WO2016017807A1 - 可撓性薄膜構造の表示セルを取り扱う方法 - Google Patents

可撓性薄膜構造の表示セルを取り扱う方法 Download PDF

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Publication number
WO2016017807A1
WO2016017807A1 PCT/JP2015/071835 JP2015071835W WO2016017807A1 WO 2016017807 A1 WO2016017807 A1 WO 2016017807A1 JP 2015071835 W JP2015071835 W JP 2015071835W WO 2016017807 A1 WO2016017807 A1 WO 2016017807A1
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WIPO (PCT)
Prior art keywords
cell
mother board
display cell
carrier tape
motherboard
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PCT/JP2015/071835
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English (en)
French (fr)
Japanese (ja)
Inventor
多公歳 中西
創矢 徐
智 小塩
村上　奈穗
Original Assignee
日東電工株式会社
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Publication of WO2016017807A1 publication Critical patent/WO2016017807A1/ja

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to a technical field including handling a display cell having a flexible thin film structure.
  • the present invention relates to the handling of display cells that can be formed into flexible thin film structures such as organic EL display cells.
  • the organic EL display cell can be formed in a flexible thin film structure
  • the display device using the display cell can be curved, or the entire display device can be configured to be flexible and rollable or bendable. It is.
  • this type of display cell has a flexible thin film structure, it is not easy to handle the display cell at the stage of manufacturing the display device.
  • a display cell having a relatively small size used for a display device of a smartphone or tablet size is manufactured by forming a large number of cells on one substrate.
  • Patent Document 1 Korean Patent Application Publication No. 10-1174834
  • a resin film such as a polyimide resin is formed on a glass substrate, and the resin film is used as a base material for forming a film display cell.
  • a large number of display cells arranged in a plurality of rows and columns are formed on the substrate, the entire surface thereof is covered with a process film, and then the substrate on which the display cells are formed is peeled from the glass substrate.
  • the individual film-shaped display cells are divided so that the terminal portions including the electrical terminals for electrical connection formed on one side of the individual film-shaped display cells are exposed.
  • Each film-like display cell is formed by peeling off the process film at a location corresponding to the terminal portion.
  • a movable having a suction disk with a vacuum suction function In the process of bonding various films required for subsequent processing to the display cells formed on such a glass substrate, generally a movable having a suction disk with a vacuum suction function. Use a support base. Then, the resin base material on the glass substrate and a plurality of display cells formed thereon are sucked and held on the suction plate of the support base with the glass substrate facing down, and the surface of the display cell is required as needed. And attach the protective film. Next, the display cell on which the protective film is bonded is transported to the glass substrate peeling position together with the glass substrate.
  • the upper surface of the display cell on the resin base material is held by the second suction plate having a vacuum suction function, and at the same time, the vacuum suction in the suction plate of the movable support base is released.
  • the glass substrate is separated from the movable support and is supported from above by the second suction disk. Thereafter, the glass substrate is peeled from the resin base material by a method such as laser irradiation from the lower side of the glass substrate.
  • This laser irradiation method is described in, for example, International Publication WO2009 / 104371A1 (Patent Document 2).
  • a back surface protective film is bonded to the lower surface of the resin base material.
  • This method requires a second suction disk with a vacuum suction function in order to receive a glass substrate, a resin base material formed thereon and a display cell from a movable support base having a vacuum suction function. And Therefore, the entire apparatus is large and expensive.
  • a flexible thin-film structure display cell formed on a resin base material is formed on a glass substrate without using a suction board having a vacuum suction function above the conveyance path of the flexible thin-film structure display cell. It is an object to be solved to provide a method for handling a display cell having a flexible thin film structure that can be transferred to the next process together with the heat resistant substrate as described above.
  • the present invention provides a method of handling an optical display cell having a flexible thin-film structure when an optical display unit is manufactured by passing the optical display cell having a flexible thin-film structure through a plurality of steps. It is.
  • a carrier tape having a pressure-sensitive adhesive layer formed on one side is moved in the feeding direction of the optical display cell while the pressure-sensitive adhesive layer is directed downward.
  • the optical display cell is transferred through the plurality of steps.
  • a method of handling a display cell having a flexible thin film structure includes a resin base material and a flexible thin film structure formed on the resin base material on a heat resistant mother substrate such as a glass substrate.
