WO2017028412A1 - 一种有机发光二极管器件及制作方法和显示装置 - Google Patents

一种有机发光二极管器件及制作方法和显示装置 Download PDF

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WO2017028412A1
WO2017028412A1 PCT/CN2015/097123 CN2015097123W WO2017028412A1 WO 2017028412 A1 WO2017028412 A1 WO 2017028412A1 CN 2015097123 W CN2015097123 W CN 2015097123W WO 2017028412 A1 WO2017028412 A1 WO 2017028412A1
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layer
emitting diode
organic light
light emitting
organic
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PCT/CN2015/097123
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English (en)
French (fr)
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李�瑞
徐德智
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京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Priority to EP15894512.1A priority Critical patent/EP3340330B1/en
Priority to US15/322,328 priority patent/US10181578B2/en
Publication of WO2017028412A1 publication Critical patent/WO2017028412A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present invention relate to an organic light emitting diode display device, a method of fabricating the same, and a display device.
  • OLED Organic Light-Emitting Diode
  • the cathode is usually made of a metal such as aluminum, magnesium or calcium.
  • the chemical properties are relatively active and easily react with the infiltrated water vapor and oxygen.
  • water vapor and oxygen also chemically react with the hole transport layer and the electron transport layer of the OLED device, and these reactions cause failure of the OLED device. Therefore, the effective packaging of the OLED device, so that the functional layers of the OLED device are sufficiently separated from the moisture, oxygen and other components in the atmosphere, can greatly extend the life of the OLED device, thereby prolonging the service life of the OLED display.
  • An object of the embodiments of the present invention is to provide an organic light emitting diode device, a manufacturing method thereof, and a display device, which can reduce damage of OLED devices by moisture and oxygen of air, and improve waterproof oxygen resistance of the OLED device.
  • An embodiment of the present invention provides an organic light emitting diode device, a manufacturing method thereof, and a display device, wherein the organic light emitting diode device includes: a first substrate, an organic light emitting diode disposed on the first substrate, and the organic light emitting diode disposed on the organic light emitting diode At least one encapsulation layer thereon, an adhesive layer disposed over the at least one encapsulation layer, and a second substrate disposed over the bonding layer At least one side surface of the encapsulation layer has a textured structure.
  • the concave-convex structure on the surface of the inorganic layer increases the surface area of the inorganic layer, thereby improving the performance of water-proof oxygen; the concave-convex structure on the surface of the organic layer increases the contact between the organic layer and the inorganic layer.
  • the area improves the bonding effect, because the organic layer itself has water absorption, and also improves the waterproof performance of the organic layer. Therefore, compared with the prior art, the solution can reduce the damage of the OLED device by reducing the moisture and oxygen of the air, and improve the waterproof oxygen resistance of the OLED device.
  • the organic light emitting diode device includes at least two encapsulation layers including alternating organic layers and inorganic layers.
  • the alternating design of the organic layer and the inorganic layer makes full use of the excellent performance of the inorganic layer of water-proof oxygen, wherein the organic layer has water absorption and can perform a good bonding between the OLED device and the inorganic layer.
  • the organic light emitting diode device includes two encapsulation layers including an organic layer over the organic light emitting diode and an inorganic layer over the organic layer, the organic layer
  • the upper surface has an uneven structure
  • both the upper surface and the lower surface of the inorganic layer have an uneven structure
  • the uneven structure of the upper surface of the organic layer is coupled with the uneven structure of the lower surface of the inorganic layer.
  • a layer of organic layer plus a layer of inorganic layer design can achieve a good waterproof effect.
  • Multi-layer stacking can meet the requirements of long-term use in harsh environments with high waterproofing, but multilayer stacking will have loss of transmittance.
  • the organic layer is in direct contact with the organic light emitting diode because the organic layer does not require an etching process and there is no risk of damaging the light emitting diode during fabrication.
  • the organic layer has a thickness of 1 to 2 microns and the inorganic layer has a thickness of 0.1 to 1 micron.
  • the too thin inorganic layer has the risk of etching through in the process of etching the uneven structure.
