WO2019218635A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2019218635A1
WO2019218635A1 PCT/CN2018/117516 CN2018117516W WO2019218635A1 WO 2019218635 A1 WO2019218635 A1 WO 2019218635A1 CN 2018117516 W CN2018117516 W CN 2018117516W WO 2019218635 A1 WO2019218635 A1 WO 2019218635A1
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WO
WIPO (PCT)
Prior art keywords
array substrate
display panel
organic light
substrate
mounting groove
Prior art date
Application number
PCT/CN2018/117516
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English (en)
French (fr)
Inventor
原莎
于锋
马应海
张峰
Original Assignee
云谷（固安）科技有限公司
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Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Priority to US16/340,383 priority Critical patent/US11289675B2/en
Publication of WO2019218635A1 publication Critical patent/WO2019218635A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present application relates to the field of display technologies, and in particular, to a display panel and a method of fabricating the same.
  • OLED Organic Light-Emitting Diode
  • OLED displays are easy to customize the appearance, more and more terminal manufacturers are applying them to full screen and borderless products.
  • full-screen and borderless products require a larger light-emitting area, in practical applications, it is usually necessary to provide a mounting slot on the organic light-emitting diode display to reserve a front camera or an earpiece on the terminal device. The location where the hardware is installed.
  • the packaging method of the OLED display device mainly includes a cover type package and a thin film package, wherein the thin film package realizes packaging of the OLED device through lamination of an organic thin film layer and an inorganic thin film layer, which is generally used for packaging of a flexible OLED display device.
  • the cover type package covers the cover glass to the organic light-emitting device
  • the package material of the package area is irradiated with high-energy laser light, and the package material is heated and melted and flows onto the base substrate, thereby realizing the cover glass and the lining. Bonding of the base substrate to achieve packaging.
  • the installation slot is usually opened by using a cutter wheel or a laser on the display panel after the package is completed.
  • a cutter wheel or a laser cutting process it is extremely easy to damage the organic light-emitting unit at the edge of the grooved area, and the display of the edge of the grooved area is abnormal and the sensing is poor.
  • a display panel and a method of fabricating the same are provided.
  • a method of fabricating a display panel comprising the following steps.
  • An array substrate is provided, the array substrate includes at least one mounting groove for providing a mounting space for the hardware structure, the mounting groove penetrating the array substrate in a direction perpendicular to the array substrate,
  • a package structure for packaging the organic light emitting unit is formed on one side of the array substrate, and the mounting groove is exposed.
  • the cutting and grooving is performed, which avoids display defects and poor sensing caused by damage of components at the edge of the mounting groove during the cutting process. , thereby improving the production yield of the display panel.
  • the step of forming the organic light emitting unit on the array substrate before forming the groove region is further included.
  • the support structure is supported on a side of the array substrate facing away from the organic light emitting unit, and is filled in the mounting groove.
  • the supporting structure includes a first supporting portion supported on a side of the array substrate facing away from the organic light emitting unit, and a second end connected to a side of the first supporting portion facing the array substrate Support,
  • the second support portion extends into and fills the mounting groove.
  • the encapsulating structure for encapsulating the organic light emitting unit is formed on one side of the array substrate, and the following steps are further included before the mounting slot is exposed.
  • the separating the support structure and the array substrate specifically includes the following steps.
  • the method further comprises the following steps.
  • the film layers of the carrier substrate, the base substrate, and the array substrate located at at least one predetermined region are removed to form the mounting grooves.
  • the removing the film layers of the carrier substrate, the substrate substrate, and the array substrate located at the at least one preset region to form the mounting groove specifically includes the following steps.
  • the mounting layer is formed by removing the film layers of the carrier substrate, the substrate substrate and the array substrate located in at least one predetermined region by an etching process.
  • the display panel is a flexible display panel
  • the packaging structure for packaging the organic light emitting unit is formed on one side of the array substrate, and the exposing the mounting slot specifically includes the following steps.
  • a thin film encapsulation layer covering the organic light emitting unit is formed on the array substrate except for the mounting groove region.
  • the display panel is a hard display panel
  • the package structure for encapsulating the organic light emitting unit is formed on one side of the array substrate, and the exposing the mounting slot specifically includes the following steps.
  • a sealant is disposed between the package cover and the array substrate, and the package cover and the array substrate are paired to form a sealed package space.
  • a through hole penetrating the mounting groove is formed in the package cover, and the through hole has a one-to-one correspondence with the mounting groove.
  • a display panel comprising:
  • the array substrate includes at least one mounting groove, and the mounting groove penetrates the array substrate in a direction perpendicular to the array substrate,
  • An organic light emitting unit disposed on a side of the array substrate except for a region of the mounting groove
  • the package structure is disposed on a side of the array substrate other than the mounting groove region for encapsulating the organic light emitting unit.
  • the array substrate includes, at least in turn, a carrier substrate, a substrate substrate, a thin film transistor, and an anode and a functional film layer, the functional film layer including at least a pixel defining layer, and the pixel defining layer includes a plurality of pixel defining openings.
  • the organic light-emitting unit comprises at least an organic light-emitting material layer and a cathode layer formed on the organic light-emitting material layer, and the organic light-emitting unit is correspondingly disposed in the plurality of pixel-defined openings.
  • the organic light emitting material layer comprises a conjugated polymer material.
  • the package structure comprises a thin film encapsulation layer.
  • the package structure includes a package cover, the package cover is opposite to the array substrate, and a sealant is disposed between the package substrate to form a sealed package space.
  • a through hole is defined in the package cover, and the through hole has a one-to-one correspondence with the mounting groove.
  • FIG. 1 is a flow chart of a method for fabricating a display panel according to an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view of a display panel in an embodiment in which an organic light emitting unit is not formed.
  • FIG. 3 is a schematic cross-sectional view of the display panel shown in FIG. 2 when forming an organic light emitting unit.
  • the display panel motherboard includes a motherboard body and a package structure disposed on the motherboard body.
  • the motherboard body has a plurality of display panels, and each of the display panels is provided with an OLED device.
  • the package structure includes a plurality of package structures in one-to-one correspondence with the plurality of display panels, each package structure for packaging the OLED device in the corresponding display panel.
  • a mounting groove is provided in a non-display area outside the effective display area. Since the area of the effective display area is limited in this way, the effect of "full screen” or “narrow border” cannot be achieved, and therefore, it is necessary to open a mounting groove in the display area.
  • the principle of laser cutting is to cut the film layer by thermal melting, and the packaging structure of the flexible display panel is a thin film encapsulation layer formed by an inorganic layer and an organic layer. Since the edge of the thin film encapsulation layer may be damaged by expansion or tear due to absorption of a large amount of heat, water vapor permeates from the side of the display panel, thereby destroying the organic light emitting unit, so that the display panel cannot achieve long-term excellent display performance.
  • high-energy laser irradiation generates high heat, so that the instantaneous temperature can reach 800 ° C ⁇ 1000 ° C, and static electricity is generated. This may cause damage to the organic layer, the functional layer, the metal cathode, and the like in the organic light-emitting unit.
  • the pressing and edging of the cutter wheel may cause the internal stress of the sealant to be released, which may cause the sealant to crack, and may even cause the package cover to peel off from the substrate, so that the water and oxygen
  • the organic light-emitting unit is invaded through the cracking channel, so that the organic light-emitting unit has black spots and bubbles, which eventually leads to device failure.
  • the cutting deviation is likely to be miscut, and the display of the edge of the mounting groove is poor and the sensing is poor.
