WO2015045583A1 - 物品の支持装置及び支持装置への２種類の物品の載置方法 - Google Patents

物品の支持装置及び支持装置への２種類の物品の載置方法 Download PDF

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WO2015045583A1
WO2015045583A1 PCT/JP2014/069019 JP2014069019W WO2015045583A1 WO 2015045583 A1 WO2015045583 A1 WO 2015045583A1 JP 2014069019 W JP2014069019 W JP 2014069019W WO 2015045583 A1 WO2015045583 A1 WO 2015045583A1
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article
positioning member
support device
placement surface
positioning
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PCT/JP2014/069019
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English (en)
French (fr)
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玄己 小合
靖久 伊藤
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村田機械株式会社
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Priority to US15/021,388 priority Critical patent/US9664335B2/en
Priority to EP14847792.0A priority patent/EP3050825B1/en
Priority to CN201480052704.1A priority patent/CN105683064B/zh
Priority to KR1020167010049A priority patent/KR101697202B1/ko
Priority to JP2015538983A priority patent/JP6052642B2/ja
Priority to SG11201600344RA priority patent/SG11201600344RA/en
Publication of WO2015045583A1 publication Critical patent/WO2015045583A1/ja

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
    • F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Definitions

  • This invention relates to enabling two types of articles having different sizes to be positioned together and placed on a support device.
  • a support device for two types of articles of different sizes.
  • two types of containers are generated according to the wafers and these can be supported by the same support device.
  • These containers are provided with grooves having a V-shaped cross section at three locations on the bottom, and are usually positioned by coupling three pins and grooves provided on the support device. If the container is positioned using this groove, only one article can be positioned. For this reason, two types of support devices are required according to the container, which is inefficient.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2007-287877 proposes a transport system that can transport two types of large and small articles by accommodating and transporting a small article container in a large article container.
  • An object of the present invention is to provide a support device and a placement method capable of positioning and placing two types of articles having different sizes together.
  • the article support device of the present invention is a support device for placing a plurality of types of articles, A placement surface on which a first article and a second article having a bottom that is larger than the first article can be placed together; A first positioning member that protrudes from the placement surface and positions the bottom of the first article; A second positioning member that projects from the placement surface and positions the second article; The first positioning member is disposed at a position that does not interfere with the second article when the second article is positioned on the placement surface by the second positioning member. The second positioning member is disposed at a position that does not interfere with the first article when the first article is positioned on the placement surface by the first positioning member. To do.
  • the two types of article placement methods of the present invention are: A method of placing a plurality of types of articles on a support device,
  • the support device includes a placement surface on which a first article and a second article having a bottom larger than the first article can be placed together, and a first positioning member that protrudes from the placement surface.
  • a second positioning member Positioning the first article with the first positioning member and placing the first article on the placement surface while avoiding interference between the second positioning member and the first article;
  • the first positioning member of the present invention positions the first article while avoiding contact with the second article.
  • the second positioning member positions the second article while avoiding contact with the first article. Therefore, one supporting device can be shared for supporting the first article and supporting the second article.
  • the first article and the second article are, for example, containers that contain semiconductor wafers, and the second article contains a semiconductor wafer having a larger diameter than the first article.
  • the first positioning member is at least a pair of pins protruding from the mounting surface, engages with a hole in the bottom of the first article, and enters into a recess in the bottom of the second article. It is made not to contact 2 articles
  • the second positioning member is at least a pair of guide members protruding from the placement surface, and is configured to guide the outer periphery of the bottom of the second article. Since the second article has a larger bottom than the first article, if the second positioning member is provided so as to guide the outer periphery of the bottom, the second article does not interfere with the first article.
  • the second article can be reliably positioned by guiding with at least a pair of guide members.
  • each of the pair of guide members includes a pair of tapered surfaces having different inclination directions, and is configured to guide a corner of the outer periphery of the bottom of the second article by the pair of tapered surfaces.
  • the first positioning member is at least a pair of pins protruding from the mounting surface, engages with a hole in the bottom of the first article, and, for example, three radially on the bottom of the second article.
  • the positioning groove is provided so as not to come into contact with the second article.
  • a pin can be provided so as to engage with the hole in the bottom of the first article at a position where the second article enters. Therefore, the first article can be reliably positioned without interfering with the second article.