  • the excessively thick inorganic layer wastes the material, and the thickness of the inorganic layer needs to be adjusted according to the product requirements in the specific product design process.
  • the organic layer comprises a polyacrylate-based organic layer.
  • the inorganic layer comprises a silicon nitride inorganic layer or a silicon oxynitride inorganic layer.
  • the bonding layer is a thermosetting material bonding layer.
  • the thermosetting material bonding layer comprises a thermosetting phenolic resin bonding layer or a UV curable adhesive layer.
  • the polyacrylate-based organic layer is a negative polyacrylate-based material.
  • the thermosetting phenolic resin material can be gradually hardened by chemical reaction by heating, and is not heated again. Softening occurs; UV-curable glue can absorb ultraviolet energy under ultraviolet light to produce active radicals or cations, causing a series of chemical reactions in the bonding layer to finally cure.
  • the first substrate and/or the second substrate are flexible substrates.
  • the flexible substrate comprises a polybutylene terephthalate substrate or a polyethylene terephthalate substrate.
  • the substrate may be a flexible substrate applied to a flexible display device.
  • the material of the flexible substrate is not limited, and may include, for example, polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. At least one of the esters.
  • the substrate may also be a common hard substrate such as a glass substrate, a resin substrate or the like.
  • the relief structure comprises a square relief structure, a wave relief structure or a zigzag relief structure.
  • the concave-convex structure can increase the contact area between the encapsulating layers and between the encapsulating layer and the bonding layer, thereby improving the waterproof oxygen resistance and enhancing the bonding effect.
  • the embodiment of the invention further provides a method for fabricating an organic light emitting diode device, comprising:
  • the second substrate is bonded to the adhesive layer.
  • the surface of the encapsulation layer is provided with a concave-convex structure, and the concave-convex structure on the surface of the inorganic layer increases the surface area of the inorganic layer, thereby improving the performance of waterproofing oxygen; the uneven structure on the surface of the organic layer is increased.
  • the contact area between the organic layer and the inorganic layer improves the bonding effect, and the organic layer itself has water absorption property, and also improves the waterproof property of the organic layer. Therefore, compared with the prior art, the solution can reduce the damage of the OLED device by reducing the moisture and oxygen of the air, and improve the waterproof oxygen resistance of the OLED device.
  • the forming the at least one encapsulation layer over the organic light emitting diode comprises:
  • An uneven structure is formed on the upper surface of the encapsulation layer.
  • forming the concave-convex structure on the upper surface of the encapsulation layer specifically includes:
  • An uneven structure is formed on the upper surface of the inorganic layer by an etching process.
  • the alternating design of the organic layer and the inorganic layer makes full use of the excellent performance of the inorganic layer of water-proof oxygen, wherein the organic layer has water absorption and can perform a good bonding between the OLED device and the inorganic layer.
  • the embodiment of the invention further provides a display device comprising the organic light emitting diode device according to any of the preceding technical solutions. Since the waterproof oxygen resistance of the organic light emitting diode device is improved, the display device has better product quality.
  • FIG. 1 is a schematic view of an organic light emitting diode device according to an embodiment of the present invention.
  • FIG. 2 is a schematic flow chart of a method for fabricating an organic light emitting diode device according to an embodiment of the present invention
  • FIG. 3 is a schematic flow chart of a method for fabricating an uneven structure of an encapsulation layer of an organic light emitting diode device according to an embodiment of the invention.
  • an embodiment of the present invention provides an organic light emitting diode device, a manufacturing method thereof, and a display device.
  • the surface of the encapsulation layer is provided with a concave-convex structure, and the concave-convex structure on the surface of the inorganic layer increases the surface area of the inorganic layer, thereby improving the performance of water-proof oxygen; the uneven structure on the surface of the organic layer is increased.
  • the contact area between the organic layer and the inorganic layer improves the bonding effect, and the organic layer itself has water absorption, and also improves the organic The waterproof performance of the layer. Therefore, compared with the prior art, the solution can reduce the damage of the OLED device by reducing the moisture and oxygen of the air, and improve the waterproof oxygen resistance of the OLED device.