  • the display panel provided by the embodiment of the present application is mainly applied to a full-screen or a borderless display panel, and may also be a display panel having a normal frame or a narrow frame.
  • FIG. 1 is a flow chart showing a method of fabricating a display panel in an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view showing a display panel in which an organic light emitting unit is not formed in an embodiment of the present application.
  • FIG. 3 is a cross-sectional view showing the display panel shown in FIG. 2 in which an organic light emitting unit is formed.
  • FIG. 1 is a flow chart showing a method of fabricating a display panel in an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view showing a display panel in which an organic light emitting unit is not formed in an embodiment of the present application.
  • FIG. 3 is a cross-sectional view showing the display panel shown in FIG. 2 in which an organic light emitting unit is formed.
  • an embodiment of the present application provides a method for fabricating a display panel, including the following steps.
  • step S110 an array substrate is provided.
  • the array substrate 10 includes at least one mounting groove (not shown) for providing a mounting space for the hardware structure.
  • the mounting groove penetrates the array substrate 10 in a direction perpendicular to the array substrate 10.
  • the array substrate that is, a TFT (Thin-film transistor) array substrate, refers to a carrier substrate (for example, a glass substrate) on which at least a functional film layer such as a base substrate, a TFT array, an anode, and a pixel defining layer is formed.
  • a carrier substrate for example, a glass substrate
  • a functional film layer such as a base substrate, a TFT array, an anode, and a pixel defining layer is formed.
  • the installation slot is an area for mounting the hardware structure.
  • the hardware structure comprises one or more of the following structures: a front camera, a start button, an earpiece or a speaker.
  • the specific installation method of the hardware structure is not limited herein.
  • the shape of the cut mounting groove is determined according to the hardware structure to be mounted, and different mounting holes may be provided for different hardware structures.
  • the mounting groove is parallel to the substrate.
  • the cross-sectional shape is one or more of the following shapes: circular, elliptical, rectangular, trapezoidal, diamond or square.
  • the array substrate 10 includes a carrier substrate 12, a substrate substrate 14 (for example, made of PI material) formed on the carrier substrate 12, a thin film transistor 16 disposed on the substrate substrate 14, and a setting The anode and functional film layer (not shown) on the thin film transistor 16.
  • the functional film layer includes at least a pixel defining layer, and the pixel defining layer includes a plurality of pixel defining openings (not shown) for setting the organic light emitting unit.
  • step S130 an organic light emitting unit is formed in an area on the array substrate 10 other than the mounting groove area.
  • the organic light emitting unit 19 includes at least an organic light emitting material layer and a cathode layer formed on the organic light emitting material layer.
  • the organic light emitting material layer may have a multilayer structure, for example, in addition to the light emitting layer, an electron transport layer and a hole transport layer for balancing electrons and holes, and for enhancing electrons and An electron injecting layer and a hole injecting layer in which holes are injected.
  • the array substrate 10 has a plurality of pixel regions, each of which may include a plurality of sub-pixel regions.
  • one pixel region may be a sub-pixel region that emits red light, a sub-pixel region that emits green light, and an emission.
  • the sub-pixel area of the blue light is formed.
  • the organic light emitting unit 19 is a pixel including a plurality of sub-pixels.
  • a precision metal mask can be used to vaporize the light-emitting layers emitting red, green, and blue light to corresponding sub-pixel regions.
  • the pixel defining layer has a plurality of pixel defining openings, each pixel defining opening is for defining a corresponding pixel, the pixel defining opening includes a plurality of sub-openings, and the corresponding sub-pixels are disposed in the corresponding sub-openings .
  • the organic light-emitting unit 19 is formed by vapor deposition at the pixel defining opening, and the organic light-emitting material is not evaporated in the grooved region.
  • Step S150 a package structure for encapsulating the organic light emitting unit is disposed on one side of the array substrate, and the mounting groove is exposed.
  • the package structure is disposed on a side of the array substrate 10 on which the organic light emitting unit 19 is formed, and the package structure can block air and moisture from the organic light emitting unit 19. It is easy to understand that since the organic light-emitting material is very sensitive to an external environment such as water vapor and oxygen, if the organic light-emitting material in the display panel is exposed to a water vapor or oxygen atmosphere, the performance of the display panel may be drastically reduced or completely damaged. By providing a package structure on the array substrate 10, the organic light-emitting unit 19 can be well protected, thereby improving the reliability of the display panel.
  • the method for fabricating the display panel performs cutting and grooving before evaporating the organic light-emitting unit 19 on the array substrate 10 to avoid damage to the organic light-emitting unit 19 during the cutting process, thereby improving the display panel. Production yield.
  • the evaporation and packaging of the organic unit are performed after the cutting and grooving, thereby preventing the package structure from being damaged by expansion or tear due to the absorption of a large amount of heat in the subsequent cutting process, thereby preventing the organic light-emitting unit 19 from being subjected to damage. Erosion of air or water vapor outside the enclosed space, thereby improving the display effect and service life of the display panel.
  • step S130 the following steps are further included before step S130.
  • step S120 the support structure is supported on a side of the array substrate facing away from the organic light emitting unit, and is filled in the mounting groove.
  • the support structure 18 includes a first support portion 182 supported on a side of the array substrate 10 facing away from the organic light emitting unit 19, and one end connected to a side of the first support portion 182 facing the array substrate 10
  • the second support portion 184 projects into and fills the mounting groove.
  • the array substrate 10 having the mounting grooves can be well supported, thereby improving the strength of the array substrate 10 after the grooves, thereby ensuring the production yield of the display panel.
  • the second support portion is avoided.
  • the 184 is displaced or even detached in the mounting groove, and the first supporting portion 182 can serve as a limiting fixing to ensure the relative fixing of the supporting structure 18 and the array substrate 10.
  • the first supporting portion 182 has a plate shape that abuts on a side of the carrier substrate 12 away from the substrate 14 .
  • the shape of the second support portion 184 matches the shape and size of the mounting groove.
  • the second support portion 184 extends from the side of the array substrate 10 facing away from the organic light emitting unit 19 and is filled in the mounting groove.
  • the length of the second supporting portion 184 extending in the vertical direction may be equal to the depth of the mounting groove, or may be unequal, but should be at least flush with the surface of the array substrate 10 on which the organic light emitting unit 19 is disposed. Thereby, the mounting groove is supported, and the vapor deposition of the organic light emitting unit is facilitated.
  • one end of the second supporting portion 184 away from the first supporting portion 182 protrudes from a side of the array substrate 10 on which the organic light emitting unit is disposed.
  • the organic light-emitting unit may be vapor-deposited along the periphery of the second support portion 184, thereby avoiding the evaporation failure of the organic light-emitting unit at the edge of the mounting groove.
  • the second support portion 184 may be fixedly coupled to the first support portion 182 or may be detachably coupled to the first support portion 182 .
  • the second support portion 184 can be bonded to the first support portion 182 by an adhesive.
  • the second support portion 184 may also be integrally formed with the first support portion 182, which is not limited herein.
  • the organic light emitting unit 19 may be evaporated along the circumference of the second supporting portion 184 during the evaporation of the organic light emitting unit 19, thereby avoiding organic light emission at the edge of the mounting groove.
  • the phenomenon that the unit 19 is poor in vapor deposition occurs.
  • the supporting structure 18 supports the side of the array substrate 10 facing away from the organic light emitting unit 19 and the circumferential direction of the mounting groove to ensure the strength of the display panel, thereby improving the reliability of the display panel. .
