WO2014192671A1 - 感光性樹脂組成物、フォトスペーサー、カラーフィルター用保護膜、及び、タッチパネルの保護膜もしくは絶縁膜 - Google Patents
感光性樹脂組成物、フォトスペーサー、カラーフィルター用保護膜、及び、タッチパネルの保護膜もしくは絶縁膜 Download PDFInfo
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- WO2014192671A1 WO2014192671A1 PCT/JP2014/063779 JP2014063779W WO2014192671A1 WO 2014192671 A1 WO2014192671 A1 WO 2014192671A1 JP 2014063779 W JP2014063779 W JP 2014063779W WO 2014192671 A1 WO2014192671 A1 WO 2014192671A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133519—Overcoatings
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13398—Spacer materials; Spacer properties
Definitions
- the present invention relates to a photosensitive resin composition. Specifically, the present invention relates to a photosensitive resin composition suitable for a photo spacer, a protective film for a color filter, a protective film for a touch panel, or an insulating film for a touch panel.
- liquid crystal display devices have attracted attention, and photosensitive resins are frequently used in the manufacturing process.
- a photosensitive resin in which a color pigment is dispersed is used for a portion corresponding to a pixel on a color filter, and a photosensitive resin is also used for a black matrix.
- beads having a predetermined particle size are used as a photo spacer, and a gap is provided between two substrates.
- these beads are dispersed randomly, there is a problem that light leakage, scattering of incident light, etc. occur due to distribution on the color display pixels, and the contrast of the liquid crystal panel is lowered.
- a method has been proposed in which a columnar resinous spacer is formed on a black matrix located between pixels by a photolithographic method of partial pattern exposure and development using a photosensitive resin. . Since the photo spacer can be arranged at a position avoiding the pixels, it does not adversely affect the display quality as described above, and the display quality can be improved.
- a drop method (ODF: One Drop Fill) has been proposed in place of the conventional liquid crystal inflow method (vacuum suction method) as the mother glass for manufacturing a liquid crystal display (LCD) becomes larger.
- ODF liquid crystal inflow method
- the number of steps and the process time can be reduced as compared with the conventional vacuum suction method.
- a predetermined amount of liquid crystal calculated from the cell gap is dropped and held, so that a pressure change is applied to the photo spacer arranged on the glass substrate. It is desired for the photo spacer to have a high elastic recovery characteristic so that the shape does not plastically deform with respect to this pressure change.
- a method of nano-dispersing inorganic fine particles such as organosilica sol (for example, Patent Document 2), or a content ratio of a polyfunctional monomer such as dipentaerythritol hexaacrylate is 50% or more.
- a method for example, Patent Document 3 is known in which high elasticity is obtained by increasing the thickness.
- the resin composition becomes hydrophobic, there is a problem that the development time becomes long and the productivity is lowered, and a photosensitive resin composition capable of achieving both high elasticity and high developability is obtained. It is not done.
- An object of the present invention is to provide a photosensitive resin composition that is highly developable, has a cured product with excellent elastic recovery characteristics and adhesion, and can form a high-definition spacer.
- the present invention includes a hydrophilic resin (A), a polyfunctional (meth) acrylate (B), a photopolymerization initiator (C), a solvent (D) having an HLB of 8.0 to 30.0, and the following: A photosensitive resin composition containing a compound (E) which is a condensate containing the compound represented by the general formula (1) as an essential constituent monomer; and the photosensitive resin composition is irradiated with light and then alkali-developed.
- a photo spacer, a color filter protective film, and a touch panel protective film or insulating film formed by patterning and post-baking.
- R 1 is one selected from the group consisting of a (meth) acryloyloxyalkyl group, a glycidoxyalkyl group, a mercaptoalkyl group, and an aminoalkyl group whose alkyl group has 1 to 6 carbon atoms
- R 2 is an aliphatic saturated hydrocarbon group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms
- R 3 is an alkyl group having 1 to 4 carbon atoms
- M is a silicon atom
- It is one or more atoms selected from the group consisting of titanium atoms and zirconium atoms
- m is 0 or 1.
- the photosensitive resin composition of the present invention has high developability, the cured product has excellent elastic recovery properties, excellent adhesion to a glass substrate, and can form a high-definition photospacer. There is an effect.
- the photosensitive resin composition of the present invention comprises a hydrophilic resin (A), a polyfunctional (meth) acrylate (B), a photopolymerization initiator (C), a solvent having an HLB of 8.0 to 30.0 (D ) And a compound (E), which is a condensate containing the compound represented by the following general formula (1) as an essential constituent monomer, as an essential component.
- R 1 is one selected from the group consisting of a (meth) acryloyloxyalkyl group, a glycidoxyalkyl group, a mercaptoalkyl group, and an aminoalkyl group whose alkyl group has 1 to 6 carbon atoms
- R 2 is an aliphatic saturated hydrocarbon group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms
- R 3 is an alkyl group having 1 to 4 carbon atoms
- M is a silicon atom
- It is one or more atoms selected from the group consisting of titanium atoms and zirconium atoms
- m is 0 or 1.
- (meth) acrylate means “acrylate and / or methacrylate”
- (meth) acrylic acid means “acrylic acid and / or methacrylic acid”
- (meth) acrylic resin means “(Acrylic resin and / or methacrylic resin)
- (meth) acryloyl group means “acryloyl group and / or methacryloyl group”
- (meth) acryloyloxy group means "acryloyloxy group and / or methacrylic group”.
- hydrophilic resin (A) used in the present invention examples include a hydrophilic vinyl resin (A1), a hydrophilic epoxy resin (A2), a hydrophilic polyester resin, a hydrophilic polyamide resin, a hydrophilic polycarbonate resin, and a hydrophilic polyurethane resin. Can be mentioned. (A) may use 1 type and may use 2 or more types together. Among these, the hydrophilic vinyl resin (A1) and the hydrophilic epoxy resin (A2) are preferable from the viewpoint of the sensitivity of the photosensitive resin composition and the viewpoint of ease of production. From the viewpoint of elastic recovery characteristics, a hydrophilic epoxy resin (A2) is more preferable.
- the hydrophilicity index in the hydrophilic resin (A) is defined by HLB. Generally, the larger this value, the higher the hydrophilicity.
- the HLB value of (A) is preferably 4 to 19, more preferably 5 to 18, particularly preferably 6 to 17. When it is 4 or more, the developing property is further improved when developing the photospacer, and when it is 19 or less, the water resistance of the cured product is further improved.
- HLB is an index indicating a balance between hydrophilicity and lipophilicity, and is described in, for example, “Introduction to Surfactants” (published by Sanyo Chemical Industries, Ltd., 2007, Takehiko Fujimoto), page 212. It is known as the calculated value by the Oda method, not the calculated value by the Griffin method.
- the organic value and the inorganic value for deriving HLB can be calculated using the values in the table described in the above “Introduction to Surfactant” page 213. However, the oxyethylene group (—CH 2 CH 2 O—) is treated specially and calculated using an inorganic value of 75 and an organic value of 40.
- the solubility parameter (hereinafter referred to as SP value) [(unit is (cal / cm 3 ) 1/2 ]) of the hydrophilic resin (A) is preferably 7 to 14, more preferably 8 to 13, particularly preferably. Is from 9 to 13. If it is 7 or more, the developability can be further improved, and if it is 14 or less, the water resistance of the cured product is further improved.
- the SP value in the present invention is calculated by the method described in the following document proposed by Fedors et al. "POLYMER ENFINEERING AND SCIENCE, February, 1974, Vol. 14, No. 2, Robert F. Fedors (pp. 147-154)" Those with close SP values are likely to mix with each other (highly dispersible), and those with a distant numerical value are difficult to mix.
- hydrophilic group examples include a carboxyl group, a hydroxyl group, an amino group, an amide group, a polyether group, a sulfonic acid group, a sulfate ester group, and a phosphate ester group.
- a carboxyl group is preferred from the viewpoint of alkali developability.
- the carboxyl group content is indicated by an acid value.
- the acid value of (A) is preferably 10 to 500 mgKOH / g, more preferably 20 to 300 mgKOH / g. If it is 10 mgKOH / g or more, the developability is more likely to be exhibited, and if it is 500 mgKOH / g or less, the water resistance of the cured product can be further improved.
- the acid value in the present invention can be measured by an indicator titration method using an alkaline titration solution.
- the method is as follows. (I) About 0.1 to 10 g of a sample is precisely weighed and placed in an Erlenmeyer flask, and then a neutral methanol / acetone solution [a mixture of acetone and methanol at 1: 1 (volume ratio)] is added and dissolved. (Ii) Add several drops of phenolphthalein indicator and titrate with 0.1 mol / L potassium hydroxide titration solution. The end point of neutralization is defined as the time when the indicator is slightly red for 30 seconds. (Iii) Determine using the following equation.
- Acid value (mgKOH / g) (A ⁇ f ⁇ 5.61) / S
- f titer of 0.1 mol / L potassium hydroxide titration solution
- S sampling amount (g)
- hydrophilic resins (A) examples include those having the above-mentioned hydrophilic group in the side chain and / or terminal of the vinyl polymer molecule.
- a preferred production method of (A1) is a method of vinyl polymerizing a vinyl monomer (a) having a hydrophilic group and, if necessary, a hydrophobic group-containing vinyl monomer (b).
- Examples of the vinyl monomer (a) having a hydrophilic group include the following vinyl monomers (a1) to (a7).
- (A) may use 1 type and may use 2 or more types together.