  • an embodiment of the present invention provides an organic light emitting diode device, including: a first substrate 1 , an organic light emitting diode 2 disposed on the first substrate 1 , and an encapsulation layer disposed on the organic light emitting diode 2 .
  • the adhesive layer 5 disposed on the encapsulation layer and the second substrate 6 above the adhesive layer 5 have at least one side surface of the encapsulation layer having a concave-convex structure.
  • the encapsulation layer includes two layers of an organic layer 3 and an inorganic layer 4 .
  • the encapsulating layer may include only an organic layer or an inorganic layer, or may be a plurality of layers in which the organic layer and the inorganic layer are alternately designed.
  • the alternating design of the organic layer and the inorganic layer makes full use of the excellent performance of the inorganic layer of water-proof oxygen, wherein the organic layer has water absorption and can perform a good bonding between the OLED device and the inorganic layer.
  • an encapsulation layer of an organic light emitting diode device includes an organic layer 3 over an organic light emitting diode and an inorganic layer 4 over the organic layer 3 .
  • the upper surface of the organic layer 3 has an uneven structure
  • the inorganic layer 4 Both the upper surface and the lower surface have an uneven structure, and the uneven structure of the upper surface of the organic layer is coupled with the uneven structure of the lower surface of the inorganic layer. Since the inorganic layer is directly formed on the organic layer, the lower surface of the inorganic layer forms a concave-convex structure coupled to the upper surface of the organic layer.
  • a layer of organic layer plus a layer of inorganic layer design can achieve a good waterproof effect.
  • Multi-layer stacking can meet the requirements of long-term use in harsh environments with high waterproofing, but multilayer stacking will have loss of transmittance.
  • the organic layer is in direct contact with the organic light emitting diode because the organic layer does not require an etching process and there is no risk of damaging the light emitting diode during fabrication.
  • the organic layer has a thickness of 1 to 2 micrometers, and the inorganic layer has a thickness of 0.1 to 1 micrometer.
  • An excessively thin organic layer or inorganic layer has the risk of etching through during etching of the textured structure. Excessive organic or inorganic layers waste material, and the thickness of the organic or inorganic layer is required in the specific product design process. Adjust according to product requirements.
  • the organic layer material is made of polyacrylate.
  • the organic layer material is a negative polyacrylate.
  • the inorganic layer may be silicon nitride or silicon oxynitride. quality.
  • the adhesive layer comprises a thermosetting material bonding layer
  • the thermosetting material bonding layer comprises a thermosetting phenolic resin bonding layer or a UV curing adhesive layer.
  • thermosetting phenolic resin material can be gradually hardened by chemical reaction by heating, and does not soften again after being heated; the UV curable adhesive can absorb ultraviolet energy under ultraviolet light irradiation to generate active radicals or cations, and a series of chemistry occurs in the bonding layer. The reaction is finally cured.
  • the first substrate and/or the second substrate may be a flexible substrate applied to a flexible display device.
  • the material of the flexible substrate is not limited, and may include, for example, polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. At least one of the esters.
  • the material of the flexible substrate is a polybutylene terephthalate substrate or a polyethylene terephthalate substrate.
  • the first substrate and the second substrate may also be a common hard substrate such as a glass substrate, a resin substrate, or the like. The material of the first substrate and the second substrate is not limited.
  • the first substrate may be a flexible substrate, and the second substrate is a rigid substrate; or in some embodiments, the first substrate is a rigid substrate.
  • the second substrate is a flexible substrate; or in some embodiments, the first substrate and the second substrate are both flexible substrates or rigid substrates.
  • the uneven structure on the encapsulation layer is a square concavo-convex structure, but the actual situation is not limited thereto, and the concavo-convex structure may be other shape structures such as a corrugated concavo-convex structure or a zigzag concavo-convex structure.
  • the concave-convex structure can increase the contact area between the encapsulating layers and between the encapsulating layer and the bonding layer, thereby improving the waterproof oxygen resistance and enhancing the bonding effect.
