WO2015107758A1 - 樹脂モールド金型および樹脂モールド方法 - Google Patents

樹脂モールド金型および樹脂モールド方法 Download PDF

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Publication number
WO2015107758A1
WO2015107758A1 PCT/JP2014/079747 JP2014079747W WO2015107758A1 WO 2015107758 A1 WO2015107758 A1 WO 2015107758A1 JP 2014079747 W JP2014079747 W JP 2014079747W WO 2015107758 A1 WO2015107758 A1 WO 2015107758A1
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WIPO (PCT)
Prior art keywords
elastic body
resin
mold
mounting component
cavity
Prior art date
Application number
PCT/JP2014/079747
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English (en)
French (fr)
Japanese (ja)
Inventor
川口　誠
正明 涌井
Original Assignee
アピックヤマダ株式会社
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Filing date
Publication date
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Priority to KR1020167019898A priority Critical patent/KR102335853B1/ko
Priority to CN201480073241.7A priority patent/CN105917451B/zh
Priority to JP2015557719A priority patent/JP6422447B2/ja
Publication of WO2015107758A1 publication Critical patent/WO2015107758A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the present invention relates to a technique effective when applied to a resin mold and a resin molding method.
  • Patent Document 1 exposes the back surface (surface opposite to the mounted surface) of a semiconductor chip flip-chip mounted on a wiring board.
  • a technique for resin molding is described. Specifically, it is a technique of performing resin molding by covering the back surface of the exposed semiconductor chip with a release film.
  • An object of the present invention is to provide a resin mold mold capable of improving the production yield of resin mold products.
  • a resin mold mold according to an embodiment of the present invention is a resin mold mold that clamps a workpiece having a mounting component with one and the other mold, and performs resin molding so that a clamp surface of the mounting component is exposed.
  • a cavity recess is provided on the parting surface of the one mold, and the workpiece is disposed on the parting surface of the other mold so as to protrude from the inner bottom surface of the cavity recess.
  • an elastic body that presses the mounting component is provided, the opposing surface of the elastic body that protrudes from the inner bottom surface of the cavity recess and faces the mounting component is wider than the clamping surface of the mounting component.
  • the resin molding method according to an embodiment of the present invention is a resin molding method in which a workpiece having a mounting component is clamped by one and the other molds, and the resin molding is performed so as to expose a clamp surface of the mounting component.
  • a cavity recess is provided in the parting surface of the one mold, and an elastic body protruding from the inner bottom surface is provided on the inner bottom surface of the cavity recess, and the mounting component protrudes from the inner bottom surface of the cavity recess.
  • the elastic body whose opposing surface is wider than the clamping surface of the mounting component, disposing the work on the parting surface of the other mold and clamping the work, and mounting the elastic body with the elastic body
  • the elastic body is recessed in the mounting component, and the elastic body protrudes so as to exceed the clamp surface around the mounting component.
  • the elastic body is recessed in the mounting component, the elastic body protrudes so as to exceed the clamp surface around the mounting component, and the resin is prevented from leaking to the clamp surface of the mounting component (for example, a semiconductor chip). (Blocks the flow of resin). Thereby, it is possible to prevent a flash (resin burr) from being generated on the clamp surface of the mounted component. Further, even if the mounting component is uneven in height between the workpieces or the mounting component is curved, it can be absorbed by the elastic body. Therefore, the production yield of the resin mold product can be improved.
  • the elastic body is formed in a shape in which a portion facing the mounting component is thin and a portion facing the periphery of the mounting component is thick.
  • the elastic body more easily protrudes so as to exceed the clamp surface around the mounted component.
  • the one die is provided with a cavity piece constituting an inner bottom surface of the cavity recess, and the cavity piece is provided with the elastic body. Is more preferable.
  • the cavity piece can prevent the elastic body from spreading in the direction intersecting with the clamping direction.
  • the cavity piece is provided in the one mold through a liner.
  • the position adjustment of the cavity piece and the height variation adjustment of each workpiece can be easily performed.
  • a film is provided on the parting surface of the one mold including the opposing surface of the elastic body and the inner surface of the cavity recess.
  • the elastic body can be protected by the film, the occurrence of cracks and deterioration can be prevented, the durability of the elastic body can be improved, and the chemical resistance of the elastic body to the resin can also be improved.
  • the protruding thickness of the elastic body is thicker than the flatness of the clamp surface of the mounted component.
  • the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
  • the compressive stress of the elastic body is lower than the yield strength of the mounted component and higher than the molding pressure.
  • the production yield of resin mold products can be improved.
  • the number of components is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less.
  • the shape of a component, etc. it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .
  • FIG. 1 to FIG. 3 schematically show a cross section of the main part of the resin mold 10 during operation (during the manufacturing process).
  • FIG. 4 schematically shows a resin mold product 100 (work W) obtained from the resin mold 10.
  • the resin mold 10 is configured to include a pair of molds (upper mold 11 and lower mold 12). In the resin mold 10, the workpiece C is clamped by the upper mold 11 and the lower mold 12 to form a cavity C, and the resin R filled in the cavity C is thermally cured in a state where the resin R is held and is molded into a resin mold. Processing to manufacture (form) 100 is performed.
  • the workpiece W includes a substrate 101 (for example, a wiring substrate) and a mounting component 102 (for example, a chip component such as a semiconductor chip).
  • a substrate 101 for example, a wiring substrate
  • a mounting component 102 for example, a chip component such as a semiconductor chip.
  • the mounting component 102 is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed.
  • the other surfaces (main surface, side surface) are resin-molded.
  • the substrate 101 is clamped by the upper mold 11 and the lower mold 12, and the back surface 102a of the mounting component 102 is also clamped. For this reason, in this embodiment, the back surface 102a becomes a clamp surface.
  • the mounting component 102 includes various types of memory and logic chips that require heat dissipation, optical chips having a light emitting surface and a light receiving surface, and TSV type chips having electrical connection terminals on the upper and lower surfaces.
  • a semiconductor chip can also be used.
  • the mounting component 102 is connected to a conductor functioning as an upper and lower through electrode in the work W, a heat radiating plate for radiating heat from a semiconductor chip included in the work W, and a semiconductor chip included in the work W.
  • An interposer substrate may be used.
  • a process of pumping (injecting) resin into the cavity C via a resin path communicating with the cavity C is performed by a known transfer mechanism.
  • molding the resin mold part is performed by a well-known press mechanism.
  • the resin mold 10 may be configured such that the upper mold 11 is a fixed mold and the lower mold 12 is a movable mold, and the mold can be opened and closed by a press mechanism.
  • the upper mold 11 is a movable mold and the lower mold 12 is a fixed mold. Alternatively, the upper mold 11 and the lower mold 12 may be movable.
  • the lower mold 12 is provided with a pot (not shown) and a workpiece placement portion 13 on which the workpiece W is placed (arranged).
  • the work placement unit 13 is provided so as to be recessed from the parting surface 12 a of the lower mold 12.
  • the upper die 11 is provided with a cull (not shown), a runner gate 14, and a cavity recess 15 that constitutes a cavity C.
  • the cull, the runner gate 14 and the cavity recess 15 are provided so as to be recessed from the parting surface 11 a of the upper mold 11.
  • the resin mold 10 is provided with a heater (not shown). With this heater, the resin mold 10 can be heated to a predetermined temperature (for example, 180 ° C.).
  • the resin mold 10 includes an elastic body 16 that presses the mounting component 102 and is provided so as to protrude from the inner bottom surface 15 a of the cavity recess 15 (the lower surface of the cavity piece 17) into the cavity recess 15. .
  • An elastic body recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided, and the elastic body 16 is provided in the elastic body recess 21.
  • the elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the back surface 102a (clamping surface) of the mounting component 102.
  • the elastic body 16 may be made of, for example, a rubber material such as fluorine rubber or silicone rubber, or an engineering plastic such as a PEEK (polyether ether ketone) material.
  • the resin mold 10 when assembling the elastic body 16 to the upper mold 11, the resin mold 10 is provided with a cavity piece 17 (mold block) provided on the upper mold 11 and constituting the inner bottom surface 15 a of the cavity recess 15.
  • the upper die 11 is provided with a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15.
  • a cavity piece 17 is provided (assembled) in the piece recess 20 without protruding from the inner bottom surface 15 a of the cavity recess 15.
  • the cavity piece 17 is provided with a recess 21 for an elastic body.
  • the elastic body 16 is fixed to the cavity piece 17 by, for example, an adhesive. For this reason, the cavity piece 17 holds the elastic body 16. Therefore, in this embodiment, the cavity piece 17 is provided with the elastic body 16, and the cavity piece 17 integrated with the elastic body 16 is assembled to the upper mold 11. Although it is conceivable to attach the elastic body 16 directly to the upper mold 11 without using the cavity piece 17, the elastic body 16 can be easily assembled to the upper mold 11 through the cavity piece 17.
  • the elastic body 16 can be replaced and used when a desired sealing property cannot be ensured due to, for example, heating or deformation.
  • the resin mold 10 includes a liner 22 provided on the inner bottom surface 20a of the piece recess 20.
  • the cavity piece 17 is provided on the upper mold 11 via the liner 22.
