WO2014130928A2 - Strain isolation structures for stretchable electronics - Google Patents

Strain isolation structures for stretchable electronics Download PDF

Info

Publication number
WO2014130928A2
WO2014130928A2 PCT/US2014/017968 US2014017968W WO2014130928A2 WO 2014130928 A2 WO2014130928 A2 WO 2014130928A2 US 2014017968 W US2014017968 W US 2014017968W WO 2014130928 A2 WO2014130928 A2 WO 2014130928A2
Authority
WO
WIPO (PCT)
Prior art keywords
buffer structure
device component
junction region
encapsulant
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2014/017968
Other languages
English (en)
French (fr)
Other versions
WO2014130928A3 (en
Inventor
Yung-Yu Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP14754143.7A priority Critical patent/EP2959755A4/en
Priority to KR1020157026253A priority patent/KR20150122721A/ko
Priority to CN201480018842.8A priority patent/CN105340371B/zh
Priority to JP2015559039A priority patent/JP6449789B2/ja
Priority to CA2901789A priority patent/CA2901789C/en
Publication of WO2014130928A2 publication Critical patent/WO2014130928A2/en
Publication of WO2014130928A3 publication Critical patent/WO2014130928A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09245—Crossing layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density

Definitions

  • High quality medical sensing and imaging data has become increasingly beneficial in the diagnoses and treatment of a variety of medical conditions.
  • the conditions can be associated with the digestive system, the cardio-circulatory system, and can include injuries to the nervous system, cancer, and the like.
  • most electronic systems that could be used to gather such sensing or imaging data have been rigid and inflexible. These rigid electronics are not ideal for many applications, such as in biomedical devices.
  • Most of biological tissue is soft and curved. The skin and organs are delicate and far from two-dimensional.
  • various examples described herein are directed generally to systems, apparatus and methods for providing strain isolation in a conformable electronic system.
  • the systems, methods and apparatus described herein provide effective, compact, and complex systems that include stretchable and/or flexible interconnects in electrical
  • buffer structures are described that effectively redistributes the strain that might normally act at or near an edge of the more rigid device component or on a junction region between the stretchable and/or flexible interconnects and the more rigid device components.
  • a system, apparatus and method is provided that is based on thin device islands, including integrated circuitry (IC) chips and/or stretchable and/or flexible interconnects that are encapsulated in an encapsulant.
  • IC integrated circuitry
  • a system, apparatus and method includes a device component, at least one conductive stretchable and/or flexible interconnect in electrical communication with the device component, the at least one conductive stretchable and/or flexible interconnect forming the electrical communication with the device component at a junction region, a buffer structure, and an encapsulant encapsulating at least the device component and the junction region.
  • the buffer structure overlaps with at least a portion of the junction region.
  • the buffer structure has a higher value of Young's modulus than the encapsulant.
  • a system, apparatus and method includes a device component, at least one conductive stretchable and/or flexible interconnect in electrical communication with the device component, the at least one conductive stretchable and/or flexible interconnect forming the electrical communication with the device component at a junction region, a first buffer structure disposed over the device component, a second buffer structure disposed below the device component, and an encapsulant encapsulating at least the device component and the junction region.
  • the first buffer structure and the second buffer structure overlap with at least a portion of the junction region.
  • the first buffer structure and the second buffer structure have a higher value of Young's modulus than the encapsulant.
  • a system, apparatus and method includes a device component, a flexible base, the device component being disposed on, or at least partially embedded in, the flexible base, at least one conductive stretchable and/or flexible interconnect in electrical communication with the device component, the at least one conductive stretchable and/or flexible interconnect forming the electrical communication with the device component at a junction region, a buffer structure, and an encapsulant encapsulating at least the device component and the junction region.
  • the buffer structure overlaps with at least a portion of the flexible base.
  • the flexible base has a higher value of Young's modulus than the encapsulant.
  • the buffer structure has a higher value of Young's modulus than the encapsulant.
  • FIGs. 1 A and IB show top and cross-sectional side views of an example conformable electronic system, according to the principles described herein.
  • FIGs. 2A and 2B show top and cross-sectional side views of an example conformable electronic system, according to the principles described herein.
  • FIG. 3A shows an example apparatus that includes a strain isolation structure, according to the principles described herein.
  • FIG. 3B shows example results of a finite element analysis of the example apparatus of FIG. 3A, according to the principles described herein.
  • FIG. 4 shows a plot of an example distribution of strain in an example apparatus, according to the principles described herein.
  • FIGs. 5A-5B show top and cross-sectional side views of an example apparatus, according to the principles described herein.
  • FIGs. 6A-6B show top and cross-sectional side views of another example apparatus, according to the principles described herein.
  • FIG. 7A - 7B show cross-sectional side views of other example apparatus, according to the principles described herein.
  • FIG. 8A - 8B show cross-sectional side views of other example apparatus, according to the principles described herein.
  • FIG. 9A shows examples of buffer structures that have a substantially polygonal prism conformation, according to the principles described herein
  • FIGs. 9B - 9C show examples of buffer structure having an irregular structure, according to the principles described herein.
  • FIG. 10 shows a top view of another example apparatus, according to the principles described herein.
  • FIG. 1 1 A shows a cross-sectional side view of another example apparatus, according to the principles described herein.
  • FIG. 1 IB shows the finite element model approximation for the components in an example computation of an example apparatus, according to the principles described herein.
  • FIGs. 12A and 12B show example results of the finite element computations of FIG. 1 IB, according to the principles described herein.
  • FIGs. 13 shows a plot of the von Mises strain and first principal strain versus relative elongation for the example computation of FIGs. 12A and 12B, according to the principles described herein.
  • the term “includes” means includes but is not limited to, the term “including” means including but not limited to.
  • the term “based on” means based at least in part on.
  • the term “disposed on” or “disposed above” is defined to encompass “at least partially embedded in.”
  • any references to "top” surface and “bottom” surface are used primarily to indicate relative position, alignment and/or orientation of various
  • disposed over encompass the meaning of “embedded in,” including “partially embedded in.”
  • reference to feature A being “disposed on,” “disposed between,” or “disposed over” feature B encompasses examples where feature A is in contact with feature B, as well as examples where other layers and/or other components are positioned between feature A and feature B.
  • a system, apparatus and method described herein provides strain isolation in a conformable electronic system.
  • buffer structures are described herein that can be used to reduce a strain that can be exerted near a junction region between a stretchable and/or flexible interconnect or flexible interconnect and a device island when the conformable electronic system is subjected to stretching or torsion.
  • the buffer structures according to the principles described herein are comprised of a material having elastic properties that can effectively redistribute the strain acting on the junction region between stretchable and/or flexible interconnects and rigid device islands in a device structure.
  • the stain isolation structure can be used to create a gradient in local rigidity that effectively redistributes the strain away from the junction region between the stretchable and/or flexible interconnects and the rigid device islands.
  • the buffer structures can be used to facilitate reduction in the concentration of the stress or strain at the junction region, i.e., the transition region from a more rigid component (such as but not limited to a device island) to a more compliant component (such as but not limited to a stretchable and/or flexible interconnect).
  • a more rigid component such as but not limited to a device island
  • a more compliant component such as but not limited to a stretchable and/or flexible interconnect
  • the buffer structure can have a curved conformation that minimize the stress or strain concentration at or near the sharp edge of integrated circuit (IC) chips.
  • the strain relief structure can be formed in a disk conformation, a torus conformation, or other closed curve conformation.
  • the example buffer structures can be disposed above and/or below the junction region between a more rigid component (such as but not limited to a device island) to a more compliant component (such as but not limited to a stretchable and/or flexible interconnect).
  • the dimensions of the buffer structures are configured such that at least a portion of the buffer structures overlaps the device component and at least a portion of the buffer structure overlaps the junction region between the device component and the compliant component..
  • the device component can be disposed on or in a flexible base, the flexible base being formed of a material having elastic properties.
  • the buffer structures overlaps the device component and at least a portion of the buffer structure overlaps the junction region between the device component and the compliant component.
  • An example system, apparatus and method according to the principles described herein can provide a platform of complex device integration and can be applied to many different kinds of stretchable electronic devices.
  • An example system, apparatus and method described herein includes at least .one strain relief structure that is independent of chip geometry, compatible with conventional
  • FIGs. 1 A and IB show top and cross-sectional side views of a conformable electronic system 100 to which the example system, apparatus and method described herein can be applied.
  • Example conformable electronic system 100 includes device components 102 and compliant components 104 encapsulated in an encapsulant 106.
  • the compliant components 104 are in electrical communication with the device components 102 at a junction region 108.
  • the compliant component 104 can be a stretchable and/or flexible interconnect.
  • the encapsulant 106 can be any material having elastic properties, including a polymer or other polymeric material.
  • the example conformable electronic system 100 can be subjected to stretching, torsion or other forces. As shown in FIG.
  • the forces can act to cause a stretching or elongation of the system along a longitudinal direction (e.g., along, the lines of forces shown in the figure).
  • the applied forces can cause an amount of stress or strain to be exerted at junction region 108.
  • the stress or strain at junction region 108 can cause an amount of structural damage at junction region 108, including crack formation in, or rupture of, the compliant component 104 or the junction region 108.
  • FIGs. 2A and 2B show top and cross-sectional side views of a conformable electronic system 150 that includes device components 102 and compliant components 104 encapsulated in encapsulant 106.
  • the compliant components 104 are in electrical communication with the device components 102 at junction region 108.
  • the device component 102 is disposed in, or at least partially embedded in, a flexible base 1 10.
  • the compliant component 104 can be a stretchable and/or flexible interconnect.
  • the encapsulant 106 can be any material having elastic properties, including a polymer or other polymeric material.
  • the example conformable electronic system 100 can be subjected to stretching, torsion or other forces.
  • the flexible base 1 10 is to cushion the device component 102. As described in greater detail in connection with FIGs. 3A, 3B and 4, the stretching or elongation forces can cause an amount of stress or strain near the junction region.
  • FIG. 3A show a top views of an example structure that includes device component 102 disposed in a flexible base 1 10, encapsulated in an encapsulant 106.
  • FIG. 3B shows results of a finite element analysis of the example structure as it is subjected to a stretching or other elongation force.
  • Table 1 shows the materials properties of the components of this example structure of FIG. 3 A, including silicon, which can be a constituent of the device component 1 10, a polyimide, which can be used to form the flexible base 102, and a silicone, which can be used as the encapsulant 106.
  • FIG. 4 shows a plot of the distribution of strain (computed as Von Mises strain) in the encapsulant and in the flexible base in regions proximate the junction region between the device component and the compliant component. Table 1
  • FIGs. 5A and 5B show top and cross-sectional side views of an example apparatus 500 that includes a buffer structure to provide strain isolation.
  • the example apparatus 500 includes a device component 502 and a compliant component 504, encapsulated in encapsulant 506.
  • the compliant component 504 is in electrical communication with the device component 502 at junction region 508.
  • the compliant component 504 can be a stretchable and/or flexible interconnect.
  • the example apparatus of FIG. 5 A and 5B includes a buffer structure 509 disposed proximate to the junction region 508 and also encapsulated in the encapsulant 506. As shown in FIG. 5B, the buffer structure 509 overlaps with at least a portion of the junction region 508.
  • the buffer structure 509 is comprised of material that has less elastic flexibility than the material of the encapsulant 506. As a non-limiting example, the buffer structure 509 has a higher value of Young's modulus than the encapsulant 506. While the example of FIGs. 5A and 5B illustrates the buffer structure 509 disposed in the example apparatus 500 proximate to and substantially below the junction region 508, it is also contemplated that the buffer structure 509 can be disposed in the example apparatus 500 proximate to and substantially above the junction region 508.
  • the buffer structure can be either disposed on the surface of the flexible base (including an elastomer substrate), including being at least partially embedded in the flexible base (including an elastomer substrate).
  • FIGs. 6A and 6B show top and cross-sectional side views of another example apparatus 550 that includes a buffer structure to provide strain isolation.
  • the example apparatus 550 includes the device component 502 and the compliant component 504, encapsulated in the encapsulant 506.
  • the compliant component 504 is in electrical communication with the device component 502 at junction region 508.
  • the compliant component 504 can be a stretchable and/or flexible interconnect.
  • the example apparatus of FIG. 5 A and 5B includes a buffer structure 51 1 disposed proximate to the junction region 508 and also encapsulated in the encapsulant 506. Rather than the solid buffer structure 509 shown for the example of FIGs. 5A and 5B, the buffer structure 51 1 of FIGs.
  • the buffer structure 509 is comprised of material that has less elastic flexibility than the material of the encapsulant 506. As a non-limiting example, the buffer structure 509 has a higher value of Young's modulus than the encapsulant 506.
  • the inner dimension of the hollow portion of the buffer structure 51 1 can be positioned to overlap with a portion of the device component proximate the junction region 508, and the outer dimension of the buffer structure 51 1 can be positioned to overlap with the junction region 508.
  • the buffer structure 51 1 can be formed as an annular structure.
  • the inner diameter of the annular buffer structure can be positioned to overlap with a portion of the flexible base, and wherein the outer diameter of the annular buffer structure is positioned to overlap with the junction region.
  • FIG. 7A shows a cross-sectional side view of another example apparatus 700 that includes a buffer structure to provide strain isolation.
  • the example apparatus 700 includes a device component 702 and a compliant component 704, encapsulated in encapsulant 706.
  • the compliant component 704 is in electrical communication with the device component 702 at junction region 708.
  • the compliant component 704 can be a stretchable and/or flexible interconnect.
  • the device component 702 is disposed on, or at least partially embedded in, a flexible base 710.
  • the example apparatus of FIG. 7A includes a buffer structure 71 1 that overlaps with at least a portion of the flexible base 710 and is also encapsulated by the encapsulant 706.
  • the encapsulant 706 can be any material having elastic properties, including a polymer or other polymeric material.
  • the flexible base 710 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant.
  • the buffer structure 71 1 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant.
  • FIG. 7B shows a cross-sectional side view of another example apparatus 750 that includes two buffer structures to provide strain isolation.
  • the example of FIG. 7B includes the same type of materials and components described above in connection with FIG. 7A.
  • the description above in connection with the example apparatus 700 of FIG. 7A applies to the example apparatus 750 of FIG. 7B.
  • the example apparatus 750 of FIG. 7B includes two buffer structures 71 1-a and 71 1-b that are disposed substantially opposite to each other, on either side of the device component 702 and flexible base 710.
  • a central point of buffer structure 71 1-a approximately coincides with a central point of buffer structure 71 1 -b.
