WO2015033515A1 - 半導体モジュール及びインバータ装置 - Google Patents
半導体モジュール及びインバータ装置 Download PDFInfo
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- WO2015033515A1 WO2015033515A1 PCT/JP2014/004027 JP2014004027W WO2015033515A1 WO 2015033515 A1 WO2015033515 A1 WO 2015033515A1 JP 2014004027 W JP2014004027 W JP 2014004027W WO 2015033515 A1 WO2015033515 A1 WO 2015033515A1
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- heat sink
- convex
- semiconductor module
- step portion
- bonding layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
Definitions
- the present invention relates to a semiconductor module that forms a circuit using a ceramic circuit board having a conductor layer, and an inverter device using the semiconductor module.
- a ceramic circuit board on which a semiconductor element is mounted is bonded to a heat sink via a bonding layer such as solder, and then the thermal stress is applied to the end of the bonding layer when the temperature is returned from the high temperature during bonding to room temperature.
- the resulting strain concentration occurs.
- the heat sink is provided with a convex portion having an area smaller than the bonding area with the bonding layer (see, for example, Patent Document 1). With this configuration, the strain concentration is reduced by increasing the thickness of the end portion of the bonding layer where the strain concentration occurs.
- the present invention has been made to solve the above-described problems, and is to obtain a semiconductor module with improved reliability.
- the semiconductor module according to the present invention has a first conductor layer on a first surface of a ceramic substrate, and a second conductor layer on a second surface opposite to the first surface of the ceramic substrate.
- a ceramic circuit board, a semiconductor element mounted on the first conductor layer, a third surface and a fourth surface opposite to the third surface, and the second conductor layer and the third surface A heat sink whose surface is bonded via a bonding layer; a fin provided on the fourth surface of the heat sink; and a refrigerant flow path housing fixed around the end of the heat sink so as to wrap the fin.
- the third surface of the heat sink is provided at the convex portion having a convex plane having an area smaller than the bonding area with the bonding layer, and at the end of the convex portion, and the heat sink thickness of the corresponding portion is convex.
- a first step portion that is thinner than the thickness of the heat sink of the portion corresponding to the portion, and the first step portion A second stepped portion that is thinner than a portion corresponding to the first stepped portion, and the bonding layer includes the convex portion of the heatsink and the first stepped portion. It joins with a level
- the inverter device according to the present invention is configured using the semiconductor module according to the present invention.
- the present invention it is possible to relieve the stress applied to the end portion of the bonding layer when the refrigerant channel housing and the heat sink are fixed. Thereby, a semiconductor module and an inverter device with improved reliability can be obtained.
- FIG. 1A is a cross-sectional view of the semiconductor module 100 according to the present embodiment.
- FIG. 1B is a view of the semiconductor module 100 shown in FIG.
- FIG. 1A is a cross-sectional view taken along the line AA in FIG.
- the ceramic substrate 1 has a first conductor layer 2 on one side as a first side and a second side as a second side opposite to the first side.
- a second conductor layer 3 is provided.
- the ceramic base 1, the first conductor layer 2, and the second conductor layer 3 are collectively referred to as a ceramic circuit board 30.
- a semiconductor element 4 is mounted on the first conductor layer 2 of the ceramic circuit board 30.
- 1A and 1B show an example in which four semiconductor elements 4 are mounted.
- a heat sink 10a is joined to the second conductor layer 3 of the ceramic circuit board 30 via a joining layer 5 that melts at a high temperature such as solder and solidifies when returned to room temperature.
- the heat sink 10a has a third surface in contact with the bonding layer 5 and a fourth surface opposite to the third surface.
- the planar portion of the convex portion 11 is referred to as a convex plane 15.
- the convex portion 11 includes a quadrangular convex plane 15 and a first step wall surface 16 perpendicular to the convex plane 15 at the end.
- the convex portion 11 is located inside the bonding layer 5, and as a result, the area of the convex plane 15 is the bonding area between the bonding layer 5 and the third surface of the heat sink 10a. Smaller than.