  • the position adjustment (height adjustment) of the cavity piece 17 within the piece recess 20 can be easily performed.
  • a spring whose thickness can be changed according to pressure, and a wedge member whose thickness can be changed by inserting and removing are also applied. It is also possible to adjust the height (thickness) variation of each workpiece W by sliding the cavity piece 17 within the piece recess 20.
  • a release film (hereinafter, referred to as “parting surface 11 a”) of the upper mold 11 including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15 is formed. It is also simply called “film”.) F is stretched. Further, the workpiece W is arranged on the parting surface 12a (work placement portion 13) including the inner surface of the workpiece placement portion 13 of the lower mold 12.
  • a cavity C including the cavity recess 15 is formed, and the pot, the cal, the runner, A communication path (resin path) including the gate 14 is formed.
  • the elastic body 16 presses the mounting component 102, and the elastic body 16 is recessed by the mounting component 102 due to the reaction, so that the mounting component 102 The elastic body 16 protrudes into the cavity C so as to exceed the back surface 102a. For this reason, it is possible to prevent (seal) the resin R from leaking to the back surface 102a of the mounting component 102 at the time of resin injection / filling.
  • the elastic body 16 has a pressure-resistant region at a portion 16a (the central portion of the elastic body 16) facing the mounting component 102, and a portion 16b (the outer peripheral portion of the elastic body 16) facing the periphery of the mounting component 102. It becomes a seal area.
  • the elastic body 16 By pressing the film F against the back surface 102a of the mounting component 102 by the elastic body 16, there is no gap in the edge portion of the mounting component 102.
  • the resin R can be prevented from entering the gap. That is, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounted component 102. Therefore, according to the resin mold 10 in the present embodiment, the manufacturing yield of the resin molded product 100 can be improved, and the manufacturing cost can be reduced by eliminating the need for flash removal.
  • the height of the mounting component 102 between the workpieces W, or the back surface 102a of the mounting component 102 is curved or uneven. Even so, it can be absorbed by the elastic body 16.
  • the film F is considerably thin considering the followability to the uneven shape of the upper mold 11, dimensional accuracy, economy, etc., the film F alone is caused by the mounting component 102 as described above. In some cases, the generated gap cannot be sufficiently buried to prevent flashing. On the other hand, by using the elastic body 16 having an arbitrary thickness together with the film F, the gap generated at the edge portion of the back surface 102a of the mounting component 102 can be surely buried.
  • the protruding thickness A of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 is larger than the flatness of the back surface 102a of the mounting component 102, for example. Can be. According to this, in a state where the workpiece W is clamped (see FIG. 2), the elastic body 16 can be protruded more reliably around the mounting component 102 so as to exceed the back surface 102a of the mounting component 102. However, the elastic body 16 does not necessarily have to protrude from the inner bottom surface 15 a of the cavity recess 15.
  • the position of the back surface 102 a of the mounting component 102 can be made higher than the position of the inner bottom surface 15 a of the cavity recess 15.
  • the thickness of the elastic body 16 can be set arbitrarily.
  • the operation of the resin mold 10 in one embodiment of the present invention (resin molding method, resin mold product 100 manufacturing method) will be described with reference to FIGS.
  • the upper mold 11 is provided with the elastic body 16 in the elastic recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 as shown in FIG. 1. Yes.
  • the upper mold 11 stretches the film F on the parting surface 11 a including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15.
  • the workpiece W is disposed on the parting surface 12a (work placement portion 13), and the resin R is supplied to the pot.
  • the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. Then, the film F is adsorbed and held on the parting surface 11a of the upper mold 11 by a known suction mechanism (vacuum pump) using a gap between the cavity pieces 17 and a suction path (suction hole) (not shown). 11a is stretched.
  • the elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15. For this reason, the film F will be stretched also in the part which protrudes from the inner bottom face 15a.
  • This film F is heat resistant enough to withstand the heating temperature of the resin mold 10 and is easily peeled off from the parting surface 11a of the upper mold 11 and is a film material having flexibility and extensibility. is there.
  • the film F for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.
  • the elastic body concave portion 21 is provided in the cavity piece 17, and the cavity piece 17 is provided in the piece concave portion 20. For this reason, the film F can be sucked and held between the outer peripheral side surface of the cavity piece 17 and the inner wall surface of the concave portion 20 for the piece as a suction path.
  • the work W is transported to the resin mold 10 by a loader (not shown), and the work W is arranged on the parting surface 12a.
  • a resin R for example, a tablet, granule, powder, or liquid mold resin
  • the resin R is supplied to the pot. Since the resin mold 10 is heated to a predetermined temperature by the built-in heater, the resin R supplied to the pot is melted.
  • the workpiece W is clamped via the film F to form the cavity C including the cavity recess 15.
