CN104023486A - 软硬多层线路板及其电测定位孔的制作方法 - Google Patents
软硬多层线路板及其电测定位孔的制作方法 Download PDFInfo
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104470265A (zh) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | 一种多层线路板的制作方法 |
CN104998957A (zh) * | 2015-08-04 | 2015-10-28 | 景旺电子科技(龙川)有限公司 | 一种铝基板及其冲孔方法 |
CN106211562A (zh) * | 2016-08-30 | 2016-12-07 | 苏州良基电子科技有限公司 | 一种电路板 |
CN106973488A (zh) * | 2017-05-18 | 2017-07-21 | 台山市精诚达电路有限公司 | 一种用于电气测试的fpc线路板 |
CN107105579A (zh) * | 2017-05-26 | 2017-08-29 | 东莞翔国光电科技有限公司 | 一种灯条专用电路板跑网的解决方法 |
CN108401373A (zh) * | 2018-02-12 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | 线路板及其曝光防呆方法 |
CN111836482A (zh) * | 2020-06-19 | 2020-10-27 | 珠海市鼎协电子有限公司 | 改善线路板测试对位的方法和线路板 |
CN113109698A (zh) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | 一种多层软硬结合线路板的缺陷测试方法 |
CN113747667A (zh) * | 2021-08-27 | 2021-12-03 | 广州广合科技股份有限公司 | 一种金手指卡板插槽的加工方法 |
CN114630510A (zh) * | 2020-12-14 | 2022-06-14 | 华为技术有限公司 | 一种多层电路板的单张芯板对位方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102843863A (zh) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | 高精度电测定位方法 |
CN102421241A (zh) * | 2011-08-01 | 2012-04-18 | 东莞生益电子有限公司 | Pcb多层板层间绝缘介质耐电压测试图形 |
CN203912365U (zh) * | 2014-06-11 | 2014-10-29 | 深圳华麟电路技术有限公司 | 软硬多层线路板 |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104470265B (zh) * | 2014-11-19 | 2017-09-22 | 广州兴森快捷电路科技有限公司 | 一种多层线路板的制作方法 |
CN104470265A (zh) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | 一种多层线路板的制作方法 |
CN104998957A (zh) * | 2015-08-04 | 2015-10-28 | 景旺电子科技(龙川)有限公司 | 一种铝基板及其冲孔方法 |
CN106211562A (zh) * | 2016-08-30 | 2016-12-07 | 苏州良基电子科技有限公司 | 一种电路板 |
CN106973488B (zh) * | 2017-05-18 | 2019-03-26 | 台山市精诚达电路有限公司 | 一种用于电气测试的fpc线路板 |
CN106973488A (zh) * | 2017-05-18 | 2017-07-21 | 台山市精诚达电路有限公司 | 一种用于电气测试的fpc线路板 |
CN107105579A (zh) * | 2017-05-26 | 2017-08-29 | 东莞翔国光电科技有限公司 | 一种灯条专用电路板跑网的解决方法 |
CN108401373A (zh) * | 2018-02-12 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | 线路板及其曝光防呆方法 |
CN108401373B (zh) * | 2018-02-12 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | 线路板及其曝光防呆方法 |
CN111836482A (zh) * | 2020-06-19 | 2020-10-27 | 珠海市鼎协电子有限公司 | 改善线路板测试对位的方法和线路板 |
CN114630510A (zh) * | 2020-12-14 | 2022-06-14 | 华为技术有限公司 | 一种多层电路板的单张芯板对位方法 |
CN114630510B (zh) * | 2020-12-14 | 2024-04-12 | 华为技术有限公司 | 一种多层电路板的单张芯板对位方法 |
CN113109698A (zh) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | 一种多层软硬结合线路板的缺陷测试方法 |
CN113747667A (zh) * | 2021-08-27 | 2021-12-03 | 广州广合科技股份有限公司 | 一种金手指卡板插槽的加工方法 |
CN113747667B (zh) * | 2021-08-27 | 2023-07-18 | 广州广合科技股份有限公司 | 一种金手指卡板插槽的加工方法 |
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Correction item: Patentee|Address Correct: SHENZHEN HUALIN CIRCUIT TECHNOLOGY Co.,Ltd.|518000 No.1, Jinlong Avenue, Baolong Industrial City, Longgang District, Shenzhen City, Guangdong Province False: Yancheng Hualin Electronic Technology Co.,Ltd.|224056 Yanlong Street, Yandu District, Yancheng City, Jiangsu Province Number: 10-02 Volume: 39 |
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