WO2015096667A1 - 线路板的钻孔方法 - Google Patents

线路板的钻孔方法 Download PDF

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Publication number
WO2015096667A1
WO2015096667A1 PCT/CN2014/094351 CN2014094351W WO2015096667A1 WO 2015096667 A1 WO2015096667 A1 WO 2015096667A1 CN 2014094351 W CN2014094351 W CN 2014094351W WO 2015096667 A1 WO2015096667 A1 WO 2015096667A1
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Prior art keywords
circuit board
drilling
positioning
hole
target
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PCT/CN2014/094351
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English (en)
French (fr)
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任小浪
陈蓓
樊光辉
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
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Publication of WO2015096667A1 publication Critical patent/WO2015096667A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Definitions

  • the invention relates to a method for preparing a circuit board, in particular to a method for drilling a circuit board.
  • Drilling is a very important process in the PCB manufacturing process. Drilling on the circuit board is mainly used for soldering of circuit board components and conduction between layers. At present, the drilling process of the PCB board is completely drilled from one side of the PCB to the other side by using a drill. For a PCB with a high aspect ratio, when drilling with a conventional drill, it is limited by the length of the blade edge. When drilling a PCB, and changing to a drill with a long blade length, it is easy to break because the strength of the drill is reduced. Once the drill is broken, it is difficult to remove it from the PCB, which inevitably causes the PCB to be scrapped. Moreover, the thickness of the plate is a very important factor affecting the accuracy of the hole position.
  • the object of the present invention is to overcome the defects of the prior art and to provide a method for drilling a circuit board, which can realize drilling of a high-thickness ratio circuit board and obtain a high-precision hole position.
  • the present invention adopts the following technical solutions:
  • a method for drilling a circuit board includes the following steps:
  • the direction target is one, and is disposed outside the horizontal center line and the vertical center line of the circuit board;
  • the holes are drilled from the front and back sides of the board, respectively, so that the front and back holes are formed into through holes.
  • the drilling method of the present invention reduces the depth of each required drilling by drilling holes from the front and the back of the circuit board, so that it is not necessary to use a drill having a particularly long blade length, and the long blade is used in drilling.
  • Drilling technology is a difficult problem. For drilling holes from different faces, it is necessary to ensure that the hole axes of the front hole drilling and the reverse hole drilling coincide to avoid deviation.
  • the drilling method of the present invention can realize high-precision positioning by using the positioning target and the positioning hole to ensure high-precision positioning. The high precision of the drilling hole position, together with the direction target and the direction hole, is used to identify the direction of the circuit board and avoid the hole position error caused by the wrong direction.
  • the positioning target is 3-6, and the positioning pattern formed by the positioning target as the end point is symmetric with the horizontal center line or the vertical center line of the circuit board.
  • the positioning target needs to be evenly distributed on the circuit board to reduce the deviation of the positioning.
  • the positioning target is designed to be inverted and the position of the positioning hole is the same as that before the flipping, that is, the positioning pattern formed by the positioning target as the end point needs to be set along the The horizontal centerline or vertical centerline of the board is symmetrical.
  • the positioning targets are an odd number, one positioning target must be located on the horizontal centerline or vertical centerline of the board.
  • the positioning targets are preferably four, and the four positioning targets are end points to form a rectangular positioning pattern.
  • the positioning target is 3
  • the positioning pattern of the isosceles triangle can be selected.
  • the positioning target is 4, the positioning pattern of the isosceles trapezoid can also be selected.
  • the regular pentagon or regular hexagon can also be selected. Wait.
  • the positioning target is 4, and the 4 positioning targets are end points.
  • Forming a rectangular positioning pattern; the direction target is located on one side of the positioning pattern and is 4-7 mm away from the positioning target of one of the end points of the edge.
  • the four positioning targets are placed on the four corners of the circuit board to reduce the influence on the circuit board pattern, and the direction target is located on one side of the rectangle instead of the other positions of the circuit board, also to reduce the line The influence of the board graphics. It is estimated that the distance from the nearest target is preferably 4-7mm. When the distance is too far, it is difficult to identify, and when the distance is too close, it will affect each other. Therefore, in practice, 4-7mm is used. good.