  • the two buffer structures 71 1 -a and 71 1 -b can be displaced relative to each other in the encapsulant 706 such that a central point of buffer structure 71 1-a does not coincide with a central point of buffer structure 71 1 -b, with buffer structure 71 1-a and/or buffer structure 71 1 -b overlapping with at least a portion of the flexible base 710.
  • the buffer structure 71 1 can be formed as annular buffer structures.
  • the inner diameter of the annular buffer structure can be positioned to overlap a portion of the flexible base 710.
  • the outer diameter of the annular buffer structure can be positioned over a portion of the junction region 708.
  • FIG. 8A shows a cross-sectional side view of another example apparatus 800 that includes a buffer structure to provide strain isolation.
  • the example apparatus 800 includes a device component 802 and a compliant component 804, encapsulated in an encapsulant 806 that is formed from any material having elastic properties, including a polymer or other polymeric material.
  • the compliant component 804 is in electrical communication with the device component 802 at junction region 808.
  • the compliant component 804 can be a stretchable and/or flexible interconnect.
  • the device component 802 is disposed on, or at least partially embedded in, a flexible base 810. In the example apparatus of FIG.
  • the buffer structure 81 1 is formed as a substantially solid structure that overlaps with at least a portion of the flexible base 810 and is also encapsulated by the encapsulant 806.
  • the flexible base 810 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant.
  • the buffer structure 81 1 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant 806.
  • FIG. 8B shows a cross-sectional side view of another example apparatus 850 that includes two of the buffer structures 81 1-a and 81 1 -b.
  • the example of FIG. 8B includes the same type of materials and components described above in connection with FIG. 8A.
  • the description above in connection with the example apparatus 800 of FIG. 8A applies to the example apparatus 850 of FIG. 8B.
  • the two buffer structures 81 1-a and 81 1 -b are disposed substantially opposite to each other, on either side of the device component 802 and flexible base 810, in the example of FIG. 8B.
  • the two buffer structures 81 1 -a and 81 1 -b can be displaced relative to each other in the encapsulant 806, with buffer structure 81 1-a and/or buffer structure 81 1-b overlapping with at least a portion of the flexible base 810.
  • the buffer structure including any one or more of buffer structures 51 1 , 71 1 , 71 1 -a, 71 1 -b, 81 1 , 81 1 -a, and 81 1 -b, can be formed to have a substantially cylindrical conformation or to have a substantially polygonal prism conformation.
  • FIG. 9 A shows an example of buffer structures that have a substantially polygonal prism conformation, as either a solid buffer structure 900 or as a buffer structure 910 that includes a hollow portion 920. While the example of FIG.
  • the buffer structure including any one or more of buffer structures 51 1 , 71 1 , 71 1 -a, 71 1 -b, 81 1 , 81 1 -a, and 81 1 -b, can be formed to have hexagonal or any other polygonal symmetry or an irregular structure.
  • the buffer structure including any one or more of buffer structures 51 1 , 71 1 , 71 1 -a, 71 1 -b, 81 1 , 81 1 -a, and 81 1 -b, can be formed to have an irregular structure.
  • the buffer structure having an irregular structure can include at least one protruding portion that overlaps a portion of the flexible substrate, the junction region, and/or a portion of the compliant according to the principles of any of the examples herein is contemplated. .
  • FIG. 9B shows a top view of another example apparatus that includes a buffer structure to provide strain isolation.
  • the example apparatus includes a device component 952 and a compliant component 954, encapsulated in an encapsulant 956 that is formed from any material having elastic properties, including a polymer or other polymeric material.
  • the compliant component 954 is in electrical communication with the device component 802 at junction region 958.
  • the compliant component 954 can be a stretchable and/or flexible interconnect.
  • the device component 952 is disposed on, or at least partially embedded in, a flexible base 960. In the example apparatus of FIG.
  • the buffer structure 961 is also encapsulated by the encapsulant 956 and is formed as an irregular structure including a protruding portion 961 -a.
  • the buffer structure 961 can be disposed in the example apparatus such that the protruding portion 961 -a overlaps with at least a portion of the device component 952, with the junction region 958 and/or with flexible base 960.
  • the buffer structure 961 also can be disposed such that the protruding portion 961 -a overlaps with at least a portion of the compliant component 954.
  • the flexible base 960 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant 956.
  • the buffer structure 961 including protruding portion 961 -a, is formed from a material that has a higher value of Young's modulus than the material of the encapsulant 956.
  • FIG. 9C shows a top view of another example apparatus that includes a buffer structure to provide strain isolation.
  • the example apparatus includes a device component 982 and a compliant component 984, encapsulated in an encapsulant 986 that is formed from any material having elastic properties, including a polymer or other polymeric material.
  • the compliant component 984 is in electrical communication with the device component 802 at junction region 988.
  • the compliant component 984 can be a stretchable and/or flexible interconnect.
  • the device component 982 is disposed on, or at least partially embedded in, a flexible base 990. In the example apparatus of FIG.
  • the buffer structure 991 is also encapsulated by the encapsulant 986 and is formed as an irregular structure including two protruding portions 991 -a and 991-b.
  • the buffer structure 991 can be disposed in the example apparatus such that the protruding portions 991 -a and 991 -b overlap with at least a portion of the device component 982, with the junction region 988 and/or with flexible base 990.
  • the buffer structure 991 also can be disposed such that the protruding portion 991 -a and 991-b overlap with, and can be disposed along the sides of, at least a portion of the compliant component 984.
  • the flexible base 990 is formed from a material that has a higher value of Young's modulus than the material of the encapsulant 986.
  • the buffer structure 991 including protruding portions 991 -a and 991-b, is formed from a material that has a higher value of Young's modulus than the material of the encapsulant 986.
  • any example apparatus described herein can be formed as a multi-layer apparatus that includes multi-layer arrangement of the device components and the compliant components.
  • the multi-layer apparatus can include at least one buffer structure that is positioned relative to the junction region between at least one device component and at least one compliant structure according to the principles of any of the examples described herein.
  • the multilayer apparatus includes a device component disposed on or at least partially embedded in a flexible base
  • the multi-layer apparatus can include at least one buffer structure that is positioned relative to the junction region between at least one device component and at least one compliant structure according to the principles of any of the examples described herein.
  • the multi-layer apparatus can include two, three, four or more buffer structures, each of which is positioned in an example multi-layer apparatus relative to a device component, a junction region, a flexible substrate, a stretchable, and/or a flexible interconnect according to the principles of any of the examples described herein.
  • at least two of the buffer structures can be disposed relative to each other such that a central point of the first buffer structure approximately coincides with a central point of the second buffer structure, or at least two of the buffer structures can be disposed relative to each other such that a central point of the first buffer structure is displaced relative to a central point of the second buffer structure.
  • FIG. 10 shows a top view of an example apparatus 1000 that includes two buffer structures.
  • the example apparatus 1000 includes two device components (devise component 1002-a and device component 1002-b).
  • the example apparatus 1000 includes compliant components 1004-a and 1004-b and compliant components 1005-a and 1005-b, each formed as stretchable and/or flexible interconnect.
  • some of the compliant components can provide electrical communication between device components at a junction region (such as junction region 1008-a).
  • compliant components can provide electrical communication at a junction region (such as junction region 1008-b) between device components and an external device, such as device 1018.
  • a junction region such as junction region 1008-b
  • at least one of the devise components can be disposed on, or at least partially embedded in, a flexible base (such as flexible base 1010-a or flexible base 1010-b).
  • the example apparatus 1000 can be encapsulated in an encapsulant 1006 that is formed from any material having elastic properties, including a polymer or other polymeric material.
  • buffer structures 101 1 -a and 101 1-b each of which is also encapsulated by the encapsulant 1006.
  • the buffer structures 101 1-a and 101 1-b can be disposed in the example apparatus 1000 such that it overlaps with at least a portion of a device component (devise component 1002-a and device component 1002-b), with a junction region (junction region 1008-a or junction region 1008-b), with at least a portion of a flexible base (flexible base 1010-a or flexible base 1010-b), and/or with at least a portion of a compliant component (compliant components 1004-a, 1004-b, 1005-a, or 1005-b).
  • the flexible base 1010- a or 1010-b can be formed from a material that has a higher value of Young's modulus than the material of the encapsulant 1006.
  • the buffer structure 101 1-a or 101 1 -b can be formed from a material that has a higher value of Young's modulus than the material of the encapsulant 1006.
  • the stretchable and/or flexible interconnects can be formed from a conductive material.
  • the conductive material can be but is not limited to a metal, a metal alloy, a conductive polymer, or other conductive material.
  • the metal or metal alloy of the coating may include but is not limited to aluminum, stainless steel, or a transition metal (including copper, silver, gold, platinum, zinc, nickel, titanium, chromium, or palladium, or any combination thereof) and any applicable metal alloy, including alloys with carbon.
  • suitable conductive materials may include a semiconductor-based conductive material, including a silicon-based conductive material, indium tin oxide or other transparent conductive oxide, or Group III-IV conductor (including GaAs).
  • the semiconductor- based conductive material can be doped.
  • intersection structure, the flexible base, and/or the encapsulant can be formed from any material having elastic properties, subject to the described relationship of elastic properties required for each apparatus.
  • intersection structure, the flexible base, and/or the encapsulant can be formed from a polymer or polymeric material.
  • Non-limiting examples of applicable polymers or polymeric materials include, but are not limited to, a polyimide, a polyethylene terephthalate (PET), a silicone, or a polyeur ethane.
  • a polymer or polymeric material herein can be a UV curable polymer, or a silicone such as but
  • the flexible base and the buffer structure can be formed from the same polymer or polymeric material, or from different polymers or polymeric materials.
  • the encapsulant can be a silicone such as but not limited to ECOFLEX® (BASF, Florham Park, NJ).
  • the encapsulant should be biocompatible.
  • the stretchable and/or flexible interconnects can be embedded in a polyimide that also acts as a mechanical reinforcement.
  • the stretchable and/or flexible interconnects can have a thickness of about 0.1 ⁇ , about 0.3 ⁇ , about 0.5 ⁇ , about 0.8 ⁇ , about 1 ⁇ , about 1.5 ⁇ , about 2 ⁇ or greater.
  • the buffer structure and/or flexible base can have a thickness of about 5 ⁇ , about 7.5 ⁇ , about 9 ⁇ , about 12 ⁇ or greater.
  • the encapsulant can have a thickness of about 100 ⁇ , about 125 ⁇ , about 150 ⁇ , about 175 ⁇ , about 200 ⁇ , about 225 ⁇ , about 250 ⁇ , about 300 ⁇ or greater.
  • FIG. 1 1A shows a cross-sectional side view of an example apparatus 1 100 that includes two buffer structures, which is used as a model to perform a finite element analysis (described in connection with FIG. 1 IB).
  • the example of FIG. 1 1 A includes a device component 1 102 disposed or at least partially embedded in a flexible base 1 1 10, buffer structures 1 1 1 1-a and 1 1 1 1 -b that are disposed substantially opposite to each other, on either side of the device component 1 102 and flexible base 1 1 10, all encapsulated in encapsulant 1 106.
  • the example of FIG. 1 1 A includes the same type of materials and components described above in connection with equivalent components of any of the previous example apparatus.
  • FIG. 1 IB shows the finite element model approximation for the encapsulant 1 156, the flexible base 1 160, the buffer structure 1 161 , and the device component 1 152.
  • the flexible base and the buffer structures are approximated as being comprised of a polyimide.
  • the encapsulant is approximated as being comprised of a silicone.
  • the device component is approximated as being comprised of a silicon-based device.
  • FIGs. 12A and 12B show example results of the finite element computations.
  • FIG. 12A show example results of the finite element computations of the example apparatus 1 100 of FIG. 1 1 A being subjected to a stretching or elongation force.
  • FIG. 12B show example results of the finite element computations of an example apparatus similar to FIG. 1 1 A which does not include buffer structures 1 1 1 1 -a and 1 1 1 1 -b, also being subjected to the stretching or elongation force.
  • FIG. 12B shows that, in the absence of buffer structures, the area 1260 of higher strain concentration in the encapsulant coincides with the edge of the device component 1250, even though the device component 1250 is disposed in a flexible base.
  • a junction region of an electrical communication between a device component and a compliant structure could be disposed proximate to this edge.
  • Such a concentration of strain as shown in FIG. 12B could cause damage to the junction region during a stretching or elongation, including possibly resulting in rupture of the junction region.
  • such a concentration of strain at the edge can cause interfacial delamination between the device component and the flexible base near the edge.
  • FIG. 12A shows that the buffer structures 1210 cause the area 1220 of higher strain concentration in the encapsulant to shift from the edge of the device component 1200 or the flexible base, to instead be concentrated in an outer area. As a result, a strain that might develop at the junction region of an apparatus is channeled away from that area.
  • Such a distribution of strain as shown in FIG. 12B could reduce the risk of or prevent damage to the junction region during a stretching or elongation, thereby maintaining the performance of the apparatus. In addition, there is less risk of interfacial delamination between the device component and the flexible base near the edge.
  • the buffer structure in Figure 12A can be extended to the edge of the high strain concentration region.
  • FIG. 13 shows a plot of the von Mises strain and first principal strain versus relative elongation for the computation of FIGs. 12A and 12B.
  • FIG. 13 shows that the values of von Mises strain and first principal strain in the apparatus without a buffer are higher than for the apparatus that includes a buffer structure.
  • the example apparatus described herein can be fabricated using any technique in the art.
  • the conductive materials of the stretchable and/or flexible interconnects can be fabricated using evaporation, sputtering, or other deposition technique, and then patterned according to the desired conformation.
  • the flexible base, the buffer structure, and/or the encapsulant can be formed using, e.g., spin-coating or casting and using a mask or amold to define the desired shape of the component.
  • inventive embodiments are presented by way of example only and that inventive embodiments may be practiced otherwise than as specifically described.
  • inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein.
  • any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure.
  • the above-described embodiments of the invention may be implemented in any of numerous ways. For example, some embodiments may be implemented using hardware, software or a combination thereof. When any aspect of an embodiment is implemented at least in part in software, the software code may be executed on any suitable processor or collection of processors, whether provided in a single device or computer or distributed among multiple devices/computers.
  • the technology described herein may be embodied as a method, of which at least one example has been provided.
  • the acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.
  • a reference to "A and/or B", when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.
  • the phrase "at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements.
  • This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase "at least one" refers, whether related or unrelated to those elements specifically identified.
  • At least one of A and B can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Micromachines (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Element Separation (AREA)
PCT/US2014/017968 2013-02-25 2014-02-24 Strain isolation structures for stretchable electronics Ceased WO2014130928A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP14754143.7A EP2959755A4 (en) 2013-02-25 2014-02-24 LOAD INSULATION STRUCTURES FOR EXPANDABLE ELECTRONIC ARTICLES
KR1020157026253A KR20150122721A (ko) 2013-02-25 2014-02-24 연신 가능 전자장치를 위한 변형 격리 구조물
CN201480018842.8A CN105340371B (zh) 2013-02-25 2014-02-24 用于可拉伸电子器件的应变隔离结构
JP2015559039A JP6449789B2 (ja) 2013-02-25 2014-02-24 伸張可能な電子機器用のひずみ絶縁構造を有する装置
CA2901789A CA2901789C (en) 2013-02-25 2014-02-24 Strain isolation structures for stretchable electronics cross-reference to related applications

