WO2014077081A1 - Tuyau de chaleur, téléphone intelligent, terminal à tablette ou assistant numérique personnel - Google Patents

Tuyau de chaleur, téléphone intelligent, terminal à tablette ou assistant numérique personnel Download PDF

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Publication number
WO2014077081A1
WO2014077081A1 PCT/JP2013/078165 JP2013078165W WO2014077081A1 WO 2014077081 A1 WO2014077081 A1 WO 2014077081A1 JP 2013078165 W JP2013078165 W JP 2013078165W WO 2014077081 A1 WO2014077081 A1 WO 2014077081A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat pipe
information terminal
portable information
pipe
Prior art date
Application number
PCT/JP2013/078165
Other languages
English (en)
Japanese (ja)
Inventor
本村　修
直人 佐久間
伸行 小島
Original Assignee
東芝ホームテクノ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012251650A external-priority patent/JP2014098530A/ja
Priority claimed from JP2013033448A external-priority patent/JP6263841B2/ja
Priority claimed from JP2013155002A external-priority patent/JP6135363B2/ja
Application filed by 東芝ホームテクノ株式会社 filed Critical 東芝ホームテクノ株式会社
Publication of WO2014077081A1 publication Critical patent/WO2014077081A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat pipe that is small and can provide a sufficient amount of heat transport, and a smartphone, tablet terminal, or portable information terminal equipped with the heat pipe.
  • Patent Document 2 discloses a foldable mobile phone equipped with a heat pipe in order to transport heat generated by a heating element to a low temperature part.
  • a mobile information terminal such as a smartphone generates more heat from the CPU than a mobile phone. Therefore, even if a structure like patent document 1 is incorporated in a portable terminal, the heat from a heat generating body cannot be transported effectively to a low temperature part.
  • Patent Document 2 discloses a heat dissipation structure that diffuses the heat generated by the CPU using a heat pipe.
  • a heat pipe having a diameter of 3 mm or more is carried. It is not possible to secure enough space for storage in the device casing.
  • heat pipes since mobile devices such as smartphones and tablet terminals have not been determined to be used, heat pipes have the disadvantage that the heat transport capability is reduced if the heat receiving part is above the direction of gravity than the heat radiating part. It was.
  • the present invention can be stored in a housing of a mobile device such as a smartphone or a tablet terminal, and has a sufficient heat transport capability regardless of the orientation of the mobile device in which the posture to be used is not determined. It aims at providing the heat pipe from which this is obtained.
  • Another object of the present invention is to provide a portable information terminal capable of effectively transporting heat from a heating element to a low temperature part.
  • Another object of the present invention is to provide a portable information terminal such as a smartphone that can install a heat pipe excellent in heat transport capability in a casing and can alleviate a heat spot generated in an outer shell.
  • an object of the present invention is to provide a heat pipe that can prevent the heat transport capability of the heat pipe from being lowered and can be made into a form suitable for a portable device.
  • an object of the present invention is to provide a portable information terminal that can be easily installed in a thin casing and that can maximize the capability of thermal components by realizing good heat diffusion. There is to do.
  • the heat pipe is also provided in the case of a portable device such as a smartphone that can be attached and detached with a battery size that can be easily held by the user's hand. It becomes possible to attach, and sufficient heat transport capability can be obtained by this heat pipe.
  • the inner surface grooved copper tube is made of pure copper and the working fluid is pure water, so that the capillary force generated in the groove becomes larger, and the heat receiving part is more than the heat radiating part with respect to the direction of gravity. Even if it is in a higher position, the decrease in heat transport capability as a heat pipe is reduced.
  • the heat generated from the heat generating part is carried to the outer peripheral part of the portable device by the heat pipe, and when the user holds the portable device by hand, it is effectively externally applied from the hand touching the outer peripheral part.
  • the heat is dissipated. Therefore, it is possible to provide a heat pipe in a form suitable for heat diffusion of a portable device such as a smartphone.
  • the heat generated from the heat generating part is carried to the outer peripheral part of the portable device by the heat pipe, and when the user holds the portable device by hand, the heat is effectively applied from the hand touching the outer peripheral part.
  • the heat is dissipated. Therefore, it is possible to provide a heat pipe in a form suitable for heat diffusion of a portable device such as a smartphone.
  • the heat generated from the heat generating portion is carried to the outer peripheral portion of the portable device by the heat pipe, and when the user holds the portable device by hand, the heat is effectively applied from the hand touching the outer peripheral portion.
  • the heat is dissipated. Therefore, it is possible to provide a heat pipe in a form suitable for heat diffusion of a portable device such as a smartphone.
  • a plurality of one heat pipe in which the heat receiving portion is higher than the heat radiating portion with respect to the direction of gravity and the other heat pipe in which the heat receiving portion is lower than the heat radiating portion in the direction of gravity Is attached to a mobile device such as a smartphone, so that even if the orientation of the mobile device is turned upside down, good heat transport is performed by either heat pipe, and the performance degradation as a heat pipe is unlikely to occur.
  • a configuration suitable for a portable device in which the heat generation amount of the heat generating portion is larger can be obtained.
  • a normal mobile phone generates a small amount of heat
  • a portable information terminal such as a smartphone operates a variety of applications, and therefore generates a large amount of heat from a heating element such as a CPU. Therefore, by installing a heat pipe in such a portable information terminal, the heat from the heating element can be effectively transported to the low temperature part.
  • the heat from the heating element can be effectively transported to the low temperature part.
  • the heat pipe cannot be mounted on the portable information terminal when the diameter of the heat pipe is ⁇ 3 mm or more, the flattening process with a thickness of 1.5 mm or less is applied to the heat pipe. It becomes possible to install a heat pipe in the gap.
  • the heat transport capability is provided inside a small portable information terminal such as a smartphone having a size that can be easily held by the user's hand.
  • a small portable information terminal such as a smartphone having a size that can be easily held by the user's hand.
  • An excellent heat pipe can be installed.
  • this heat pipe enables effective heat diffusion, and heat spots generated in the outline of the portable information terminal can be alleviated.
  • the height of the groove fin formed on the inner surface of the heat pipe is 0.06 mm to 0.25 mm, and the groove bottom width is 0.03 mm to 0.19 mm.
  • a sufficient amount of heat transported with respect to the calorific value is obtained by setting the amount of the hydraulic fluid sealed in the heat pipe to 0.0017 cc / cm to 0.0050 cc / cm per unit length of the heat pipe. It is possible to prevent the heat pipe from swelling when the hydraulic fluid freezes while ensuring the above. Therefore, a heat pipe excellent in heat transport capability can be installed inside a small portable information terminal such as a smartphone having a size that can be easily held by a user's hand. Further, this heat pipe enables excellent heat diffusion, and can mitigate heat spots generated in the outline of the portable information terminal.
  • heat transport is also performed inside a small portable information terminal such as a smartphone having a size that can be easily held by the user's hand.
  • a heat pipe with excellent capacity can be installed.
  • the heat pipe can effectively diffuse the heat generated by the heating element such as the CPU from the surroundings of the heating element, so that the heat spot generated in the outer periphery of the portable information terminal is alleviated especially in the vicinity of the heating element. it can.
  • heat generated from a heating element such as a CPU can be efficiently transferred to the heat receiving portion of the heat pipe via the heat conductor, and a gap corresponding to the thickness of the heat conductor is formed in the heating element. If there is, the heat receiving part of the heat pipe can be installed in the gap. For this reason, it is possible to provide an optimum cooling mode by installing a heat pipe having excellent heat transport capability inside a portable information terminal that is particularly required to be thin.
  • the heat radiating part of the heat pipe is fitted in the groove formed in the structure, the contact area between the structure and the heat radiating part of the heat pipe is small even if the surface area of the heat pipe is small.
  • the heat from the heat radiating part of the heat pipe can be easily transferred to the structure, and the heat conduction between the heat pipe and the structure can be improved.
  • the heat spot which arises in the outline of a personal digital assistant can be eased further.
  • the temperature of the heating element is higher than that of the heating element.
  • a flexible heat conducting member must be connected in the middle of the heat pipe. If it is a portable information terminal incorporated in one common case, the heat pipe that diffuses the heat from the heating element may be mounted in the single case, and the flexibility that impairs the heat transport capability of the heat pipe. Therefore, it is not necessary to add a heat conductive member that has a good characteristic within a limited housing space. Accordingly, it is possible to provide a portable information terminal such as a smartphone capable of realizing a compact structure while maximizing the heat transport capability of the heat pipe.
  • the heat radiating portion of the heat pipe when the heat radiating portion of the heat pipe is cooled from the outside of the housing by cooling or a heat radiating member, the heat radiating portion of the heat pipe is strongly cooled on one side with respect to the circumferential direction.
  • the hydraulic fluid condenses and stays in the cooled area on one side, but by twisting the groove formed on the inner surface of the heat pipe, for example, spirally, the hydraulic fluid uniformly enters the entire groove, reducing the performance of the heat pipe Can be difficult to cause.
  • strength of a heat pipe can be improved by not forming a groove
  • the twenty-first aspect of the present invention it is easy to take an installation space in the width direction around the CPU as a heating element, but an installation space in the thickness direction cannot be taken.
  • the space around the battery is easy to install in the thickness direction, but the installation space in the width direction is difficult. Therefore, by applying flat processing only to the heat receiving portion of the heat pipe, the housing size (thickness / width) of a portable information terminal such as a smartphone can be further reduced.
  • the flat part is not applied to the curved part of the heat pipe, the cooling performance is excellent, and since the part other than the curved part is flat processed, the portable information terminal such as a smartphone is thinned. can do.
  • the housing size is further reduced by flattening the heat pipe while securing the heat transport amount necessary for cooling the portable information terminal such as a smartphone. Can do.
  • the housing size is further reduced by flattening the heat pipe while securing the heat transport amount necessary for cooling the portable information terminal such as a smartphone. Can do.
  • the housing size is further reduced by flattening the heat pipe while ensuring the heat transport amount necessary for cooling the portable information terminal such as a smartphone. Can do.
  • the capillary force of the groove formed on the inner surface of the heat pipe is increased, and it is possible to make it difficult for the heat pipe performance to deteriorate even in the top heat position.
  • the shape of the tip of the heat radiating part of the heat pipe is not stable and the performance as a heat pipe is inferior to other parts, it is a so-called dead space of a portable information terminal such as a smartphone.
  • a portable information terminal such as a smartphone.
  • the heat dissipation from the metal body to the user's hand or the atmosphere is excellent, and the cooling effect can be increased.
  • frosting on the metal body can be prevented by heat exchange between the heat radiating portion of the heat pipe and the metal body using the heat pipe as a defrosting means.
  • heat can be radiated from the back of the casing of the portable device or the back of the display touching the outside air by the heat pipe, and a heat radiating form in which the best cooling effect can be obtained.
  • the heat pipe is not easily affected by gravity regardless of the orientation in which the mobile device is used. It is possible to prevent a decrease in the heat transport capacity of the pipe, and to make it suitable for a portable device. Further, the heat generated inside the casing can be guided to the heat pipe and can be radiated from the back of the casing of the portable device that is in contact with the outside air.
  • the heat receiving portion is located at a position higher than the heat radiating portion with respect to the direction of gravity
  • the other heat pipe is located at a position lower than the heat radiating portion with respect to the direction of gravity.
  • the heat pipe is surrounded by the depression formed in the heat receiving block, and the part of the outer surface of the heat pipe and the heat receiving surface of the heat receiving block are substantially adhered to the functional component of the portable device. Even if the heat sink is small, the contact area between the heat receiving block and the functional component and the heat pipe can be as large as possible, making it easy to transfer heat from the functional component to the heat pipe. The conductivity can be made excellent. Thereby, the temperature rise of a functional component is reduced and the heat spot which arises on the surface of a portable apparatus can also be relieved.
  • the heat pipe is surrounded by the depression formed on the surface opposite to the heat receiving surface of the heat receiving block so that the heat receiving surface of the heat receiving block is substantially adhered to the functional component of the portable device, Even if the surface area is small, the contact area between the heat receiving block and the heat pipe can be as large as possible, making it easy to transfer heat from the functional component to the heat pipe, and excellent heat conduction between the functional component and the heat pipe. Can be Thereby, the temperature rise of a functional component is reduced and the heat spot which arises on the surface of a portable apparatus can also be relieved.
  • a part of the heat pipe is disposed in a gap between the first functional component and the second functional component of the portable device so as to dissipate heat to the rear surface of the casing of the portable device or the rear surface of the display.
  • a part of the heat pipe can be disposed between the heat generating part of the portable device and the battery to dissipate heat to the back surface of the casing of the portable device or the back surface of the display.
  • the heat pipe is arranged on the side of the first functional component of the portable device, and the heat receiving plate is substantially adhered to the first functional component, so the heat from the first functional component is It can be efficiently transmitted to the heat pipe via the heat receiving plate.
  • the heat pipe is surrounded by the concave bent portion formed in the heat receiving plate, the heat from the first functional component can be efficiently transferred to the heat pipe via the heat receiving plate.
  • the first functional component has a gap corresponding to the thickness of the heat receiving plate, it becomes possible to install a heat pipe in the gap, and especially a cooling mode that is optimal for portable devices such as tablet terminals that are required to be thin. can do.
  • the outer diameter of the inner grooved copper tube is set to ⁇ 2.5 mm or less, or the copper tube is flattened, so that the thermal conductivity is reduced in a slight gap in the casing of the portable device such as a tablet terminal. It is possible to attach a heat pipe made of a copper tube with an inner groove excellent in the size, and to incorporate and provide a heat pipe having an excellent heat transport capability in a portable device of a size that is easy for the user to handle.
  • the overall length of the heat pipe can be made longer and the length of the heat radiating portion can be more sufficiently secured.
  • the positional relationship between the heat receiving part and the heat radiating part becomes difficult to increase with respect to the distance (head) in the direction of gravity, so that the heat pipe further increases the influence of gravity regardless of the orientation in which the mobile device is used. It becomes difficult to receive, and the fall of the heat transport capability of a heat pipe can be prevented effectively.
  • the entire length of the heat pipe can be lengthened and the length of the heat radiating portion can be sufficiently secured. Because the positional relationship between the heat receiving part and the heat radiating part is not so large with respect to the distance (head) in the direction of gravity, the heat pipe is affected by gravity regardless of the orientation in which the mobile device is used. It becomes difficult to prevent a decrease in the heat transport capacity of the heat pipe.
  • the heat radiating plate to which the heat pipe is thermally connected can be easily installed in the thin casing even for the thickness limitation of the casing in pursuit of ease of use.
  • the heat transported by the heat pipe is diffused over a wide area of the heat dissipation plate, and good heat diffusion can be realized over a wide area of the housing. Since the temperature rise of the thermal component is also suppressed, the capability of the thermal component can be maximized, and the processing speed of a portable information terminal such as a smartphone is greatly improved.
  • the thermal conductivity of the heat radiating plate by setting the thermal conductivity of the heat radiating plate to 15 W / m ⁇ k or more, it becomes possible to perform sufficient heat diffusion over a wide range of the casing, and the thickness of the heat radiating plate is reduced.
  • the thickness By setting the thickness to 0.3 mm or less, it becomes possible to cope with the limitation on the thickness of the casing in pursuit of ease of use. Therefore, the portable information terminal can be provided which can be easily installed even with respect to the thickness limitation of the casing in pursuit of ease of use and can perform better heat diffusion over a wide area of the casing.
  • the heat pipe is a flat heat pipe having a thickness of 2 mm or less, so that it is possible to cope with the thickness limitation of the casing in pursuit of ease of use. For this reason, it is possible to provide a portable information terminal that can be easily installed even with respect to the thickness limitation of the casing in pursuit of ease of use and can perform good heat diffusion over a wide area of the casing.
  • the thickness is particularly severely limited inside the housing.
  • the first part is placed at a location, and the second part is placed at a place where the thickness is more restrictive than that, so that the installation can be done even for the thickness limitation of the chassis in pursuit of ease of use. This makes it easy to provide a portable information terminal that can perform better thermal diffusion over a wide area of the housing.
  • the melting point of the solder for thermally connecting the heat pipe to the heat radiating plate is set to 160 ° C. or less so that the heat pipe does not swell at the time of soldering and the ease of use is pursued. It becomes possible to cope with the thickness limitation of the housing. For this reason, it is possible to provide a portable information terminal that can be more easily installed even when the thickness of the housing pursues ease of use, and can perform better heat diffusion over a wide area of the housing.