  • the embodiment of the invention further provides a method for fabricating an organic light emitting diode device, as shown in FIG. 2, comprising the following steps:
  • Step S101 forming an organic light emitting diode on the first substrate
  • Step S102 forming at least one encapsulation layer on the organic light emitting diode, and at least one side surface of the encapsulation layer has a concave-convex structure;
  • Step S103 forming an adhesive layer on at least one of the encapsulation layers
  • Step S104 bonding the second substrate to the adhesive layer.
  • an organic light emitting diode device as shown in FIG. 1 is prepared, and an organic film is formed on the organic light emitting diode to form an organic layer, and an uneven structure is formed on the organic layer, and then passes through the plasma.
  • the enhanced chemical vapor deposition method deposits a layer of inorganic substances on the surface of the organic layer, and forms a concave-convex structure on the upper surface of the inorganic layer, and finally coats the inorganic layer with a film of glue, and the film is fixed. After bonding, the first substrate and the second substrate are bonded.
  • forming at least one encapsulation layer over the organic light emitting diode comprises:
  • An uneven structure is formed on the upper surface of the encapsulation layer.
  • the organic light emitting diode device coated with the organic film obtains the desired concave and convex structure after entering the soft baking and exposure developing process; and forming the concave and convex structure on the surface of the inorganic layer needs to be first in the inorganic layer
  • the surface is coated with a photoresist and subjected to exposure and development, and the inorganic layer not covered by the photoresist is etched by a dry etching technique.
  • other patterning processes such as laser engraving may be employed to form the relief structure.
  • forming the relief structure on the upper surface of the encapsulation layer specifically includes the following steps (as shown in FIG. 3):
  • Step S105 forming an organic layer on the organic light emitting diode