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361768939P 2013-02-25 2013-02-25
US61/768,939 2013-02-25
US13/843,873 US9226402B2 (en) 2012-06-11 2013-03-15 Strain isolation structures for stretchable electronics
US13/843,873 2013-03-15

Publications (2)

Publication Number Publication Date
WO2014130928A2 true WO2014130928A2 (en) 2014-08-28
WO2014130928A3 WO2014130928A3 (en) 2015-05-07

Family

ID=51387921

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2014/017968 Ceased WO2014130928A2 (en) 2013-02-25 2014-02-24 Strain isolation structures for stretchable electronics
PCT/US2014/017975 Ceased WO2014130931A1 (en) 2013-02-25 2014-02-24 Strain relief structures for stretchable interconnects

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2014/017975 Ceased WO2014130931A1 (en) 2013-02-25 2014-02-24 Strain relief structures for stretchable interconnects

Country Status (7)

Country Link
US (4) US9226402B2 (enExample)
EP (2) EP2959754A4 (enExample)
JP (3) JP6449789B2 (enExample)
KR (2) KR20150125939A (enExample)
CN (4) CN110856344A (enExample)
CA (2) CA2900700A1 (enExample)
WO (2) WO2014130928A2 (enExample)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9168094B2 (en) 2012-07-05 2015-10-27 Mc10, Inc. Catheter device including flow sensing
US9186060B2 (en) 2008-10-07 2015-11-17 Mc10, Inc. Systems, methods and devices having stretchable integrated circuitry for sensing and delivering therapy
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
US9545285B2 (en) 2011-10-05 2017-01-17 Mc10, Inc. Cardiac catheter employing conformal electronics for mapping
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US9579040B2 (en) 2011-09-01 2017-02-28 Mc10, Inc. Electronics for detection of a condition of tissue
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US9629586B2 (en) 2008-10-07 2017-04-25 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9655560B2 (en) 2008-10-07 2017-05-23 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US9702839B2 (en) 2011-03-11 2017-07-11 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US9846829B2 (en) 2012-10-09 2017-12-19 Mc10, Inc. Conformal electronics integrated with apparel
US9894757B2 (en) 2008-10-07 2018-02-13 Mc10, Inc. Extremely stretchable electronics
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US9949691B2 (en) 2013-11-22 2018-04-24 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
US9972649B2 (en) 2015-10-21 2018-05-15 Massachusetts Institute Of Technology Nanowire FET imaging system and related techniques
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
US10398343B2 (en) 2015-03-02 2019-09-03 Mc10, Inc. Perspiration sensor
US10410962B2 (en) 2014-01-06 2019-09-10 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
US10532211B2 (en) 2015-10-05 2020-01-14 Mc10, Inc. Method and system for neuromodulation and stimulation
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10673280B2 (en) 2016-02-22 2020-06-02 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
US10959326B2 (en) 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
US11154235B2 (en) 2016-04-19 2021-10-26 Medidata Solutions, Inc. Method and system for measuring perspiration
US11768262B2 (en) 2019-03-14 2023-09-26 Massachusetts Institute Of Technology Interface responsive to two or more sensor modalities
US12610823B2 (en) 2020-11-25 2026-04-21 Pragmatic Semiconductor Limited Flexible electronic circuits with support structures

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201317746D0 (en) 2013-10-08 2013-11-20 Smith & Nephew PH indicator
US20190212311A1 (en) 2013-01-11 2019-07-11 Smith & Nephew Plc Ph and moisture indicator devices and formulations
KR102444269B1 (ko) * 2013-09-27 2022-09-16 택토텍 오와이 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR102042137B1 (ko) * 2014-05-30 2019-11-28 한국전자통신연구원 전자장치 및 그 제조 방법
US9743513B2 (en) * 2014-12-26 2017-08-22 Industrial Technology Research Institute Flexible electronic device
CN107210269B (zh) * 2015-03-11 2020-07-28 英特尔公司 利用应变重分布层的可拉伸电子器件制造方法
US10182284B2 (en) * 2015-06-11 2019-01-15 Facebook Technologies, Llc Connector assembly for detachable audio system
WO2017047519A1 (ja) * 2015-09-17 2017-03-23 ポリマテック・ジャパン株式会社 弾性配線部材
WO2017099795A1 (en) * 2015-12-11 2017-06-15 Intel Corporation Multi-layer flexible/stretchable electronic package for advanced wearable electronics
US10206277B2 (en) 2015-12-18 2019-02-12 Intel Corporation Gradient encapsulant protection of devices in stretchable electronics
US10477688B2 (en) * 2015-12-24 2019-11-12 Intel Corporation Stretchable electronic assembly
FI20165054A (fi) * 2016-01-28 2017-07-29 Clothing Plus Mbu Oy Joustava piirilevy
WO2017156502A1 (en) * 2016-03-10 2017-09-14 Carnegie Mellon University Integrated electronic device with flexible and stretchable substrate
JP6405334B2 (ja) * 2016-04-18 2018-10-17 日本メクトロン株式会社 伸縮性配線基板、及び、伸縮性配線基板の製造方法
US10104805B2 (en) * 2016-05-09 2018-10-16 The United States Of America As Represented By The Secretary Of The Army Self cooling stretchable electrical circuit having a conduit forming an electrical component and containing electrically conductive liquid
CA3023772A1 (en) 2016-05-13 2017-11-16 Smith & Nephew Plc Sensor enabled wound monitoring and therapy apparatus
US10736212B2 (en) * 2016-05-20 2020-08-04 Ares Materials Inc. Substrates for stretchable electronics and method of manufacture
US20170344055A1 (en) * 2016-05-25 2017-11-30 Intel Corporation Structural brace for electronic circuit with stretchable substrate
CN107437534A (zh) * 2016-05-27 2017-12-05 中国科学院苏州纳米技术与纳米仿生研究所 可拉伸电子系统
WO2018049431A1 (en) * 2016-09-07 2018-03-15 Ares Materials Inc. Substrates for stretchable electronics and method of manufacture
WO2018063198A1 (en) 2016-09-28 2018-04-05 Aleksandar Aleksov Flexible packaging for a wearable electronic device
EP3328166A1 (en) * 2016-11-29 2018-05-30 IMEC vzw Method for forming non-flat devices
JP6851813B2 (ja) * 2016-12-22 2021-03-31 東洋アルミニウム株式会社 配線基板
CN206863338U (zh) * 2017-02-24 2018-01-09 深圳市大疆创新科技有限公司 视频眼镜头带及视频眼镜
US11324424B2 (en) 2017-03-09 2022-05-10 Smith & Nephew Plc Apparatus and method for imaging blood in a target region of tissue
EP3592219B1 (en) 2017-03-09 2023-05-10 Smith & Nephew plc Device and apparatus of determining skin perfusion pressure
US11690570B2 (en) 2017-03-09 2023-07-04 Smith & Nephew Plc Wound dressing, patch member and method of sensing one or more wound parameters
EP3609449A1 (en) 2017-04-11 2020-02-19 Smith & Nephew PLC Component positioning and stress relief for sensor enabled wound dressings
US12033738B2 (en) 2017-05-15 2024-07-09 Smith & Nephew Plc Negative pressure wound therapy system using eulerian video magnification
CN110832598B (zh) 2017-05-15 2024-03-15 史密夫及内修公开有限公司 伤口分析装置和方法
CA3066073A1 (en) 2017-06-23 2018-12-27 Smith & Nephew Plc Positioning of sensors for sensor enabled wound monitoring or therapy
GB201809007D0 (en) 2018-06-01 2018-07-18 Smith & Nephew Restriction of sensor-monitored region for sensor-enabled wound dressings
GB201804502D0 (en) 2018-03-21 2018-05-02 Smith & Nephew Biocompatible encapsulation and component stress relief for sensor enabled negative pressure wound therapy dressings
JP7511468B2 (ja) 2017-08-10 2024-07-05 スミス アンド ネフュー ピーエルシー センサを有効化した創傷モニタリングまたは治療のためのセンサの配置
WO2019048624A1 (en) 2017-09-10 2019-03-14 Smith & Nephew Plc ENCAPSULATION INSPECTION SYSTEMS AND METHODS AND COMPONENTS IN SENSOR EQUIPMENT DRESSINGS
GB201718870D0 (en) 2017-11-15 2017-12-27 Smith & Nephew Inc Sensor enabled wound therapy dressings and systems
GB201804971D0 (en) 2018-03-28 2018-05-09 Smith & Nephew Electrostatic discharge protection for sensors in wound therapy
FI20175818A1 (en) 2017-09-14 2019-03-15 Clothing Plus Mbu Oy Electrical signal transmission system
GB201718859D0 (en) 2017-11-15 2017-12-27 Smith & Nephew Sensor positioning for sensor enabled wound therapy dressings and systems
JP7282079B2 (ja) 2017-09-27 2023-05-26 スミス アンド ネフュー ピーエルシー センサが使用可能な陰圧創傷監視および療法装置のｐｈ感知
US11839464B2 (en) 2017-09-28 2023-12-12 Smith & Nephew, Plc Neurostimulation and monitoring using sensor enabled wound monitoring and therapy apparatus
CN111213435B (zh) 2017-10-12 2023-07-14 大日本印刷株式会社 配线基板和配线基板的制造方法
US11612054B2 (en) 2017-10-12 2023-03-21 Dai Nippon Printing Co., Ltd. Wiring board and method for manufacturing wiring board
GB201718851D0 (en) 2017-11-15 2017-12-27 Smith & Nephew Flocked conformable circuit boards for sensor enabled wound therapy dressings and systems
WO2019096828A1 (en) 2017-11-15 2019-05-23 Smith & Nephew Plc Integrated sensor enabled wound monitoring and/or therapy dressings and systems
CN107978578B (zh) * 2017-11-23 2020-02-21 中国科学院力学研究所 一种变线宽的柔性可拉伸导线及其制备方法
CN111867672A (zh) * 2018-02-16 2020-10-30 西北大学 无线医疗传感器和方法
US10955671B2 (en) * 2018-03-01 2021-03-23 Invensas Corporation Stretchable film assembly with conductive traces
KR102554048B1 (ko) * 2018-07-20 2023-07-10 엘지디스플레이 주식회사 스트레쳐블 표시 장치
EP3608964B1 (en) 2018-08-08 2022-05-11 LG Display Co., Ltd. Stretchable display device
GB201814011D0 (en) 2018-08-29 2018-10-10 Smith & Nephew Componet positioning and encapsulation for sensor enabled wound dressings
CN109216188A (zh) * 2018-09-07 2019-01-15 清华大学 柔性互连线及其制造方法以及参数测量方法
WO2020053290A1 (en) 2018-09-12 2020-03-19 Smith & Nephew Plc Device, apparatus and method of determining skin perfusion pressure
EP3856104B1 (en) 2018-09-28 2025-08-06 T.J.Smith And Nephew, Limited Optical fibers for optically sensing through wound dressings
KR102664207B1 (ko) 2018-10-08 2024-05-07 엘지디스플레이 주식회사 스트레쳐블 표시 장치 및 그 제조 방법
CN111050461B (zh) * 2018-10-12 2021-01-22 昆山工研院新型平板显示技术中心有限公司 电子装置及其制作方法
GB201816838D0 (en) 2018-10-16 2018-11-28 Smith & Nephew Systems and method for applying biocompatible encapsulation to sensor enabled wound monitoring and therapy dressings
WO2020091010A1 (ja) * 2018-10-31 2020-05-07 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP6774657B1 (ja) * 2018-10-31 2020-10-28 大日本印刷株式会社 配線基板及び配線基板の製造方法
CA3119738A1 (en) 2018-11-13 2020-05-22 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
GB201820927D0 (en) 2018-12-21 2019-02-06 Smith & Nephew Wound therapy systems and methods with supercapacitors
EP3813496B1 (en) * 2019-01-21 2025-08-20 Murata Manufacturing Co., Ltd. Stretchable wiring board
JP7251165B2 (ja) * 2019-01-24 2023-04-04 大日本印刷株式会社 配線基板及び配線基板の製造方法
GB201901242D0 (en) 2019-01-30 2019-03-20 Smith & Nephew Optical sensing systems and methods for sensing enabled wound dressings and systems
GB2595176B (en) 2019-01-30 2023-02-15 Smith & Nephew Sensor integrated dressings and systems
CN111493817B (zh) * 2019-01-31 2023-10-10 周冠谦 具延展性的柔性感测装置
JP7216911B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216912B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2020187851A1 (en) 2019-03-18 2020-09-24 Smith & Nephew Plc Design rules for sensor integrated substrates
US12478279B2 (en) 2019-03-19 2025-11-25 Smith & Nephew Plc Systems and methods for measuring tissue impedance
JP7272065B2 (ja) * 2019-04-02 2023-05-12 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7272074B2 (ja) * 2019-04-08 2023-05-12 大日本印刷株式会社 配線基板及び配線基板の製造方法
GB201909947D0 (en) 2019-07-11 2019-08-28 Smith & Nephew Sensor sheet with digital distributed data acquisition for wound monitoring and treatment
GB201914443D0 (en) 2019-10-07 2019-11-20 Smith & Nephew Sensor enabled negative pressure wound monitoring apparatus with different impedances inks
US20220124910A1 (en) * 2019-12-09 2022-04-21 Avary Holding (Shenzhen) Co., Limited. Stretchable sensing structure and method for manufacturing stretchable sensing structure
GB201918856D0 (en) 2019-12-19 2020-02-05 Smith & Nephew Sensor integrated dressings and systems
GB202003203D0 (en) 2020-03-05 2020-04-22 Smith & Nephew Sensor integrated dressings and systems
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
GB2609367B (en) 2020-04-21 2024-09-25 Smith & Nephew Wound treatment management using augmented reality overlay
GB202007391D0 (en) 2020-05-19 2020-07-01 Smith & Nephew Patient protection from unsafe electric current in sensor integrated dressings and systems
KR102905931B1 (ko) 2020-07-27 2025-12-29 삼성전자주식회사 연신 소자, 표시 패널, 센서 및 전자 장치
KR102913246B1 (ko) * 2020-07-30 2026-01-15 엘지이노텍 주식회사 회로 기판
CN111935900B (zh) * 2020-08-10 2024-12-24 深圳市特深电气有限公司 柔性电路连接装置、连接方法和保护柔性电路板的方法
JP7264136B2 (ja) * 2020-08-28 2023-04-25 横河電機株式会社 力検出装置、力検出システム及び力検出装置の製造方法
CN114138061B (zh) * 2020-09-03 2024-11-01 财团法人工业技术研究院 电子装置
WO2022063379A1 (en) 2020-09-28 2022-03-31 Coloplast A/S Medical appliance
JP7015952B1 (ja) 2021-04-12 2022-02-03 大日本印刷株式会社 配線基板及び配線基板の製造方法
KR102749617B1 (ko) * 2022-07-08 2025-01-02 국립공주대학교 산학협력단 물결형 연신 배선 및 그 제조 방법
AT526502B1 (de) * 2023-03-23 2024-04-15 Sendance Gmbh Verformbarer Gegenstand