- the first step portion 12 is a surface provided around the end of the convex portion 11, and the thickness of the heat sink 10 a at the first step portion 12 is the thickness of the heat sink 10 a at the convex portion 11. Thinner than thickness.
- the first step portion 12 is a surface provided around the end of the convex portion 11, and the thickness of the heat sink 10 a corresponding to the first step portion 12 is the convex portion. 11 is thinner than the thickness of the heat sink 10a in the portion corresponding to 11.
- the second step portion 13 is a surface provided around the end portion of the first step portion 12 with a second step wall surface 17 being another step wall surface parallel to the first step wall surface 16 interposed therebetween. The thickness of the heat sink 10a at the second step portion 13 is thinner than the thickness of the heat sink 10a at the first step portion 12.
- the second step portion 13 is a surface provided around the end portion of the first step portion 12 with the second step wall surface 17 interposed therebetween, and is a portion corresponding to the second step portion 13.
- the thickness of the heat sink 10a is further thinner than the thickness of the heat sink 10a corresponding to the first step portion 12.
- the second step wall surface 17 described above exists between the surface of the first step portion 12 and the surface of the second step portion 13. That is, the second step wall surface 17 is connected to the end portion of the first step portion 12, and the second step portion 13 is connected to the end portion of the second step wall surface 17.
- the bonding layer 5 is bonded to the convex portion 11 and the first step portion 12.
- the peripheral edge portion 19 is sandwiched between the first step wall surface 16 and the third step wall surface 18 parallel to the second step wall surface 17 around the end of the second step portion 13. Is provided.
- the peripheral edge 19 is on the same surface as the convex flat surface 15, and the thickness of the heat sink 10 a corresponding to the peripheral edge 19 is the same as the thickness of the heat sink 10 a corresponding to the convex 11. That is, the heat sink 10a according to the present embodiment cuts the first groove corresponding to the first step portion 12 and the second groove corresponding to the second step portion 13 on an Al plate having a predetermined thickness. Formed by taking out.
- the depth of the second groove corresponding to the second step portion 13 is deeper than the depth of the first groove corresponding to the first step portion 12.
- the thickness of the heat sink 10a at the portion corresponding to the peripheral portion 19 is the same as the thickness of the heat sink 10a at the portion corresponding to the convex portion 11, but the portion of the heat sink 10a at the portion corresponding to the second step portion 13 is used. It may be thicker than the thickness, and may be thinner than the thickness of the heat sink 10a corresponding to the convex portion 11.
- a cooling fin 14 is provided on the fourth surface of the heat sink 10a.
- the water jacket 20 which is a coolant channel housing that forms a coolant channel inside, wraps the fins 14 in order to bring the fins 14 into contact with the coolant that is the coolant. It is fixed.
- the water jacket 20 is provided with an inlet 21 and an outlet 22 for the coolant, and the flow of the coolant is indicated by arrows in FIG.
- the coolant entering from the inlet 21 passes through the water jacket 20 and exits from the outlet 22.
- the heat generated in the ceramic circuit board 30 is transferred to the heat sink 10a and is transferred from the fins 14 of the heat sink 10a to the refrigerant, whereby the ceramic circuit board 30 is cooled.
- the coolant flowing through the water jacket 20 that is the coolant channel housing is a coolant, and water, antifreeze, or the like is used.
- a broken line A is a line indicating the position of the end portion (first step wall surface 16) of the convex plane 15 of the convex portion 11.
- a broken line B is a line indicating the position of the end portion of the second conductor layer 3.
- the broken line C is a line indicating the position of the end portion (second step wall surface 17) of the first step portion 12.
- the broken line D is a line indicating the position of the end portion of the second step portion 13. Therefore, as apparent from FIG.
- the end portion (broken line B) of the second conductor layer 3 is located outside the end portion (broken line A) of the convex plane 15 of the convex portion 11 and the second portion.