  • a mother board structure on which a cell motherboard comprising at least one display cell is supported is brought into contact with an adhesive tape on the upper surface of the motherboard structure with the heat-resistant mother board facing down, and the motherboard structure is formed from the upper surface by the adhesive tape.
  • the motherboard structure is sent to the next process by supporting the body and moving the adhesive tape in the feeding direction.
  • the method in this aspect of the invention comprises: A mother board structure in which a cell motherboard comprising a resin base material and at least one display cell of a flexible thin film structure formed on the resin base material is supported on a heat resistant mother board, the display cell faces upward A step of feeding in the feeding direction in a state of becoming, and a carrier tape having an adhesive surface extending in the feeding direction is brought into contact with the display cell of the mother board structure sent in the feeding direction, and the mother board structure is placed on the upper surface by the carrier tape And feeding the motherboard structure in the feed direction by moving the carrier tape in the feed direction.
  • the cell mother board can include at least a plurality of display cells arranged in a vertical row parallel to the feeding direction.
  • the above-described method is performed by attaching the cell mother board from which the carrier tape has been peeled off to the bottom adhesive film.
  • a cutting step of cutting each individual display cell may be included.
  • the cell motherboard from which the heat-resistant mother substrate has been peeled is wound around a roll in the middle of the method, and the cell motherboard is unwound from the roll in a later stage.
  • the step of laminating the bottom surface affixed film can be performed.
  • the display cell can be an organic EL display cell.
  • a method for handling a display cell having a flexible thin film structure can be embodied as a method for handling a cell motherboard having at least one display cell having a flexible thin film structure.
  • This method On a heat resistant mother substrate such as a glass substrate, a mother board structure in which a cell mother board comprising a resin base material and at least one display cell of a flexible thin film structure formed on the resin base material is supported, Sending in the feed direction with the display cell facing up, A carrier tape having an adhesive surface and extending in the feed direction is brought into contact with the display cells of the motherboard structure fed in the feed direction so that the motherboard structure is supported from the upper surface by the carrier tape, and the carrier tape is fed.
  • Sending the motherboard structure in the feed direction by moving in a direction; Peeling the heat-resistant mother board from the mother board structure supported by the carrier tape and fed in the feeding direction; It is characterized by including.
  • the method may further include a step of winding the mother board structure from which the heat-resistant mother board has been peeled off with a carrier tape on a roll. Further, before the step of winding the mother board structure with the carrier tape on the roll, the adhesive tape layer is formed on the surface of the mother board structure from which the heat-resistant mother board is peeled while the mother board structure is fed in the feeding direction by the carrier tape. Steps may be included.
  • an adhesive tape is brought into contact with an upper surface of a mother board structure composed of a heat-resistant mother board such as a glass substrate and a cell mother board with the heat-resistant mother board facing down.
  • the mother board structure is fed by supporting the mother board structure from the upper surface with a tape and moving the adhesive tape in the feeding direction, and the cell mother board after the heat-resistant mother board is peeled from the mother board structure is also included in the cell motherboard. Since it is supported from above by the adhesive tape, the mother board structure can be transferred without using a vacuum suction board above the conveyance path.
  • FIG. 1 It is a top view which shows an example of the optical display cell which can be used in the method of one Embodiment of this invention. It is a perspective view which shows roughly an example of the manufacturing process of the organic electroluminescent display cell which has a comparatively small display screen.
  • An example of the cell assembly mother board to which the method of the present invention is applied is shown.
  • (A) is a top view and
  • (b) is a sectional view.
  • (A) (b) (c) (d) is a figure which shows each step of surface protection film peeling operation
  • FIG. 1 shows an example of an optical display cell 1 that can be handled in the method of an embodiment of the present invention.
  • the optical display cell 1 has a rectangular shape having a short side 1a and a long side 1b in plan view, and a terminal portion 1c having a predetermined width is formed along one short side 1a.
  • a number of electrical terminals 2 for electrical connection are arranged on the terminal portion 1c.
  • a region excluding the terminal portion 2 of the optical display cell 1 is a display region 1d.
  • the display area 1d has a width W in the horizontal direction and a length L in the vertical direction.
