TW201526144A - 物品之支撐裝置及對支撐裝置載置兩種物品之載置方法 - Google Patents

物品之支撐裝置及對支撐裝置載置兩種物品之載置方法 Download PDF

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TW201526144A
TW201526144A TW103133484A TW103133484A TW201526144A TW 201526144 A TW201526144 A TW 201526144A TW 103133484 A TW103133484 A TW 103133484A TW 103133484 A TW103133484 A TW 103133484A TW 201526144 A TW201526144 A TW 201526144A
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article
positioning member
mounting surface
support device
positioning
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TWI582887B (zh
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Haruki OGO
Yasuhisa Ito
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Murata Machinery Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
    • F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

本發明提供一種可將大小不同之兩種物品均進行定位而載置之支撐裝置。將第1物品與底部大於第1物品之第2物品，載置在支撐裝置之載置面。設置第1定位構件及第2定件構件，該第1定位構件係自載置面突出，將第1物品之底部定位，該第2定位構件係自載置面突出，將第2物品定位。第1定位構件係配置於當利用第2定位構件將第2物品定位在載置面上時不與第2物品干涉之位置，第2定位構件係配置於當利用第1定位構件將第1物品定位在載置面上時不與第1物品干涉之位置。

Description

物品之支撐裝置及對支撐裝置載置兩種物品之載置方法
本發明係關於可將大小不同之兩種物品均進行定位而載置於支撐裝置上。
若可對大小不同之兩種物品共用支撐裝置則較為方便。例如於處理大小不同之兩種半導體晶圓之工廠中，對應晶圓而產生兩種容器，若可利用相同之支撐裝置支撐該等容器則較為方便。該等容器係於底部之三個部位具備有剖面為V字狀之槽，通常係使設置於支撐裝置之3根銷與槽耦接而進行定位。若使用該槽將容器定位，則僅可將一物品定位。因此，配合容器就需要兩種支撐裝置，而使效率低下。
以下顯示相關聯之先前技術。專利文獻1(日本專利特開2007-287877)提案有將較小物品之容器收納至較大物品之容器內而進行搬送，藉此可搬送大小兩種物品之搬送系統。
[先前技術文獻] [專利文獻]
[專利文獻1]日本專利特開2007-287877
本發明之課題，在於提供一種可將大小不同之兩種物品均進行定位而載置之支撐裝置及載置方法。
本發明之物品之支撐裝置係為載置複數個種類之物品之支撐裝置，其特徵在於，載置面，其可載置第1物品亦可載置底部大於上述第1物品之第2物品；第1定位構件，其自上述載置面突出，將上述第1物品之底部定位；以及第2定位構件，其自上述載置面突出，將上述第2物品定位；且上述第1定位構件係配置於當利用上述第2定位構件將上述第2物品定位在載置面上時不與上述第2物品干涉之位置，上述第2定位構件係配置於當利用上述第1定位構件將上述第1物品定位在載置面上時不與上述第1物品干涉之位置。
本發明之兩種物品之載置方法係於支撐裝置上載置複數個種類之物品之方法，其特徵在於：上述支撐裝置具備有：載置面，其可載置第1物品亦可載置底部大於上述第1物品之第2物品；以及第1定位構件與第2定位構件，其等皆自上述載置面突出；且上述載置方法係進行如下之步驟：一面迴避第2定位構件與第1物品之干涉，一面利用第1定位構件將第1物品定位，且載置於載置面上；以及一面迴避第1定位構件與第2物品之干涉，一面利用第2定位 構件將第2物品定位，且載置於載置面上。
本發明之第1定位構件係一面迴避與第2物品之接觸，一面將第1物品定位。又，第2定位構件係一面迴避與第1物品之接觸，一面將第2物品定位。因此，可將一個支撐裝置共用於第1物品之支撐及第2物品之支撐。第1物品與第2物品，例如均為收納半導體晶圓之容器，且第2物品相較於第1物品係收納直徑更大之半導體晶圓。
較佳為，上述第1定位構件係自載置面突出之至少一對銷，構成為與上述第1物品底部之孔卡合，且進入至上述第2物品底部之凹部內而不與第2物品接觸。如此一來，可不妨礙第2物品之定位，而簡單地將第1物品進行定位而載置。
又，較佳為，上述第2定位構件係自載置面突出之至少一對導引構件，構成為導引上述第2物品底部之外周。由於第2物品之底部大於第1物品之底部，因此若以導引底部之外周之方式設置第2定位構件，則不會與第1物品干涉。而且，藉由利用至少一對導引構件進行導引，可確實地將第2物品定位。例如一對導引構件分別具備有傾斜方向不同之一對推拔面，且以藉由一對推拔面導引第2物品之底部外周之角部之方式所構成。