  • the performance deterioration due to the use posture is further unlikely to occur, and it is possible to provide a heat pipe preferable for a portable device in which the use posture is not determined.
  • the ninth aspect of the present invention it is possible to provide a heat pipe in a form suitable for a portable device in which the heat generation amount of the heat generating portion is larger.
  • a portable information terminal capable of effectively transporting heat from the heating element to the low temperature part can be provided.
  • the heat from the heating element can be effectively transported to the low temperature part.
  • the heat pipe having excellent heat transport capability can be installed in the casing of the small portable information terminal, and effective heat diffusion is enabled by the heat pipe. Heat spots that occur in the outer shell of the can be reduced.
  • a heat pipe excellent in heat transport capability can be installed in the casing of a small and thin portable information terminal, and excellent heat diffusion is enabled by the heat pipe.
  • the heat spot generated in the outer shell of the terminal can be alleviated.
  • a heat pipe excellent in heat transport capability can be installed in a housing of a small portable information terminal, and excellent heat diffusion is enabled by the heat pipe. Heat spots generated in the outer shell can be reduced.
  • a heat pipe excellent in heat transport capability can be installed in the housing of a small portable information terminal, and the heat generated from the heating element by the heat pipe is effective from the periphery of the heating element. Therefore, it is possible to alleviate a heat spot generated in the outer area of the belt device especially in the vicinity of the heating element.
  • an optimum cooling mode can be obtained by installing a heat pipe excellent in heat transport capability in a casing of a portable information terminal that is particularly required to be thin.
  • a portable information terminal such as a smartphone capable of realizing a compact structure while maximizing the heat transport capability of the heat pipe.
  • the performance of the heat pipe can be hardly lowered, and the strength of the heat pipe can be improved.
  • the housing size (thickness / width) of a portable information terminal such as a smartphone can be further reduced.
  • a portable information terminal such as a smartphone can be thinned.
  • the housing size (thickness / width) as a portable information terminal such as a smartphone can be further reduced.
  • the housing size (thickness / width) as a portable information terminal such as a smartphone can be further reduced.
  • the housing size (thickness / width) as a portable information terminal such as a smartphone can be further reduced.
  • heat influence on the battery can be avoided by the heat radiation area.
  • the thirty-third aspect of the present invention it is advantageous for cooling of functional components in a portable device such as a tablet terminal in which the user's usage posture is arbitrary, and a cooling mode optimum for the portable device can be obtained.
  • the temperature rise of the functional component can be reduced, and the heat spot generated on the surface of the portable device can be reduced.
  • the temperature rise of the functional component can be reduced, and the heat spot generated on the surface of the portable device can be alleviated.
  • a heat pipe having an excellent heat transport capability in a small and thin portable device that is easy to handle for a user. Can be suppressed.
  • a part of the heat pipe can be disposed between the heat generating part of the portable device and the battery to dissipate heat to the back surface of the casing of the portable device or the back surface of the display.
  • heat from the first functional component can be efficiently transmitted to the heat pipe via the heat receiving plate.
  • a portable information terminal that can be easily installed in a thin casing and can exhibit the ability of the thermal component to the maximum by realizing good heat diffusion. Can be provided.
  • the portable information that can be installed more easily even with respect to the thickness limitation of the casing pursuing ease of use and can stably perform good heat diffusion in a wide area of the casing.
  • a terminal can be provided.
  • a portable information terminal that can be installed more easily even with respect to the thickness limit of the casing in pursuit of ease of use and can perform better heat diffusion over a wide area of the casing. Can be provided.
  • a portable information terminal that can be installed more easily even with respect to the thickness limit of the casing in pursuit of ease of use and can perform better heat diffusion over a wide area of the casing. Can be provided.
  • FIG. 3 is a cross-sectional view of the heat pipe of FIG. 2 along the line AA. It is an external appearance photograph of the ultrafine heat pipe shown in FIG. It is an external appearance front view of the smart phone which accommodates a heat pipe same as the above. It is an internal sketch of the smart phone equipped with the ultrafine heat pipe shown in FIG. It is an internal sketch of the smart phone equipped with the ultrafine heat pipe shown in FIG. It is the internal schematic of the smart phone equipped with the ultrafine heat pipe shown in FIG. It is the internal schematic of the smart phone equipped with the ultrafine heat pipe shown in FIG.
  • FIG. 10 is an internal schematic diagram of a smartphone equipped with an extra-fine heat pipe different from FIGS. 8 and 9.
  • FIG. 11 is an internal schematic diagram of a smartphone equipped with an extra-fine heat pipe different from FIGS. 8 to 10.
  • FIG. 12 is a schematic diagram of the interior of a smartphone equipped with an extra-fine heat pipe different from those shown in FIGS. It is an external appearance front view of the smart phone as a portable information terminal in a 2nd embodiment of the present invention. It is the internal schematic of the smart phone which made the fine heat pipe fit to the heat-receiving plate closely_contact
  • FIG. 15 is a cross-sectional view of the smartphone of FIG. 14 taken along the line BB.
  • FIG. 15 is a cross-sectional view of the smartphone of FIG. 14 taken along the line CC.
  • FIG. 3 is an internal sketch of a smartphone in which the ultrafine heat pipe shown in FIG. 2 is in direct contact with the CPU.
  • FIG. 3 is a cross-sectional view taken along the line CC of the ultrafine heat pipe shown in FIG.
  • FIG. 3 is a cross-sectional view of the ultrafine heat pipe after flattening.
  • FIG. 2 is a schematic view of the interior of a smartphone in which the ultrafine heat pipe shown in FIG.
  • FIG. 3 is a schematic view of the inside of a smartphone in which the ultrafine heat pipe shown in FIG. FIG.
  • FIG. 24 is a schematic diagram of the interior of a smartphone equipped with an extra-fine heat pipe different from FIG. 14, FIG. 21, and FIG.
  • FIG. 24 is an internal schematic diagram of a smartphone equipped with an extra-fine heat pipe different from FIG. 14 and FIGS. 21 to 23.
  • FIG. 25 is an internal schematic diagram of a smartphone equipped with an extra-fine heat pipe different from FIG. 14 and FIGS. 21 to 24.
  • FIG. 26 is a schematic internal view of a smartphone equipped with an extra-fine heat pipe different from FIG. 14 and FIGS. 21 to 25.
  • FIG. 27 is a schematic internal view of a smartphone equipped with an extra-fine heat pipe different from FIG. 14 and FIGS. 21 to 26. It is a partial expansion top view of an ultrafine heat pipe of another shape same as the above.
  • FIG. 24 is a schematic diagram of the interior of a smartphone equipped with an extra-fine heat pipe different from FIG. 14, FIG. 21, and FIG.
  • FIG. 24 is an internal schematic diagram of a smartphone equipped with an extra-fine
  • FIG. 3 is a cross-sectional view taken along line AA of the ultrafine heat pipe having another shape shown in FIG. It is an external appearance perspective view of the ultra-fine heat pipe in one embodiment of the present invention.
  • FIG. 31 is a partially enlarged view of the ultrafine heat pipe shown in FIG. 30.
  • FIG. 32 is a sectional view of the heat pipe of FIG. 31 taken along the line DD.
  • FIG. 31 is an external view of a tablet terminal in which the heat pipe shown in FIG. 30 is incorporated. It is a top view in a housing
  • FIG. 41 is a sectional view taken along the line EE of FIG. 40.
  • FIG. 41 is a cross-sectional view taken along the line EE of FIG. 40 showing another example.
  • FIG. 41 is a cross-sectional view taken along the line EE of FIG. 40 showing another example.
  • FIG. 41 is a cross-sectional view taken along the line EE of FIG. 40 showing another example.
  • FIG. 41 is a cross-sectional view taken along the line EE of FIG. 40 showing another example.
  • FIG. 41 is a cross-sectional view taken along the line EE of FIG.
  • FIGS. 1 to 12 show a first embodiment of the present invention, and here, a heat pipe mounted on a portable device such as a smartphone will be described as an example.
  • FIG. 1 shows the external appearance of the ultrafine heat pipe 1
  • FIG. 2 shows the external appearance of another shape of the ultrafine heat pipe 2.
  • Each of these ultrafine heat pipes 1 and 2 has an outer diameter of ⁇ 2 mm, and as shown in FIG. 3, both ends of the internally grooved copper tube 12 made of pure copper or the like made of a material in which the groove 11 is formed on the inner wall, It is configured to be sealed by Tig welding.
  • the inside of the copper tube 12 is filled with a working fluid 13 (not shown) such as pure water in a vacuum state.
  • the tube forming the main body of the ultrafine heat pipes 1 and 2 instead of the pure copper copper tube 12 having particularly excellent thermal conductivity, for example, the thermal conductivity is inferior to pure copper, but the workability is improved.
  • a copper alloy tube or the like may be used. Also in that case, a plurality of grooves 11 are formed on the inner wall, and the sealing portions 15 are formed by appropriate means such as Tig welding at both ends of the hollow cylindrically extending tube body, so that the inside of the tube body Is obtained in a vacuum state.
  • the outer shapes of the ultrafine heat pipes 1 and 2 are both bent at about 90 ° in the middle of the copper tube 12 to form bent portions 21 at the respective portions, and both ends of the linear base portion 22.
  • a substantially U-shape is formed by connecting a straight arm portion 23 via a bent portion 21 to the second arm portion.
  • the ultrathin heat pipe 1 shown in FIG. 1 has substantially the same length of the base 22 and the arm 23, but the ultrafine heat pipe 2 shown in FIG. Each part of the bent portion 21 is selected.
  • one or a plurality of bent portions 21 of about 90 ° are formed, whereby the outer shape of the ultrafine heat pipe is also formed in a substantially U shape, a substantially L shape, or a substantially B shape. .
  • FIG. 4 shows a photograph of the ultrafine heat pipe 1, and the copper tube 12 is formed with a slight crushing portion in the bent portion 21 due to an external force during the bending process.
  • flattening may be performed to form a crushed portion, or may remain uncrushed.
  • the outline of the portable device 31 is formed by a vertically long, substantially rectangular casing 32 having an outer dimension that can be held by hand.
  • a touch panel 33 in which an input device and a display device are integrated is disposed on the front side of the housing 32, while a CPU (central processing unit) serving as a control unit of the portable device 31 is disposed above the housing 32.
  • 34 and other various electronic components 35 are accommodated in a state of being mounted on the printed circuit board 36, and the inside of the housing 32 can be charged to supply necessary power to the CPU 34 and the electronic components 35.
  • a battery pack 37 as a substantially rectangular charging means is detachably accommodated.
  • typical external dimensions of a smartphone that is the mobile device 31 are 67 mm wide, 130 mm high, and 8.3 mm thick.
  • the external dimensions of the battery pack 37 are 53 mm wide, 58 mm high, and 4 mm thick. .8 mm. Due to the dimensional difference between the portable device 31 and the battery pack 37, at least the outer diameter of the ultrafine heat pipes 1, 2 is between the portable device 31 and the outer peripheral portion 38 of the housing 32 and the outer surface of the battery pack 37.
  • a U-shaped gap 39 is formed with a wide dimension.
  • the ultrathin heat pipes 1 and 2 are continuously provided with a groove 11 having a wick structure from one end to the other end of the copper tube 12 without interruption.
  • the ultrafine heat pipes 1 and 2 are partly arranged as heat receiving parts 16 so as to be able to transfer heat to the CPU 34 which is a heat generating part of the portable device 31, and the other part is used as the heat radiating part 17 and portable devices.
  • 31 is arranged in the gap 39 in a state along a part of the outer peripheral portion 38 in the vicinity of the outline of the casing 32.
  • the size is limited from the viewpoint of easiness to hold, and the extra-fine heat pipes 1 and 2 as shown in FIGS. Can do.
  • the outer diameter of the ultrafine heat pipes 1 and 2 is preferably ⁇ 2.5 mm or less. Further, since the portable device 31 such as a smartphone often holds and holds the outer peripheral portion 38 of the outer case of the housing 32 by hand, the heat is transferred from the heat radiating portion 17 of the ultrafine heat pipes 1 and 2 to the outer peripheral portion 38. This is advantageous for cooling.
  • FIG. 10 and FIG. 11 show examples in which the ultrafine heat pipes 3 and 4 having shapes different from the ultrafine heat pipes 1 and 2 described above are individually attached to the portable device 31.
  • the ultra-fine heat pipe 3 shown in FIG. 10 is bent at about 90 ° at one place in the copper tube 12 to form a bent portion 21 at that portion, and a linear base portion. It is formed in a substantially L shape in which a straight arm portion 23 is connected to one end of 22 via a bent portion 21.
  • a part of the extra-fine heat pipe 3 is arranged as a heat receiving part 16 so as to be able to transfer heat with the CPU 34, and the other part as a heat radiating part 17, a part of the outer peripheral part 38 of the housing 32. Is arranged in the gap 39 in a state along the line.
  • the ultrafine heat pipe 3 shown in FIG. 11 is bent at about 90 ° in the middle of the copper tube 12 to form bent portions 21 at the portions, and bent at both ends of the linear base portion 22.
  • a straight arm portion 23 is connected via the portion 21, and the both ends of the arm portion 23 are formed in a substantially square shape connecting the straight folded portion 24 via another bent portion 22.
  • a part of the extra-fine heat pipe 4 is arranged as a heat receiving part 16 so as to be able to transfer heat with the CPU 34, and the other part as a heat radiating part 17, a part of the outer peripheral part 38 of the housing 32. Is arranged in the gap 39 in a state along the line.
  • FIG. 12 shows an example in which an extra fine heat pipe 5 having a different shape is mounted in one portable device 31 in addition to the extra fine heat pipe 1 described above.
  • the ultrafine heat pipe 5 is bent at about 90 ° at four locations along the copper tube 12 to form bent portions 21 at the respective portions, and the bent portions 21 are provided at both ends of the linear base portion 22.
  • the straight arm portions 23 are connected to each other, and the both ends of the arm portions 23 are formed in a substantially square shape by connecting the straight folded portions 24 via other bent portions 22.
  • a part of the extra-fine heat pipe 5 is arranged as a heat receiving part 16 in a state capable of transferring heat to the CPU 34, and the other part as a heat radiating part 17, a part of the outer peripheral part 38 of the housing 32. Is disposed above the inside of the housing 32.
  • the shape of the heat pipe mounted in the mobile device 31 is not linear, but is substantially U-shaped (extra-fine heat pipes 1 and 2), substantially L-shaped (extra-fine heat pipe 3), Since it has a substantially square shape (extra-fine heat pipes 4 and 5), the distance (drop) in the direction of gravity between the heat receiving portion 16 and the heat radiating portion 17 does not increase even if the length of the heat radiating portion 17 is sufficiently secured. Thereby, the fall of the heat transport capability as the ultrafine heat pipes 1, 2, 3, 4, and 5 can be prevented.
  • a plurality of ultrafine heat pipes 1 and 5 are attached to a portable device 31 such as a smartphone, and the heat receiving portion 16 of one ultrafine heat pipe 5 in a certain use posture is Even if it comes to a position higher than the heat radiating part 17, the heat receiving part 16 of the other ultrafine heat pipe 1 is arranged to be lower than the heat radiating part 17 with respect to the direction of gravity. Thereby, even if the usage posture of the mobile device 31 by the user is reversed upside down, either one of the ultra-fine heat pipes 1 and 5 is located at a position where the heat receiving portion 16 is lower than the heat radiating portion 17 in the direction of gravity.
  • good heat transport can be performed by either of the fine heat pipes 1 and 5. This can be said to be an optimal configuration when the use posture of the mobile device 31 is not constant and the heat generation amount of the CPU 34 is larger, for example, like a mobile device 31 such as a smartphone.
  • the operation of the above configuration will be described.
  • the heat from the CPU 34 is very fine heat pipes 1, 2, 3, 4, 5 Is transferred to the heat receiving portion 16, the working fluid 13 evaporates in the heat receiving portion 16, and the steam flows from the heat receiving portion 16 toward the heat radiating portion 17 having a low temperature, in the ultrafine heat pipes 1, 2, 3, 4, and 5.
  • Heat transport takes place.
  • the heat transported to the heat radiating part 17 is transferred from the outer peripheral part 38 of the outer case of the housing 32 thermally connected to the heat radiating part 17 to the outside of the portable device 31 through the user's hand touching the outer peripheral part 38. Heat is dissipated.
  • heat from the CPU 34 is effectively diffused, and a heat spot generated on the outer surface in the vicinity thereof is alleviated.
  • the steam is condensed and the working liquid 13 is accumulated, and in the heat receiving part 16, the working liquid 13 is reduced by evaporation.
  • the hydraulic fluid 13 is returned from the heat radiating portion 17 to the heat receiving portion 16 by utilizing the capillary force of the groove 11 formed on the inner wall of the inner grooved copper tube 12.
  • the heat receiving unit 16 is located higher than the heat radiating unit 17 in the direction of gravity due to the use posture of the portable device 31, a sufficient amount of the hydraulic fluid 13 does not return to the heat receiving unit 16 due to the influence of gravity. It falls into a phenomenon, and it leads to the performance fall as extra-fine heat pipes 1, 2, 3, 4, and 5.
  • the effect of gravity increases as the distance (head) in the direction of gravity increases.
  • the outer shape of the heat pipe is substantially U-shaped (extra-fine heat pipes 1, 2), substantially L-shaped (extra-fine heat pipe 3), or substantially U-shaped (extra-fine heat pipes 4, 5). ) So that the distance (head) does not increase in the direction of gravity even if the heat radiation portion 17 is formed long. As a result, regardless of the orientation in which the mobile device 31 is used, the ultrafine heat pipes 1, 2, 3, 4, and 5 are not easily affected by gravity. The fall of the heat transport capability as 5 can be prevented.
  • the other ultrafine heat pipe is used. Since the plurality of ultra-fine heat pipes 1 and 5 are mounted in the housing 32 of the mobile device 31 such as a smartphone so that the heat receiving portion 16 of 5 is positioned lower than the heat radiating portion 17 with respect to the direction of gravity, Regardless of the orientation in which the device 31 is used, when either one of the fine heat pipes 1 and 5 always performs good heat transport and the heat generation amount of the CPU 34 mounted on the portable device 31 is larger, An optimum configuration can be obtained.
  • the diameter of the copper pipe 12 is ⁇ 2. It is formed to 5 mm or less.
  • the battery pack 37 can be attached and detached in a case 32 of a portable device 31 such as a smartphone that can be easily held by the user's hand. It becomes possible to attach the above-mentioned ultrafine heat pipes 1, 2, 3, 4 and 5, and this ultrafine heat pipes 1, 2, 3, 4, and 5 can provide a sufficient heat transport capability. Therefore, it is possible to provide ultrafine heat pipes 1, 2, 3, 4, and 5 that can be housed in the housing 32 of the portable device 31 such as a smartphone and can obtain a sufficient heat transport capability.
  • the pipe body is a copper pipe 12 with a groove 11 formed on the inner wall and made of pure copper and having an inner groove, and the working liquid 13 is pure water.
  • the inner surface grooved copper tube 12 with the groove 11 formed on the inner wall is made of pure copper and the working fluid 13 is made of pure water, so that the capillary force generated in the groove 11 becomes larger and the heat receiving portion 16 moves in the direction of gravity.
  • the reduction in heat transport capability as the ultrafine heat pipes 1, 2, 3, 4, 5 is reduced. Therefore, it is possible to provide ultrafine heat pipes 1, 2, 3, 4, and 5 having further excellent heat transport capability.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 of the present embodiment are arranged along the CPU 34 that is a heat generating part of the mobile device 31 and a part of the outer peripheral part 38 of the mobile device 31.
  • the heat generated from the CPU 34 is carried to the outer peripheral portion of the portable device 31 by the ultrafine heat pipes 1, 2, 3, 4, and 5, and when the user holds the portable device 31 by hand, the outer periphery Heat is effectively radiated from the hand touching the portion 38 to the outside. Therefore, if the ultrathin heat pipes 1, 2, 3, 4, and 5 are arranged along the CPU 34 of the mobile device 31 such as a smartphone and a part of the outer peripheral portion 38 of the mobile device 31, the mobile device 31 such as a smartphone is naturally provided. Therefore, it is possible to provide ultrafine heat pipes 1, 2, 3, 4, and 5 in a form suitable for heat diffusion.
  • one or more portions of the copper tube 12 are provided in the ultrafine heat pipes 1, 2, 3, 4, and 5 in which the working fluid 13 is sealed in the inner surface grooved copper tube 12 in which the groove 11 is formed on the inner wall.
  • a bent portion 21 is provided at a location that is processed to be approximately 90 °.
  • the ultra-fine heat pipes 1, 2, 3, 4, and 5 housed in the portable device 31 are not easily affected by gravity, and performance degradation due to the orientation of the use posture is unlikely to occur. . Therefore, it is possible to provide the ultrafine heat pipes 1, 2, 3, 4, and 5 that can obtain a sufficient heat transporting ability regardless of the orientation of the portable device 31 in which the posture to be used is not determined.
  • the shape of the heat pipe is preferably a substantially U-shaped ultrathin heat pipe 1 or 2, a substantially L-shaped ultrathin heat pipe 3, or a substantially B-shaped ultrathin heat pipe 4 or 5. .
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 are arranged along a part of the CPU 34 of the portable device 31 and the outer peripheral portion 38 of the portable device 31. Thereby, as described above, it is possible to provide the ultrafine heat pipes 1, 2, 3, 4, and 5 in a form suitable for the thermal diffusion of the portable device 31 such as a smartphone.
  • the CPU 34 and the portable device of the portable device 31 are used in the ultrafine heat pipes 1, 2, 3, 4, and 5 in which the working fluid 13 is sealed in the inner grooved copper tube 12 in which the groove 11 is formed on the inner wall.
  • the fine heat pipes 1, 2, 3, 4, and 5 are arranged along a part of the outer peripheral portion 38 of 31.
  • the heat generated from the CPU 34 is conveyed to the outer peripheral portion of the portable device 31 by the ultrafine heat pipes 1, 2, 3, 4, and 5, and the user holds the portable device 31 by hand. Then, heat is effectively radiated from the hand touching the outer peripheral portion 38 to the outside. Therefore, it is possible to provide ultrafine heat pipes 1, 2, 3, 4, and 5 in a form suitable for thermal diffusion of the mobile device 31 such as a smartphone.
  • a part corresponding to the heat radiating part 17 of the ultrafine heat pipes 1, 2, 3, 4 is formed between the outer peripheral part 38 of the portable device 31 and the battery pack 37 that is a charging means that can be attached to and detached from the portable device 31 It is preferable to arrange between them.
  • the heat pipe of this embodiment is attached to the same portable apparatus 31, and the heat receiving part 16 is a 1st heat pipe in a position higher than the heat radiating part 17 with respect to the direction of gravity.
  • the ultrathin heat pipe 5 as a second heat pipe in which the heat receiving portion 16 is located lower than the heat radiating portion 17 with respect to the direction of gravity.
  • a mobile device 31 such as a smartphone
  • either one of the ultrafine heat pipes 1 and 5 can perform good heat transport.
  • the performance of the heat pipe is not easily lowered, and the CPU 34 can be configured to be suitable for the portable device 31 that generates a larger amount of heat.
  • each shape of the ultrafine heat pipes 1, 2, 3, 4, and 5 shown in each embodiment is merely an example, and can be appropriately changed according to the outer shape of the mobile device 31.
  • 11 shows an example in which two ultrafine heat pipes 1 and 5 are mounted on the portable device 31, but three or more ultrafine heat pipes may be mounted.
  • the ultrafine heat pipe 1 shown in FIG. 1 and the ultrafine heat pipe 2 having another shape shown in FIG. 2 are used.
  • These ultra-fine heat pipes 1 and 2 each have a diameter of ⁇ 2 mm, and in addition to FIG. 3 described above, as shown in FIGS. 19 and 20, the material in which the groove 11 is formed on the inner wall is made of pure copper or the like. Both ends of the internally grooved copper pipe 12 are sealed by Tig welding.
  • the shape of the groove 11 is such that the fin height Hf, which is the height dimension of the convex fin formed between the adjacent grooves 11, 11, is in the range of 0.06 mm to 0.25 mm.
  • the groove bottom width Lbg which is the width of the bottom, is in the range of 0.03 mm to 0.19 mm.
  • the inside of the copper tube 12 is in a vacuum state and a working fluid 13 (not shown) such as pure water is 0.0017 cc / cm to 0.0050 cc / cm per unit length in the longitudinal direction of the copper tube 12. It is enclosed to become.
  • a working fluid 13 such as pure water
  • the configuration of the ultrafine heat pipes 1 and 2 is the same as that of the first embodiment, as shown in FIGS. 1 and 2, the copper tube 12 is applied to the bent portion 21 by an external force during bending. A slight crushing portion is formed, but apart from that, the hollow cylindrical copper tube 12 is flattened due to the space limitation for installing the ultrafine heat pipes 1 and 2 on the structure 32 of the portable information terminal 31 described later.
  • the crushing portion 25 having a substantially elliptical cross section may be formed by processing, and may be installed in the structure 32.
  • FIG. 19 show the copper tube 12 in a portion where the crushed portion 25 is not formed
  • FIG. 20 shows the copper tube 12 in a portion where the crushed portion 25 is formed by flattening.
  • the portable information terminal 31 according to the present embodiment is equivalent to the portable device according to the first embodiment, and the entire outline is formed by a vertically long and substantially rectangular structure 32 having an outer dimension that can be held by a hand.
  • a display 33 corresponding to the touch panel of the first embodiment is disposed as a display unit in which the input device and the display device are integrated.
  • a CPU (Central Processing Unit) 34 that is a control unit of the portable information terminal 31 and other various electronic components 35 are accommodated in a state of being mounted on the printed circuit board 36, and the structure Below the inside of the body 32, a battery pack 37, which is a substantially rectangular charging means that can be charged for supplying necessary power to the CPU 34 and the electronic component 35, is detachably accommodated.
  • typical external dimensions of a smartphone that is the portable information terminal 31 are 67 mm in width, 130 mm in height, and 8.3 mm in thickness
  • the external dimensions of the battery pack 37 are 53 mm in width, 58 mm in height, and thickness. 4.8 mm.
  • the ultrathin heat pipes 1 and 2 are continuously provided with a groove 11 having a wick structure from one end to the other end of the copper tube 12 without interruption.
  • the ultrafine heat pipes 1 and 2 are partly arranged as heat receiving parts 16 so as to be able to transfer heat to the CPU 34 that is a heat generating body of the portable information terminal 31, and the other part is portable as the heat radiating part 17.
  • the information terminal 31 is arranged along with a part of the outer peripheral portion 38 in the vicinity of the outline of the structure 32. Thereby, the size is limited from the viewpoint of easiness to hold, and even the portable information terminal 31 such as a smartphone in which the battery pack 37 can be attached and detached is attached with the ultra-fine heat pipes 1 and 2 as shown in FIG. 1 and FIG. be able to.
  • the outer diameter OD (see FIG. 19) of the ultrafine heat pipes 1 and 2 is preferably ⁇ 2.5 mm or less.
  • FIGS. 14 and 15 there is a method of transferring heat to the heat receiving portion 16 of the ultrafine heat pipe 1 through a heat receiving plate 51 made of a material having good heat conductivity such as copper.
  • the heat receiving plate 51 shown in FIGS. 14 and 15 is formed by forming a substantially U-shaped concave bent portion 53 on one side of a flat heat receiving portion 52 that is in close contact with the heat generating surface of the CPU 34.
  • the heat receiving portion 16 of the cylindrical heat pipe 1 is surrounded by an inner surface of a concave bent portion 53 formed on the heat receiving plate 51.
  • the heat receiving portion 52 of the heat receiving plate 51 has a heat receiving surface, which is one surface, in close contact with the heat generating surface of the CPU 34.
  • the ultrafine heat pipe 1 is connected to the side of the heating element such as the CPU 34 via a heat conductor such as the heat receiving plate 51.
  • a heat conductor such as the heat receiving plate 51.
  • the portable information terminal 31 such as a smartphone often holds the outer peripheral portion 38 of the outer shell of the portable information terminal 31 by hand, it transfers heat from the heat radiating portion 17 of the ultrafine heat pipe 1 to the outer peripheral portion 38. This is advantageous for cooling. At that time, as shown in FIG.
  • a groove having a substantially U-shaped cross section in the structure 32 is positioned between the outer peripheral portion 38 of the portable information terminal 31 and the structure 32 and the outer surface of the battery pack 37.
  • the heat dissipating part 17 of the ultrafine heat pipe 1 into the groove 39 ′, good heat transfer is possible.
  • the heat from the CPU 34 can be directly transmitted to the ultrafine heat pipes 1 and 2 without providing the heat receiving plate 51.
  • reference numeral 40 denotes a back cover that is mounted so as to cover the back side of the structure 32, and the back cover 40 forms the outer back of the portable information terminal 31.
  • FIG. 23 and FIG. 24 show an example in which the ultrafine heat pipes 3 and 4 having shapes different from the ultrafine heat pipes 1 and 2 described above are individually attached to the portable information terminal 31.
  • the ultrafine heat pipe 3 shown in FIG. 23 is bent at about 90 ° at one midpoint of the copper tube 12 to form a bent portion 21 at that portion, and a linear base portion. It is formed in a substantially L shape in which a straight arm portion 23 is connected to one end of 22 via a bent portion 21.
  • a part of the fine heat pipe 3 here is arranged as a heat receiving part 16 so as to be able to transfer heat with the CPU 34, and the other part is used as a heat radiating part 17, and a part of the outer peripheral part 38 of the structure 32. Are fitted and arranged in the groove 39 ′ of the structure 32.
  • the ultra-fine heat pipe 3 shown in FIG. 24 is bent at about 90 ° in the middle of the copper tube 12 to form bent portions 21 at the portions, and bent at both ends of the linear base portion 22.
  • a straight arm portion 23 is connected via the portion 21, and the both ends of the arm portion 23 are formed in a substantially square shape connecting the straight folded portion 24 via another bent portion 22.
  • a part of the extra-fine heat pipe 4 is arranged as a heat receiving part 16 so as to be able to transfer heat with the CPU 34, and the other part as a heat radiating part 17, a part of the outer peripheral part 38 of the structure 32. Are fitted and arranged in the groove 39 ′ of the structure 32.
  • FIG. 25 shows an example in which, in addition to the ultrafine heat pipe 1 described above, an ultrafine heat pipe 5 having a different shape is mounted in the structure 32 of one portable information terminal 31.
  • the ultrafine heat pipe 5 is bent at about 90 ° at four locations along the copper tube 12 to form bent portions 21 at the respective portions, and the bent portions 21 are provided at both ends of the linear base portion 22.
  • the straight arm portions 23 are connected to each other, and the both ends of the arm portions 23 are connected to the straight folded portions 24 via other bent portions 21.
  • a part of the fine heat pipe 5 here is arranged as a heat receiving part 16 in a state capable of transferring heat to the CPU 34, and the other part is used as a heat radiating part 17, and a part of the outer peripheral part 38 of the structure 32. Is disposed above the inside of the structure 32.
  • the other configurations of the ultrafine heat pipes 3, 4 and 5 are the same as those of the ultrafine heat pipes 1 and 2, and the cross-sectional shape of the ultrafine heat pipe 2 shown in FIGS. The same applies to the heat pipes 1, 3, 4, and 5.
  • the configuration of the portable information terminal 31 shown in FIGS. 23 to 25 is also the same as that shown in FIGS. 22 to 25 all employ a configuration in which heat from the CPU 34 is directly transmitted to the heat receiving portions 16 of the ultrafine heat pipes 2, 3, 4, and 5, but as shown in FIGS. 14 and 15, You may employ
  • the shape of the heat pipe mounted in the portable information terminal 31 is not linear, but is substantially U-shaped (extra-fine heat pipes 1 and 2), substantially L-shaped (extra-fine heat pipe 3), Since it has a substantially square shape (extra-fine heat pipes 4, 5), the distance (drop) in the direction of gravity between the heat receiving portion 16 and the heat radiating portion 17 does not increase even if the length of the heat radiating portion 17 is sufficiently secured. Thereby, the fall of the heat transport capability as the ultrafine heat pipes 1, 2, 3, 4, and 5 can be prevented.
  • a plurality of ultrafine heat pipes 1 and 5 are attached to a portable information terminal 31 such as a smartphone, and the heat receiving portion 16 of one ultrafine heat pipe 5 in a certain use posture is Even if the heat receiving unit 16 is located higher than the heat radiating unit 17, the heat receiving unit 16 of the other ultrafine heat pipe 1 is disposed at a position lower than the heat radiating unit 17 with respect to the direction of gravity. Thereby, even if the user's usage posture of the portable information terminal 31 is turned upside down, one of the ultrafine heat pipes 1 and 5 has the heat receiving portion 16 positioned lower than the heat radiating portion 17 in the direction of gravity. In any direction of use, good heat transport can be performed by either of the fine heat pipes 1 and 5. This can be said to be an optimal configuration when the usage posture of the portable information terminal 31 is not constant and the amount of heat generated by the CPU 34 is larger, such as the portable information terminal 31 such as a smartphone.