  • the optical display cell 1 is preferably an organic EL display cell, but the method of the present invention can be applied to any display cell having a flexible thin film structure.
  • the optical display cell 1 can have various screen sizes from a relatively small size for mobile phones or smartphones or tablets to a relatively large size for television applications.
  • FIG. 2 is a perspective view schematically showing an example of a manufacturing process of an organic EL display cell having a relatively small display screen for use in a smartphone or a tablet.
  • a glass substrate 3 as a heat-resistant mother substrate is prepared, and a heat-resistant resin material, preferably a polyimide resin, is applied to the glass substrate 3 to a predetermined thickness and dried.
  • a substrate 4 is formed.
  • a heat resistant resin material polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), etc. can be used in addition to polyimide resin.
  • a flexible ceramic sheet as described in JP 2007-157501 A (Patent Document 3), or JP 2013-63892 A (Patent Document 4)
  • flexible glass as described in JP 2010-13250 A (Patent Document 5) and JP 2013-35158 A (Patent Document 6).
  • a flexible ceramic sheet or flexible glass is used as the substrate, it is not necessary to use the glass substrate 3.
  • a plurality of organic EL display cells 1 are formed on the resin base material 4 in a state of being arranged in a vertical and horizontal matrix by a known manufacturing method, and the resin base material 4 and the display cells are cell assembly motherboard B. Form. When there is one display cell formed on the resin substrate 4, this is called a cell motherboard. Thereafter, the surface protective film 5 is bonded so as to cover the organic EL display cell 1 formed on the resin substrate 4.
  • the cell assembly motherboard B or the one in which the cell motherboard is bonded to a heat resistant substrate such as the glass substrate 3 is referred to as a motherboard structure.
  • FIG. 3A is a plan view showing an example of the cell assembly mother board B without the surface protective film 5 attached thereto
  • FIG. 3B is a cross-sectional view taken along the line bb of FIG.
  • substrate B with which the surface protection film 5 was bonded together is shown in the state arrange
  • FIG. 3 (a) in the cell assembly motherboard B, a plurality of optical display cells 1 constitute vertical columns and horizontal rows with the terminal portions 1a oriented in the horizontal direction.
  • the cell aggregate motherboard B has a rectangular shape having a short side B-1 and a long side B-2.
  • a reference mark m serving as a reference point is attached by printing, engraving, or other appropriate technique.
  • the reference mark m is referred to as a reference when the mother board B is positioned.
  • the cell assembly mother board B is sent in the direction indicated by the arrow A in FIG.
  • the cell assembly mother board B in the state having the glass substrate 3 is sent to the glass substrate peeling position where the glass substrate 3 is peeled after passing through the defect inspection of the optical display cell 1.
  • the handling method of the present invention is applied.
  • an optical inspection of the cell assembly motherboard B is performed prior to transferring the cell assembly motherboard B having the glass substrate 3 to the glass substrate peeling position. In preparation for this optical inspection, it is necessary to peel the surface protective film 5 from the cell assembly motherboard B. In FIG. 4, the procedure which peels the surface protection film 5 is shown.
  • the cell assembly mother board B is held by the vacuum suction force on the suction holding board 10 supported by the guide 15 and the support mechanism 13 that move along the guide rail 14. Is sent to the surface protective film peeling position, and is raised to a predetermined height by the lifting mechanism at the position shown in FIG.
  • This predetermined height is a height at which the upper surface of the surface protective film 5 of the cell assembly mother board B can contact the adhesive tape 16d positioned between the pair of pressing rolls 16c with a predetermined contact pressure.
  • the cell assembly mother board B raised to the predetermined height by the elevating mechanism is sent to the position below the peeling adhesive tape driving device 16 as it is.
  • the upper surface of the surface protection film 5 of the mother board B contacts the adhesive surface of the adhesive tape 16d in a pressed state between the pair of pressing rolls 16c.
  • the adhesive force of the adhesive tape 16d to the surface protective film 5 is larger than the adhesive force of the surface protective film 5 to the optical display cell 1, so that the surface protective film 5 adheres to the adhesive tape 16d and is on the resin substrate 4. It peels from the optical display cell 1 arrange
  • the peeled surface protective film 5 is taken up together with the adhesive tape 16d by a take-up roll 16b.