Family Cites Families (289)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716861A (en) 1971-03-22 1973-02-13 J Root Serpentine antenna mounted on a rotatable capacitive coupler
US3805427A (en) 1972-12-18 1974-04-23 H Epstein Medical alarm bracelet
US3838240A (en) 1973-04-04 1974-09-24 Rca Corp Bonding tool and method of bonding therewith
US4059467A (en) 1976-09-27 1977-11-22 Bell Telephone Laboratories, Incorporated Method for removal of elastomeric silicone coatings from integrated circuits
CA1105565A (en) 1978-09-12 1981-07-21 Kaufman (John G.) Hospital Products Ltd. Electrosurgical electrode
US4278474A (en) 1980-03-25 1981-07-14 The United States Of America As Represented By The United States Department Of Energy Device for conversion of electromagnetic radiation into electrical current
US4416288A (en) 1980-08-14 1983-11-22 The Regents Of The University Of California Apparatus and method for reconstructing subsurface electrophysiological patterns
US4658153A (en) 1984-06-18 1987-04-14 Amnon Brosh Planar coil apparatus for providing a frequency output vs. position
US5018005A (en) * 1989-12-27 1991-05-21 Motorola Inc. Thin, molded, surface mount electronic device
US6387052B1 (en) 1991-01-29 2002-05-14 Edwards Lifesciences Corporation Thermodilution catheter having a safe, flexible heating element
DE69210395T2 (de) 1991-04-05 1997-01-09 Medtronic Inc Erfassungssystem mit subkutanen mehrfachelektroden
JPH0587511A (ja) 1991-07-24 1993-04-06 Yamaha Corp 曲げ検出装置
US5272375A (en) 1991-12-26 1993-12-21 E. I. Du Pont De Nemours And Company Electronic assembly with optimum heat dissipation
US5491651A (en) 1992-05-15 1996-02-13 Key, Idea Development Flexible wearable computer
US5306917A (en) 1992-08-12 1994-04-26 Reliant Laser Corporation Electro-optical system for measuring and analyzing accumulated short-wave and long-wave ultraviolet radiation exposure
US5471982A (en) 1992-09-29 1995-12-05 Ep Technologies, Inc. Cardiac mapping and ablation systems
US6233491B1 (en) 1993-03-16 2001-05-15 Ep Technologies, Inc. Cardiac mapping and ablation systems
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5617870A (en) 1993-04-29 1997-04-08 Scimed Life Systems, Inc. Intravascular flow measurement system
US5326521A (en) 1993-05-26 1994-07-05 East Douglas A Method for preparing silicone mold tooling
JP3035352B2 (ja) 1993-08-24 2000-04-24 メトリカ・インコーポレーテッド 新規な使い捨て電子検定ディバイス
US5360987A (en) 1993-11-17 1994-11-01 At&T Bell Laboratories Semiconductor photodiode device with isolation region
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
US5454270A (en) 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
US5567975A (en) 1994-06-30 1996-10-22 Santa Barbara Research Center Group II-VI radiation detector for simultaneous visible and IR detection
US6023638A (en) 1995-07-28 2000-02-08 Scimed Life Systems, Inc. System and method for conducting electrophysiological testing using high-voltage energy pulses to stun tissue
US5612513A (en) 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
NL1001890C2 (nl) 1995-12-13 1997-06-17 Cordis Europ Catheter met plaatvormige elektrode-reeks.
SE9600334D0 (sv) 1996-01-30 1996-01-30 Radi Medical Systems Combined flow, pressure and temperature sensor
JP3957803B2 (ja) 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
US5880369A (en) 1996-03-15 1999-03-09 Analog Devices, Inc. Micromachined device with enhanced dimensional control
US5817008A (en) 1996-10-31 1998-10-06 Spacelabs Medical, Inc. Conformal pulse oximetry sensor and monitor
US6063046A (en) 1997-04-11 2000-05-16 Allum; John H. Method and apparatus for the diagnosis and rehabilitation of balance disorders
US20050096513A1 (en) 1997-11-11 2005-05-05 Irvine Sensors Corporation Wearable biomonitor with flexible thinned integrated circuit
JP3175673B2 (ja) * 1997-11-27 2001-06-11 日本電気株式会社 半導体素子を実装したフレキシブル回路基板ユニットの製造方法
DE59803887D1 (de) 1998-01-22 2002-05-23 Fraunhofer Ges Forschung Mikrosystem und verfahren zum herstellen eines mikrosystems
JP3511895B2 (ja) 1998-06-05 2004-03-29 株式会社村田製作所 セラミック多層基板の製造方法
US7209787B2 (en) 1998-08-05 2007-04-24 Bioneuronics Corporation Apparatus and method for closed-loop intracranial stimulation for optimal control of neurological disease
IT1310000B1 (it) 1999-01-26 2002-02-05 Consiglio Nazionale Ricerche Sensore a fibra ottica e trasduttore fotocromico per fotometria eradiometria e relativo metodo
US20020082515A1 (en) 1999-07-01 2002-06-27 Campbell Thomas H. Thermography catheter
GB2355116B (en) 1999-10-08 2003-10-08 Nokia Mobile Phones Ltd An antenna assembly and method of construction
US6641860B1 (en) 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
US6489178B2 (en) 2000-01-26 2002-12-03 Texas Instruments Incorporated Method of fabricating a molded package for micromechanical devices
WO2001074251A2 (en) 2000-03-31 2001-10-11 Rita Medical Systems Inc. Tissue biopsy and treatment apparatus and method
US20040106334A1 (en) 2000-06-14 2004-06-03 Tatsuo Suzuki Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method
US6511478B1 (en) 2000-06-30 2003-01-28 Scimed Life Systems, Inc. Medical probe with reduced number of temperature sensor wires
US6640120B1 (en) 2000-10-05 2003-10-28 Scimed Life Systems, Inc. Probe assembly for mapping and ablating pulmonary vein tissue and method of using same
US6775906B1 (en) 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
US6421016B1 (en) 2000-10-23 2002-07-16 Motorola, Inc. Antenna system with channeled RF currents
US6743982B2 (en) 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
US6603440B2 (en) 2000-12-14 2003-08-05 Protura Wireless, Inc. Arrayed-segment loop antenna
US6944482B2 (en) 2001-01-22 2005-09-13 Wildseed Ltd. Visualization supplemented wireless mobile telephony
US20030017848A1 (en) 2001-07-17 2003-01-23 Engstrom G. Eric Personalizing electronic devices and smart covering
US20020128700A1 (en) 2001-03-08 2002-09-12 Cross Thomas E. Lead with adjustable angular and spatial relationships between electrodes
US6600363B2 (en) 2001-04-05 2003-07-29 Cornell Research Foundation, Inc. Folded floating-gate differential pair amplifier
US6477417B1 (en) 2001-04-12 2002-11-05 Pacesetter, Inc. System and method for automatically selecting electrode polarity during sensing and stimulation
KR100380107B1 (ko) 2001-04-30 2003-04-11 삼성전자주식회사 발열체를 갖는 회로 기판과 기밀 밀봉부를 갖는 멀티 칩패키지
US6455931B1 (en) 2001-05-15 2002-09-24 Raytheon Company Monolithic microelectronic array structure having substrate islands and its fabrication
US6626940B2 (en) 2001-06-15 2003-09-30 Scimed Life Systems, Inc. Medical device activation system
US6410971B1 (en) 2001-07-12 2002-06-25 Ferrotec (Usa) Corporation Thermoelectric module with thin film substrates
US6770966B2 (en) 2001-07-31 2004-08-03 Intel Corporation Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
JP4638626B2 (ja) 2001-08-01 2011-02-23 北川工業株式会社 磁性体の成形方法、磁性体、およびプリント基板
WO2003021679A2 (en) 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
US7146221B2 (en) 2001-11-16 2006-12-05 The Regents Of The University Of California Flexible electrode array for artifical vision
AU2002360407A1 (en) 2001-11-20 2003-09-02 California Institute Of Technology Neural prosthetic micro system
US20040092806A1 (en) 2001-12-11 2004-05-13 Sagon Stephen W Microelectrode catheter for mapping and ablation
DE10202123A1 (de) 2002-01-21 2003-07-31 Infineon Technologies Ag Verfahren und Vorrichtung zur Integration von Elektronik in Textilien
US20030162507A1 (en) 2002-02-20 2003-08-28 Vatt Gregory B. Semiconductor structure for high speed digital and radio frequency processing
US20060134713A1 (en) 2002-03-21 2006-06-22 Lifescan, Inc. Biosensor apparatus and methods of use
US6930608B2 (en) 2002-05-14 2005-08-16 Motorola, Inc Apparel having multiple alternative sensors and corresponding method
US6980777B2 (en) 2002-07-31 2005-12-27 Nokia Corporation Smart pouch cover for mobile device
US6965160B2 (en) 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
US7227240B2 (en) 2002-09-10 2007-06-05 Semiconductor Components Industries, L.L.C. Semiconductor device with wire bond inductor and method
JP3931780B2 (ja) * 2002-09-27 2007-06-20 株式会社デンソー 多層プリント基板
US7698909B2 (en) 2002-10-01 2010-04-20 Nellcor Puritan Bennett Llc Headband with tension indicator
US20040085469A1 (en) 2002-10-30 2004-05-06 Eastman Kodak Company Method to eliminate bus voltage drop effects for pixel source follower amplifiers
WO2004045374A2 (en) 2002-11-14 2004-06-03 Ethicon Endo-Surgery, Inc. Methods and devices for detecting tissue cells
JP2004179258A (ja) 2002-11-25 2004-06-24 Hamamatsu Photonics Kk 紫外線センサ
WO2004062526A2 (en) 2003-01-16 2004-07-29 Galil Medical Ltd. Device, system, and method for detecting, localizing, and characterizing plaque-induced stenosis of a blood vessel
US6894265B2 (en) 2003-01-31 2005-05-17 Foveon, Inc. Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same
US20040149921A1 (en) 2003-02-05 2004-08-05 Alexander Smyk Personal solar adviser
FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7337012B2 (en) 2003-04-30 2008-02-26 Lawrence Livermore National Security, Llc Stretchable polymer-based electronic device
US7265298B2 (en) 2003-05-30 2007-09-04 The Regents Of The University Of California Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
WO2004112356A1 (en) 2003-06-12 2004-12-23 Nokia Corporation Mobile communication device cover and method for its operation
US7413919B2 (en) 2003-06-20 2008-08-19 Acellent Technologies, Inc. Method of manufacturing a structural health monitoring layer
JP2005052212A (ja) 2003-08-05 2005-03-03 Axiom Co Ltd 肌センサ
EP1677674A4 (en) 2003-08-20 2009-03-25 Philometron Inc MONITORING OF HYDROGENATION
JP2005079472A (ja) * 2003-09-02 2005-03-24 Seiko Epson Corp 配線基板、電気光学装置及び電子機器