  • the upper die 11 and the lower die 12 are brought close to each other by a press mechanism, and the workpiece W is clamped by the upper die 11 and the lower die 12.
  • the elastic body 16 is provided in the elastic body recess 21 of the cavity piece 17, the cavity piece 17 presses (clamps) the workpiece W via the elastic body 16.
  • the elastic body 16 since the elastic body 16 having a strength lower than that of the mounting component 102 and the bump 103 and easily deformable is used, the elastic body 16 is deformed so as to be recessed by the mounting component 102 while the workpiece W is clamped. . As a result, the elastic body 16 is recessed by the mounting component 102, and the elastic body 16 protrudes from the inner bottom surface 15 a of the cavity recess 15 around the mounting component 102. That is, the surface of the portion 16 a of the elastic body 16 (facing surface 16 ab) is flush with the inner bottom surface 15 a of the cavity recess 15 and the portion 16 b of the elastic body 16 exceeds the back surface 102 a of the mounting component 102. It protrudes into the cavity C from the inner bottom surface 15a.
  • the elastic body 16 is entirely made of the same material (for example, fluororubber), and includes a portion 16a facing the mounting component 102 and a portion 16b facing the periphery of the mounting component 102. It has a plate shape with the same thickness. For this reason, for example, by using the elastic body 16 having an elastic modulus that can be crushed and deformed to the outside, the compressed volume of the elastic body 16 and the mounting can be obtained in a state where the workpiece W is clamped (see FIG. 2). The volume of the portion 16b of the elastic body 16 protruding so as to surround the component 102 is the same.
  • the elastic body 16 does not protrude downward on the outer periphery of the mounting component 102 by being compressed and deformed outward in this way, but rather the elastic body 16 in the pressure resistant region is simply compressed, so that the elasticity in the seal region is relatively increased.
  • the body 16 may protrude.
  • the elastic body 16 in addition to the fluororesin, a silicone resin and various engineering plastics can be used.
  • a high strength material such as a PEEK (polyetheretherketone) material
  • the liner 22 includes a spring to prevent damage to the mounting component 102 and the bump 103. Is preferred.
  • the concave portion 21 for the elastic body is provided in the cavity piece 17.
  • the elastic body 16 can be easily held in the upper mold 11 through the cavity piece 17.
  • the inner wall surface (edge) of the elastic body recess 21 provided in the cavity piece 17 serves as a wall, and the direction in which the elastic body 16 intersects the clamping direction when the workpiece W is clamped (the horizontal direction in FIG. 2). Can be prevented from spreading).
  • the elastic body 16 since the outer periphery of the elastic body 16 is surrounded by the cavity piece 17, the elastic body 16 does not spread laterally, for example, the outer peripheral side surface of the cavity piece 17 for adsorbing and holding the film F as described above The space between the inner wall surface of the recess 20 for the piece is not blocked, and the film F can be securely held by suction.
  • the film F is provided on the parting surface 11a of the upper mold 11 including the opposing surface 16ab of the elastic body 16 and the inner surface of the cavity recess 15, and the film F is clamped while the workpiece W is clamped.
  • the elastic body 16 is preferably recessed by the mounting component 102.
  • the structure which does not use the film F is also considered, by using the film F, the elastic body 16 can be protected. Specifically, the angular mounting component 102 can be prevented from being pressed and damaged, and the durability of the elastic body 16 can be improved by preventing the occurrence of cracks and deterioration. Further, direct contact with the resin R can be prevented, and deterioration of the elastic body 16 due to the resin R can also be prevented.
  • the elastic body 16 can be selected without considering the corrosion resistance due to the resin R. Furthermore, since the resin F can be prevented from entering the gap between the cavity piece 17 and the cavity recess 15 by using the film F, the elastic body 16 is deformed by filling the gap with the resin R. And the elastic body 16 does not come off with the release of the resin R.
  • the transfer mechanism is driven to inject the resin R into the cavity C, and the filling of the resin R into the cavity C is completed.
  • the plunger provided in the pot of the lower mold 12 so as to be movable back and forth is advanced to the cull side (upper mold 11 side), and the resin R melted in the pot is moved by the plunger (tip portion). Press.
  • the resin R pressed by the plunger enters the cavity C through the cull and runner gate 14. That is, the resin R is poured into the cavity C.
  • the plunger is further advanced toward the cull side to inject (pressure feed) the resin R into the cavity C, and the cavity C is filled with the resin R. At this time, the resin R is pressurized in the cavity C so as to press the film F.
  • the workpiece W is flip-chip mounted on the substrate 101 via a plurality of bumps 103, the surface of the substrate 101 (mounting surface) and the main surface of the mounting component 102 (bump 103 is formed).