  • the mother board B from which the surface protective film 5 has been peeled is lowered to the height at the time of feeding at the position shown in FIG. 4A by the lifting mechanism at the position shown in FIG.
  • Optical inspection is performed in two stages: surface reflection inspection shown in FIG. 5A and lighting inspection of display cells shown in FIG.
  • a light source 70 and a light receiver 71 are provided as an inspection apparatus for the surface reflection inspection, and the cell assembly mother board B is supported by the suction holding board 10 and below the reflection inspection apparatus. Moved to. At this position, light from the light source 70 is applied to the surface of the optical display cell 1 that is the subject, and is reflected by the surface of the optical display cell 1 to enter the light receiver 71, whereby the surface of the optical display cell 1. A defect is detected.
  • FIG. 5B shows an outline of the lighting inspection, and a plurality of detectors 72 for detecting the light emission state of the optical display cell 1 are arranged in a line. Since the cell assembly mother board B manufactured by the process shown in FIG. 2 has a configuration in which a plurality of optical display cells 1 are arranged in a vertical and horizontal matrix, in this embodiment, all of the cell assembly motherboard B in the cell assembly motherboard B is provided. A pseudo terminal unit 75 shown in FIG. 6 is used so that the optical display cell 1 is excited simultaneously.
  • the pseudo terminal unit 75 includes a rectangular outer frame 75a corresponding to the rectangular shape of the cell assembly motherboard B, a plurality of horizontal bars 75b, and a plurality of vertical bars 75c.
  • the outer frame 75a rectangular windows 75d arranged vertically and horizontally so as to correspond to the arrangement of the optical display cells 1 in the cell assembly motherboard B are formed.
  • a connection terminal 76 is arranged at a position corresponding to the terminal portion 2 of each optical display cell 1 along one short side of each window 75d.
  • the pseudo terminal unit 75 is provided with a power supply terminal 77 for supplying excitation power to the terminal 2 of each optical display cell 1 in the cell assembly motherboard B.
  • FIG. 7 shows a state in which the pseudo terminal unit 75 shown in FIG. 6 is used.
  • the pseudo terminal unit 75 is placed on the cell assembly motherboard B so that the outer frame 75a overlaps the peripheral edge of the cell assembly motherboard B.
  • the window 75d of the pseudo terminal unit 75 overlaps the optical display cell 1 in the cell assembly motherboard B, respectively.
  • the detector 72 inspects the operating state of each cell 1 for each emission color.
  • FIG. 8 is a schematic side view showing the entire bonding mechanism 20.
  • the laminating mechanism 20 includes an optical film roll 22 obtained by winding a long optical film 21 in a roll shape.
  • the optical film 21 is fed out from the optical film roll 22 at a constant speed by a pair of drive rolls 23.
  • the optical film 21 includes a long web-shaped polarizing film in which protective films 21b such as TAC films are bonded to both sides of a polarizer 21a, and an adhesive layer 21d.
  • a laminated web comprising a quarter-wave ( ⁇ ) retardation film 21c having a long web shape bonded to the polarizing film.
  • a carrier film 21e is bonded to the outside of the retardation film 21c via another pressure-sensitive adhesive layer 21d.
  • the polarizer 21a and the retardation film 21c are arranged so that the absorption axis of the polarizer 21a and the slow axis or fast axis of the retardation film 21c intersect at an angle in the range of 45 ° ⁇ 5 °.
  • the optical film 21 has a long continuous web shape, and the width thereof corresponds to the lateral width W of each display cell arranged on the mother board B.
  • the absorption axis of the polarizer 21a is parallel to the length direction of the polarizer 21a, and the slow axis of the retardation film 21c is 45 ° with respect to the length direction of the retardation film 21c.
  • the structure is oriented obliquely by an angle in the range of ⁇ 5 °.
  • the oblique stretching there are detailed descriptions in Japanese Patent Application No. 2013-070787 (Patent Document 7) and Japanese Patent Application No. 2013-070789 (Patent Document 8), and the phase difference stretched by the methods described in these documents.
  • a film can be used.
  • the retardation film 21c a film having a reverse dispersion characteristic in which the retardation becomes smaller toward the shorter wavelength side according to the wavelength can be used.