JP4050682B2 (ja) 2003-09-29 2008-02-20 日東電工株式会社 フレキシブル配線回路基板の製造方法
US20050113744A1 (en) 2003-11-21 2005-05-26 Cyberkinetics, Inc. Agent delivery systems and related methods under control of biological electrical signals
KR20050061756A (ko) * 2003-12-18 2005-06-23 한국전자통신연구원 이동형 생체신호 측정용 전극-커넥터 보호 덮개 및 이를포함하는 전극-커넥터
KR20050066128A (ko) 2003-12-26 2005-06-30 주식회사 팬택앤큐리텔 체인지 커버를 이용한 메모리카드의 교체구조 및 방법
US7150745B2 (en) 2004-01-09 2006-12-19 Barrx Medical, Inc. Devices and methods for treatment of luminal tissue
US20060003709A1 (en) 2004-06-30 2006-01-05 Nokia Corporation Protective enclosure for a mobile terminal
US7618260B2 (en) 2004-02-27 2009-11-17 Daniel Simon R Wearable modular interface strap
US20050203366A1 (en) 2004-03-12 2005-09-15 Donoghue John P. Neurological event monitoring and therapy systems and related methods
US7727228B2 (en) 2004-03-23 2010-06-01 Medtronic Cryocath Lp Method and apparatus for inflating and deflating balloon catheters
US7259030B2 (en) 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7302751B2 (en) 2004-04-30 2007-12-04 Hewlett-Packard Development Company, L.P. Method of fabricating a rat's nest RFID antenna
TWI255572B (en) 2004-05-05 2006-05-21 Advanced Connectek Inc A portable electrical power unit with transmission display
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
KR101368748B1 (ko) 2004-06-04 2014-03-05 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
EP1605502A1 (en) 2004-06-08 2005-12-14 Interuniversitair Microelektronica Centrum Vzw Transfer method for the manufacturing of electronic devices
US6987314B1 (en) 2004-06-08 2006-01-17 Amkor Technology, Inc. Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
EP1761792A2 (en) 2004-06-17 2007-03-14 Koninklijke Philips Electronics N.V. Flexible and wearable radio frequency coil garments for magnetic resonance imaging
CN101091114A (zh) 2004-08-31 2007-12-19 生命扫描苏格兰有限公司 制造自动校准传感器的方法
KR100643756B1 (ko) 2004-09-10 2006-11-10 삼성전자주식회사 유연소자, 유연압력센서, 및 이들의 제조방법
JP2006108431A (ja) 2004-10-06 2006-04-20 Sharp Corp 半導体装置
JP4517845B2 (ja) 2004-12-13 2010-08-04 日本電気株式会社 フレキシブルケーブル及び電子機器の製造方法
US8118740B2 (en) 2004-12-20 2012-02-21 Ipventure, Inc. Moisture sensor for skin
JP4137061B2 (ja) 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP2006201217A (ja) * 2005-01-18 2006-08-03 Seiko Epson Corp 配線基板、電気光学装置及び電子機器
US20090291508A1 (en) 2008-05-20 2009-11-26 Rapid Pathogen Screening Inc. Nanoparticles in diagnostic tests
US8594563B2 (en) 2005-02-15 2013-11-26 Vodafone Group Plc Security for wireless communication
GB0505826D0 (en) 2005-03-22 2005-04-27 Uni Microelektronica Ct Vsw Methods for embedding of conducting material and devices resulting from said methods
US7300631B2 (en) 2005-05-02 2007-11-27 Bioscale, Inc. Method and apparatus for detection of analyte using a flexural plate wave device and magnetic particles
US8261195B2 (en) 2005-05-13 2012-09-04 Skinit, Inc. Method for customizing cover for electronic device
US8688189B2 (en) 2005-05-17 2014-04-01 Adnan Shennib Programmable ECG sensor patch
US20060266475A1 (en) 2005-05-24 2006-11-30 American Standard Circuits, Inc. Thermally conductive interface
US20070031283A1 (en) 2005-06-23 2007-02-08 Davis Charles Q Assay cartridges and methods for point of care instruments
DK1909890T3 (da) 2005-07-01 2010-05-03 Imec Organ til funktionel genskabelse af et beskadiget nervesystem
US7769472B2 (en) 2005-07-29 2010-08-03 Medtronic, Inc. Electrical stimulation lead with conformable array of electrodes
US20070027485A1 (en) 2005-07-29 2007-02-01 Kallmyer Todd A Implantable medical device bus system and method
US8657814B2 (en) 2005-08-22 2014-02-25 Medtronic Ablation Frontiers Llc User interface for tissue ablation system
WO2007040064A1 (ja) 2005-09-30 2007-04-12 Matsushita Electric Industrial Co., Ltd. シート状複合電子部品とその製造方法
JP2009512209A (ja) 2005-10-13 2009-03-19 エヌエックスピー ビー ヴィ 電子装置または回路およびその製造方法
JP2007105316A (ja) 2005-10-14 2007-04-26 Konica Minolta Sensing Inc 生体情報測定器
US7271393B2 (en) 2005-11-15 2007-09-18 Nokia Corporation UV radiation meter using visible light sensors
US7759167B2 (en) 2005-11-23 2010-07-20 Imec Method for embedding dies
US9629567B2 (en) 2006-01-12 2017-04-25 Biosense Webster, Inc. Mapping of complex fractionated atrial electrogram
AT503191B1 (de) 2006-02-02 2008-07-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einem eingebetteten bauelement sowie verfahren zum einbetten zumindest eines bauelements in einem leiterplattenelement
IL174211A0 (en) 2006-03-09 2007-07-04 Rotschild Carmel Method and system for using a cellular phone in water activities
CN101416302A (zh) * 2006-04-07 2009-04-22 皇家飞利浦电子股份有限公司 可弹性变形的集成电路器件
AU2007254204A1 (en) 2006-05-18 2007-11-29 Ndi Medical, Llc Portable assemblies, systems, and methods for providing functional or therapeutic neurostimulation
US20080046080A1 (en) 2006-07-07 2008-02-21 Interuniversitair Microelektronica Centrum (Imec) Method for forming packaged microelectronic devices and devices thus obtained
US20080036097A1 (en) 2006-08-10 2008-02-14 Teppei Ito Semiconductor package, method of production thereof and encapsulation resin
KR101453419B1 (ko) * 2006-09-06 2014-10-23 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 2차원 인장 가능하고 구부릴 수 있는 장치
US20080074383A1 (en) 2006-09-27 2008-03-27 Dean Kenneth A Portable electronic device having appearance customizable housing
JP5559539B2 (ja) 2006-10-18 2014-07-23 べシックス・バスキュラー・インコーポレイテッド 身体組織に望ましい温度作用を誘発するシステム
US8046039B2 (en) 2006-10-20 2011-10-25 Lg Electronics Inc. Mobile terminal and case for mobile terminal
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
US8979755B2 (en) 2006-12-08 2015-03-17 The Boeing Company Devices and systems for remote physiological monitoring
DE102006060411B3 (de) 2006-12-20 2008-07-10 Infineon Technologies Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
EP2127082A1 (en) 2007-01-19 2009-12-02 3M Innovative Properties Company Cable for a capacitive proximity sensor
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
US7851906B2 (en) 2007-03-26 2010-12-14 Endicott Interconnect Technologies, Inc. Flexible circuit electronic package with standoffs
US8761846B2 (en) 2007-04-04 2014-06-24 Motorola Mobility Llc Method and apparatus for controlling a skin texture surface on a device
WO2008128208A1 (en) 2007-04-12 2008-10-23 Magneto Inertial Sensing Technology, Inc. Infant sid monitor based on accelerometer
US7693167B2 (en) 2007-05-22 2010-04-06 Rockwell Collins, Inc. Mobile nodal based communication system, method and apparatus
US8140154B2 (en) 2007-06-13 2012-03-20 Zoll Medical Corporation Wearable medical treatment device
US8877565B2 (en) 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
US20090000377A1 (en) 2007-06-29 2009-01-01 Shipps J Clay Brain impact measurement system
US20090015560A1 (en) 2007-07-13 2009-01-15 Motorola, Inc. Method and apparatus for controlling a display of a device
WO2009026139A1 (en) 2007-08-17 2009-02-26 Isis Biopolymer Llc Iontophoretic drug delivery system
US8484836B2 (en) * 2007-09-10 2013-07-16 The Board Of Trustees Of The Leland Stanford Junior University Flexible network
US20090088750A1 (en) 2007-09-28 2009-04-02 Tyco Healthcare Group Lp Insulating Boot with Silicone Overmold for Electrosurgical Forceps
JP2009094099A (ja) * 2007-10-03 2009-04-30 Nec Lcd Technologies Ltd フレキシブル基板の接続部の構造、フレキシブル基板、フラットパネル表示装置
US7739791B2 (en) * 2007-10-26 2010-06-22 Delphi Technologies, Inc. Method of producing an overmolded electronic module with a flexible circuit pigtail
KR100919642B1 (ko) 2007-12-17 2009-09-30 한국전자통신연구원 지향성 음향 생성 장치 및 그를 이용한 휴대용 단말기
TWI370714B (en) * 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
JP2009170173A (ja) 2008-01-11 2009-07-30 Denso Corp Ｅｌ素子及びその製造方法
JP4530180B2 (ja) 2008-01-22 2010-08-25 Ｏｋｉセミコンダクタ株式会社 紫外線センサおよびその製造方法
US20110098583A1 (en) 2009-09-15 2011-04-28 Texas Instruments Incorporated Heart monitors and processes with accelerometer motion artifact cancellation, and other electronic systems
WO2009104462A1 (ja) * 2008-02-22 2009-08-27 ソニー株式会社 ディスクカートリッジ
CN103872002B (zh) 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
WO2009114689A1 (en) 2008-03-12 2009-09-17 The Trustees Of The University Of Pennsylvania Flexible and scalable sensor arrays for recording and modulating physiologic activity
US7619416B2 (en) 2008-04-17 2009-11-17 Universität Zürich Prorektorat Forschung Eidgenössische Technische Hochschule Coil assembly and multiple coil arrangement for magnetic resonance imaging
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
US20090322480A1 (en) 2008-06-30 2009-12-31 Robert Leon Benedict Rfid tag and method of vehicle attachment thereof
US8223325B2 (en) 2008-09-19 2012-07-17 Sensors For Medicine & Science, Inc. Optical sensor assembly
US8251736B2 (en) * 2008-09-23 2012-08-28 Tyco Electronics Corporation Connector assembly for connecting an electrical lead to an electrode
WO2010036807A1 (en) 2008-09-24 2010-04-01 The Board Of Trustees Of The University Of Illinois Arrays of ultrathin silicon solar microcells
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US20100271191A1 (en) 2008-10-07 2010-10-28 De Graff Bassel Systems, devices, and methods utilizing stretchable electronics to measure tire or road surface conditions
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
WO2010042957A2 (en) 2008-10-07 2010-04-15 Mc10, Inc. Systems, devices, and methods utilizing stretchable electronics to measure tire or road surface conditions
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8056819B2 (en) 2008-10-14 2011-11-15 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Miniature and multi-band RF coil design
FR2937511B1 (fr) 2008-10-23 2014-05-16 Oreal Dispositif de distribution d'un produit avec ajustement automatique ou semi-automatique des proprietes du produit grace a un capteur d'ambiance integre