  • the first article includes, for example, three positioning grooves radially on the bottom, and the supporting device includes both the positioning groove for the first article and the positioning groove for the second article. In both cases, the bottom surface of the first article and the bottom surface of the second article are positioned in a non-contact manner.
  • FIG. 1 is a cross-sectional view of an essential part showing a state in which the first article is placed on the support device along a cross section in the II-II direction of FIG.
  • FIG. 1 is a cross-sectional view of an essential part showing a state in which the second article is placed on the support device along the cross section in the III-III direction of FIG.
  • Partial plan view showing positioning of second object Plan view of stocker using support device of embodiment
  • FIG. 1 to 5 show a support device 2 of an embodiment and a stocker 50 using the same.
  • FIG. 1 shows a support device 2 arranged in a stocker.
  • the support device 2 is attached to a support column 4 of a stocker 50 and arranged vertically and horizontally.
  • the support device 2 is plate-shaped and includes an opening 6 on the side opposite to the support column 4, mounting surfaces 8 and 8 on both sides thereof, and a mounting surface 9 near the support column 4.
  • the mounting surfaces 8 and 8 are provided with pins 10 and tapered pieces 12, and the support device 2 includes a pair of pins 10 and 10 and a pair of tapered pieces 12 and 12.
  • the side of the support column 4 is called a heel and the front end side of the opening 6 is called the front side, and the pin 10 is in a position closer to the opening 6 than the taper piece 12.
  • the pin 10 is in a position closer to the opening 6 than the taper piece 12.
  • Three or more pins 10 and taper pieces 12 may be provided.
  • the taper pieces 12 are provided at two places on the heel side in addition to the two places on the front side of the support device 2 and the corners of the article 30 are positioned by the taper pieces 12 at four places, the positioning accuracy of the article 30 is improved. improves.
  • the taper pieces 12 may be provided only at two locations on the front side of the support device 2.
  • Reference numeral 20 denotes a first article
  • reference numeral 30 denotes a second article
  • the first article 20 (hereinafter simply referred to as article 20) is a container that accommodates, for example, a 300 mm wafer for semiconductors
  • the second article 30 (hereinafter simply referred to as article 30).
  • the types of the articles 20 and 30 are arbitrary, the article 30 has a larger bottom than the article 20, and the article 20 may be positioned by the pins 10 and 10 without interfering with the taper pieces 12 and 12. It is only necessary that the taper pieces 12 and 12 can be positioned without interfering with the pins 10 and 10.
  • 21 and 31 are heads of the articles 20 and 30, and are used by an overhead traveling vehicle or the like to hold the articles 20 and 30.
  • 22 and 32 are doors, which are used for loading and unloading wafers into and from the articles 20 and 30.
  • the articles 20 and 30 are provided with positioning grooves 24 and 34, and in the original specification, the grooves 24 and 34 are positioned by kinematic coupling with pins (not shown) on the support device side, and the grooves 24 and 34 are in the longitudinal direction of the grooves.
  • the perpendicular cross section is V-shaped.
  • the article 20 is positioned by engaging the pins 10 on the placement surfaces 8 and 8 with holes provided in the bottom of the article 20.
  • the corner portion 36 of the article 30 is positioned by the taper piece 12 on the placement surfaces 8 and 8.
  • the positioning of the article 20 is shown in FIG.
  • the article 20 which is a container for a 300 mm wafer is generally provided with a pair of holes 26 for engagement with pins called forklift pins.
  • the pins 10 and 10 are provided so as to engage with the holes 26 and 26.
  • the pin 10 is arranged in the positioning groove 34 of the article 30 so that it does not interfere with the article 30.
  • Reference numerals 25 and 35 are shelves in the articles 20 and 30, and W1 and W2 are semiconductor wafers placed on the shelves 25 and 30, respectively. *
  • the positioning groove 34 of the article 30 is used to avoid interference with the pin 10, the pair of corner portions 36 and 36 on the door 32 side of the article 30 are positioned by the tapered pieces 12 and 12.
  • the taper piece 12 includes a tapered surface 14 inclined in the left-right direction and a tapered surface 15 descending from the near side to the heel side.
  • the article 30 can be positioned by guiding the pair of corner portions 36 and 36 with the pair of left and right taper pieces 12 and 12.
  • item 30 can be used for positioning.
  • the support device 2 can be used for any application on which the articles 20 and 30 are placed.
  • a stocker 50 shared by 300 mm wafers and 450 mm wafers can be obtained.
  • the conveyance device 52 moves through the central conveyance space 51 to deliver the article to and from the support device 2.
  • the support device 2 is arranged across a plurality of layers on both sides of the conveyance space 51.
  • the type of the transport device 52 is arbitrary, but for example, a mast 56 is provided on the carriage 53, and the drive device of the transfer hand 54 is moved up and down.
  • the hand 54 may be shared with the articles 20 and 30, and a dedicated hand may be provided for each article 20 and 30. Furthermore, you may provide another conveying apparatus for every goods 20 and 30.
  • Supporting device 4 Post 6 Opening 8, 9 Placement surface 10 Pin 12 Tapered piece 14, 15 Tapered surface 20 First article 30 Second article 21, 31 Head 22, 32 Door 24, 34 Positioning groove 25, 35 Shelf 26 Hole 36 Corner 50 Stocker 51 Transport space 52 Transport device 53 Carriage 54 Hand 56 Mast W1, W2 Semiconductor wafer