  • Retardation films having reverse dispersion characteristics are described in Japanese Patent No. 5204200 (Patent Document 9), Japanese Patent No. 5448264 (Patent Document 10), and the like, and are described in these patent applications in the method of this embodiment.
  • a retardation film having reverse dispersion characteristics can be used.
  • the optical film 21 fed out from the optical film roll 22 by the pair of drive rolls 23 is cut and formed through a guide roll 24, a dancer roll 25, a guide roll 26, and a guide roll 27 that are movable in the vertical direction.
  • the cut forming mechanism 28 includes a cutting blade 29 and a pair of drive rolls 30 for feeding.
  • the notch forming mechanism 28 stops the drive roll 30 at the notch forming position and operates the cutting blade 29 in a state where the feeding of the optical film 21 is stopped, leaving the carrier film 21e only on the optical film 21. Cuts 28a are formed in the width direction.
  • the interval between the notches 28a is a distance corresponding to the length L in the vertical direction of each display cell 1 on the mother board B.
  • the optical film is cut in the width direction by the cuts 28a to become the optical film sheet 21f having the horizontal width W and the vertical method length L of the display cell.
  • a plurality of optical film sheets 21a are continuously formed on the carrier film 21e, and these optical film sheets 21a are supported by the carrier film 21e and sent to the bonding position.
  • the dancer roll 25 is elastically biased upward, and a pair of drive rolls 23 that continuously drive the optical film 21 in the feeding direction, and the feeding of the optical film 21 is stopped at the time of cutting. It is an adjustment roll that acts to adjust the film feed between a pair of drive rolls 30 that are driven by a distance. That is, during the stop period of the drive roll 30, the dancer roll 25 moves upward so as to absorb the feed of the drive roll 23 by the urging force, and when the drive roll 30 starts operating, The tensile force applied to the optical film 21 by 30 moves downward against the urging force.
  • a series of optical film sheets 21f formed by the cuts 28a is supported by the carrier film 21e, passes through the guide roll 31 and the guide roll 32, passes through the dancer roll 33 having the same configuration as the dancer roll 25, and guides. Guided by rolls 34, 35, 36, 37 and sent to the bonding position.
  • a laminating roll 38 and a carrier film peeling mechanism 39 are provided at the laminating position.
  • the laminating roll 38 is movably disposed between the upper drawing position and the lower pressing position, and among the continuous optical film sheets 21f supported by the carrier film 21e, the leading end of the leading optical film sheet 21f.
  • the position is aligned with the tip of the display cell 1 to be bonded, it is lowered from the upper position to the lower pressing position, and the optical film sheet 21f is pressed against the display cell 1 on the mother board B and bonded. I do.
  • the carrier film peeling mechanism 39 includes a peeling blade that acts to fold the carrier film 21e at an acute angle and peel the leading optical film sheet 21f from the carrier film 21e at the bonding position.
  • a carrier film take-up roll 40 is arranged to take up the carrier film 21e folded back at an acute angle. The carrier film 21e peeled off from the optical film sheet 21f is sent to the take-up roll 40 through the guide roll 41 and the pair of take-up drive rolls 42, and is taken up by the take-up roll 40.
  • the operation of the drive roll 30 and the cutting blade 29 is controlled by the above-described control device not shown in FIG. That is, the control device stores information related to the size and position of the display cell 1 on the mother board B, and the control device drives the driving roll 30 and the cutting blade based on the information about the longitudinal length L of the display cell 1.
  • the operation of No. 29 is controlled, and the cuts 28 a are formed in the optical film 21 at intervals in the longitudinal direction corresponding to the longitudinal length L of the display cell 1.
  • a film detection device 43 for detecting the leading end of the optical film sheet 21f is provided on the upstream side of the laminating position, and information on the leading end position of the optical film sheet 21f sent to the laminating position is sent to the control device. provide.
  • This optical film sheet leading edge position information is stored in a control device, and the control device is based on this optical film sheet leading edge position information and the positional information of the mother board B acquired from the suction holding board 10 and is used for winding with the driving roll 30.
  • An indication that the operation of the drive roll 42 is controlled in accordance with the movement of the suction holding board 10 and the optical film sheet 21f peeled off from the carrier film 21e is bonded on the motherboard B at the bonding position. Adjust to align with the tip of cell 1.
  • the optical film sheet 21f and the mother board B are sent at a synchronized speed.