  • the positioning target is disposed on each inner panel of the circuit board, and after the circuit board is pressed, the positioning targets on the inner layers of the different layers overlap, and are automatically recognized by the X-ray punching machine. Select the position with the highest degree of overlap to punch out the positioning hole.
  • positioning targets can be set according to the inner panel pattern of each layer, and a more accurate hole position can be obtained for each inner panel pattern, and finally, X-ray automatic recognition, The position with the highest degree of overlap of the positioning target is selected to punch out the positioning hole, and the requirements of the hole position of each layer pattern are comprehensively considered, and the degree of deviation is reduced.
  • the directional holes can also be made in a similar manner, that is, a directional target is placed on each of the inner panels, and then automatically recognized by the X-ray punching machine to punch out the directional holes.
  • the positioning target is fabricated by the method of exposing, developing, and etching the pattern of the positioning target during the inner layer patterning.
  • directional targets can be made in a similar manner.
  • the positioning target or the direction target it can be covered with a dry film to prevent the copper layer of the target pattern from being etched away by the subsequent etching process to form a copper layer to display the target pattern;
  • the dry film removal at the target pattern causes the copper layer of the target pattern to be etched away by a subsequent etching process to form a pattern in which the copper layer is missing to display the target pattern.
  • the positioning target and/or the directional target include a circle, a cross, a concentric ring, a rectangle, an equilateral triangle, etc., so as to facilitate the identification of the X-ray punching machine.
  • the reverse side of the circuit board is first drilled to form a reverse half hole, and then the line is The front side of the plate is drilled to form a through hole that is open to the opposite side of the hole. Since some holes that do not need to be drilled back and forth can be produced together in the front hole drilling, firstly drilling the opposite side, that is, the back side with less drilling, can reduce the downtime caused by setting parameters and drilling the drill, thereby improving production. effectiveness. In addition, it also prevents the operator from forgetting to drill the reverse side.
  • the segmented drilling is divided into at least two divisions for the reverse drilling and the front drilling of the wiring board.
  • the ratio of the depth of the drilled circuit board to the diameter of the drill is ⁇ 10
  • the method of segmented drilling is required, wherein the number of segments is preferably 3 to 5 segments.
  • the depth of the drilled circuit board is determined according to the thickness of the circuit board and the overlap length of the drill hole, and the overlap length of the drill hole is the front side drilling and the reverse side.
  • the hole overlap length h 2 is generally 0.5 to 1.0 mm, and can also be flexibly set according to specific needs.
  • the length of the cutting edge is determined according to the depth of the drilled circuit board, the thickness of the cover plate, and the length of the retracted chip, that is, the length of the drill blade l ⁇ the depth of the drilled circuit board S 1 (or S 2 )+
  • the thickness of the cover h 1 + reserve the length d of the chip. That is, l ⁇ S 1 (or S 2 ) + h 1 + d.
  • the thickness of h 1 is usually 0.1 to 0.2 mm
  • d is usually 0.5 mm
  • the diameter of the pin is usually 3.15 mm.
  • the present invention has the following beneficial effects:
  • the method for drilling a circuit board according to the present invention can reduce the depth of each required drilling by drilling holes from the front and the back of the circuit board, thereby avoiding the use of a long-edge drill. And positioning with the positioning target and the direction target, respectively, from the front and back of the circuit board, obtaining high-precision hole position and then drilling, avoiding the hole caused by the weakening of the cutting material in the circuit board. Poor bit precision The problem.
  • FIG. 1 is a schematic diagram of a positioning method of a drilling method positioning target and a direction target in a specific embodiment.
  • a method for drilling a circuit board includes the following steps:
  • a positioning target 1 and a directional target 2 are disposed on the circuit board, and the positioning target 1 is four, which are respectively disposed in four angular directions of the circuit board, and the four positioning targets are respectively 1 is a positioning pattern in which the end points form a rectangle.
