WO2015129682A9 - ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム - Google Patents

ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム Download PDF

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WO2015129682A9
WO2015129682A9 PCT/JP2015/055222 JP2015055222W WO2015129682A9 WO 2015129682 A9 WO2015129682 A9 WO 2015129682A9 JP 2015055222 W JP2015055222 W JP 2015055222W WO 2015129682 A9 WO2015129682 A9 WO 2015129682A9
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Prior art keywords
polyimide resin
laminated film
same
resin
resin composition
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PCT/JP2015/055222
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English (en)
French (fr)
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WO2015129682A1 (ja
Inventor
富川真佐夫
渡邉拓生
李忠善
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東レ株式会社
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Priority to EP15754960.1A priority Critical patent/EP3112394A4/en
Priority to CN201580010593.2A priority patent/CN106029744B/zh
Priority to KR1020167025224A priority patent/KR102122278B1/ko
Priority to JP2015524565A priority patent/JP6555126B2/ja
Priority to SG11201606994XA priority patent/SG11201606994XA/en
Priority to US15/121,446 priority patent/US10026637B2/en
Publication of WO2015129682A1 publication Critical patent/WO2015129682A1/ja
Publication of WO2015129682A9 publication Critical patent/WO2015129682A9/ja

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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
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    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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  • General Physics & Mathematics (AREA)
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  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

高い耐熱性を有し、大面積でもボイド等がなく均一に仮接着することが可能であるポリイミド樹脂、これを用いた樹脂組成物および積層フィルムを提供する。 本発明は、少なくとも酸無水物残基とジアミン残基を有するポリイミド樹脂であり、全ジアミン残基中、ポリシロキサン系ジアミンの残基を６０モル％以上含むポリイミド樹脂である。
PCT/JP2015/055222 2014-02-26 2015-02-24 ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム WO2015129682A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP15754960.1A EP3112394A4 (en) 2014-02-26 2015-02-24 Polyimide resin, resin composition using same, and laminated film
CN201580010593.2A CN106029744B (zh) 2014-02-26 2015-02-24 聚酰亚胺树脂、使用其的树脂组合物及层叠膜
KR1020167025224A KR102122278B1 (ko) 2014-02-26 2015-02-24 폴리이미드 수지, 이것을 이용한 수지 조성물 및 적층 필름
JP2015524565A JP6555126B2 (ja) 2014-02-26 2015-02-24 ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム
SG11201606994XA SG11201606994XA (en) 2014-02-26 2015-02-24 Polyimide resin, resin composition using same, and laminated film
US15/121,446 US10026637B2 (en) 2014-02-26 2015-02-24 Polyimide resin, resin composition using same, and laminated film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014034900 2014-02-26
JP2014-034900 2014-02-26

Publications (2)

Publication Number Publication Date
WO2015129682A1 WO2015129682A1 (ja) 2015-09-03
WO2015129682A9 true WO2015129682A9 (ja) 2016-10-20

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PCT/JP2015/055222 WO2015129682A1 (ja) 2014-02-26 2015-02-24 ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム

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Country Link
US (1) US10026637B2 (ja)
EP (1) EP3112394A4 (ja)
JP (1) JP6555126B2 (ja)
KR (1) KR102122278B1 (ja)
CN (1) CN106029744B (ja)
SG (1) SG11201606994XA (ja)
TW (1) TWI652286B (ja)
WO (1) WO2015129682A1 (ja)

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KR102133559B1 (ko) * 2015-09-24 2020-07-13 아사히 가세이 가부시키가이샤 폴리이미드 전구체, 수지 조성물 및 수지 필름의 제조 방법
KR20180077185A (ko) * 2015-10-29 2018-07-06 도레이 카부시키가이샤 가부착용 적층체 필름, 가부착용 적층체 필름을 사용한 기판 가공체 및 적층 기판 가공체의 제조 방법, 및 이것들을 사용한 반도체 장치의 제조 방법
KR20180104311A (ko) * 2016-02-08 2018-09-20 도레이 카부시키가이샤 수지 조성물, 수지층, 영구 접착제, 임시 점착 접착제, 적층 필름, 웨이퍼 가공체 및 전자 부품 또는 반도체 장치의 제조 방법
KR102574758B1 (ko) * 2017-03-30 2023-09-06 닛산 가가쿠 가부시키가이샤 박리층 형성용 조성물 및 박리층
JP7107311B2 (ja) * 2017-06-16 2022-07-27 大日本印刷株式会社 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
JP7281887B2 (ja) * 2017-10-19 2023-05-26 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びポリイミド
GB2570510A (en) * 2018-01-30 2019-07-31 Pragmatic Printing Ltd System and method for manufacturing plurality of integrated circuits
TWI675899B (zh) * 2018-04-25 2019-11-01 達興材料股份有限公司 暫時黏著被加工物之方法及黏著劑
KR102279081B1 (ko) * 2018-08-20 2021-07-19 주식회사 엘지화학 폴리이미드 필름 및 이를 이용하는 플렉서블 디바이스
CN114957660A (zh) * 2021-02-26 2022-08-30 新应材股份有限公司 聚酰亚胺树脂组合物、聚酰亚胺树脂黏着层、积层体、以及电子组件的制造方法
JP2022156876A (ja) * 2021-03-31 2022-10-14 Tdk株式会社 樹脂複合積層体、樹脂複合積層体の製造方法および伸縮性デバイス

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CN106029744B (zh) 2018-08-28
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CN106029744A (zh) 2016-10-12
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KR20160127032A (ko) 2016-11-02
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