  • the subsequent process can be prevented.
  • the effect on the film layer at the edge of the mounting groove thereby improving the production yield of the display panel.
  • step S150 the following steps are further included before step S150.
  • step S140 the support structure 18 and the array substrate 10 are separated.
  • the support structure 18 can be separated from the array substrate 10 by mechanical peeling.
  • the first support portion 182 and the second support portion 184 may be separated from the array substrate 10, and the first support portion 182 and the second support portion 184 may be separated from the array substrate 10 separately.
  • the first support portion 182 is fixedly coupled to the second support portion 184, the first support portion 182 is separated from the side of the carrier substrate 12 facing away from the base substrate 12, and the second support can be The portion 184 is taken out of the mounting slot.
  • the first support portion 182 and the second support portion 184 are detachably connected, for example, by glue bonding, the first support portion 182 is lowered by heating when separated.
  • the adhesion between the first support portion 182 and the second support portion 184 is detachable from the second support portion 184, and the first support portion 182 and the second support portion 184 can be separated from the array substrate 10 separately. Thereby, damage to the array substrate 10 when the support structure 18 is separated from the array substrate 10 is reduced.
  • the second support portion 184 needs to be separated from the array substrate 10.
  • the organic light emitting unit 19 is formed by vapor deposition
  • only the second supporting portion 184 may be separated from the mounting groove, and after the display panel is completed, the first supporting portion 182 and the carrier substrate 12 are peeled off. . Thereby, the first support portion 182 can continue to support the array substrate 10 in a subsequent process, thereby improving the strength of the display panel.
  • the organic light-emitting material is a conjugated polymer material.
  • the conjugated polymer material has high elasticity, and has little influence on the structure of the organic light-emitting unit 19 in the process of removing the support structure.
  • the support structure may be mechanically separated, for example, the support structure is first pre-separated from the organic light-emitting material by a blade, and then an external force is applied to completely separate it. In this way, damage to the organic light emitting unit 19 can be more effectively reduced.
  • the first support portion 182 is supported (eg, bonded) on a side of the array substrate that faces away from the organic light emitting unit 19.
  • an adhesive may be applied on a corresponding area on the side of the carrier substrate 12 facing away from the base substrate 14, and then the second support portion 184 is placed in the mounting groove, and the first support portion 182 is bonded.
  • the glue is bonded to the carrier substrate 12.
  • the adhesive may be applied to the first support portion 182, which is not limited herein.
  • separating the support structure 18 from the array substrate 10 specifically includes the following steps.
  • step S132 the first supporting portion 182 and the array substrate 10 are heated to reduce the viscosity between the first supporting portion 182 and the side of the array substrate 10 facing away from the organic light emitting unit 19.
  • the first support portion 182 can be separated from the substrate from the carrier substrate 12 by mechanical peeling. One side of the substrate 14 is separated.
  • step S134 the first support portion 182 and the array substrate 10 are separated, and the second support portion 184 is detached from the mounting groove.
  • the second support portion 184 Since the second support portion 184 is connected to the first support portion 182, the second support portion 184 can be simultaneously separated from the mounting groove during the process of separating the first support portion 182 from the array substrate 10.
  • the support structure 18 can be fixed by the adhesive, and by heating the first support portion 182 and the array substrate 10, the viscosity between the two can be lowered, thereby making the support structure 18 separable from the array substrate 10.
  • the separation process is simple, the control is facilitated, and the yield of the display panel is improved.
  • the display panel is a flexible display panel
  • step S130 specifically includes the following steps.
  • a thin film encapsulation layer covering the organic light emitting unit 19 is formed on the array substrate 10 except for the mounting groove region.
  • a thin film encapsulation material may be used to form a thin film encapsulation layer on the array substrate 10 on which the organic light emitting unit 19 is evaporated, but the trench region is not encapsulated.
  • the thin film encapsulation layer is coated on the organic light emitting unit 19 to implement packaging of the organic light emitting unit 19.
  • the thin film encapsulation layer may be one or more layers, and may be an organic film layer or an inorganic film layer, or may be a laminated structure of an organic film layer and an inorganic film layer.
  • the thin film encapsulation layer may include two inorganic film layers and one organic film layer between the two inorganic film layers.
  • step S130 specifically includes the following steps.
  • a package cover is provided.
  • a sealant is disposed between the package cover and the array substrate 10, and the package cover is aligned with the array substrate 10 to form a sealed package space.
  • the sealant pattern can be printed on the package area of the array substrate 10, and then the package cover is aligned with the array substrate 10 so that the through holes on the package cover correspond to the mounting grooves. Then, the encapsulant is scanned by the laser to melt the encapsulant and package the package cover and the array substrate 10 to form a sealed package space, thereby protecting the organic light emitting unit 19. It can be understood that, in some other embodiments, the sealant pattern can be printed on the package area of the package cover, and then the box and the laser scanning and melting are performed, as long as the package cover is adhered to the array substrate 10. The purpose of the package can be.
  • a through hole communicating with the mounting groove is formed in the package cover, and the through hole has a one-to-one correspondence with the mounting groove.
  • a through hole corresponding to the mounting groove can be cut on the package cover by a laser or a cutter wheel to reveal the mounting groove. It is to be understood that, in some embodiments, a through hole corresponding to the mounting slot may be formed in the package cover before the package cover and the array substrate 10 are aligned with each other.
  • the method further includes the following steps.
  • step S112 a carrier substrate 12 is provided.
  • the carrier substrate 12 may be a glass substrate.
  • step S114 the base substrate 14 is formed on the carrier substrate 12.
  • the base substrate 14 is formed on the carrier substrate 12.
  • the base substrate 14 is a flexible substrate, optionally formed of an organic polymer, silicon nitride, and silicon oxide.
  • the organic polymer may be a polyimide substrate, a polyamide substrate, a polycarbonate substrate, or a polyphenylene ether.
  • the base substrate 14 can be obtained by curing the polyimide after coating the polyimide glue on the carrier substrate 12.
  • step S116 the thin film transistor 16, the anode, and the functional film layer are sequentially formed on the base substrate 14.
  • the thin film transistor 16 is formed on the base substrate 14.
  • an additional layer such as a buffer layer may be formed on the substrate substrate 14 prior to forming the thin film transistor 16.
  • the buffer layer may be formed on the entire surface of the base substrate 14, or may be formed by patterning.
  • the buffer layer may have a suitable material including a material such as PET, PEN polyacrylate, and/or polyimide to form a layered structure in a single layer or a multilayer stack.
  • the buffer layer may also be formed of silicon oxide or silicon nitride, or may comprise a composite layer of an organic material layer and/or an inorganic material.
  • the thin film transistor 16 can control the emission of each sub-pixel or can control the amount of emission each sub-pixel emits.
  • the thin film transistor 16 may include a semiconductor layer, a gate electrode, a source electrode, and a drain electrode.
  • the semiconductor layer may be formed of an amorphous silicon layer, a metal oxide or a polysilicon layer, or may be formed of an organic semiconductor material.
  • the semiconductor layer includes a channel region and a source and drain region doped with dopants.
  • the semiconductor layer may be covered with a gate insulating layer, and the gate electrode may be disposed on the gate insulating layer.
  • the gate insulating layer may cover the entire surface of the base substrate 14.
  • the gate insulating layer can be formed by patterning.