特佳為，上述第1定位構件係自載置面突出之至少一對銷，構成為與上述第1物品底部之孔卡合，且進入至呈放射狀地設置於上述第2物品底部之例如有三個之定位用槽內，而不與第2物品接觸。於第2物品具備有定位用槽之情形時，可於進入至該槽之位置且以與第1物品底部之孔卡合之方式設置銷。因此，可不與第2物品干涉而確實地將第1物品定位。特佳為，上述第1物品係 於底部呈放射狀地具備有例如三個定位用槽，且支撐裝置係構成為與上述第1物品之定位用槽和上述第2物品之定位用槽均非接觸地定位上述第1物品之底面與上述第2物品之底面。
2‧‧‧支撐裝置
4‧‧‧支柱
6‧‧‧開口
8、9‧‧‧載置面
10‧‧‧銷
12‧‧‧推拔片
14、15‧‧‧推拔面
20‧‧‧第1物品
21、31‧‧‧頭部
22、32‧‧‧門
24、34‧‧‧定位槽
25、35‧‧‧棚架
26‧‧‧孔
30‧‧‧第2物品
36‧‧‧角部
50‧‧‧倉儲
51‧‧‧搬送空間
52‧‧‧搬送裝置
53‧‧‧台車
54‧‧‧手臂
56‧‧‧桅桿
W1、W2‧‧‧半導體晶圓
圖1係表示排列有實施例之支撐裝置之狀態之俯視圖。
圖2係沿圖1之II-II方向剖面表示將第1物品載置於支撐裝置上之狀態之主要部分剖面圖。
圖3係沿圖1之III-III方向剖面表示將第2物品載置於支撐裝置上之狀態之主要部分剖面圖
圖4係表示第2物體之定位之局部俯視圖。
圖5係使用實施例之支撐裝置之倉儲之俯視圖。
以下表示用以實施本發明之最佳實施例。本發明之範圍應依申請專利範圍之記載，參考說明書之記載與該領域中眾所周知之技術，並按照該發明所屬技術領域中具有通常知識者之理解而決定。
[實施例]
於圖1至圖5中表示實施例之支撐裝置2與使用該支撐裝置2之倉儲50。圖1表示排列於倉儲內之支撐裝置2，支撐裝置2係安裝於倉儲50之支柱4，且排列於上下左右。支撐裝置2為板狀，且具備有與支柱4相反側之開口6、開口6兩側之載置面8、8、及靠近支柱4之載置面9。於載置面8、8設置有銷10及推拔片12，支撐裝置2具備有一對銷10、10及一對推拔片12、12。 再者，於本說明書中，自支撐裝置2觀察時，將支柱4側稱為裏側，將開口6之前端側稱為近前側，銷10係位於較推拔片12更裏側之位置且接近開口6之位置。再者，亦可將銷10、推拔片12各設置三個以上。尤其，除了將推拔片12設置於支撐裝置2近前側之兩個部位以外，若將推拔片12亦設置於裏側之兩個部位，而利用推拔片12將物品30角落之四個部位進行定位，則可提高物品30之定位精準度。然而，亦可如實施例般，將推拔片12僅設置於支撐裝置2近前側之兩個部位。
元件符號20係第1物品，30係第2物品，第1物品20(以下簡稱為物品20)係例如收納半導體用之300mm晶圓之容器，而第2物品30(以下簡稱為物品30)係例如收納半導體用之450mm晶圓之容器。再者，物品20、30之種類為任意，物品30之底部大於物品20之底部，且物品20只要可不與推拔片12、12干涉地利用銷10、10進行定位便可，而物品20只要可不與銷10、10干涉地利用推拔片12、12進行定位便可。元件符號21、31為物品20、30之頭部，用於供高架移行車等抓持物品20、30而使用。元件符號22、32為門，用於對物品20、30存取晶圓而使用。
物品20、30具備有定位槽24、34，就原本之規格而言，使支撐裝置側未圖示之銷運動耦合而定位於槽24、34，槽24、34與槽之長度方向垂直之剖面係呈V字狀。然而，若藉由槽24、34進行定位，則僅可將物品20、30中之一者載置於支撐裝置2上。因此，對於物品20，使載置面8、8上之銷10卡合而定位於設置在物品20底部之孔。又，對於物品30，藉由載置面8、8上之推拔片12，而將物品30之角部36定位。
將物品20之定位表示於圖2中。於作為300mm晶圓用之容器之物品20，通常設置一對孔26，用於與被稱為堆高機銷之銷卡合。而且，以與該孔26、26卡合之方式設置銷10、10。若選擇設置銷10之位置與將物品30載置於支撐裝置2上之位置，則可將銷10配置於物品30之定位槽34內，而不與物品30干涉。將該狀況係表示於圖3中。再者，元件符號25、35為物品20、30內之棚架，W1、W2為載置於棚架25、30之半導體晶圓。
由於使用物品30之定位槽34以避免與銷10之干涉，因此利用推拔片12、12將物品30之門32側之一對角部36、36定位。將該狀況表示於圖4中，推拔片12具備有朝左右方向傾斜之推拔面14、及從近前側向裏側下降之推拔面15。藉由利用左右一對推拔片12、12導引一對角部36、36，可將物品30定位。再者，並不限定於角部36，可將物品30之底部外周任意之凹凸用於定位。
支撐裝置2雖然可用於載置物品20、30之任意之用途，但若作為例如倉儲50之棚架支承件使用，則可獲得300mm晶圓與450mm晶圓共用之倉儲50。搬送裝置52在中央之搬送空間51移動，於與支撐裝置2之間傳送物品。又，支撐裝置2在搬送空間51之兩側跨複數層排列。雖然搬送裝置52之種類為任意，但例如於台車53上設置桅桿56，使移載用之手臂54之驅動裝置升降。手臂54亦可針對物品20、30共用，又，亦可分別針對物品20、30設置專用之手臂。此外，亦可分別針對物品20、30設置不同之搬送裝置。
2‧‧‧支撐裝置
4‧‧‧支柱
6‧‧‧開口
8、9‧‧‧載置面
10‧‧‧銷
12‧‧‧推拔片
20‧‧‧第1物品
21、31‧‧‧頭部
22、32‧‧‧門
24、34‧‧‧定位槽
30‧‧‧第2物品
36‧‧‧角部
50‧‧‧倉儲

