WO2019128032A1 - 封装结构及其制备方法与有机电致发光装置 - Google Patents

封装结构及其制备方法与有机电致发光装置 Download PDF

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Publication number
WO2019128032A1
WO2019128032A1 PCT/CN2018/086070 CN2018086070W WO2019128032A1 WO 2019128032 A1 WO2019128032 A1 WO 2019128032A1 CN 2018086070 W CN2018086070 W CN 2018086070W WO 2019128032 A1 WO2019128032 A1 WO 2019128032A1
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layer
substrate
desiccant
package
package structure
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PCT/CN2018/086070
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English (en)
French (fr)
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穆欣炬
刘宏俊
史凯兴
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昆山维信诺科技有限公司
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Publication of WO2019128032A1 publication Critical patent/WO2019128032A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • the present invention relates to the field of display technologies, and in particular, to a package structure and a method for fabricating the same, and an organic electroluminescence device.
  • OLED Organic Light-Emitting Display
  • OLED has the advantages of self-luminous, fast response, wide viewing angle, high brightness, colorful, light and thin, etc., and is considered as the next generation display technology.
  • Organic materials of organic electroluminescent devices are very sensitive to water and oxygen. Traces of water and oxygen can cause oxidation, crystallization or electrode degradation of organic materials in the display, affecting the life of the display or directly causing damage to the display.
  • the organic electroluminescent device includes a substrate 10, an OLED device layer 30 disposed on the substrate 10, and a package cover 20.
  • the solid dried sheet 50 is attached by grooving in the package cover 20.
  • there is a certain requirement on the thickness of the attached dry sheet 50 that is, a minimum thickness limit on the thickness of the package cover 20.
  • the thickness of the package cover 20 cannot be reduced, which limits the thickness of the organic electroluminescent device, which is disadvantageous to the thinning and flexibility of the product.
  • the present invention provides a package structure.
  • the package structure includes: a first substrate and a second substrate disposed opposite to each other; a body to be package disposed between the first substrate and the second substrate; formed on the first substrate, And continuously covering the encapsulation layer on the exposed surface of the body to be packaged; and a desiccant layer interposed between the encapsulation layer and the second substrate; wherein the desiccant layer is in a gel state Agent layer.
  • the gel state desiccant in the desiccant layer has a viscosity of 50,000 to 800,000 mPa ⁇ s.
  • the package structure further includes a package ring disposed around an edge of the package to be packaged, and the package ring is disposed between the first substrate or the encapsulation layer and the second substrate to form a closed cavity
  • the desiccant layer is disposed in the sealed cavity.
  • the desiccant layer completely fills the closed cavity.
  • the encapsulation layer is an inorganic material layer
  • the encapsulation layer comprises at least one inorganic thin film layer
  • each of the inorganic thin film layers is independently selected from a silicon nitride film or a silicon oxide film.
  • the encapsulation layer has a thickness of 0.5 ⁇ m to 3 ⁇ m.
  • a method of fabricating a package structure comprising: providing a first substrate, a surface to be packaged on a surface of the first substrate; forming on the first substrate Continually covering an encapsulation layer of the exposed surface of the package; providing a package ring around the peripheral edge of the to-be-package on the first substrate or the encapsulation layer, in the encapsulation layer, and optionally the first Forming a desiccant filling cavity with a packaging ring as a sidewall on the substrate; filling a liquid desiccant in the desiccant filling cavity; pressing the second substrate such that the second substrate fills the desiccant cavity The sealing is performed to form a closed cavity; the liquid desiccant is cured to form a gel state desiccant.
  • the gel state desiccant fills the closed cavity.
  • the gel state desiccant has a viscosity of 50,000 to 800,000 mPa ⁇ s.
  • an organic electroluminescent device comprising a package structure according to the present invention, the object to be packaged being an organic light emitting array layer.
  • the organic light emitting array layer includes: a first electrode layer and a spacer disposed on the first electrode layer, the first electrode layer includes a plurality of first electrode strips disposed in parallel with each other, The extending direction of the spacer column is perpendicular to the extending direction of the first display electrode; wherein the spacer column has a cross section in an inverted trapezoidal shape along the extending direction of the first electrode strip, each side of the cross section The acute angle between the side and the first electrode layer is 45°-70°.
  • the first electrode layer further includes a plurality of insulating strips, the insulating strips are disposed in the one-to-one correspondence with the isolation columns below the isolation pillars, and the insulating strips are to be the first electrodes The strips are separated into a plurality of sub-first electrodes distributed along the direction in which the first electrode strip extends.
  • the package structure provided by the embodiment of the present invention can form a package for the package by forming an encapsulation layer for covering the package to be packaged, and avoid the influence of water and oxygen on the package formed by the encapsulation layer and the second substrate;
  • a desiccant layer for blocking moisture and oxygen in the external environment and the cavity is formed between the encapsulation layer and the second substrate by curing the liquid desiccant, and there is no requirement for the thickness of the desiccant layer, that is, without increasing Based on the thickness of the package structure, the water and oxygen barrier capability of the package structure is increased.
  • the package structure provided by the embodiment of the present invention can be relatively evenly distributed between the encapsulation layer and the second substrate by using a desiccant layer in a gel state and utilizing a certain ductility of the gel state desiccant.