  • the resin R is also filled in a narrow area with the formed surface) (mold underfill).
  • the resin R used for the mold underfill can be filled in a narrow space such as between the bumps 103 or under the mounting component 102, and on the other hand, flashing on the mounting component 102 is also likely to occur.
  • the seal structure as described above is very effective.
  • the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby a resin mold portion 104 (resin R) as shown in FIG.
  • the resin molded product 100 (work W) provided with is almost completed as a molded product.
  • the back surface 102 a of the mounting component 102 is exposed from the resin mold portion 104.
  • a peripheral groove 105 formed by the elastic body 16 (part 16b) protruding from the inner bottom surface 15a of the cavity recess 15 is formed in the resin mold portion 104 so as to surround the back surface 102a of the mounting component 102 having a rectangular shape in plan view. Has been.
  • the elastic body 16 having a compressive stress higher than the molding pressure at the time of holding pressure is used to face the periphery of the mounting component 102 in a state where the resin R filled in the cavity C is held. It is also possible to prevent the portion 16b of the elastic body 16 from being deformed.
  • the resin 16 is prevented from leaking to the back surface 102a of the mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the mounting component 102 (flow of the resin R). Can be interrupted). Thereby, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounting component 102. Therefore, the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
  • the back surface 102 a of the mounting component 102 is sealed while being buried in the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15. For this reason, the back surface 102a of the mounting component 102 and the front surface (upper surface in FIG. 4) of the resin mold portion 104 are flush with each other. For example, even if a heat sink having a flat connection surface is used, the back surface 102a and the resin mold portion 104 are used. It is possible to use an inexpensive heat sink.
  • FIG. 5 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16A In the state where the mold is opened, the elastic body 16A has a flat opposing surface 16ab, and with reference to this, the thickness is thin at the center (part 16a) of the elastic body 16A and thick at the outer peripheral part (part 16b). It has a concave shape.
  • the elastic body 16A is provided in the elastic body recess 21 of the cavity piece 17A, the cavity piece 17A is provided with a protrusion 17a protruding from the inner bottom surface 21a of the elastic body recess 21.
  • the elastic body 16A is provided (assembled) in the elastic concave portion 21 of the cavity piece 17A so that the convex portion 17a is fitted into the concave elastic body 16A.
  • the thickness of the elastic body 16A in the pressure-resistant region is reduced, and the mounting component 102 is lifted by the pressure of the resin R filled in the cavity C. Can be prevented. That is, when the elastic body 16A is thick due to the resin pressure of the resin R filled between the substrate 101 and the mounting component 102, the mounting component 102 supported by the elastic body 16A is deformed so as to have a medium height. Sometimes. On the other hand, such deformation of the mounting component 102 can be prevented by reducing the thickness of the elastic body 16A in the pressure resistant region (in other words, providing the convex portion 17a).
  • the elastic body 16 is bonded and fixed to the cavity piece 17 has been described. Not limited to this, as shown in the present embodiment, the elastic body 16 may be secured to the cavity piece 17A by being prevented from coming off.
  • the cavity piece 17c is fitted into the concave part 17b provided so as to be recessed from the outer wall surface of the convex part 17a of the cavity piece 17A, and the convex part 16c provided so as to protrude from the inner wall surface of the concave elastic body 16A.
  • the elastic body 16 is secured to the 17A and fixed.
  • the elastic body 16A can be fixed by forming an internal thread on the outer wall surface of the convex portion 17a of the cavity piece 17A and an external thread on the inner wall surface of the concave elastic body 16A and tightening the cavity piece 17A.
  • FIG. 6 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16B is provided with a convex portion 16d (flange portion) so as to protrude from the outer wall surface on the inner bottom surface 21a side of the concave portion 21 for elastic body.
  • the cavity piece 17B is provided with a recess 17c so as to be recessed from the inner wall surface of the elastic body recess 21.
  • the cavity piece 17B is configured to be divided into an upper block 17d and a lower block 17e.
  • the upper block 17d and the lower block 17e are divided on the same plane as the inner bottom surface 21a of the elastic body recess 21. For this reason, the lower block 17e becomes a ring-shaped hollow part, and the upper block 17d becomes a cover part.
  • the elastic body 16B In order to fix the elastic body 16B to the cavity piece 17B, first, the upper block 17d and the lower block 17e are divided. Next, the elastic body 16B is fitted into the ring-shaped lower block 17e so that the convex portion 16d of the elastic body 16B is hooked on the concave portion 17c of the lower block 17e (cavity piece 17B). Next, the lower block 17e and the upper block 17d are assembled so as to cover the elastic body 16B and the lower block 17e with the upper block 17d, and screwed with, for example, a bolt (not shown), so that the elastic body 16B is cavity piece. Secure to 17B. Thereafter, the cavity piece 17B integrated with the elastic body 16B is provided (assembled) in the concave part 20 for the piece. Thereby, the elastic body 16B can be reliably fixed to the cavity piece 17B. Further, it is possible to cope with a change in the arrangement of the mounting component 102 by simply replacing the elastic body 16B and the lower block 17e.
