形成被构图为框状结构的第三覆盖层；在所述第三覆盖层的中心部分上设置第四覆盖层，使得所述第三覆盖层和所述第四覆盖层形成所述凸状结构。
可选地，所述OLED显示面板的封装方法还包括利用具有镂空部分的掩膜板来形成所述覆盖层或所述又一覆盖层，其中，在所述镂空部分处沉积所述覆盖层或所述又一覆盖层。
可选地，所述OLED显示面板的封装方法还包括在所述盖板上形成粘合剂，其中，所述凹状结构的凹陷与所述粘合剂的位置和尺寸相对应，使得将所述基板和所述盖板接合后，所述粘合剂容纳于所述凹陷中。
可选地，所述粘合剂包括玻璃胶。
可选地，所述OLED显示面板的封装方法还包括：在盖板上形成粘合剂，其中，所述凹状结构的凹陷与所述粘合剂的位置和尺寸相对应，使得将所述基板和所述盖板接合后，所述粘合剂容纳于所述凹陷中。
可选地，所述OLED显示面板的制造方法还包括，其中，所述凹状结构的凹陷与所述凸状结构的凸起的位置和尺寸相对应，使得将所述基板和所述盖板接合后，所述凸起容纳于所述凹陷中。
可选地，所述覆盖层由低熔点的材料来形成。
可选地，所述基板为阵列基板，所述基板和所述盖板由玻璃形成，所述覆盖层为含有硅的氧化物，所述方法进一步包括：在所述覆盖层上设置有机发光材料；将所述基板与所述盖板接合；进行烧结；将接合的所述基板和盖板切成面板；在面板的接合位置周围设置可固化的辅助粘合剂；通过固化形成辅助粘合层。
本公开文本的另一个目的在于提供一种OLED显示面板。
本公开文本的第二方面提供了一种OLED显示面板，所述OLED显示面板具有基板、形成在基板上的覆盖层和盖板，所述覆盖层具有凹状结构。
可选地，所述OLED显示面板还包括在所述盖板和所述覆盖层之间的又一覆盖层，其中，所述又一覆盖层具有凸状结构，并且所述凸状结构的凸起容纳于所述凹状结构的凹陷中。
可选地，所述OLED显示面板还包括在所述盖板和所述覆盖层之间的粘合剂，其中，所述粘合剂容纳于所述凹状结构的凹陷中。
可选地，所述基板和所述盖板由玻璃形成，所述覆盖层由含有硅的氧化物形成。
本公开文本的又一个目的在于提供一种OLED显示装置。
本公开文本的第三方面提供了一种OLED显示装置，其中，所述系统包含上述的OLED显示面板。
附图说明
为了更清楚地说明本公开文本的实施例的技术方案，下面将对实施例的附图进行简要说明，应当知道，以下描述的附图仅仅涉及本公开文本的一些实施例，而非对本公开文本的限制，其中：
图1为示出了根据本公开文本的一个实施例的沉积覆盖层后的基板的示意图；
图2为示出了根据本公开文本的一个实施例的进行第一次刻蚀后的结构的示意图；
图3为示出了根据本公开文本的一个实施例的进行第二次刻蚀后的结构的示意图；
图4为示出了根据本公开文本的一个实施例的基板和盖板的接合的示意图；
图5为示出了根据本公开文本的另一个实施例的掩膜板局部形状与氧化物层结构的示意图；
图6为示出了根据本公开文本的另一个实施例的基板和盖板的接合的示意图；
图7为示出了根据本公开文本的又一个实施例的基板和盖板的接合的示意图。
具体实施方式
为了使本公开文本的实施例的目的、技术方案和优点更加清楚，下面将接合附图，对本公开文本的实施例的技术方案进行清楚、完整的描述。显然，所描述的实施例是本公开文本的一部分实施例，而不是全部的实施例。基于所描述的本公开文本的实施例，本领域技术人员在无需创造性劳动的前提下所获得的所有其他实施例，也都属于本公开文本保护的范围。
当介绍本公开文本的元素及其实施例时，冠词“一”、“一个”、“该”和“所述”旨在表示存在一个或者多个要素。用语“包含”、“包括”、“含有”和“具有”旨在包括性的并且表示可以存在除所列要素之外的另外的要素。除非上下文中另外明确地指出，否则在本公开文本和所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。相似地，措辞“包含”和“包括”将解释为包含在内而不是独占性地。同样地，术语“包括”和“或”应当解释为包括在内的， 除非本文中明确禁止这样的解释。在本文中使用术语“实例”之处，特别是当其位于一组术语之后时，所述“实例”仅仅是示例性的和阐述性的，且不应当被认为是独占性的或广泛性的。