  • Step S106 forming an uneven structure on the upper surface of the organic layer by an exposure and development process
  • Step S107 forming an inorganic layer on the surface of the organic layer
  • Step S108 forming an uneven structure on the upper surface of the inorganic layer by an etching process.
  • the surface of the encapsulation layer is provided with a concave-convex structure, and the concave-convex structure on the surface of the inorganic layer increases the surface area of the inorganic layer, thereby improving the performance of waterproofing oxygen; the uneven structure on the surface of the organic layer is increased.
  • the contact area between the organic layer and the inorganic layer improves the bonding effect, and the organic layer itself has water absorption property, and also improves the waterproof property of the organic layer. Therefore, compared with the prior art, the solution can reduce the damage of the OLED device by reducing the moisture and oxygen of the air, and improve the waterproof oxygen resistance of the OLED device.
  • the embodiment of the invention further provides a display device comprising the organic light emitting diode device of any of the foregoing technical solutions. Since the waterproof oxygen resistance of the organic light emitting diode device is improved, the display device has better product quality.
  • the type of the display device is not limited, and may be an ordinary flat panel display device or a flexible display device.
  • the specific types of display devices may be displays, electronic paper, tablets, televisions, smart display tags, smart display cards, and the like.

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Abstract

一种有机发光二极管显示器件及制作方法和显示装置。有机发光二极管显示器件包括：第一基板（1），设置在第一基板（1）上的有机发光二极管（2），设置在有机发光二极管（2）之上的至少一层封装层（3，4），设置在至少一层封装层（3，4）之上的粘接层（5），以及粘接层（5）上方的第二基板（6），封装层（3，4）的至少一侧表面具有凹凸结构。因此，可以减少空气的水汽和氧气对器件的损害，提高器件的防水氧性能。

Description

一种有机发光二极管器件及制作方法和显示装置 技术领域
本发明的实施例涉及一种有机发光二极管显示器件及制作方法和显示装置。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管，简称OLED)显示屏由于具有薄、轻、宽视角、主动发光、发光颜色连续可调、成本低、响应速度快、能耗小、驱动电压低、工作温度范围宽、生产工艺简单、发光效率高及可柔性显示等优点，已成为极具发展前景的下一代显示技术。