  • the various packages of the package achieve the same degree of encapsulation to better absorb the external environment and the water vapor and oxygen in the cavity, which can more effectively prevent water oxygen from intruding into the package to be packaged, and has a simple structure and is easy to be industrially prepared;
  • the desiccant layer can change shape during the impact by external force, release stress, and buffer the body to be packaged, so as to simplify the process difficulty of the subsequent operation and improve the impact resistance of the corresponding product.
  • the package structure provided by the embodiment of the present invention preferably, by providing a package ring as a sidewall to form a sealed cavity between the package layer and the second substrate, without etching the sealing layer, not only simplifying the process, but also simplifying the process. It is beneficial to reduce the thickness of the package structure to meet the needs of miniaturization and miniaturization of the product.
  • the encapsulation layer is at least one inorganic thin film layer, that is, an encapsulation layer is formed by an inorganic material for isolating water vapor and oxygen, and avoiding the influence of external water vapor on the package.
  • the method for preparing an organic electroluminescence device is prepared by filling a liquid sealing gel in a sealed gel filling cavity and then solidifying to form a gel state or a solid sealing gel, which not only does not need to etch the encapsulation layer, but simplifies The operation steps and the difficulty of operation, and the liquid sealing glue has a certain fluidity and can be relatively evenly distributed in the sealed rubber filling cavity; and in the liquid curing adhesive curing process, as the volume of the liquid sealing glue changes, it enables A more complete filling within the closed cavity to create a better closed environment. It can be seen that the method is beneficial to improve the water oxygen barrier capability without increasing the thickness of the package structure, and it is easy to realize the ultra-thinning of the corresponding organic electroluminescence device.
  • the organic electroluminescent device provided by the embodiment of the invention can form a package of the organic electroluminescent device layer by forming an encapsulation layer for covering the organic electroluminescent device layer, thereby avoiding formation of the encapsulation layer and the second substrate.
  • the effect of water oxygen on the organic light-emitting array layer in the cavity; further, by forming a desiccant layer between the encapsulation layer and the second substrate for blocking moisture and oxygen in the external environment and the cavity, the thickness of the desiccant layer is not It is required to increase the water-oxygen barrier capability of the organic electroluminescent device without increasing the thickness of the organic electroluminescent device.
  • FIG. 1 is a schematic structural view of a display device in the prior art
  • Embodiment 1 of the present invention is a schematic structural diagram of a package structure in Embodiment 1 of the present invention.
  • Fig. 3 is a schematic view showing the structure of an organic electroluminescent device in Embodiment 2 of the present invention.
  • Figure 1 10-substrate; 20-package cover; 30-OLED device layer; 40-UV package; 50-dried sheet;
  • An embodiment of the present invention provides a package structure, as shown in FIG. 2, including a first substrate 10 and a second substrate 20 disposed opposite to each other, a body to be package 30 disposed between the first substrate 10 and the second substrate 20, and An encapsulation layer 60 formed on the first substrate 10 and continuously covering the exposed surface of the to-be-packaged body 30; wherein the to-be-packaged body 30 is formed on the first substrate 10, and the to-be-packaged body The exposed surface is formed on the outer side of the first substrate 10; or the outer peripheral edge of the package to be packaged on the first substrate 10 or the encapsulation layer 30 is further provided with a package ring 40, and the package ring 40 is disposed.
  • a sealed cavity is enclosed between the first substrate 10 (or the encapsulation layer 60) and the second substrate 20.
  • the desiccant layer 50 is interposed between the encapsulation layer 60 and the second substrate 20 .
  • the desiccant layer is a desiccant layer in a gel state.
  • the package 30 By forming the encapsulation layer 60 for covering the body 30 to be packaged, the package 30 can be formed into a package, thereby avoiding the influence of the encapsulation layer 60 and the cavity formed by the second substrate 20 on the package 30;
  • the desiccant method forms a desiccant layer between the encapsulation layer and the second substrate for blocking moisture and oxygen in the external environment and the cavity, and there is no requirement for the thickness of the desiccant layer, so the thickness of the package structure can be increased without increasing the thickness of the package structure. Based on this, the water and oxygen barrier capability of the package structure is increased.
  • the encapsulation layer 60 covers the body to be packaged 30 and extends to the surface of the first substrate 10; that is, the encapsulation layer 60 forms a closed cavity with the first substrate 10, and the package 30 is disposed in the sealed cavity, and The opposite surfaces of the package 30 are respectively disposed in contact with the encapsulation layer 60 or the first substrate 10.
  • the direction indicated by the arrow x in FIG. 2 is the longitudinal direction of the first substrate 10
  • the direction indicated by the arrow y is the thickness direction of the encapsulation layer 60.
  • the gel state desiccant has a viscosity of 50,000 to 800,000 mPa ⁇ s. Controlling the viscosity of the desiccant is beneficial to maintain the gel state of the desiccant, so that it has a variable three-dimensional structure, can change shape during the impact of external force, release stress, and buffer the body to be packaged, thereby simplifying the follow-up The process difficulty of the operation and the impact resistance of the corresponding product.
  • the encapsulation layer 60 is an inorganic material layer, which may include at least one inorganic thin film layer, for example, may be a layer of an amorphous coating layer, or a superposed structure of two or three inorganic thin film layers;
  • the inorganic thin film layers are each independently selected from a silicon nitride film or a silicon oxide film.
  • the encapsulation layer 60 is an inorganic thin film layer.