- the end portion (dashed line C) of the surface of the first stepped portion 12 is further outside the end portion (dashed line C) of the first stepped portion 12 than the end portion (broken line B).
- the end (broken line A) of the convex plane 15 of the convex portion 11 is 1 mm smaller from both ends (broken line C) of the first step portion 12 on both sides in the X-axis direction and the Y-axis direction. It is said.
- the height of the convex portion 11 is 1 mm from the surface of the first step portion 12.
- the surface of the second step portion 13 provided at the end portion (dashed line C) of the surface of the first step portion 12 has both end portions of the first step portion 12 on both sides in the X-axis direction and the Y-axis direction. It is assumed that the distance is increased by 1 mm outward from (broken line C).
- the height of the step wall surface between the first step portion 12 and the second step portion 13 is 1 mm.
- the distance to the end portion (dashed line D) of the two step portions 13 is the same 1 mm, but it is not always necessary to have the same size.
- the distance from the end portion (dashed line C) of the first step portion 12 to the end portion (dashed line D) of the second step portion 13 is that the bonding layer 5 does not exist, so that the water jacket 20 and the heat sink 10a are fixed.
- the distance may be smaller than the distance from the end of the convex portion 11 (broken line A) to the end of the first step portion 12 (broken line C).
- the convex flat surface 15 of the convex-shaped part 11 is smaller, and the stress relaxation effect becomes high by making the convex-shaped part 11 higher.
- the distance from the second step wall surface 17 to the end of the second stepped portion 13 is larger, and the height of the second step wall surface 17 is increased, so that the stress relaxation effect is enhanced.
- FIG. 2A shows a view of the heat sink 10a of the semiconductor module 100 according to the present embodiment as viewed from above.
- FIG. 2B is a cross-sectional view taken along the line BB in FIG.
- FIG. 2C shows a cross-sectional view taken along the line CC of FIG.
- an arc shape is used. This is because the effect of relaxing the stress is increased by increasing the thickness of the corner portion of the bonding layer 5 where the stress is most concentrated because the bonding distance is long.
- the convex portion 11, the first step portion 12, and the second step portion 13 are manufactured by cutting, but the first step portion 12 and the first step portion 12 are formed by a method such as molding with a mold and two-layer bonding. There is no problem even if the two step portions 13 are formed.
- Al is used as the material of the heat sink 10a, but a material such as Cu or Al—SiC may be used.
- a material such as Cu or Al—SiC may be used.
- Ni plating is applied on the heat sink 10a after the first step portion 12 is formed by cutting or the like to improve solder wettability.
- the second step portion 13 may be formed by cutting or the like. Since the second step portion 13 formed by cutting or the like after Ni plating has poor solder wettability, the shape of the bonding layer 5 can be controlled more easily, and the bonding layer 5 having a good shape is formed. be able to.
- solder As a material of the bonding layer 5, a case where solder is used as an example and is supplied to the third surface of the heat sink 10a by screen printing will be described in detail below. It does not limit regarding a supply method, The supply by a dispenser, an inkjet, or a solder sheet may be sufficient. In the present embodiment, the supply amount is adjusted so that the solder height after the solder bonding is performed becomes an average of 0.3 mm. Needless to say, the material of the bonding layer 5 is not limited to solder as long as it can be melted when heated to high temperature and solidified and bonded when returned to room temperature. The member used for the bonding layer 5 may not be solder, for example, Ag paste or conductive adhesive.
- the lead-free solder when used as the solder material for the bonding layer 5, the lead-free solder has a high melting point, and strain applied to the end of the bonding layer 5 when the temperature is returned to room temperature after bonding increases. By using, a further stress relaxation effect can be obtained.
- the strain concentration generated at the end of the bonding layer 5 when the temperature is returned to room temperature is the linear expansion coefficient of the ceramic circuit board 30 and the heat sink.
- the bonding layer 5 is bonded to the convex portion 11 and the first step portion 12 of the heat sink 10a. To do.
- the bonding layer 5 is not bonded to the second step portion 13.