研究表明，空气中的水汽和氧气等成分对OLED显示屏中OLED器件的寿命影响很大，这是因为：OLED器件工作时需要从阴极注入电子，这就要求阴极功函数越低越好，但阴极通常采用铝、镁、钙等金属材质，化学性质比较活波，极易与渗透进来的水汽和氧气发生反应。另外，水汽和氧气还会与OLED器件的空穴传输层以及电子传输层发生化学反应，这些反应都会引起OLED器件的失效。因此对OLED器件进行有效的封装，使OLED器件的各功能层与大气中的水汽、氧气等成分充分隔开，就可以大大延长OLED器件的寿命，从而延长OLED显示屏的使用寿命。
如何提高OLED器件防水氧性能是目前亟待解决的技术问题。
发明内容
本发明实施例的目的是提出一种有机发光二极管器件及制作方法和显示装置，以减少空气的水汽和氧气对OLED器件的损害，提高OLED器件防水氧性能。
本发明实施例提供了一种有机发光二极管器件及制作方法和显示装置，其中有机发光二极管器件包括：第一基板，设置在所述第一基板上的有机发光二极管，设置在所述有机发光二极管之上的至少一层封装层，设置在所述至少一层封装层之上的粘接层，以及设置在所述粘接层上方的第二基板，所 述封装层的至少一侧表面具有凹凸结构。
通过在封装层的表面设计有凹凸结构，使得无机层表面的凹凸结构增大了无机层的表面积，进而提高了防水氧的性能；有机层表面的凹凸结构增大了有机层与无机层的接触面积，改善了粘结效果，由于有机层自身具有吸水性，同时也提高了有机层的防水性能。因此，相比现有技术，本方案能够以减少空气的水汽和氧气对OLED器件的损害，提高OLED器件防水氧性能。
在一些实施方式中，所述有机发光二极管器件包括至少两层封装层，所述至少两层封装层包括交替设置的有机层和无机层。
有机层和无机层的交替设计充分利用了无机层的防水氧的优良性能，其中的有机层具有吸水性，并且可以在OLED器件和无机层之间起到很好的粘接作用。
在一些实施方式中，所述有机发光二极管器件包括两层封装层，所述两层封装层包括位于有机发光二极管之上的有机层和位于所述有机层之上的无机层，所述有机层的上表面具有凹凸结构，所述无机层的上表面和下表面均具有凹凸结构，且所述有机层上表面的凹凸结构和所述无机层下表面的凹凸结构相耦合。
一层有机层加一层无机层的设计即可达到很好的防水效果，多层叠加可以满足恶劣潮湿环境中长期使用对防水要求比较高的情况，但是多层叠加会有透过率损失。有机层与有机发光二极管直接接触是因为有机层不需要刻蚀工艺，在制作过程中没有损伤发光二极管的风险。
在一些实施方式中，所述有机层厚度为1～2微米，所述无机层厚度为0.1～1微米。
过薄的无机层在刻蚀凹凸结构的过程中有刻蚀穿的风险，过厚的无机层会浪费材料，无机层的厚度在具体的产品设计过程中需要根据产品要求调整。
在一些实施方式中，所述有机层包括聚丙烯酸酯类有机层。
在一些实施方式中，所述无机层包括氮化硅无机层或氮氧化硅无机层。
在一些实施方式中，所述粘接层为热固性材料粘接层。在一些实施方式中，所述热固性材料粘接层包括热固性酚醛树脂粘接层或UV固化胶粘接层。
在一些实施方式中，聚丙烯酸酯类有机层为负性聚丙烯酸酯类材料。热固性酚醛树脂材料可通过加热发生化学反应而逐渐硬化成型，再次受热也不 发生软化；UV固化胶可以在紫外光照射下吸收紫外能量，产生活性自由基或阳离子，使粘接层发生一系列化学反应而最终固化。
在一些实施方式中，所述第一基板和/或第二基板为柔性基板。在一些实施方式中，所述柔性基板包括聚对苯二甲酸丁二醇酯基板或聚对苯二甲酸乙二醇酯基板。
基板可以为柔性基板，应用于柔性显示装置。柔性基板的材质不限，例如可以包括聚酰亚胺、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺、聚醚砜、聚对苯二甲酸乙二醇酯和聚萘二甲酸乙二醇酯中的至少一种。此外，基板也可以为常见的硬质基板，例如玻璃基板、树脂基板等等。
在一些实施方式中，所述凹凸结构包括方形凹凸结构，波浪形凹凸结构或锯齿形凹凸结构。
凹凸结构可以增加封装层之间、封装层与粘接层之间的接触面积，起到提高防水氧性能、增强粘接效果的作用。
本发明实施例还提供一种有机发光二极管器件的制作方法，包括：
在第一基板之上形成有机发光二极管；
在有机发光二极管之上形成至少一层封装层，所述封装层的至少一侧表面具有凹凸结构；
在所述至少一层封装层之上形成粘接层；
将所述第二基板与所述粘接层粘接。
在该方法实施例的技术方案中，在封装层的表面设计有凹凸结构，无机层表面的凹凸结构增大了无机层的表面积，进而提高了防水氧的性能；有机层表面的凹凸结构增大了有机层与无机层的接触面积，改善了粘结效果，由于有机层自身具有吸水性，同时也提高了有机层的防水性能。因此，相比现有技术，本方案能够以减少空气的水汽和氧气对OLED器件的损害，提高OLED器件防水氧性能。
在一些实施方式中，所述在有机发光二极管之上形成至少一层封装层包括：
在所述封装层的上表面形成凹凸结构。
在一些实施方式中，在所述封装层的上表面形成凹凸结构具体包括：
在有机发光二极管之上形成有机层；
通过曝光显影工艺在所述有机层的上表面形成凹凸结构；