- Hydroxyl-containing vinyl monomer Hydroxyalkyl (meth) acrylates having 1 to 30 carbon atoms in the hydroxyalkyl group (such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 3-hydroxypropyl (meth) acrylate)), polyalkylenes ( Alkylene group having 1 to 8 carbon atoms) glycol (degree of polymerization 2 to 40) mono (meth) acrylate [polyethylene glycol mono (meth) acrylate etc.], alkylol (meth) acrylamide [N-methylol (meth) acrylamide etc.], Examples thereof include hydroxystyrene and 2-hydroxyethylpropenyl ether.
- (A3) Sulphonic acid group-containing vinyl monomer examples thereof include vinyl sulfonic acid, (meth) allyl sulfonic acid, styrene sulfonic acid, ⁇ -methyl styrene sulfonic acid, 2- (meth) acryloylamido-2-methylpropane sulfonic acid, and salts thereof.
- the salt include alkali metal (sodium and potassium) salts, alkaline earth metal (calcium and magnesium) salts, primary to tertiary amine salts, ammonium salts and quaternary ammonium salts.
- (A4) Amino group-containing vinyl monomer: And tertiary amino group-containing (meth) acrylates [dialkylaminoalkyl (meth) acrylates such as dimethylaminoethyl (meth) acrylate and diethylaminoethyl (meth) acrylate)] and the like.
- (A5) Amide group-containing vinyl monomer: (Meth) acrylamide, N-alkyl (1 to 6 carbon atoms) (meth) acrylamide, diacetone acrylamide, N, N′-methylene-bis (meth) acrylamide, N, N-dialkyl (1 to 6 carbon atoms) or N, N-diaralkyl (C7-15) (meth) acrylamide (eg, N, N-dimethylacrylamide and N, N-dibenzylacrylamide), methacrylformamide, N-methyl-N-vinylacetamide, cinnamic acid Examples include amides and cyclic amides (N-vinylpyrrolidone, N-allylpyrrolidone, etc.).
- Quaternary ammonium base-containing vinyl monomer A quaternized product of a tertiary amino group-containing vinyl monomer having 6 to 50 carbon atoms (preferably 8 to 20 carbon atoms) (for example, methyl chloride, dimethyl sulfate, benzyl chloride, dimethyl carbonate, etc.) such as dimethyl
- (A7) (Poly) ether group-containing vinyl monomer Alkoxy (alkoxy group having 1 to 8 carbon atoms) alkylene (alkylene group having 1 to 8 carbon atoms) glycol mono (meth) acrylate [methoxyethylene glycol mono (meth) acrylate and methoxypropylene glycol mono (meth) acrylate, etc.], alkoxy (Alkoxy group having 1 to 8 carbon atoms) polyalkylene (alkylene group having 2 to 4 carbon atoms) glycol mono (meth) acrylate [methoxypolyethylene glycol (degree of polymerization 2 to 40) mono (meth) acrylate and methoxypolypropylene glycol (polymerization) Degree 2 to 30) mono (meth) acrylate, etc.].
- hydrophobic group-containing vinyl monomer (b) used in combination with the hydrophilic group-containing vinyl monomer (a) in the hydrophilic vinyl polymer (A1) as necessary include the following monomers (b1) to (b5).
- (B) may use 1 type and may use 2 or more types together.
- (B1) (Meth) acrylic acid ester:
- alkyl (meth) acrylate having 1 to 20 carbon atoms in the alkyl group include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, and n-butyl (meth) acrylate.
- Examples of the alicyclic group-containing (meth) acrylate include dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and isobornyl (meth) acrylate.
- Aromatic hydrocarbon monomer examples include styrene, ⁇ -methyl styrene, vinyl toluene, 2,4-dimethyl styrene, ethyl styrene, isopropyl styrene, butyl styrene, phenyl styrene, cyclohexyl styrene, benzyl styrene, and vinyl naphthalene. It is done.
- Carboxylic acid vinyl ester examples of those having 4 to 50 carbon atoms include vinyl acetate, vinyl propionate and vinyl butyrate.
- Vinyl ether monomer examples of those having 3 to 50 carbon atoms (preferably 6 to 20 carbon atoms) include vinyl methyl ether, vinyl ethyl ether, vinyl propyl ether, and vinyl butyl ether.
- Vinyl ketone monomer examples of those having 4 to 50 carbon atoms include vinyl methyl ketone, vinyl ethyl ketone and vinyl phenyl ketone.
- the hydrophilic vinyl resin (A1) is a polymer having (a) and (b) as a constituent monomer as described above, and a (meth) acryloyl group as a side chain or a terminal as necessary for the purpose of further improving sensitivity. You may make it contain.
- Examples of the method for containing a (meth) acryloyl group in the side chain include the following methods (1) and (2).
- a polymer is produced using a monomer having a group capable of reacting with an isocyanate group (such as a hydroxyl group or a primary or secondary amino group) in at least a part of (a), and then (meth) A method of reacting a compound having an acryloyl group and an isocyanate group (such as acryloylethyl isocyanate).
- an isocyanate group such as a hydroxyl group or a primary or secondary amino group
- a polymer is produced using a monomer having a group capable of reacting with an epoxy group (hydroxyl group, carboxyl group, primary or secondary amino group, etc.) in at least a part of (a), and then A method of reacting a compound having a (meth) acryloyl group and an epoxy group (such as glycidyl (meth) acrylate).
- the number average molecular weight of the hydrophilic vinyl resin (A1) by gel permeation chromatography (GPC) is preferably 1,000 to 30,000, more preferably Is 1,500 to 10,000.
- the Mn of the hydrophilic resin (A) in the present invention is determined using a GPC measuring device (HLC-8120GPC, manufactured by Tosoh Corporation), a column (TSKgel GMHXL 2 + TSKgel Multipore HXL-M, manufactured by Tosoh Corporation). , Measured in a THF solvent at a measurement temperature of 40 ° C. using TSK standard polystyrene [manufactured by Tosoh Corporation] as a reference substance.
- the hydrophilic epoxy resin (A2) is an epoxy resin containing a hydrophilic functional group such as a hydroxyl group, a carboxyl group, or an oxyethylene group in the molecule.
- (A2) preferably has a (meth) acryloyl group in the molecule from the viewpoint of photocuring reactivity.
- a preferred method for producing the hydrophilic epoxy resin (A2) is that the epoxy group in the raw material epoxy resin (A2 0 ) (hereinafter sometimes simply referred to as (A2 0 )) contains a (meth) acryloyl group-containing monomer.
- Carboxylic acid (a21) is reacted to open an epoxy group to form a hydroxyl group to form a (meth) acryloyl group-containing monocarboxylic acid (a21) adduct of (A2 0 ).
- the polyvalent carboxylic acid or polyvalent carboxylic acid anhydride (c) is reacted.
- (meth) acryloyl group containing monocarboxylic acid (a21) is unsaturated monocarboxylic acid containing a (meth) acryloyl group among carboxyl group-containing vinyl monomers (a2).
- raw material epoxy resin (A2 0 ) examples include aliphatic epoxy resins [eg, Etototo YH-300, PG-202, PG-207 (all manufactured by Toto Kasei Co., Ltd.)] and alicyclic epoxy resins [eg, CY-179.
- aromatic epoxy resins for example, phenol novolac epoxy resin, cresol novolac epoxy resin [for example, EOCN-102S (manufactured by Nippon Kayaku Co., Ltd.)] Bisphenol A epoxy resin, biphenyl type epoxy resin, glycidyl-modified polyvinylphenol, etc.].
- aromatic epoxy resin is preferable from the viewpoint of hardness.
- polyvalent carboxylic acid or polyvalent carboxylic acid anhydride (c) used in the production of (A2) include unsaturated polyvalent carboxylic acids and their anhydrides, and saturated polyvalent (2-6 valent) carboxylic acids (For example, aliphatic saturated polyvalent carboxylic acids such as oxalic acid, succinic acid, phthalic acid, adipic acid, dodecanedioic acid, dodecenyl succinic acid, pentadecenyl succinic acid and octadecenyl succinic acid; tetrahydrophthalic acid, hexahydro Aromatic or cycloaliphatic polycarboxylic acids such as phthalic acid, methyltetrahydrophthalic acid, trimellitic acid, pyromellitic acid, biphenyltetracarboxylic acid and naphthalenetetracarboxylic acid) and their anhydrides (for example, succinic anhydride, Alipha
- the charged weight ratio of (meth) acryloyl group-containing monocarboxylic acid (a21) / (A2 0 ) is preferably such that the concentration of (meth) acryloyl groups in (A2) is 1.0 mmol / g or more.
- the weight ratio is such that
- the reaction temperature in the reaction between (A2 0 ) and (a21) is not particularly limited, but is preferably 70 to 110 ° C.
- the reaction time is not particularly limited, but is preferably 5 to 30 hours.
- a catalyst for example, triphenylphosphine
- a radical polymerization inhibitor hydroquinone, p-methoxyphenol, etc.
- the charge equivalent of the polyvalent carboxylic acid or polyvalent carboxylic acid anhydride (c) relative to the weight of the (meth) acryloyl group-containing monocarboxylic acid (a21) adduct of (A2 0 ) is such that the acid value of (A2) is Equivalent / g so as to be 10 to 500 mg KOH / g.
- the charge equivalent of (c) / (A2 0 ) (meth) acrylic acid adduct is preferably 0 from the above viewpoint. .18 to 8.9 meq / g, more preferably 0.53 to 7.1 meq / g.
- the reaction temperature in the reaction of the (meth) acryloyl group-containing monocarboxylic acid (a21) adduct of (A2 0 ) with the polyvalent carboxylic acid or polyvalent carboxylic acid anhydride (c) is not particularly limited, but preferably 70 ⁇ 110 ° C.
- the reaction time is not particularly limited, but is preferably 3 to 10 hours.
- the number average molecular weight of (A2) is preferably 500 to 3,000, more preferably 1,000 to 2,800, from the viewpoints of sensitivity and developability as the photosensitive resin composition.