- the thickness of the bonding layer 5 at the position corresponding to the first step portion 12 of the heat sink 10a is larger than the thickness of the bonding layer 5 at the position corresponding to the convex plane 15 of the convex portion 11 of the heat sink 10a. It is configured to be thick. With this configuration, an effect of increasing the reliability of the bonding layer 5 works. In particular, the stress relief effect is obtained by making the corner portion of the first step portion 12 into an arc shape.
- solder When solder is used for the bonding layer 5, Cu is used for the first conductor layer 2 and the second conductor layer 3, and Al is used for the heat sink 10a, Cu used for the first conductor layer 2 and the second conductor layer 3 is used.
- the thermal conductivity of is about 400 W / mK, which is higher than the thermal conductivity of Al used for the heat sink 10a (about 200 W / mK).
- the thermal conductivity of the solder that becomes the bonding layer 5 is usually about 50 W / mK, which is smaller than the thermal conductivity of Cu and Al. Therefore, although the bonding layer 5 is a metal, if the thickness is large, there is a problem that the thermal resistance from the semiconductor element 4 to the heat sink 10a is increased.
- the temperature near the first step portion 12 around the heat sink 10a is higher than the vicinity of the convex portion 11 of the heat sink 10a, and the temperature tends to decrease. . Therefore, in order to lower the temperature of the entire bonding layer 5 more uniformly, as described above, the thickness of the bonding layer 5 at a position corresponding to the convex plane 15 of the convex portion 11 of the heat sink 10a that becomes high temperature is set. It is desirable that the heat sink 10a is configured to be thinner than the thickness of the bonding layer 5 at a position corresponding to the first step portion 12 of the heat sink 10a.
- the ceramic circuit board 30 on which the semiconductor element 4 is mounted is connected to the third surface of the heat sink 10a to which solder is supplied. After mounting on top, solder reflow is performed to heat up to 250 ° C. and soldering is performed.
- the fillet of the bonding layer 5 after the bonding with the solder is held on the surface of the first step portion 12, and the second step portion 13. Solder does not flow out on the surface. Therefore, it is not necessary to use a solder resist or the like when joining the ceramic circuit board 30 and the heat sink 10a, and the manufacturing process is facilitated.
- the angle formed by the surface of the first step portion 12 and the second step wall surface 17 is 90 degrees. That is, the contact angle of the bonding layer 5 is added by 90 degrees at the end portion of the first step portion 12 as compared with the surface of the first step portion 12. Thereby, the solder does not flow out to the second step portion 13 until the contact angle of the bonding layer 5 reaches the contact angle +90 degrees at the end portion of the first step portion 12, and the fillet of the bonding layer 5 is It is held at the end of the first step portion 12.
- the contact angle between the bonding layer 5 and the heat sink 10a is 30 degrees or more, if the bonding layer 5 is spread by wetting, wetting spreads by 30 degrees or more on the surface of the first step portion 12.
- the end of the first step 12 is not 120 degrees or more, it cannot spread over the end of the first step 12.
- step-difference part 12 and the 2nd step wall surface 17 comprise is 90 degree
- the smoother the shape of the fillet of the bonding layer 5 can prevent the amount of strain of the bonding layer 5 from locally increasing. Therefore, according to the present embodiment, since the bonding layer 5 having a stable shape can be formed automatically, the period during which the reliability of the semiconductor module 100 can be guaranteed can be extended.
- FIG. 3 is a cross-sectional view showing another example of the joined state of the ceramic circuit board 30 and the heat sink 10a according to the present embodiment.
- the bonding state between the ceramic circuit board 30 and the heat sink 10a is most preferably a state in which the bonding layer 5 extends to the end of the first step portion 12 as shown in FIG.
- the bonding layer 5 may not spread to the end of the first step portion 12 as shown in FIG.
- the bonding layer 5 may extend beyond the first step portion 12 to the second step wall surface 17 or the second step portion 13. Also in this case, there is no problem as long as the solder does not spread over the entire second step portion 13, and the effect of the present invention can be obtained.
