JPWO2015045583A1 - 物品の支持装置及び支持装置への2種類の物品の載置方法 - Google Patents
物品の支持装置及び支持装置への2種類の物品の載置方法 Download PDFInfo
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- JPWO2015045583A1 JPWO2015045583A1 JP2015538983A JP2015538983A JPWO2015045583A1 JP WO2015045583 A1 JPWO2015045583 A1 JP WO2015045583A1 JP 2015538983 A JP2015538983 A JP 2015538983A JP 2015538983 A JP2015538983 A JP 2015538983A JP WO2015045583 A1 JPWO2015045583 A1 JP WO2015045583A1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
- F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
第1の物品と、前記第1の物品よりも底部が大きい第2の物品とを、共に載置できる載置面と、
前記載置面から突き出し、前記第1の物品の底部を位置決めする第1の位置決め部材と、
前記載置面から突き出し、前記第2の物品を位置決めする第2の位置決め部材と、
前記第1の位置決め部材は、前記第2の位置決め部材により、前記第2の物品を載置面上に位置決めする際に、前記第2の物品と干渉しない位置に配置され、
前記第2の位置決め部材は、前記第1の位置決め部材により、前記第1の物品を載置面上に位置決めする際に、前記第1の物品と干渉しない位置に配置されていることを特徴とする。
支持装置上に複数の種類の物品を載置する方法であって、
前記支持装置は、第1の物品と、前記第1の物品よりも底部が大きい第2の物品とを、共に載置できる載置面と、共に前記載置面から突き出す、第1の位置決め部材と、第2の位置決め部材とを備え、
第2の位置決め部材と第1の物品との干渉を回避しながら、第1の位置決め部材により第1の物品を位置決めして、載置面上に載置するステップと、
第1の位置決め部材と第2の物品との干渉を回避しながら、第2の位置決め部材により第2の物品を位置決めして、載置面上に載置するステップ、とを行うことを特徴とする。
12 テーパー片 14,15 テーパー面 20 第1の物品
30 第2の物品 21,31 頭部 22,32 扉
24,34 位置決め溝 25,35 棚 26 孔
36 角部 50 ストッカ 51 搬送スペース
52 搬送装置 53 台車 54 ハンド 56 マスト
W1,W2 半導体ウェハー
Claims (8)
- 複数の種類の物品を載置する支持装置であって、
第1の物品と、前記第1の物品よりも底部が大きい第2の物品とを、共に載置できる載置面と、
前記載置面から突き出し、前記第1の物品の底部を位置決めする第1の位置決め部材と、
前記載置面から突き出し、前記第2の物品を位置決めする第2の位置決め部材と、
前記第1の位置決め部材は、前記第2の位置決め部材により、前記第2の物品を載置面上に位置決めする際に、前記第2の物品と干渉しない位置に配置され、
前記第2の位置決め部材は、前記第1の位置決め部材により、前記第1の物品を載置面上に位置決めする際に、前記第1の物品と干渉しない位置に配置されていることを特徴とする、物品の支持装置。 - 前記第1の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第1の物品の底部の孔と係合し、かつ前記第2の物品の底部の凹部内に入って第2の物品とは接触しないようにされていることを特徴とする、請求項1の物品の支持装置。
- 前記第2の位置決め部材は載置面から突き出す少なくとも一対のガイド部材で、前記第2の物品の底部の外周をガイドするように構成されていることを特徴とする、請求項1の物品の支持装置。
- 前記第1の位置決め部材は載置面から突き出す少なくとも一対のピンで、前記第1の物品の底部の孔と係合し、かつ前記第2の物品の底部に放射状に設けられている位置決め用の溝内に入って、第2の物品とは接触しないようにされていることを特徴とする、請求項3の物品の支持装置。
- 前記一対のガイド部材は各々、傾斜方向が異なる一対のテーパー面を備え、かつ一対のテーパー面により前記第2の物品の底部外周の角部をガイドするように構成されていることを特徴とする、請求項4の物品の支持装置。
- 前記第1の物品と前記第2の物品は共に半導体ウェハーを収容する容器で、前記第2の物品は、前記第1の物品に比べ、より大径の半導体ウェハーを収容するようにされていることを特徴とする、請求項5の物品の支持装置。
- 前記第1の物品は位置決め用の溝を底部に放射状に備え、
前記第1の物品の位置決め用の溝とも、前記第2の物品の位置決め用の溝とも、非接触に、前記第1の物品の底面と前記第2の物品の底面とを位置決めするように構成されていることを特徴とする、請求項6の物品の支持装置。 - 支持装置上に複数の種類の物品を載置する方法であって、
前記支持装置は、第1の物品と、前記第1の物品よりも底部が大きい第2の物品とを、共に載置できる載置面と、共に前記載置面から突き出す、第1の位置決め部材と、第2の位置決め部材とを備え、
第2の位置決め部材と第1の物品との干渉を回避しながら、第1の位置決め部材により第1の物品を位置決めして、載置面上に載置するステップと、
第1の位置決め部材と第2の物品との干渉を回避しながら、第2の位置決め部材により第2の物品を位置決めして、載置面上に載置するステップ、とを行うことを特徴とする、支持装置への2種類の物品の載置方法。
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JP2013201778 | 2013-09-27 | ||
JP2013201778 | 2013-09-27 | ||
PCT/JP2014/069019 WO2015045583A1 (ja) | 2013-09-27 | 2014-07-17 | 物品の支持装置及び支持装置への2種類の物品の載置方法 |
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JP6052642B2 JP6052642B2 (ja) | 2016-12-27 |
JPWO2015045583A1 true JPWO2015045583A1 (ja) | 2017-03-09 |
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US (1) | US9664335B2 (ja) |
EP (1) | EP3050825B1 (ja) |
JP (1) | JP6052642B2 (ja) |
KR (1) | KR101697202B1 (ja) |
CN (1) | CN105683064B (ja) |
SG (1) | SG11201600344RA (ja) |
TW (1) | TWI582887B (ja) |
WO (1) | WO2015045583A1 (ja) |
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JP6332133B2 (ja) * | 2015-05-14 | 2018-05-30 | 株式会社ダイフク | 容器搬送設備 |
JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
JP6794898B2 (ja) * | 2017-03-29 | 2020-12-02 | 株式会社ダイフク | 収納棚 |
JP6801640B2 (ja) * | 2017-12-21 | 2020-12-16 | 株式会社ダイフク | 収納棚及び物品収納設備 |
CN109051481B (zh) * | 2018-07-24 | 2020-05-08 | 杭州星程科技有限公司 | 一种物流商品分拣方法 |
Citations (5)
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JPH11163085A (ja) * | 1997-11-28 | 1999-06-18 | Shinko Electric Co Ltd | キャリア用載置装置 |
JP2002002909A (ja) * | 2000-06-19 | 2002-01-09 | Shinko Electric Co Ltd | ストッカ用ロボットの教示確認方法 |
JP2003174068A (ja) * | 2001-12-05 | 2003-06-20 | Oputeikon:Kk | ウエーハ搬送容器の着座確認装置 |
JP2003282672A (ja) * | 2001-11-08 | 2003-10-03 | Samsung Electronics Co Ltd | 半導体製造設備のカセットテーブル |
JP2005197431A (ja) * | 2004-01-07 | 2005-07-21 | Shinko Electric Co Ltd | ロードポート装置 |
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CA2007003C (en) * | 1988-08-01 | 1994-10-11 | Irvin Dale Bond | Parts stacking pallet |
JP4050806B2 (ja) * | 1997-06-26 | 2008-02-20 | ゼオン化成株式会社 | 二重箱コンテナ |
TWI237305B (en) * | 1998-02-04 | 2005-08-01 | Nikon Corp | Exposure apparatus and positioning apparatus of substrate receiving cassette |
JP4200387B2 (ja) | 2006-04-14 | 2008-12-24 | 村田機械株式会社 | 搬送システム |
CN101578700B (zh) * | 2006-08-18 | 2012-11-14 | 布鲁克斯自动化公司 | 容量减少的载物台,传送,装载端口,缓冲系统 |
US8016113B2 (en) * | 2008-09-16 | 2011-09-13 | Plastic Systems, Inc. | Storage system with improved pole securement system |
JP2011187539A (ja) * | 2010-03-05 | 2011-09-22 | Sinfonia Technology Co Ltd | ガス注入装置、ガス排出装置、ガス注入方法及びガス排出方法 |
CN202268335U (zh) * | 2011-09-07 | 2012-06-06 | 承澔科技股份有限公司 | 能够装配不同尺寸晶圆盒的承载机构 |
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2014
- 2014-07-17 EP EP14847792.0A patent/EP3050825B1/en active Active
- 2014-07-17 WO PCT/JP2014/069019 patent/WO2015045583A1/ja active Application Filing
- 2014-07-17 JP JP2015538983A patent/JP6052642B2/ja active Active
- 2014-07-17 SG SG11201600344RA patent/SG11201600344RA/en unknown
- 2014-07-17 KR KR1020167010049A patent/KR101697202B1/ko active IP Right Grant
- 2014-07-17 US US15/021,388 patent/US9664335B2/en active Active
- 2014-07-17 CN CN201480052704.1A patent/CN105683064B/zh active Active
- 2014-09-26 TW TW103133484A patent/TWI582887B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163085A (ja) * | 1997-11-28 | 1999-06-18 | Shinko Electric Co Ltd | キャリア用載置装置 |
JP2002002909A (ja) * | 2000-06-19 | 2002-01-09 | Shinko Electric Co Ltd | ストッカ用ロボットの教示確認方法 |
JP2003282672A (ja) * | 2001-11-08 | 2003-10-03 | Samsung Electronics Co Ltd | 半導体製造設備のカセットテーブル |
JP2003174068A (ja) * | 2001-12-05 | 2003-06-20 | Oputeikon:Kk | ウエーハ搬送容器の着座確認装置 |
JP2005197431A (ja) * | 2004-01-07 | 2005-07-21 | Shinko Electric Co Ltd | ロードポート装置 |
Also Published As
Publication number | Publication date |
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US9664335B2 (en) | 2017-05-30 |
KR101697202B1 (ko) | 2017-01-17 |
CN105683064B (zh) | 2018-02-09 |
EP3050825A4 (en) | 2017-04-19 |
TWI582887B (zh) | 2017-05-11 |
EP3050825B1 (en) | 2021-09-01 |
EP3050825A1 (en) | 2016-08-03 |
WO2015045583A1 (ja) | 2015-04-02 |
US20160223136A1 (en) | 2016-08-04 |
TW201526144A (zh) | 2015-07-01 |
CN105683064A (zh) | 2016-06-15 |
KR20160060086A (ko) | 2016-05-27 |
JP6052642B2 (ja) | 2016-12-27 |
SG11201600344RA (en) | 2016-04-28 |
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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