  • the direction target 2 is one, located on one side of the rectangular positioning pattern, and is close to a positioning target of the edge end, and the distance from the positioning target is 5-6 mm.
  • the positioning target and the direction target pattern are formed on each inner panel by exposure, development and etching.
  • the positioning targets on the inner plates of the different layers overlap, and the direction targets on the inner plates of the different layers overlap.
  • the implementation of the drilling method of this embodiment requires a front hole drilling file and a reverse drilling file.
  • the front hole drilling file is completed according to the normal process, and the reverse drilling file needs to be mirrored and then lost.
  • the mirroring mode includes two types of left and right mirroring and upper and lower mirroring.
  • the left and right mirroring modes use the vertical center line 3 of the circuit board as a mirror axis
  • the upper and lower mirroring modes use the horizontal center line 4 of the circuit board as a mirror axis.
  • the vertical center line 3 is used as the mirror axis, and the mirror image is the left and right mirror image; if the positioning pattern is symmetrical along the horizontal center line of the circuit board, the horizontal center is Line 4 is used as the mirror axis, and the mirror mode is the upper and lower mirror.
  • X-ray automatic punching equipment ie X-Ray punching machine
  • set the relevant parameters send the circuit board to be produced to the equipment workbench, move and adjust the position of the circuit board, and make X -Ray punching machine finds the positioning target and direction target set in the inner layer of the circuit board, automatically recognizes it by X-ray punching machine, selects the position with the highest degree of overlap, and measures the actual position data, starts the punching machine, and rushes A positioning hole and a directional hole having a diameter of 3.175 mm are produced.
  • Determining the depth of the hole determining the depths S 1 and S 2 of the front and back holes according to the thickness h of the board and the length h 2 of the hole, the length of the hole being overlapped by the front hole and the back side
  • the thickness h of the circuit board is 4.5 mm
  • the depth S 1 of the front hole and the depth S 2 of the back hole are 2.6 mm
  • the method of segment drilling is required, wherein the number of segments is 4 paragraphs.
  • Drill selection According to the depth of the drilled circuit board S 1 (or S 2 ), the thickness h 1 of the cover plate and the length d of the reserved chip retreat, determine the length of the drill blade l, l ⁇ S 1 (or S 2 ) + h 1 +d.
  • the thickness of h 1 is usually 0.1 to 0.2 mm
  • d is usually 0.5 mm
  • the diameter of the pin is usually 3.15 mm.
  • the depth of the drilled circuit board is 2.6 mm
  • the thickness h 1 of the cover plate is 0.1 mm
  • a drill having a blade length of 3.5 mm and a diameter of 0.15 mm is selected.
  • Drilling production Determine the coordinate system of the reverse drilling file and the machine table, import the reverse drilling file, set the parameters and the drill, drill the fixing hole corresponding to the positioning hole on the electric board, and screw the pin, then Install the circuit board and the cover plate in turn, wherein the circuit board needs to face the upper upper plate with the reverse side, and use the direction hole to position, to ensure that the direction of the circuit board needs to be consistent with the reverse hole drilling file; according to the above set parameters
  • the drilling depth on the reverse side is controlled to drill the drill from the opposite side to form a reverse half hole.
  • Remove the cover plate and the circuit board import the front hole drilling file, and turn the circuit board over, then install the circuit board and the cover plate in turn.
  • the circuit board needs to face up and the upper board.
  • the direction hole is used for positioning.
  • the direction of the circuit board is consistent with the front hole drilling file. After the circuit board and the cover plate are fixed, the drill is controlled to drill from the front side to form a through hole which is connected with the reverse half hole to complete the drilling.
  • a common drill with a blade length of 3.5 mm and a diameter of 0.15 mm is drilled through a 4.5 mm thick circuit board, that is, a drill hole having a thickness to diameter ratio of 30:1 is completed.