  • the fin height Hf is too low than 0.06 mm, the capillary force generated in the groove 11 is insufficient, and if the fin height Hf is too high than 0.25 mm, FIG.
  • the internal space of the copper pipe 12 that becomes a steam passage is closed.
  • the amount of the hydraulic fluid 13 enclosed is less than 0.0017 cc / cm, the amount of heat transported with respect to the amount of heat generated in the CPU 34 which is a heating element is insufficient, and conversely the amount of hydraulic fluid 13 enclosed is 0.0050 cc / cm. If the amount is too much, the problem arises that the fine heat pipe 1 swells when the hydraulic fluid 13 freezes.
  • the thickness a of the crushed portion 25 which is a flat portion after flattening is in the range of 0.6 to 1.5 mm, and the width b is 2.2 to 5.2 mm.
  • the flattening is performed by adjusting the diameter OD of the copper tube 12 so as to be within the range of.
  • the flatness which is the ratio of the width b to the thickness a of the crushed portion 25, falls within the range of 0.115 to 0.682.
  • the upper limit of the flatness may be less than 1 in consideration of flattening the copper tube 12 having a circular cross section.
  • ultra-thin heat pipes 1, 2, 3, 4, and 5 having an aspect ratio a / b of 0.115 ⁇ a / b ⁇ 1 are mounted on the portable information terminal 31 such as a smartphone, The thickness and width of a certain structure 32 can be further reduced.
  • the ultrafine heat pipe 1 shown in FIG. 26 applies a flattening process to the heat receiving portion 16 to form a crushed portion 25.
  • the heat connection between the heat receiving portion 16 of the ultrafine heat pipe 1 and the CPU 34 is achieved.
  • the portions other than the heat receiving portion 16 of the ultrafine heat pipe 1 are not flattened and remain circular in cross section. Therefore, the heat radiating portion 17 of the ultrafine heat pipe 1 is disposed between the battery pack 37 and the outer peripheral portion 38 of the structure 32 while maintaining a circular cross section.
  • Other configurations are completely the same as those shown in FIG.
  • the CPU 34 and the battery pack 37 are different in shape, the CPU 34 has a space in the width direction, but the space in the thickness direction cannot be secured. Although it is easy to take installation space in the thickness direction, it is difficult to take installation space in the width direction. Therefore, as in the ultrathin heat pipe 1 shown in FIG. 26, only the heat receiving portion 16 is flattened, whereby the ultrathin heat pipe 1 is arranged on the upper surface of the CPU 34 and the outer peripheral portion 38 of the battery pack 37 and the structure 32.
  • the thickness and width of the portable information terminal 31 such as a smartphone can be further reduced by arranging the heat dissipating part 17 of the ultrafine heat pipe 1 having a circular cross section.
  • the ultrafine heat pipe 1 shown in FIG. 27 flattenes not only the heat receiving portion 16 but also the heat radiating portion 17 to form a crushed portion 25, but the bent portion 21 which is a curved portion is not flattened and has a circular cross section. Leave.
  • the reason for performing the flattening process except for the bent portion 21 is that when the bent portion 21 is flattened, the performance as the ultrafine heat pipe 1 is extremely lowered. If the bending part 21 of the extra-fine heat pipe 1 is not flattened, the heat from the CPU 34 can be transported by the extra-fine heat pipe 1 without any trouble, so that the cooling performance can be improved, and the parts other than the bent part 21 can be provided.
  • the portable information terminal 31 such as a smartphone can be thinned.
  • Other configurations are completely the same as those shown in FIG.
  • FIG. 28 is a partial development plan view of the ultrafine heat pipe 1 described above.
  • a looped or spiral groove 11 that is twisted or skewed with respect to the straight (axial) direction of the copper tube 12 is formed on the cylindrical inner surface of the copper tube 12 constituting the ultrafine heat pipe 1.
  • the angle (tilt angle) ⁇ of the groove 11 with respect to the length direction of the copper tube 12 is in the range of 2 to 50 °.
  • the groove depth of the groove 11 here is 0.15 mm.
  • the heat dissipating part 17 of the ultrafine heat pipe 1 When the heat dissipating part 17 of the ultrafine heat pipe 1 is cooled from the outside of the structure 32, the heat dissipating part 17 of the ultrafine heat pipe 1 is strongly cooled on one side with respect to the circumferential direction orthogonal to the length direction. 1
  • the working fluid 13 inside condenses and remains in the cooled area on one side.
  • the groove 11 formed on the inner surface of the ultrafine heat pipe 1 is twisted, for example, in a spiral shape, the working fluid 13 uniformly enters the entire groove 11, and the performance of the ultrafine heat pipe 1. The decline is unlikely to occur.
  • strength of the ultrafine heat pipe 1 improves by not forming the groove
  • the configuration of the ultrafine heat pipe 1 shown in FIGS. 26 to 28 can be similarly applied to the other ultrafine heat pipes 2, 3, 4, and 5.
  • FIG. 29 shows a cross-sectional shape of the ultrafine heat pipe 2 different from those shown in FIGS.
  • the ultrafine heat pipe 2 shown here has a groove bottom width Lbg of the groove 11 formed on the inner surface of the grooved copper tube 12 of 0.08 to 0.14 mm, and is the width dimension of the upper end portion of the groove 11.
  • the groove 11 having a groove upper end width Ltg of about 0.03 mm and a groove upper end width Ltg narrower than the groove bottom width Lbg is formed.
  • the capillary force of the groove 11 formed on the inner surface of the ultrafine heat pipe 2 becomes strong, and the performance of the ultrafine heat pipe 2 even in the top heat posture where the heat receiving portion 16 is higher than the heat radiating portion 17. The decrease is less likely to occur.
  • the configuration of the ultrafine heat pipe 2 shown in FIG. 29 can be applied to the other ultrafine heat pipes 1, 3, 4, and 5 in the same manner.
  • a display 33 as a display unit and a CPU 34 as a heating element are incorporated in a structure 32 that is a single casing.
  • This is a foldable type in which two casings as in Patent Document 2 are rotatably connected by a hinge mechanism, and a heating element is incorporated in one casing while a display unit is incorporated in another casing.
  • the fundamental structure is different from the portable information terminal.
  • the fine heat pipes 1, 2, 3, 4, and 5 are mounted on the structure 32 together with the display 33 and the CPU 34.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 that diffuse the heat from the CPU 34 may be mounted in one structure 32 that constitutes the portable information terminal 31, and the ultrafine heat pipes 1, 2, and 3 are installed. , 4, and 5 that do not need to be added to the space of the limited structure 32 so as to impair the heat transport capability.
  • the display 33 is arranged on the front (front) side of the structure 32, whereas the CPU 34 and the ultrafine heat pipes 1, 2, 3, 4, and 5 are on the back side of the structure 32 that is closed by the back cover 40.
  • the heat transfer from the CPU 34 can be efficiently performed on the back side of the structure 32 while minimizing the thermal influence on the front side of the structure 32.
  • the portable information terminal 31 such as a smartphone is often used while the palm is in contact with the back surface from the side surface of the portable information terminal 31, the ultra-fine heat pipes 1, 2, 3, only on the back side of one structure 32.
  • Arranging 4 and 5 in a concentrated manner is a very advantageous configuration for efficiently dissipating the heat generated from the CPU 34 through the user's hand.
  • the heat radiating portion 15 of the ultrafine heat pipe 1 has a tip portion disposed between the outer peripheral portion 38 of the structure 32 and the battery pack 37. Between the outer peripheral portion 38 of the structure 32 and the battery pack 37 is a so-called dead space where no other components are mounted.
  • the tip of the heat radiating part 17 of the extra fine heat pipe 1 is not stable in shape and the performance as the extra fine heat pipe 1 is inferior to other parts, so the tip of the heat radiating part 17 of the extra fine heat pipe 1 is in this dead space. By disposing the portion, it is possible to avoid interference with other components inside the structure 32 that is a casing.
  • the structure 32 is preferably a metal body that is a member having good thermal conductivity.
  • the heat dissipating part 17 of the ultrafine heat pipe 1 is fitted in a groove 39 ′ provided in a structure 32 made of a metal such as aluminum, and the heat connection is performed. It has become.
  • the portable information terminal 31 having excellent heat dissipation from the structure 32 to the user's hand or the atmosphere can be obtained, and the cooling effect of the portable information terminal 31 is increased.
  • the ultrafine heat pipe 1 acts as a defrosting means for removing frost attached to the metal structure 32, and heat exchange between the heat radiating portion 17 of the ultrafine heat pipe 1 and the structure 32 is performed. Thus, frost on the structure 32 can be prevented.
  • the groove 39 ′ provided in the structure 32 is located not only between the outer peripheral portion 38 of the structure 32 and the outer surface of the battery pack 37 as described above, but also in the heat radiation area between the CPU 34 and the battery pack 37. You may let them.
  • a heat radiating region is formed in the structure 32 between the heat receiving portion 16 and the battery pack 37.
  • the thermal influence on the battery pack 37 can be avoided.
  • Such a configuration of the ultrafine heat pipe 1 can be similarly applied to the other ultrafine heat pipes 2, 3, 4, and 5.
  • the operation of the above configuration will be described.
  • the heat from the CPU 34 is very fine heat pipes 1, 2, 3, 4, 5, the hydraulic fluid 13 evaporates in the heat receiving portion 16, and steam flows from the heat receiving portion 16 toward the heat radiating portion 17 having a low temperature, and the inside of the ultrafine heat pipes 1, 2, 3, 4, 5 Heat transport takes place at
  • the heat transported to the heat radiating part 17 reaches the structure 32 thermally connected to the heat radiating part 17, and the user's hand touching the outer peripheral part 38 from the outer peripheral part 38 of the outer shell of the portable information terminal 31.
  • the heat is radiated to the outside of the portable information terminal 31 through the terminal.
  • the steam is condensed and the working liquid 13 is accumulated, and in the heat receiving part 16, the working liquid 13 is reduced by evaporation.
  • the working fluid 13 is returned from the heat radiating portion 17 to the heat receiving portion 16 by utilizing the capillary force generated in the groove 11 formed on the inner wall of the inner surface grooved copper tube 12.
  • the heat receiving unit 16 is located higher than the heat radiating unit 17 with respect to the direction of gravity due to the use posture of the portable information terminal 31, a sufficient amount of the hydraulic fluid 13 returns to the heat receiving unit 16 due to the influence of gravity. This leads to a decrease in the performance of the ultrafine heat pipes 1, 2, 3, 4, and 5.
  • the fin height Hf that defines the shape of the groove 11 is 0.06 mm or more which is a specified value
  • the groove bottom width Lbg is 0.19 mm or less which is a specified value.
  • the ultra-fine heat pipes 1, 2, 3, 4, and 5 mounted on the portable information terminal 31 it is important to obtain a sufficient capillary force.
  • the sealed amount per unit length of the hydraulic fluid 13 is a specified value of 0.0017 cc / cm or more
  • the groove bottom width Lbg that defines the shape of the groove 11 is a specified value of 0.03 mm or more. It is also important to ensure a sufficient amount of the working fluid 13 in the heat receiving section 16 as the ultrafine heat pipes 1, 2, 3, 4, and 5 mounted on the portable information terminal 31 such as a smartphone. And the influence of gravity mentioned above becomes large, so that the distance (drop) in the direction of gravity is large.
  • the outer shape of the heat pipe is substantially U-shaped (extra-fine heat pipes 1, 2), substantially L-shaped (extra-fine heat pipe 3), or substantially U-shaped (extra-fine heat pipes 4, 5). ) So that the distance (head) does not increase in the direction of gravity even if the heat radiation portion 17 is formed long.
  • the ultra-fine heat pipes 1, 2, 3, 4, and 5 are not easily affected by gravity and are mounted on the portable information terminal 31 such as a smartphone. As the ultrafine heat pipes 1, 2, 3, 4 and 5, the heat transport capacity can be prevented from decreasing.
  • the other ultrafine heat pipe is used. Since the plurality of ultrathin heat pipes 1 and 5 are mounted in the mobile information terminal 31 such as a smartphone so that the heat receiving unit 16 of 5 is positioned lower than the heat radiating unit 17 with respect to the direction of gravity, the mobile information terminal 31 Regardless of the orientation of use, the heat transfer is always carried out by one of the fine heat pipes 1 and 5 and the heating element of the heating element is mounted like the CPU 34 mounted on the portable information terminal 31 such as a smartphone. When the heat generation amount is larger, an optimum configuration can be obtained.
  • the capillary height generated in the groove 11 is sufficiently appropriate by setting the fin height Hf that is the shape of the groove 11 to 0.06 mm or more and the groove bottom width Lbg to 0.19 mm or less. Further, the amount of the hydraulic fluid 13 sealed per unit length is set to 0.0017 cc / cm or more, and the groove bottom width Lbg that forms the groove 11 is set to 0.03 mm or more. A sufficient amount of hydraulic fluid 13 is secured, and the ultrafine heat pipes 1, 2, 3, 4, and 5 having excellent heat transport capability are mounted on the portable information terminal 31 regardless of the usage posture of the portable information terminal 31. Is possible.
  • the hydraulic fluid 13 is frozen by setting the amount of the hydraulic fluid 13 sealed in the ultrafine heat pipes 1, 2, 3, 4, and 5 to a specified amount of 0.0050 cc / cm or less per unit length. Even in this case, the ultrafine heat pipes 1, 2, 3, 4, and 5 can be prevented from expanding. Moreover, when the fin height Hf, which is the shape of the groove 11, is set to 0.25 mm or less, the ultra-fine heat pipes 1, 2, 3, 4, 5 are flattened in response to the thinning of the portable information terminal 31. In addition, even in the crushing portion 25, the internal space of the copper tube 12 is not blocked, and a sufficient steam passage is ensured, so that reliable heat transport by the ultrafine heat pipes 1, 2, 3, 4, and 5 becomes possible.
  • both ends of the copper tube 12 are sealed, and the ultrafine heat pipes 1, 2, 3, 4, 5 formed by enclosing the working fluid 13 therein are used as portable information such as smartphones. It is installed in the terminal 31.
  • a normal mobile phone generates a small amount of heat, but since the portable information terminal 31 such as a smartphone operates various applications, the amount of heat generated from a heating element such as the CPU 34 is large. Therefore, by installing the above-described ultrafine heat pipes 1, 2, 3, 4, and 5 in the portable information terminal 31, heat from a heating element such as the CPU 34 can be effectively transported to the low temperature part.
  • the portable information terminal 31 is a smartphone or a tablet terminal
  • the heat from a heating element such as the CPU 34 can be effectively transported to the low temperature part, particularly as a smartphone or a tablet terminal.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 installed in the portable information terminal 31 are subjected to flattening processing with a thickness of 1.5 mm or less.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 cannot be mounted on the portable information terminal 31.
  • 1, 2, 3, 4, and 5 can be flattened to a thickness of 1.5 mm or less, so that it is possible to install ultrafine heat pipes 1, 2, 3, 4, and 5 in the gap of the portable information terminal 31.
  • the portable information terminal 31 of this embodiment seals both ends of the inner surface grooved copper tube 12 having a diameter OD of ⁇ 2.5 mm or less and formed the groove 11 on the inner surface, and encloses the working fluid 13 therein. It is configured by installing ultra-fine heat pipes 1, 2, 3, 4, and 5, which are groove type heat pipes.
  • the diameter OD of the copper tube 12 constituting the ultrafine heat pipes 1, 2, 3, 4, 5 is made to be ⁇ 2.5 mm or less, small portable information such as a smartphone having a size that can be easily held by the user's hand.
  • Ultrafine heat pipes 1, 2, 3, 4, and 5 having excellent heat transport capability can be installed inside the terminal 31.
  • effective heat diffusion is enabled by the ultrafine heat pipes 1, 2, 3, 4, and 5, and heat spots generated in the outline of the portable information terminal 31 can be alleviated.
  • the groove 11 has a shape of a groove-type ultrafine heat pipe 1, 2 having a fin height Hf of 0.06 mm to 0.25 mm and a groove bottom width Lbg of 0.03 mm to 0.19 mm. , 3, 4 and 5 are installed in the portable information terminal 31.
  • the fin height Hf of the groove 11 formed on the inner surface of the ultrafine heat pipes 1, 2, 3, 4, 5 is 0.06 mm to 0.25 mm, and the groove bottom width Lbg is 0.03 mm to 0.19 mm.
  • the capillary force generated in the groove 11 is made appropriate, a sufficient amount of the working fluid 13 is secured in the heat receiving portion 16 of the ultrafine heat pipes 1, 2, 3, 4, and 5, and the portable information terminal 31 Even if the ultra-fine heat pipes 1, 2, 3, 4, and 5 are flattened in response to the reduction in thickness, the internal space that becomes the vapor path of the ultra-fine heat pipes 1, 2, 3, 4, and 5 is not blocked. can do.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 having excellent heat transport capability can be installed inside a small and thin portable information terminal 31 such as a smartphone having a size that can be easily held by the user's hand.
  • excellent heat diffusion is enabled by the ultrafine heat pipes 1, 2, 3, 4, and 5, and a heat spot generated in the outer shell of the portable information terminal 31 can be alleviated.
  • the groove-type ultrafine heat pipes 1, 2, 3, 4, 5 in which the sealed amount of the hydraulic fluid 13 is 0.0017 cc / cm to 0.0050 cc / cm per unit length are provided as portable information terminals. 31 is installed inside.
  • the amount of hydraulic fluid sealed in the ultrafine heat pipes 1, 2, 3, 4, 5 is 0.0017 cc / cm to 0.0050 cc / cm per unit length of the ultrafine heat pipes 1, 2, 3, 4, 5
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 having excellent heat transport capability can be installed inside a small portable information terminal 31 such as a smartphone having a size that can be easily held by the user.
  • excellent heat diffusion is enabled by the ultrafine heat pipes 1, 2, 3, 4, and 5, and a heat spot generated in the outer shell of the portable information terminal 31 can be alleviated.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 mounted on the portable information terminal 31 have a diameter OD of ⁇ 2.5 mm or less and diffuse heat generated from the CPU 34 that is a heating element. Is arranged.
  • a small portable information terminal such as a smartphone having a size that can be easily held by a user's hand by setting the diameter of the copper tube 12 constituting the ultrafine heat pipes 1, 2, 3, 4, 5 to ⁇ 2.5 mm or less. Also inside 31, ultrafine heat pipes 1, 2, 3, 4, and 5 having excellent heat transport capability can be installed. Further, since the heat generated from the CPU 34 as a heating element can be effectively diffused from the periphery of the CPU 34 by the ultrafine heat pipes 1, 2, 3, 4, and 5, the portable information terminal is particularly located near the CPU 34. The heat spot generated in the outline of 31 can be relaxed.
  • the portable information terminal 31 receives heat generated from the CPU 34 that is a heat generator by a heat receiving plate 51 as a heat conductor, and the heat pipe 51 is arranged on the side of the CPU 34 through the heat receiving plate 51.
  • the structure which transmits to the heat receiving part 16 of 1, 2, 3, 4, 5 is employ
  • the portable information terminal 31 of this embodiment forms the groove
  • the structure 32 and the heat radiating portion 17 have a small surface area.
  • the contact area of the extra fine heat pipes 1, 2, 3, 4 and 5 with the heat radiating portion 17 can be increased as much as possible, and the heat from the radiating portion 17 of the extra fine heat pipes 1, 2, 3, 4, and 5 can be obtained. It is easy to convey to the structure 32, and the heat conduction between the ultrafine heat pipes 1, 2, 3, 4, 5 and the structure 32 can be made excellent. Thereby, the heat spot which arises in the outline of portable information terminal 31 can be eased further.
  • the portable information terminal 31 of the present embodiment is applied to a smartphone in which a CPU 34 as a heating element and a display 33 as a display body are incorporated in a single structural body 32 that is a single housing.
  • Ultrafine heat pipes 1, 2, 3, 4, and 5 are mounted on the structure 32 so as to diffuse the generated heat.
  • a display body having a temperature lower than that of the heating element is incorporated from the heating element incorporated in one casing.
  • a flexible heat conducting member must be connected in the middle of the heat pipe.
  • the portable information terminal 31 such as a smartphone capable of realizing a compact structure while maximizing the heat transport capability of the ultrafine heat pipes 1, 2, 3, 4, and 5.
  • the grooves 11 formed on the inner surfaces of the ultrafine heat pipes 1, 2, 3, 4, and 5 are twisted instead of linear.
  • the heat radiating portion 17 of the ultrafine heat pipes 1, 2, 3, 4, 5 is cooled from the outside of the structure 32 by cooling or a heat radiating member, the heat radiating portions of the ultrafine heat pipes 1, 2, 3, 4, 5 are obtained. 17 is strongly cooled on one side with respect to the circumferential direction, and by this cooling, the working fluid 13 inside the ultrafine heat pipes 1, 2, 3, 4 and 5 is condensed and remains in the cooled region on one side.
  • the groove 11 formed on the inner surface of the pipes 1, 2, 3, 4, 5 is twisted in a spiral shape, the working fluid 13 enters the entire groove 11, and the heat pipes 1, 2, 3, 4, 5 is less likely to cause performance degradation.
  • the strength of the ultrafine heat pipes 1, 2, 3, 4, and 5 can be improved by not forming the groove 11 in a straight line along the length direction of the ultrafine heat pipes 1, 2, 3, 4, and 5. Can do.
  • the portable information terminal 31 in the present embodiment is configured such that a part of the ultrafine heat pipes 1, 2, 3, 4, and 5 is a flattened portion 25 that is flattened in cross section, and the remaining portion is circular in cross section. Is done.
  • the space around the CPU 34 which is a heating element, tends to take an installation space in the width direction, but an installation space in the thickness direction cannot be taken.
  • the space around the battery pack 37 can easily be set in the thickness direction, but is difficult to set in the width direction. Therefore, the casing size (thickness / width) of the portable information terminal 31 such as a smartphone can be further reduced by flattening only the heat receiving portions 16 of the ultrafine heat pipes 1, 2, 3, 4, and 5. it can.
  • the portable information terminal 31 in this embodiment forms the bending part 21 used as a curved part in the ultrathin heat pipes 1, 2, 3, 4, and 5, and forms parts other than this bent part 21 in flat cross-section. Yes.
  • the bending portion 21 of the ultrafine heat pipes 1, 2, 3, 4 and 5 is not flattened so that it has excellent cooling performance, and the portions other than the bending portion 21 are flattened.
  • the portable information terminal 31 can be thinned.
  • the crushing portion 25 which is a flattened portion of the ultrafine heat pipes 1, 2, 3, 4 and 5 has a flatness ratio a / b which is a ratio of a thickness a to a width b of 0. Flattening is performed so that 115 ⁇ a / b ⁇ 1.
  • the casing of the portable information terminal 31 is obtained by flattening the ultrafine heat pipes 1, 2, 3, 4, and 5 while ensuring the heat transport amount necessary for cooling the portable information terminal 31 such as a smartphone.
  • the size (thickness / width) can be further reduced.
  • the portable information terminal 31 in the present embodiment is provided with a crushing portion 25 as a flat portion having a flat cross section in the ultrafine heat pipes 1, 2, 3, 4 and 5, and the thickness a of the crushing portion 25 is set to 0.6. To 1.5 mm and the width b to 2.2 to 5.2 mm.
  • the casing of the portable information terminal 31 is obtained by flattening the ultrafine heat pipes 1, 2, 3, 4, and 5 while ensuring the heat transport amount necessary for cooling the portable information terminal 31 such as a smartphone.
  • the size (thickness / width) can be further reduced.
  • the groove 11 formed on the inner surface of the ultrafine heat pipes 1, 2, 3, 4 and 5 in this embodiment has a groove upper end width Ltg narrower than the groove bottom width Lbg.
  • the capillary force of the grooves formed on the inner surfaces of the ultrafine heat pipes 1, 2, 3, 4 and 5 becomes strong, and the performance of the ultrafine heat pipes 1, 2, 3, 4, and 5 is deteriorated even in the top heat posture. Can be made difficult to occur.
  • the heat dissipating part 17 of the ultrafine heat pipes 1, 2, 3, 4, and 5 in this embodiment is between the outer peripheral part 38 of the structure 32 whose tip is a housing and the battery pack 37 that is a battery. Be placed.
  • the shape of the tip of the heat radiating part 17 of the ultrafine heat pipes 1, 2, 3, 4 and 5 is not stable, and the performance as the ultrafine heat pipes 1, 2, 3, 4, and 5 is better than other parts. Therefore, by disposing the battery pack 37 between the outer peripheral portion 38 of the structure 32 which is a so-called dead space of a portable information terminal such as a smartphone, interference with other components inside the structure 32 is avoided. be able to.
  • the heat radiation portions of the ultrafine heat pipes 1, 2, 3, 4, and 5 are thermally connected to the structure 32 that is a metal body.
  • the portable information terminal 31 excellent in heat dissipation from the structure 32, which is a metal body, to the user's hand or the atmosphere can be provided, and the cooling effect can be increased.
  • the ultrafine heat pipes 1, 2, 3, 4, and 5 are provided as defrosting means for removing frost attached to the structure 32 that is a metal body.
  • the portable information terminal 31 of this embodiment has provided the heat dissipation area
  • the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.
  • the shapes of the ultrafine heat pipes 1, 2, 3, 4, and 5 shown in the embodiments are merely examples, and can be appropriately changed according to the outer shape of the portable information terminal 31 such as a smartphone.
  • FIG. 25 shows an example in which two ultrafine heat pipes 1 and 5 are mounted on the portable information terminal 31, but three or more ultrafine heat pipes may be mounted.
  • FIGS. 30 to 44 A third embodiment of the present invention will be described with reference to the attached drawings of FIGS. 30 to 44, taking a heat pipe mounted on a portable device such as a tablet terminal as an example.
  • FIG. 30 shows the appearance of the ultrafine heat pipe 61
  • FIG. 31 shows a part thereof enlarged.
  • the ultrafine heat pipe 61 as the heat pipe has an outer diameter of ⁇ 2 mm.
  • the ends of the internally grooved copper tube 12 made of pure copper or the like having a groove 11 formed on the inner wall are connected to the Tig. Sealed by welding.
  • the inside of the copper tube 12 is filled with a working fluid 13 (not shown) such as pure water in a vacuum state.
  • a working fluid 13 such as pure water in a vacuum state.
  • the copper pipe 12 instead of the copper pipe 12 made of pure copper having particularly excellent thermal conductivity, for example, copper having improved workability although thermal conductivity is inferior to pure copper.
  • An alloy tube or the like may be used. Also in that case, a plurality of grooves 11 are formed on the inner wall, and the sealing portions 15 are formed by appropriate means such as Tig welding at both ends of the hollow cylindrically extending tube body, so that the inside of the tube body Is obtained in a vacuum state.
  • the outer shape of the ultrafine heat pipe 61 shown in FIG. 30 is bent at about 90 ° at two locations on the copper tube 12 to form bent portions 21 at the respective portions, and both ends of the linear base portion 22.
  • a substantially U-shape is formed by connecting a straight arm portion 23 via a bent portion 21 to the second arm portion. 30 is different in the length of the base 22 and the length of the arm 23 and the arm 23 is longer than the base 22, but the length of the base 22 and the arm 23 is bent. Changes can be made as appropriate by selecting the part 21.
  • one or a plurality of bent portions 21 of about 90 ° are formed, whereby the outer shape of the ultrafine heat pipe is also formed in a substantially L shape or a substantially U shape, or a plurality of ultrafine heat pipes. It is formed so as to form a radial shape as a whole.
  • the extra fine heat pipe 61 here is provided as the heat receiving part 16 where the base 22 receives heat from the heat generating component, and the heat receiving part 17 where the arm part 23 releases the heat received by the heat receiving part 16 to the outside. .
  • the copper tube 12 is slightly crushed in the bent portion 21 due to external force during bending, but is flattened according to the space in which the extra-fine heat pipe 61 is attached to the portable device 71 described later. In some cases, the crushed portion is formed or left uncrushed.
  • the portable device 71 such as a tablet terminal that accommodates the ultrafine heat pipe 61
  • the portable device 71 has an outer dimension that can be easily carried by a user, and has a vertically long and substantially rectangular casing 72 and a flat display that closes the front-side opening of the casing 72.
  • 73 forms a flat outline as the portable device 71.
  • a CPU Central Processing Unit
  • 74 that is a control unit of the portable device 71 and other various electronic components 75 are mounted on a main printed circuit board (Maine PCB) 76 that is a board.
  • Maine PCB main printed circuit board
  • a battery pack 77 that is a charging device having a flat and substantially rectangular shape that can be charged to supply necessary power to the CPU 74 and the electronic component 75 is detachably stored in the portable device 71.
  • a touch panel unit 78 in which the input device and the display device are integrated is disposed on the front side of the display 73, while the back surface of the display 73 facing the opening of the housing 72 is flat aluminum with no unevenness.
  • the metal plate 79 is used.
  • the touch panel portion 78 is disposed so as to be exposed on the front surface of the portable device 71 so as to be touched by a user's finger.
  • the two ultrafine heat pipes 61 and 61 ′ having the same shape shown in FIGS. 30 to 32 (hereinafter, the heat pipes having the same shape are denoted by the same numerals, In order to distinguish between the heat pipes, the other heat pipe is marked with a “′” after the number.)
  • each of the heat pipes is housed and arranged in the housing 72 with the heat receiving portion 16 thermally connected to the CPU 74.
  • the One arm portion 23 forming a part of the ultrafine heat pipes 61 and 61 ′ is disposed in a gap between the functional components such as the main printed circuit board 76 and the battery pack 77 of the portable device 71 and the functional components.
  • the other arm portion 23 is disposed along the longitudinal side surface of the main printed circuit board 76, and the heat radiating portion 17 of the ultrafine heat pipes 61, 61 ′ is an outer shell 80 that forms the back surface of the casing 72 of the portable device 71, or a display.
  • 73 is configured to transfer heat to the metal plate 79 forming the back surface of 73. This can be said to be the best mode for attaching the ultrafine heat pipes 61 and 61 'to the portable device 71 such as a tablet terminal whose size is limited from the viewpoint of ease of holding.
  • the diameter which is the outer diameter of the ultrafine heat pipes 61 and 61 ', is preferably ⁇ 2.5 mm or less.
  • the material of the outer shell 80 is made of a metal having good thermal conductivity such as aluminum.
  • the outer peripheral shape of the housing 72 and the outer peripheral shape of the display 73 are the same.
  • a metal plate 79 of the display 73 shown in FIG. 35 is placed on the upper surface opening of the housing 72 shown in FIG. Is configured.
  • the two ultrafine heat pipes 61 and 61 ′ are both arranged on the upper surface of the main printed circuit board 76 so that the entire heat radiating portion 17 is thermally connected to the metal plate 79.
  • both of the two ultrafine heat pipes 61 and 61 ′ are disposed on the lower surface of the main printed circuit board 76, it is possible to thermally connect the entire heat radiating portion 17 to the outer shell 80.
  • one ultrafine heat pipe 1 is disposed on the upper surface of the main printed circuit board 76, and the other ultrafine heat pipe 61 ′ is disposed on the lower surface of the main printed circuit board 76.
  • FIGS. 36 to 39 various embodiments of the heat pipe structure including one or more ultra-fine heat pipes mounted on the portable device 71 will be described with reference to FIGS. In FIGS. 36 to 39, only the main components in the housing 72 are shown.
  • FIG. 36 shows an example in which the two ultrafine heat pipes 61, 61 'shown in FIG.
  • one arm portion 23 of the ultrafine heat pipes 61 and 61 ′ is disposed in a gap between one side surface in the longitudinal direction of the main printed circuit board 76 that is a functional component and one side surface of the battery pack 77.
  • the other arm portion 23 of the ultrafine heat pipes 61 and 61 ′ is disposed along the other side surface in the longitudinal direction of the main printed circuit board 76, and the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′ is transferred with the CPU 74. It arrange
  • FIG. 37 shows an example in which another two ultrafine heat pipes 62 and 62 ′ are accommodated in the portable device 71 in addition to the two ultrafine heat pipes 61 and 61 ′ shown in FIG. 36.
  • the ultrafine heat pipes 62, 62 ′ are bent at approximately 90 ° at one midpoint of the copper tube 12 to form a bent portion 21 at that portion, and the bent portion 21 is formed at one end of the linear base portion 22. Is formed in a substantially L-shape in which the straight arm portions 23 are connected to each other.
  • the ultrathin heat pipes 62 and 62 ′ here are partly disposed corresponding to the base portion 22 as the heat receiving portion 16 so as to be able to transfer heat to the CPU 74, and another portion corresponding to the arm portion 23 is radiating heat.
  • the portion 17 is disposed in the gap 82 along a part of the outer peripheral portion 81 of the housing 72. Therefore, even if the user places the portable device 71 such as a tablet terminal on a surface having heat insulation properties, the heat radiation portion 17 of the ultrafine heat pipes 62 and 62 ′ is in a state along a part of the outer peripheral portion 81 of the portable device 71. Since it arrange
  • FIG. 38 shows an example in which a single ultrafine heat pipe 3 having a shape different from that of the aforementioned ultrafine heat pipe 61 is accommodated in the portable device 71.
  • the ultrafine heat pipe 63 is bent at about 90 ° at two points in the middle of the copper tube 12 to form bent portions 21 at the portions, and the bent bases 21 are provided at both ends of the linear base portion 22. It is formed in a substantially U-shape in which straight arm portions 23 having the same length are connected.
  • one arm portion 23 of the ultrafine heat pipe 63 is located in the gap between the longitudinal side surface of the main printed circuit board 76 and one side surface of the battery pack 77.
  • the other arm portion 23 of the ultrafine heat pipe 63 is arranged along the other side surface in the longitudinal direction of the main printed circuit board 76, and the heat receiving portion 16 of the ultrafine heat pipe 63 can transfer heat with the CPU 74. And heat transfer from the heat radiating portion 17 to the metal plate 79 and the outer shell 80.
  • FIG. 39 shows an example in which two ultrafine heat pipes 64 and 64 ′ having a shape different from that of each of the ultrafine heat pipes 61 described above are accommodated and arranged radially in the casing 72 of the portable device 71.
  • the ultrathin heat pipes 64 and 64 ′ are bent at two different angles in the middle of the copper tube 12 to form bent portions 21 at the portions, and the bent portions 21 are formed at both ends of the linear base portion 22. It forms in the shape which connected the linear arm part 23 which has different length via.
  • one arm portion 23 of the ultrafine heat pipes 64, 64 ′ is disposed so as to cross the upper surface of the battery pack 77, and the other arm portion 23 of the ultrafine heat pipes 64, 64 ′ is
  • the main printed circuit board 76 is arranged from the other side surface in the longitudinal direction toward the outer peripheral surface 81 of the portable device 71, and the heat receiving portions 16 of the ultrafine heat pipes 64 and 64 ′ are arranged in a state capable of transferring heat to the CPU 74 to dissipate heat. Heat transfer is performed from the portion 17 to the metal plate 79 and the outer shell 80.
  • a plurality of heat receiving units 16 are used as the center. It is noted that the ultrafine heat pipes 64 and 64 ′ are arranged radially.
  • the configuration of the portable device 71 shown in FIGS. 36 to 39 is also the same as that shown in FIGS. In each example shown in FIGS. 36 to 38, the shape of the heat pipe mounted in the portable device 71 is not a straight line, but is bent at about 90 ° at one or several places to obtain a substantially L-shaped (extra-fine shape).
  • a plurality of ultrafine heat pipes 61, 61 ′, 62, 62 ′, 64, 64 ′ are installed in a portable device 71 such as a tablet terminal.
  • the heat receiving unit 16 In the positional relationship between the heat receiving unit 16 and the heat radiating unit 17 in a certain usage posture 71, the heat receiving unit 16 is located at a position higher than the heat radiating unit 17 with respect to the direction of gravity.
  • 64 and heat sinks 16 ′, 62 ′, and 64 ′ as second heat pipes in which the heat receiving part 16 is located lower than the heat radiating part 17 with respect to the direction of gravity.
  • one of the ultrafine heat pipes 61, 62, 64 has the heat receiving part 16 at a position lower than the heat radiating part 17 in the direction of gravity.
  • good heat transport is performed by either the ultrafine heat pipes 61, 62, 64 or the ultrafine heat pipes 61 ′, 62 ′, 64 ′.
  • This is advantageous for cooling the CPU 74 that is a heat generating component in the portable device 71 such as a tablet terminal in which the user's usage posture is arbitrary, and can be said to be an optimum cooling configuration for the portable device 71.
  • FIG. 40 shows the embodiment shown in FIGS. 34 and 36 described above, in which a solid block-shaped heat receiving block 91 is provided in close contact with the heat generating surface (upper surface) of the CPU 74 which is a heat generating portion.
  • the heat receiving block 91 is made of a metal material having excellent heat conductivity such as copper or aluminum, and is provided as a heat transfer member that efficiently transfers heat from the CPU 74 to the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′. .
  • FIGS. 41 to 43 Specific embodiments using the heat receiving block 91 are shown in FIGS. 41 to 43, respectively.
  • the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′ has a U-groove shape in which a part of the outer surface in the circumferential direction is formed in the heat receiving block 91. It is surrounded by the depression 92. This is because heat from the CPU 74 is easily transmitted to the heat receiving section 16 of the ultrafine heat pipes 61 and 61 ′ via the heat receiving block 91.
  • the heat receiving block 91 has a heat receiving surface which is one surface closely attached to a heat generating surface of the CPU 74.
  • a recess 92 is formed on the heat receiving surface side of the heat receiving block 91, and not only the heat receiving block 91 but also a part in the circumferential direction of the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′. It is made to adhere to CPU74. This is because the outer diameter of the ultrafine heat pipes 61 and 61 ′ is ⁇ 2.5 mm or less, so the surface area is small. Therefore, the contact area between the ultrafine heat pipes 61 and 61 ′ and the heat receiving block 91 and the CPU 74 is as large as possible. The heat is easily transmitted to the ultrafine heat pipes 61 and 61 ′ directly or through the heat receiving block 91.
  • flat processing may be applied to a part of the cylindrical heat pipes 61 and 61 '.
  • the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′ is formed in a flat shape that is crushed in one direction at a portion that fits into the recess 92. Therefore, in this case, the heat receiving block 91 can be formed thin by reducing the depth of the recess 92 compared to the case where the heat receiving portion 16 of the ultrafine heat pipes 61, 61 ′ is not flattened, and the thickness of the portable device 71 is reduced. This is effective when it is desired to reduce only the thickness in one direction.
  • FIG. 44 shows a specific embodiment in which a plate-shaped heat receiving plate 93 is provided as a heat transfer member instead of the heat receiving block 91 described above.
  • the heat receiving plate 93 is formed by forming U-groove-shaped concave bent portions 95 on both sides of a flat plate-shaped close contact portion 94 that is in close contact with the heat generating surface of the CPU 74.
  • the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′ having a cylindrical shape is surrounded by the inner surface of the concave bent portion 95 formed on the heat receiving plate 93. This is because heat from the CPU 74 is easily transmitted to the heat receiving portion 16 of the ultrafine heat pipes 61 and 61 ′ via the heat receiving plate 93.
  • the close contact portion 94 of the heat receiving plate 93 has a heat receiving surface as one surface in close contact with the heat generating surface of the CPU 74.
  • the concave bent portion 95 that protrudes closer to the CPU 74 than the close contact portion 94 is arranged so that the heat receiving portion 16 of the ultrafine heat pipes 61, 61 ′ is disposed on the side of the side surface direction of the CPU 74 having a rectangular shape.
  • the heat generated by the CPU 74 is transmitted to the ultra-fine heat pipes 61 and 61 ′ by a heat receiving plate 93 made of aluminum or copper having a thickness of 0.5 mm.
  • a heat receiving plate 93 made of aluminum or copper having a thickness of 0.5 mm.
  • the heat transported to the heat radiating unit 17 is transferred to the outside of the portable device 71 through the outer shell 80 that forms the back surface of the casing 72 that is thermally connected to the heat radiating unit 17 or the metal plate 79 that forms the back surface of the display 73. Heat is dissipated. Thereby, in the portable device 71, heat from the CPU 74 is effectively diffused, heat spots generated on the outer surface in the vicinity thereof are alleviated, and a temperature rise of the CPU 74 is also reduced.
  • the vapor is condensed and the working liquid 13 is accumulated, and in the heat receiving part 16, the working liquid 13 is reduced by evaporation.
  • the hydraulic fluid 13 is returned from the heat radiating portion 17 to the heat receiving portion 16 by utilizing the capillary force of the groove 11 formed on the inner wall of the inner grooved copper tube 12.
  • the usage posture of the portable device 71 is arbitrary, and if the heat receiving unit 16 is located higher than the heat radiating unit 17 with respect to the direction of gravity, a sufficient amount of the hydraulic fluid 13 is received by the influence of gravity.
  • one or several places of the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ are bent at about 90 °, and the outer shape thereof is substantially U-shaped (extra fine).
  • the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ are hardly affected by gravity regardless of the orientation in which the portable device 71 is used, and the ultrafine heat pipe 61 , 61 ′, 62, 62 ′, 63, 64, 64 ′ can be prevented from being deteriorated.
  • a plurality of ultrafine heat pipes 61, 61 ′, 62, 62 ′, 64, 64 ′ are installed in a portable device 71 such as a tablet terminal.
  • the heat receiving unit 16 In the positional relationship between the heat receiving unit 16 and the heat radiating unit 17 in a certain usage posture 71, the heat receiving unit 16 is located at a position higher than the heat radiating unit 17 with respect to the direction of gravity.
  • 64 and heat sinks 16 ′, 62 ′, and 64 ′ as second heat pipes in which the heat receiving part 16 is located lower than the heat radiating part 17 with respect to the direction of gravity.
  • the usage posture of the portable device 71 is turned upside down, and the heat receiving portion 16 of one of the ultrafine heat pipes 61, 62, 64 is positioned higher than the heat radiating portion 17 in the gravitational direction.
  • the heat receiving part 16 of the other ultrafine heat pipes 61 ′, 62 ′, and 64 ′ comes to a position lower than the heat radiating part 17 with respect to the direction of gravity, in which direction the usage posture of the portable device 71 is.
  • good heat transport is always performed by either one of the ultrafine heat pipes 61, 62, 64 or the ultrafine heat pipes 61 ′, 62 ′, 64 ′. This is advantageous for the cooling of the CPU 74 in the portable device 71 such as a tablet terminal in which the user's usage posture is arbitrary, and is a configuration of a cooling mode optimal for the portable device 71.
  • the heat radiating portion 17 of the ultrafine heat pipes 62 and 62 ′ is disposed along a part of the outer peripheral portion 81 of the portable device 71. Even if it is placed on a surface having heat insulation properties, heat generated from the CPU 74 or the like is dissipated from the outer peripheral portion 81 to the outside of the portable device 71 and is excellent in heat radiation properties.
  • the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, and 64 ′ as heat pipes in which the working liquid 13 is sealed in the inner grooved copper pipe 12.
  • the outer diameter, that is, the diameter of the copper tube 12 is formed to be ⁇ 2.5 mm or less, or the copper tube 12 is flattened.
  • ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, and 64 ′ that can be stored in the casing 72 of the portable device 71 such as a tablet terminal and have excellent heat transport capability are provided. it can.
  • the ultrathin heat pipes 62 and 62 ′ are arranged along the CPU 74 that is the heat generating portion of the portable device 71 and a part of the outer peripheral portion 81 of the portable device 71.
  • the heat generated from the CPU 74 is an inner surface groove with excellent thermal conductivity. Since it is carried to the outer peripheral part 81 of the portable device 71 by the ultra-fine heat pipes 62 and 62 'made of the attached copper tube 12, even when the user places the upper surface or the rear surface of the portable device 71 on a heat-insulating surface, the CPU 74 The heat can be guided to the ultrafine heat pipes 62 and 62 ′ and can be radiated to the outside from the outer peripheral portion 81 of the portable device 71, and the heat dissipation can be improved.
  • the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ are a base portion 22 and an arm portion 23 that are straight portions, and a bent portion 21 that is a curved portion. Composed.
  • the ultrafine heat pipes 61, 61 are provided. Even if the total length of ', 62, 62', 63, 64, 64 'is increased and the length of the heat radiating portion 17 is sufficiently secured, the positional relationship between the heat receiving portion 16 and the heat radiating portion 17 is the distance in the gravity direction ( Therefore, the heat pipes 61, 61 ′, 62, 62 ′, 63, 64, and 64 ′ are not affected by gravity regardless of the orientation in which the portable device 71 is used.
  • the shape of the ultrafine heat pipes 61, 61 ', 62, 62', 63 is a substantially U-shape or a substantially L-shape.
  • the ultra-fine heat pipes 61, 61 ′, 62, 62 ′, 63 are formed into a substantially U-shape or a substantially L-shape, thereby forming the ultra-fine heat pipes 61, 61 ′, 62, 62 ′, 63. Even if the overall length of the heat sink 17 is made longer and the length of the heat radiating portion 17 is further sufficiently secured, the positional relationship between the heat receiving portion 16 and the heat radiating portion 17 is unlikely to increase with respect to the distance in the gravitational direction (head).
  • the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63 are less susceptible to the influence of gravity, and the ultrafine heat pipes 61, 61 ′, 62 , 62 ′, 63 can be effectively prevented from lowering the heat transport capability, and the portable device 71 can be made more suitable.
  • the heat radiating part 17 forming a part of the ultrafine heat pipes 61, 61 ′, 63 is connected to the main printed circuit board 76 that is the first functional component of the portable device 71.
  • the battery pack 77 which is another second functional component, and dissipates heat to the outer shell 80 which is the back surface of the casing 72 of the portable device 71 and the metal plate 79 which is the back surface of the display 73. It is the composition to do.
  • the heat dissipating part 17 of the ultrafine heat pipes 61, 61 ′, 63 is arranged in the gap between the main printed circuit board 76 of the portable device 71 and the battery pack 77, and the outer shell 80 or the rear surface of the casing 72 of the portable device 71 or Since heat is radiated to the metal plate 79 which is the back surface of the display 73, ultra-fine heat pipes 61, 61 'and 63 having an excellent heat transport capability are effectively added to a small and thin portable device 71 that is easy for the user to handle.
  • heat can be radiated from the back surface of the casing 72 of the portable device 71 and the back surface of the display 73 that are exposed to the outside air by the ultra-fine heat pipes 61, 61 ', 63, and a heat radiation mode that provides the best cooling effect. be able to.
  • the 1st functional component is made into the portable device 71 which is a heat-emitting part
  • the 2nd functional component is made into the battery pack 77 which is a battery, Therefore
  • the heat radiating part 17 of the ultrafine heat pipes 61, 61 ', and 63 is carried out. It is possible to dissipate heat to the outer shell 80 that is the back surface of the casing 72 of the portable device 71 and the metal plate 79 that is the back surface of the display 73 by being arranged in the gap between the CPU 74 of 71 and the battery pack 77.
  • a plurality of ultrafine heat pipes 64 and 64 ′ in which the working liquid 13 is sealed in the inner grooved copper tube 12 are radially arranged in the casing 72 of the portable device 71.
  • heat is dissipated to the outer shell 80 that is the back surface of the casing 72 of the portable device 71 and the metal plate 79 that is the back surface of the display 73.
  • the ultrafine heat pipes 64 and 64 ′ are hardly affected by gravity, and the heat transport capability of the ultrafine heat pipes 64 and 64 ′ can be prevented from being lowered, and a form suitable for the portable device 71 can be achieved.
  • the heat generated inside the casing 72 can be guided to the ultra-fine heat pipes 64 and 64 'and can be dissipated from the back surface of the casing 72 of the portable device 71 that is in contact with the outside air, so that the best cooling effect can be obtained.
  • a heat dissipation mode can be adopted.
  • the heat pipe is attached to the portable device 71, and the heat receiving portion 16 is a heat pipe of the first heat pipe that is higher than the heat radiating portion 17 with respect to the direction of gravity.
  • the usage posture of the mobile device 71 Even if it becomes upside down, since the heat receiving part 16 is in a position lower than the heat radiating part 17 in the gravitational direction, for example, one of the ultrafine heat pipes 61, 62, 64 has a use posture of the portable device 71.
  • the heat transport capacity of the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 64, 64 ′ is not reduced, and the ultrafine heat pipes 61, 62, 64 or ultrafine Topaipu 61 ', 62', either by 64 ', can be performed better heat transport.
  • This is advantageous for the cooling of the CPU 74 in the portable device 71 such as a tablet terminal in which the user's usage posture is arbitrary, and can be an optimum cooling mode for the portable device 71.
  • the ultrafine heat pipes 61 and 61 ′ are connected to the CPU 74 which is a heat generating part as the first functional component of the portable device 71.
  • the heat receiving surface of the heat receiving block 91 and the heat receiving surface of the heat receiving block 91 are almost in close contact with each other, and a recess 92 is formed in the heat receiving block 91 so that the heat sink 17 of the ultrafine heat pipes 61 and 61 ′ is surrounded by the recess 92. Is preferred.
  • the heat sink 17 of the ultrafine heat pipes 61, 61 ′ is surrounded by the recess 92 formed in the heat receiving block 91, so that the CPU 74 of the portable device 71 has a part of the outer surface of the ultrafine heat pipes 61, 61 ′ and the heat receiving block 91. Since the heat receiving surface is almost adhered, even if the diameter of the copper tube 12 is ⁇ 2.5 mm or less and its surface area is small, the contact area between the heat receiving block 91 and the CPU 74 and the ultrafine heat pipes 61 and 61 ′ is as large as possible.
  • the heat from the CPU 74 can be easily transferred to the ultrafine heat pipes 61 and 61 ′, and the heat conduction between the CPU 74 and the ultrafine heat pipes 61 and 61 ′ can be made excellent. Thereby, the temperature rise of CPU74 is reduced and the heat spot which arises on the surface of portable device 71 can also be eased.
  • the heat receiving surface of the heat receiving block 91 is brought into close contact with the CPU 74 mounted on the portable device 71 and the heat receiving block 91 receives heat. It is preferable that a recess 92 is formed on the surface opposite to the surface, and the recess 92 surrounds the ultrafine heat pipes 61, 61 ′.
  • the heat receiving surface of the heat receiving block 91 is almost in close contact with the CPU 74 of the portable device 71 so as to surround the ultrafine heat pipes 61, 61 ′ with the recess 92 formed on the surface opposite to the heat receiving surface of the heat receiving block 91.
  • the diameter of the copper tube 12 is ⁇ 2.5 mm or less and its surface area is small, the contact area between the heat receiving block 91 and the ultrafine heat pipes 61, 61 ′ can be as large as possible, and the heat from the CPU 74 can be minimized.
  • the heat receiving plate 93 is substantially adhered to the CPU 74 mounted on the portable device 71, and the ultrafine heat pipe is disposed on the side of the CPU 74. It is preferable to arrange 61, 61 'and surround the ultrafine heat pipes 61, 61' by a concave bent portion 95 formed on the heat receiving plate 93.
  • the ultrathin heat pipes 61, 61 ′ are arranged on the side of the CPU 74 of the portable device 71 so as to surround the ultrafine heat pipes 61, 61 ′ in the concave bent portion 95 formed on the heat receiving plate 93, and the heat receiving plate 93 is placed on the CPU 74. Since the heat from the CPU 74 can be efficiently transferred to the ultrafine heat pipes 61 and 61 'via the heat receiving plate 93, and the CPU 74 has a gap corresponding to the thickness of the heat receiving plate 93, Ultra-fine heat pipes 61 and 61 ′ can be installed in the gap, and a cooling mode that is optimal for a portable device 71 such as a tablet terminal that is particularly required to be thin can be obtained.
  • the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ are provided on a smartphone or tablet terminal. Furthermore, by mounting the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ on a smartphone or tablet terminal, the ultrafine heat pipes 61, 61 ′, 62 having excellent heat transport capability are provided. , 62 ′, 63, 64, 64 ′ can be provided effectively.
  • the portable information terminal 101 is a smartphone that is smaller than the above-described tablet terminal and has an external dimension that can be held by hand, and has a vertically long and substantially rectangular back cover 102. Is arranged on the back side of the flat touch panel 103, thereby forming a flat outline (housing) as the portable information terminal 101.
  • a CPU (central processing unit) 104 that is a control unit of the portable information terminal 101 and other various electronic components (not shown) are mounted on a printed circuit board 106 that is a substrate.
  • a battery pack 107 which is a chargeable flat and substantially rectangular charging means for supplying necessary power to the CPU 104 and electronic components, is housed in a removable manner with respect to the portable information terminal 101.
  • an operation display unit 108 in which an input device and a display device are integrated is disposed on the front side of the touch panel 103, while the back surface of the touch panel 103 facing the front side opening of the back cover 102 has no unevenness. It is composed of a flat metal plate 109 such as aluminum.
  • the operation display unit 108 is exposed and arranged on the front surface of the portable information terminal 101 so that it can be touched with a user's finger.
  • the portable information terminal 101, the back cover 102, the touch panel 103, the CPU 104, the printed circuit board 106, the battery pack 107, the operation display unit 108, and the metal plate 109 of the present embodiment are the same as the portable device 71 and the housing of the above embodiment. It corresponds to the body 72, the display 73, the CPU 74, the main printed circuit board 76, the battery pack 77, the touch panel portion 78, and the metal plate 79, respectively.
  • a tablet terminal may be included in addition to the smartphone.
  • the heat radiating plate 110 is installed.
  • the flat heat pipes 111 and 112 are both on the back side of the heat radiating plate 110 and are arranged along the side surface of the battery pack 107 having a rectangular box shape.
  • the CPU 104 is on the front side of the printed circuit board 106, and the printed circuit board 106 is disposed so that a part of the flat heat pipes 111 and 112 is located in the vicinity of the CPU 104.
  • a heat source heater 121 instead of the CPU 104 and a thermocouple 122 as a temperature sensor are mounted in order to actually measure the heat diffusion state of the heat radiating plate 110, but these are installed in the actual portable information terminal 101. Not.
  • FIG. 49 shows the appearance of a single cooling unit in which a U-shaped flat heat pipe 111 is thermally connected to the heat radiating plate 110
  • FIG. 50 shows an L-shaped flat heat pipe 112 thermally connected to the heat radiating plate 110.
  • the external appearance of the cooling unit is shown.
  • the heat radiating plate 110 is made of a metal such as an aluminum alloy having a thermal conductivity of 15 W / m ⁇ k or more and a thickness of 0.3 mm or less.
  • the heat radiating plate 110 is provided with a plating layer (not shown) such as nickel or tin on the surface, and then a flat heat pipe 111 or a flat heat by a low-temperature solder 123 having a melting point of 160 ° C.
  • the flat heat pipe 111 or the flat heat pipe 112 and the heat radiating plate 110 are in good thermal connection, and at the time of soldering, the flat heat pipe 111 or the flat heat pipe The possibility that 112 may swell due to deformation due to heat can be eliminated.
  • attachment portions 124 to the casing of the portable information terminal 101 are provided at corner portions located at the four corners of the heat dissipation plate 110.
  • the attachment portion 124 is formed as a through hole.
  • the attachment portion 124 is aligned with a screw hole (not shown) formed on the back surface portion of the touch panel 103, and a screw as a fastening member (not shown) is attached to the attachment portion 124.
  • the heat radiating plate 120 is provided with a notch 126 for preventing interference that escapes from a portion 125 that interferes with the housing of the portable information terminal 101.
  • two notches 126 are provided on the left and right sides of the lower portion of the heat dissipation plate 120, and the heat dissipation plate 110 is attached using the mounting portion 124 so that the heat dissipation plate 120 does not contact the portion 125 that interferes with the housing. It can be attached and fixed to the casing of the portable information terminal 101, and the thermal influence on the part 125 that interferes with the casing of the portable information terminal 101 from the heat radiation plate 110 can be reduced.
  • the heat radiating plate 120 is provided with one notch 126 on the right side in addition to the mounting portion 124.
  • an interference preventing hole 127 that escapes the battery pack 107 is provided as a part where the heat radiating plate 120 interferes with the casing of the portable information terminal 101.
  • the heat radiating plate 110 can be attached and fixed to the housing of the portable information terminal 101 using the attachment portion 124 so that the heat radiating plate 110 does not contact the battery pack 107, and the heat radiating plate 120 can be fixed to the battery pack 107. Can also reduce the thermal effects.
  • the notches 126 and holes 127 as escape portions are not limited to those shown in FIGS. 51 to 54, and are formed at appropriate positions on the heat radiation plate 110 as necessary. Further, even when the notch 126 and the hole 127 are provided in the heat radiating plate 120, the flat heat pipe 112 is arranged so as to be thermally connected to the heat radiating plate 120 as a whole.
  • FIG. 57 shows a straight heat pipe 113 that has not been flattened and is used in the present embodiment.
  • the heat pipe 113 is a non-flat circular tube having an outer diameter of ⁇ 2 mm to ⁇ 6 mm, and both ends of the internally grooved copper tube 12 made of pure copper or the like whose groove 11 is formed on the inner wall are Tig welded. It is sealed and configured.
  • a sheet-like flat heat pipe 114 may be configured by stacking and joining a plurality of sheets 131 of copper foil or the like formed in an uneven shape by etching. Yes (see FIG. 63).
  • the inside is filled with a working fluid 13 (not shown) such as pure water in a vacuum state.
  • a copper alloy tube having improved workability may be used in place of the pure copper copper tube 12 having particularly excellent thermal conductivity.
  • a plurality of grooves 11 are formed, and sealing portions 15 are formed by appropriate means such as Tig welding at both ends of the hollow cylindrical tube extending in the longitudinal direction, so that the inside of the tube is sealed in a vacuum state.
  • Heat pipe 113 is obtained.
  • the groove 11 is provided along the entire circumference of the inner surface of the copper tube 12 and along the longitudinal direction, and forms a liquid flow path 18 for the working liquid 13.
  • the hollow portion surrounded by the groove 11 forms a gas flow path 19 for the working fluid 13.
  • the heat pipe 113 is flattened to a thickness that matches the installation space of the casing of the portable information terminal 101 without being bent, so that a part or the whole of the copper pipe 12 is crushed as shown in FIG. An I-shaped flat heat pipe 115 having a portion is obtained.
  • the heat pipe 113 is bent at one or several places in the middle of the copper tube 12, and may be formed into a U shape, an L shape, or a U shape as shown in FIG. .
  • the flat heat pipe 111 in which a crushed portion is formed in a part or the whole of the copper pipe 12 as described above by performing flattening to a thickness according to the installation space of the housing of the portable information terminal 101, 112 is configured.
  • the outer shape of the U-shaped flat heat pipe 111 is bent at about 90 ° at two locations in the middle of the copper tube 12 to form curved bent portions 21 at the respective portions.
  • a linear arm portion 23 is connected to both ends of 22 via a bent portion 21.
  • the flat heat pipe 111 here is a part corresponding to the base portion 22 as the heat receiving portion 16 and is arranged in a state capable of transferring heat to the CPU 104 via the heat radiating play 110, and another portion corresponding to the arm portion 23.
  • a part of the heat radiating part 17 is thermally connected to both sides of the heat radiating plate 110 along a part of the outer peripheral part of the casing of the portable information terminal 101.
  • the outer shape of the L-shaped flat heat pipe 112 is bent at about 90 ° at one point in the middle of the copper tube 12 to form a curved bent portion 21 at that portion, and is linear.
  • a straight arm portion 23 is connected to one end of the base portion 22 via a bent portion 21.
  • the flat type heat pipe 112 is arranged in a state where a part corresponding to the base portion 22 can receive heat from the CPU 104 via the heat radiating plate 110 as the heat receiving portion 16, and corresponds to the arm portion 23.
  • a part of the heat-dissipating part 17 is thermally connected to one side of the heat-dissipating plate 110 along a part of the outer peripheral part of the casing of the portable information terminal 101.
  • FIG. 58 shows cross sections of the flat heat pipes 111, 112, and 115.
  • the thickness of the flat heat pipes 111, 112, 115 is preferably in the range of 0.4 mm to 2 mm according to the installation space of the casing of the portable information terminal 101.
  • the groove 11 is provided along the entire circumference of the inner surface of the copper tube 12 and along the longitudinal direction to form the liquid flow path 18 for the working liquid 13. .
  • the hollow portion surrounded by the groove 11 forms a gas flow path 19 for the working fluid 13.
  • the non-flat heat pipe 113 and the flat heat pipes 111, 112, 114, 115 completed in this way are, as described above, the mounting portion 124, the heat sink plate 110 provided with the notches 126 and the holes 127 as necessary, and the low temperature.
  • the solder 123 is used for soldering connection.
  • the heat radiating plate 110 to which the heat pipe 113 and the flat heat pipes 111, 112, 114, and 115 are thermally connected is installed while being in close contact between the metal plate 109 forming the back surface of the touch panel 103 and the battery pack 107 as much as possible. Is done.
  • the printed circuit board 106 on which the CPU 104 is mounted is also installed inside the casing of the portable information terminal 101 so that the CPU 104 and the heat radiating plate 110 are in close contact as much as possible.
  • a cover of the CPU 104 may be installed between the CPU 104 and the heat dissipation plate 115 as necessary.
  • the portable information terminal 101 such as a smartphone
  • the thickness of the casing is limited, it is excellent in installation property and good heat diffusion can be obtained over a wide area of the casing. Therefore, the temperature rise of the CPU 104 can be kept low, and hot spots on the outer surface of the touch panel 103 and the like can be suppressed.
  • the cross-sectional shape of the flat heat pipes 111, 112, and 115 is not limited to that shown in FIG. 58, and various modifications can be made.
  • the flat heat pipes 111, 112, and 115 shown in FIGS. 59 to 62 are not a whole circumference of the inner surface of the copper tube 12, but a part of the inner surface.
  • a groove 11 is provided, and the groove 11 forms a liquid flow path 18 for the working liquid 13, while a gas flow path 19 for the working liquid 13 is formed at a portion where the groove 11 is not formed.
  • the liquid flow path 18 of the working liquid 13 is formed on one side in the width direction, and the gas flow of the working liquid 13 on the other side in the width direction.
  • a path 19 is formed.
  • the liquid flow path 18 and the gas flow path 19 of the hydraulic fluid 13 can be separately disposed on one side and the other side in the width direction of the flat heat pipes 111, 112, 115.
  • the liquid flow path 18 for the working liquid 13 is formed on both sides in the width direction, and the gas flow path 19 for the working liquid 13 is formed in the center in the width direction.
  • the liquid flow path 18 and the gas flow path 19 of the working fluid 13 can be arranged separately on both sides and the center in the width direction of the flat heat pipes 111, 112, 115.
  • the flat heat pipes 111, 112, and 115 shown in FIG. 61 and FIG. 62 have a substantially planar shape with a wider width direction than that shown in FIG. In this case, the width of the flat heat pipes 111, 112, and 115 substantially matches the width of the heat radiating plate 110, and heat can be quickly diffused throughout the heat radiating plate 110.
  • the same flat heat pipe 114 can also be obtained by etching the surface to form the concavo-convex portion 132 and stacking and joining the processed sheets 131.
  • the thickness of the flat heat pipe 114 is also preferably in the range of 0.4 mm to 2 mm in accordance with the installation space of the casing of the portable information terminal 101.
  • the copper pipe 12 may be flattened with different flatness ratios.
  • the flatness ratio is large and the thickness is thin.
  • the heat transported to the heat radiating portion 17 is thermally diffused to a wide planar area of the heat radiating plate 110, and is radiated from the back and front surfaces of the heat radiating plate 110 to the metal plate 109 that forms the back surface of the touch panel 103 and the battery pack 107. Is. Thereby, since the portable information terminal 101 can diffuse the heat generated in the CPU 104 and the like over a wide area, the heat spots generated on the outer surface of the touch panel 103 and the like are alleviated and the temperature rise of the CPU 104 can be suppressed. .
  • the heat radiating portion 17 of the heat pipe 113 or the flat heat pipes 111, 112, 114, 115 condenses the vapor and accumulates the working fluid 13, but the heat pipe 113 or the flat heat pipes 111, 112, 114, 115. Due to the capillary force of the groove 11 formed on the inner wall, the hydraulic fluid 13 is transmitted through the liquid flow path 18 and returned from the heat radiating portion 17 to the heat receiving portion 16. Therefore, the hydraulic fluid 13 does not disappear in the heat receiving portion 16, and the vaporized hydraulic fluid 13 travels through the gas flow path 19 and is guided to the heat radiating portion 17, so that the evaporation continues, and the heat pipe 113 or the flat heat pipe. The original performance of 111, 112, 114, 115 is exhibited.
  • the heat pipe 113 and the flat heat pipes 111, 112, 114, and 115 are arranged on the CPU 104, and the thickness of the casing is pursued for ease of use, particularly in the portable information terminal 101 such as a smartphone.
  • the heat conductivity of the CPU 104 and the like via the heat radiating plate 110 is widened while taking advantage of the features of the heat pipe 113 and the flat heat pipes 111, 112, 114, 115, which have extremely good thermal conductivity compared to the graphite sheet. It is possible to quickly diffuse heat.