- Photosensitive resin composition hydrophilic resin (A), polyfunctional (meth) acrylate (B), photopolymerization initiator (C) and compound (E) [hereinafter (A) to (C), (E) and Describe. ]
- the content of (A) based on the total weight is preferably 10 to 80% by weight, more preferably 15 to 78% by weight, and particularly preferably 20 to 75% by weight. If it is 10% by weight or more, the alkali developability can be exhibited satisfactorily, and if it is 80% by weight or less, the elastic recovery property can be exhibited more satisfactorily.
- any known polyfunctional (meth) acrylate can be used without particular limitation. Examples thereof include meth) acrylate (B1), trifunctional (meth) acrylate (B2), and 4-6 functional (meth) acrylate (B3). (B) may use 1 type and may use 2 or more types together.
- bifunctional (meth) acrylate means that the number of (meth) acryloyl groups is two, and the same description method is used hereinafter.
- Examples of the bifunctional (meth) acrylate (B1) include esterified products of polyhydric (preferably divalent to octavalent) alcohol having 2 to 30 carbon atoms and (meth) acrylic acid [for example, di (meth) acrylate of ethylene glycol, Di (meth) acrylate of glycerin, di (meth) acrylate of trimethylolpropane, di (meth) acrylate of 3-hydroxy-1,5-pentanediol, 2-hydroxy-2-ethyl-1,3-propanediol Di (meth) acrylate]; an alkylene oxide (2 to 4 carbon atoms of an alkylene group) of a polyhydric (preferably divalent to octavalent) alcohol having 2 to 30 carbon atoms and an adduct of (meth) acrylic acid Esterified products [for example, di (meth) acrylate of trimethylolpropane ethylene oxide adduct, glycerin Di (me
- Examples of the trifunctional (meth) acrylate (B2) include tri- or higher-valent (preferably tri- to 8-valent) alcohol having 3 to 30 carbon atoms and esterified product of (meth) acrylic acid [for example, tri (meth) acrylate, A tri (meth) acrylate of methylolpropane, a tri (meth) acrylate of pentaerythritol]; and an alkylene oxide of 3 to 30 (preferably 3 to 8) carbon atoms having 3 to 30 carbon atoms (2 to 3 carbon atoms of the alkylene group). 4) 1-30 mol adduct and esterified product of (meth) acrylic acid [for example, tri (meth) acrylate of ethylene oxide adduct of trimethylolpropane] and the like.
- Examples of the 4- to 6-functional (meth) acrylate (B3) include esterified products of a tetravalent or higher (preferably 4- to 8-valent) alcohol having 5 to 30 carbon atoms and (meth) acrylic acid [for example, tetra (meth) of pentaerythritol Acrylate, penta (meth) acrylate of dipentaerythritol, and hexa (meth) acrylate of dipentaerythritol]; and alkylene oxides of alkylene having 5 to 30 carbon atoms (preferably 4 to 8 valences) Carbonate 2-4) 1-30 mol adduct and esterified product of (meth) acrylic acid [for example, tetra (meth) acrylate of ethylene oxide adduct of dipentaerythritol, penta (meth) acrylate of ethylene oxide adduct of dipentaerythritol ) Pro of acrylate and dipentaery
- (B2) and (B3) are preferable, and (B3) is more preferable.
- Examples of (B) that can be easily obtained from the market include light acrylate PE-3A (manufactured by Kyoeisha Chemical Co., Ltd .: pentaerythritol triacrylate), neomer DA-600 (manufactured by Sanyo Chemical Industries, Ltd .: dipentaerythritol pentaacrylate), and neomer. And EA-300 (manufactured by Sanyo Chemical Industries, Ltd .: pentaerythritol tetraacrylate).
- the polyfunctional (meth) acrylate (B) used by this invention may contain the photosensitive acrylic oligomer (B4) in the one part.
- examples of such (B4) include urethane acrylate, polyester acrylate, and polyether acrylate that have Mn of 1,000 or less, do not contain a carboxyl group, and have two or more acryloyl groups in one molecule. It is.
- the content of the polyfunctional (meth) acrylate (B) in the photosensitive resin composition of the present invention is preferably based on the total weight of (A) to (C) and (E) from the viewpoint of the elastic recovery rate. Is 10 to 80% by weight, more preferably 15 to 75% by weight.
- the photopolymerization initiator (C) used in the photosensitive resin composition of the present invention starts polymerization of a polymerizable unsaturated compound by exposure to radiation such as visible light, ultraviolet light, far infrared light, charged particle beam, and X-ray. Any component may be used as long as it can generate radicals that can be generated.
- Examples of such a photopolymerization initiator (C) include acetophenone derivative (C1), acylphosphine oxide derivative (C2), titanocene derivative (C3), triazine derivative (C4), bisimidazole derivative (C5), O -Acyl oxime (oxime ester) derivative (C6), benzophenone derivative (C7), thioxanthone derivative (C8), ⁇ -diketone derivative (C9), anthraquinone derivative (C10), acridine derivative (C11), and two or more of these The mixture which contains is mentioned.
- Examples of the acetophenone derivative (C1) include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, benzyldimethyl ketal, 2-hydroxy-2-methylpropiophenone, 4-isopropyl-2-hydroxy-2-methylpropiophenone, 2 -Methyl-1- (4- (methylthio) phenyl) -2-morpholino-1-propanone, dimethylbenzyl ketal, methylbenzoyl formate, 2-benzyl-2-dimethylamino-1- (4-morpholine Phenyl) - butan-1-one] and the like.
- acylphosphine oxide derivative (C2) examples include trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide.
- titanocene derivative (C3) examples include bis ( ⁇ 5 -2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium. Is mentioned.
- Examples of the triazine derivative (C4) include trichloromethyltriazine and benzyl-2,4,6- (trihalomethyl) triazine.
- Examples of the bisimidazole derivative (C5) include 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer.
- O-acyloxime (oxime ester) derivative (C6) examples include 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], ethanone, 1- [9 -Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime).
- benzophenone derivative (C7) examples include benzophenone, 4,4-bis (dimethylamino) benzophenone, 3,3-dimethyl-4-methoxy-benzophenone, and Michler's ketone.
- Examples of the thioxanthone derivative (C8) include isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, isopropylthioxanthone, and diisopropylthioxanthone.
- Examples of the ⁇ -diketone derivative (C9) include camphorquinone.
- anthraquinone derivative (C10) examples include anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, and tert-butylanthraquinone.
- Examples of the acridine derivative (C11) include 9-phenylacridine, 1,7-bis (9-acridinyl) heptane, 1,5-bis (9-acridinyl) pentane, and 1,3-bis (9-acridinyl) propane. Is mentioned.
- (C1) to (C11), (C1), (C2), and (C8) are preferable from the viewpoint of ease of synthesis, and 2-methyl-1- [4- (methylthio) phenyl] -2- Morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide and 2, 4-Diethylthioxanthone is more preferable, and from the viewpoint of reactivity, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-1-propanone and bis (2,4,6-trimethylbenzoyl) -phenyl Phosphine oxide is particularly preferred.
- the photopolymerization initiator (C) As the photopolymerization initiator (C), a commercially available one can be easily obtained.
- Irgacure 907 BASF
- 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one include Irgacure 369 (BASF)
- Phenylphosphine oxide includes Irgacure 819 (manufactured by BASF)
- 2,4-diethylthioxanthone includes Kayacure-DETX-S (manufactured by Nippon Kayaku Co., Ltd.).
- the content of the photopolymerization initiator (C) based on the total weight of (A) to (C) and (E) in the photosensitive resin composition of the present invention is preferably 2 to 15% by weight, more preferably 3 -12% by weight, particularly preferably 4-11% by weight. If it is 2% by weight or more, curing reactivity and elastic recovery characteristics can be exhibited more satisfactorily, and if it is 15% by weight or less, reduction of mask contamination at the time of light exposure can be further exhibited.
- the photosensitive resin composition of the present invention contains a solvent (D) having an HLB of 8.0 or more and 30.0 or less as a fourth essential component. If the solvent (D) is not included, developability becomes insufficient.
- the HLB of the solvent (D) is 8.0 or more and 30.0 or less, preferably 9.0 or more and 25.0 or less, more preferably 10.0 or more and 20.0 or less. If the HLB is less than 8.0, the developability deteriorates, and if it exceeds 30.0, the development adhesion deteriorates.
- ether solvents including ether ester solvents and ether alcohol solvents
- ethylene glycol dimethyl ether HLB: 11.9
- ethylene glycol monomethyl ether HLB: 21.9
- ethylene glycol monomethyl ether acetate HLB: 13.5
- ethylene glycol monobutyl ether HLB: 14.6
- diethylene glycol dimethyl ether HLB: 14.2
- diethylene glycol diethyl ether HLB: 10.
- diethylene glycol ethyl methyl ether HLB: 12.1, diethylene glycol monomethyl ether (HLB: 25.0), diethylene glycol monoethyl ether (H B: 20.8), diethylene glycol isopropyl methyl ether (HLB: 11.3), diethylene glycol monobutyl ether (HLB: 15.6), diethylene glycol monoethyl ether acetate (HLB: 13.1), triethylene glycol dimethyl ether (HLB: 14.1), tetraethylene glycol dimethyl ether (HLB: 15.0), propylene glycol monomethyl ether (HLB: 17.1), propylene glycol monoethyl ether (HLB: 13.3), propylene glycol propyl ether (HLB: 10) .9), dipropylene glycol monomethyl ether (HLB: 10.0), tripropylene glycol monomethyl ether (HLB: 9.4), 3-methoxybutanol (H B: 17.1) and 3-methoxybutan
- ether solvents and ester solvents are preferable from the viewpoint of coatability.
- diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, 3-methoxybutanol, and ethyl lactate. (D) may use 1 type and may use 2 or more types together.
- the solvent (D) is a “water-soluble solvent”, and the term “water-soluble solvent” here refers to a glass flask containing pure water and solvent in a volume ratio of 1: 1, and then stirred at 25 ° C. for 5 minutes. Then, after standing for 10 minutes after stopping the stirring, when visually confirmed, the pure water and the solvent are not separated into two layers, and the mixed solution of water and the solvent is uniformly transparent.
- the solvent is capable of dissolving or dispersing each component, and is selected according to the method of using the photosensitive resin composition of the present invention, and a solvent having a boiling point in the range of 100 to 280 ° C. is selected. Is preferred.
- a solvent (F) other than the solvent (D) may be contained.
- solvents (F) include ketone solvents (such as cyclohexanone), ether solvents (including ether ester solvents and ether alcohol solvents) (such as propylene glycol monomethyl ether acetate and methoxybutyl acetate), and ester solvents (such as butyl acetate). Etc. Among these, ether solvents and ester solvents are preferable from the viewpoint of coatability. (F) may use 1 type and may use 2 or more types together.
- the content of the solvent (D) is preferably 5% by weight or more based on the total weight of (A) to (E), more preferably 8 to 90% by weight, particularly preferably 10 to 89% by weight, and most preferably 15%. ⁇ 88% by weight.
- the content of the solvent (F) is preferably 0 to 95% by weight, more preferably 3 to 95% by weight, and particularly preferably 5 to 95% by weight with respect to the weight of the solvent (D). *
- the photosensitive resin composition of the present invention contains a compound (E) that is a condensate containing a compound represented by the following general formula (1) as an essential constituent monomer as a fifth essential component.
- R 1 is one selected from the group consisting of a (meth) acryloyloxyalkyl group, a glycidoxyalkyl group, a mercaptoalkyl group, and an aminoalkyl group whose alkyl group has 1 to 6 carbon atoms
- R 2 is an aliphatic saturated hydrocarbon group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms
- R 3 is an alkyl group having 1 to 4 carbon atoms
- M is a silicon atom
- It is one or more atoms selected from the group consisting of titanium atoms and zirconium atoms
- m is 0 or 1.
- a silicon atom and a titanium atom are preferable, and a silicon atom is more preferable.
- examples of the aliphatic saturated hydrocarbon group include a linear alkyl group, a branched alkyl group, and an alicyclic saturated hydrocarbon group.
- the straight chain alkyl groups include methyl, ethyl, n-propyl, n-butyl, n-octyl and n-dodecyl groups and their deuterium substitutes;
- the branched alkyl groups include isopropyl, isobutyl, sec-butyl and 2
- Examples of the cyclic saturated hydrocarbon group include a cyclohexyl group, a cyclooctyl group, a cyclohexylmethyl group, a cyclohexylethyl group, and a methylcyclohexyl group.
- aromatic hydrocarbon group examples include an aryl group, an aralkyl group, and an alkylaryl group.
- Aryl groups include phenyl, biphenyl, naphthyl groups and their deuterium, fluorine or chlorine substituents; aralkyl groups include tolyl, xylyl, mesityl and their deuterium, fluorine or chloride; and alkylaryl Groups include methylphenyl and ethylphenyl groups.
- R 2 is preferably a linear alkyl group, branched alkyl group and aryl group from the viewpoint of curing reactivity, more preferably a linear alkyl group and an aryl group, particularly preferably a methyl group, an ethyl group, A phenyl group and a combination thereof.
- R 3 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, and a sec-butyl group, and preferably a methyl group and an ethyl group from the viewpoint of thermosetting reactivity. is there.
- examples of the compound having a (meth) acryloyloxyalkyl group as R 1 include the following compounds.
- m is 0, that is, trifunctional compound having three alkoxy groups: 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropyltrimethoxysilane, 3-acryloyl Leuoxypropyltriethoxysilane, 3-methacryloyloxypropyltrimethoxytitanium, 3-methacryloyloxypropyltrimethoxyaluminum, 3-methacryloyloxypropyltrimethoxyzirconium and the like.
- m is 1, that is, a trifunctional compound having two alkoxy groups: 3-methacryloyloxypropylmethyldimethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, 3-acryloyloxypropylmethyldimethoxysilane, 3- Acryloyloxypropylmethyldiethoxysilane, 3-methacryloyloxypropylmethyldimethoxytitanium, 3-methacryloyloxypropylmethyldimethoxyaluminum, 3-methacryloyloxypropylmethyldimethoxyzirconium and the like.
- Examples of the compound having a glycidoxyalkyl group as R 1 include the following compounds.
- m is 0, that is, a trifunctional compound having three alkoxy groups: 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltrimethoxytitanium, etc.
- m is 1, that is, trifunctional compound having two alkoxy groups: 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxytitanium, 3- Glycidoxypropylmethyldimethoxyaluminum, 3-glycidoxypropylmethyldimethoxyzirconium, etc.
- Examples of the compound having a mercaptoalkyl group as R 1 include the following compounds.
- m is 0, that is, trifunctional compound having three alkoxy groups: 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltrimethoxytitanium, 3-mercaptopropyltrimethoxyaluminum, 3 -Mercaptopropyltrimethoxyzirconium and the like.
- m is 1, that is, trifunctional compound having two alkoxy groups: 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, 3-mercaptopropylmethyldimethoxytitanium, 3-mercaptopropylmethyldimethoxyaluminum, 3-mercaptopropylmethyldimethoxyzirconium and the like.
- Examples of the compound having an aminoalkyl group as R 1 include the following compounds.
- m is 0, that is, trifunctional compound having three alkoxy groups: N-2 aminoethyl ⁇ -aminopropyltrimethoxysilane, N-2 aminoethyl ⁇ -aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane 3-aminopropyltriethoxysilane, N-2 aminoethyl ⁇ -aminopropyltrimethoxytitanium, N-2 aminoethyl ⁇ -aminopropyltrimethoxyaluminum, N-2 aminoethyl ⁇ -aminopropyltrimethoxyzirconium and the like.
- m is 1, that is, trifunctional compound having two alkoxy groups: N-2 aminoethyl ⁇ -aminopropylmethyldimethoxysilane, N-2 aminoethyl ⁇ -aminopropylmethyldiethoxysilane, 3-aminopropylmethyldimethoxy Silane, 3-aminopropylmethyldiethoxysilane, N-2aminoethyl ⁇ -aminopropylmethyldimethoxytitanium, N-2aminoethyl ⁇ -aminopropylmethyldimethoxyaluminum, N-2aminoethyl ⁇ -aminopropylmethyldimethoxyzirconium, etc. .
- (meth) acrylic having 3 alkoxy groups is preferable.
- a condensate comprising a leuoxyalkyl group-containing trifunctional silane compound as an essential constituent monomer, and a condensate comprising a glycidoxyalkyl group-containing trifunctional silane compound having three alkoxy groups as an essential constituent monomer More preferred are condensates containing 3-acryloyloxypropyltrimethoxysilane as an essential constituent monomer and condensates containing 3-glycidoxypropyltrimethoxysilane as an essential constituent monomer.
- a dialkyl dialkoxysilane eg, dimethyldimethoxysilane, diethyldimethoxysilane, etc.
- diaryl dialkoxy Silane for example, diphenyldimethoxysilane etc.
- Examples of (E) that can be easily obtained from the market include KR-513 [manufactured by Shin-Etsu Chemical Co., Ltd .: acrylic group and methyl group-containing methoxysiloxane (acrylic-modified alkoxypolysiloxane)].
- the content of the compound (E) is 0.1 to 20% by weight, preferably 0.5%, based on the total weight of (A) to (C) and (E), from the viewpoints of elastic recovery and adhesion. -15% by weight, more preferably 1-12% by weight.
- the photosensitive resin composition of the present invention may further contain other components as necessary, and examples thereof include inorganic fine particles, a surfactant, a silane coupling agent, an antioxidant, and a polymerization inhibitor.
- the total addition amount of the other components is 0 to 10% by weight, preferably 0.1 to 8% by weight, more preferably 0.3 to 5% based on the total weight of (A) to (C) and (E). % By weight.
- metal oxides and metal salts can be used as the inorganic fine particles.
- the metal oxide include titanium oxide, silicon oxide, and aluminum oxide.
- the metal salt include calcium carbonate and barium sulfate. Of these, metal oxides are preferable and silicon oxide is more preferable from the viewpoints of heat-resistant transparency and chemical resistance.
- the inorganic fine particles preferably have a volume average primary particle diameter of 1 to 200 nm.
- surfactant various types of surfactants such as anionic, cationic, nonionic, amphoteric, fluorine and silicon can be used. Of these, fluorine-based and silicon-based surfactants are preferable from the viewpoint of applicability.
- silane coupling agent examples include vinyl silane, acrylic silane, epoxy silane, amino silane, and the like.
- Antioxidants include 2,6-di-t-butyl-4-methylphenol, 2-t-butyl-6- (3-t-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl Acrylate, 2- [1- (2-hydroxy-3,5-di-t-pentylphenyl) ethyl] -4,6-di-t-pentylphenyl acrylate, 6- [3- (3-t-butyl- 4-hydroxy-5-methylphenyl) propoxy] -2,4,6,10-tetra-butyldibenz [d, f] [1,3,2] dioxaphosphine, 3-4′-hydroxy-3 ′ -5'-di-t-butylphenyl) propionic acid-n-octadecyl, octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) -propionate, 3,9-bis [2- [ 3- (3-
- polymerization inhibitor examples include p-methoxyphenol, hydroquinone, naphthylamine, tert-butylcatechol, 2,3-di-tert-butyl-p-cresol and the like.