Abstract

大きさが異なる２種類の物品を、共に位置決めして載置できる支持装置を提供する。第１の物品（２０）と、第１の物品（２０）よりも底部が大きい第２の物品（３０）とを、支持装置の載置面に載置する。載置面から突き出し、第１の物品（２０）の底部を位置決めする第１の位置決め部材（１０）と、載置面から突き出し、第２の物品（３０）を位置決めする第２の位置決め部材（１２）とを設ける。第１の位置決め部材（１０）は、第２の位置決め部材（１２）により、第２の物品（３０）を載置面上に位置決めする際に、第２の物品（３０）と干渉しない位置に配置され、第２の位置決め部材（１２）は、第１の位置決め部材（１０）により、第１の物品（２０）を載置面上に位置決めする際に、第１の物品（２０）と干渉しない位置に配置されている。

Description

物品の支持装置及び支持装置への２種類の物品の載置方法
　この発明は、大きさの異なる２種類の物品を、共に位置決めして支持装置上へ載置できるようにすることに関する。
　大きさが異なる２種類の物品に対して、支持装置を共用できると便利なことがある。例えば大きさが異なる２種類の半導体ウェハーを扱う工場では、ウェハーに応じて２種類の容器が発生し、これらを同じ支持装置で支持できると便利である。これらの容器は、底部の３個所に断面がＶ字状の溝を備え、通常は、支持装置に設けた３本のピンと溝をカップリングさせて位置決めする。この溝を用いて容器を位置決めすると、一方の物品しか位置決めできない。このため容器に合わせて２種類の支持装置が必要になり、非効率である。
　関連する先行技術を示す。特許文献１（特開2007-287877）は、小さな物品の容器を、大きな物品の容器内に収容して搬送することにより、大小２種類の物品を搬送できる搬送システムを提案している。
特開2007-287877
　この発明の課題は、大きさが異なる２種類の物品を、共に位置決めして載置できる支持装置と載置方法とを提供することにある。
　この発明の物品の支持装置は、複数の種類の物品を載置する支持装置であって、
　第１の物品と、前記第１の物品よりも底部が大きい第２の物品とを、共に載置できる載置面と、
　前記載置面から突き出し、前記第１の物品の底部を位置決めする第１の位置決め部材と、
　前記載置面から突き出し、前記第２の物品を位置決めする第２の位置決め部材と、
　前記第１の位置決め部材は、前記第２の位置決め部材により、前記第２の物品を載置面上に位置決めする際に、前記第２の物品と干渉しない位置に配置され、
　前記第２の位置決め部材は、前記第１の位置決め部材により、前記第１の物品を載置面上に位置決めする際に、前記第１の物品と干渉しない位置に配置されていることを特徴とする。　
　この発明の２種類の物品の載置方法は、
　支持装置上に複数の種類の物品を載置する方法であって、
　前記支持装置は、第１の物品と、前記第１の物品よりも底部が大きい第２の物品とを、共に載置できる載置面と、共に前記載置面から突き出す、第１の位置決め部材と、第２の位置決め部材とを備え、
　第２の位置決め部材と第１の物品との干渉を回避しながら、第１の位置決め部材により第１の物品を位置決めして、載置面上に載置するステップと、
　第１の位置決め部材と第２の物品との干渉を回避しながら、第２の位置決め部材により第２の物品を位置決めして、載置面上に載置するステップ、とを行うことを特徴とする。
　この発明の第１の位置決め部材は、第２の物品との接触を回避しながら、第１の物品を位置決めする。また第２の位置決め部材は、第１の物品との接触を回避しながら、第２の物品を位置決めする。このため１つの支持装置を第１の物品の支持と第２の物品の支持とに共用できる。第１の物品と第２の物品は、例えば共に半導体ウェハーを収容する容器で、第２の物品は、第１の物品に比べ、より大径の半導体ウェハーを収容するようにされている