  • the gate insulating layer may be formed of silicon oxide, silicon nitride, or other insulating organic or inorganic material in consideration of adhesion to an adjacent layer, formability of a stacked target layer, and surface flatness.
  • the gate electrode may be covered by an interlayer insulating layer formed of silicon oxide, silicon nitride, and/or other suitable insulating organic or inorganic materials. A portion of the gate insulating layer and the interlayer insulating layer may be removed, and a contact hole is formed after the removal to expose a predetermined region of the semiconductor layer.
  • the source electrode and the drain electrode may contact the semiconductor layer via the contact hole.
  • thin film transistor 16 Since the thin film transistor 16 has a complicated layer structure, its top surface may be uneven.
  • thin film transistor 16 also includes a planarization layer to form a sufficiently flat top surface. After the planarization layer is formed, a via hole may be formed in the planarization layer to expose the source and drain electrodes of the thin film transistor 16.
  • the functional film layer includes a pixel defining layer.
  • the anode is a pixel electrode, wherein the pixel electrode includes a sub-pixel electrode corresponding to the sub-pixel region, and the plurality of sub-pixel electrodes are formed on the planarization layer. It will be readily understood that a plurality of sub-pixel electrodes are electrically connected to the thin film transistor 16 through the aforementioned via holes, where the sub-pixel electrodes are generally referred to as anodes.
  • the pixel defining layer covers a plurality of sub-pixel electrodes having corresponding sub-pixel openings for defining sub-pixels, for example, the pixel defining layer may be made of a suitable organic material such as polyacrylate, polyimide, or the like or including a suitable inorganic A single material layer of material or a conforming material layer is formed. Specifically, in an embodiment, the pixel defining layer may expose a central portion of each sub-pixel electrode by a patterning process.
  • Step S118 removing the film layers of the carrier substrate 12, the substrate substrate 14, and the array substrate 10 located at at least one predetermined region to form a mounting groove.
  • the preset area can be selected first.
  • the shape of the preset area is the same as the shape of the mounting groove, and the graphic size of the preset area is consistent with the graphic size of the mounting groove. Then, the carrier substrate 12, the substrate substrate 14, and the respective film layers are cut along the boundary line of the predetermined region, thereby forming the aforementioned mounting grooves.
  • the carrier substrate 12, the substrate substrate 14, and the film layers of the predetermined region may be cut off by a cutter wheel cutting process or a laser cutting process.
  • a cutter wheel cutting process or a laser cutting process.
  • other processes may be employed.
  • the removing the film layers of the carrier substrate 12, the substrate substrate 14, and the array substrate 10 located at the at least one predetermined region to form the mounting trenches specifically includes the following steps.
  • the film layers of the carrier substrate 12, the substrate substrate 14, and the array substrate 10 located in at least one predetermined region are removed by an etching process to form the mounting grooves.
  • the etching process can further reduce the damage to the organic light emitting unit 19 during the cutting process, and further improve the production yield of the display panel.
  • the present application further provides a display panel formed by the method for fabricating the display panel in the above embodiment.