- the photosensitive resin composition of the present invention can be obtained, for example, by mixing the above-described components with a known mixing apparatus such as a planetary mixer.
- the photosensitive resin composition is usually liquid at room temperature, and its viscosity is 25 ° C., preferably 0.1 to 10,000 mPa ⁇ s, more preferably 1 to 8,000 mPa ⁇ s.
- the photosensitive resin composition of the present invention is excellent in elastic recovery characteristics and high developability, and has high resolution. Therefore, the photo spacer, the protective film for the color filter, the protective film for the touch panel, or the insulating film for the touch panel Suitable as a photosensitive resin composition for film formation.
- a preferable forming step of obtaining a cured product from the photosensitive resin composition of the present invention is a step of applying a photosensitive resin composition on a substrate, irradiating with light, forming a pattern by alkali development, and performing post-baking. .
- the formation of the cured product is usually performed in the following steps (1) to (5).
- substrate examples include roll coating, spin coating, spray coating, and slit coating.
- the coating device examples include spin coater, air knife coater, roll coater, bar coater, die coater, curtain coater, gravure coater, and comma coater. Etc.
- the film thickness is preferably 0.5 to 10 ⁇ m, more preferably 1 to 5 ⁇ m.
- the drying temperature is preferably 20 to 120 ° C, more preferably 30 to 110 ° C.
- the drying time is preferably 0.5 to 10 minutes, more preferably 1 to 8 minutes, and particularly preferably 1 to 5 minutes. Drying may be performed under reduced pressure or normal pressure.
- a step of exposing the photosensitive resin composition layer with actinic rays through a predetermined photomask examples include visible rays, ultraviolet rays, far infrared rays, charged particle beams, X-rays, and laser beams.
- the light source examples include sunlight, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, and a semiconductor laser.
- the exposure dose is not particularly limited, but is preferably 20 to 300 mJ / cm 2 , and more preferably 20 to 100 mJ / cm 2 from the viewpoint of production cost.
- a component having a (meth) acryloyl group in the photosensitive resin composition reacts to undergo photocuring reaction.
- an alkaline aqueous solution is usually used as the developer.
- the alkaline aqueous solution include aqueous solutions of alkali metal hydroxides such as sodium hydroxide and potassium hydroxide; aqueous solutions of carbonates such as sodium carbonate, potassium carbonate and sodium hydrogencarbonate; hydroxytetramethylammonium and hydroxytetraethylammonium.
- an aqueous solution of an organic alkali is usually used as the developer.
- a surfactant such as an anionic surfactant, a cationic surfactant, an amphoteric surfactant and a nonionic surfactant can be added and used.
- a developing method there are a dip method and a shower method, but the shower method is preferable.
- the temperature of the developer is preferably 20 to 45 ° C.
- the development time is appropriately determined according to the film thickness and the solubility of the photosensitive resin composition.
- Post-heating (post-baking) step The post-baking temperature is preferably 50 to 280 ° C., more preferably 100 to 250 ° C.
- the post-bake time is preferably 5 minutes to 2 hours.
- Production Example 1 A glass flask equipped with a heating / cooling / stirring device, a reflux condenser, and a nitrogen inlet tube was charged with 60 parts of styrene, 20 parts of methyl methacrylate, 20 parts of methacrylic acid, and 217 parts of diethylene glycol dimethyl ether. After replacing the gas phase in the system with nitrogen, 36 parts of a solution of 6 parts of 2,2′-azobis (2,4-dimethylvaleronitrile) dissolved in 30 parts of diethylene glycol dimethyl ether was added and heated to 90 ° C. The mixture was further reacted at the same temperature for 4 hours.
- hydrophilic vinyl resin (A-1).
- the acid value in terms of solid content of the hydrophilic vinyl resin was 131.5.
- Mn by GPC was 4,000.
- the hydrophilic vinyl resin had an SP value of 10.8 and an HLB value of 7.1.
- Production Example 2 A glass flask equipped with a heating / cooling / stirring device, a reflux condenser, and a nitrogen introduction tube was charged with 90 parts of styrene, 10 parts of methyl methacrylate, 30 parts of methacrylic acid, and 327 parts of propylene glycol monomethyl ether acetate. After replacing the gas phase part in the system with nitrogen, 38 parts of a solution in which 8 parts of 2,2′-azobis (2,4-dimethylvaleronitrile) was dissolved in 30 parts of propylene glycol monomethyl ether acetate were added, And further reacted at the same temperature for 4 hours.
- hydrophilic vinyl resin (A-2).
- the acid value in terms of solid content of the hydrophilic vinyl resin was 96.1.
- Mn by GPC was 4,500.
- the hydrophilic vinyl resin had an SP value of 11.1 and an HLB value of 6.8.
- the reaction product was further charged with 91 parts of tetrahydrophthalic anhydride, further reacted at 90 ° C. for 5 hours, and then diluted with propylene glycol monomethyl ether acetate so that the content of hydrophilic epoxy resin was 60%.
- a 60% propylene glycol monomethyl ether acetate solution of epoxy resin (A-3) was obtained.
- the acid value in terms of solid content of the hydrophilic epoxy resin was 88.4.
- the Mn by GPC was 2,200.
- the hydrophilic epoxy resin had an SP value of 11.3 and an HLB value of 9.8.
- Examples 1 to 9 and Comparative Examples 1 to 4 According to the number of parts in Table 1, a solution of the hydrophilic resin (A-1) produced in Production Example 1 in a glass container, the following (B-1), (C-1), (C-3), ( D-1), (D-2) surfactants (G-1) and (G-2), and acrylic-modified alkoxypolysiloxane (E-1) produced in Production Example 4 were charged until uniform. The mixture was stirred to obtain a photosensitive resin composition of Example 1. Further, using the same apparatus, the photosensitive resin compositions of Examples 2 to 9 and Comparative Examples 1 to 4 were obtained in the same manner using the raw materials in the number of parts shown in Table 1.
- the number average molecular weight (Mn) of the compound (E) was measured using HLC-8320GPC (manufactured by Tosoh Corp.) and THF solvent, TSK standard polystyrene (Tosoh Corp.) as a reference substance.
- GPC workstation EcoSEC-WS manufactured by Tosoh Corporation was used as analysis software.
- a photosensitive resin composition was applied onto a 10 cm ⁇ 10 cm square glass substrate by a spin coater and dried to form a coating film having a dry film thickness of 5 ⁇ m. This coating film was heated on a hot plate at 80 ° C. for 3 minutes, and then developed with a 0.05% aqueous KOH solution for 30 seconds to evaluate the developability.
- the evaluation criteria are as follows. A: There is no residue visually. ⁇ : There is a slight residue visually. ⁇ : There are many residues by visual inspection. X: Development is not possible.
- a photosensitive resin composition was applied onto a 10 cm ⁇ 10 cm square glass substrate by a spin coater and dried to form a coating film having a dry film thickness of 5 ⁇ m.
- This coating film was heated on a hot plate at 80 ° C. for 3 minutes.
- the resulting coating film was irradiated with 60 mJ / cm 2 of light from an ultrahigh pressure mercury lamp through a mask for forming a photospacer (illuminance 22 mW / cm 2 in terms of i-line).
- a photospacer luminance 22 mW / cm 2 in terms of i-line.
- alkali development was performed using a 0.05% aqueous KOH solution.
- post-baking was performed at 230 ° C. for 30 minutes to form a photo spacer on the glass substrate.
- the elastic recovery characteristic of the photospacer can be evaluated by the “elastic recovery rate” when a certain pressure defined by the following formula (1) is applied.
- the elastic recovery characteristic was evaluated by measuring the elastic recovery rate under a pressure condition of 0.5 mN / ⁇ m 2 .
- a micro hardness tester Fischer Instruments, Inc .; “Fischer Scope H-100”
- a planar indenter with a square cross section for one photo spacer selected arbitrarily from among photo spacers formed on a glass substrate 50 ⁇ m ⁇ 50 ⁇ m
- a load was applied to 0.5 mN / ⁇ m 2 over 30 seconds at a load speed of 0.017 mN / ⁇ m 2 ⁇ sec and held for 5 seconds.
- the amount of deformation from the initial position of the photospacer in a state where a load was applied was measured.
- the amount of change at this time is defined as a total deformation amount T 0 ( ⁇ m).
- T 0 The deformation amount from the initial position of the photo spacer at this time.
- T 1 The deformation amount from the initial position of the photo spacer at this time.
- a photosensitive resin composition was applied onto a 10 cm ⁇ 10 cm square glass substrate by a spin coater and dried to form a coating film having a dry film thickness of 5 ⁇ m.
- This coating film was heated on a hot plate at 80 ° C. for 3 minutes.
- the resulting coating film was irradiated with 60 mJ / cm 2 of light from an ultrahigh pressure mercury lamp through a mask for forming a photospacer (illuminance 22 mW / cm 2 in terms of i-line).
- a photospacer luminance 22 mW / cm 2 in terms of i-line.
- interval exposure gap
- the photosensitive resin composition was applied onto a transparent glass substrate (thickness 0.7 mm) with a spin coater and dried to form a coating film.
- This coating film was heated at 80 ° C. for 3 minutes.
- the obtained coating film was irradiated with light from an ultrahigh pressure mercury lamp at 60 mJ / cm 2 (illuminance 22 mW / cm 2 in terms of i-line). Thereafter, alkali development was performed using a 0.05% aqueous KOH solution. After washing with water, post-baking was performed at 230 ° C. for 30 minutes to form a protective film having a thickness of 2 ⁇ m.
- the transmittance of light having a wavelength of 400 nm was measured for the protective film obtained as described above using an ultraviolet-visible spectrophotometer UV-2400 (manufactured by Shimadzu Corporation).
- the transmittance at 400 nm is shown in Table 1. When this value is 97% or more, it can be said that the transparency of the protective film is good.
