KR102335853B1 - 수지 몰드 금형 및 수지 몰드 방법 - Google Patents

수지 몰드 금형 및 수지 몰드 방법 Download PDF

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Publication number
KR102335853B1
KR102335853B1 KR1020167019898A KR20167019898A KR102335853B1 KR 102335853 B1 KR102335853 B1 KR 102335853B1 KR 1020167019898 A KR1020167019898 A KR 1020167019898A KR 20167019898 A KR20167019898 A KR 20167019898A KR 102335853 B1 KR102335853 B1 KR 102335853B1
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KR
South Korea
Prior art keywords
elastic body
resin
cavity
mounting component
mold
Prior art date
Application number
KR1020167019898A
Other languages
English (en)
Korean (ko)
Other versions
KR20160106614A (ko
Inventor
마코토 가와구치
마사아키 와쿠이
Original Assignee
아피쿠 야마다 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아피쿠 야마다 가부시키가이샤 filed Critical 아피쿠 야마다 가부시키가이샤
Publication of KR20160106614A publication Critical patent/KR20160106614A/ko
Application granted granted Critical
Publication of KR102335853B1 publication Critical patent/KR102335853B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020167019898A 2014-01-14 2014-11-10 수지 몰드 금형 및 수지 몰드 방법 KR102335853B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014004448 2014-01-14
JPJP-P-2014-004448 2014-01-14
PCT/JP2014/079747 WO2015107758A1 (ja) 2014-01-14 2014-11-10 樹脂モールド金型および樹脂モールド方法

Publications (2)

Publication Number Publication Date
KR20160106614A KR20160106614A (ko) 2016-09-12
KR102335853B1 true KR102335853B1 (ko) 2021-12-07

Family

ID=53542662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167019898A KR102335853B1 (ko) 2014-01-14 2014-11-10 수지 몰드 금형 및 수지 몰드 방법

Country Status (5)

Country Link
JP (1) JP6422447B2 (zh)
KR (1) KR102335853B1 (zh)
CN (1) CN105917451B (zh)
TW (1) TWI645952B (zh)
WO (1) WO2015107758A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9911700B2 (en) * 2016-01-26 2018-03-06 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Embedded packages
TWI585904B (zh) * 2016-04-22 2017-06-01 矽品精密工業股份有限公司 電子封裝件及基板結構
JP6423399B2 (ja) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 樹脂成形方法、フィルム搬送装置および樹脂成形装置
JP2019083276A (ja) * 2017-10-31 2019-05-30 エムテックスマツムラ株式会社 半導体素子パッケージの製造方法
US11227810B2 (en) * 2017-11-10 2022-01-18 Shindengen Electric Manufacturing Co., Ltd. Electronic module with a groove and press hole on the surface of a conductor
DE102017131110A1 (de) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh Verfahren zum einbetten von optoelektronischen bauelementen in eine schicht
CN108761876A (zh) * 2018-05-21 2018-11-06 武汉华星光电半导体显示技术有限公司 显示组件制造装置及方法、显示组件
US10950818B2 (en) 2018-05-21 2021-03-16 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Apparatus and method for manufacturing display assembly
NL2021145B1 (en) * 2018-06-18 2020-01-06 Besi Netherlands Bv Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
CN108831839B (zh) * 2018-06-22 2020-03-24 苏州震坤科技有限公司 一种去除半导体塑封制程中所产生毛边的方法
CN111952205B (zh) * 2020-03-26 2022-04-19 神盾股份有限公司 模块化模具及使用其制作指纹感测模块的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128303A (ja) 2002-10-04 2004-04-22 Towa Corp アンダーフィル樹脂モールド基板及び個片とアンダーフィル樹脂モールド方法及び金型
JP2006027082A (ja) * 2004-07-16 2006-02-02 Towa Corp 半導体素子の樹脂封止成形方法
JP2007505491A (ja) * 2003-09-09 2007-03-08 フィーコ ビー．ブイ． 可撓性圧力素子を用いて電子部品をカプセル封入する方法および装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP5084829B2 (ja) * 2007-06-28 2012-11-28 パナソニック株式会社 半導体素子の実装構造体の製造方法、半導体素子の実装方法、及び加圧ツール
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
JP5185069B2 (ja) 2008-10-31 2013-04-17 アピックヤマダ株式会社 トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128303A (ja) 2002-10-04 2004-04-22 Towa Corp アンダーフィル樹脂モールド基板及び個片とアンダーフィル樹脂モールド方法及び金型
JP2007505491A (ja) * 2003-09-09 2007-03-08 フィーコ ビー．ブイ． 可撓性圧力素子を用いて電子部品をカプセル封入する方法および装置
JP2006027082A (ja) * 2004-07-16 2006-02-02 Towa Corp 半導体素子の樹脂封止成形方法

Also Published As

Publication number Publication date
KR20160106614A (ko) 2016-09-12
CN105917451A (zh) 2016-08-31
CN105917451B (zh) 2018-07-06
TWI645952B (zh) 2019-01-01
WO2015107758A1 (ja) 2015-07-23
JP6422447B2 (ja) 2018-11-14
JPWO2015107758A1 (ja) 2017-03-23
TW201532774A (zh) 2015-09-01

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