- FIG. 4 is a cross-sectional view of an inverter device 40 incorporating the semiconductor module 100 according to the present embodiment.
- the inverter module 40 is formed by the semiconductor module 100 of the present embodiment being sealed with the mold resin 51 integrally with the control substrate 50.
- FIG. 5 shows a cross-sectional view of a modified example of the semiconductor module 101 in the case of having a plurality of ceramic circuit boards 30a, 30b, and 30c on which the semiconductor element 4 is mounted.
- FIG. 5 shows an example in which four semiconductor elements 4 are mounted on one ceramic circuit board 30a, 30b, 30c, as in FIGS. 1 (a) and 1 (b).
- three ceramic circuit boards 30a, 30b, and 30c are joined adjacent to the same heat sink 10b.
- the arrows in FIG. 5 indicate the flow of the coolant as in FIG. In the heat sink 10b shown in FIG.
- convex portions 11a, 11b, and 11c are provided so as to correspond to the ceramic circuit boards 30a, 30b, and 30c, and the first portions corresponding to the periphery of the convex portions 11a, 11b, and 11c.
- One step portion 12a, 12b, 12c and second step portion 13a, 13b, 13c are provided. That is, the heat sink 10b is formed by cutting out a first groove corresponding to the first step portion 12 and a second groove corresponding to the second step portion 13 on an Al plate having a predetermined thickness. .
- a peripheral edge 19 is provided in the periphery of the end of the step 13a corresponding to the ceramic circuit board 30a, the periphery of the end of the step 13b corresponding to the ceramic circuit board 30b, and the periphery of the end of the step 13c corresponding to the ceramic circuit board 30c. That is, a peripheral edge portion 19 having the same plane as the convex portions 11a, 11b, and 11c is provided between the second step portion 13a corresponding to the ceramic circuit board 30a and the second step portion 13b corresponding to the ceramic circuit board 30b. A peripheral edge portion 19 is provided between the second step portion 13b corresponding to the ceramic circuit board 30b and the second step portion 13bc corresponding to the ceramic circuit board 30c.
- the heat sink 10b is greatly warped due to the large number of the ceramic circuit boards 30a, 30b, and 30c.
- the compressive stress generated at the end of the bonding layer 5 is Since it is absorbed by the second step portions 13a, 13b, and 13c, the reliability of the semiconductor module 101 can be improved.
- the semiconductor module shown in the first embodiment of the present invention has the first conductor layer on the first surface of the ceramic base, and the second side opposite to the first surface of the ceramic base.
- a ceramic circuit board having a second conductor layer on the surface, a semiconductor element mounted on the first conductor layer, a third surface and a fourth surface opposite to the third surface,
- a third surface of the heat sink is provided at a convex portion having a convex plane having an area smaller than a bonding area with the bonding layer, and an end portion of the convex portion, and corresponds to the third surface of the heat sink.
- the thickness of the heat sink in the portion is smaller than the thickness of the heat sink in the portion corresponding to the convex portion.
- a bonding layer having a stepped portion and a second stepped portion provided at an end of the first stepped portion, wherein the thickness of the heat sink of the corresponding portion is thinner than the portion corresponding to the first stepped portion; Is joined at the convex portion of the heat sink and the first stepped portion.
- FIG. FIG. 6A shows a view of the heat sink 10c of the present embodiment as viewed from above.
- FIG. 6B is a cross-sectional view taken along the line DD of FIG.
- FIG. 6C shows a cross-sectional view taken along line EE of FIG.
- the first step portion 12 and the second step portion 13 are provided outside the four sides of the quadrangular convex plane 15 of the convex portion 11.
- the first step portion 12, the second step portion 13, and the peripheral portion 19 are outside the two sides facing each other among the four sides of the quadrangular convex plane 15 of the convex portion 11.