- the photosensitive resin compositions of the present invention of Examples 1 to 9 are excellent in all points of developability, elastic recovery characteristics, resolution, development adhesion, transparency, adhesion, and pencil hardness as shown in Table 1. Yes. On the other hand, since Comparative Examples 1 and 2 do not contain the solvent (D), the developability is poor. Since Comparative Examples 3 and 4 do not contain the hydrophilic resin (A), development cannot be performed.
- the photosensitive resin composition of the present invention is excellent in developability and elastic recovery characteristics after curing and adhesion to a glass substrate, a photo spacer for a display element, a protective film for a color filter, a protective film for a touch panel, or an insulating film for a touch panel Can be suitably used. Furthermore, it is also suitable as a photosensitive resin composition for various other resist materials such as a photo solder resist, a photosensitive resist film, a photosensitive resin relief plate, a screen plate, a photoadhesive or a hard coat material.
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Abstract
Description
高精細化の方法として、硫黄原子含有化合物を添加する方法(例えば特許文献1)が開示されているが、微細なフォトスペーサーを形成すると密着性が著しく低下する。
しかし、ODF方式においては、セルギャップから計算して見積もった所定量の液晶を滴下して狭持するため、その際にガラス基板上に配置されたフォトスペーサーに圧力変化がかかる。この圧力変化に対して、形状が塑性変形しないよう、高い弾性回復特性を有することがフォトスペーサーに対して望まれる。
しかし、いずれの方法でも、樹脂組成物は疎水性になるため、現像時間が長くなり、生産性が低下するという問題があり、高弾性と高現像性が両立し得る感光性樹脂組成物は得られていない。
すなわち、本発明は、親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、HLBが8.0以上30.0以下である溶剤(D)、および下記一般式(1)で示される化合物を必須構成単量体とする縮合物である化合物(E)を含有する感光性樹脂組成物;並びに上記の感光性樹脂組成物を光照射の後、アルカリ現像してパターンを形成し、さらにポストベークを行って形成されたフォトスペーサー、カラーフィルター用保護膜、およびタッチパネルの保護膜もしくは絶縁膜である。
(A)は1種を用いてもよいし、2種以上を併用してもよい。これらのうち、感光性樹脂組成物の感度の観点と、製造のし易さの観点から、好ましくは親水性ビニル樹脂(A1)及び親水性エポキシ樹脂(A2)である。弾性回復特性の観点から、さらに好ましくは親水性エポキシ樹脂(A2)である。
(A)のHLB値は、好ましくは4~19、さらに好ましくは5~18、特に好ましくは6~17である。4以上であればフォトスペーサーの現像を行う際に、現像性がさらに良好であり、19以下であれば硬化物の耐水性がさらに良好である。
HLB値は有機化合物の有機性の値と無機性の値との比率から計算することができる。
HLB=10×無機性/有機性
HLBを導き出すための有機性の値及び無機性の値については前記「界面活性剤入門」213頁に記載の表の値を用いて算出できる。ただし、オキシエチレン基(-CH2CH2O-)は特別扱いをして、無機性値75、有機性値40を用いて算出する。
「POLYMER ENFINEERING AND SCIENCE,February,1974,Vol.14,No.2,Robert F. Fedors(147~154頁)」
SP値が近いもの同士はお互いに混ざりやすく(分散性が高い)、この数値が離れているものは混ざりにくい。
カルボキシル基の含有量は酸価で示される。(A)の酸価は、好ましくは10~500mgKOH/g、さらに好ましくは20~300mgKOH/gである。10mgKOH/g以上であると、現像性がさらに良好に発揮されやすく、500mgKOH/g以下であれば硬化物の耐水性がさらに良好に発揮できる。
(i)試料約0.1~10gを精秤して三角フラスコに入れ、続いて中性メタノール・アセトン溶液[アセトンとメタノールを1:1(容量比)で混合したもの]を加え溶解する。
(ii)フェノールフタレイン指示薬数滴を加え、0.1mol/L水酸化カリウム滴定用溶液で滴定する。指示薬の微紅色が30秒続いたときを中和の終点とする。
(iii)次式を用いて決定する。
酸価(mgKOH/g)=(A×f×5.61)/S
ただし、A:0.1mol/L水酸化カリウム滴定用溶液のmL数
f:0.1mol/L水酸化カリウム滴定用溶液の力価
S:試料採取量(g)
ヒドロキシアルキル基の炭素数が1~30のヒドロキシアルキル(メタ)アクリレート[2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート及び3-ヒドロキシプロピル(メタ)アクリレート等]、ポリアルキレン(アルキレン基の炭素数1~8)グリコール(重合度2~40)モノ(メタ)アクリレート[ポリエチレングリコールモノ(メタ)アクリレート等]、アルキロール(メタ)アクリルアミド[N-メチロール(メタ)アクリルアミド等]、ヒドロキシスチレン及び2-ヒドロキシエチルプロペニルエーテル等が挙げられる。
炭素数3~30の不飽和モノカルボン酸[(メタ)アクリル酸、クロトン酸及び桂皮酸等]、炭素数4~30の不飽和多価(2~4価)カルボン酸[(無水)マレイン酸、イタコン酸、フマル酸及びシトラコン酸等]、炭素数4~30の不飽和多価カルボン酸のアルキル(炭素数1~10のアルキル基)エステル[マレイン酸モノアルキルエステル、フマル酸モノアルキルエステル及びシトラコン酸モノアルキルエステル等]、並びにこれらの塩[アルカリ金属塩(ナトリウム塩及びカリウム塩等)、アルカリ土類金属塩(カルシウム塩及びマグネシウム塩等)、アミン塩及びアンモニウム塩等]が挙げられる。
ビニルスルホン酸、(メタ)アリルスルホン酸、スチレンスルホン酸、α-メチルスチレンスルホン酸、2-(メタ)アクリロイルアミド-2-メチルプロパンスルホン酸及びこれらの塩が挙げられる。塩としては、アルカリ金属(ナトリウム及びカリウム等)塩、アルカリ土類金属(カルシウム及びマグネシウム等)塩、第1~3級アミン塩、アンモニウム塩及び第4級アンモニウム塩等が挙げられる。
3級アミノ基含有(メタ)アクリレート[ジメチルアミノエチル(メタ)アクリレート及びジエチルアミノエチル(メタ)アクリレート等のジアルキルアミノアルキル(メタ)アクリレート]等が挙げられる。
(メタ)アクリルアミド、N-アルキル(炭素数1~6)(メタ)アクリルアミド、ジアセトンアクリルアミド、N,N’-メチレン-ビス(メタ)アクリルアミド、N,N-ジアルキル(炭素数1~6)又はN,N-ジアラルキル(炭素数7~15)(メタ)アクリルアミド(例えば、N,N-ジメチルアクリルアミド及びN,N-ジベンジルアクリルアミド等)、メタクリルホルムアミド、N-メチル-N-ビニルアセトアミド、桂皮酸アミド及び環状アミド(N-ビニルピロリドン、N-アリルピロリドン等)が挙げられる。
炭素数6~50(好ましくは8~20)の第3級アミノ基含有ビニルモノマーの4級化物(4級化剤としては、メチルクロライド、ジメチル硫酸、ベンジルクロライド及びジメチルカーボネート等)、例えば、ジメチルアミノエチル(メタ)アクリレートの4級化物、ジエチルアミノエチル(メタ)アクリレートの4級化物、ジメチルアミノエチル(メタ)アクリルアミドの4級化物及びジエチルアミノエチル(メタ)アクリルアミドの4級化物等が挙げられる。
アルコキシ(アルコキシ基の炭素数1~8)アルキレン(アルキレン基の炭素数1~8)グリコールモノ(メタ)アクリレート[メトキシエチレングリコールモノ(メタ)アクリレート及びメトキシプロピレングリコールモノ(メタ)アクリレート等]、アルコキシ(アルコキシ基の炭素数1~8)ポリアルキレン(アルキレン基の炭素数2~4)グリコールモノ(メタ)アクリレート[メトキシポリエチレングリコール(重合度2~40)モノ(メタ)アクリレート及びメトキシポリプロピレングリコール(重合度2~30)モノ(メタ)アクリレート等]等が挙げられる。
アルキル基の炭素数1~20のアルキル(メタ)アクリレートとしては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n-プロピル(メタ)アクリレート、イソプロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、n-ヘキシル(メタ)アクリレート及び2-エチルヘキシル(メタ)アクリレート等が挙げられる。また、脂環基含有(メタ)アクリレートとしては、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート及びイソボルニル(メタ)アクリレート等が挙げられる。
スチレン骨格を有する炭化水素モノマーとしては、スチレン、α-メチルスチレン、ビニルトルエン、2,4-ジメチルスチレン、エチルスチレン、イソプロピルスチレン、ブチルスチレン、フェニルスチレン、シクロヘキシルスチレン、ベンジルスチレン及びビニルナフタレン等が挙げられる。
炭素数4~50のものとしては、酢酸ビニル、プロピオン酸ビニル及び酪酸ビニル等が挙げられる。
炭素数3~50(好ましくは6~20)のものとしては、ビニルメチルエーテル、ビニルエチルエーテル、ビニルプロピルエーテル及びビニルブチルエーテル等が挙げられる。
炭素数4~50のものとしては、ビニルメチルケトン、ビニルエチルケトン及びビニルフェニルケトン等が挙げられる。
なお、(メタ)アクリロイル基含有モノカルボン酸(a21)は、カルボキシル基含有ビニルモノマー(a2)のうち、(メタ)アクリロイル基を含有する不飽和モノカルボン酸である。
(A20)のうち好ましいのは硬度の観点から芳香族エポキシ樹脂である。
例えば2官能(メタ)アクリレートとは、(メタ)アクリロイル基の数が2個であることを意味し、以下同様の記載法を用いる。
そのような(B4)としては、Mnが1,000以下であって、カルボキシル基を含有せず、1分子中に2個以上のアクリロイル基を有するウレタンアクリレート、ポリエステルアクリレート及びポリエーテルアクリレートなどが含まれる。
これらの中で好ましいものは、塗工性の点からエーテル溶剤、エステル溶剤である。これらの中でもジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールエチルメチルエーテル、3-メトキシブタノール、乳酸エチルである。
(D)は1種を用いてもよいし、2種以上を併用してもよい。
これらの中で好ましいものは、塗工性の点からエーテル溶剤およびエステル溶剤である。
(F)は1種を用いてもよいし、2種以上を併用してもよい。
直鎖アルキル基としては、メチル、エチル、n-プロピル、n-ブチル、n-オクチルおよびn-ドデシル基およびこれらの重水素置換体;分岐アルキル基としては、イソプロピル、イソブチル、sec-ブチルおよび2-エチルヘキシル基;並びに環式飽和炭化水素基としては、シクロヘキシル基、シクロオクチル基、シクロヘキシルメチル基、シクロヘキシルエチル基およびメチルシクロヘキシル基などが挙げられる。
アリール基としては、フェニル、ビフェニル、ナフチル基およびこれらの重水素、フッ素もしくは塩素の各置換体;アラルキル基としては、トリル、キシリル、メシチルおよびこれらの重水素、フッ素もしくは塩化物;並びに、アルキルアリール基としては、メチルフェニルおよびエチルフェニル基などが挙げられる。
R3としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基およびsec-ブチル基などが挙げられ、好ましいのは、熱硬化反応性の観点からメチル基およびエチル基である。
mが0、すなわちアルコキシ基を3個有する3官能化合物・・・3-メタクリロイロキシプロピルトリメトキシシラン、3-メタクリロイロキシプロピルトリエトキシシラン、3-アクリロイロキシプロピルトリメトキシシラン、3-アクリロイロキシプロピルトリエトキシシラン、3-メタクリロイロキシプロピルトリメトキシチタン、3-メタクリロイロキシプロピルトリメトキシアルミニウム、3-メタクリロイロキシプロピルトリメトキシジルコニウム等。
mが0、すなわちアルコキシ基を3個有する3官能化合物・・・3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、3-グリシドキシプロピルトリメトキシチタン等。
mが1、すなわちアルコキシ基を2個有する3官能化合物・・・3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-グリシドキシプロピルメチルジメトキシチタン、3-グリシドキシプロピルメチルジメトキシアルミニウム、3-グリシドキシプロピルメチルジメトキシジルコニウム等。
mが0、すなわちアルコキシ基を3個有する3官能化合物・・・3-メルカプトプロピルトリメトキシシラン、3-メルカプトプロピルトリエトキシシラン、3-メルカプトプロピルトリメトキシチタン、3-メルカプトプロピルトリメトキシアルミニウム、3-メルカプトプロピルトリメトキシジルコニウム等。
mが1、すなわちアルコキシ基を2個有する3官能化合物・・・3-メルカプトプロピルメチルジメトキシシラン、3-メルカプトプロピルメチルジエトキシシラン、3-メルカプトプロピルメチルジメトキシチタン、3-メルカプトプロピルメチルジメトキシアルミニウム、3-メルカプトプロピルメチルジメトキシジルコニウム等。
mが0、すなわちアルコキシ基を3個有する3官能化合物・・・N-2アミノエチルγ-アミノプロピルトリメトキシシラン、N-2アミノエチルγ-アミノプロピルトリエトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、N-2アミノエチルγ-アミノプロピルトリメトキシチタン、N-2アミノエチルγ-アミノプロピルトリメトキシアルミニウム、N-2アミノエチルγ-アミノプロピルトリメトキシジルコニウム等。
mが1、すなわちアルコキシ基を2個有する3官能化合物・・・N-2アミノエチルγ-アミノプロピルメチルジメトキシシラン、N-2アミノエチルγ-アミノプロピルメチルジエトキシシラン、3-アミノプロピルメチルジメトキシシラン、3-アミノプロピルメチルジエトキシシラン、N-2アミノエチルγ-アミノプロピルメチルジメトキシチタン、N-2アミノエチルγ-アミノプロピルメチルジメトキシアルミニウム、N-2アミノエチルγ-アミノプロピルメチルジメトキシジルコニウム等。
化合物(E)の縮合物を構成する単量体としては、上記一般式(1)で示される化合物以外に、ジアルキルジアルコキシシラン(例えば、ジメチルジメトキシシラン、ジエチルジメトキシシラン等)、ジアリ-ルジアルコキシシラン(例えば、ジフェニルジメトキシシラン等)等が挙げられる。
硬化物の形成は、通常、以下(1)~(5)の工程で行われる。
膜厚は、好ましくは0.5~10μm、さらに好ましくは1~5μmである。
現像方法としては、ディップ方式とシャワー方式があるが、シャワー方式の方が好ましい。現像液の温度は、好ましくは20~45℃である。現像時間は、膜厚や感光性樹脂組成物の溶解性に応じて適宜決定される。
加熱冷却・撹拌装置、還流冷却管、窒素導入管を備えたガラス製フラスコに、スチレン60部、メタクリル酸メチル20部、メタクリル酸20部及びジエチレングリコールジメチルエーテル217部を仕込んだ。系内の気相部分を窒素で置換したのち、2、2’-アゾビス(2,4-ジメチルバレロニトリル)6部をジエチレングリコールジメチルエーテル30部に溶解した溶液36部を添加し、90℃に加熱し、さらに同温度で4時間反応させた。さらに得られた溶液にメタクリル酸グリシジル15部、トリエチルアミン1部を添加し、90℃で6時間反応させ、親水性ビニル樹脂(A-1)の30%ジエチレングリコールジメチルエーテル溶液を得た。
親水性ビニル樹脂の固形分換算した酸価は131.5であった。GPCによるMnは4,000であった。なお、親水性ビニル樹脂のSP値は10.8、HLB値は7.1であった。
加熱冷却・撹拌装置、還流冷却管、窒素導入管を備えたガラス製フラスコに、スチレン90部、メタクリル酸メチル10部、メタクリル酸30部及びプロピレングリコールモノメチルエーテルアセテート327部を仕込んだ。系内の気相部分を窒素で置換したのち、2、2’-アゾビス(2,4-ジメチルバレロニトリル)8部をプロピレングリコールモノメチルエーテルアセテート30部に溶解した溶液38部を添加し、90℃に加熱し、さらに同温度で4時間反応させた。さらに得られた溶液にメタクリル酸グリシジル15部、トリエチルアミン1部を添加し、90℃で6時間反応させ、親水性ビニル樹脂(A-2)の30%プロピレングリコールモノメチルエーテルアセテート溶液を得た。
親水性ビニル樹脂の固形分換算した酸価は96.1であった。GPCによるMnは4,500であった。なお、親水性ビニル樹脂のSP値は11.1、HLB値は6.8であった。
加熱冷却・撹拌装置、還流冷却管、滴下ロート及び窒素導入管を備えたガラス製フラスコに、クレゾールノボラック型エポキシ樹脂「EOCN-102S」(日本化薬(株)製エポキシ当量200)200部とプロピレングリコールモノメチルエーテルアセテート145部を仕込み、90℃まで加熱して均一に溶解させた。続いて、アクリル酸76部、トリフェニルホスフィン2部及びp-メトキシフェノール0.2部を仕込み、90℃にて10時間反応させた。
この反応物にさらにテトラヒドロ無水フタル酸91部を仕込み、さらに90℃にて5時間反応させ、その後プロピレングリコールモノメチルエーテルアセテートで親水性エポキシ樹脂の含有量が60%になるように希釈し、親水性エポキシ樹脂(A-3)の60%プロピレングリコールモノメチルエーテルアセテート溶液を得た。
親水性エポキシ樹脂の固形分換算した酸価は88.4であった。GPCによるMnは2,200であった。なお、親水性エポキシ樹脂のSP値は11.3、HLB値は9.8であった。
[化合物(E-1)の製造]
加熱冷却・攪拌装置、環流冷却管、滴下ロートおよび窒素導入管を備えたガラス製フラスコに、3-アクリロイロキシプロピルトリメトキシシラン46部(0.2モル部)、ジフェニルジメトキシシラン160部(0.65モル部)とイオン交換水45g(2.5モル部)と、シュウ酸0.1部(0.001モル部)を仕込み、60℃、6時間の条件で加熱撹拌し、さらにエバポレーターを用いて、加水分解により副生したメタノールを減圧下で2時間かけて除去し、アクリル変性アルコキシポリシロキサン(E-1)(Mn:2,100)を得た。
表1の配合部数に従い、ガラス製の容器に製造例1で製造した親水性樹脂(A-1)の溶液、下記の(B-1)、(C-1)、(C-3)、(D-1)、(D-2)界面活性剤(G-1)、および(G-2)、並びに製造例4で製造したアクリル変性アルコキシポリシロキサン(E-1)を仕込み、均一になるまで攪拌し、実施例1の感光性樹脂組成物を得た。また同様の装置を用いて、表1の配合部数の原料を用いて、同様に実施例2~9、および比較例1~4の感光性樹脂組成物を得た。
(B-1):「ネオマーDA-600」(ジペンタエリスリトールペンタアクリレート:三洋化成工業(株)社製)(HLB:9.4)
(B-2):「ネオマーEA-300」(ペンタエリスリトールテトラアクリレート:三洋化成工業(株)社製)(HLB:7.8)
(C-1):「イルガキュア819」(ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド:BASF社製)
(C-2):「イルガキュア907」(2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノ-1-プロパノン:BASF社製)
(C-3):「カヤキュア-DETX-S」(2,4-ジエチルチオキサントン:日本化薬(株)製)
(D-1)ジエチレングリコールエチルメチルエーテル
(D-2)ジエチレングリコールジメチルエーテル
(D-3)乳酸エチル