  • FIG. 7 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • FIG. 14 is a cross-sectional view schematically showing the resin molded product 100 during the manufacturing process.
  • the workpiece W in the present embodiment includes a substrate 101 (for example, a wiring substrate), a chip component 102A such as a semiconductor chip as a mounting component, and a columnar conductor 102B (via member) made of a conductive material such as copper. It has.
  • the chip component 102A is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed.
  • the other surfaces (main surface, side surface) are resin-molded.
  • the columnar conductor 102B is mounted on the substrate 101, the other end surface 102b opposite to the one end surface on the mounting side is exposed, and the other surface (side surface) is resin-molded. Thereby, not only the board
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 in a state where the mold is opened.
  • the elastic body 16 has a facing surface 16ab facing the chip component 102A and the columnar conductor 102B (mounting component) wider than the back surface 102a of the chip component 102A to be clamped and the other end surface 102b (clamping surface) of the columnar conductor 102B. It has a shape.
  • the elastic body 16 is deformed so as to be recessed by the chip component 102A and the columnar conductor 102B.
  • the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of the chip component 102A or the columnar conductor 102B. It protrudes into the cavity C from the inner bottom surface 15a of the cavity recess 15 so as to exceed the other end surface 102b.
  • resin is applied to the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the chip component 102A and the columnar conductor 102B.
  • R can be prevented from leaking.
  • the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
  • the chip parts 102A and the columnar conductors 102B which are likely to be different in height due to being manufactured separately, are collectively resin-molded, the height variations that cannot be absorbed by the film F alone are compensated. It is possible to prevent the flash from occurring on the end surfaces (the back surface 102a and the other end surface 102b) of the member.
  • the resin molded product 100 manufactured with the resin mold 10 in this embodiment is formed on the substrate 101 with the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B exposed.
  • the resin mold portion 104 is provided.
  • the resin mold portion 104 has a circumferential groove 105 (105A, 105B) that is molded by a portion 16b of the elastic body 16 that prevents the occurrence of flash in the resin molding process.
  • the circumferential groove 105A is formed around the back surface 102a of the chip component 102A
  • the circumferential groove 105B is formed around the other end surface 102b of the columnar conductor 102B.
  • a resin mold product 100 having high shielding properties can be obtained.
  • the manufacturing method will be described as applied to a resin molded product 100 (semiconductor package) including a semiconductor chip (chip component 102A) as having high shielding properties.
  • the film F is peeled off and the resin mold 10 is resin-molded. Remove product 100.
  • shielding ink or shielding paste is applied to the package surface (resin mold portion 104, chip component 102 ⁇ / b> A and columnar conductor 102 ⁇ / b> B exposed from resin mold portion 104) to form shield layer 120. .
  • the shield layer 120 is electrically connected to the columnar conductor 102B.
  • a plurality of mounting bumps 121 for mounting the resin mold product 100 on another mounting substrate is formed on the back surface of the substrate 101 (the surface opposite to the surface on which the resin mold portion 104 is formed). At this time, a certain mounting bump 121 is electrically connected to the columnar conductor 102 ⁇ / b> B via the in-substrate wiring 122.
  • the in-substrate wiring 122 constituted by the multilayer wiring layers provided in the substrate 101 and vias between them is schematically shown by broken lines.
  • electromagnetic waves are allowed to flow to the ground (GND) through the shield layer 120, the columnar conductor 102B, the in-substrate wiring 122, and the mounting bumps 121 to exert a shielding function.
  • GND ground
  • the shielding ink or shielding paste using a material having high thermal conductivity the heat radiation area can be increased, and a heat radiation function of the semiconductor chip (chip component 102A) can be expected.
  • the conductive shield layer 120 When forming the conductive shield layer 120, it is possible to use an electrostatic coating method in which a coating liquid as described later is discharged from the nozzle while applying a potential difference between the nozzle and an object to be coated. Also, inkjet method, plating method, PVD ( A physical vapor deposition (CVD) method, a chemical vapor deposition (CVD) method, a spray coating method, a printing method, or the like can also be used.
  • a coating liquid (ink) in which fine powder (metal such as Ag or carbon) having conductivity or magnetism and a binder resin are dissolved in a solvent can be used.