  • the laminating roll 38 descends to the lower pressing position, and presses the optical film sheet 21 f against the display surface of the display cell 1. In this manner, the optical film sheet 21f is bonded to the display cell 1.
  • FIG. 10 is a schematic view showing an example of an order in which the optical film sheet 21f is sequentially bonded to the display cells 1 arranged in a matrix form on the mother board B.
  • the laminating mechanism 20 has a fixed lateral position with respect to the feed direction, and the suction holding disk 10 that holds the mother board B is mounted on the support mechanism 13 so as to be movable in the lateral direction.
  • the position of the mother board B is controlled so that the first display cell 1 in the leftmost display cell row is first positioned at the bonding position.
  • the optical film sheet 21f is bonded to the display portion 1d of the display cell 1 at the head of the left end column.
  • the mother board B is displaced in the left horizontal direction with respect to the feed direction by a distance corresponding to the horizontal interval of the display cell rows.
  • the first display cell 1 in the second column from the left is positioned at the bonding position.
  • the optical film sheet 21f is bonded to the display portion 1d of the display cell 1 by the same operation as described above.
  • the motherboard B is displaced in the left lateral direction by the same operation, and the optical film sheet 21f is bonded.
  • the bonding of the optical film sheet 21f to the top display cell is completed. This state is shown in FIG.
  • the suction holding platen 10 is driven in the feed direction by a distance corresponding to the interval between the display cells 1 in each column, and the second display cell 1 from the top of the rightmost column is positioned at the bonding position, and similarly.
  • an optical film sheet 21 f is bonded to the display portion 1 d of the cell 1.
  • the mother board B is driven in the feeding direction, and the optical film sheet 21f is bonded by the same operation.
  • the laminated optical film supported by the carrier film 21e is cut into a predetermined length by the cutting mechanism 28 in advance to form the optical film sheet 21f, and then displayed on the motherboard B.
  • the optical film is passed to the entire display cell in a column in the form of a continuous strip film without being cut into a sheet shape in advance. Pasted together.
  • the cut forming mechanism 28 in the bonding mechanism 20 shown in FIG. 8 is not necessary.
  • the lamination according to this embodiment is shown in FIG. As shown in FIG.
  • the leading end of the first display cell 1 in the leftmost row in the feed direction is positioned at a predetermined position in the bonding position.
  • the carrier film 21e is peeled off from the optical film 21, and the optical film is continuously bonded to the display cell 1 in the left end column.
  • the mother board B is moved leftward and rearward, and the same bonding is performed with the display cell 1 at the head of the second column aligned with the bonding position as shown in FIG. 11B.
  • the mother board B is moved to the left lateral direction and rearward so that the display cell 1 at the head of the right end column is aligned with the bonding position as shown in FIG.
  • FIG. 12 is a schematic view of an optical display unit manufacturing apparatus 80 according to an embodiment for carrying out the optical display cell handling method of the present invention.
  • the mother board B is sent to the optical display unit manufacturing apparatus 80 shown in FIG. It is done.
  • the device 80 includes a carrier tape feeding roller 81, a carrier tape take-up roller 82, and a plurality of guide rollers 84a, 84b, 84c, 84d, and 84e arranged between the rollers 81 and 82.
  • a roll 83 a of the carrier tape 83 is attached to the carrier tape feeding roller 81.
  • the carrier tape 83 includes a tape base 83b and a light peeling force adhesive layer 83c provided on one surface of the tape base 83b.
  • the roll 83a of the carrier tape 83 has a configuration in which the pressure-sensitive adhesive layer 83c is wound outward.
  • the carrier tape 83 is unwound from the roll 83a and is passed in the horizontal direction along the lower traveling path of the guide rollers 84b, 84c, 84d, 84e so that the adhesive layer 83c faces downward, and the winding roller 82 Rolled up.
  • the cell assembly mother board B in which the optical film sheet 21f is bonded to the display surface of the optical display cell 1 is held in the horizontal direction while being held on the suction holding board 10 together with the glass substrate 3 bonded to the mother board B. To the position below the carrier tape 83 extending in
  • the optical display unit manufacturing apparatus 80 shown in FIG. 12 includes a carrier tape bonding position I, a glass substrate peeling position II, an adhesive layer application position III, a composite film bonding position IV, and an optical display cell cutting position V.
