CN110769603B - 一种基于八点对位的多层pcb图形曝光对位方法及装置 - Google Patents
一种基于八点对位的多层pcb图形曝光对位方法及装置 Download PDFInfo
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- CN110769603B CN110769603B CN201910978182.2A CN201910978182A CN110769603B CN 110769603 B CN110769603 B CN 110769603B CN 201910978182 A CN201910978182 A CN 201910978182A CN 110769603 B CN110769603 B CN 110769603B
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005553 drilling Methods 0.000 claims abstract description 89
- 230000005484 gravity Effects 0.000 claims abstract description 51
- 239000012792 core layer Substances 0.000 claims abstract description 47
- 239000010410 layer Substances 0.000 claims description 136
- 238000004590 computer program Methods 0.000 claims description 14
- 239000011229 interlayer Substances 0.000 abstract description 8
- 239000007787 solid Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 2
- 229910052705 radium Inorganic materials 0.000 description 2
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
流程 | 工具层次 | 对位参考层 |
镭射钻孔 | L3/4 | L4 |
镭射钻孔 | L8/7 | L7 |
机械钻孔 | L3/8 | L4/5/6/7 |
图形曝光 | L3 | L4 |
图形曝光 | L8 | L7 |
对位模式 | 镭射崩底pad比例 | 图形崩盲孔比例 | 图形崩通孔比例 | 累计 |
逐层对位 | 0.0% | 0.0% | 28.6% | 28.6% |
X-RAY靶孔对位 | 33.7% | 0.0% | 0.0% | 33.7% |
新型多层8点混合综合对位 | 0.0% | 0.4% | 0.3% | 0.7% |
Claims (5)
Priority Applications (1)
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CN201910978182.2A CN110769603B (zh) | 2019-10-15 | 2019-10-15 | 一种基于八点对位的多层pcb图形曝光对位方法及装置 |
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CN201910978182.2A CN110769603B (zh) | 2019-10-15 | 2019-10-15 | 一种基于八点对位的多层pcb图形曝光对位方法及装置 |
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CN110769603A CN110769603A (zh) | 2020-02-07 |
CN110769603B true CN110769603B (zh) | 2021-06-08 |
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CN201910978182.2A Active CN110769603B (zh) | 2019-10-15 | 2019-10-15 | 一种基于八点对位的多层pcb图形曝光对位方法及装置 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112347950B (zh) * | 2020-11-11 | 2024-04-05 | 湖北大学 | 基于深度学习的pcb板镭射标靶识别方法及系统 |
CN114630510B (zh) * | 2020-12-14 | 2024-04-12 | 华为技术有限公司 | 一种多层电路板的单张芯板对位方法 |
Citations (10)
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JPH0254996A (ja) * | 1988-08-19 | 1990-02-23 | Fujitsu Ltd | 位置決め積層方法 |
JPH0327595A (ja) * | 1989-06-23 | 1991-02-05 | Toshiba Chem Corp | 多層積層板の基準穴あけ法 |
JPH0473996A (ja) * | 1990-07-13 | 1992-03-09 | Hitachi Telecom Technol Ltd | 多層プリント基板の穴明け方法及びその装置 |
JPH08192337A (ja) * | 1995-01-10 | 1996-07-30 | Hitachi Ltd | 位置合わせ方法 |
CN103752882A (zh) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | 线路板的钻孔方法 |
CN105764272A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | Hdi板高集中度对位制造方法 |
CN105764261A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | 线路ldi曝光定位方法及其应用 |
CN106793520A (zh) * | 2016-12-30 | 2017-05-31 | 昆山元茂电子科技有限公司 | 印刷电路板的钻孔方法 |
CN107241859A (zh) * | 2017-04-27 | 2017-10-10 | 广州市锲致智能技术有限公司 | 一种基于图像识别的运动控制自适应补偿方法及装置 |
JP2019136732A (ja) * | 2018-02-09 | 2019-08-22 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9420708B2 (en) * | 2011-03-29 | 2016-08-16 | Ibiden Co., Ltd. | Method for manufacturing multilayer printed wiring board |
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254996A (ja) * | 1988-08-19 | 1990-02-23 | Fujitsu Ltd | 位置決め積層方法 |
JPH0327595A (ja) * | 1989-06-23 | 1991-02-05 | Toshiba Chem Corp | 多層積層板の基準穴あけ法 |
JPH0473996A (ja) * | 1990-07-13 | 1992-03-09 | Hitachi Telecom Technol Ltd | 多層プリント基板の穴明け方法及びその装置 |
JPH08192337A (ja) * | 1995-01-10 | 1996-07-30 | Hitachi Ltd | 位置合わせ方法 |
CN103752882A (zh) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | 线路板的钻孔方法 |
CN105764272A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | Hdi板高集中度对位制造方法 |
CN105764261A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | 线路ldi曝光定位方法及其应用 |
CN106793520A (zh) * | 2016-12-30 | 2017-05-31 | 昆山元茂电子科技有限公司 | 印刷电路板的钻孔方法 |
CN107241859A (zh) * | 2017-04-27 | 2017-10-10 | 广州市锲致智能技术有限公司 | 一种基于图像识别的运动控制自适应补偿方法及装置 |
JP2019136732A (ja) * | 2018-02-09 | 2019-08-22 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
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Denomination of invention: A Method and Device of Multi layer PCB Graphic Exposure Alignment Based on Eight Point Alignment Effective date of registration: 20221213 Granted publication date: 20210608 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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Date of cancellation: 20230425 Granted publication date: 20210608 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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Denomination of invention: A method and device for exposing and aligning multi-layer PCB graphics based on eight point alignment Effective date of registration: 20230512 Granted publication date: 20210608 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |
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Granted publication date: 20210608 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |