Classifications

• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
  • C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
  • C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
  • C30B15/20—Controlling or regulating
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
  • C30B29/02—Elements
  • C30B29/06—Silicon
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/12—Active materials
  • H10F77/122—Active materials comprising only Group IV materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/12—Active materials
  • H10F77/122—Active materials comprising only Group IV materials
  • H10F77/1223—Active materials comprising only Group IV materials characterised by the dopants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/70—Surface textures, e.g. pyramid structures
  • H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/547—Monocrystalline silicon PV cells

Definitions

• the field relates generally to the manufacture of solar cells fabricated on monocrystalline silicon wafers, and more specifically to solar cells fabricated on indium-doped monocrystalline silicon wafers sliced from Czochralski grown monocrystalline silicon ingots.
• Single crystal silicon which is the starting material in most processes for the fabrication of semiconductor electronic components, is commonly prepared by the so-called Czochralski (“Cz”) method.
• Cz Czochralski
• polycrystalline silicon (“polysilicon”) is charged to a crucible and melted, a seed crystal is brought into contact with the molten silicon, and then a single crystal is grown by slow extraction. After formation of a neck is complete, the diameter of the crystal is enlarged by, for example, decreasing the pulling rate and/or the melt temperature until the desired or target diameter is reached.
• the cylindrical main body of the crystal which has an approximately constant diameter is then grown by controlling the pull rate and the melt temperature while compensating for the decreasing melt level.
• the crystal diameter is typically reduced gradually to form a tail end in the form of an end-cone.
• the end-cone usually is formed by increasing the crystal pull rate and heat supplied to the crucible. When the diameter becomes small enough, the crystal is then separated from the melt.
• Solar cells may be fabricated from monocrystalline silicon substrates produced by the Czochralski method.
• Czochralski grown monocrystalline silicon substrates may be grown by either standard, i.e., batch, or continuous.
• the growing crystal is doped primarily with boron. It is the industry standard for diffused junction screen-printed solar cells to use boron-doped silicon wafers.
• boron-doped silicon wafers is not without problems. For example, it is known that oxygen impurity, commonly caused by the crucible, of a Czochralski grown crystal can interact with boron dopants forming complexes in the material.
• LID light induced degradation
• one aspect is directed to a solar cell comprising an indium- doped monocrystalline silicon wafer sliced from an ingot grown by the Czochralski method, wherein the efficiency of converting solar spectral irradiance on a surface of the indium-doped monocrystalline silicon wafer under an absolute air mass of 1.5 is at least 17%.
• Another aspect is directed to a solar cell comprising an indium-doped
• Still another aspect is directed to a solar cell comprising an indium-doped monocrystalline silicon wafer sliced from an ingot grown by the Czochralski method, wherein the wafer has an average bulk resistivity less than about 10 ohm-cm and wherein the relative efficiency of the solar cell degrades by no more than about 1% after at least 4 hours exposure to sunlight at a temperature less than 45°C.
• Yet another aspect is directed to a monocrystalline silicon segment having a central axis, a front surface and a back surface that are generally perpendicular to the central axis, a central plane between and parallel to the front and back surfaces, a circumferential edge, and a radius, R, extending from the central axis to the circumferential edge, the segment comprising a mean indium concentration of at least about 1 x 10 15 atoms/cubic centimeters; wherein the indium concentration has a relative radial variance of no more than about 15% over at least 0.75R.
• Another aspect is directed to a monocrystalline silicon wafer having a thickness between about 100 micrometers and about 1000 micrometers and two major dimensions between about 50 mm and about 300 mm, the monocrystalline silicon wafer comprising a mean indium concentration of at least about 1 x 10 15 atoms/cubic centimeters; wherein the indium
• concentration has a variance of no more than about 15% over at least 75% of the length of either of the two major dimensions.
• Yet another aspect is directed to a method of growing a single crystal silicon ingot comprising the steps of providing a single crystal ingot growing apparatus, wherein the growing apparatus includes a chamber having an internal pressure and a crucible disposed within the chamber, preparing a silicon melt in the crucible, introducing an inert gas into the chamber from a gas inlet above the silicon melt, wherein the inert gas flows over the surface of the silicon melt and has a flow rate, introducing a volatile dopant into the silicon melt, wherein the volatile dopant includes indium, growing an indium-doped single crystal silicon ingot, wherein the indium-doped single crystal silicon ingot has an indium dopant concentration, and controlling the indium dopant concentration in the ingot by adjusting the ratio of the inert gas flow rate and the internal pressure of the chamber.
• Still another aspect is directed to a monocrystalline silicon ingot having a central axis, a circumferential edge, a radius extending from the central axis to the circumferential edge, and a mass, the ingot comprising a mean indium concentration of at least about 5 x 10 14 atoms per cubic centimeter and an axial variance of indium concentration of less than about 5 x 10 14 atoms per cubic centimeter over an axial length of over 20 centimeters, wherein the radius of the ingot is greater than about 75 millimeters.
• Another aspect is directed to a method of growing a single crystal silicon ingot comprising the steps of providing a single crystal ingot growing apparatus, wherein the growing apparatus includes a chamber having an internal pressure, a crucible disposed within the chamber, and a liquid doping device, preparing a silicon melt in the crucible, introducing an inert gas into the chamber from a gas inlet above the silicon melt, wherein the inert gas flows over the surface of the silicon melt and has a flow rate, introducing a volatile dopant into the silicon melt as a liquid, wherein the volatile dopant includes indium, growing an indium-doped single crystal silicon ingot, wherein the indium-doped single crystal silicon ingot has an indium dopant concentration, and controlling the indium dopant concentration in the ingot by adjusting the ratio of the inert gas flow rate and the internal pressure of the chamber.
• FIG. 1 is a cross-section of a crystal growth chamber.
• FIG. 2 is a cross-section of a liquid doping system for use in a crystal growth chamber.
• FIG. 3 is an enlarged view of the feeding tube of the doping system shown in
• FIG. 4 is a cross-section of the doping system of FIG. 2 being lowered towards a melt surface.
• FIG. 5 is a cross-sectional view of the doping system of FIG. 2 positioned near the melt surface
• FIG. 6 is a depiction of a monocrystalline silicon ingot grown according to the methods disclosed herein.
• FIG. 7 is a depiction of a monocrystalline silicon wafer of an embodiment.
• FIGS. 8A, 8B, and 8C are graphs showing the absorption of solar cells fabricated on indium-doped monocrystalline silicon wafers and solar cells fabricated on boron-doped monocrystalline silicon wafers of light across the solar spectrum.
• FIG. 9 is a graph depicting the minority carrier lifetime in a high lifetime, boron doped wafer both before and after light soaking (P01GJ - A4).
• the minority carrier lifetime data were obtained according to the method described in Example 12.
• FIG. 10 is a graph depicting the minority carrier lifetime in an average lifetime, boron doped wafer both before and after light soaking (P00PC - C2).
• the minority carrier lifetime data were obtained according to the method described in Example 12.
• FIG. 1 1 is a graph depicting the minority carrier lifetime before and after light soaking (210T0N). The minority carrier lifetime data were obtained according to the method described in Example 12.
• FIG. 12 is a boxplot depicting the normalized solar cell and module efficiency of boron and indium based solar cells and modules after outdoor light soaking. These data were obtained according to the method described in Example 13.
• FIG. 13 is a boxplot depicting the normalized open circuit voltage of boron and indium based solar cells and modules after outdoor light soaking. These data were obtained according to the method described in Example 13.
• FIG. 14 is a boxplot depicting the normalized short circuit current of boron and indium based solar cells and modules after outdoor light soaking. These data were obtained according to the method described in Example 13.
• FIG. 15 is a boxplot depicting the normalized fill factor of boron and indium based solar cells and modules after outdoor light soaking. These data were obtained according to the method described in Example 13.
• FIG. 16 is a boxplot depicting the % Relative LID of boron and indium based solar cells after outdoor light soaking. These data were obtained according to the method described in Example 13.
• FIG. 17 is a boxplot depicting the absolute solar cell efficiency loss of boron and indium based solar cells after outdoor light soaking. These data were obtained according to the method described in Example 13.
• An indium-doped monocrystalline silicon segment e.g., a wafer, disclosed herein is sliced from an ingot grown by the Czochralski method.
• the indium-doped monocrystalline silicon segment is useful in the fabrication of semiconductors and solar cells.
• the present disclosure is further directed to a solar cell fabricated on an indium-doped monocrystalline silicon wafer sliced from an ingot grown by the Czochralski method.
• the indium-doped monocrystalline silicon wafer of the present disclosure is characterized by high efficiency of converting solar spectral irradiance (e.g., sunlight) on a surface thereof.
• the indium-doped monocrystalline silicon wafer of the present disclosure is characterized, in particular, by high efficiency of converting light in the infrared region of the solar spectrum. Accordingly, the indium-doped monocrystalline silicon wafer of the present disclosure is capable of solar spectral irradiance conversion efficiency of at least 17%, at least 18%, at least 19%, or even at least 20%, as measured under an absolute air mass of 1.5.
• the light induced degradation of indium-doped monocrystalline silicon wafers according to the present disclosure is substantially less than the LID of conventional boron- doped solar cells.
• the relative efficiency of the solar cell degrades by no more than about 1% after exposure to light, e.g., sunlight. Absolute light induced degradation has been observed to be less than 0.5% and in some cases substantially less, such as less than 0.1%.
• the indium-doped monocrystalline silicon wafer of the present disclosure is particularly suited for use in the manufacture of solar cells.
• the present disclosure is directed to an indium-doped monocrystalline silicon wafer sliced from a Czochralski grown ingot.
• the Czochralski grown ingot may be grown by a batch Cz process or a continuous Cz process.
• indium is a highly volatile dopant, and has an extremely low segregation coefficient compared to other dopants. For example, indium's segregation coefficient is approximately 4 x 10 ⁇ 4 , compared to 0.8 for boron.
• the indium dopant concentration in the silicon melt can vary by orders of magnitude during a single Czochralski batch growth process.
• the axial (i.e., along the length of the ingot) dopant concentration in the grown ingot may also vary by orders of magnitude as a result of varying dopant concentration in the silicon melt.
• Such axial variation is not desirable as the resistivity of wafers taken from the ingot will depend upon their position within the ingot. According to a method of the present disclosure, therefore, conditions may be controlled in either a batch Cz process or a continuous Cz process to ensure uniform indium dopant along the axial length of the single crystal silicon ingot and along the radial length of the wafer as measured from the central axis to the edge.
• the monocrystalline silicon substrate comprises a segment of a single crystal silicon ingot, i.e., a portion sliced from a single crystal silicon ingot.
• the monocrystalline silicon substrate comprises a single crystal silicon wafer.
• the silicon wafer comprises a wafer sliced from a single crystal silicon wafer which has been sliced from a single crystal ingot grown in accordance with Czochralski crystal growing methods described herein.
• the single crystal silicon ingot has a nominal diameter achievable by Czochralski crystal growing methods. In general, the nominal diameter may be at least about 150 mm, about 200 mm, or greater than about 200 mm, such as 205 mm, 250 mm, 300 mm or even 450 mm.
• the indium-doped single crystal silicon wafer may be sliced from the ingot to have the round shape associated with semiconductor applications or may be sliced to have a generally square shape for use in the manufacture of solar cells.
• the indium-doped monocrystalline silicon wafer is prepared for use in a semiconductor application.
• Ingot growth as well as standard process for preparing wafers for semiconductor manufacture, including silicon slicing, lapping, etching, and polishing techniques, are disclosed, for example, in F. Shimura, Semiconductor Silicon Crystal Technology, Academic Press, 1989, and Silicon Chemical Etching, (J. Grabmaier ed.) Springer- Verlag, N.Y., 1982 (incorporated herein by reference).
• the indium-doped monocrystalline silicon wafer is prepared for use in the manufacture of a solar cell.
• the wafer may be sliced into generally square shape (see FIG. 7).
• a semi-square cell starts from a circular wafer but has had the edges cut off so that a number of cells can be more efficiently packed into a rectangular module.
• Ingots prepared by the Czochralski method generally contain oxygen impurities, which may enter the silicon melt from the ambient atmosphere and from the crucible wall.
• the molten silicon etches or dissolves the quartz that makes up the crucible, thereby generating oxygen doping.
• the oxygen is dispersed throughout the crystal and can cluster to form precipitates and complexes.
• monocrystalline silicon wafers sliced therefrom may comprise oxygen concentrations up to about 30 PPMA (parts per million atomic, ASTM standard F-121-83 or SEMI standard M44), and generally less than about 20 PPMA, such as between about 1 1 PPMA and about 20 PPMA.
• Ingots prepared by the Czochralski method may also comprise carbon as an impurity.
• single crystal silicon ingots, and monocrystalline silicon wafers sliced therefrom, may comprise carbon at a concentration of no more than about 2 ppma.
• the present disclosure is directed to monocrystalline silicon ingots prepared by the Czochralski method that are doped with indium, such as the ingot shown in FIG. 6.
• the present disclosure is directed to methods for growing such ingots.
• the present disclosure is directed to segments and wafers sliced from such indium-doped Czochralski grown ingots.
• the indium-doped monocrystalline silicon substrate comprises a segment, e.g., a wafer, comprising two major, generally parallel surfaces, one of which is a front surface of the substrate and the other of which is a back surface of the substrate, a circumferential edge joining the front and back surfaces, a central plane between the front and back surfaces, and a radius, R, extending from the central plane to the circumferential edge.
• the monocrystalline silicon substrate comprises a monocrystalline silicon wafer having a circular shape. The diameter of the wafer is generally similar to the diameter of the Czochralski-grown single crystal silicon ingot, except for the portion of the ingot that is ground, as known in the art, in order to achieve an ingot having a uniform diameter.
• Ingots are generally grown to a diameter greater than the diameter of the wafer and are typically subjected to grinding in order to smooth the outer circumferential edges thereof, which may reduce the diameter compared to the freshly grown ingot.
• the diameter of the wafer may be at least about 150 mm, about 200 mm, or greater than about 200 mm, such as 205 mm, 250 mm, 300 mm or even 450 mm, and in some embodiments between about 150 mm and about 450 mm.
• the monocrystalline silicon wafer has a thickness between about 100 micrometers and about 1000 micrometers, such as between about 120 micrometers and about 240 micrometers. In specific embodiments, the thickness may be about 180 micrometers, or about 200 micrometers. The thickness may vary by about 20 micrometers lesser or greater than the above recited thickness.
• an indium-doped monocrystalline silicon ingot (which may have been cropped to remove the seed and end cones) or indium-doped monocrystalline silicon segment sliced therefrom (e.g., a wafer) having a central axis, a front surface and a back surface that are generally perpendicular to the central axis, a central plane between and parallel to the front and back surfaces, a circumferential edge, and a radius, R, extending from the central axis to the circumferential edge comprises a mean indium concentration of at least about 5 x 10 14 atoms/cubic centimeters (about 0.01 PPMA), or at least about 1 x 10 15 atoms/cubic centimeters, which is about 0.02 PPMA.
• the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 18 atoms/cubic centimeters (about 20 PPMA). In some embodiments, the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 17 atoms/cubic centimeters (about 2 PPMA). In some embodiments, the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 16 atoms/cubic centimeters (about 0.2 PPMA).
• the Czochralski growth method of the present disclosure enables the preparation of ingots and segments sliced therefrom of substantial axial and radial uniformity of the indium concentration. Accordingly, in some embodiments, the ingot or segment sliced therefrom has a relative radial variance of the indium concentration of no more than about 15% over at least 0.75R (i.e., at least 75% of the radius of the ingot or segment). In some embodiments, the ingot or segment sliced therefrom has a relative radial variance of the indium concentration of no more than about 10% over at least 0.75R (i.e., at least 75% of the radius of the ingot or segment).
• the ingot or segment sliced therefrom has a relative radial variance of the indium concentration of no more than about 15% over at least 0.95R (i.e., at least 95% of the radius of the ingot or segment).
• "Relative radial variance” is determined by measuring the change in indium concentration between two points that are located a given distance apart along the radial length of the monocrystalline silicon ingot as measured from the central axis of the wafer to the circumferential edge divided by the indium concentration as measured at the point closest to the central axis of the monocrystalline silicon wafer. This resultant value is multiplied by 100 in order to arrive at a percentage. This percentage is the "relative radial variance" in indium concentration at disclosed herein.
• the single crystal silicon ingot is generally cut to have four flat edges, wherein each edge is of substantially identical length. Accordingly, the solar cell comprises a monocrystalline silicon wafer that is generally square shaped.
• the monocrystalline silicon wafer is generally square shaped and has rounded edges See FIG. 7, which is a depiction of a monocrystalline silicon wafer having the industry standard square shape of solar cells.
• the square shaped monocrystalline silicon wafer may comprise rounded edges, having a radius, R, as measured from the central axis to the
• the monocrystalline silicon wafers have a thickness between about 100 micrometers and about 1000 micrometers, such as between about 120 micrometers and about 240 micrometers. In specific embodiments, the thickness may be about 180 micrometers, or about 200 micrometers. The thickness may vary by about 20 micrometers lesser or greater than the above recited thickness.
• the length of the two major dimensions of the ingot i.e., flat to flat
• the flat to flat dimensions of the two major dimensions may each be about 125 mm ( ⁇ 0.5 millimeters). In some embodiments, the flat to flat dimensions of the two major dimensions may each be about 156 mm ( ⁇ 0.5 millimeters).
• the rounded edges may have lengths of between about 10 mm and about 20 mm, such as about 15.4 mm ⁇ 1.0 millimeter.
• indium-doped monocrystalline silicon ingots for use in the manufacture of solar cells are generally cropped to have flat edges, such that wafers sliced therefrom are generally square shaped with rounded corners, as shown in FIG. 7.
• the square shaped indium-doped monocrystalline silicon wafer of the present disclosure comprises a mean indium concentration of at least about 5 x 10 14 atoms/cubic centimeters (about 0.01 PPMA), or at least about 1 x 10 15 atoms/cubic centimeters, which is about 0.02 PPMA.
• the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 18 atoms/cubic centimeters (about 20 PPMA). In some embodiments, the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 17 atoms/cubic centimeters (about 2 PPMA). In some embodiments, the mean indium concentration is between about 1 x 10 15 atoms/cubic centimeters (about 0.02 PPMA) and about 1 x 10 16 atoms/cubic centimeters (about 0.2 PPMA).
• the square shaped wafer may have a variance of indium concentration of no more than about 15% over at least 75% of the length of either of the two major dimensions.
• the indium concentration of the wafer has a variance of no more than about 15% over at least 75% of the length of both of the two major dimensions.
• the indium concentration has a variance of no more than about 10% over at least 75% of the length of both of the two major dimensions.
• the indium concentration has a variance of no more than about 15% over at least 95% of the length of both of the two major dimensions.
• the solar cells of the present disclosure comprising monocrystalline silicon wafers having indium dopant concentrations as set forth herein generally have an average bulk resistivity less than about 10 ohm-cm. In some embodiments, the average bulk resistivity less than about 5 ohm-cm, less than about 4 ohm-cm, less than about 3 ohm-cm, less than about 1 ohm-cm, or even less than about 0.5 ohm-cm.
• an indium-doped monocrystalline silicon ingot is grown by the Czochralski method. In some embodiments, an indium-doped monocrystalline silicon ingot is grown by the batch Czochralski method. In some embodiments, an indium-doped monocrystalline silicon ingot is grown by the continuous Czochralski method.
• Indium-doped monocrystalline silicon ingots according to the present disclosure are generally grown in a Czochralski-growth system and are grown according to the Voronkov theory. See, e.g., WO 1998/45508; WO 1998/45509; WO 1998/45510; and WO 2000/022196; among other applications assigned to MEMC Electronic Materials.
• the Czochralski growth chamber comprises a crucible, a system for the delivery of silicon during ingot growth, and a system for the delivery of indium during ingot growth.
• the crucible can be any known for use in silicon crystal growing that is capable of containing both solid and liquid silicon feedstock.
• the crucible can be a quartz crucible or can be a graphite crucible containing a quartz inner liner.
• the crucible can also have any cross-sectional shape depending, for example, on the geometry of the crystal growth system, but typically has a circular cross- sectional shape.
• the crucible suitably comprises an inner growth zone and an outer feed zone, and these zones are in fluid communication with each other.
• the crucible can comprise a wall or other separating means that divides the crucible into the inner and outer zones.
• the wall may comprise a means for the delivery of silicon and/or indium during growth of the monocrystalline ingot.
• the indium-doped single crystal silicon ingot may be grown by the continuous Czochralski method.
• Silicon sources for forming the initial melt or for supplementing the silicon melt during ingot growth include electronic grade silicon,
• the silicon may be added as granular polycrystalline silicon or as polycrystalline chunks.
• the silicon delivery system comprises means to heat the added silicon such that the silicon melt is supplemented with molten silicon.
• the silicon can be delivered in either solid or molten form.
• the continuous Czochralski growth system of the present disclosure further comprises a means for delivering indium to the crucible, both in the silicon of the initial melt and for supplementing the silicon melt as the ingot is pulled.
• the indium can be delivered separately from the silicon supplement, or the indium may be provided in the silicon supplement.
• Continuous Czochralski growth comprises supplementation, either continuous or intermittent, of the silicon melt with silicon and indium may occur to ensure that the relative concentration of indium in the melt remains relatively constant and to further ensure that the silicon melt level remains relatively constant as silicon in the melt solidifies into the growing single crystal.
• the method for growing an indium-doped single crystal silicon ingot comprises batch Czochralski.
• Silicon stock material for forming the initial melt in the batch Czochralski method may include electronic grade silicon, metallurgical grade silicon, or solar grade silicon.
• the silicon stock material may be granular polycrystalline silicon or polycrystalline chunks, for example.
• a Czochralski growth chamber suitable for growing the indium-doped ingots described herein is indicated generally at 100 in FIG. 1.
• the growth chamber 100 includes a crucible 102 for holding a melt 104 of semiconductor or solar-grade material, such as silicon, surrounded by a susceptor 106 contained within a furnace 108.
• the semiconductor or solar-grade material is melted by heat provided from a heating element 1 10 surrounded by insulation 112.
• Heat shields or reflectors 1 14 may be disposed above the melt surface 116 to provide better thermal distribution within the growth chamber 100.
• a pulling mechanism 118 is provided within the growth chamber for growing and pulling ingots out of the melt 104.
• the pulling mechanism includes a pulling cable 120, a seed holder or chuck 122 disposed at the end of the pulling cable, and a seed crystal 124 coupled to the seed holder or chuck 122 for initiating crystal growth.
• the growth chamber 100 may also include one or more gas inlets 126 for introducing an inert gas into the growth chamber.
• the gas inlets 126 may be disposed anywhere along the growth chamber 100.
• the gas inlets 126 in FIG. 1 are disposed above the melt surface 116.
• Gas introduced through the gas inlets flows over the surface of the silicon melt and the surface of the growing ingot, thereby preventing contaminant particles from reaching the phase boundary at which the single crystal is growing.
• Suitable inert gasses include argon, helium, nitrogen, neon, mixtures thereof, and any other suitably inert gas.
• the inert gas flow over the surface of the silicon melt tends to increase evaporation of species from the silicon melt, particularly volatile dopants, such as indium. This effect is amplified when the inert gas flows through narrow channels above the silicon melt, such as those created by heat shields or reflectors 1 14. Accordingly, the gas inlets 126 may be attached to one or more flow controllers 128 for controlling the flow rate of the incoming inert gas, described in more detail below.
• the growth chamber may also include one or more exhaust outlets 130 for removing fluids, such as inert gases and evaporated species from the melt, and contaminant particles from the growth chamber.
• the exhaust outlets 130 may be attached to one or more pressure regulating devices 132, described in more detail below, for regulating the internal chamber pressure of the growth chamber 100.
• the exhaust outlets may also be attached to a pump 134, described in more detail below, which may be operated independently of or in conjunction with the pressure regulating devices 132 to regulate the internal chamber pressure of the growth chamber 100.
• the indium dopant may be introduced as a solid or a liquid.
• the indium dopant may be introduced as a liquid using a liquid doping system, such as the liquid doping system 200 shown in FIG. 2, to limit the amount of indium dopant evaporation during the doping and/or growth process, and to provide more predictable indium dopant concentrations in the resulting indium-doped silicon ingot.
• the liquid doping system 200 shown in FIG. 2 may be disposed within a growth chamber, such as the growth chamber 100 shown in FIG. 1, and may be suspended by cables or wires 202 from a dummy seed 204 attached to a pulling mechanism, such as the pulling mechanism 1 18 shown in FIG. 1, for positioning the liquid doping system 200 during the doping process described herein.
• the dummy seed 204 may be sized and shaped to be received within or coupled to the seed holder or chuck 122 of the pulling mechanism 118 used to grow
• the cables or wires 202 are made from molybdenum or tungsten, although other materials may be used for cables or wires 202.
• the dummy seed 204 may be made of stainless steel or any other suitable material for supporting the weight of the liquid doping system.
• the liquid doping system 200 can be installed in growth chambers, such as the growth chamber 100 shown in FIG. 1, with little to no modification.
• the liquid doping system 200 includes a dopant reservoir 206 for holding dopant 208, and an elongated feeding tube 300 extending from a first, or upper, opening 210 in the dopant reservoir 206.
• the liquid doping system 200 may be made of any material suitable for high temperature applications (e.g., refractory ceramics, molybdenum, tungsten, and graphite). Quartz is suitable because it minimizes the risk of contamination from the liquid doping system 200.
• the liquid doping system 200 has a unitary
• the liquid doping system 200 may be assembled from separate components.
• the dopant reservoir 206 includes quartz sidewalls 212 which define a generally cylindrical body 214 and a tapered end 216 defining the first opening 210 having a smaller cross-sectional area than the cross-sectional area of the body 214.
• the tapered end 216 has a conical shape to channel dopant to the lowest point of the dopant reservoir 206.
• the sidewalls 212 of tapered end 216 are linearly tapered, although the sidewalls 212 defining the tapered end 216 may also be curved inwardly such that tapered end 216 has a bowl-type shape.
• An end of the body 214 distal from the tapered end 216 includes one or more holes 218, equally spaced around the circumference of body 214, through which cables or wires 202 are inserted to secure the liquid doping system 200 to the pulling mechanism 118 for positioning the liquid doping system 200 during the doping process described herein.
• the embodiment shown in FIG. 2 has four holes 218, although other embodiments may have a different number of holes.
• the feeding tube 300 comprises sidewalls 302 extending from the upper opening 210 to a length L, and has a first, or upper, end 304 positioned near the upper opening 210, and a second, or lower, end 306 distal from the upper end 304, having a second, or lower opening, 308 defined therein.
• An angled tip 310 is disposed at the lower end 306 of the feeding tube 300.
• the angled tip 310 provides a better visual indicator of contact between the lower end 306 of the feeding tube and the melt surface 116, compared to a non- angled tip.
• the angled tip 310 therefore aids the operator (not shown) in minimizing the contact between the melt 104 and the liquid doping system 200.
• the doping system is lowered towards the melt surface 116 until the angled tip 310 contacts the melt surface 1 16.
• the dopant reservoir 206 is thus positioned above the melt surface 1 16 by a distance generally equal to the length L of the feeding tube 300.
• the length L of the feeding tube 300 is selected so that during the doping operation, the dopant reservoir is positioned at a height H (shown in FIG. 5) above the melt surface 116 such that the temperature within the dopant reservoir is just above the melting temperature of the dopant 208, thereby limiting dopant evaporation.
• the feeding tube 300 has an inner diameter d defined by inner sidewalls 312 of feeding tube 300, wherein the inner diameter d is sized such that when liquid dopant is passing through the feeding tube 300, the liquid dopant substantially occupies the volume enclosed by feeding tube 300. As a result, the free surface of the liquid dopant is minimized, thereby reducing evaporation of the liquid dopant.
• the inner diameter d of feeding tube 300 is also sized such that the capillary action does not prevent liquid dopant from passing through feeding tube 300.
• the inner diameter d of the feeding tube 300 may be inwardly tapered towards the lower end 306 of the feeding tube 300.
• the feeding tube 300 also has an outer diameter D based upon the thickness of the feeding tube sidewalls 302 and the size of the inner diameter d.
• the outer diameter D of feeding tube 300 is the same as the outer diameter of the tapered end 216 at the upper opening 210.
• the inner sidewalls 312 of the feeding tube 300 extend inwardly near the opening 210 to form a first restriction 314 configured to restrict the passage of solid dopant 208 through the feeding tube 300.
• the first restriction 314 may alternatively be formed from the inner sidewalls 316 of the tapered end 216, or the first restriction 314 may span the feeding tube 300 and the tapered end 216.
• the first restriction 314 has a diameter sized to prevent the passage of solid dopant through the feeding tube 300. In the embodiment shown in FIGS. 2 and 3, the first restriction has an inner diameter of 1 mm.
• a second restriction 318 of this embodiment is formed near the lower end 306 of the feeding tube 300 to impede the flow of, and reduce the velocity of liquid dopant passing through feeding tube 300.
• the velocity of liquid dopant By reducing the velocity of liquid dopant, the impact of the liquid dopant on the melt surface 1 16 is reduced, thereby reducing splashing or spattering of the melt 104.
• impeding the flow of the liquid dopant in the lower end 306 of the feeding tube 300 causes the liquid dopant to be further heated prior to being introduced into the melt 104.
• the liquid dopant is heated to a temperature approaching the temperature of the melt 104 before being introduced into the melt 104. This reduces the thermal shock between the dopant 208 and the melt 104.
• raising the temperature of the liquid dopant reduces the viscosity of the liquid dopant, thereby further reducing splashing or spattering of the melt 104 when liquid dopant is introduced.
• the second restriction 318 also reduces the cross-sectional area of the liquid dopant stream exiting the feeding tube 300, and the resulting free surface area of the liquid dopant on the melt surface 1 16. By reducing the free surface area of the liquid dopant on the melt surface 1 16, the second restriction 318 further reduces evaporation of the liquid dopant.
• the second restriction 318 has a similar configuration to the first restriction 314 in that the inner sidewalls 312 of the feeding tube 300 are inwardly tapered near the lower opening 308 to form the second restriction 318.
• the second restriction 318 extends downwardly to the end of feeding tube 300, defining the lower opening 308 of the feeding tube 300.
• the diameter of the second restriction 318 is sized smaller than the inner diameter d of the feeding tube 300, and large enough to permit liquid dopant to overcome the capillary forces acting on the liquid dopant from the inner sidewalls 312 of feeding tube 300. In the embodiment shown in FIG. 3, the diameter of the second restriction is 2 mm.
• FIGS. 2 and 4-5 a method of using the liquid doping system 200 to introduce liquid dopant into a melt of semiconductor or solar-grade material will now be described.
• a predetermined amount of dopant particles 208 are introduced into dopant reservoir 206 while the liquid doping system 200 is positioned remote from the melt surface 1 16.
• the tapered end 216 funnels the dopant particles 208 towards the lowest portion of the dopant reservoir 206.
• the first restriction 314 prevents solid dopant particles 208 from passing through feeding tube 300.
• the liquid doping system 200 is lowered near the melt surface 116 via pulling mechanism 1 18.
• the liquid doping system 200 is lowered until the angled tip 310 of feeding tube 300 contacts the melt surface 1 16.
• the angled tip 310 of the feeding tube 300 facilitates positioning of the liquid doping system 200 near the melt surface 116 by providing a better visual indicator of contact between the melt surface 116 and the feeding tube 300.
• the liquid doping system 200 is configured to be positioned near the melt surface 1 16 and to minimize contact with the melt 104, which contact can cause gradual degradation of the doping system from thermal shock and deformation, solidification of the melt material around the feeding tube, and deposition on the feeding tube inner surface of silicon monoxide evaporating from the melt 104.
• a move time may be determined within which to position the liquid doping system 200. The move time may be based upon the amount of time needed to melt solid dopant particles 208, and can be estimated by the amount of time needed to raise the temperature of the solid dopant particles 208 to the melting point, or
• T m is the melting temperature of the dopant
• T s is temperature of the solid dopant particles 208 at the beginning of the doping process (normally room temperature)
• c3 ⁇ 4 is the specific heat capacity of the solid dopant particles 208
• m ⁇ is the total mass of the solid dopant particles 208
• Cdd is the specific heat capacity of the liquid doping system 200
• MM is the mass of the liquid
• doping system 200 is the rate of energy transfer from the melt 104 and other components of the growth chamber 100 to the solid dopant particles 208 and to the liquid doping system 200.
• Positioning the liquid doping system 200 near the melt surface 1 16 within the move time prevents liquid dopant from being released while liquid doping system 200 is positioned remote from the melt surface 116, thereby preventing a violent impact of the liquid dopant on the melt surface 1 16.
• the angled tip 310 of feeding tube 300 reduces the amount of time needed to position the liquid doping system 200 because it provides a better visual indication of contact between the melt surface 1 16 and the feeding tube 300. Thus, the angled tip 310 aids the operator (not shown) in positioning the liquid doping system 200 within the move time.
• the temperature inside the dopant reservoir 206 is increased to the melting temperature of dopant particles 208.
• the resulting liquid dopant 220 flows through first restriction 314 and feeding tube 300.
• the size of diameter d of feeding tube 300 limits the available free surface of the liquid dopant 220 as it flows through the feeding tube 300, thereby limiting evaporation of the liquid dopant 220.
• Liquid dopant 220 flowing through feeding tube 300 is impeded by the second restriction 318 at the lower end 306 of feeding tube 300 before exiting feeding tube 300 through the lower opening 308 and entering the melt 104.
• the second restriction 318 impedes the flow of, and reduces the velocity of liquid dopant 220 passing through feeding tube 300, thereby reducing the impact of the liquid dopant 220 on the melt surface 1 16, and any splashing or spattering of the melt 104. Further, impeding the flow of the liquid dopant in the lower end 306 of the feeding tube 300 causes the liquid dopant 220 to be further heated prior to entering the melt 104.
• the temperature of the liquid dopant 220 can be heated to a temperature approaching the temperature of the melt 104 before entering the melt, thereby reducing thermal shock between the liquid dopant 220 and the melt 104. Additionally, raising the temperature of the liquid dopant 220 reduces the viscosity of the liquid dopant, thereby further reducing splashing or spattering of the melt 104 when liquid dopant 220 is introduced in to the melt 104.
• the second restriction 318 also reduces the cross-sectional area of the liquid dopant 220 stream exiting the feeding tube 300, and the resulting free surface area of the liquid dopant 220 on the melt surface 116. By reducing the free surface area of the liquid dopant 220 on the melt surface 116, the second restriction 318 reduces evaporation of the liquid dopant 220.
• liquid doping system 200 is raised by pulling mechanism 118 and removed from furnace 108. The doping process may then be repeated or the liquid doping system 200 may be stored for later use.
• the dopant 208 has a relatively low melting point, e.g., less than 1400°C, or even less than 800°C, the doping method described above can be performed in a relatively short amount of time. As a result, the temperature of the body 214 of dopant reservoir 206 is low enough such that the liquid doping system 200 can be removed from the furnace 108 immediately after the doping process is completed, without the need for a cooling step.
• a relatively low melting point e.g., less than 1400°C, or even less than 800°C
• the dummy seed 204 can be immediately removed from the chuck 122 and replaced with a seed crystal, such as the seed crystal 124 shown in FIG. 1, for use in growing a monocrystalline ingot.
• an inert gas may be introduced into the growth chamber from one or more gas inlets 126 disposed above the silicon melt 104 to remove contaminants and evaporated species produced by the melt, and reduce the risk of contaminants being incorporated into the grown ingot.
• the inert gas flows over the melt surface 1 16 and the surface of the growing ingot 136, thereby preventing contaminant particles from being able to reach the phase boundary 138 at which the single crystal is growing.
• Suitable inert gasses include argon, helium, nitrogen, neon, mixtures thereof, and any other suitably inert gas.
• the indium dopant concentration in the grown ingot may be controlled by adjusting the inert gas flow rate in relation to other parameters within the growth chamber.
• the indium dopant concentration in the grown ingot may be controlled by adjusting the ratio of the inert gas flow rate and the internal chamber pressure based upon a relationship between the inert gas flow rate, the internal chamber pressure, and the effective evaporation rate of indium in the silicon melt.
• g is the effective evaporation rate of indium in the silicon melt
• p is the internal pressure of the chamber
• a and B are each coefficients dependent upon the configuration of the growth chamber.
• incoming inert gas flow rate refers to the total flow rate of the inert gas entering the growth chamber through the one or more gas inlets described herein, measured as a volumetric flow rate, a mass flow rate, or any other suitable means of measuring flow rate.
• the effective evaporation rate of indium in the silicon melt may be selected based upon a desired indium dopant concentration in the silicon melt at a given time t during the ingot growth process.
• the indium dopant concentration in the silicon melt may be related to the amount of time elapsed during the growth process by the equation where C / is the indium dopant concentration in the silicon melt at a given time t during the growth process, Qo is the initial indium dopant concentration in the silicon melt, g * is the effective evaporation rate of the indium dopant, and H is the ratio of the melt volume to the free surface of the melt (i.e., the surface area of the silicon melt less the surface area of the ingot cross-section).
• the effective evaporation rate of indium in the silicon melt may also be selected based upon a desired dopant concentration profile in the grown ingot. For example, the dopant concentration in a growing ingot at the solid-liquid interface can be approximately calculated using the equation
• C s is the indium dopant concentration in the solidified ingot at the solid-liquid interface
• k is the segregation coefficient of indium in silicon (approximately 4 x 10 ⁇ 4 ).
• the effective evaporation rate of indium in the silicon melt may also be selected based upon a desired resistivity profile in the grown ingot.
• the resistivity of indium-doped silicon can be related to the indium dopant concentration in the silicon using industry standards, such as the Irvin curve set forth in DIN 50444, SEMI MF723-0307.
• a corresponding indium-dopant concentration profile may be determined, a corresponding indium- dopant concentration in the silicon melt may be determined, and an effective evaporation rate of indium in the silicon melt may be selected accordingly.
• one or more calibration ingots may be fabricated and utilized to determine an empirical relationship between the resistivity of indium-doped silicon and the indium dopant concentration of the indium-doped silicon.
• the indium dopant concentration may be measured independently of the resistivity using, for example, secondary ion mass spectroscopy (SIMS) or low- temperature Fourier transform infrared spectroscopy (LT-FTIR).
• SIMS secondary ion mass spectroscopy
• LT-FTIR low- temperature Fourier transform infrared spectroscopy
• Such measurement techniques may provide more accurate values for indium dopant concentration in indium-doped silicon as a result of indium having a relatively high ionization energy in silicon (approximately 160 MeV).
• the independently measured indium dopant concentrations may be used in combination with measured resistivity values to select an effective evaporation rate of indium in the silicon melt, as described above.
• the coefficients A and B in Eq. 2 may be empirically determined based upon measurements taken from grown indium-doped silicon ingots. For example, the coefficients A and B may be determined using the relationship between the effective evaporation rate of indium and the effective segregation coefficient of indium in silicon, k e , expressed as
• g * (k e - k) , Eq. 5 where k is the segregation coefficient of indium in silicon (approximately 4 x 10 "4 ), H is the ratio of the melt volume to the free surface of the melt, v is the average pull speed of the crystal puller, and ⁇ is the liquid-to-solid density ratio of silicon.
• solidified fraction means the mass of the ingot between the seed end of the ingot and the reference cross-section, divided by the total mass of the initial charge weight used to grow the ingot.
• the rate of indium dopant evaporation may be controlled by adjusting the ratio of the inert gas flow rate and the internal chamber pressure. Consequently, the indium-dopant concentration in the grown indium-doped silicon ingot may also be controlled by adjusting the ratio of the inert gas flow rate and the internal chamber pressure.
• the inert gas flow rate and the internal chamber pressure may be adjusted such that the ratio of the inert gas flow rate and the internal chamber pressure is between about 0.05 and about 1.40 normal-liters per minute per millibar, between about 0.10 and about 1.00 normal- liters per minute per millibar, or between about 0.10 and about 0.80 normal-liters per minute per millibar.
• the flow rate of the inert gas may be varied between about 20 normal-liters per minute and about 200 normal-liters per minute, between about 30 normal- liters per minute and about 140 normal-liters per minute, or between about 30 normal-liters per minute and about 80 normal-liters per minute.
• the internal pressure of the growth chamber may be varied between about 20 millibar and about 400 millibar, between about 30 millibar and about 200 millibar, or between about 30 millibar and about 100 millibar.
• the term "normal-liter" refers to one liter of the referenced gas at 273.15 Kelvin and 101.325 kPa.
• the ratio of the inert gas flow rate and the internal chamber pressure may be adjusted prior to, during, or both prior to and during the growth process to obtain a desired indium dopant concentration in the grown ingot.
• the inert gas flow rate and/or the internal chamber pressure may be adjusted one more times during the growth process, or even continuously during the growth process.
• the inert gas flow rate and/or the internal chamber pressure may be adjusted based upon real-time measurements of the Czochralski growth process, or at one or more predetermined times following the start of the growth process.
• predetermined times at which the inert gas flow rate or the internal chamber pressure is adjusted may be based upon an amount of time elapsed after commencement of the growth process, upon the ingot reaching a desired length, upon the pulling speed reaching a desired pull speed, or upon an amount of the silicon melt being consumed by the growth process.
• the flow rate of the inert gas flowing through the gas inlets 126 is controlled using one or more flow controllers 128 attached to the gas inlets 126.
• the flow controllers 128 may be any device suitable for regulating the flow rate of inert gas passing through the gas inlet and into the growth chamber, such as mass flow controllers, volumetric flow controllers, throttle valves, or butterfly valves.
• the flow controllers 128 may be automated or manually controlled. Automated flow controllers may be controlled by one or more programmable devices 140 capable of adjusting the flow rate of the inert gas based on user defined conditions (e.g., after a certain amount of time has elapsed).
• the flow controllers shown in FIG. 1 are automated mass flow controllers controlled by programmable devices 140 capable of adjusting the flow rate of the inert gas based on user defined conditions.
• the internal pressure of the growth chamber 100 may be controlled using one or more pressure regulating devices 132 in fluid communication with the exhaust outlets 130 of the growth chamber.
• the pressure regulating devices 132 may be any type of device suitable for regulating the pressure within the growth chamber 100, including electronic pressure controllers, throttle valves, butterfly valves, and ball valves.
• the pressure regulating devices 132 may be automated or manually controlled. Automated pressure regulating devices may be controlled by one or more programmable devices 140 capable of adjusting the internal pressure of the growth chamber 100 based on user defined conditions (e.g., after a certain amount of time has elapsed).
• the programmable device 140 used to control the pressure regulating device 132 may be separate from or the same as the programmable device 140 used to control the flow controller 128.
• the pressure regulating device shown in FIG. 1 is automated and controlled by a programmable device 140 capable of adjusting the internal pressure of the growth chamber based on user defined conditions.
• a pump 134 in fluid communication with the exhaust outlets 130 of the growth chamber 100 may be used to pump inert gas, contaminants, and evaporated species from the silicon melt (e.g., SiO and dopant related species) out of the growth chamber 100.
• the pump 134 may be operated independently of or in conjunction with the pressure regulating device 132 to regulate or adjust the pressure within the growth chamber 100.
• the pump 134 may be controlled by a programmable device 140 capable of adjusting the settings of the pump based on user defined conditions (e.g., after a certain amount of time has elapsed).
• the programmable device 140 may be the same as or separate from the programmable device used to control the flow controller 128 and/or the pressure regulating device 132.
• Adjusting the ratio of the inert gas flow rate and the internal chamber pressure ensures that the relative concentration of indium in the melt remains relatively constant as the indium-doped silicon ingot is grown, and further ensures that the dopant concentration in the indium-doped silicon ingot is relatively uniform.
• An advantage of the process of the present disclosure is the preparation of a commercially sized monocrystalline silicon ingot, such as the ingot 600 shown in FIG. 6, with low axial variance of the indium dopant concentration in the direction parallel to the ingot's central axis 602, in addition to the low radial variance along the radius 604 as measured from the central axis to the circumferential edge 606.
• the axial variance of the indium concentration may be less than about 5 x 10 14 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 20 cm, less than about 1 x 10 14 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 20 cm, less than about 5 x 10 13 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 20 cm, or even less than about 4 x 10 13 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 20 cm.
• the axial variance of the indium concentration may be less than about 1 x 10 15 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 40 cm, less than about 5 x 10 14 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 40 cm, or even less than about 2 x 10 14 atoms per cubic centimeter over an axial length of the monocrystalline silicon ingot of over 40 cm.
• the relative axial variance of indium concentration may be less than about 20% over an axial length of the monocrystalline silicon ingot of over 20 cm, less than about 10% over an axial length of the monocrystalline silicon ingot of over 20 cm, less than about 5% over an axial length of the monocrystalline silicon ingot of over 20 cm, or even less than about 2% over an axial length of the
• the relative axial variance of indium concentration may be less than about 33% over an axial length of the monocrystalline silicon ingot of over 40 cm, less than about 25% over an axial length of the monocrystalline silicon ingot of over 40 cm, less than about 15% over an axial length of the monocrystalline silicon ingot of over 40 cm, or even less than about 10% over an axial length of the
• the mass of the indium- doped silicon ingot 600 may be at least about 30 kg, at least about 40 kg, at least about 50 kg, at least about 60 kg, at least about 70 kg, or at least about 80 kg. In yet further embodiments, the mass of the indium-doped silicon ingot 600 may be in excess of 175 kg, such as at least about 180 kg, at least about 200kg, or even at least about 220 kg.
• "Relative axial variance" is determined by measuring the change in indium concentration between two points that are located a given distance apart along the axial length of the monocrystalline silicon ingot divided by the indium concentration as measured at the point closest to the seed cone of the monocrystalline silicon ingot.
• This resultant value is multiplied by 100 in order to arrive at a percentage.
• This percentage is the "relative axial variance" in indium concentration at disclosed herein.
• the process of the present disclosure results in a monocrystalline silicon ingot having low relative axial variance of indium concentration over a substantial length of the silicon ingot.
• the ingot may be sliced into a population of indium-doped monocrystalline silicon wafers having substantially uniform properties of resistivity, conversion efficiency, and resistance to light induced degradation.
• the monocrystalline silicon ingot may be processed into a monocrystalline silicon wafer or population of monocrystalline silicon wafers suitable for use in solar cell applications.
• the ingot may be processed according to industry standards, including cutting to have flat edges, grounded, edge chamfered, cropped, and wiresaw cut into a population of monocrystalline silicon wafers having substantially uniform properties of indium concentration and resistivity, as explained herein.
• the cutting operation generally follows the guidelines provided by the manufacturer of the cutting tool.
• the monocrystalline silicon ingot is cut into a population of indium-doped monocrystalline silicon wafers having industry standard shapes and sizes meeting the geometric requirements of the end use in a solar cell.
• An indium-doped monocrystalline silicon wafer processed and sliced according to the industry standard may then be further processed, again according to industry standards, into a solar cell.
• the wafer surface may be textured to minimize reflection. Any "roughening" of the surface reduces reflection by increasing the chances of reflected light bouncing back onto the surface, rather than out to the surrounding air.
• a single crystalline substrate can be textured by etching along the faces of the crystal planes.
• the crystalline structure of silicon results in a surface made up of pyramids if the surface is appropriately aligned with respect to the internal atoms.
• Another type of surface texturing used is known as "inverted pyramid" texturing. Using this texturing scheme, the pyramids are etched down into the silicon surface rather than etched pointing upwards from the surface.
• the textured wafer is then processed according to industry standards, to contain an emitter according to industry standard process such as diffusion or implantation of phosphorus, followed by edge isolation.
• an anti-reflection coating may be applied.
• Anti-reflection coatings on solar cells are similar to those used on other optical equipment such as camera lenses. They consist of a thin layer of dielectric material, with a thickness so that interference effects in the coating cause the wave reflected from the anti-reflection coating top surface to be out of phase with the wave reflected from the semiconductor surfaces. These out-of-phase reflected waves destructively interfere with one another, resulting in zero net reflected energy.
• a commonly used coating is silicon nitride.
• a double layer anti-reflection coating may be applied, such as zinc sulfide/magnesium fluoride.
• a patterned metal screen e.g., silver, aluminum, is applied by screen printing to the front and the back of the wafer, which is followed by firing the wafers to yield solar cells useful in, e.g., an array grid.
• the solar cells of the present disclosure are characterized by high efficiency of solar spectral irradiance conversion.
• Solar spectral irradiance conversion efficiency may be measured according to industry standards.
• conversion efficiency may be measured according to the standard set forth in ASTM G 173 -03 entitled American Society for Testing and Materials (ASTM) Terrestrial Reference Spectra for Photovoltaic Performance Evaluation.
• ASTM G173 spectra represent terrestrial solar spectral irradiance on a surface of specified orientation under a set of specified atmospheric conditions.
• the solar cell efficiency is the ratio of the electrical output of a solar cell to the incident energy in the form of sunlight.
• Terrestrial solar cells are measured under AMI .5 conditions and at a temperature of 25°C.
• the energy conversion efficiency ( ⁇ ) of a solar cell is the percentage of the solar energy to which the cell is exposed that is converted into electrical energy.
• the efficiency of a solar cell is determined as the fraction of incident power which is converted to electricity and is defined as:
• V max is maximum power
• V oc is the open-circuit voltage
• I sc is the short-circuit current
• FF is the fill factor
• ⁇ is the efficiency
• a solar cell comprises an indium-doped monocrystalline silicon wafer characterized by an efficiency of converting solar spectral irradiance on a surface of the indium-doped monocrystalline silicon wafer under an absolute air mass of 1.5 of at least 17%, at least 18%, at least 19%, at least 19.5%, at least 20%, at least 20.5%, at least 21%, at least 22%, at least 24%, at least 26%, at least 28% or at least 30%.
• an indium-doped monocrystalline silicon wafer of the present disclosure absorbs more light in the infrared region of the solar spectrum that a boron-doped monocrystalline silicon wafer having substantially similar or identical resistivity.
• an indium-doped monocrystalline silicon wafer of the present disclosure absorbs more light in the wavelength range between 830 nm and 1400 nm than a boron-doped wafer having substantially similar or even identical resistivity. See FIGS.
• FIGS. 8A, 8B, and 8C are graphs showing the better absorption of solar cells fabricated from indium- doped monocrystalline silicon wafers compared to solar cells fabricated from boron-doped monocrystalline silicon wafers of light across the solar spectrum.
• the absorption of the solar cells fabricated from indium-doped wafers was greater than the absorption of the solar cells fabricated from boron-doped wafers even though the resistivity of the boron-doped wafers (about 2.4 ohm cm) is less than the resistivity of the indium-doped wafers (about 3.5 ohm cm).
• the indium-doped monocrystalline silicon wafers of the present disclosure are characterized by low light induced degradation, on both a relative and an absolute basis.
• the relative efficiency of a solar cell comprising an indium-doped monocrystalline silicon wafer degrades by no more than about 2% after 1 hour to 300 hours exposure to light equivalent to 0.1 suns to 10 suns at a temperature less than 45°C.
• the relative efficiency of the solar cell degrades by no more than about 1% after 1 hour to 300 hours exposure to light equivalent to 0.1 suns to 10 suns at a temperature less than 45°C.
• the relative efficiency of the solar cell degrades by no more than about 0.5% after 1 hour to 300 hours exposure to light equivalent to 0.1 suns to 10 suns at a temperature less than 45°C. In some embodiments, the relative efficiency of the solar cell degrades by no more than about 0.3% after 1 hour to 300 hours exposure to light equivalent to 0.1 suns to 10 suns at a temperature less than 45°C. In some embodiments, the relative efficiency of the solar cell degrades by no more than about 2%, or not more than about 1%, not more than 0.5%, or not more than 0.3%, after 24 hours exposure to light equivalent to 0.7 suns at a temperature less than 45°C.
• Relative efficiency is determined by subjecting the indium-doped monocrystalline silicon wafers to illumination, e.g., 24 hours exposure to light equivalent to 0.7 suns at a temperature less than 45 °C, and measuring the decline in efficiency compared to the efficiency of the initial state wafer. The difference in efficiency (efficiency of initial state wafer subtracted by efficiency of wafer after illumination) is divided by the efficiency of initial state wafer. The resultant value may be multiplied by 100 to derive the percentages expressed herein.
• the indium-doped monocrystalline silicon wafers are further characterized by low absolute light induced degradation of efficiency. Absolute light induced degradation is determined by subtracting the efficiency of the degraded wafer (expressed as a percentage) from the efficiency of the initial state wafer (also expressed as a percentage). In some embodiments, the absolute efficiency of the solar cell comprising an indium-doped monocrystalline silicon wafer degrades by no more than about 0.5%, or about 0.2%, or about 0.1%, or about 0.06% after 1 hour to 300 hours exposure to light equivalent to 0.1 suns to 10 suns at a temperature less than 45°C.
• the absolute efficiency of the solar cell comprising an indium- doped monocrystalline silicon wafer degrades by no more than about 0.5%, about 0.2%, about 0.1%, or about 0.06% after 24 hours exposure to light equivalent to 0.7 suns at a temperature less than 45°C. In some embodiments, the absolute efficiency of the solar cell comprising an indium- doped monocrystalline silicon wafer degrades by no more than about 1.0%, about 0.5%, about 0.2%, about 0.1%, or about 0.06% after 4 hours exposure to sunlight at a temperature less than 45°C.
• Example 1 Indium-Doped Monocrystalline Silicon Ingot Grown by Batch Czochralski Method
• An indium-doped monocrystalline silicon ingot was grown by a conventional batch Czochralski method. The ingot was grown to a diameter greater than 200 mm and then ground by a method standard in the industry to a uniform diameter of 200 mm. [0099] The ingot was sliced by wiresaw into wafers having a thickness between about 180 micrometers and about 200 micrometers, and wafers were selected for analysis from various lengths from the seed cone. The wafers were tested for resistivity at the center of the wafer and at 6 mm from the edge of the wafer, indium concentration at the center of the wafer, oxygen concentration at the center of the wafer, carbon concentration at the center of the wafer, and radial resistivity variance. The indium concentration was determined using the Irvin curve set forth in DIN 50444, SEMI MF723-0307. These data are provided in the following Table 1.
• Example 2 Indium-Doped Monocrystalline Silicon Ingot Grown by Batch Czochralski Method
• An indium-doped monocrystalline silicon ingot was grown by batch Czochralski method. During the growth process, the ratio of the inert gas flow rate and the internal chamber pressure were adjusted to control the indium dopant concentration in the grown ingot according to the methods described herein. The ingot was grown to a diameter greater than 200 mm and then ground by a method standard in the industry to a uniform diameter of 200 mm.
• the ingot was sliced by wiresaw into wafers having a thickness between about 180 micrometers and about 200 micrometers, and wafers were selected for analysis from various lengths from the seed cone.
• the wafers were tested for resistivity at the center of the wafer and at 6 mm from the edge of the wafer, indium concentration at the center of the wafer, oxygen concentration at the center of the wafer, carbon concentration at the center of the wafer, and radial resistivity variance.
• the indium concentration was determined using the Irvin curve set forth in DIN 50444, SEMI MF723-0307. These data are provided in the following Table 2.
• An indium-doped monocrystalline silicon ingot was grown by batch Czochralski method. During the growth process, the ratio of the inert gas flow rate and the internal chamber pressure were adjusted to control the indium dopant concentration in the grown ingot according to the methods described herein. The ingot was grown to a diameter greater than 200 mm and then ground by a standard method to a uniform diameter of 200 mm.
• the ingot was sliced by wiresaw into wafers having a thickness between about 180 micrometers and about 200 micrometers, and wafers were selected for analysis from various lengths from the seed cone.
• the wafers were tested for resistivity at the center of the wafer and at 6 mm from the edge of the wafer, indium concentration at the center of the wafer, oxygen concentration at the center of the wafer, carbon concentration at the center of the wafer, and radial resistivity variance.
• the indium concentration was determined using the Irvin curve set forth in DIN 50444, SEMI MF723-0307. These data are provided in the following Table 3.
• Example 4 Indium-Doped Monocrystalline Silicon Ingot Grown by Batch Czochralski Method
• An indium-doped monocrystalline silicon ingot was grown by batch Czochralski method. During the growth process, the ratio of the inert gas flow rate and the internal chamber pressure were adjusted to control the indium dopant concentration in the grown ingot according to the methods described herein. The ingot was grown to a diameter greater than 200 mm and then ground by a standard method to a uniform diameter of 200 mm.
• the ingot was sliced by wiresaw into wafers having a thickness between about 180 micrometers and about 200 micrometers, and wafers were selected for analysis from various lengths from the seed cone.
• the wafers were tested for resistivity at the center of the wafer and at 6 mm from the edge of the wafer, indium concentration at the center of the wafer, oxygen concentration at the center of the wafer, carbon concentration at the center of the wafer, and radial resistivity variance.
• the indium concentration was determined using the Irvin curve set forth in DIN 50444, SEMI MF723-0307. These data are provided in the following Table 4.
• the resistivity of the 200 wafers was within the range of 3.03 ohm-cm to 3.5 ohm-cm.
• the oxygen concentrations of the wafers were within the range of 14.9 PPMA to 15.4 PPMA.
• the lifetimes of the wafers were within the range of 325 microseconds to 651 microseconds (measured at crystal level at injection level of 5xl0 14 /cm 3 ; Sinton BCT 400).
• Solar cells were fabricated from the indium-doped wafers prepared according to the method described in Example 5. The wafers were selected to have resistivity of 3.5 ohm-cm and were implanted with a 90 ohm/sq emitter.
• Voc denotes the open-circuit voltage, i.e., the maximum voltage available from the solar cell.
• FF denotes fill factor, which is the maximum power from a solar cell, defined as the ratio of the maximum power from the solar cell to the product of Voc and fsc(the short circuit current). Efficiency is defined as the ratio of energy output from the solar cell to input energy from the sun.
• N-factor denotes the diode ideality factor, which may range from 1 to 2. A value closer to 1 denotes ideal behavior.
• Rs denotes the series resistance.
• RSH denotes shunt resistance.
• Solar cells were fabricated from the indium-doped wafers prepared according to the method described in Example 5. The wafers were selected to have resistivity of 3.5 ohm-cm and were diffused with a POCL3-HNS 65 emitter.
• 200 wafers were selected from a boron-doped ingot grown according to the continuous Czochralski method.
• the wafers had flat to flat lengths of the major dimensions of 156 mm+/-0.5 mm.
• the wafer diagonal dimension was 200 mm+/-0.5 mm.
• the corner length was 15.4 mm +/-1 mm.
• the thicknesses of the wafers were 200 micrometers +/-20 micrometers or 180 micrometers +/-20 micrometers.
• the resistivity of the 200 boron-doped wafers was between about 2.4 ohm-cm and about 2.73 ohm-cm.
• the oxygen concentrations of the wafers were about 14.6 PPMA.
• the lifetimes of the wafers were about 320 microseconds (measured at crystal level at injection level of 5xl0 14 /cm 3 ; Sinton BCT 400).
• Solar cells were fabricated from the boron-doped wafers prepared according to the method described in Comparative Example 1. The wafers were selected to have resistivity of 2.4 ohm-cm and were implanted with a POCL3-HNS 65 emitter.
• Example 8 Light Induced Degradation Testing of Solar Cells Fabricated from Indium- Doped Monocrystalline Silicon Wafers and Solar Cells Fabricated from Boron-Doped Monocrystalline Silicon Wafers
• Solar cells fabricated from indium-doped monocrystalline silicon wafers of Example 6 and solar cells fabricated from boron-doped monocrystalline silicon wafers of Comparative Example 2 were subjected to solar spectral irradiance equivalent to 0.7 suns for 24 hours at a temperature below 45°C in order to test the light induced degradation of various performance characteristics of the solar cells.
• the performance characteristics of the initial solar cells and the performance characteristics of the solar cells after irradiance for 24 hours are presented in the following Table 10.
• the light induced degradation evaluations were performed on solar cells fabricated from indium-doped monocrystalline silicon wafers and solar cells fabricated from boron-doped monocrystalline silicon wafers that were selected to be closely matched in oxygen concentration and dopant concentration.
• the solar cells fabricated from indium-doped wafers showed substantially reduced light induced degradation after illumination compared to the solar cells fabricated from boron-doped wafers.
• Solar cells were fabricated from indium-doped wafers. The wafers were selected to have resistivity of 3.4 ohm-cm and were implanted with a 90-110 ohm/sq emitter.
• Example 10 Initial State Testing of Indium-Doped Monocrystalline Silicon Wafers Implanted with 90-110 ohm/sq Emitter
• Solar cells were fabricated from indium-doped wafers. The wafers were selected to have resistivity of 3.1 ohm-cm and were implanted with a 90-110 ohm sq emitter.
• Solar cells were fabricated from boron-doped wafers. The wafers were selected to have resistivity of 2.5 ohm-cm and were implanted with a 90-110 ohm/sq emitter.