　好ましくは、前記第１の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第１の物品の底部の孔と係合し、かつ前記第２の物品の底部の凹部内に入って第２の物品とは接触しないようにされている。このようにすると、第２の物品の位置決めを妨げずに、第１の物品を簡単に位置決めして載置できる。
　また好ましくは、前記第２の位置決め部材は載置面から突き出す少なくとも一対のガイド部材で、前記第２の物品の底部の外周をガイドするように構成されている。第２の物品は第１の物品よりも底部が大きいので、底部の外周をガイドするように第２の位置決め部材を設けると、第１の物品と干渉することがない。そして少なくとも一対のガイド部材でガイドすることにより、第２の物品を確実に位置決めできる。例えば一対のガイド部材は各々傾斜方向が異なる一対のテーパー面を備え、かつ一対のテーパー面により第２の物品の底部外周の角部をガイドするように構成されている。　
　特に好ましくは、前記第１の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第１の物品の底部の孔と係合し、かつ前記第２の物品の底部に放射状に例えば３個設けられている位置決め用の溝内に入って、第２の物品とは接触しないようにされている。第２の物品が位置決め用の溝を備えている場合、この溝に入る位置でかつ第１の物品の底部の孔と係合するように、ピンを設けることができる。このため第２の物品と干渉せずに、確実に第１の物品を位置決めできる。特に好ましくは、前記第１の物品は位置決め用の溝を底部に放射状に例えば３個備え、支持装置は、前記第１の物品の位置決め用の溝とも、前記第２の物品の位置決め用の溝とも、非接触に、前記第１の物品の底面と前記第２の物品の底面とを位置決めするように構成されている。　
実施例の支持装置を配列した状態を表す平面図 第１の物品を支持装置上に載置している状態を、図１のII-II方向断面に沿って示す要部断面図 第２の物品を支持装置上に載置している状態を、図１のIII-III方向断面に沿って示す要部断面図 第２の物体の位置決めを示す部分平面図 実施例の支持装置を用いたストッカの平面図
　以下に本発明を実施するための最適実施例を示す。この発明の範囲は、特許請求の範囲の記載に基づき、明細書の記載とこの分野での周知技術とを参酌し、当業者の理解に従って定められるべきである。
　図１～図５に、実施例の支持装置２とそれを用いたストッカ５０とを示す。図１はストッカ内に配列された支持装置２を示し、支持装置２はストッカ５０の支柱４に取り付けられて、上下左右に配列されている。支持装置２は板状で、支柱４とは反対側の開口６と、その両側の載置面８，８、及び支柱４寄りの載置面９とを備えている。載置面８，８にはピン１０とテーパー片１２とが設けられ、支持装置２は一対のピン１０，１０と一対のテーパー片１２，１２とを備えている。なおこの明細書において、支持装置２から見て支柱４側を奧、開口６の先端側を手前と呼び、ピン１０はテーパー片１２よりも奧の位置で、かつ開口６に近接した位置にある。なおピン１０，テーパー片１２を各３個以上設けても良い。特にテーパー片１２を、支持装置２の手前側２個所の他に、奧側の２個所にも設けて、物品３０の角隅を４個所でテーパー片１２により位置決めすると、物品３０の位置決め精度が向上する。ただし実施例のように、テーパー片１２を支持装置２の手前側２個所にのみ設けても良い。