  • it may be a layer of SiN x film or a layer of SiO 2 film.
  • the thickness of the encapsulation layer 60 is not particularly required. However, in order to meet the development requirements of miniaturization and flexibility, the encapsulation layer 60 has a thickness of 0.5 ⁇ m to 3 ⁇ m. In the present embodiment, the encapsulation layer 60 It is an inorganic thin film layer having a thickness of 1 ⁇ m.
  • the encapsulation ring 40 is disposed on the first substrate 10 and surrounds the outer peripheral edge of the body to be packaged 30; that is, the encapsulation ring 40 is a closed annular structure surrounding the to-be-packaged body 30.
  • the encapsulation ring 40 is a glass paste that is cured by laser. It can also be said that the encapsulation ring 40 is an inorganic encapsulation ring.
  • the first substrate 10, the encapsulation layer 60, the encapsulation ring 40, and the second substrate 20 form a sealed cavity, and a desiccant layer 50 is provided in the formed sealed cavity.
  • the desiccant layer 50 is a desiccant layer in a gel state.
  • the desiccant layer 50 in the gel state is completely filled and evenly distributed in the closed cavity, and the external environment and the water vapor and oxygen in the sealed cavity can be greatly absorbed by avoiding the generation of voids, thereby avoiding Water oxygen invades the package to be encapsulated.
  • the gel state desiccant layer 50 may be an OleDry F type desiccant of Futaba Company, or another liquid desiccant material having a water-blocking ability as a raw material, which is formed by curing, and only needs to ensure the final condensation formed in the desiccant layer.
  • the viscosity of the colloidal desiccant may be 80000-500000 mPa ⁇ s.
  • the encapsulation layer 60 covers the outside of the body to be package 30 and extends along the length direction of the first substrate 10 until extending to the edge of the first substrate 10. That is, the encapsulation layer 60 is attached to cover the body to be packaged 30 and extends along the edge of the first substrate 10.
  • the encapsulation ring 40 is disposed on the encapsulation layer 60, which forms a closed cavity with the encapsulation layer 60 and the second substrate 20, and a desiccant layer 50 is disposed in the sealed cavity.
  • the encapsulation ring 40 may be an organic (UV cured epoxy) ring.
  • the body to be packaged 30 may be an organic electroluminescent device layer or other structure that requires packaging.
  • An embodiment of the present invention provides an organic electroluminescent device, which is different from Embodiment 1 in that the body to be package 30 is an organic light emitting array layer.
  • the organic light emitting array layer includes: a first electrode layer and a spacer column 72, wherein the first electrode layer includes a plurality of first electrode strips disposed in parallel with each other (as shown in the figure, the first electrode layer is an anode) a layer, such as an ITO layer, extending in a direction perpendicular to an extending direction of the first display electrode; wherein the spacer pillar 72 has an inverted trapezoidal shape along an extending direction of the first electrode strip In cross section, the acute angle between each of the sides of the cross section and the first electrode layer is 45°-70°.
  • the spacer column 72 is disposed in such a structure to facilitate good separation of the corresponding second electrodes, and is not easy to collapse, and can effectively prevent short circuit between the corresponding second electrode and the first electrode, or adjacent The problem of electrical connection between the two electrodes.
  • the first electrode layer further includes a plurality of insulating strips 71.
  • the insulating strips 71 are disposed in the one-to-one correspondence with the spacer pillars 72 under the isolation pillars 72, and the insulating strips 71 are disposed.
  • the first electrode strip is separated into a plurality of sub-first electrodes distributed along the extending direction of the first electrode strip.
  • the first electrode layer is an anode layer
  • the second electrode layer is a cathode layer
  • the organic light-emitting array layer further includes a functional layer and a second electrode layer, wherein the first electrode layer includes a plurality of first electrode strips arranged in parallel, The plurality of isolation pillars 72 are disposed on the first electrode layer in parallel with each other, and the extending direction of the spacer pillars 72 is perpendicular to the extending direction of the first electrode strip, and the functional layer is formed in the first
  • the electrode layer is disposed between each of the isolation pillars 72
  • the second electrode layer is formed on the functional layer and located between each of the isolation pillars 72.
  • the surface of the isolation pillar 72 away from the first electrode layer is higher than the surface of the second electrode layer away from the first electrode layer.
  • the functional layer includes an optional electron injection layer in which the second electrodes are sequentially stacked in the direction of the first electrode, an optional electron transport layer, an optional hole blocking layer, a light emitting layer, an optional electron blocking layer, An optional hole transport layer, an optional hole injection layer.
  • the encapsulation layer 60 is continuously covered on the organic light emitting array layer (continuously covering the surfaces of the second electrode and the barrier layer).
  • the desiccant layer 50 fills the closed cavity between the encapsulation layer 60 and the second substrate 20. .
  • the height of the package ring 40 is higher than the height of the spacer, that is, the distance between the first substrate 10 and the second substrate 20 depends on the height of the package ring 40.
  • the first substrate 10 and the second substrate 20 may be a rigid substrate such as glass.
  • the first substrate 10 is a glass substrate
  • the second substrate 20 is a glass cover plate.
  • the first substrate 10 and the second substrate 20 it may be a flexible substrate.
  • the flexible substrate can be prepared using a polyester-based, polyimide-based compound material or a thin metal sheet.