• Example 11 Light Induced Degradation Testing of Solar Cells Fabricated from Indium- Doped Monocrystalline Silicon Wafers and Solar Cells Fabricated from Boron-Doped Monocrystalline Silicon Wafers
• the light induced degradation evaluations were performed on solar cells fabricated from indium-doped monocrystalline silicon wafers and solar cells fabricated from boron-doped monocrystalline silicon wafers that were selected to be closely matched in oxygen concentration and dopant concentration.
• the solar cells fabricated from indium-doped wafers showed substantially reduced light induced degradation after illumination compared to the solar cells fabricated from boron-doped wafers. More specifically, the efficiency of the solar cells fabricated from indium-doped wafers remained at or very near 19% after illumination, compared to absolute degradation of about 0.5% for the boron-doped cells. In view of these results, solar cells fabricated from indium-doped cells exhibited substantially less light induced degradation than solar cells fabricated from boron-doped cells.
• Example 12 Effect of Light Induced Degradation on Minority Carrier Lifetime of Solar Cells Fabricated from Indium-Doped Monocrystalline Silicon Wafers and Solar Cells Fabricated from Boron-Doped Monocrystalline Silicon Wafers
• Three groups of wafers were chosen from three different crystals. Each group of wafers was from the same segment. There are four wafers in each group. The first group of wafers was sliced from a high lifetime boron doped continuous Cz segment. The second group of wafers was sliced from an average lifetime boron doped continuous Cz segment. The third group of wafers was sliced from an indium doped Cz crystal.
• the crystal segment lifetime and resistivity for all three groups is shown in Table 16.
• the injection level lifetime for all four P01GJ-A4 (high lifetime, boron doped) wafers are shown in FIG. 9 before and after outdoor light soaking for six days.
• the injection level lifetime for all four P00PC - C2 wafers (average lifetime, boron doped) are shown in FIG. 10 before and after outdoor light soaking for six days.
• the injection level lifetime for all four 210T0N wafers (indium doped) are shown in FIG. 11 before and after outdoor light soaking for six days.
• the minority carrier lifetime of indium doped Cz wafers does not degrade after exposure to sunlight for 6 days, while the minority carrier lifetime of boron doped CCz wafers does degrade.
• the LID test on boron and indium doped silicon wafers, where minority carrier lifetime is the measureable performance parameter, corresponds to the solar cell efficiency data on solar cells made on indium doped Cz silicon and boron doped CCz silicon wafers.
• the efficiency of solar cells made on indium doped Cz wafers does not degrade after light exposure, while solar cells made on boron doped CCz do exhibit light induced degradation.
• a silicon solar cell's efficiency is related to the silicon wafer's minority carrier lifetime.
• the equations below pertain to an ideal semiconductor diode with no electric recombination in the space charge region. A more general formulation can be made, but the overall relationships can be demonstrated with an ideal diode model. Solar cell efficiency is given by equation 9.
• V oc is the open circuit voltage of the solar cell
• I sc is the short circuit current
• FF is the diode fill factor
• ⁇ is the power density of the illumination incident on the solar cell.
• Piont is 1 kW/m 2 for the AMI.5 solar spectrum.
• V oc is a strong function of the base silicon's minority carrier diffusion length. The function of the open circuit voltage for an ideal diode is given in equation 10.
• Equation 10 k is Boltzmann's constant, T is the temperature, q is the fundamental charge of an electron, II is the electric current generated due to illumination, and Io is the saturation current of the solar cell assuming an ideal p-n junction.
• the open circuit voltage is related to the minority carrier diffusion length via the saturation current of the solar cell, which is given in equation 1 1.
• A is the area of the solar cell
• D e ,h is the diffusivity constant of electrons and holes respectively
• A is the number of dopant acceptors
• o is the number of dopant donors
• L e ,h is the diffusion length of electrons and holes respectively.
• a p-type silicon wafer is used and a junction is made with a heavily doped n- type emitter.
• the second term in equation 1 1 is significantly smaller than the first term, and can be ignored. All of the variables in the first term are fixed by the process or are physical constants except the diffusion length of electrons. Since this is a p-type material, L e is the minority carrier diffusion length.
• This parameter has been used as a measure of crystalline perfection. It represents the average distance a minority carrier will travel in a crystal before recombining with a majority carrier. Its value is affected by many crystal properties such as metallic impurities, crystal defects (dislocations, vacancies, etc.), intentional impurities (dopants), and other defects.
• the minority carrier diffusion length is related to the minority carrier lifetime via the diffusivity constants of the minority carrier. This relationship for electrons, which are the minority carrier in p-type silicon, is shown in equation 12.
• T E is the minority carrier lifetime of electrons.
• Equation 13 indicates that the electric current due to illumination primarily occurs within one diffusion length on either side of the depletion region. In a standard industrial solar cell, the depletion width can be considered small, less than 0.5 microns, and the thicknesses of the n-type diffused emitter region is shorter than the depletion width, the active region of electric current generation due to illumination will be one diffusion length into the p-type silicon wafer.
• the electron - hole pair recombination rate will be determined by the minority carriers, electrons in p-type silicon. This has two implications for solar cell efficiency. The first is that by increasing II, the V oc will increase, as described in equation 10. The second is that by increasing the minority carrier diffusion length the portion of the silicon wafer that will actively generate electron - hole pairs will increase, which will increase the short circuit current, I sc .
• the minority carrier diffusion length, and by extension the minority carrier lifetime, is one of the most important material properties of a silicon wafer used as the base of solar cell. It is a measure of crystalline perfection, which has a significant effect on solar cell's open circuit voltage, V oc . Also, it increases the electrically active volume of the base silicon wafer, which contributes to the solar cell's open circuit voltage, V oc , and short circuit current, I sc .
• silicon wafers with longer minority carrier lifetimes have better solar cell efficiencies provided they are in the same electronic structure, such as an industry standard diffused junction screen-printed solar cell. Therefore, by maintaining a wafer's minority carrier lifetime by replacing boron with indium, the solar cell's efficiency will not degrade because of illumination, and the efficiency of the solar cell after light exposure will be higher for solar cells fabricated on indium doped wafers.
• Example 13 Comparative Testing of the effect of Light Induced Degradation on Minority Carrier Lifetime of Solar Cells and Modules Fabricated from Indium-Doped
• a population of solar cells was fabricated using production line equipment (by a large industrial solar cell manufacturer). Solar cells were fabricated on both boron-doped single crystalline silicon wafers and indium-doped single crystalline silicon wafers. The solar cells were initially measured on a Sinton Instruments FCT-400 light current vs. voltage tester. A total of 93 solar cells were measured, including 27 solar cells fabricated on boron-doped silicon wafers and 66 solar cells fabricated on indium-doped silicon wafers. The initial solar cell efficiency for both boron and indium based solar cell was between 19.1% - 19.2%. After initial measurements, all 93 solar cells were simultaneously light soaked outdoors. Light soaking was done by leaving the solar cells outside at St. Peters, MO in autumn from 12:00PM until
• solar modules were fabricated from solar cells fabricated on indium- doped single crystal silicon wafers and boron-doped single crystal silicon wafers.
• Six modules were fabricated from indium-doped single crystal silicon wafers.
• One reference module was fabricated from boron-doped single crystal silicon wafers.
• the modules were fabricated using standard module materials (MEMC Singapore, Inc.). Each module was manufactured from 72 solar cells. These modules were subjected to light soaking by leaving the modules outside at Singapore until they were exposed to approximately 150kW-hr/m 2 of total solar irradiance. To compare to the solar cell performance, solar module performance data after at a total irradiance exposure of approximately 20 kW-hr/m 2 was used.
• the average normalized performance parameters of the solar cells fabricated from boron-doped silicon wafers and indium-doped silicon wafers after light soaking are shown in the following Table 18.
• the normalized solar cell efficiency shown in FIG. 12 indicates that the solar cells fabricated on indium-doped silicon wafers degrade by less than 1%, while the solar cells fabricated on boron-doped slicon wafers degrade by more than 2%.
• the degradation for solar cells fabricated on boron-doped silicon wafers is significantly greater than solar cells fabricated on indium-doped silicon wafers and occurs in every performance parameter; V oc , I sc , and FF.
• the solar module LID performance displays almost the same behavior as the solar cell data. The only difference can be seen in the open circuit voltage. However, after longer sunlight exposure times (150 kW-hr/m 2 ), the solar cell and module open circuit voltage data are closer.
• the comparison of the solar cells fabricated on boron-doped silicon wafers and indium-doped silicon wafers made in a high volume manufacturing facility can also be shown in terms of percent relative LID and absolute efficiency loss. Both are typically used in the photovoltaic industry for reporting loss due light induced degradation.
• the percent relative LID and absolute efficiency loss for the solar cells fabricated on boron-doped silicon wafers and indium-doped silicon wafers are shown in FIGS. 16 and 17, respectively.

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