(D-4)エチレングリコールモノメチルエーテル
(D-5)トリプロピレングリコールモノメチルエーテル
(E-2):「KR-513」〔アクリル基およびメチル基含有メトキシシロキサン(アクリル変性アルコキシポリシロキサン):信越化学(株)製〕
(F-1)プロピレングリコールモノメチルエーテルアセテート
(F-2)酢酸ブチル
(G-1):「KF-352A」〔ポリエーテル変性ポリジメチルシロキサン(界面活性剤):信越化学(株)社製〕
(G-2):「メガファックTF-2066」〔ポリエーテル変性フッ素化合物(界面活性剤):DIC(株)社製〕
HLC-8320GPC(東ソー(株)製)を使用し、THF溶媒、TSK標準ポリスチレン(東ソー(株)製)を基準物質として測定した。また、解析ソフトとしてGPCワークステーションEcoSEC-WS(東ソー(株)製)を使用した。
[現像性の評価]
10cm×10cm四方のガラス基板上に、スピンコーターにより感光性樹脂組成物を塗布し、乾燥し、乾燥膜厚5μmの塗膜を形成した。この塗膜をホットプレート上で80℃、3分間加熱し、その後0.05%KOH水溶液を用いて30秒間現像を行い、現像性を評価した。評価基準は以下の通りである。
◎:目視により残留物無し。
○:目視により残留物わずかにあり。
△:目視により残留物が多い。
×:現像できない。
10cm×10cm四方のガラス基板上に、スピンコーターにより感光性樹脂組成物を塗布し、乾燥し、乾燥膜厚5μmの塗膜を形成した。この塗膜をホットプレート上で80℃、3分間加熱した。
得られた塗膜に対し、フォトスペーサー形成用のマスクを通して超高圧水銀灯の光を60mJ/cm2照射した(i線換算で照度22mW/cm2)。
なお、マスクと基板の間隔(露光ギャップ)は100μmで露光した。
その後0.05%KOH水溶液を用いてアルカリ現像した。水洗したのち、230℃で30分間ポストベークを行い、ガラス基板上にフォトスペーサーを形成した。
弾性回復特性は0.5mN/μm2の圧力条件下での弾性回復率を測定して評価した。
この際に、0.017mN/μm2・秒の負荷速度で、30秒かけて0.5mN/μm2まで荷重をかけ、5秒間保持した。
荷重がかかった状態でのフォトスペーサーの初期位置からの変形量を測定した。このときの変化量を総変形量T0(μm)とする。
(2)次に、0.017mN/μm2・秒の除荷速度で30秒かけて荷重を0まで解除し、その状態で5秒間保持した。この時のフォトスペーサーの初期位置からの変形量を塑性変形量T1(μm)とする。
(3)上記のようにして測定したT0とT1から、下記数式(1)を用いて弾性回復率を算出した。
[弾性回復特性の評価]と同様の操作で得られたフォトスペーサーのうち、フォトマスクの開口径が直径10μmのフォトスペーサーをレーザー顕微鏡にて下底径を測定し、これを解像度の評価とした。下底形が小さいほど解像度が高いといえ、10.8μm以下であれば、解像度は良好であると言える。
10cm×10cm四方のガラス基板上に、スピンコーターにより感光性樹脂組成物を塗布し、乾燥し、乾燥膜厚5μmの塗膜を形成した。この塗膜をホットプレート上で80℃、3分間加熱した。得られた塗膜に対し、フォトスペーサー形成用のマスクを通して超高圧水銀灯の光を60mJ/cm2照射した(i線換算で照度22mW/cm2)。なお、マスクと基板の間隔(露光ギャップ)は100μmで露光した。その後0.05%KOH水溶液を用いて90秒間現像を行い、現像密着性を評価した。評価基準は以下の通りである。◎または○であれば、現像密着性は良好であると言える。
◎:フォトマスク開口径10μmで剥れなし
○:フォトマスク開口径12μmで剥れなし(10μmでは剥れあり)
△:フォトマスク開口径16μmで剥れなし(10μm、12μmでは剥れあり)
×:フォトマスク開口径16μmで剥れあり
感光性樹脂組成物を透明ガラス基板(厚さ0.7mm)上にスピンコーターで塗布し、乾燥して、塗膜を形成した。この塗膜を80℃で3分間加熱した。
得られた塗膜に超高圧水銀灯の光を60mJ/cm2(i線換算で照度22mW/cm2)照射した。
その後0.05%KOH水溶液を用いてアルカリ現像した。水洗したのち、230℃で30分間ポストベークを行い、膜厚2μmの保護膜を形成した。
上記のようにして得られた保護膜について、紫外可視分光光度計UV-2400(島津製作所社製)を用いて波長400nmの光の透過率を測定した。
400nmの透過率を表1に示した。この値が97%以上の場合に、保護膜の透明性は良好といえる。
透明性の評価と同様の操作で得られた保護膜について、JIS K5600-5-6の付着性(クロスカット法)により保護膜の密着性について評価した。
表1に碁盤目100(10×10)個中、ガラス基板上に残ったクロスカットした保護膜の碁盤目の数を示した。95以上であれば、密着性は良好であると言える。
透明性の評価と同様の操作で、得られた保護膜について、JIS K5600-5-4の引っかき硬度(鉛筆法)により保護膜の鉛筆硬度について評価した。
鉛筆硬度を表1に示した。
この値が3H以上の場合に、保護膜の硬度は良好といえる。
その一方で、比較例1および2は、溶剤(D)を含有していないため、現像性が悪い。比較例3および4は親水性樹脂(A)を含有していないため、現像ができない。
Claims (6)
- 親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、HLBが8.0以上30.0以下である溶剤(D)、および下記一般式(1)で示される化合物を必須構成単量体とする縮合物である化合物(E)を含有する感光性樹脂組成物。
[式(1)中、R1は、アルキル基の炭素数が1~6の(メタ)アクリロイロキシアルキル基、グリシドキシアルキル基、メルカプトアルキル基およびアミノアルキル基からなる群から選ばれる1種以上の有機基、R2は炭素数1~12の脂肪族飽和炭化水素基または炭素数6~12の芳香族炭化水素基、R3は炭素数1~4のアルキル基、Mは珪素原子、チタン原子およびジルコニウム原子からなる群から選ばれる1種以上の原子であり、mは0または1である。] - 上記一般式(1)において、Mが珪素原子である請求項1に記載の感光性樹脂組成物。
- 上記一般式(1)において、R1が、アルキル基の炭素数が1~6の(メタ)アクリロイロキシアルキル基および/又はアルキル基の炭素数が1~6のグリシドキシアルキル基である請求項1または2に記載の感光性樹脂組成物。
- 請求項1~3のいずれか1項に記載の感光性樹脂組成物を光照射の後、アルカリ現像してパターンを形成し、さらにポストベークを行って形成されたフォトスペーサー。
- 請求項1~3のいずれか1項に記載の感光性樹脂組成物を光照射の後、アルカリ現像してパターンを形成し、さらにポストベークを行って形成されたカラーフィルター用保護膜。
- 請求項1~3のいずれか1項に記載の感光性樹脂組成物を光照射の後、アルカリ現像してパターンを形成し、さらにポストベークを行って形成されたタッチパネルの保護膜もしくは絶縁膜。
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| JP2015519839A JP6377056B2 (ja) | 2013-05-30 | 2014-05-26 | 感光性樹脂組成物、フォトスペーサー、カラーフィルター用保護膜、及び、タッチパネルの保護膜もしくは絶縁膜 |
| CN201480026139.1A CN105190440B (zh) | 2013-05-30 | 2014-05-26 | 感光性树脂组合物、光学间隔件、彩色滤色器用保护膜和触摸面板的保护膜或绝缘膜 |
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| JP2016186609A (ja) * | 2015-03-27 | 2016-10-27 | 三洋化成工業株式会社 | 感光性樹脂組成物 |
| EP3330338A1 (en) * | 2016-12-05 | 2018-06-06 | Henkel AG & Co. KGaA | Liquid adhesive composition, adhesive sheet, and adhesive bonding method |
| EP3460828A4 (en) * | 2016-05-18 | 2019-05-22 | Soken Chemical & Engineering Co., Ltd. | LIGHT-CURABLE RESIN COMPOSITION, RESIN LAYER AND FORM FORMING |
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| CN110032041B (zh) * | 2019-05-07 | 2020-11-10 | 深圳市华星光电半导体显示技术有限公司 | 光阻组合物、显示面板及其制备方法 |
| US10996518B1 (en) | 2019-12-26 | 2021-05-04 | Industrial Technology Research Institute | Light switchable device |
| CN111458977A (zh) * | 2020-04-15 | 2020-07-28 | Tcl华星光电技术有限公司 | 一种光刻胶及其制备的显示面板 |
| US11300875B2 (en) | 2020-04-15 | 2022-04-12 | Tcl China Star Optoelectronics Technology Co., Ltd. | Photoresist, display panel and display device |
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| Publication number | Publication date |
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| CN105190440B (zh) | 2019-08-06 |
| TW201447486A (zh) | 2014-12-16 |
| JPWO2014192671A1 (ja) | 2017-02-23 |
| JP6377056B2 (ja) | 2018-08-22 |
| KR102326631B1 (ko) | 2021-11-15 |
| CN105190440A (zh) | 2015-12-23 |
| KR20160013860A (ko) | 2016-02-05 |
| TWI613514B (zh) | 2018-02-01 |
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