  • the organic electroluminescent device layer can be packaged to avoid water and oxygen in the cavity formed by the encapsulation layer 60 and the second substrate 20.
  • the effect of the organic light-emitting array layer; in addition, a gel state desiccant layer for blocking moisture and oxygen in the external environment and the cavity is formed between the encapsulation layer and the second substrate by a method of curing the liquid desiccant, for the desiccant
  • the thickness of the layer is not required, that is, the water and oxygen barrier capability of the package structure can be increased without increasing the thickness of the package structure.
  • isolation column in this embodiment is not limited to the isolation column shown in FIG. 3, and may be other shapes, and only needs to ensure that the isolation column can isolate adjacent organic light emitting diodes.
  • Embodiments of the present invention provide a method for fabricating an organic electroluminescence device, including the following steps:
  • Step S11 preparing an organic light emitting array layer on the first substrate, and the structure of the organic light emitting array layer is as described above;
  • step S12 a continuous encapsulation layer covering the exposed surface of the organic light emitting array layer (the surface away from the side of the first substrate) is formed on the first substrate.
  • an encapsulation layer 60 continuously covering the surface of the organic light-emitting array layer away from the first substrate, the encapsulation layer 60 extending to the surface of the first substrate 10 to form a sealed cavity with the first substrate 10, and encapsulating the organic light-emitting array layer Closed cavity.
  • Step S13 providing a packaging ring around the outer peripheral edge of the organic light emitting array layer on the encapsulation layer to form a desiccant filling cavity with the encapsulating ring as a sidewall on the encapsulation layer.
  • a package ring 40 surrounding the outer peripheral edge of the organic light-emitting array layer is formed on the encapsulation layer 60 by a laser-cured glass frit to form a desiccant filling with the upper surface of the encapsulation layer 60 as the bottom surface and the encapsulation ring 40 as the sidewall. Cavity.
  • step S14 a liquid desiccant layer is filled in the desiccant filling chamber.
  • Filling the desiccant filling chamber with a liquid desiccant layer, and the amount of the liquid desiccant applied may be calculated according to the volume of the subsequently formed closed cavity, so that the liquid desiccant can be completely filled after being expanded during the curing process.
  • the sealed cavity is sufficient.
  • the coating pattern of the liquid desiccant formed on the surface of the first substrate 10 or the encapsulation layer 60 is selected from, but not limited to, a "back" shape, or an "S" shape.
  • the coating of the shape can ensure that the liquid desiccant layer 50 is completely filled with the closed cavity, and the amount of liquid desiccant required is minimized, thereby achieving cost saving.
  • the coating pattern of the desiccant layer 50 may be set according to the surface pattern of the organic light emitting array layer to ensure the desiccant layer in the subsequent pressing step. 50 can completely fill the cavity between the second substrate 20 and the organic light emitting array layer.
  • Step S15 pressing the second substrate such that the second substrate seals the desiccant filling chamber to form a closed cavity.
  • the second substrate 20 is press-fitted to the top surface of the package ring 40 and closely adheres to the second substrate 20 to seal the desiccant filling chamber to form a sealed cavity.
  • step S16 the liquid desiccant is solidified to form a gel state desiccant and fills the closed cavity.
  • the liquid desiccant is subjected to a curing treatment, and by controlling the curing conditions, the liquid desiccant forms a gel state desiccant and fills the sealed cavity.
  • the curing condition can be selected according to the curing condition of the liquid desiccant to control the gel state and volume of the desiccant formed, and the viscosity of the desiccant in the gel state is 50,000 while completely filling the closed cavity.
  • the coating thickness of the OleDry F type liquid desiccant is between 20 and 40 ⁇ m, it can be baked at 80 ° C for 1 hour, so that the liquid desiccant achieves a perfect filling effect.