　２０は第１の物品、３０は第２の物品で、第１の物品２０（以下単に物品２０）は例えば半導体用の300mmウェハーを収容する容器で、第２の物品３０（以下単に物品３０）は例えば半導体用の450mmウェハーを収容する容器である。なお物品２０，３０の種類は任意で、物品３０が物品２０よりも底部が大きく、かつ物品２０は、テーパー片１２，１２と干渉せずに、ピン１０，１０により位置決めできれば良く、物品２０は、ピン１０，１０と干渉せずに、テーパー片１２，１２により位置決めできれば良い。２１，３１は物品２０，３０の頭部で、天井走行車等が物品２０，３０を把持するために用いる。２２，３２は扉で、物品２０，３０にウェハーを出し入れするために用いる。
　物品２０，３０は位置決め溝２４，３４を備え、本来の仕様では、溝２４，３４に支持装置側の図示しないピンをキネマチックカップリングさせて位置決めし、溝２４，３４は溝の長手方向に直角な断面がＶ字状である。しかしながら溝２４，３４により位置決めを行うと、物品２０，３０の一方しか、支持装置２上に載置できない。そこで物品２０に対しては、載置面８，８上のピン１０を、物品２０の底部に設けた孔に係合させて位置決めする。また物品３０に対しては、載置面８，８上のテーパー片１２により、物品３０の角部３６を位置決めする。
　物品２０の位置決めを図２に示す。300mmウェハー用の容器である物品２０には、フォークリフトピンと呼ばれるピンとの係合用に、孔２６を一対設けることが一般的である。そしてこの孔２６，２６と係合するように、ピン１０，１０を設ける。ピン１０を設ける位置と、物品３０を支持装置２上に載置する位置、とを選択すると、物品３０の位置決め溝３４内にピン１０が配置されて、物品３０と干渉しないようにできる。この状況を図３に示す。なお２５，３５は物品２０，３０内の棚で、Ｗ１，Ｗ２は棚２５，３０に載置されている半導体ウェハーである。　
　物品３０の位置決め溝３４を、ピン１０との干渉を回避するために用いたので、物品３０の扉３２側の一対の角部３６，３６をテーパー片１２，１２で位置決めする。この状況を図４に示し、テーパー片１２は左右方向に傾斜するテーパー面１４と、手前側から奧側へ下降するテーパー面１５とを備えている。左右一対のテーパー片１２，１２で、一対の角部３６，３６をガイドすることにより、物品３０を位置決めすることができる。なお角部３６に限らず、物品３０の底部外周の任意の凹凸を、位置決めに用いることができる。
　支持装置２は、物品２０，３０を載置する任意の用途に用いることができるが、例えばストッカ５０の棚受として用いると、300mmウェハーと450mmウェハーとに共用のストッカ５０が得られる。中央の搬送スペース５１を搬送装置５２が移動して、支持装置２との間で物品を受け渡しする。また支持装置２は搬送スペース５１の両側に複数層に渡って配列されている。搬送装置５２の種類は任意であるが、例えば台車５３上にマスト５６を設けて、移載用のハンド５４の駆動装置を昇降させる。ハンド５４は物品２０，３０に対して共用としても良く、また物品２０，３０毎に専用のハンドを設けても良い。さらに物品２０，３０毎に、別の搬送装置を設けても良い。
２　支持装置　　４　支柱　　６　開口　　８，９　載置面　　１０　ピン
１２　テーパー片　　１４，１５　テーパー面　　２０　第１の物品
３０　第２の物品　　２１，３１　頭部　　２２，３２　扉
２４，３４　位置決め溝　　２５，３５　棚　　２６　孔
３６　角部　　５０　ストッカ　　５１　搬送スペース
５２　搬送装置　　５３　台車　　５４　ハンド　　５６　マスト
Ｗ１，Ｗ２　半導体ウェハー