KR101013557B1 (ko) 2008-11-06 2011-02-14 주식회사 하이닉스반도체 플랙시블 반도체 패키지 및 이를 제조하기 위한 와이어 본딩 장치
EP2356680B1 (en) 2008-11-12 2015-04-08 Mc10, Inc. Extremely stretchable electronics
US20110101789A1 (en) 2008-12-01 2011-05-05 Salter Jr Thomas Steven Rf power harvesting circuit
WO2010082993A2 (en) 2008-12-11 2010-07-22 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
JP2012515436A (ja) 2009-01-12 2012-07-05 エムシー１０ インコーポレイテッド 非平面撮像アレイの方法及び応用
GR1006723B (el) 2009-01-16 2010-03-09 ������������ ������������-������� ����������� ����������� ��������� ������� (���� ������� 5%) Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας
EP2392196B1 (en) 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
EP2392198B1 (en) * 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device and method of manufacturing thereof
WO2010102310A2 (en) 2009-03-03 2010-09-10 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US10729357B2 (en) 2010-04-22 2020-08-04 Leaf Healthcare, Inc. Systems and methods for generating and/or adjusting a repositioning schedule for a person
US8332053B1 (en) * 2009-04-28 2012-12-11 Hrl Laboratories, Llc Method for fabrication of a stretchable electronic skin
KR101706915B1 (ko) 2009-05-12 2017-02-15 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
US20100327387A1 (en) 2009-06-26 2010-12-30 Ichiro Kasai Avalanche Photodiode
JP4788850B2 (ja) 2009-07-03 2011-10-05 株式会社村田製作所 アンテナモジュール
WO2011003181A1 (en) 2009-07-06 2011-01-13 Autonomous Identity Management Systems Inc. - Aims Gait-based authentication system
JP2011018805A (ja) 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置の製造方法
EP2275805A1 (en) 2009-07-16 2011-01-19 Acreo AB Moister sensor
US8227916B2 (en) 2009-07-22 2012-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method for reducing dielectric layer delamination
US20120065937A1 (en) 2009-10-01 2012-03-15 Mc10, Inc. Methods and apparatus for measuring technical parameters of equipment, tools and components via conformal electronics
US20110218756A1 (en) 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US20130192356A1 (en) 2009-10-01 2013-08-01 Mc10, Inc. Methods and apparatus for measuring technical parameters of equipment, tools, and components via conformal electronics
US20110079908A1 (en) * 2009-10-06 2011-04-07 Unisem Advanced Technologies Sdn. Bhd. Stress buffer to protect device features
US8390516B2 (en) 2009-11-23 2013-03-05 Harris Corporation Planar communications antenna having an epicyclic structure and isotropic radiation, and associated methods
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
WO2011084450A1 (en) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Electrophysiology in-vivo using conformal electronics
WO2011084709A2 (en) 2009-12-17 2011-07-14 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or change in motion
US8872663B2 (en) 2010-01-19 2014-10-28 Avery Dennison Corporation Medication regimen compliance monitoring systems and methods
WO2011094307A1 (en) 2010-01-26 2011-08-04 Meggitt ( San Juan Capistrano) , Inc. Measurement system using body mounted physically decoupled sensor
EP2556392A4 (en) 2010-04-07 2014-03-19 Mc10 Inc METHODS AND APPARATUSES FOR MEASURING TECHNICAL PARAMETERS OF EQUIPMENT, TOOLS AND COMPONENTS VIA ADAPTABLE ELECTRONIC SHEET
GB201005889D0 (en) * 2010-04-08 2010-05-26 Cambridge Entpr Ltd Tuning of mechanical properties of polymers
JP5284308B2 (ja) * 2010-04-19 2013-09-11 日本メクトロン株式会社 フレキシブル回路基板及びその製造方法
WO2011146258A2 (en) 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
US8715204B2 (en) 2010-07-14 2014-05-06 Prima Temp, Inc. Wireless vaginal sensor probe
WO2012011289A1 (ja) 2010-07-23 2012-01-26 パナソニック株式会社 Ｎｆｃ通信装置およびその制御方法
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
JP5570353B2 (ja) * 2010-09-03 2014-08-13 バイエル マテリアルサイエンス株式会社 伸縮性配線を有する導電部材
US8836101B2 (en) 2010-09-24 2014-09-16 Infineon Technologies Ag Multi-chip semiconductor packages and assembly thereof
US8506158B2 (en) 2010-10-12 2013-08-13 P.S.L. Limited Watch
DE102010042567B3 (de) 2010-10-18 2012-03-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Chip-Package und Chip-Package
WO2012054762A2 (en) 2010-10-20 2012-04-26 Medtronic Ardian Luxembourg S.A.R.L. Catheter apparatuses having expandable mesh structures for renal neuromodulation and associated systems and methods
CN103313671B (zh) 2010-10-25 2017-06-06 美敦力Af卢森堡有限责任公司 用于神经调节治疗的估算及反馈的装置、系统及方法
US8520399B2 (en) * 2010-10-29 2013-08-27 Palo Alto Research Center Incorporated Stretchable electronics modules and circuits
US8456021B2 (en) 2010-11-24 2013-06-04 Texas Instruments Incorporated Integrated circuit device having die bonded to the polymer side of a polymer substrate
US8391947B2 (en) 2010-12-30 2013-03-05 Biosense Webster (Israel), Ltd. Catheter with sheet array of electrodes
EP2484750A1 (en) 2011-02-07 2012-08-08 Ecole Polytechnique Fédérale de Lausanne (EPFL) Monitoring system for cell culture
US8581731B2 (en) 2011-02-16 2013-11-12 Connor Kent Purks Circuits, systems, and methods for monitoring and reporting foot impact, foot placement, shoe life, and other running/walking characteristics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
JP2012218147A (ja) 2011-04-11 2012-11-12 Imec マイクロキャビティを封止するための方法
US8513814B2 (en) 2011-05-02 2013-08-20 International Business Machines Corporation Buffer pad in solder bump connections and methods of manufacture
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US20120316455A1 (en) 2011-06-10 2012-12-13 Aliphcom Wearable device and platform for sensory input
EP2729067A4 (en) 2011-07-14 2014-10-29 Mc10 Inc DETECTION OF A FORCE EXERCISED ON A FOOT OR A FOOTWEAR ARTICLE
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
WO2013022853A1 (en) 2011-08-05 2013-02-14 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
JP2013035974A (ja) * 2011-08-10 2013-02-21 Tokai Rubber Ind Ltd 柔軟導電材料
US8702619B2 (en) 2011-08-26 2014-04-22 Symap Holding Limited Mapping sympathetic nerve distribution for renal ablation and catheters for same
WO2013033724A1 (en) 2011-09-01 2013-03-07 Mc10, Inc. Electronics for detection of a condition of tissue
US20130116520A1 (en) 2011-09-01 2013-05-09 Masoud Roham Single and multi node, semi-disposable wearable medical electronic patches for bio-signal monitoring and robust feature extraction
US20140221160A1 (en) 2011-09-08 2014-08-07 Paofit Holdings Pte. Ltd. Sensor Device and System for Fitness Equipment
US20130200268A1 (en) 2011-09-28 2013-08-08 Mc10, Inc. Electronics for detection of a property of a surface
WO2013052919A2 (en) 2011-10-05 2013-04-11 Mc10, Inc. Cardiac catheter employing conformal electronics for mapping
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
EP2626755B1 (en) 2012-02-10 2019-04-10 Nxp B.V. Calibration method, calibration device and measurement device
WO2013126591A1 (en) 2012-02-21 2013-08-29 Zih Corp. Method and apparatus for implementing near field communications with a printer
US9184798B2 (en) 2012-03-12 2015-11-10 Broadcom Corporation Near field communications (NFC) device having adjustable gain
US20140121540A1 (en) 2012-05-09 2014-05-01 Aliphcom System and method for monitoring the health of a user
US20130316645A1 (en) 2012-05-23 2013-11-28 Health & Life Co., Ltd. Near field communication enabled medical device system
US20130321373A1 (en) 2012-05-31 2013-12-05 Semiconductor Energy Laboratory Co., Ltd. Electronic device, program, and recording medium
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US8948832B2 (en) 2012-06-22 2015-02-03 Fitbit, Inc. Wearable heart rate monitor
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
EP2866645A4 (en) 2012-07-05 2016-03-30 Mc10 Inc CATHETER DEVICE WITH FLOW MEASUREMENT
CN104507655B (zh) 2012-07-31 2016-12-14 夏普株式会社 模具的制造方法
CN105008949A (zh) 2012-10-09 2015-10-28 Mc10股份有限公司 与服装整合的保形电子装置
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
KR20140049314A (ko) * 2012-10-17 2014-04-25 한국전자통신연구원 신축성 전자 디바이스 및 그의 제조방법
US20140188426A1 (en) 2012-12-27 2014-07-03 Steven FASTERT Monitoring hit count for impact events
EP2943901A4 (en) 2013-01-08 2016-10-19 Mc10 Inc APPLICATION FOR MONITORING A PROPERTY OF A SURFACE
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
EP3003149A4 (en) 2013-06-03 2017-06-14 Kacyvenski, Isaiah Motion sensor and analysis
CN105357997A (zh) 2013-06-21 2016-02-24 Mc10股份有限公司 适形电子设备式条带
EP3024523B1 (en) 2013-07-22 2018-08-29 Inhalation Sciences Sweden AB Apparatus and method for generating an aerosol
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
KR20160065948A (ko) 2013-10-07 2016-06-09 엠씨10, 인크 감지 및 분석용 등각 센서 시스템
WO2015054506A2 (en) 2013-10-09 2015-04-16 Mc10, Inc. Utility gear including conformal sensors
EP3071096A4 (en) 2013-11-22 2017-08-09 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
JP2017504114A (ja) 2014-01-03 2017-02-02 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 低出力定量的測定用の集積装置
JP2017502752A (ja) 2014-01-03 2017-01-26 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 流量センシングを含むカテーテルまたはガイドワイヤデバイスおよびその使用
US10410962B2 (en) 2014-01-06 2019-09-10 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
JP2017509869A (ja) 2014-02-24 2017-04-06 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 変形インジケータを有する共形電子回路
CN106063392B (zh) 2014-03-04 2020-06-02 Mc10股份有限公司 电子器件的多部分柔性包封壳体
EP3117206A4 (en) 2014-03-12 2017-11-15 Mc10, Inc. Quantification of a change in assay
CA2957044A1 (en) 2014-09-22 2016-03-31 Mc10, Inc. Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
CN107005282A (zh) 2014-11-18 2017-08-01 Mc10股份有限公司 用于电子装置激活的系统、装置和方法
US20160228640A1 (en) 2015-02-05 2016-08-11 Mc10, Inc. Method and system for interacting with an environment
EP3258837A4 (en) 2015-02-20 2018-10-10 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor

Cited By (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9629586B2 (en) 2008-10-07 2017-04-25 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US10325951B2 (en) 2008-10-07 2019-06-18 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US10383219B2 (en) 2008-10-07 2019-08-13 Mc10, Inc. Extremely stretchable electronics
US9655560B2 (en) 2008-10-07 2017-05-23 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US9186060B2 (en) 2008-10-07 2015-11-17 Mc10, Inc. Systems, methods and devices having stretchable integrated circuitry for sensing and delivering therapy
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9833190B2 (en) 2008-10-07 2017-12-05 Mc10, Inc. Methods of detecting parameters of a lumen
US9662069B2 (en) 2008-10-07 2017-05-30 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US10186546B2 (en) 2008-10-07 2019-01-22 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9894757B2 (en) 2008-10-07 2018-02-13 Mc10, Inc. Extremely stretchable electronics
US9704908B2 (en) 2008-10-07 2017-07-11 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US9702839B2 (en) 2011-03-11 2017-07-11 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
US9723711B2 (en) 2011-05-27 2017-08-01 Mc10, Inc. Method for fabricating a flexible electronic structure and a flexible electronic structure
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
US9622680B2 (en) 2011-08-05 2017-04-18 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US9579040B2 (en) 2011-09-01 2017-02-28 Mc10, Inc. Electronics for detection of a condition of tissue
US9545285B2 (en) 2011-10-05 2017-01-17 Mc10, Inc. Cardiac catheter employing conformal electronics for mapping
US9408305B2 (en) 2012-06-11 2016-08-02 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9844145B2 (en) 2012-06-11 2017-12-12 Mc10, Inc. Strain isolation structures for stretchable electronics
US9554850B2 (en) 2012-07-05 2017-01-31 Mc10, Inc. Catheter device including flow sensing
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9750421B2 (en) 2012-07-05 2017-09-05 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9168094B2 (en) 2012-07-05 2015-10-27 Mc10, Inc. Catheter device including flow sensing
US9801557B2 (en) 2012-07-05 2017-10-31 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9583428B2 (en) 2012-10-09 2017-02-28 Mc10, Inc. Embedding thin chips in polymer
US10296819B2 (en) 2012-10-09 2019-05-21 Mc10, Inc. Conformal electronics integrated with apparel
US9846829B2 (en) 2012-10-09 2017-12-19 Mc10, Inc. Conformal electronics integrated with apparel
US10032709B2 (en) 2012-10-09 2018-07-24 Mc10, Inc. Embedding thin chips in polymer
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US10334724B2 (en) 2013-05-14 2019-06-25 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US10482743B2 (en) 2013-08-05 2019-11-19 Mc10, Inc. Flexible temperature sensor including conformable electronics
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
US9949691B2 (en) 2013-11-22 2018-04-24 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
US10258282B2 (en) 2013-11-22 2019-04-16 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
US10410962B2 (en) 2014-01-06 2019-09-10 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
USD825537S1 (en) 2014-10-15 2018-08-14 Mc10, Inc. Electronic device having antenna
US10986465B2 (en) 2015-02-20 2021-04-20 Medidata Solutions, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10398343B2 (en) 2015-03-02 2019-09-03 Mc10, Inc. Perspiration sensor
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
US10532211B2 (en) 2015-10-05 2020-01-14 Mc10, Inc. Method and system for neuromodulation and stimulation
US9972649B2 (en) 2015-10-21 2018-05-15 Massachusetts Institute Of Technology Nanowire FET imaging system and related techniques
US10673280B2 (en) 2016-02-22 2020-06-02 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
US10567152B2 (en) 2016-02-22 2020-02-18 Mc10, Inc. System, devices, and method for on-body data and power transmission
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
US11154235B2 (en) 2016-04-19 2021-10-26 Medidata Solutions, Inc. Method and system for measuring perspiration
US11992326B2 (en) 2016-04-19 2024-05-28 Medidata Solutions, Inc. Method and system for measuring perspiration
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
US10959326B2 (en) 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
US11172570B2 (en) 2017-11-07 2021-11-09 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
US11768262B2 (en) 2019-03-14 2023-09-26 Massachusetts Institute Of Technology Interface responsive to two or more sensor modalities
US12610823B2 (en) 2020-11-25 2026-04-21 Pragmatic Semiconductor Limited Flexible electronic circuits with support structures