  • the drill is not easy to break during the drilling process, and the hole position of the front hole and the back hole is high, the hole axes are completely coincident, and there is no deviation, and for each inner plate, the hole position precision of the hole is also very high.

Abstract

一种线路板的钻孔方法，包括以下步骤：在线路板上设置定位标靶（1）和方向标靶（2），并在定位标靶（1）处钻出定位孔，在方向标靶（2）处钻出方向孔，利用方向孔识别线路板的方向；分别从线路板的正面和反面钻孔，使正面和反面的钻孔形成通孔。该钻孔方法能够实现高厚径比的线路板钻孔，并能获得高精度的孔位。

Description

线路板的钻孔方法 技术领域
本发明涉及一种线路板制备方法，特别是涉及一种线路板的钻孔方法。
背景技术
钻孔是PCB制作过程中一个非常重要的工序，在线路板上钻孔主要用于线路板元件的焊接及层与层之间的导通。目前PCB板的钻孔工艺是采用钻刀从PCB的一面向另一面完全钻穿，对于高厚径比的PCB板，在使用普通的钻刀钻孔时，受刀刃刃长的限制，无法一次性钻穿PCB板，而改用刃长较长的钻刀时，又因为钻刀的强度降低，容易折断，钻刀一旦折断，则很难从PCB板中取出，必然使PCB板报废。并且，板厚是影响孔位精度一个非常关键的因素，PCB板越厚，钻孔的孔位精度会越低，特别是反面孔位，由于未被切削材料的厚度越来越薄，抵抗形变的能力慢慢减弱，致使反面孔的精度会变得非常差。因此，对于此类高厚径比的PCB板材而又需要获得高精度孔位的问题，用一般的钻孔方法难以实现。
发明内容
基于此，本发明的目的在于克服现有技术的缺陷，提供一种线路板的钻孔方法，采用该方法能够实现高厚径比的线路板钻孔，并能获得高精度的孔位。
为实现上述目的，本发明采取以下技术方案：
一种线路板的钻孔方法，包括以下步骤：
在线路板上设置定位标靶和方向标靶，并在定位标靶处钻出定位孔，在方 向标靶处钻出方向孔；所述方向标靶为一个，设置于该线路板横向中心线和竖向中心线以外的区域；
利用方向孔对线路板的方向进行识别，使销钉穿过所述定位孔，将线路板和盖板安装固定；
分别从线路板的正面和反面钻孔，使正面和反面的钻孔形成通孔。
本发明的钻孔方法，通过从线路板的正面和反面分别钻孔，降低了每一次需要钻孔的深度，因此不需要使用刃长特别长的钻刀，解决了在钻孔时采用长刃钻刀技术难度大的问题。而针对从不同面钻孔，需要保证正面钻孔和反面钻孔的孔轴重合，避免产生偏差，本发明的钻孔方法通过定位标靶和定位孔的利用，能够实现高精度的定位，保证钻孔孔位的高精度，再配合方向标靶和方向孔，用于识别线路板的方向，避免由于方向错误导致的孔位错误。
在其中一个实施例中，所述定位标靶为3-6个，由该定位标靶为端点形成的定位图形以该线路板横向中心线或竖向中心线对称。该定位标靶需均匀分布于线路板上，用以降低定位的偏差。并且为了在线路板翻转后，还能使用同样的盖板，需将定位标靶设计为翻转后其定位孔位置与翻转前一致，即需要将由定位标靶为端点形成的定位图形设为沿该线路板横向中心线或竖向中心线对称。当定位标靶为奇数个时，必有一个定位标靶位于该线路板横向中心线或竖向中心线上。随着定位标靶数量的增加，能够更加准确的实现高精度定位，但是，随着定位标靶数量的增加，会加大销钉安装的难度。因此，所述定位标靶优选为4个，由该4个定位标靶为端点组成矩形的定位图形。当定位标靶为3个时，可选用等腰三角形的定位图形，当定位标靶为4个时，也可选用等腰梯形的定位图形，同样，也可选用正五边型或正六边形等。