在所述有机层表面形成无机层；
通过刻蚀工艺在所述无机层的上表面形成凹凸结构。
有机层和无机层的交替设计充分利用了无机层的防水氧的优良性能，其中的有机层具有吸水性，并且可以在OLED器件和无机层之间起到很好的粘接作用。
本发明实施例还提供了一种显示装置，包括前述任一技术方案所述的有机发光二极管器件。由于有机发光二极管器件防水氧性能得以提高，本显示装置具有较佳的产品品质。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例中有机发光二极管器件示意图；
图2为本发明实施例有机发光二极管器件制作方法流程示意图；
图3为本发明实施例中有机发光二极管器件的封装层凹凸结构制作方法流程示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
为了提高OLED器件防水氧性能，本发明实施例提供了一种有机发光二极管器件及制作方法和显示装置。在本发明实施例的技术方案中，在封装层的表面设计有凹凸结构，无机层表面的凹凸结构增大了无机层的表面积，进而提高了防水氧的性能；有机层表面的凹凸结构增大了有机层与无机层的接触面积，改善了粘结效果，由于有机层自身具有吸水性，同时也提高了有机 层的防水性能。因此，相比现有技术，本方案能够以减少空气的水汽和氧气对OLED器件的损害，提高OLED器件防水氧性能。
为使本发明的目的、技术方案和优点更加清楚，以下举实施例对本发明作进一步详细说明。
如图1所示，本发明实施例提供了一种有机发光二极管器件，包括：第一基板1，设置在第一基板1上的有机发光二极管2，设置在有机发光二极管2之上的封装层，设置在封装层之上的粘接层5，以及粘接层5上方的第二基板6，封装层的至少一侧表面具有凹凸结构。
如图1所示，在本发明实施例的技术方案中，封装层包括有机层3和无机层4两层。但在实际应用中，可以封装层可以仅包括有机层或无机层，也可以是有机层和无机层交替设计的多层。有机层和无机层的交替设计充分利用了无机层的防水氧的优良性能，其中的有机层具有吸水性，并且可以在OLED器件和无机层之间起到很好的粘接作用。
如图1所示，有机发光二极管器件的封装层包括位于有机发光二极管之上的有机层3和位于有机层3之上的无机层4，有机层3的上表面具有凹凸结构，无机层4的上表面和下表面均具有凹凸结构，且所述有机层上表面的凹凸结构和所述无机层下表面的凹凸结构相耦合。由于无机层直接形成在有机层上，所以无机层下表面会形成和有机层上表面相耦合的凹凸结构。
一层有机层加一层无机层的设计即可达到很好的防水效果，多层叠加可以满足恶劣潮湿环境中长期使用对防水要求比较高的情况，但是多层叠加会有透过率损失。有机层与有机发光二极管直接接触是因为有机层不需要刻蚀工艺，在制作过程中没有损伤发光二极管的风险。
在本发明实施例的技术方案中，有机层厚度为1～2微米，无机层厚度为0.1～1微米。
过薄的有机层或无机层在刻蚀凹凸结构的过程中有刻蚀穿的风险，过厚的有机层或无机层会浪费材料，有机层或无机层的厚度在具体的产品设计过程中需要根据产品要求调整。
在本发明实施例的技术方案中，有机层材料采用聚丙烯酸酯类。在一种实施方式中，有机层材料采用负性聚丙烯酸酯类。
在本发明实施例的技术方案中，无机层可以采用氮化硅或者氮氧化硅材 质。
在本发明实施例的技术方案中，粘接层采用热固性材料粘接层，热固性材料粘接层包括热固性酚醛树脂粘接层或UV固化胶粘接层。
热固性酚醛树脂材料可通过加热发生化学反应而逐渐硬化成型，再次受热也不发生软化；UV固化胶可以在紫外光照射下吸收紫外能量，产生活性自由基或阳离子，使粘接层发生一系列化学反应而最终固化。
第一基板和/或第二基板可以为柔性基板，应用于柔性显示装置。柔性基板的材质不限，例如可以包括聚酰亚胺、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺、聚醚砜、聚对苯二甲酸乙二醇酯和聚萘二甲酸乙二醇酯中的至少一种。在本发明实施例中，柔性基板的材质采用聚对苯二甲酸丁二醇酯基板或聚对苯二甲酸乙二醇酯基板。此外，第一基板和第二基板也可以为常见的硬质基板，例如玻璃基板、树脂基板等等。第一基板和第二基板的材质没有限制，例如在一些实施方式中，第一基板可以为柔性基板，第二基板为硬质基板；或者在一些实施方式中，第一基板为硬质基板，第二基板为柔性基板；或者在一些实施方式中，第一基板和第二基板均为柔性基板或硬质基板。
如图1所示，封装层上的凹凸结构为方形凹凸结构，但实际情况并不局限于此，凹凸结构也可以为波浪形凹凸结构或锯齿形凹凸结构等其他形状结构。凹凸结构可以增加封装层之间、封装层与粘接层之间的接触面积，起到提高防水氧性能、增强粘接效果的作用。
本发明实施例还提供了一种有机发光二极管器件的制作方法，如图2所示，包括以下步骤：
步骤S101、在第一基板之上形成有机发光二极管；
步骤S102、在有机发光二极管之上形成至少一层封装层，封装层的至少一侧表面具有凹凸结构；
步骤S103、在至少一层封装层之上形成粘接层；
步骤S104、将第二基板与粘接层粘接。