Also Published As

Publication number Publication date
WO2014130928A3 (en) 2015-05-07
KR20150125939A (ko) 2015-11-10
JP2018207122A (ja) 2018-12-27
JP6396928B2 (ja) 2018-09-26
WO2014130931A1 (en) 2014-08-28
CN109951946B (zh) 2021-10-01
CN105340371B (zh) 2019-11-01
JP2016524314A (ja) 2016-08-12
JP2016509375A (ja) 2016-03-24
CN105706536A (zh) 2016-06-22
US20160309594A1 (en) 2016-10-20
CA2901789A1 (en) 2014-08-28
EP2959755A4 (en) 2016-11-09
CN110856344A (zh) 2020-02-28
US20180302988A1 (en) 2018-10-18
EP2959755A2 (en) 2015-12-30
US20160081192A1 (en) 2016-03-17
US20140240932A1 (en) 2014-08-28
CN105706536B (zh) 2018-12-21
EP2959754A4 (en) 2016-11-09
US9226402B2 (en) 2015-12-29
KR20150122721A (ko) 2015-11-02
JP6449789B2 (ja) 2019-01-09
CA2901789C (en) 2021-02-16
EP2959754A1 (en) 2015-12-30
CA2900700A1 (en) 2014-08-28
CN105340371A (zh) 2016-02-17
US9844145B2 (en) 2017-12-12
CN109951946A (zh) 2019-06-28
US9408305B2 (en) 2016-08-02

Similar Documents

Publication Publication Date Title
US9844145B2 (en) Strain isolation structures for stretchable electronics
US9247637B2 (en) Strain relief structures for stretchable interconnects
US10334724B2 (en) Conformal electronics including nested serpentine interconnects
US9583428B2 (en) Embedding thin chips in polymer
Zhang et al. Conformal manufacturing of soft deformable sensors on the curved surface
Cheng et al. An analytical model for shear-enhanced adhesiveless transfer printing
US10474188B2 (en) Flexible electronic device containing electronic element and polymer nanosheet and method for manufacturing same
Kim et al. Microscale inorganic light-emitting diodes on flexible and stretchable substrates
KR20200130370A (ko) 도전성 필름, 센서, 터치 패널 및 화상 표시 장치

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201480018842.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14754143

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2901789

Country of ref document: CA

ENP Entry into the national phase

Ref document number: 2015559039

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2014754143

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20157026253

Country of ref document: KR

Kind code of ref document: A