在其中一个实施例中，所述定位标靶为4个，由该4个定位标靶为端点， 形成矩形的定位图形；所述方向标靶位于该定位图形的一条边上，并与该条边其中一个端点的定位靶标距离4-7mm。将4个定位标靶设置于线路板的四个角，降低对线路板图形的影响，并且把方向标靶位于该矩形的一条边上，而不是线路板的其他位置，同样是为了降低对线路板图形的影响。经测算，方向标靶离最近的定位标靶距离优选4-7mm，当距离太远时，不易识别，而距离太近时，又会产生相互影响，因此，在实践中，以4-7mm为佳。
在其中一个实施例中，所述定位标靶设置于线路板的每层内板上，线路板压合后，不同层的内板上的定位标靶重叠，由X射线冲孔机自动识别，选择重叠程度最高的位置冲出定位孔。通过在每一层内板上设置定位标靶，可以根据每一层内板图形设置定位标靶，针对每一层内板图形，获得更为准确的孔位，最终，由X射线自动识别，选择定位标靶重叠程度最高的位置冲出定位孔，综合考虑了各层图形对孔位的要求，将偏差程度降低。同样，方向孔也可通过类似的方式制作，即在每一层内板上均设置方向标靶，随后由X射线冲孔机自动识别，冲出方向孔。
在其中一个实施例中，所述定位标靶通过以下方法制作：在内层图形制作时，通过曝光、显影和蚀刻的方式，将定位标靶的图形制作出。同样，方向标靶也可通过类似的方式制作。定位标靶或方向标靶的图形制作时，既可以用干膜覆盖保护，避免标靶图形的铜层被后续的蚀刻过程蚀刻掉，形成以铜层显示标靶图形的方式；也可以将标靶图形处的干膜去除，使标靶图形的铜层被后续的蚀刻过程蚀刻掉，形成以铜层缺失显示标靶图形的方式。所述的定位靶标和/或方向靶标，其图形包括圆、十字架、同心圆环、矩形、正三角形等，达到便于X射线冲孔机识别即可。
在其中一个实施例中，先对线路板的反面钻孔，形成反面半孔，再对线路 板的正面钻孔，形成和反面半孔导通的通孔。由于一些无需正反钻的孔可以在正面钻孔时一起生产，先对反面钻孔，即先钻孔少的反面，可以减少因设定参数、排钻刀而导致的停机时间，从而提高生产效率。另外，也能防止操作人员忘记对反面进行钻孔。
在其中一个实施例中，对线路板的反面钻孔和正面钻孔时，采用至少分为两次的分段式钻孔。特别是当钻入线路板的深度和钻刀直径的比值≥10的时候，需要采取分段钻孔的方式，其中分段数优选3～5段。通过分段钻孔的方式，减少钻刀单次停留在板内的时间，进而保证钻孔过程中的散热及除尘效果，能够降低断刀、孔壁粗糙的品质风险。
在其中一个实施例中，分别从线路板的正面和反面钻孔时，钻入线路板的深度根据该线路板的厚度和钻孔重叠长度确定，所述钻孔重叠长度为正面钻孔以及反面钻孔重叠的长度；即正面钻入线路板的深度S1＝反面钻入线路板的深度S2＝线路板的厚度h÷2+钻孔重叠长度h2÷2，即S1＝S2＝h÷2+h2÷2。所述钻孔重叠长度h2一般为0.5～1.0mm，也可根据具体需要灵活设置。
在其中一个实施例中，钻刀刃长根据钻入线路板的深度、盖板的厚度和预留退屑长度确定，即钻刀刃长l≥钻入线路板的深度S1(或S2)+盖板的厚度h1+预留退屑长度d。即l≥S1(或S2)+h1+d。其中，h1的厚度通常为0.1～0.2mm，d通常为0.5mm，采用销钉的直径常为3.15mm。
与现有技术相比，本发明具有以下有益效果：