出于下文表面描述的目的，如其在附图中被标定方向那样，术语“上”、“下”、“左”、“右”“垂直”、“水平”、“顶”、“底”及其派生词应涉及公开文本。术语“上覆”、“在……顶上”、“定位在……上”或者“定位在……顶上”意味着诸如第一结构的第一要素存在于诸如第二结构的第二要素上，其中，在第一要素和第二要素之间可存在诸如界面结构的中间要素。术语“接触”意味着连接诸如第一结构的第一要素和诸如第二结构的第二要素，而在两个要素的界面处可以有或者没有其它要素。
图1示出了根据本公开文本的一个实施例的沉积覆盖层后的基板。对盖板也进行相类似处理，得到的沉积覆盖层后的盖板与沉积覆盖层后的基板的结构相类似，因此其示意图不再另行绘出。在图1所示的实施例中，在阵列工艺完成之后，在设置有机发光材料之前，在基板和盖板的表面上形成覆盖层。根据本公开文本的实施例，基板和盖板可以采用本领域通常使用的任何材料，例如，玻璃。基板可为阵列(array)基板，且其含有至少一个面板(panel)。下文中，将以阵列基板为例进行示例性说明。
通过调节覆盖层的组分和比例，可以控制薄膜的热膨胀系数和粘合能力。考虑到烧结，覆盖层可以由低熔点材料来形成。考虑到基板的材质，覆盖层可由非晶体材料组成。
可选地，覆盖层为氧化物层，例如，含有硅的氧化物SiOx，或者是SiOx加其它金属氧化物及非金属氧化物。其中，在基板为玻璃的情况下，采用含有硅的氧化物作为覆盖层可以得到良好的覆盖效果。需要指出，在本公开文本全文中，覆盖层为氧化物层仅为示例性的，可设置任何其它适合于做覆盖层的材料，而非仅限制于氧化物。其中，作为覆盖层的氧化物层可以通过诸如物理气相沉积或者化学气相沉积的气相沉积法来沉积，也可以通过本领域已知的其它工艺来沉积。
图2和图3为对图1的结构进行后续处理以分别生成具有凹状结构覆 盖层的基板和具有凸状结构的又一覆盖层的盖板的示意图。
如图2所示，对形成有覆盖层的基板进行处理，在基板上形成被构图为框状结构的覆盖层。对形成有覆盖层的盖板也进行相类似处理，得到的构图后的盖板与构图后的基板的结构相类似，因此其示意图不再另行绘出。
在一种实施方式中，具体地，可分别对基板和盖板进行第一次刻蚀。例如，依次通过施加光刻(PR)胶、掩膜曝光、显影、刻蚀、剥离等，在基板处形成如图2所示的图形，图形可为在面板边缘处形成的矩形图形。在盖板表面对应于基板的位置以相似方法得到相似图形。根据封装的需要，覆盖层的框状结构可为连续或者不连续的框状，图形也不限制于矩形。
如图3所示，对于基板，被构图为框状的覆盖层的边框的中心部分被去除，形成了具有凹状结构的覆盖层；对于盖板，被构图为框状的覆盖层的边框的边缘部分被去除，形成了具有凸状结构的又一覆盖层。
在一种实施方式中，具体地，可分别对基板和盖板进行第二次刻蚀。例如，依次通过施加光刻(PR)胶、掩膜曝光、显影、刻蚀、剥离等，在面板处形成如图3所示的图形。对于基板，将其框状覆盖层的边框的中心部分去除，使得其在面板边缘处形成具有凹陷的凹状覆盖层。对于盖板，将其框状覆盖层的边框的边缘部分去除，使得其在面板边缘处形成具有凸起的凸状覆盖层。并且，凹状覆盖层的凹陷与凸状覆盖层的凸起的位置和尺寸相对应，使得将基板和盖板接合后，凸起能够容纳与凹陷中。
然后，镀敷有机发光材料，完成蒸镀等后续工艺。为简便起见，不再冗述。
接着，如图4所示，将基板和盖板接合，然后优选地进行烧结。在一种实施方式中，具体地，将基板和盖板对合在一起，然后可利用激光在盖板一侧对覆盖层进行烧结处理。覆盖层在瞬间高温下融化，如前所述基板和盖板上的覆盖层能够对应啮合，从而基板和盖板上的覆盖层粘合在一起，随后进行冷却固化。
此后，将接合的基板和和盖板切成若干面板。在面板的接合位置(即，盖板与基板相接合的位置)周围设置可固化的辅助粘合剂，例如，热固化 或者光固化的辅助粘合剂(例如，紫外胶)，通过固化形成辅助粘合层，加强对显示器件内部的保护。
图5示出了根据本公开文本的另一个实施例。如图5所示，对于基板部分，形成被构图为框状结构的第一覆盖层；在第一覆盖层的边缘部分上设置第二覆盖层，使得第一覆盖层和第二覆盖层形成凹状结构。对于盖板部分，在盖板上形成被构图为框状结构的第三覆盖层；在第三覆盖层的中心部分上设置第四覆盖层，使得第三覆盖层和第四覆盖层形成凸状结构。