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Abstract

本发明涉及显示技术领域，公开了一种封装结构及其制备方法与有机电致发光装置。其中，所述封装结构包括：相对设置的第一基板和第二基板；形成在所述第一基板和第二基板之间的待封装体；形成在所述第一基板上、并连续的覆盖在所述待封装体裸露表面上的封装层；以及夹设在所述封装层与所述第二基板之间的干燥剂层，所述干燥剂层为凝胶态的干燥剂层。本发明通过固化液态干燥剂的方法在封装层与第二基板之间形成凝胶态的干燥剂层，对于干燥剂层的厚度没有要求，因此能够在不增加该封装结构厚度的基础上，增加该封装结构的水氧阻隔能力。

Description

封装结构及其制备方法与有机电致发光装置 技术领域
本发明涉及显示技术领域，具体涉及一种封装结构及其制备方法，以及有机电致发光装置。
背景技术
有机电致发光装置(Organic Light-Emitting Display，简称为OLED)相对于液晶显示装置具有自发光、反应快、视角广、亮度高、色彩艳、轻薄等优点，被认为是下一代显示技术。
有机电致发光装置的有机材料对水氧非常敏感，微量的水氧就会造成显示屏中有机材料的氧化、结晶或者电极的劣化，影响显示屏的寿命或者直接导致显示屏的损坏。
现有技术中一般采用在封装片上贴附固态干燥片，实现吸附水氧的目的。如图1所示，该有机电致发光装置包括基板10，设置在基板10上的OLED器件层30，以及封装盖板20。通过在封装盖板20中开槽，贴附固态干燥片50。为保证有机电致发光装置的封装效果，对所贴附的干燥片50的厚度有一定的要求，即对封装盖板20的厚度有最小厚度限制。
然而上述技术方案中，由于封装盖板20的厚度限制，会导致封装盖板20的厚度不能减薄，进而会限制该有机电致发光装置的厚度，不利于产品的轻薄化、柔性化。
发明内容
鉴于此，为解决有机电致发光装置的厚度较大的问题，本发明提供了一种封装结构。根据本发明的一方面，该封装结构包括：相对设置的第一 基板和第二基板；设置在所述第一基板和第二基板之间的待封装体；形成在所述第一基板上、并连续的覆盖在所述待封装体的裸露表面的封装层；以及夹设在所述封装层与所述第二基板之间的干燥剂层；其中所述干燥剂层为凝胶态的干燥剂层。
可选地，所述干燥剂层中的凝胶态的干燥剂的粘度为50000-800000mPa·s。
可选地，所述封装结构还包括环绕所述待封装体边缘设置的封装环，所述封装环设置在所述第一基板或所述封装层与所述第二基板之间围成密闭腔体，所述干燥剂层设置在所述密闭腔体内。
可选地，所述干燥剂层完全填充所述密闭腔体。
可选地，所述封装层为无机材料层；
可选地，所述封装层包括至少一层无机薄膜层；
可选地，各所述无机薄膜层分别独立地选自氮化硅薄膜或氧化硅薄膜。
可选地，所述封装层的厚度为0.5μm至3μm。
根据本发明的另一方面，还提供了一种封装结构的制备方法，所述方法包括：提供第一基板，所述第一基板的表面上形成有待封装体；在所述第一基板上形成连续的覆盖待封装体裸露表面的封装层；在所述第一基板或所述封装层上环绕所述待封装体的外周边缘设置封装环，以在所述封装层、以及可选的第一基板上形成以封装环为侧壁的干燥剂填充腔；在所述干燥剂填充腔中装入液态干燥剂；压合所述第二基板，使得所述第二基板对所述干燥剂填充腔进行密闭，形成密闭腔体；固化所述液态干燥剂，使其形成凝胶态干燥剂。
可选地，所述凝胶态干燥剂充满所述密闭腔体。
可选地，所述凝胶态的干燥剂的粘度为50000-800000mPa·s。
此外，在本发明中还提供了一种有机电致发光装置，该装置包括根据本发明的封装结构，所述待封装体为有机发光阵列层。
可选地，所述有机发光阵列层包括：第一电极层和设置在所述第一电极层上的隔离柱、所述第一电极层包括相互平行设置的多个第一电极条，所述隔离柱的延伸方向与所述第一显示电极的延伸方向垂直；其中所述隔离柱沿所述第一电极条的延伸方向上具有呈倒梯形形状的横截面，所述横截面中每条侧边与第一电极层之间的锐角为45°-70°。
可选地，所述第一电极层中还包括多个绝缘条，所述绝缘条与所述隔离柱一一对应地设置在所述隔离柱的下方，所述绝缘条将所述第一电极条分离为沿所述第一电极条延伸方向分布的多个子第一电极。
本发明技术方案，具有如下优点：
1.本发明实施例提供的封装结构，通过形成用于覆盖待封装体的封装层，能够对待封装体形成封装，避免封装层与第二基板所形成的腔体内水氧对待封装体的影响；此外，通过固化液态干燥剂的方法在封装层与第二基板之间形成用于阻隔外界环境和腔体内的水汽和氧气的干燥剂层，对于干燥剂层的厚度没有要求，即能够在不增加该封装结构厚度的基础上，增加该封装结构的水氧阻隔能力。
2.本发明实施例提供的封装结构，通过选用凝胶态的干燥剂层，利用凝胶态干燥剂所具有的一定的延展性，能够相对均匀分布在封装层与第二基板之间，对待封装体的各方位实现相同的封装程度，以更好地吸收外界环 境以及腔体内的水汽和氧气，能够更有效地避免水氧侵入待封装体，且结构简单易于工业制备；此外凝胶态的干燥剂层在受到外力冲击的过程中能够改变形状，释放应力，为待封装体起到缓冲作用，以简化后续操作的工艺难度，并提高相应产品的抗冲击能力。