  • the display panel includes an array substrate 10, an organic light emitting unit 19 formed on the array substrate 10, and a package structure for packaging the organic light emitting unit 19.
  • the display panel also includes at least one mounting slot for providing installation space for the hardware structure. The mounting groove penetrates the display panel in a direction perpendicular to the array substrate 10.
  • the display panel may be a panel after the carrier substrate 12 is peeled off, or may be a panel that retains the carrier substrate 12 .
  • an embodiment of the present application further provides a display device.
  • the display device can be a display terminal, such as a tablet computer, and in other embodiments, the display device can also be a mobile communication terminal, such as a mobile phone terminal.
  • the display device includes a display panel and a control unit for transmitting display signals to the display panel.
  • the method for fabricating the display panel provided by the embodiment of the present invention performs cutting and grooving before evaporating the organic light-emitting unit 19 on the array substrate 10 to avoid damage to the organic light-emitting unit 19 during the cutting process. Thereby improving the production yield of the display panel.
  • the evaporation and packaging of the organic unit are performed after cutting and grooving, thereby preventing the package structure from being damaged by expansion or tear due to absorption of a large amount of heat in the subsequent cutting process, thereby preventing the organic light-emitting unit 19 from being subjected to damage. Erosion of air or water vapor outside the enclosed space, thereby improving the display effect and service life of the display panel.
  • the organic light emitting unit 19 can be evaporated along the circumference of the second supporting portion 184 during the evaporation of the organic light emitting unit 19, thereby avoiding the mounting groove.
  • the edge organic light emitting unit 19 is poor in vapor deposition.
  • the supporting structure 18 supports the side of the array substrate 10 facing away from the organic light emitting unit 19 and the circumferential direction of the mounting groove, the strength of the display panel is ensured, thereby improving the reliability of the display panel. Sex.

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Abstract

本申请涉及一种显示面板的制作方法，包括：提供一阵列基板，阵列基板包括至少一个用于为硬件结构提供安装空间的安装槽，所述安装槽在垂直于所述阵列基板的方向上贯穿所述阵列基板，在阵列基板一侧设置用于对有机发光单元封装的封装结构，并显露安装槽。如此，在阵列基板上蒸镀有机发光单元之前，即进行切割以开槽，从而避免出现在切割过程中由于安装槽边缘的元件的损伤引起的显示不良及传感不良，提高了显示面板的生产良率。还提供一种显示面板。

Description

显示面板及其制作方法
援引加入
本申请要求将于2018年05月14日提交中国专利局、申请号为201810457249.3、发明名称为“显示面板及其制作方法”的中国专利申请的优先权，其全部内容通过引用并入在本申请中。
技术领域
本申请涉及显示技术领域，特别是涉及一种显示面板及其制作方法。
背景技术
近年来，随着智能终端设备和可穿戴设备的技术发展，对于平板显示的需求变得越来越多样化，诸如OLED(Organic Light-Emitting Diode，OLED)有机发光二极管显示器，其相比液晶显示屏省去了较为耗能的背光模组，具有自发光性能，因此，具有更好的节能性的优点。另外，OLED显示器由于相较于传统的平板显示器，具有可弯曲、柔韧性佳等优点而被广泛应用于手机、平板电脑等智能终端产品中。
由于OLED显示器便于对外观进行定制化，使得越来越多的终端厂商将其应用到全面屏和无边框产品中。然而，由于全面屏和无边框产品需要更大的发光面积，因此，在实际应用过程中，通常需要在有机发光二极管显示器上设置安装槽，用以在终端设备上预留前置摄像头或听筒等硬件的安装位置。
OLED显示器件的封装方式主要有盖板式封装和薄膜封装，其中薄膜封装是通过有机薄膜层及无机薄膜层的层叠来实现OLED器件的封装，其通常用于柔性OLED显示器件的封装。盖板式封装是将盖板玻璃覆盖在有机发光器件上之后，利用高能量的激光照射封装区的封装材料，使封装材料受热后熔融并流动至衬底基板上，从而实现盖板玻璃和衬底基板的粘合，进而实现封装。
安装槽的开设通常是通过在封装完成后的显示面板上利用刀轮或激光进行 切割开槽。但是，无论是刀轮切割还是激光切割工艺，都极易由于破坏开槽区域边缘的有机发光单元等而造成损伤，进而使开槽区域边缘的显示异常及传感不良。
发明内容
根据本申请公开的各种实施例，提供一种显示面板及其制作方法。
一种显示面板的制作方法，所述方法包括以下步骤。
提供一阵列基板，阵列基板包括至少一个用于为硬件结构提供安装空间的安装槽，所述安装槽在垂直于所述阵列基板的方向上贯穿所述阵列基板，
在阵列基板上除安装槽区域外形成有机发光单元，
在阵列基板一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽。
通过上述的显示面板的制作方法，在阵列基板上蒸镀有机发光单元之前，进行切割开槽，其避免了出现在切割过程中由于安装槽边缘的元件的损伤所引起的显示不良及传感不良，从而提高了显示面板的生产良率。
可选地，所述在阵列基板上除安装槽区域外形成有机发光单元之前还包括以下步骤。
将支撑结构支撑于所述阵列基板的背离所述有机发光单元的一侧上，且填充于所述安装槽内。
