JP2007287877A - 搬送システム - Google Patents
搬送システム Download PDFInfo
- Publication number
- JP2007287877A JP2007287877A JP2006112401A JP2006112401A JP2007287877A JP 2007287877 A JP2007287877 A JP 2007287877A JP 2006112401 A JP2006112401 A JP 2006112401A JP 2006112401 A JP2006112401 A JP 2006112401A JP 2007287877 A JP2007287877 A JP 2007287877A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- foup
- conveyor
- small article
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003028 elevating effect Effects 0.000 claims description 4
- 230000032258 transport Effects 0.000 description 36
- 239000004065 semiconductor Substances 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 レチクルカセット18を搬送するコンベヤ4を設け、有軌道台車14のリフタ16でレチクルカセット18をリフトさせて、ダミーFOUP22の内部とコンベヤ4との間で受け渡しする。
【効果】 FOUP搬送用の搬送システムとレチクル搬送用の搬送システムを接続できる。
【選択図】 図1
Description
請求項2の発明での追加の課題は、小形物品の姿勢を変えずに、かつ比較的小さな開口から、容器とコンベヤとの間で小形物品を移載できるようにすることにある。
請求項3の発明での追加の課題は、小形物品用の搬送システムを待たせることを少なくすることにある。
(1) レチクル搬送システム36,36間で、FOUP搬送システム38を用いてレチクルカセット18を搬送できる。
(2) 有軌道台車14を用いると、ダミーFOUP22に設けた比較的小さな開口60により、レチクルカセット18を簡単かつ正確に移載できる。
(3) コンベヤ4をレチクルカセット18のバッファとして利用できる。
4 コンベヤ
6 レチクル側ステーション
7 コンベヤユニット
8 FOUP側ユニット
10 ステーション
12 溝
14 有軌道台車
15 台車
16 リフタ
17 昇降アーム
18 レチクルカセット
20,24 フランジ
22 ダミーFOUP
26 制御部
28 通信部
30 上位コントローラ
32 レチクル搬送車コントローラ
33 FOUP搬送車コントローラ
34 走行レール
36 レチクル搬送システム
38 FOUP搬送システム
39 レチクルマガジン
40,50 走行レール
41,51 支柱
42,52 天井走行車
44,54 走行台車
45,55 給電台車
46,56 横送り部
47,57 θドライブ
48,58 昇降駆動部
49,59 昇降台
60 開口
62 穴
64 台
Claims (3)
- 小形物品を搬送するための第1の搬送システムと、大形物品を搬送するための第2の搬送システムとの間で、小形物品を搬送するシステムであって、
前記小形物品を収納するための、第2の搬送システムで搬送自在な容器であって、前記小形物品の出入りを許容する開口を備えたものを設けると共に、
第1の搬送システム側と第2の搬送システム側との間で、前記小形物品を搬送するためのコンベヤと、
第2の搬送システムとの間で前記容器を受け渡し自在なステーションと、
該ステーションの前記容器と前記コンベヤとの間で、前記小形物品を受け渡しするための移載手段とを設け、
該移載手段は、前記小形物品をリフトアップするための昇降手段と、リフトアップされた小形物品を前記開口を通して前記容器内と前記コンベヤとの間で移動させるための移動手段、とを備えたものであることを特徴とする、搬送システム。 - 前記容器の側面に前記開口を設けると共に、前記移載手段を、前記移動手段としてのレールにガイドされる台車と、前記昇降手段としての昇降台とで構成したことを特徴とする、請求項1の搬送システム。
- 前記コンベヤを前記小形物品のバッファに兼用することを特徴とする、請求項1または2の搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006112401A JP4200387B2 (ja) | 2006-04-14 | 2006-04-14 | 搬送システム |
TW096105091A TW200807490A (en) | 2006-04-14 | 2007-02-12 | Transportation system and transportation method |
US11/783,323 US7806648B2 (en) | 2006-04-14 | 2007-04-09 | Transportation system and transportation method |
EP07007643A EP1845552B1 (en) | 2006-04-14 | 2007-04-13 | Transportation system and transportation method |
DE602007000656T DE602007000656D1 (de) | 2006-04-14 | 2007-04-13 | Transportsystem und Transportverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006112401A JP4200387B2 (ja) | 2006-04-14 | 2006-04-14 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007287877A true JP2007287877A (ja) | 2007-11-01 |
JP4200387B2 JP4200387B2 (ja) | 2008-12-24 |
Family
ID=38283907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006112401A Expired - Fee Related JP4200387B2 (ja) | 2006-04-14 | 2006-04-14 | 搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US7806648B2 (ja) |
EP (1) | EP1845552B1 (ja) |
JP (1) | JP4200387B2 (ja) |
DE (1) | DE602007000656D1 (ja) |
TW (1) | TW200807490A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015045711A1 (ja) | 2013-09-30 | 2015-04-02 | 村田機械株式会社 | 保管庫 |