  • the resin mold 10 in the present embodiment it is possible to reliably expose all the columnar conductors 102B that are difficult to install at a uniform height.
  • a separate process for exposing the columnar conductor 102 ⁇ / b> B is not performed, and the shielding function is reliably exhibited in all the resin molded products 100. Can be made.
  • FIG. 8 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • a plurality of elastic bodies 16 are provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened.
  • Each elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the mounting component 102a (clamp surface).
  • each elastic body 16 is deformed so as to be recessed by the respective mounting component 102. More specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the cavity 16 so that the portion 16b of the elastic body 16 exceeds the back surface 102a of the mounting component 102.
  • the recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • each mounted component 102 since each mounted component 102 inevitably varies in height from the substrate 101 when mounted, it may be difficult to absorb the variation in height with only the thin film F. is there. For this reason, it is possible to absorb variations in the mounting height of the mounting component 102 by providing the elastic body 16 at each position of the mounting component 102.
  • the resin R can be prevented from leaking to the back surface 102a of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. .
  • the resin R can be prevented from leaking to the back surface 102a of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. .
  • the resin R is molded on the outer periphery of the elastic body 16 at the end face of the cavity piece 17, the resin can be molded with a desired dimensional accuracy, and the surface of the molded product supporting the heat sink can be set to an arbitrary height. It can be reliably molded. Further, since the elastic body 16 is provided for each mounting component 102, it can be partially replaced, and there is an effect that maintenance is easy.
  • FIG. 9 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened.
  • the elastic body 16 has a facing surface 16ab facing the plurality of mounting components 102 wider than the back surfaces 102a (clamp surfaces) of the plurality of mounting components 102. In this case, since it is not necessary to provide the elastic body recesses 21 by the number of the mounting components 102, a simple mold configuration can be achieved.
  • the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the back surface 102a of each mounting component 102.
  • the cavity recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • each mounting component 102 when molding is performed using one elastic body 16, the back surface of each mounting component 102 is formed by the portion 16 b of the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15 around each mounting component 102. It is possible to prevent the resin R from leaking to 102. Thereby, it is possible to prevent the flash from occurring on the back surface 102a of each mounted component 102 with a simple configuration. Therefore, a resin mold product capable of preventing flashing can be manufactured at a low cost.
  • FIGS. 10 and 11 are cross-sectional views schematically showing the main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • a part 16e (protruding facing surface) of the facing surface 16ab of the elastic body 16C is formed in the cavity recess 15 so as to correspond to each mounting component 102. Is provided so as to protrude from the inner bottom surface 15a.
  • the other part excluding the part 16e of the facing surface 16ab of the elastic body 16C is provided so as to be flush with the inner bottom surface 15a of the cavity recess 15.
  • the elastic body 16 ⁇ / b> C has a shape in which a part 16 e of the facing surface 16 ab facing the mounting component 102 is wider than the back surface 102 a (clamp surface) of the mounting component 102.
  • the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface of the portion 16a of the elastic body 16 (a part 16e of the facing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of each mounting component 102. So as to protrude from the inner bottom surface 15a of the cavity recess 15 into the cavity C.
  • the resin R can be prevented from leaking to the back surface 102 of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. . Accordingly, the upper surface of the molded product can be formed flat by the facing surface 16ab that is maintained flat in the elastic body 16C while preventing flash from occurring on the back surface 102a of each mounted component 102. Therefore, it is possible to efficiently produce a resin mold product with high heat generation using a heat sink. Further, unlike the fifth embodiment, there is no need to provide the recesses 21 for the elastic body according to the number of the mounting components 102, so that a resin mold product using a heat sink can be produced with a simple mold.
  • FIG. 12 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the resin mold 10 in the present embodiment has a swivel structure in which the upper mold 11A can tilt the swivel piece 17C.
  • the upper mold 11A of the swivel structure includes a swivel piece 17C, a guide piece 18 that supports the swivel piece 17C in a suspended manner, and a spring 19 that is elastically mounted between the swivel piece 17C and the guide piece 18.
  • a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided.
  • a swivel piece 17C constituting the inner bottom surface 15a of the cavity concave portion 15 is provided (assembled) together with the guide piece 18 in the concave portion 20 for the piece.
  • a convex spherical surface portion 17f is provided on the surface opposite to the inner bottom surface 15a of the swivel piece 17C.
  • the guide piece 18 facing the convex spherical portion 17f is provided with a concave spherical portion 18a.
  • a spring 19 is provided around the convex spherical portion 17f and the concave spherical portion 18a.
  • the swivel piece 17C which is a cavity piece, tilts with the convex spherical portion 17f guided by the concave spherical portion 18a.