覆盖层可由任何适用于作覆盖层的材料组成，基板可为阵列基板。下文以覆盖层为氧化物层、基板为阵列基板、基板和盖板材料为玻璃进行示例性说明。需要注意，在本实施例中，作为示例，基板和盖板都为玻璃板。然而，基板和盖板的材料可为本领域技术人员所知的任何材料，而不限于玻璃。并且，基板和盖板的材料可相同，也可不同。
在一个实施方式中，具体地，可分别在阵列基板和盖板的玻璃板上覆盖不同掩膜，通过两次气相沉积(例如，物理气相沉积)分到得到具有凹状结构的覆盖层的基板和具有凸状结构的又一覆盖层的盖板。
如图5所示，先用掩膜板在基板和盖板上分别进行一次沉积。对于沉积，在镂空部分处沉积有覆盖层。在非镂空部分，由于有掩膜的阻挡，未沉积覆盖层。其沉积结果如图5所示，对于基板，通过一次沉积，在基板上形成第一层覆盖层，且第一覆盖层具有与图2类似的框状结构，该框架结构可为连续或者不连续的框状，框状结构的形状包括但不限于矩形。对于盖板，通过一次沉积，在盖板上形成第三层覆盖层，且第三覆盖层具有与图2类似的框状结构，该框架结构可为连续或者不连续的框状，框状结构的形状包括但不限于矩形。
然后，再利用掩膜板分别对基板和盖板进行二次沉积。即，在沉积有第一覆盖层的基板和沉积有第三覆盖层的盖板上再次沉积覆盖层。对于基板，设计二次沉积的掩膜的形状，以使得进行二次沉积之后，能在第一覆盖层的边缘上沉积第二覆盖层，并且第一覆盖层和第二覆盖层形成凹状结构。对于盖板，设计二次沉积的掩膜的形状，以使得进行二次沉积之后， 能在第三覆盖层的中心部分上沉积第四覆盖层，并且第三覆盖层和第四覆盖层形成凸状结构。
两次沉积后的效果如图5所示。在图5中，俯视图的虚线框部分(即，颜色加重区域)分别表示二次沉积后的第二覆盖层和第四覆盖层。其中，凹状结构的凹陷与凸状结构的凸起的位置和尺寸相对应，使得将基板和盖板接合后，凸起能够容纳与凹陷中。
然后，镀敷有机发光材料，完成蒸镀等后续工艺。接着，如图6所示。将基板和盖板接合，然后进行烧结。在一种实施方式中，具体地，将基板和盖板对合在一起，然后可利用激光在盖板一侧对覆盖层进行烧结处理。覆盖层在瞬间高温下融化，如前所述基板和盖板上的覆盖层能够对应啮合，从而基板和盖板上的覆盖层粘合在一起，随后进行冷却固化。
此后，将接合的基板和和盖板切成面板。在面板的接合位置(即，盖板与基板相接合的位置)周围设置可固化的辅助粘合剂，例如可热固化或者光固化的辅助粘合剂(例如，紫外胶)，通过固化形成辅助粘合层，加强对显示器件内部的保护。
图7示出了根据本公开文本的又一个实施例。在此实施例中，可按照如图2-3或者图5所示的方法，在基板上形成具有凹状结构的覆盖层。
覆盖层可由任何适用于作覆盖层的材料组成，包括但不限于氧化物层。基板可为阵列基板。下文以基板为阵列基板进行示例性说明。
在阵列工艺完成之后，在背板上形成具有凹状结构的覆盖层。在盖板上涂覆粘合剂。其中，凹状结构的凹陷与粘合剂的位置和尺寸相对应，使得将基板和盖板接合之后，粘合剂能够容纳于凹陷中。粘合剂可被本领域技术人员所知的任何合适的材料，其包括但不限制于玻璃胶。
然后，将基板和盖板接合，进行烧结。基板和盖板对合之后，粘合剂聚集在基板上的凹状结构的凹陷中。可利用激光在盖板一侧进行烧结处理。在烧结过程中，凹陷结构的凹陷可以为粘合剂保温。从而有效地提高烧结结果，对减少烧结能量和时间具有良好效果。
需要指出，本文所述的凸起或者粘合剂能够容纳于凹陷中，包括凸起 或者粘合剂能够部分地容纳于凹陷中，也包括凸起或者粘合剂能够完全地容纳于凹陷中。可根据实际需要，确定凸起或者粘合剂和凹陷的尺寸关系。
在本公开文本中，覆盖层的凹状结构可以减少空气的透过空间，使得氧气和水汽的透过大幅度减少。齿形设计增加了粘合位置的接触面积，使得粘合更加牢固。通过气相沉积将覆盖层分别沉积到基板和盖板上，克服了涂粘合剂(例如，玻璃胶)不均匀造成的缺陷。并且对于气相沉积形成的膜层，可以通过掩膜更好的控制图形。若减少需要在盖板上进行的工艺，基板上的凹状结构的凹陷的空间局限性可控制粘合剂在压力下的流向，使得粘合剂分布更均匀，而凹陷具有较好的保温效果，可以使用相对较低的激光能量使粘合剂有更好的烧结效果，降低激光密封(laser sealing)的应力。