在本发明实施例的技术方案中，制作如图1所示的有机发光二极管器件，需要在有机发光二极管之上涂覆有机膜形成有机层，并在有机层上形成凹凸结构，再通过等离子体增强化学气相沉积法在有机层表面沉积一层无机物，并在无机层的上表面形成凹凸结构，最后在无机层上涂覆一层胶膜，胶膜固 化后将第一基板和第二基板粘合。
在一些实施方式中，在有机发光二极管之上形成至少一层封装层包括：
在封装层的上表面形成凹凸结构。
在本发明实施例的技术方案中，涂覆有机膜后的有机发光二极管器件在进过软烘、曝光显影工艺后得到所需要的凹凸结构；在无机层表面形成凹凸结构，需要先在无机层表面涂覆光刻胶并进行曝光显影，再通过干刻技术刻蚀没有光刻胶覆盖的无机层。当然，形成凹凸结构也可以采用其他构图工艺，如激光雕刻等。
在一些实施方式中，在封装层的上表面形成凹凸结构具体包括以下步骤(如图3所示)：
步骤S105、在有机发光二极管之上形成有机层；
步骤S106、通过曝光显影工艺在有机层的上表面形成凹凸结构；
步骤S107、在有机层表面形成无机层；
步骤S108、通过刻蚀工艺在无机层的上表面形成凹凸结构。
在该方法实施例的技术方案中，在封装层的表面设计有凹凸结构，无机层表面的凹凸结构增大了无机层的表面积，进而提高了防水氧的性能；有机层表面的凹凸结构增大了有机层与无机层的接触面积，改善了粘结效果，由于有机层自身具有吸水性，同时也提高了有机层的防水性能。因此，相比现有技术，本方案能够以减少空气的水汽和氧气对OLED器件的损害，提高OLED器件防水氧性能。
本发明实施例还提供了一种显示装置，包括前述任一技术方案的有机发光二极管器件。由于有机发光二极管器件防水氧性能得以提高，本显示装置具有较佳的产品品质。显示装置的类型不限，可以为普通的平板显示装置，也可以为柔性显示装置。显示装置的具体类型可以为显示器、电子纸、平板电脑、电视机、智能显示标签、智能显示卡，等等。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年8月20日递交的中国专利申请第201510516240.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (13)

  1. 一种有机发光二极管器件，包括：
    第一基板，
    设置在所述第一基板上的有机发光二极管，
    设置在所述有机发光二极管之上的至少一层封装层，
    设置在所述至少一层封装层之上的粘接层，以及
    所述粘接层上方的第二基板，
    其中，
    所述至少一层封装层的至少一侧表面具有凹凸结构。
  2. 如权利要求1所述的有机发光二极管器件，其中所述有机发光二极管器件包括至少两层封装层，所述至少两层封装层包括交替设置的有机层和无机层。
  3. 如权利要求1或2所述的有机发光二极管器件，其中所述有机发光二极管器件包括两层封装层，所述两层封装层包括位于有机发光二极管之上的有机层和位于所述有机层之上的无机层，所述有机层的上表面具有凹凸结构，所述无机层的上表面和下表面均具有凹凸结构，且所述有机层上表面的凹凸结构和所述无机层下表面的凹凸结构相耦合。
  4. 如权利要求1至3中任一项所述的有机发光二极管器件，其中所述有机层厚度为1～2微米，所述无机层厚度为0.1～1微米。
  5. 如权利要求2至4中任一项所述的有机发光二极管器件，其中所述有机层包括聚丙烯酸酯类有机层。
  6. 如权利要求2至5中任一项所述的有机发光二极管器件，其中所述无机层包括氮化硅无机层或氮氧化硅无机层。
  7. 如权利要求1至6中任一项所述的有机发光二极管器件，其中所述粘接层为热固性材料粘接层，所述热固性材料粘接层包括热固性酚醛树脂粘接层或UV固化胶粘接层。
  8. 如权利要求1至7中任一项所述的有机发光二极管器件，其中所述第一基板和/或第二基板为柔性基板，所述柔性基板包括聚对苯二甲酸丁二醇酯基板或聚对苯二甲酸乙二醇酯基板。
  9. 如权利要求1～8任一项所述的有机发光二极管器件，其中所述凹凸结构包括方形凹凸结构，波浪形凹凸结构或锯齿形凹凸结构。
  10. 一种有机发光二极管器件的制作方法，包括：
    在第一基板之上形成有机发光二极管；
    在有机发光二极管之上形成至少一层封装层，所述封装层的至少一侧表面具有凹凸结构；
    在所述至少一层封装层之上形成粘接层；
    将所述第二基板与所述粘接层粘接。
  11. 如权利要求10所述的有机发光二极管器件的制作方法，其中在有机发光二极管之上形成至少一层封装层包括：
    在所述封装层的上表面形成凹凸结构。
  12. 如权利要求11所述的有机发光二极管器件的制作方法，其中在所述封装层的上表面形成凹凸结构具体包括：
    在有机发光二极管之上形成有机层；
    通过曝光显影工艺在所述有机层的上表面形成凹凸结构；
    在所述有机层表面形成无机层；
    通过刻蚀工艺在所述无机层的上表面形成凹凸结构。
  13. 一种显示装置，包括如权利要求1～9任一项所述的有机发光二极管器件。
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