可选地，所述支撑结构包括支撑于所述阵列基板的背离所述有机发光单元一侧的第一支撑部，以及一端连接于所述第一支撑部朝向所述阵列基板一侧的第二支撑部，
所述第二支撑部伸入并填充于所述安装槽。
可选地，所述在阵列基板一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽之前还包括以下步骤。
分离所述支撑结构与所述阵列基板。
可选地，所述分离所述支撑结构与所述阵列基板具体包括以下步骤。
加热所述第一支撑部与所述阵列基板，以降低所述第一支撑部与所述阵列 基板背离所述有机发光单元一侧之间的粘性，
分离所述第一支撑部与所述阵列基板，使所述第二支撑部从所述安装槽脱离。
可选地，所述方法还包括以下步骤。
提供承载基板，
在所述承载基板上形成衬底基板，
在所述衬底基板上依次形成薄膜晶体管、阳极及功能膜层，
去除位于至少一个预设区域处的承载基板、衬底基板及阵列基板的各膜层，形成所述安装槽。
可选地，所述去除位于至少一个预设区域处的承载基板、衬底基板及阵列基板的各膜层，以形成所述安装槽具体包括以下步骤。
采用蚀刻工艺，去除位于至少一个预设区域的承载基板、衬底基板及阵列基板的各膜层，形成所述安装槽。
可选地，所述显示面板为柔性显示面板，所述在阵列基板一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽具体包括以下步骤。
在所述阵列基板上除安装槽区域外形成一层覆盖所述有机发光单元的薄膜封装层。
可选地，所述显示面板为硬屏显示面板，所述在阵列基板一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽具体包括以下步骤。
提供封装盖板，
在所述封装盖板及所述阵列基板之间设置封框胶，并将封装盖板与阵列基板对盒，以形成一密闭封装空间，
在封装盖板开设贯通所述安装槽的通孔，所述通孔与所述安装槽一一对应。
一种显示面板，，包括：
阵列基板，包括至少一个安装槽，所述安装槽在垂直于所述阵列基板的方向上贯穿阵列基板，
有机发光单元，设置在所述阵列基板的一侧上除安装槽区域外的区域内，
封装结构，设置在所述阵列基板一侧的除所述安装槽区域外的区域上，用 于对所述有机发光单元封装。
所述阵列基板至少依次包括承载基板、衬底基板、薄膜晶体管、以及阳极和功能膜层，所述功能膜层至少包括像素限定层，所述像素限定层包括多个像素定义开口。
可选地，所述有机放光单元至少包括有机发光材料层及形成于所述有机发光材料层上的阴极层，所述有机放光单元对应地设置于所述多个像素定义开口内。
可选地，其中所述有机发光材料层包括共轭高分子材料。
可选地，所述封装结构包括薄膜封装层。
可选地，所述封装结构包括封装盖板，所述封装盖板与所述阵列基板对盒，并且与所述封装基板之间设置有封框胶，以形成以密闭封装空间，在所述封装盖板上开设有通孔，所述通孔与所述安装槽一一对应。
附图说明
图1为本申请一实施例中的显示面板的制作方法的流程框图。
图2为本申请一实施例中的显示面板在未形成有机发光单元时的剖面示意图。
图3为图2中所示的显示面板在形成有机发光单元时的剖面示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，但并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
在显示面板的生产制造中，为了降低制造成本并形成大规模批量化的生产，一般是在一张较大的显示面板母板上制作多个显示面板，然后通过切割工序，将较大的显示面板母板切割为若干个单独的显示面板。一般地，显示面板母板包括母板主体及设置于母板主体上的封装结构。母板主体具有多个显示面板， 每个显示面板中设置有OLED器件。封装结构包括与多个显示面板一一对应的多个封装结构，每个封装结构用于对相应的显示面板中的OLED器件进行封装。
在显示面板的边框越来越窄的发展趋势下，在显示面板母板上的切割线位置与显示元件封装边界之间的距离逐渐缩窄。此外，在实际应用过程中，通常需要在显示面板上设置安装槽，用以在终端设备上预留前置摄像头、听筒、起始键或扬声器等硬件的安装位置。一般是在有效显示区域外的非显示区域内设置安装槽。由于这样限制了有效显示区域的面积，导致无法达到“全面屏”或“窄边框”的效果，因此，需要在显示区域内开设安装槽。
以开槽工艺中的激光切割为例，激光切割的原理是通过热融化将膜层切开，而柔性显示面板的封装结构为无机层及有机层形成的薄膜封装层。由于薄膜封装层的边缘可能因为吸收了大量热而出现膨胀或撕裂等损伤，导致水汽从显示面板侧边渗透，从而破坏有机发光单元，使显示面板无法实现长期优良的显示性能。另外，在采用激光切割时，高能量的激光照射会发生较高的热量，使得瞬间温度可以达到800℃～1000℃，并产生静电。这可能对有机发光单元中的有机层、功能层及金属阴极等造成损伤。
以开槽工艺中的刀轮切割为例，刀轮的按压和磨边易引起封框胶内部应力释放，其可能导致封框胶开裂，甚至还可能导致封装盖板与基板剥离，使水氧经开裂通道侵入有机发光单元，从而使有机发光单元出现黑点和气泡，进而最终导致器件失效。此外，在刀轮切割时，由于刀轮的磨边量有限，因此容易发生切割偏差发生误切，造成安装槽的边缘的显示不良及传感不良。
因此，需要提供一种能够避免在显示面板开槽过程中所造成的显示异常及传感不良的显示面板及其制作方法。
可以理解的是，本申请实施例提供的显示面板主要是应用于全面屏或无边框的显示面板，当然也可以是具有普通边框或者窄边框的显示面板。
图1示出了本申请一实施例中的显示面板的制作方法的流程框图。图2示出了本申请一实施例中的显示面板未形成有机发光单元的剖面示意图。图3示出了图2中所示的显示面板形成有有机发光单元的剖面示意图。为了便于说明，在上述附图中仅示出了与本申请实施例相关的部分的结构。
参阅图1，本申请一实施例提供了一种显示面板的制作方法，包括以下步骤。
步骤S110，提供一阵列基板。
请参阅图2，阵列基板10包括至少一个用于为硬件结构提供安装空间的安装槽(图未标)，安装槽在垂直于阵列基板10的方向上贯穿阵列基板10。
阵列基板，即TFT(Thin-film transistor，薄膜晶体管)阵列基板，是指至少形成有衬底基板、TFT阵列、阳极，以及像素定义层等功能膜层的承载基板(例如，玻璃基板)。
安装槽，是用来安装硬件结构的区域，为了方便说明，本申请命名其为安装槽，但该名称并不限定本申请，因此也可以根据需要修改为其它名称，例如，通孔、凹槽、安装孔等。较佳地，硬件结构包括下列结构中的一种或多种：前置摄像头、起始键、听筒或扬声器。硬件结构的具体安装方式，在此不做限定。另外，在形成安装槽时，根据需要安装的硬件结构决定切割的安装槽的形状，针对不同的硬件结构，可以设置不同形状的安装槽，较佳的，安装槽在平行于衬底基板方向上的截面形状为下列形状中的一种或多种：圆形、椭圆形、矩形、梯形、菱形或正方形。
以柔性显示面板为例，阵列基板10包括承载基板12、形成于承载基板12上的衬底基板14(例如，由PI材料制成)、设置于衬底基板14上的薄膜晶体管16，以及设置于薄膜晶体管16上的阳极和功能膜层(图未示)。功能膜层至少包括像素限定层，像素限定层包括多个像素定义开口(图未示)，像素定义开口用于设置有机发光单元。
步骤S130，在阵列基板10上的除安装槽区域外的区域内形成有机发光单元。
请参阅图3，有机发光单元19至少包括有机发光材料层及形成有机发光材料层上的阴极层。在一些实施例中，有机发光材料层可以具有多层结构，例如，除了发光层之外，还可以包括用于平衡电子和空穴的电子传输层和空穴传输层，以及用于增强电子和空穴的注入的电子注入层和空穴注入层。
阵列基板10具有多个像素区域，每个像素区域可包括多个子像素区域，例如，在一些实施例中，一个像素区域可以由发射红光的子像素区域、发射绿光 的子像素区域及发射蓝光的子像素区域构成。有机发光单元19为一个像素，其包括多个子像素。在具体制作过程中，可以使用精密金属掩膜板来蒸镀发射红光、绿光及蓝光的发光层至对应的子像素区域上。
具体地，在一些实施例中，像素限定层具有多个像素定义开口，每个像素定义开口用于限定对应的像素，像素定义开口包括多个子开口，对应的子像素设置于对应的子开口中。在具体制作时，通过在像素定义开口进行蒸镀来形成有机发光单元19，而在开槽区内不蒸镀有机发光材料。
步骤S150，在阵列基板一侧设置用于对有机发光单元封装的封装结构，并显露安装槽。
封装结构设于阵列基板10的形成有有机发光单元19的一侧上，封装结构能够为有机发光单元19阻挡空气及水汽。容易理解的是，由于有机发光材料对水汽和氧气等外部环境十分敏感，如果将显示面板中的有机发光材料暴露在有水汽或氧气的环境中，会造成显示面板的性能急剧下降或者完全损坏。通过在阵列基板10上设置封装结构，可对有机发光单元19进行良好的保护，从而提高显示面板的可靠性。