Claims (8)

  1. 　複数の種類の物品を載置する支持装置であって、
    　第１の物品と、前記第１の物品よりも底部が大きい第２の物品とを、共に載置できる載置面と、
    　前記載置面から突き出し、前記第１の物品の底部を位置決めする第１の位置決め部材と、
    　前記載置面から突き出し、前記第２の物品を位置決めする第２の位置決め部材と、
    　前記第１の位置決め部材は、前記第２の位置決め部材により、前記第２の物品を載置面上に位置決めする際に、前記第２の物品と干渉しない位置に配置され、
    　前記第２の位置決め部材は、前記第１の位置決め部材により、前記第１の物品を載置面上に位置決めする際に、前記第１の物品と干渉しない位置に配置されていることを特徴とする、物品の支持装置。
  2. 　前記第１の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第１の物品の底部の孔と係合し、かつ前記第２の物品の底部の凹部内に入って第２の物品とは接触しないようにされていることを特徴とする、請求項１の物品の支持装置。
  3. 　前記第２の位置決め部材は載置面から突き出す少なくとも一対のガイド部材で、前記第２の物品の底部の外周をガイドするように構成されていることを特徴とする、請求項１の物品の支持装置。
  4. 　前記第１の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第１の物品の底部の孔と係合し、かつ前記第２の物品の底部に放射状に設けられている位置決め用の溝内に入って、第２の物品とは接触しないようにされていることを特徴とする、請求項３の物品の支持装置。
  5. 前記一対のガイド部材は各々、傾斜方向が異なる一対のテーパー面を備え、かつ一対のテーパー面により前記第２の物品の底部外周の角部をガイドするように構成されていることを特徴とする、請求項４の物品の支持装置。
  6. 　前記第１の物品と前記第２の物品は共に半導体ウェハーを収容する容器で、前記第２の物品は、前記第１の物品に比べ、より大径の半導体ウェハーを収容するようにされていることを特徴とする、請求項５の物品の支持装置。
  7. 　前記第１の物品は位置決め用の溝を底部に放射状に備え、
    　前記第１の物品の位置決め用の溝とも、前記第２の物品の位置決め用の溝とも、非接触に、前記第１の物品の底面と前記第２の物品の底面とを位置決めするように構成されていることを特徴とする、請求項６の物品の支持装置。
  8. 　支持装置上に複数の種類の物品を載置する方法であって、
    　前記支持装置は、第１の物品と、前記第１の物品よりも底部が大きい第２の物品とを、共に載置できる載置面と、共に前記載置面から突き出す、第１の位置決め部材と、第２の位置決め部材とを備え、
    　第２の位置決め部材と第１の物品との干渉を回避しながら、第１の位置決め部材により第１の物品を位置決めして、載置面上に載置するステップと、
    　第１の位置決め部材と第２の物品との干渉を回避しながら、第２の位置決め部材により第２の物品を位置決めして、載置面上に載置するステップ、とを行うことを特徴とする、支持装置への２種類の物品の載置方法。　　
PCT/JP2014/069019 2013-09-27 2014-07-17 物品の支持装置及び支持装置への２種類の物品の載置方法 WO2015045583A1 (ja)

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