3.本发明实施例提供的封装结构，优选情况下，通过设置封装环作为侧壁，以在封装层和第二基板之间形成密闭腔体，无需刻蚀密闭层，不但简化了工艺，还有利于降低封装结构的厚度，以适应于产品小型化、微型化的需求。
4.本发明实施例提供的封装结构，优选情况下，封装层为至少一层无机薄膜层，即通过无机材料形成封装层，用于隔绝水汽和氧气，避免外界水汽对待封装体的影响。
5.本发明实施例提供的有机电致发光装置的制备方法，通过将液态密闭胶填充在密闭胶填充腔，再固化形成凝胶态或固态的密闭胶，不但不需要刻蚀封装层，简化操作步骤及操作难度，而且，液态密闭胶具有一定的流动性，能够相对均匀地分布在密闭胶填充腔中；而且在液态密闭胶固化过程中，随着液态密闭胶体积的变化，使其能够更完整的填充在密闭腔体之内，以形成更好的密闭环境。可见，该方法有利于在不增加该封装结构厚度的前提下，提高其水氧隔绝能力，易于实现相应有机电致发光装置的超薄化。
6.本发明实施例提供的有机电致发光装置，通过形成用于覆盖有机电致发光器件层的封装层，能够对有机电致发光器件层形成封装，避免封装层与第二基板所形成的腔体内水氧对该有机发光阵列层的影响；此外，通过 在封装层与第二基板之间形成用于阻隔外界环境和腔体内的水汽和氧气的干燥剂层，对于干燥剂层的厚度没有要求，即能够在不增加该有机电致发光装置厚度的基础上，增加该有机电致发光装置的水氧阻隔能力。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中显示装置的一个具体示意的结构示意图；
图2为本发明实施例1中封装结构的一个具体示意的结构示意图；
图3本发明实施例2中有机电致发光装置的一个具体示意的结构示意图。
附图标记：
图1：10-基板；20-封装盖板；30-OLED器件层；40-UV封装；50-干燥片；
图2-图3：10-第一基板；20-第二基板；30-待封装体；40-封装环；50-干燥剂层；60-封装层；71-绝缘条；72-隔离柱。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然， 所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“上”、“下”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
本发明可以以许多不同的形式实施，而不应该被理解为限于在此阐述的实施例。相反，提供这些实施例，使得本公开将是彻底和完整的，并且将把本发明的构思充分传达给本领域技术人员，本发明将仅由权利要求来限定。在附图中，为了清晰起见，会夸大层和区域的尺寸和相对尺寸。应当理解的是，当元件例如层、区域或基板被称作“形成在”或“设置在”另一元件“上”或“层叠”时，该元件可以直接设置在所述另一元件上，或者也可以存在中间元件。相反，当元件被称作“直接形成在”或“直接设置在”另一元件上或“直接层叠”时，不存在中间元件。
此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
实施例1
本发明实施例提供一种封装结构，如图2所示，包括相对设置的第一基板10以及第二基板20；设置在第一基板10和第二基板20之间的待封装 体30，以及形成在所述第一基板10上、并连续的覆盖在所述待封装体30的裸露表面的封装层60；其中待封装体30形成在所述第一基板10上，且所述待封装体30相对于所述第一基板10的外侧形成所述裸露表面；此外，在第一基板10、或者封装层60上环绕待封装体30外周边缘还设置有封装环40，所述封装环40设置在所述第一基板10(或者封装层60)和第二基板20之间围成密闭腔体。其中，在封装层60与第二基板20之间夹设有干燥剂层50。该干燥剂层为凝胶态的干燥剂层。
通过形成用于覆盖待封装体30的封装层60，能够对待封装体30形成封装，避免封装层60与第二基板20所形成的腔体内水氧对待封装体30的影响；此外，通过固化液态干燥剂的方法在封装层与第二基板之间形成用于阻隔外界环境和腔体内的水汽和氧气的干燥剂层，对于干燥剂层的厚度没有要求，因此能够在不增加该封装结构厚度的基础上，增加该封装结构的水氧阻隔能力。
如图2所示，封装层60覆盖待封装体30，并延伸至第一基板10表面；即封装层60与第一基板10形成密闭腔体，待封装体30设置在该密闭腔体内，且待封装体30的相对两个表面分别与封装层60或第一基板10贴合设置。此外，图2中箭头x所指方向为第一基板10的长度方向，箭头y所指方向为封装层60的厚度方向。
在该实施例中，优选情况下，所述凝胶态干燥剂的粘度为50000-800000mPa·s。控制干燥剂的粘度有利于保持干燥剂的凝胶状态，使其具有可变化的立体结构，在受到外力冲击的过程中能够改变形状，释放应力，为待封装体起到缓冲作用，以简化后续操作的工艺难度，并提高相应产品的抗 冲击能力。
在该实施例中，封装层60为无机材料层，其可以包括至少一层无机薄膜层，例如可以为一层无极包膜层，或者两层或三层无机薄膜层的叠加结构；各所述无机薄膜层分别独立地选自氮化硅薄膜或氧化硅薄膜。在本实施例中封装层60为一层无机薄膜层。例如，可以为一层SiN x薄膜层或一层SiO 2薄膜层。
在该实施例中，封装层60的厚度没有特殊要求，然而为了适应于小型化、柔性化的发展需求，所述封装层60的厚度为0.5μm至3μm，在本实施例中，封装层60为一层无机薄膜层，其厚度为1μm。