Claims (8)

  1. 一種物品之支撐裝置，其載置複數個種類之物品，其特徵在於，載置面，其可載置第1物品亦可載置底部大於上述第1物品之第2物品；第1定位構件，其自上述載置面突出，將上述第1物品之底部定位；以及第2定位構件，其自上述載置面突出，將上述第2物品定位；且上述第1定位構件係配置於當利用上述第2定位構件將上述第2物品定位在載置面上時不與上述第2物品干涉之位置，上述第2定位構件係配置於當利用上述第1定位構件將上述第1物品定位在載置面上時不與上述第1物品干涉之位置。
  2. 如申請專利範圍第1項之物品之支撐裝置，其中，上述第1定位構件係自載置面突出之至少一對銷，構成為與上述第1物品底部之孔卡合，且進入至上述第2物品底部之凹部內而不與第2物品接觸。
  3. 如申請專利範圍第1項之物品之支撐裝置，其中，上述第2定位構件係自載置面突出之至少一對導引構件，構成為導引上述第2物品底部之外周。
  4. 如申請專利範圍第3項之物品之支撐裝置，其中，上述第1定位構件係自載置面突出之至少一對銷，構成為與上述第1物品底部之孔卡合，且進入至呈放射狀地設置於上述第2物品底部之定位用槽內，而不與第2物品接觸。
  5. 如申請專利範圍第4項之物品之支撐裝置，其中，上述一對導引構件分別具備有傾斜方向不同之一對推拔面，且構成為藉由一對 推拔面可導引上述第2物品底部外周之角部。
  6. 如申請專利範圍第5項之物品之支撐裝置，其中，上述第1物品與上述第2物品皆為收納半導體晶圓之容器，且上述第2物品係相較於上述第1物品，可收納直徑更大之半導體晶圓。
  7. 如申請專利範圍第6項之物品之支撐裝置，其中，上述第1物品係於底部呈放射狀地具備有定位用槽，且構成為與上述第1物品之定位用槽和上述第2物品之定位用槽均非接觸地定位上述第1物品之底面與上述第2物品之底面。
  8. 一種對支撐裝置載置兩種物品之載置方法，其係於支撐裝置上載置複數個種類之物品之方法，其特徵在於：上述支撐裝置具備有：載置面，其可載置第1物品亦可載置底部大於上述第1物品之第2物品；以及第1定位構件與第2定位構件，其等皆自上述載置面突出；且上述載置方法係進行如下之步驟：一面迴避第2定位構件與第1物品之干涉，一面利用第1定位構件將第1物品定位，且載置於載置面上；以及一面迴避第1定位構件與第2物品之干涉，一面利用第2定位構件將第2物品定位，且載置於載置面上。
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