  • the heat radiation plate 110 to which the heat pipe 113 or the flat heat pipes 111, 112, 114, and 115 are thermally connected is installed in the portable information terminal 101 such as a smartphone. Even if the thickness of the casing of the information terminal 101 is limited, it can be easily installed, and good heat diffusion can be realized in a wide area of the casing via the heat dissipation plate 110.
  • the heat radiating plate 110 is notched as an escape portion for preventing interference in the attachment portion 124 of the portable information terminal 101 to the housing or the portion 125 that interferes with the housing.
  • 126 and holes 127 are provided and installed in the portable information terminal 101 such as a smartphone in a state where the heat radiating plate 110 is thermally connected to the heat pipe 113 or the flat heat pipes 111, 112, 114, 115. Therefore, even if the thickness of the portable information terminal 101 is limited, the installation is further facilitated, and good heat diffusion is stably spread over a wide area of the casing via the heat radiating plate 110. Yes.
  • the heat radiating plate 110 is made of a metal having a thermal conductivity of 15 W / m ⁇ k or more and a thickness of 0.3 mm or less.
  • the heat radiating plate 110 is made of a heat pipe 113 or flat heat pipes 111, 112, 114, 115 is installed in the portable information terminal 101 such as a smartphone in a state of being thermally connected to the 115, so that even if the thickness of the portable information terminal 101 is limited in pursuit of ease of use, the installation becomes easy. Further, better thermal diffusion can be performed over a wide area of the housing via the heat radiating plate 110.
  • the heat conductivity of the heat radiating plate 110 is less than 15 W / m ⁇ k, sufficient heat diffusion cannot be performed over a wide area of the housing via the heat radiating plate 110, and the thickness of the heat radiating plate 110 is 0. If it exceeds 3 mm, it becomes difficult to meet the limitation on the thickness of the casing of the portable information terminal 101 in pursuit of ease of use.
  • the heat radiating plate 110 thermally connected to the flat heat pipes 111, 112, 114, and 115 having a flat thickness of 2 mm or less is applied to a portable information terminal such as a smartphone. Since it is installed in 101, even if there is a limit to the thickness of the casing of the portable information terminal 101 in pursuit of ease of use, the installation becomes even easier, and a wide area of the casing can be provided via the heat radiation plate 110. Good thermal diffusion.
  • the thickness of the flat heat pipes 111, 112, 114, and 115 exceeds 2 mm, it becomes difficult to meet the limitation on the thickness of the casing of the portable information terminal 101 in pursuit of ease of use.
  • the flat heat pipes 111, 112, 114, 115 are composed of a portion 128 subjected to flat processing with a large flat rate and a portion 129 subjected to flat processing with a small flat rate. Since the heat radiation plate 110 thermally connected to the flat heat pipes 111, 112, 114, 115 having the shape is installed in the portable information terminal 101 such as a smartphone, the thickness of the casing of the portable information terminal 101 is pursued for ease of use. Even if there is a limitation, the installation is further facilitated, and good heat diffusion can be performed over a wide area of the housing via the heat radiating plate 110.
  • the heat pipe 113 or the flat heat pipes 111, 112, 114, and 115 are joined to the heat radiating plate 110 with a low-temperature solder 123 having a melting point of 160 ° C. or less, and such heat connection is performed. Since the heat radiating plate 110 is installed in the portable information terminal 101 such as a smartphone, even if there is a limit to the thickness of the casing of the portable information terminal 71 in pursuit of ease of use, the installation is further facilitated. Through the plate 110, better thermal diffusion can be performed over a wide area of the housing.
  • the heat pipe 113 and the flat heat pipes 111, 112, 114, 115 may swell during soldering, and the portable information terminal 101 pursuing ease of use. It becomes difficult to meet the thickness limitation of the housing.
  • the heat spots generated on the outer surface of the touch panel 103 and the like are alleviated and the temperature rise of the CPU 104 as a heat generating portion is suppressed, so that the performance of the CPU 104 can be maximized.
  • the processing speed of the portable information terminal 101 such as a smartphone is greatly improved.
  • FIG. 65 shows the test results comparing the temperature rise of the information portable terminal 101 due to the difference in cooling configuration.
  • the test was performed by attaching the heat source heater 121 and the thermocouple 122 to the smartphone which is the information portable terminal 101.
  • the input of the heat source heater 121 is 4 W
  • the ambient temperature is 25 ° C.
  • the flat heat pipes 111 and 112 are obtained by flattening a ⁇ 2 mm heat pipe 113 and crushing it to a thickness of 1.6 mm and a width of 2.4 mm.
  • the heat radiating plate 110 is made of pure aluminum and has a thickness of 0.2 mm.
  • the “current cooling configuration” is a conventional cooling configuration using a graphite sheet
  • the “replacement of the graphite sheet with an aluminum plate” is the heat dissipation plate of this embodiment instead of the graphite sheet.
  • 110 is a cooling configuration using only 110
  • the installation of the L-shaped heat pipe on the aluminum plate means that the L-shaped flat heat pipe 112 is thermally connected to the heat radiating plate 110 of the present embodiment.
  • “Installing the U-shaped heat pipe on the aluminum plate” is a cooling configuration in which the U-shaped flat heat pipe 111 is thermally connected to the heat radiating plate 110 of the present embodiment.
  • a “heat source temperature” that is the temperature of the heat source heater 121, a “touch panel surface temperature” that is the surface temperature of the touch panel 103, and a “housing rear surface temperature” that is the surface temperature of the back cover 102 are Each is shown.
  • “touch panel surface temperature” and “housing rear surface temperature” indicate the temperature distribution of the entire surface as an image.
  • FIG. 66 shows the cases of “current cooling configuration”, “replace graphite sheet with aluminum plate”, “install L-shaped heat pipe on aluminum plate”, and “install U-shaped heat pipe on aluminum plate”.
  • the temperature of the heat source heater 121 with the elapsed time that is, the change of the “heat source temperature” is shown in a graph.
  • the temperature of the heat source heater 121 when “the L-shaped heat pipe is installed on the aluminum plate” is reduced by 9.9K with respect to the temperature of the heat source heater 121 when the “graphite sheet is replaced with an aluminum plate”. It can be seen that the temperature of the heat source heater 121 when the “U-shaped heat pipe is installed on the aluminum plate” is reduced by 16.4K.
  • FIG. 67 shows the above-mentioned cases of “current cooling configuration”, “replace graphite sheet with aluminum plate”, “install an L-shaped heat pipe on the aluminum plate”, and “install a U-shaped heat pipe on the aluminum plate”.
  • 2 shows a graph of the change in the maximum surface temperature of the touch panel 103 according to the elapsed time, that is, the “touch panel surface temperature Max.”.
  • the maximum surface temperature of the touch panel 103 when the “L-shaped heat pipe is installed on the aluminum plate” is 9.3 K, compared to the maximum surface temperature of the touch panel 103 when the “graphite sheet is replaced with an aluminum plate”.
  • the maximum surface temperature of the touch panel 103 when the “U-shaped heat pipe is installed on the aluminum plate” is reduced by 11.6K. Further, when the limit temperature Tx1 of low-temperature burn is set to 48 ° C., the installation of the flat heat pipes 111 and 11 obtained by flattening the ⁇ 2 mm heat pipe 113 becomes the limit.
  • FIG. 68 is a graph showing the relationship between “heat source temperature” and “heat source input” which is the input of the heat source heater 121 when “L-shaped heat pipe is installed on the aluminum plate”. In the same case, the relationship between “touch panel surface temperature Max.” And “heat source input” is shown in a graph. As shown in FIG. 68, the temperature of the heat source heater 121 has a margin with respect to 90 ° C. which is the limit temperature Tx2 of the CPU 104 even when the input of the heat source heater 121 is 4 W, and the processing speed as the portable information terminal 101 does not decrease. . On the other hand, as shown in FIG.
  • the maximum surface temperature of the touch panel 103 is set to the limit temperature Tx1 of the low temperature burn. It can be:
  • the portable information terminal 101 includes the heat pipe 113 that is a heat pipe and the heat radiation plate 110 to which the flat heat pipes 111, 112, 114, and 115 are thermally connected, the back cover 102, and the touch panel 103. It is configured by being installed inside a casing composed of
  • the heat dissipation plate 110 to which the heat pipe 113 and the flat heat pipes 111, 112, 114, 115 are thermally connected is also provided for the thickness limitation of the housing pursuing ease of use in the portable information terminal 101. Can be easily installed in a thin housing.
  • the heat transported by the heat pipe 113 and the flat heat pipes 111, 112, 114, and 115 is diffused in a wide area of the heat radiating plate 110, and good heat diffusion can be realized in a wide area of the casing.
  • the heat spot generated on the outer surface such as the CPU 104 is alleviated and the temperature rise of the thermal component such as the CPU 104 is suppressed, so that the capability of the thermal component can be maximized and the processing of the portable information terminal 101 such as a smartphone is performed. Speed is greatly improved. For this reason, it is possible to provide the portable information terminal 101 that can be easily installed in a thin casing and can exhibit the ability of the thermal component to the maximum by realizing good heat diffusion.
  • the heat radiating plate 110 of the present embodiment is provided with a notch 126 and a hole 127 which are escape portions in a mounting portion 124 to the housing or a portion 125 which interferes with the housing.
  • the heat radiating plate 110 with a notch 126 and a hole 127 so as to avoid the attachment portion 124 to the housing and the portion 125 that interferes with the housing, the thickness of the housing is limited for ease of use. Therefore, it is possible to provide the portable information terminal 101 which can be easily installed and can stably perform good heat diffusion over a wide area of the housing.
  • the heat dissipation plate 110 of the present embodiment is made of a metal having a thermal conductivity of 15 W / m ⁇ k or more and a thickness of 0.3 mm or less.
  • the portable information terminal 101 can be provided which can be easily installed even with respect to the thickness limitation of the casing in pursuit of ease of use and can perform better heat diffusion over a wide area of the casing.
  • flat heat pipes 111, 112, 114, and 115 having a thickness of 2 mm or less that are flattened after bending are used as heat pipes that are thermally connected to the heat radiating plate 110.
  • the heat pipes that are thermally connected to the heat radiating plate 110 are flat heat pipes 111, 112, 114, and 115 having a thickness of 2 mm or less, so that the thickness limit of the housing pursuing ease of use is also supported. Is possible. For this reason, it is possible to provide the portable information terminal 101 that can be easily installed even with respect to the thickness limitation of the casing in pursuit of ease of use and can perform good heat diffusion over a wide area of the casing.
  • the heat pipe thermally connected to the heat radiating plate 110 includes a first portion 128 subjected to flat processing with a large flat rate and a second portion 129 subjected to flat processing with a small flat rate.
  • Flat type heat pipes 111, 112, 114, and 115 are used.
  • the first portion 128 and the second portion 129 that have been flattened with different flatness rates are formed in the flat heat pipes 111, 112, 114, and 115, respectively.
  • the first part 128 is arranged in a place where the thickness is severely restricted, and the second part 129 is arranged in a place where the thickness is more restrictive than that, thereby limiting the thickness of the housing in pursuit of ease of use. Therefore, it is possible to provide the portable information terminal 101 which can be installed more easily and can perform better heat diffusion over a wide area of the housing.
  • the heat pipe 83 and the flat heat pipes 111, 112, 114, and 115 are joined and thermally connected to the heat radiating plate 110 by the low-temperature solder 123 that is a solder having a melting point of 160 ° C. or lower. .
  • the melting point of the low-temperature solder 123 for thermally connecting the heat pipe 113 and the flat heat pipes 111, 112, 114, and 115 to the heat radiating plate 110 is set to 160 ° C. or less, so that the heat pipe is used during soldering.
  • 113 and the flat heat pipes 111, 112, 114, and 115 are not likely to swell, and it is possible to cope with the thickness limitation of the casing in pursuit of ease of use. For this reason, it is possible to provide the portable information terminal 101 that can be more easily installed even with respect to the thickness limitation of the casing in pursuit of ease of use, and can perform better heat diffusion over a wide area of the casing.
  • the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.
  • the shapes of the ultrafine heat pipes 61, 61 ′, 62, 62 ′, 63, 64, 64 ′ shown in the embodiments are merely examples, and can be appropriately changed according to the outer shape of the portable device 71.
  • . 36, 37 and 39 show an example in which two ultra-fine heat pipes 61, 61 ′, 62, 62 ′, 64 and 64 ′ are mounted on the portable device 71, but there are three or more. It is possible to mount an extra fine heat pipe.
  • the heat receiving block 91 and the heat receiving plate 93 described above may be applied to the ultrafine heat pipes 62, 62 ', 63, 64, 64'.
  • the heat pipe thermally connected to the heat radiating plate 110 may have any shape as long as the desired performance can be obtained. Further, as the attachment portion 124 to the housing of the portable information terminal 101, a device other than the through hole may be adopted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention vise à procurer un tuyau de chaleur qui peut être reçu à l'intérieur d'un boîtier d'un dispositif mobile, tel qu'un téléphone intelligent, et qui peut produire des performances de transport de chaleur adéquates quelle que soit la direction d'utilisation du dispositif mobile, qui n'a pas une orientation d'utilisation fixe. A cet effet, l'invention porte sur un tuyau de chaleur ultra fin (1), lequel tuyau comprend un fluide d'actionnement (13) hermétiquement scellé dans un tuyau en cuivre (12) constituant un corps de tuyau, le diamètre du tuyau en cuivre (12) étant de Φ2,5 mm ou moins. De préférence, le corps de tuyau est un tuyau en cuivre rainuré intérieurement (12) comprenant du cuivre pur comme matériau, et le fluide d'actionnement (13) est de l'eau pure. Le tuyau de chaleur ultra fin (1) est disposé le long d'une partie d'une partie périphérique externe (38) d'un dispositif mobile (31) et d'une unité centrale (34) du dispositif mobile (31), de façon à rendre ainsi possible au tuyau de chaleur ultra fin (1) d'être monté dans le boîtier (32) d'un téléphone intelligent ou d'un autre dispositif mobile (31) qui est de taille appropriée pour tenir dans une main d'un utilisateur, et qui est apte au détachement d'un ensemble de batterie (37), et pour obtenir des performances de transport de chaleur suffisantes.
PCT/JP2013/078165 2012-11-15 2013-10-17 Tuyau de chaleur, téléphone intelligent, terminal à tablette ou assistant numérique personnel WO2014077081A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2012251650A JP2014098530A (ja) 2012-11-15 2012-11-15 ヒートパイプ
JP2012-251650 2012-11-15
JP2012279284 2012-12-21
JP2012-279284 2012-12-21
JP2013-033448 2013-02-22
JP2013033448A JP6263841B2 (ja) 2013-02-22 2013-02-22 携帯情報端末
JP2013-155002 2013-07-25
JP2013155002A JP6135363B2 (ja) 2012-12-21 2013-07-25 ヒートパイプ

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KR20170095316A (ko) 2014-12-18 2017-08-22 가부시키가이샤 가네카 그래파이트 적층체, 그래파이트 적층체의 제조 방법, 열 수송용 구조물 및 로드상의 열 수송체
CN107257612A (zh) * 2017-08-02 2017-10-17 合肥四书电子商务有限公司 一种基于风冷的智能手机散热系统
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EP3131376B1 (fr) * 2014-06-04 2021-08-04 Huawei Technologies Co., Ltd. Dispositif électronique
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JP2016017702A (ja) * 2014-07-09 2016-02-01 東芝ホームテクノ株式会社 シート型ヒートパイプ
US10564686B2 (en) 2014-10-28 2020-02-18 Samsung Electronics Co., Ltd. Method for controlling operation of electronic device and electronic device using the same
EP3213170B1 (fr) * 2014-10-28 2021-04-14 Samsung Electronics Co., Ltd. Procédé de commande de fonctionnement de dispositif électronique et dispositif électronique l'utilisant
KR20170095316A (ko) 2014-12-18 2017-08-22 가부시키가이샤 가네카 그래파이트 적층체, 그래파이트 적층체의 제조 방법, 열 수송용 구조물 및 로드상의 열 수송체
US10062507B2 (en) 2015-09-02 2018-08-28 Tdk Corporation Electronic device sheet
CN107257612A (zh) * 2017-08-02 2017-10-17 合肥四书电子商务有限公司 一种基于风冷的智能手机散热系统
CN107257612B (zh) * 2017-08-02 2020-07-24 嘉兴市品信电器有限公司 一种基于风冷的智能手机散热系统
CN110389640A (zh) * 2019-07-03 2019-10-29 维沃移动通信有限公司 一种散热方法和移动终端

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