本发明的一种线路板的钻孔方法，通过从线路板的正面和反面分别钻孔，降低了每一次需要钻孔的深度，可以避免使用长刃钻刀。并且利用定位标靶和方向标靶进行定位，分别从线路板的正面和反面定位，获得高精度的孔位后再行钻孔，避免了由于线路板中切削材料抵抗形变能力减弱而导致的孔位精度差 的问题。
采用该方法，可以实现用普通刃长的钻刀(如刃长3.5mm)钻穿30:1的厚径比(如0.15mm直径的钻刀，4.5mm的板厚)或更高厚径比的线路板，不易断刀，降低了线路板报废的风险，并且还能提高钻孔孔位的精度。
附图说明
图1为具体实施方式中的钻孔方法定位标靶和方向标靶设置示意图。
其中：1.定位标靶；2.方向标靶；3.竖向中心线；4.横向中心线。
具体实施方式
以下结合附图和具体实施例来详细说明本发明。
一种线路板的钻孔方法，包括以下步骤：
一、定位标靶和方向标靶的设置。
如图1所示，在线路板上设置定位标靶1和方向标靶2，所述定位标靶1为四个，分别设于线路板的四个角方向上，由该四个定位标靶1为端点组成矩形的定位图形。所述方向标靶2为一个，位于该矩形的定位图形的一条边上，并靠近该边端点的一个定位标靶，与该定位靶标距离5-6mm。
按照上述设计，在内层图形制作时，通过曝光、显影和蚀刻的方式，将定位标靶和方向标靶的图形在每一层内板上制作出。在后续的压合工序中，不同层的内板上的定位标靶重叠，不同层的内板上的方向标靶重叠。
二、钻孔文件的制作。
本实施例的钻孔方法的实现需要做一个正面钻孔文件和一个反面钻孔文件，正面钻孔文件按正常流程制作完成，反面钻孔文件需经过镜像处理后再输 出。其中，镜像方式包括左右镜像和上下镜像两种，左右镜像方式以该线路板的竖向中心线3为镜像轴，上下镜像方式以该线路板的横向中心线4为镜像轴。如定位图形是沿该线路板竖向中心线对称的，则以竖向中心线3作为镜像轴，镜像方式为左右镜像；如定位图形是沿该线路板横向中心线对称的，则以横向中心线4作为镜像轴，镜像方式为上下镜像。
三、靶标的制作。
利用X射线自动冲孔设备(即X-Ray冲靶机)的中心法工作模式，根据上述设计设定相关参数，将待生产的线路板送入设备工作台，移动调整线路板位置，使X-Ray冲靶机找到线路板内层设定的定位标靶和方向标靶，由X射线冲孔机自动识别，选择重叠程度最高的位置，并测量其实际位置数据，启动冲靶机，冲出直径为3.175mm的定位孔和方向孔。
四、钻孔。
钻孔深度的确定：根据该线路板的厚度h和钻孔重叠长度h2，确定正面钻孔和反面钻孔的深度S1和S2，所述钻孔重叠长度为正面钻孔以及反面钻孔重叠的长度；正面钻孔的深度S1＝反面钻孔的深度S2＝线路板的厚度h÷2+钻孔重叠长度h2÷2，即S1＝S2≥h÷2+h2÷2，钻孔重叠长度h2一般取0.5～1.0mm。在本实施例中，线路板的厚度h为4.5mm，该正面钻孔的深度S1和反面钻孔的深度S2为2.6mm，并且需要采取分段钻孔的方式，其中分段数为4段。
钻刀的选择：根据钻入线路板的深度S1(或S2)、盖板的厚度h1和预留退屑长度d，确定钻刀刃长l，l≥S1(或S2)+h1+d。其中，h1的厚度通常为0.1～0.2mm，d通常为0.5mm，采用销钉的直径常为3.15mm。如本实施例中，钻入线路板的深度为2.6mm，盖板的厚度h1为0.1mm，预留退屑长度d为0.5mm时，选用刃长3.5mm，直径0.15mm的钻刀。