在该实施例中，封装环40为设置在第一基板10上且环绕待封装体30的外周边缘；即封装环40为环绕待封装体30的闭合的环形结构。其中，封装环40为通过激光固化的玻璃浆料(frit)，也可以表述为封装环40为无机封装环。
如图2所示，第一基板10、封装层60、封装环40以及第二基板20形成密闭腔体，在所形成的密闭腔体内设置有干燥剂层50。其中，该干燥剂层50为凝胶态的干燥剂层。优选情况下，凝胶态的干燥剂层50完全填充且均匀分布该密闭腔体中，通过避免空隙产生的方式，能够极大程度地吸收外界环境以及该密闭腔体内的水汽和氧气，能够避免水氧侵入待封装体。
该凝胶态干燥剂层50可以为Futaba公司的OleDry F型干燥剂，或者其他具有阻隔水氧能力的液态干燥剂材料为原料，经过固化形成，只需保证该干燥剂层中最终形成的凝胶态的干燥剂的粘度为80000-500000mPa·s即可。
作为本实施例的一种可选实施方式，封装层60覆盖待封装体30外，还沿第一基板10的长度方向延伸，直至延伸至第一基板10的边缘。即，封装层60贴合覆盖待封装体30且沿延伸至第一基板10的边缘。此时，封装环40设置在封装层60上，其与封装层60以及第二基板20形成密闭腔体，在该密闭腔体内设置有干燥剂层50。
作为本实施例中封装环40的可替换实施方式，封装环可以为有机物(UV固化的环氧树脂)环。
作为本实施例中待封装体30的可选实施方式，待封装体30可以为有机电致发光器件层，或其他需要实现封装的结构。
实施例2
本发明实施例提供一种有机电致发光装置，与实施例1的不同在于，待封装体30为有机发光阵列层。
如图3所示，所述有机发光阵列层包括：第一电极层和隔离柱72、所述第一电极层包括相互平行设置的多个第一电极条(如图中第一电极层为阳极层，例如ITO层)，所述隔离柱72的延伸方向与所述第一显示电极的延伸方向垂直；其中所述隔离柱72沿所述第一电极条的延伸方向上具有呈倒梯形形状的横截面，所述横截面中每条侧边与第一电极层之间的锐角为45°-70°。在本发明中将隔离柱72设置为这种结构有利于对相应第二电极起到良好的分隔作用，而且不易倒塌，可有效防止相应第二电极与第一电极之间短路，或者相邻第二电极之间电性相连的问题。
进一步地，所述第一电极层中还包括多个绝缘条71，所述绝缘条71与所述隔离柱72一一对应地设置在所述隔离柱72的下方，所述绝缘条71将 所述第一电极条分离为沿所述第一电极条延伸方向分布的多个子第一电极。通过设置绝缘条71和隔离柱的双层结构能够更有效的将有机发光阵列层中像素与像素进行分离，以提高显示效果。其中绝缘条71可以采用聚酰亚胺材料制备；隔离柱72采用常规的隔离柱材料制备即可。
进一步地，所述第一电极层为阳极层、所述第二电极层为阴极层。
其中，有机发光阵列层中除了第一电极层、隔离柱72之外，还包括功能层和第二电极层，其中所述第一电极层中包括多条平行布置的第一电极条，所述隔离柱72为多个，相互平行的设置在所述第一电极层上，且隔离柱72的延伸方向与所述第一电极条的延伸方向相垂直，所述功能层形成在所述第一电极层上、并位于各所述隔离柱72之间，所述第二电极层形成在所述功能层之上，并位于各所述隔离柱72之间。优选情况下，所述隔离柱72远离第一电极层一侧的表面，高于第二电极层远离第一电极层一侧的表面。
其中，功能层包括有第二电极向第一电极方向依次叠置的可选的电子注入层、可选的电子传输层、可选的空穴阻挡层、发光层、可选的电子阻挡层、可选的空穴传输层、可选的空穴注入层。
封装层60连续的覆盖在有机发光阵列层(连续的覆盖在第二电极和阻隔层的表面)上，优选情况下，干燥剂层50充满封装层60与第二基板20之间的封闭腔体。
此外，封装环40的高度高于隔离柱的高度，即第一基板10与第二基板20之间的间距取决于封装环40的高度。
在该实施例中，第一基板10以及第二基板20可以是硬质基板，如玻 璃。第一基板10为玻璃基板，第二基板20为玻璃盖板。作为第一基板10以及第二基板20的可替换实施方式，可以是柔性基片。柔性基片可采用聚酯类、聚酰亚胺类化合物材料或者薄金属片制备。
在该实施例中，通过形成用于覆盖有机电致发光器件层的封装层60，能够对有机电致发光器件层形成封装，避免封装层60与第二基板20所形成的腔体内水氧对该有机发光阵列层的影响；此外，通过固化液态干燥剂的方法在封装层与第二基板之间形成用于阻隔外界环境和腔体内的水汽和氧气的凝胶态干燥剂层，对于干燥剂层的厚度没有要求，即能够在不增加该封装结构厚度的基础上，增加该封装结构的水氧阻隔能力。
需要说明的是，本实施例中的隔离柱不限于图3中所示的隔离柱，也可以为其他形状，只需保证隔离柱能够隔离相邻的有机发光二极管即可。
未在本实施例中详细描述的封装结构的结构细节，请参照实施例1，在此不再赘述。
实施例3
本发明实施例提供一种有机电致发光装置的制备方法，包括以下步骤：
步骤S11，在第一基板上制备有机发光阵列层，有机发光阵列层的结构参见前面的描述；
步骤S12，在第一基板上形成连续的覆盖有机发光阵列层裸露表面(远离所述第一基板一侧的表面)的封装层。
形成连续覆盖有机发光阵列层的远离第一基板表面的封装层60，该封装层60延伸至第一基板10表面，使其与第一基板10形成密闭腔体，将有机发光阵列层封装在该密闭腔体内。