WO2015045583A1 (ja) | 2013-09-27 | 2015-04-02 | 村田機械株式会社 | 物品の支持装置及び支持装置への2種類の物品の載置方法 |
CN114649250A (zh) * | 2022-05-20 | 2022-06-21 | 弥费实业(上海)有限公司 | 供存储库与oht交换晶圆盒的运输装置、天车窗口及存储库 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7591624B2 (en) * | 2006-01-09 | 2009-09-22 | International Business Machines Corporation | Reticle storage pod (RSP) transport system utilizing FOUP adapter plate |
TWI463286B (zh) * | 2007-07-09 | 2014-12-01 | Middlesex General Ind Inc | 用於清潔製造環境中之高效率工件運輸系統及增進於一清潔製造環境中聯合一基於軌道之運輸路徑而操作之一車輛的使用率之方法 |
US8977387B2 (en) * | 2009-10-29 | 2015-03-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for overhead cross-system transportation |
CN102514920B (zh) * | 2011-12-16 | 2013-11-20 | 乌毡帽酒业有限公司 | 一种定位结构 |
JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6467932A (en) | 1987-09-08 | 1989-03-14 | Mitsubishi Electric Corp | Semiconductor wafer cassette conveyor |
US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
JPH0637227U (ja) | 1992-10-23 | 1994-05-17 | 村田機械株式会社 | 搬送システム |
US5855465A (en) * | 1996-04-16 | 1999-01-05 | Gasonics International | Semiconductor wafer processing carousel |
JP3682170B2 (ja) | 1998-09-09 | 2005-08-10 | 株式会社東芝 | カセット搬送システム、半導体露光装置、及びレチクル運搬方法 |
US6568896B2 (en) * | 2001-03-21 | 2003-05-27 | Applied Materials, Inc. | Transfer chamber with side wall port |
JP3734432B2 (ja) | 2001-06-07 | 2006-01-11 | 三星電子株式会社 | マスク搬送装置、マスク搬送システム及びマスク搬送方法 |
JP4019675B2 (ja) | 2001-10-01 | 2007-12-12 | 神鋼電機株式会社 | 搬送装置 |
JP2003188229A (ja) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | ウエハ製造システムおよびウエハ製造方法 |
JP4220173B2 (ja) | 2002-03-26 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | 基板の搬送方法 |
US6848882B2 (en) * | 2003-03-31 | 2005-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system |
JP2005136294A (ja) | 2003-10-31 | 2005-05-26 | Murata Mach Ltd | 移載装置 |
-
2006
- 2006-04-14 JP JP2006112401A patent/JP4200387B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-12 TW TW096105091A patent/TW200807490A/zh unknown
- 2007-04-09 US US11/783,323 patent/US7806648B2/en active Active
- 2007-04-13 EP EP07007643A patent/EP1845552B1/en active Active
- 2007-04-13 DE DE602007000656T patent/DE602007000656D1/de active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015045583A1 (ja) | 2013-09-27 | 2015-04-02 | 村田機械株式会社 | 物品の支持装置及び支持装置への2種類の物品の載置方法 |
KR20160060086A (ko) | 2013-09-27 | 2016-05-27 | 무라다기카이가부시끼가이샤 | 물품의 지지 장치 및 지지 장치에의 2 종류의 물품의 재치 방법 |
US9664335B2 (en) | 2013-09-27 | 2017-05-30 | Murata Machinery, Ltd. | Article support device and method for placing two types of articles on support device |
WO2015045711A1 (ja) | 2013-09-30 | 2015-04-02 | 村田機械株式会社 | 保管庫 |
US9991144B2 (en) | 2013-09-30 | 2018-06-05 | Murata Machinery, Ltd. | Storage warehouse |
CN114649250A (zh) * | 2022-05-20 | 2022-06-21 | 弥费实业(上海)有限公司 | 供存储库与oht交换晶圆盒的运输装置、天车窗口及存储库 |
CN114649250B (zh) * | 2022-05-20 | 2022-08-05 | 弥费实业(上海)有限公司 | 供存储库与oht交换晶圆盒的运输装置、天车窗口及存储库 |
Also Published As
Publication number | Publication date |
---|---|
US20070284217A1 (en) | 2007-12-13 |
US7806648B2 (en) | 2010-10-05 |
JP4200387B2 (ja) | 2008-12-24 |
EP1845552A1 (en) | 2007-10-17 |
EP1845552B1 (en) | 2009-03-11 |
DE602007000656D1 (de) | 2009-04-23 |
TW200807490A (en) | 2008-02-01 |
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