- the heat sink 10c is a first plate corresponding to the first stepped portion 12 only on the outer side of the two opposite sides of the four sides of the rectangular convex plane 15 of the convex portion 11 on the Al plate having a predetermined thickness. And a second groove corresponding to the second step portion 13 are formed.
- the first step portion 12, the second step portion 13 and the peripheral portion 19 are provided outside the two opposing sides parallel to the Y-axis direction of the quadrangular convex plane 15, and the X-axis direction is provided.
- the semiconductor module of the present embodiment is the same as the semiconductor module 100 of the first embodiment except for the structure of the heat sink 10c.
- the semiconductor module having the heat sink 10c has two sides of the convex plane 15 extending in a direction orthogonal to the direction in which the warpage increases when the ceramic circuit board 30 on which the semiconductor element 4 is mounted is joined at a high temperature and then returned to room temperature.
- the first step portion 12, the second step portion 13, and the peripheral portion 19 are provided only on the outer sides of the two opposite sides of the four sides of the quadrangular convex plane 15 of the convex portion 11. Therefore, the heat sink 10c can be formed by extrusion molding. Therefore, according to the semiconductor module of the present embodiment, an effect that manufacture and assembly are facilitated can be obtained.
- the first step portion and the second step portion are formed only on the outer sides of the two opposite sides of the four sides of the convex surface of the quadrangular convex portion. Is done. Thereby, the reliability of the semiconductor module having the heat sink can be further improved. Moreover, since the semiconductor module shown in this Embodiment 2 can form a heat sink by extrusion molding, the effect that manufacture and an assembly of a semiconductor module become easy is acquired.
- FIG. 7A shows a view of the heat sink 10d of the present embodiment as viewed from above.
- FIG. 7B is a cross-sectional view taken along the line FF in FIG.
- FIG. 7C shows a cross-sectional view taken along the line GG in FIG.
- the first step portion 12 and the second step portion 13 are provided only on the outer sides of two opposite sides of the four sides of the quadrangular convex plane 15 of the convex portion 11, and It is not provided outside the two opposing sides.
- the heat sink 10d is a first plate corresponding to the first step portion 12 only on the outer side of two opposite sides of the four sides of the quadrangular convex plane 15 of the convex portion 11 on the Al plate having a predetermined thickness. And a second groove corresponding to the second step portion 13 are formed.
- FIG. 6 shows an example in which the first stepped portion 12 and the second stepped portion 13 are provided outside two opposing sides of the quadrangular convex plane 15 that are parallel to each other in the Y-axis direction.
- the heat sink 10d of the present embodiment is different from the heat sink 10c shown in the second embodiment in that the peripheral edge portion 19 is not provided outside the end portion of the second step portion 13.
- Other structures are the same as those of the semiconductor module shown in the second embodiment.
- the ceramic circuit board 30 on which the semiconductor element 4 is mounted is bonded at a high temperature and then the direction perpendicular to the direction in which the warpage increases when the temperature is returned to the normal temperature, as in the second embodiment.
- the heat sink 10d can be formed by extrusion. Therefore, according to the semiconductor module of the present embodiment, it is possible to obtain an effect that the semiconductor module can be easily manufactured and assembled.
- the first step portion and the second step portion are only on the outer sides of the two opposite sides of the four sides of the quadrangular convex plane of the convex portion 11. It is formed. Thereby, the reliability of the semiconductor module having the heat sink can be further improved. Moreover, since the semiconductor module shown in this Embodiment 3 can form a heat sink by extrusion molding, the effect that manufacture and an assembly of a semiconductor module become easy is acquired.
- the heat sink 10d shown in the third embodiment is different from the heat sink 10c shown in the second embodiment in that the peripheral edge portion 19 is not provided outside the end of the second stepped portion 13.
- the peripheral edge portion 19 may not be provided outside the second stepped portion 13.
- the refrigerant flowing in the refrigerant flow path housing is a cooling liquid, but it is not necessarily a liquid and may be a gas such as air.