本申请实施例提供的显示面板的制作方法，在阵列基板10上蒸镀有机发光单元19之前，即进行切割开槽，以避免在切割过程中对有机发光单元19造成损伤，从而提高了显示面板的生产良率。此外，在切割开槽后再进行有机单元的蒸镀及封装，避免了封装结构在后续的切割工艺中由于其边缘吸收了大量热而出现膨胀或撕裂等损伤，从而防止有机发光单元19受到封闭空间以外的空气或水蒸气的侵蚀，进而提高显示面板的显示效果及使用寿命。
在本申请一些实施例中，步骤S130之前还包括以下步骤。
步骤S120，将支撑结构支撑于阵列基板的背离有机发光单元的一侧，且填充于安装槽中。
在一些实施例中，支撑结构18包括支撑于阵列基板10的背离有机发光单元19的一侧上的第一支撑部182，以及一端连接于第一支撑部182的朝向阵列基板10的一侧的第二支撑部184。第二支撑部184伸入并填充于安装槽中。这样，可以对开设有安装槽的阵列基板10进行良好的支撑，从而提高开槽后的阵 列基板10的强度，进而保证显示面板的生产良率。容易理解的是，由于在蒸镀有机发光单元的过程中，薄膜晶体管16、阳极层及功能膜层等位于承载基板12的背离第一支撑部182的一侧上，因此为避免第二支撑部184在安装槽内发生位移，甚至脱落，第一支撑部182可起到限位固定作用，保证支撑结构18与阵列基板10的相对固定。
具体地，在实施例中，该第一支撑部182呈板状，其紧抵于承载基板12的远离衬底基板14的一侧上。第二支撑部184的形状与安装槽的形状、大小相匹配。第二支撑部184从阵列基板10的背离有机发光单元19的一侧伸入并填充于安装槽内。
第二支撑部184纵向(图2中的垂直上下方向)延伸的长度可与安装槽的深度相等，亦可不等，但应当与阵列基板10设有有机发光单元19的一侧表面至少平齐，从而对安装槽起到支撑作用，且便于有机发光单元的蒸镀形成。作为优选的实施例，第二支撑部184远离第一支撑部182的一端从阵列基板10设有有机发光单元的一侧伸出。由此，在蒸镀有机发光单元的过程中，有机发光单元沿第二支撑部184的周缘蒸镀即可，从而避免出现安装槽边缘的有机发光单元蒸镀不良。
第二支撑部184可固定地连接于第一支撑部182，亦可可拆卸地连接于第一支撑部182。例如，在一些实施例中，第二支撑部184可通过粘结胶粘结于第一支撑部182。在另一些实施例中，第二支撑部184也可以与第一支撑部182一体成型，在此不作限定。
由于第二支撑部184填充于安装槽内，因此在蒸镀有机发光单元19的过程中，有机发光单元19沿第二支撑部184的周缘蒸镀即可，从而避免出现安装槽边缘的有机发光单元19蒸镀不良的现象发生。此外，在显示面板的制作过程中，支撑结构18对阵列基板10的背离有机发光单元19的一侧及安装槽的周向进行支撑，以保证显示面板的强度，从而提高了显示面板的可靠性。
此外，通过在形成有机发光单元之前将第一支撑部182支撑于阵列基板10的背离有机发光单元19的一侧上，并且第二支撑部184伸入并填充于安装槽内，可以防止后续工艺中对安装槽边缘的膜层的影响，进而提高显示面板的生产良 率。
本申请一些实施例中，步骤S150之前还包括以下步骤。
步骤S140，分离支撑结构18与阵列基板10。
在完成有机发光单元19的蒸镀后，可通过机械剥离的方式，将支撑结构18与阵列基板10分离。在具体实施时，可将第一支撑部182与第二支撑部184一起与阵列基板10分离，亦可将第一支撑部182和第二支撑部184与阵列基板10单独分离。
在一些实施例中，如果第一支撑部182与第二支撑部184固定连接时，则将第一支撑部182从承载基板12的背离衬底基板12的一侧分离，并可将第二支撑部184从安装槽内带出。在另一些实施例中，如果第一支撑部182与第二支撑部184为可拆卸地连接时，例如通过胶水粘结为一体，则在分离时通过采用加热的方式来降低第一支撑部182与第二支撑部184之间的粘性，从而使第一支撑部182与第二支撑部184之间可脱离，进而可将第一支撑部182和第二支撑部184与阵列基板10单独分离。由此，降低了在支撑结构18与阵列基板10分离时，可能对阵列基板10造成的损伤。
将第一支撑部182与第二支撑部184分离时，至少需要将第二支撑部184与阵列基板10分离。作为一种优选的实施例，在蒸镀形成有机发光单元19之后，可仅将第二支撑部184从安装槽分离，等显示面板制作完成后，再将第一支撑部182与承载基板12剥离。由此，第一支撑部182可在后续工艺中对阵列基板10继续进行支撑，从而提高显示面板的强度。
有机发光材料为共轭高分子材料。共轭高分子材料具有高弹性，在去除支撑结构的过程中，对有机发光单元19的结构影响较小。此外，当蒸镀完成后，可以通过机械方式分离支撑结构，例如，首先通过刀片使得支撑结构与有机发光材料预分离，然后施加外力使其完全分离。如此，能够更加有效地降低对有机发光单元19的损伤。
在本申请的一些实施例中，第一支撑部182支撑(例如，粘接)于阵列基板的背离有机发光单元19的一侧上。具体地，可以在承载基板12的背离衬底基板14的一侧上的对应区域涂设粘结胶，然后将第二支撑部184置于安装槽内， 并使第一支撑部182通过粘结胶粘结于承载基板12上。由此，可以对支撑结构18进行固定，从而防止支撑结构18相对阵列基板10产生位移，进一步保证支撑结构18对阵列基板10的支撑，以提高显示面板的可靠性。
当然，在其他一些实施例中，亦可在第一支撑部182上涂设粘结胶，在此不作限定。
在本申请的一些实施例中，分离支撑结构18与阵列基板10具体包括以下步骤。
步骤S132，加热第一支撑部182与阵列基板10，以降低第一支撑部182与阵列基板10的背离有机发光单元19的一侧之间的粘性。
具体地，当第一支撑部182与阵列基板10之间的粘结胶的粘结度在加热后降低时，则可通过机械剥离的方式将第一支撑部182从承载基板12的背离衬底基板14的一侧分离。
步骤S134，分离第一支撑部182与阵列基板10，使第二支撑部184从安装槽脱离。
由于第二支撑部184连接于第一支撑部182，因此在将第一支撑部182与阵列基板10分离的过程中，可同时将第二支撑部184从安装槽分离。
如此，通过粘结胶可以对支撑结构18进行固定，且通过加热第一支撑部182与阵列基板10，可使两者之间的粘性降低，从而使支撑结构18与阵列基板10可分离。由此，在防止支撑结构18相对阵列基板10产生位移的同时，使分离工艺简单，便于控制，提高显示面板制作的良率。
在本申请一些实施例中，显示面板为柔性显示面板，步骤S130具体包括以下步骤。
在阵列基板10上除安装槽区域外形成一层覆盖有机发光单元19的薄膜封装层。
在具体实施时，可采用薄膜封装材料在蒸镀完有机发光单元19的阵列基板10上形成薄膜封装层，但开槽区不进行封装。该薄膜封装层包覆于有机发光单元19上，从而实现对有机发光单元19的封装。
薄膜封装层可以是一层或多层结构，并且可以是有机膜层或无机膜层、或 者可以是有机膜层和无机膜层的叠层结构。例如，作为优选地实施方式，薄膜封装层可包括两层无机膜层及一层位于两层无机膜层之间的有机膜层。
在另一些实施例中，显示面板为硬屏显示面板，并且步骤S130具体包括以下步骤。
提供一封装盖板。
在封装盖板及阵列基板10之间设置封框胶，并将封装盖板与阵列基板10对盒，以形成一密闭封装空间。
可在阵列基板10的封装区域上印刷封框胶图案，然后将封装盖板与阵列基板10对盒，使封装盖板上的通孔与安装槽相对应。接着利用激光扫描封装胶图案，使封装胶熔融进而将封装盖板与阵列基板10封装在一起，并形成密闭封装空间，从而对有机发光单元19进行保护。可以理解的是，在其他一些实施例中，亦可在封装盖板的封装区域上印刷封框胶图案，然后再进行对盒及激光扫描熔融，只要能实现使封装盖板与阵列基板10粘合封装的目的即可。
在封装盖板开设连通安装槽的通孔，通孔与安装槽一一对应。
可利用激光或刀轮切在封装盖板上切割出与安装槽相对应的通孔，从而显露出该安装槽。可以理解的是，在一些实施例中，也可在封装盖板与阵列基板10对盒之前，在封装盖板上开设与安装槽相对应的通孔，在此不作限定。
在本申请一些实施例中，该方法还包括以下步骤。
步骤S112，提供一承载基板12。
具体地，该承载基板12可以为玻璃基板。
步骤S114，在承载基板12上形成衬底基板14。
以柔性显示面板为例，衬底基板14形成于承载基板12上。衬底基板14为可弯曲基板，可选地为有机聚合物、氮化硅及氧化硅形成，例如，有机聚合物可以为聚酰亚胺基板、聚酰胺基板、聚碳酸酯基板、聚苯醚砜基板等中的一种。在一些实施例中，衬底基板14可通过在承载基板12上涂覆聚酰亚胺胶液之后对聚酰亚胺进行固化得到。
步骤S116，在衬底基板14上依次形成薄膜晶体管16、阳极及功能膜层。
薄膜晶体管16形成于衬底基板14上。在一些实施例中，可以在形成薄膜 晶体管16之前，在衬底基板14上形成诸如缓冲层的另外的层。缓冲层可以形成在衬底基板14整个表面上，也可以通过图案化来形成。
缓冲层可以具有包括PET、PEN聚丙烯酸酯和/或聚酰亚胺等材料中合适的材料，以单层或多层堆叠的形式形成层状结构。缓冲层还可以由氧化硅或氮化硅形成，或者可以包括有机材料层和/或无机材料的复合层。