步骤S13，在封装层上环绕有机发光阵列层的外周边缘设置封装环，以在所述封装层上形成以封装环为侧壁的干燥剂填充腔。
在封装层60上通过激光固化的玻璃浆料(frit)形成环绕有机发光阵列层的外周边缘的封装环40，形成以封装层60上表面为底面，以封装环40为侧壁的干燥剂填充腔。
步骤S14，在所述干燥剂填充腔中装入液态干燥剂层。
在所述干燥剂填充腔中装入液态干燥剂层，所涂覆的液体干燥剂用量可以根据后续形成的密闭腔体的体积计算，以使得液体干燥剂在固化过程中膨胀后能够完全填充在所述密闭腔体即可。
此外，在第一基板10或封装层60表面所形成的液态干燥剂的涂覆图形选自但不限于“回”字形，或“S”形。该形状的涂覆能够保证液态干燥剂层50完全填充密闭腔体的情况下，所需的液态干燥剂的量最少，从而达到节约成本的目的。
可选地，在第二基板20表面涂覆干燥剂层50时，可以按照有机发光阵列层的表面图形设置干燥剂层50的涂覆图形，以保证在后续的压合步骤中，干燥剂层50能够完全填充第二基板20与有机发光阵列层之间的腔体。
步骤S15，压合第二基板使得第二基板对所述干燥剂填充腔进行密闭，形成密闭腔体。
封装压合第二基板20，使得该第二基板20与封装环40顶面接触、且紧密贴合，进而实现第二基板20对所述干燥剂填充腔进行密闭，形成密闭腔体。
步骤S16，固化所述液态干燥剂，使其形成凝胶态干燥剂，并充满所述 密闭腔体。
对液态干燥剂进行固化处理，通过控制固化条件，使得液态干燥剂形成凝胶态干燥剂，并充满所述密封腔体。其中固化条件可以根据液态干燥剂固化反应的情况选择，以控制所形成的干燥剂的凝胶态与体积，在完全填充所述密闭腔体的同时，使得凝胶态的干燥剂的粘度在50000-800000mPa·s范围内。例如，当OleDry F型液态干燥剂的涂覆厚度为20至40μm之间时，可以在80℃下烘烤1小时，使得液态干燥剂达到完美的填充效果。
未在本实施例中详细描述的具体器件结构，请参照实施例1或实施例2，在此不再赘述。显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。

Claims (14)

  1. 一种封装结构，其中，所述封装结构包括：
    相对设置的第一基板和第二基板；
    待封装体，设置在所述第一基板和第二基板之间；
    封装层，形成在所述第一基板上、并连续的覆盖在所述待封装体的裸露表面；以及
    干燥剂层，夹设在所述封装层与所述第二基板之间，所述干燥剂层为凝胶态的干燥剂层。
  2. 根据权利要求1所述的封装结构，其中，所述干燥剂层中凝胶态的干燥剂的粘度为50000-800000mPa·s。
  3. 根据权利要求1所述的封装结构，其中，所述封装结构还包括环绕所述待封装体外周边缘设置的封装环，所述封装环设置在所述第一基板或所述封装层与所述第二基板之间围成密闭腔体，所述干燥剂层设置在所述密闭腔体内。
  4. 根据权利要求3所述的封装结构，其中，所述干燥剂层完全填充所述密闭腔体。
  5. 根据权利要求1至4中任一项所述的封装结构，其中，所述封装层为无机材料层。
  6. 根据权利要求1至4中任一项所述的封装结构，其中，所述封装层包括至少一层无机薄膜层。
  7. 根据权利要求6所述的封装结构，其中，各所述无机薄膜层分别独立地选自氮化硅薄膜或氧化硅薄膜。
  8. 根据权利要求1至4中任一项所述的封装结构，其中，所述封装层的厚度为0.5μm至3μm。
  9. 一种封装结构的制备方法，其中，所述方法包括：
    提供第一基板，所述第一基板的表面上形成有待封装体；
    在所述第一基板上形成连续的覆盖待封装体裸露表面的封装层；
    在所述第一基板或所述封装层上环绕所述待封装体的外周边缘设置封装环，以在所述封装层、以及可选的第一基板上形成以封装环为侧壁的干燥剂填充腔；
    在所述干燥剂填充腔中装入液态干燥剂；
    压合所述第二基板，使得所述第二基板对所述干燥剂填充腔进行密闭，形成密闭腔体；以及
    固化所述液态干燥剂，使其形成凝胶态干燥剂。
  10. 根据权利要求9所述的封装结构的制备方法，其中，所述凝胶态干燥剂充满所述密闭腔体。
  11. 根据权利要求9或10所述的封装结构的制备方法，其中，所述凝胶态的干燥剂的粘度为50000-800000mPa·s。
  12. 一种有机电致发光装置，其中，所述装置包括权利要求1至6中任一项所述的封装结构，所述待封装体为有机发光阵列层。
  13. 根据权利要求12所述的有机电致发光装置，其中，所述有机发光阵列层包括：第一电极层和设置在所述第一电极层上的隔离柱，所述第一电极层包括相互平行设置的多个第一电极条，所述隔离柱的延伸方向与所述第一显示电极的延伸方向垂直；其中所述隔离柱沿所述第一电极条的延 伸方向上具有呈倒梯形形状的横截面，所述横截面中每条侧边与第一电极层之间的锐角为45°-70°。
  14. 根据权利要求13所述的有机电致发光装置，其中，所述第一电极层中还包括多个绝缘条，所述绝缘条与所述隔离柱一一对应地设置在所述隔离柱的下方，所述绝缘条将所述第一电极条分离为沿所述第一电极条延伸方向分布的多个子第一电极。
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