Abstract
Description
また、この発明に係るインバータ装置は、この発明に係る半導体モジュールを用いて構成したものである。
図1(a)は、本実施の形態に係る半導体モジュール100の断面図である。図1(b)は、図1(a)に示す半導体モジュール100を上から見た図である。また、図1(a)は、図1(b)のA-Aでの断面図となっている。図1に示すように、セラミック基材1は、第1の面としての一方の面に第1の導体層2が、第1の面と反対側の第2の面としてのもう一方の面に第2の導体層3が設けられている。以下では、セラミック基材1、第1の導体層2及び第2の導体層3を併せてセラミック回路基板30と呼ぶ。このセラミック回路基板30の第1の導体層2上には、半導体素子4が実装されている。図1(a)及び図1(b)では、半導体素子4が4つ実装されている例を図示している。
図6(a)に、本実施の形態のヒートシンク10cを上から見た図を示す。図6(b)は、図6(a)のD-Dでの断面図を示す。図6(c)は、図6(a)のE-Eでの断面図を示す。実施の形態1に示すヒートシンク10a、10bにおいては、凸状部11の四角形の凸平面15の4辺の外側に第1の段差部12及び第2の段差部13を設けた。本実施の形態に示すヒートシンク10cでは、第1の段差部12、第2の段差部13および周縁部19が、凸状部11の四角形の凸平面15の4辺のうち対向する2辺の外側のみに設けられているが、もう一方の対向する2辺の外側には設けられていない。すなわち、ヒートシンク10cは、所定の厚さのAlの板に、凸状部11の四角形の凸平面15の4辺のうち対向する2辺の外側のみに第1の段差部12に対応する第1の溝と第2の段差部13に対応する第2の溝を削り出すことによって形成される。図6に示すヒートシンク10cでは、四角形の凸平面15のY軸方向に平行な対向する2辺の外側に第1の段差部12、第2の段差部13及び周縁部19を設け、X軸方向に平行な対向する2辺の外側には第1の段差部12、第2の段差部13及び周縁部19を設けていない例を示している。本実施の形態の半導体モジュールは、ヒートシンク10cの構造以外は、実施の形態1の半導体モジュール100と同じである。ヒートシンク10cを有する半導体モジュールは、半導体素子4が実装されたセラミック回路基板30を高温で接合した後、常温に戻した際に反りが大きくなる方向と直交する方向に伸びる凸平面15の2辺の外側のみに第1の段差部12及び第2の段差部13を設けることで、ヒートシンク10cを有する半導体モジュールの信頼性を保証できる期間をより長くできる。
図7(a)に、本実施の形態のヒートシンク10dを上から見た図を示す。図7(b)は、図7(a)のF-Fでの断面図を示す。図7(c)は、図7(a)のG-Gでの断面図を示す。本実施の形態のヒートシンク10dでは、第1の段差部12及び第2の段差部13を、凸状部11の四角形の凸平面15の4辺のうち対向する2辺の外側のみに設け、もう一方の対向する2辺の外側には設けていない。すなわち、ヒートシンク10dは、所定の厚さのAlの板に、凸状部11の四角形の凸平面15の4辺のうち対向する2辺の外側のみに第1の段差部12に対応する第1の溝と第2の段差部13に対応する第2の溝を削り出すことによって形成される。図6は、四角形の凸平面15のY軸方向平行な対向する2辺の外側に第1の段差部12及び第2の段差部13を設けた例を示している。また、本実施の形態のヒートシンク10dは、第2の段差部13の端部の外側に周縁部19が設けられていない点が実施の形態2に示すヒートシンク10cと異なっている。その他の構造は、実施の形態2に示す半導体モジュールと同じである。ヒートシンク10dを有する半導体モジュールは、実施の形態2と同様に、半導体素子4が実装されたセラミック回路基板30を高温で接合した後、常温に戻した際に反りが大きくなる方向と直交する方向に伸びる凸平面15の2辺の外側のみに、第1の段差部12及び第2の段差部13を設けることで、ヒートシンク10dを有する半導体モジュールの信頼性を保証できる期間をより長くできる。