钻孔生产：确定反面钻孔文件与机台台面的坐标系，导入反面钻孔文件，设定好参数及钻刀，在电木板上钻出和定位孔相对应的固定孔，上销钉，然后依次安装上线路板和盖板，其中线路板需以反面朝上上板，且利用方向孔进行定位，保证线路板的方向需与反面钻孔文件保持一致；根据上述设定好的参数来确定反面钻孔深度，控制钻刀从反面钻入，形成反面半孔。取下盖板和线路板板，导入正面钻孔文件，将线路板翻转后，依次安装上线路板和盖板，其中线路板需正面朝上上板，同样，需利用方向孔进行定位，保证线路板的方向与正面钻孔文件保持一致，固定好线路板和盖板后，控制钻刀从正面钻入，形成和反面半孔导通的通孔，完成钻孔。
采用本实施例的钻孔方法，实现了用刃长3.5mm，直径0.15mm的普通钻刀，钻穿4.5mm厚的线路板，即完成了厚径比为30:1的钻孔。并且在钻孔过程中钻刀不易折断，正面钻孔和反面钻孔的孔位精度高，其孔轴完全重合，没有偏差，并且针对每一层内板而言，钻孔的孔位精度也非常高。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (9)

  1. 一种线路板的钻孔方法，其特征在于，包括以下步骤：
    在线路板上设置定位标靶和方向标靶，并在定位标靶处钻出定位孔，在方向标靶处钻出方向孔；所述方向标靶为一个，设置于该线路板横向中心线和竖向中心线以外的区域；
    利用方向孔对线路板的方向进行识别，使销钉穿过所述定位孔，将线路板和盖板安装固定；
    分别从线路板的正面和反面钻孔，使正面和反面的钻孔形成通孔。
  2. 根据权利要求1所述的线路板的钻孔方法，其特征在于，所述定位标靶为3-6个，由该定位标靶为端点形成的定位图形以该线路板横向中心线或竖向中心线对称。
  3. 根据权利要求3所述的线路板的钻孔方法，其特征在于，所述定位标靶为4个，由该4个定位标靶为端点，形成矩形的定位图形；所述方向标靶位于该定位图形的一条边上，并与该条边其中一个端点的定位靶标距离4-7mm。
  4. 根据权利要求1所述的线路板的钻孔方法，其特征在于，所述定位标靶设置于线路板的每层内板上，线路板压合后，不同层的内板上的定位标靶重叠，由X射线冲孔机自动识别，选择重叠程度最高的位置冲出定位孔。
  5. 根据权利要求4所述的线路板的钻孔方法，其特征在于，所述定位标靶通过以下方法制作：在内层图形制作时，通过曝光、显影和蚀刻的方式，将定位标靶的图形制作出。
  6. 根据权利要求1所述的线路板的钻孔方法，其特征在于，先对线路板的反面钻孔，形成反面半孔，再对线路板的正面钻孔，形成和反面半孔导通的通孔。
  7. 根据权利要求1所述的线路板的钻孔方法，其特征在于，对线路板的反面钻孔和正面钻孔时，采用至少分为两次的分段式钻孔。
  8. 根据权利要求1所述的线路板的钻孔方法，其特征在于，分别从线路板的正面和反面钻孔时，钻入线路板的深度根据该线路板的厚度和钻孔重叠长度确定，所述钻孔重叠长度为正面钻孔以及反面钻孔重叠的长度；即正面钻入线路板的深度＝反面钻入线路板的深度＝线路板的厚度÷2+钻孔重叠长度÷2，所述钻孔重叠长度为0.5～1.0mm。
  9. 根据权利要求1所述的线路板的钻孔方法，其特征在于，钻刀刃长根据钻入线路板的深度、盖板的厚度和预留退屑长度确定，即钻刀刃长≥钻入线路板的深度+盖板的厚度+预留退屑长度。
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CN114845470B (zh) * 2022-04-29 2023-07-21 龙南骏亚电子科技有限公司 一种pcb钻孔电路板节约方法

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