  • the swivel piece 17 ⁇ / b> C is provided with an elastic recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15.
  • the elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 into the cavity recess 15.
  • the workpiece W in the present embodiment is a workpiece in which a plurality of semiconductor chips 112 are sandwiched between an upper electrode 110 and a lower electrode 111 formed of, for example, a lead frame.
  • the semiconductor chip 112 is joined to the upper electrode 110 on the upper surface side and the lower electrode 111 on the lower surface side by solder.
  • the upper electrode 110 and the lower electrode 111 are also used as a heat sink.
  • different types of semiconductor chips 112 for example, IGBT elements and flywheel diode elements used in an inverter structure
  • the upper electrode 110 is inclined with respect to the lower electrode 111.
  • work W in this embodiment is arrange
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to the upper electrode 110 in a state where the mold is opened.
  • the elastic body 16 has a shape in which the facing surface 16ab facing the upper electrode 110 is wider than the upper surface (clamp surface) of the upper electrode 110.
  • the elastic body 16 is deformed so as to be recessed by the upper electrode 110. Specifically, the surface of the portion 16a of the elastic body 16 (opposing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the upper surface 110a of the upper electrode 110.
  • the recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • the swivel piece 17C tilts following the inclination, so that the workpiece W can be clamped while preventing the one-side contact.
  • the resin R can be prevented from leaking to the upper surface 110a of the upper electrode 110 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the upper electrode 110. Thereby, it is possible to prevent the flash from occurring on the upper surface 110a of the upper electrode 110. Therefore, it is possible to prevent the occurrence of flash even with a workpiece W having a variation in thickness or tilting.
  • FIG. 13 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16D is formed in a rectangular frame shape that is arranged along the outer periphery of the mounting component 102.
  • the cavity piece 17D is provided with a convex portion 17a protruding from the inner bottom surface 21a of the elastic body concave portion 21. That is, the elastic body 16D is provided in the elastic body concave portion 21 of the cavity piece 17D so as to be fitted into the rectangular frame-shaped elastic body 16D along the outer periphery of the convex portion 17a.
  • the elastic body 16D is formed to have such a width that the position of the inner peripheral surface thereof covers the position of the outermost bump 103. According to this, the deformation of the mounting component 102 when clamped is prevented. can do.
  • the mounting component 102 By using the elastic body 16D arranged along the outer periphery of the mounting component 102, since the elastic body 16D is not provided in the pressure-resistant region, the mounting component 102 is pressed by the pressure of the resin R filled in the cavity C. It can be surely prevented from floating. Accordingly, the above-described deformation of the mounting component 102 can be prevented while reliably preventing flash. Also in the present embodiment, a gap directed toward the cavity C is formed between the elastic body 16D and the cavity piece 17D, but the resin F enters the gap by using the film F. It can be formed continuously.
  • the recessed part 17b provided so that it might dent in the outer wall surface of the convex part 17a of cavity piece 17D, and the wall surface facing this wall surface so that it might protrude from the inner wall surface and outer wall surface of rectangular-frame-shaped elastic body 16D. It is also possible to fix the elastic body 16D to the cavity piece 17D by fitting the convex portion 16c.
  • the elastic body 16 made of the same material has a plate shape in which the thickness of the portion 16a facing the mounting component 102 and the thickness of the portion 16b facing the periphery of the mounting component 102 are the same.
  • the elastic body is made of a material having a hard portion facing the mounting component and a softness in the portion facing the mounting component, and facing the mounting component and the periphery of the mounting component. It may have a plate-like shape with the same thickness. According to this, the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
  • the configuration example in which the elastic body 16 is fitted in the recess 21 for the elastic body provided on the lower surface of the cavity piece 17 has been described.
  • the elastic body is attached to the cavity piece having the flat lower surface. It is good also as a structure to attach. According to this, since it is not necessary to form the concave portion for the elastic body according to the arrangement of the mounting component 102, the same cavity piece can be used even if the arrangement of the mounting component 102 changes. Moreover, it is good also as a structure which can provide the unevenness

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PCT/JP2014/079747 2014-01-14 2014-11-10 樹脂モールド金型および樹脂モールド方法 WO2015107758A1 (ja)

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CN108761876A (zh) * 2018-05-21 2018-11-06 武汉华星光电半导体显示技术有限公司 显示组件制造装置及方法、显示组件
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JP7391051B2 (ja) 2018-06-18 2023-12-04 ベシ ネーデルランズ ビー．ヴイ． 電子部品封止用の金型、その金型用インサート、インサートの製造方法および電子部品の封止方法

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TWI645952B (zh) 2019-01-01
KR102335853B1 (ko) 2021-12-07
JP6422447B2 (ja) 2018-11-14
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