10a ヒートシンク、10b ヒートシンク、10c ヒートシンク、10d ヒートシンク、11 凸状部、11a 凸状部、11b 凸状部、11c 凸状部、12 第1の段差部、12a 第1の段差部、12b 第1の段差部、12c 第1の段差部、13 第2の段差部、13a 第2の段差部、13b 第2の段差部、13c 第2の段差部、14 フィン、15 凸平面、16 第1段壁面、17 第2段壁面、18 第3段壁面、19 周縁部、20 ウォータージャケット、30 セラミック回路基板、30a セラミック回路基板、30b セラミック回路基板、30c セラミック回路基板、40 インバータ装置、50 制御基板、51 モールド樹脂、100 半導体モジュール、101 半導体モジュール。
Claims (7)
- セラミック基材の第1の面に第1の導体層を有し、前記セラミック基材の前記第1の面とは反対側の第2の面に第2の導体層を有するセラミック回路基板と、
前記第1の導体層に実装された半導体素子と、
第3の面と前記第3の面の反対側の第4の面とを有し、前記第2の導体層と前記第3の面が接合層を介して接合されたヒートシンクと、
前記ヒートシンクの前記第4の面に設けられたフィンと、
前記フィンを包み込むように、前記ヒートシンクの周端部に固着された冷媒流路筐体と、
を備え、
前記ヒートシンクの前記第3の面は、
凸平面が前記接合層との接合面積よりも小さい面積を有する凸状部と、
前記凸状部の端部に設けられ、対応する部分の前記ヒートシンクの厚さが前記凸状部に対応する部分の前記ヒートシンクの厚さよりも薄い第1の段差部と、
前記第1の段差部の端部に設けられ、対応する部分の前記ヒートシンクの厚さが前記第1の段差部に対応する部分よりもさらに薄い第2の段差部と
を有し、
前記接合層は、前記ヒートシンクの前記凸状部及び前記第1の段差部とで接合することを特徴とする半導体モジュール。 - 前記凸状部の前記凸平面のコーナー部分及び前記第1の段差部のコーナー部分を円弧形状とすること
を特徴とする請求項1に記載の半導体モジュール。 - 前記第1の段差部及び前記第2の段差部は、前記凸状部の四角形の前記凸平面の4辺のうち対向する2辺の外側のみに形成することを特徴とする請求項1に記載の半導体モジュール。
- 前記第1の段差部と前記第2の段差部との間の第2の段壁面は、前記第1の段差部の面との成す角度が90度以上であることを特徴とする請求項1から請求項3のいずれか1項に記載の半導体モジュール。
- 前記凸状部の前記凸平面の端部よりも外側に前記第2の導体層の端部が配置され、且つ前記第2の導体層の端部よりも外側に前記第1の段差部の面の端部が配置され、さらに前記第1の段差部の面の端部よりも外側に前記第2の段差部の面の端部が配置されたことを特徴とする請求項1から4のいずれか1項に記載の半導体モジュール。
- 前記第2の段差部の端部に、対応する部分の前記ヒートシンクの厚さが前記凸状部対応する部分と同一である周縁部を設けたことを特徴とする請求項1から請求項5のいずれか1項に記載の半導体モジュール。
- 請求項1から請求項6のいずれか1項に記載の半導体モジュールを用いて構成したことを特徴とするインバータ装置。
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US20160197028A1 (en) | 2016-07-07 |
DE112014004043T5 (de) | 2016-08-04 |
KR20160041991A (ko) | 2016-04-18 |
DE112014004043B4 (de) | 2020-07-09 |
JPWO2015033515A1 (ja) | 2017-03-02 |
US9812377B2 (en) | 2017-11-07 |
JP6045709B2 (ja) | 2016-12-14 |
CN105408997B (zh) | 2018-05-08 |
CN105408997A (zh) | 2016-03-16 |
KR101827186B1 (ko) | 2018-02-07 |
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