已经描述了某特定实施例，这些实施例仅通过举例的方式展现，而且不旨在限制本公开文本的范围。事实上，本文所描述的新颖实施例可以以各种其它形式来实施；此外，可在不脱离本公开文本的精神下，做出以本文所描述的实施例的形式的各种省略、替代和改变。所附权利要求以及它们的等价物旨在覆盖落在本公开文本范围和精神内的此类形式或者修改。

Claims (15)

  1. 一种OLED显示面板的封装方法，包括：提供基板和盖板，在所述基板上形成覆盖层，其中，所述覆盖层具有凹状结构。
  2. 根据权利要求1所述的OLED显示面板的封装方法，其中，在所述基板上形成所述覆盖层包括：
    在所述基板上形成被构图为框状结构的覆盖层；
    去除所述框状结构的边框的中心部分，以形成所述凹状结构。
  3. 根据权利要求1所述的OLED显示面板的封装方法，其中，在所述基板上形成所述覆盖层包括：
    形成被构图为框状结构的第一覆盖层；
    在所述第一覆盖层的边缘部分上设置第二覆盖层，使得所述第一覆盖层和所述第二覆盖层形成所述凹状结构。
  4. 根据权利要求1到3中任一项所述的OLED显示面板的封装方法，还包括在盖板上形成又一覆盖层，其中，所述又一覆盖层具有凸状结构。
  5. 根据权利要求4所述的OLED显示面板的封装方法，其中，在所述盖板上形成所述又一覆盖层包括：
    在所述盖板上形成被构图为框状结构的所述又一覆盖层；
    去除所述框状结构的边框的边缘部分，以形成所述凸状结构。
  6. 根据权利要求4所述的OLED显示面板的封装方法，其中，在所述盖板上形成所述又一覆盖层包括：
    在所述盖板上形成被构图为框状结构的第三覆盖层；
    在所述第三覆盖层的中心部分上设置第四覆盖层，使得所述第三覆盖层和所述第四覆盖层形成所述凸状结构。
  7. 根据权利要求3或6所述的OLED显示面板的封装方法，进一步包括，利用具有镂空部分的掩膜板来形成所述覆盖层或所述又一覆盖层，其中，在所述镂空部分处沉积所述覆盖层或所述又一覆盖层。
  8. 根据权利要求1到3中任一项所述的OLED显示面板的封装方法，还包括在所述盖板上形成粘合剂，其中，所述凹状结构的凹陷与所述粘合 剂的位置和尺寸相对应，使得将所述基板和所述盖板接合后，所述粘合剂容纳于所述凹陷中。
  9. 根据权利要求4到6中任一项所述的OLED显示面板的封装方法，其中，所述凹状结构的凹陷与所述凸状结构的凸起的位置和尺寸相对应，使得将所述基板和所述盖板接合后，所述凸起容纳于所述凹陷中。
  10. 根据权利要求1到9中任一项所述的OLED显示面板的封装方法，其中，所述基板为阵列基板，所述基板和所述盖板由玻璃形成，所述覆盖层由含硅的氧化物形成，所述方法进一步包括：
    在所述覆盖层上设置有机发光材料；
    将所述基板与所述盖板接合；
    进行烧结；
    将接合的所述基板和盖板切成面板；
    在所述面板的接合位置周围设置可固化的辅助粘合剂；
    通过固化所述辅助粘合剂形成辅助粘合层。
  11. 一种OLED显示面板，所述OLED显示面板具有基板、形成在基板上的覆盖层以及盖板，其中，所述覆盖层具有凹状结构。
  12. 根据权利要求11所述的OLED显示面板，还包括在所述盖板和所述覆盖层之间的又一覆盖层，其中，所述又一覆盖层具有凸状结构，并且所述凸状结构的凸起容纳于所述凹状结构的凹陷中。
  13. 根据权利要求11所述的OLED显示面板，还包括在所述盖板和所述覆盖层之间的粘合剂，其中，所述粘合剂容纳于所述凹状结构的凹陷中。
  14. 根据权利要求11-13中任一项所述的OLED显示面板，其中，所述基板和所述盖板由玻璃形成，所述覆盖层由含有硅的氧化物形成。
  15. 一种OLED显示装置，其中，所述系统包含权利要求11-14中任一项所述的OLED显示面板。
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