  • a carrier tape bonding position I a glass substrate peeling position II
  • an adhesive layer application position III a composite film bonding position IV
  • an optical display cell cutting position V a carrier tape bonding position I
  • the cell assembly mother board B in which the optical film sheet 21f is bonded to the display surface of the optical display cell 1 and the glass substrate 3 are placed on the support mechanism 13 of the suction holding board 10 before reaching the carrier tape bonding position I.
  • the height is adjusted using the provided height adjusting mechanism.
  • the height to be adjusted is such that the optical film sheet 21f bonded to the optical display cell 1 on the cell assembly motherboard B contacts the pressure-sensitive adhesive layer 83c of the carrier tape 83 with a predetermined contact pressure. .
  • the cell assembly mother board B and the glass substrate 3 on the suction holding board 10 adjusted in height are fed under the second guide roller 84b from the left in FIG.
  • the adhesive tape 83c of the carrier tape 83 fed out from the roll 83a is pressed against the optical film sheet 21f on the cell assembly motherboard B by the guide roller 84b.
  • the carrier tape 83 is joined to the cell assembly motherboard B. This state is shown in FIG.
  • the carrier tape 83 is driven at a speed synchronized with the suction holding board 10 in the feeding direction indicated by an arrow A in FIG. While the cell assembly motherboard B passes through the carrier tape bonding position I, the carrier tape 83 is bonded to all the optical film sheets 21f on the cell assembly motherboard B. After the cell assembly motherboard B passes through the carrier tape bonding position I, the vacuum suction force of the suction holding board 10 is released, and the cell assembly motherboard B and the glass substrate 3 are supported only by the carrier tape 83. become.
  • the cell assembly mother board B and the glass substrate supported by the carrier tape 83 are then sent to the glass substrate peeling position II.
  • the glass substrate 3 is peeled off from the resin base material 4 by a known method such as laser irradiation.
  • a technique for peeling a glass substrate from a resin base material by laser irradiation is described in, for example, International Publication No. WO2009 / 104371 (Patent Document 2).
  • Patent Document 2 The cell assembly mother board B from which the glass substrate 3 has been peeled is sent to the adhesive layer application position III.
  • the guide roller 84c is sandwiched between the carrier tape 83 and the cell assembly motherboard B supported by the carrier tape 83 below the guide roller 84c located above the carrier tape 83.
  • 84d, rollers 85a and 85b are arranged.
  • an adhesive tape supply roller 87 is provided at the adhesive layer application position III, and a roll 86 a of the adhesive tape 86 is supported on the supply roller 87.
  • the pressure-sensitive adhesive tape 86 includes a pressure-sensitive adhesive layer 86b, a first release liner 86c bonded to one side of the pressure-sensitive adhesive layer 86b, and a second release bonded to the other side of the pressure-sensitive adhesive layer 86b. It comprises a liner 86d.
  • the adhesive tape 86 fed out from the roll 86 a passes through the guide roller 88 and is sent between the roller 85 a and the cell assembly motherboard B supported by the carrier tape 83.
  • the adhesive tape 86 is unrolled from the roll 86a and before reaching the guide roller 88, the first release liner 86c is peeled off and the adhesive layer 86b is exposed.
  • the pressure-sensitive adhesive tape 86 is sent between the roller 84 c and the roller 85 a so that the exposed pressure-sensitive adhesive layer 86 b is in contact with the resin base material 4 on the lower surface of the cell assembly motherboard B supported by the carrier tape 83. .
  • the adhesive layer 86b is pressed against the resin substrate 4 on the lower surface of the cell assembly motherboard B by the rollers 84c and 85a and joined to the cell assembly motherboard B.
  • the cell assembly motherboard B and the adhesive tape 86 are sent between the rollers 84d and 85b, and the second release liner 86d is peeled from the adhesive layer 86b.
  • the peeled second release liner 86d is taken up by the take-up roller 89b.
  • the cell assembly mother board B having the adhesive layer 86b on the lower surface is supported by the carrier tape 83 and sent to the composite film bonding position IV.