薄膜晶体管16可以控制每个子像素的发射，或者可以控制每个子像素发射时发射的量。薄膜晶体管16可以包括半导体层、栅电极、源电极和漏电极。半导体层可以由非晶硅层、金属氧化物或多晶硅层形成，或者可以由有机半导体材料形成。在一些实施例中，半导体层包括沟道区和掺杂有掺杂剂的源区和漏区。
可以利用栅极绝缘层覆盖半导体层，栅电极可以设置在栅极绝缘层上。大体上，栅极绝缘层可以覆盖衬底基板14的整个表面。一些实施例中，可以通过图案化形成栅极绝缘层。考虑到与相邻层的粘合、堆叠目标层的可成形性和表面平整性，栅极绝缘层可以由氧化硅、氮化硅或其他绝缘有机或无机材料形成。栅电极可以被由氧化硅、氮化硅和/或其他合适的绝缘有机或无机材料形成的层间绝缘层覆盖。可以去除栅极绝缘层和层间绝缘层的一部分，并且在去除之后形成接触孔以暴露半导体层的预定区域。源电极和漏电极可以经由接触孔接触半导体层。
由于薄膜晶体管16具有复杂的层结构，因此，其顶表面可能是不平坦的。在一些实施例中，薄膜晶体管16还包括平坦化层，以形成足够平坦的顶表面。在形成平坦化层之后，可以在平坦化层中形成通孔，以暴露薄膜晶体管16的源电极和漏电极。
在一些实施例中，功能膜层包括像素限定层。阳极为像素电极，其中像素电极包括与子像素区域对应的子像素电极，多个子像素电极形成于平坦化层上。容易理解的是，多个子像素电极通过前述的通孔电连接到薄膜晶体管16，这里子像素电极通常被称为阳极。像素限定层覆盖多个子像素电极，具有对应的子像素开口以用于限定子像素，例如，像素限定层可以由诸如聚丙烯酸酯、聚酰亚胺等材料中合适的有机材料或包括合适的无机材料的单一材料层或符合材料 层形成。具体地，在实施例中，像素限定层可以通过图案化处理暴露各子像素电极的中心部分。
步骤S118，去除位于至少一个预设区域处的承载基板12、衬底基板14及阵列基板10的各膜层，形成安装槽。
例如，可首先选定预设区域。预设区域的形状与安装槽的形状相同，且预设区域的图形尺寸与安装槽的图形尺寸相一致。然后沿着预设区域的边界线切割承载基板12、衬底基板14及前述的各膜层，从而形成前述的安装槽。
可采用刀轮切割工艺或激光切割工艺对预设区域的承载基板12、衬底基板14及各膜层进行切除。当然，在其他一些实施例中，亦可采取其他工艺。例如，在另一些实施例中，所述去除位于至少一个预设区域处的承载基板12、衬底基板14及阵列基板10的各膜层，以形成安装槽具体包括以下步骤。
采用蚀刻工艺，去除位于至少一个预设区域的承载基板12、衬底基板14及阵列基板10的各膜层，以形成所述安装槽。
这样，采用蚀刻工艺，可进一步降低切割过程中对有机发光单元19的损坏，进一步提高了显示面板的生产良率。
基于上述的显示面板的制作方法，本申请还提供一种显示面板，该显示面板通过上述实施例中的显示面板的制作方法而形成。
该显示面板包括阵列基板10、形成于所述阵列基板10上的有机发光单元19，以及用于对有机发光单元19封装的封装结构。显示面板还包括至少一个用于为硬件结构提供安装空间的安装槽。安装槽在垂直于阵列基板10的方向上贯穿显示面板。
需要强调的是，该显示面板可以是将承载基板12剥离后的面板，也可以是保留承载基板12的面板。
基于上述的显示面板，本申请的实施例还提供一种显示装置。在一些实施例中，该显示装置可为显示终端，例如平板电脑，而在另一些实施例中，该显示装置亦可为移动通信终端，例如手机终端。
在一些实施例中，该显示装置包括显示面板及控制单元，该控制单元用于向显示面板传输显示信号。综上所述，通过本申请实施例提供的显示面板的制 作方法，在阵列基板10上蒸镀有机发光单元19之前，即进行切割开槽，以避免切割过程中对有机发光单元19造成损伤，从而提高了显示面板的生产良率。此外，通过切割开槽后再进行有机单元的蒸镀及封装，避免封装结构在后续的切割工艺中，由于其边缘吸收了大量热而出现膨胀或撕裂等损伤，从而防止有机发光单元19受到封闭空间以外的空气或水蒸气的侵蚀，进而提高显示面板的显示效果及使用寿命。
与此同时，由于第二支撑部184填充于安装槽内，因此在蒸镀有机发光单元19的过程中，有机发光单元19沿第二支撑部184的周缘蒸镀即可，从而避免出现安装槽边缘的有机发光单元19蒸镀不良。此外，在显示面板的制作过程中，由于支撑结构18对阵列基板10的背离有机发光单元19的一侧及安装槽周向进行支撑，因此保证了显示面板的强度，从而提高了显示面板的可靠性。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种显示面板的制作方法，其中，所述方法包括步骤：
    提供阵列基板，所述阵列基板包括至少一个安装槽，所述安装槽在垂直于所述阵列基板的方向上贯穿所述阵列基板，
    在所述阵列基板上除所述安装槽的区域外的区域上形成有机发光单元，
    在所述阵列基板的一侧设置用于对所述有机发光单元封装的封装结构，并显露所述安装槽。
  2. 根据权利要求1所述的显示面板的制作方法，其中，所述在所述阵列基板上除所述安装槽的区域外的区域上形成有机发光单元的步骤之前还包括步骤：
    将支撑结构支撑于所述阵列基板的背离所述有机发光单元的一侧上，且填充于所述安装槽内。
  3. 根据权利要求2所述的显示面板的制作方法，其中，所述支撑结构包括支撑于所述阵列基板的背离所述有机发光单元的一侧上的第一支撑部，以及一端连接于所述第一支撑部的朝向所述阵列基板的一侧的第二支撑部，
    所述第二支撑部伸入并填充于所述安装槽内。
  4. 根据权利要求3所述的显示面板的制作方法，其中，所述在所述阵列基板的一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽的步骤之前还包括步骤：
    分离所述支撑结构与所述阵列基板。
  5. 根据权利要求4所述的显示面板的制作方法，其中，所述分离所述支撑结构与所述阵列基板的步骤包括步骤：
    加热所述第一支撑部与所述阵列基板，以降低所述第一支撑部与所述阵列基板的背离所述有机发光单元的一侧之间的粘性，
    分离所述第一支撑部与所述阵列基板，使所述第二支撑部从所述安装槽脱离。
  6. 根据权利要求1所述的显示面板的制作方法，其中，所述方法还包括步骤：
    提供承载基板，
    在所述承载基板上形成衬底基板，
    在所述衬底基板上依次形成薄膜晶体管、阳极及功能膜层，
    去除位于至少一个预设区域处的承载基板、衬底基板及阵列基板的各膜层，以形成所述安装槽。
  7. 根据权利要求6所述的显示面板的制作方法，其中，所述去除位于至少一个预设区域处的承载基板、衬底基板及阵列基板的各膜层，以形成所述安装槽的步骤包括步骤：
    采用蚀刻工艺，去除位于至少一个预设区域的承载基板、衬底基板及阵列基板的各膜层，以形成所述安装槽。
  8. 根据权利要求1所述的显示面板的制作方法，其中，所述显示面板为柔性显示面板，所述在阵列基板的一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽的步骤包括步骤：
    在所述阵列基板上除安装槽的区域外的区域上形成一层覆盖所述有机发光单元的薄膜封装层。
  9. 根据权利要求1所述的显示面板的制作方法，其中，所述显示面板为硬屏显示面板，所述在阵列基板的一侧形成用于对所述有机发光单元封装的封装结构，并显露所述安装槽的步骤包括步骤：
    提供封装盖板，
    在所述封装盖板及所述阵列基板之间设置封框胶，并将封装盖板与阵列基板对盒，以形成一密闭封装空间，
    在封装盖板开设贯通所述安装槽的通孔，所述通孔与所述安装槽一一对应。
  10. 一种显示面板，其中，包括：
    阵列基板，包括至少一个安装槽，所述安装槽在垂直于所述阵列基板的方向上贯穿阵列基板，
    有机发光单元，设置在所述阵列基板的一侧上除安装槽区域外的区域内，
    封装结构，设置在所述阵列基板一侧的除所述安装槽区域外的区域上，用于对所述有机发光单元封装。
  11. 根据权利要求10所述的显示面板，其中，所述阵列基板至少依次包括承载基板、衬底基板、薄膜晶体管、以及阳极和功能膜层，所述功能膜层至少包括像素限定层，所述像素限定层包括多个像素定义开口。
  12. 根据权利要求11所述的显示面板，其中，所述有机放光单元至少包括有机发光材料层及形成于所述有机发光材料层上的阴极层，所述有机放光单元对应地设置于所述多个像素定义开口内。
  13. 根据权利要求12所述的显示面板，其中所述有机发光材料层包括共轭高分子材料。
  14. 根据权利要求10所述的显示面板，其中，所述封装结构包括薄膜封装层。
  15. 根据权利要求10所述的显示面板，其中，所述封装结构包括封装盖板，所述封装盖板与所述阵列基板对盒，并且与所述封装基板之间设置有封框胶，以形成以密闭封装空间，在所述封装盖板上开设有通孔，所述通孔与所述安装槽一一对应。
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