  • a roll 90a of a composite film 90 that is a lower surface pasting film is disposed, and the composite film 90 fed out from the roll 90a is guided by a guide roller 91 disposed below the guide roller 84e. It is pressed against the adhesive layer 86b applied to the lower surface of the cell assembly mother board B that has reached the lower position of the guide roller 84e. In this way, the composite film is bonded to the cell assembly motherboard B.
  • the carrier tape 83 is peeled off from the optical film sheet 21f on the cell assembly motherboard B at the position of the guide roller 84e, and is taken up by the take-up roller 82. Thereafter, the cell assembly mother board B is supported by the composite film 90.
  • a pair of drive rollers 91a and 91b can be provided.
  • the composite film 90 is configured as a laminate including a light shielding film layer and a film layer having impact resistance and heat dissipation.
  • an ordinary back surface protective film may be used instead of the composite film.
  • the cell assembly mother board B having the optical film sheet 21f bonded to the upper surface and the composite film 90 bonded to the lower surface is sent to the optical display cell cutting position V.
  • This cutting position V is provided with a support belt 92 made of a synthetic resin that receives the composite film 90 and a cutting blade 93, and the cell assembly mother board B is cut to separate individual optical display cells 1.
  • the mechanism and operation for this cutting are well known and will not be described in detail here.
  • FIG. 14 shows an optical display unit manufacturing apparatus according to another embodiment for carrying out the optical display cell handling method of the present invention. Since this apparatus has the same basic configuration and operation as the apparatus 80 shown in FIG. 12, the corresponding parts are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the apparatus shown in FIG. 14 differs from the apparatus 80 shown in FIG. 12 in that the cell assembly mother board B, which is passed between the rollers 84c and 85a and the adhesive layer 86b is provided on the lower surface, is provided with the carrier tape 83 and the first tape. That is, a laminate is formed together with the second release liner 86 d, and the laminate is wound around the roll 100.
  • the laminated body wound up by the roll 100 is unwound from the roll 100 in another process, and is processed at the composite film bonding position IV and the optical display cell cutting position V.
  • the method of the present invention can also be applied to the display cells 1 arranged in a vertical row on the mother board B.
  • An example is shown in FIG.
  • the display cell 1 is arranged on the mother board B so that the terminal portion 1c is lateral to the column direction.
  • the pasting can be performed by pasting the optical film sheet 21f cut in advance from the top of the column to the display portion 1d of the display cell 1 by the same operation as described with reference to FIG. .
  • the optical film 21 may be bonded to the display portion 1d over the entire display cell 1 in a row, and an excess portion of the optical film 21 may be cut off in a subsequent cutting step.
  • the method of the present invention can also be applied to display cells having a flexible sheet structure having a relatively large size. Examples thereof are shown in FIGS. 16 and 17.
  • the display cell is an organic EL cell
  • the cell itself can have a thin flexible sheet structure.
  • an optical display cell 101 having a flexible sheet structure has a rectangular shape having a short side 101a and a long side 101b, a terminal portion 101c positioned along the short side 101a, and a length L in the vertical direction. And a display portion 101d having a lateral width W.
  • the display cell 101 is formed on a base material 102 made of a heat-resistant resin material such as polyimide at the manufacturing stage. The manufacturing process is the same as the process described with reference to FIG.
  • the resin base material 102 is formed in a film shape on the glass substrate 3, and the optical display cell 101 such as an organic EL display cell is formed thereon.
  • the optical display cell 101 such as an organic EL display cell is formed thereon.
  • the optical film 21 is bonded to the upper surface of the display cell 101.
  • a mechanism similar to the bonding mechanism 20 shown in FIG. 8 can be employed.
  • the optical film 21 fed out from the optical film roll 22 has a width corresponding to the width W of the display cell 101 shown in FIG.
  • FIG. 17 the structure of the bonding part is shown schematically. The operation in the bonding portion is the same as that described above with reference to FIG. 8, and corresponding portions are denoted by the same reference numerals.

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
PCT/JP2015/071835 2014-08-01 2015-07-31 可撓性薄膜構造の表示セルを取り扱う方法 WO2016017807A1 (ja)

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CN105321862A (zh) 2016-02-10
TWI632099B (zh) 2018-08-11
KR102374333B1 (ko) 2022-03-15
CN105321862B (zh) 2018-12-18
TW201605706A (zh) 2016-02-16

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