JP5945047B1 - 携帯型電子機器用熱拡散板 - Google Patents
携帯型電子機器用熱拡散板 Download PDFInfo
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- JP5945047B1 JP5945047B1 JP2015162134A JP2015162134A JP5945047B1 JP 5945047 B1 JP5945047 B1 JP 5945047B1 JP 2015162134 A JP2015162134 A JP 2015162134A JP 2015162134 A JP2015162134 A JP 2015162134A JP 5945047 B1 JP5945047 B1 JP 5945047B1
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- heat
- heating
- metal plate
- heat pipe
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
Abstract
Description
(本発明例1)
金属板として厚さが0.2mmの銅板を使用し、ヒートパイプとして銅パイプの内部に銅細線のウイックを配置するとともに、水を作動流体として封入したヒートパイプを使用した。加熱部は、厚さが0.4mmとなるように扁平に加工し、放熱部は0.6mmの厚さに扁平加工した。ヒートパイプの加熱部は金属板に形成した孔部の内部に配置し、したがって加熱領域の厚さは、加熱部で最大となるものの、0.4mmとなっている。加熱領域に発熱体の代用として、出力の調整可能なヒータを接触させ、ヒータの出力を3W、4W、5Wとした場合の加熱部の温度を測定した。温度の測定結果を表1に示してある。
上記の本発明例1と同様の金属板およびヒートパイプを使用した。加熱領域には前述した図6に示す伝熱材を設け、伝熱材の厚さは、0.05mmとした。それに伴って、加熱部の厚さは0.35mmに設定し、したがって加熱領域の最大厚さは、本発明例1と同様に0.4mmとした。上記の本発明例1と同様に、加熱領域に発熱体の代用として、出力の調整可能なヒータを接触させ、ヒータの出力を3W、4W、5Wとした場合の加熱部の温度を測定した。温度の測定結果を表1に示してある。
上記の本発明例1および2と同様の金属板およびヒートパイプを使用した。加熱領域には前述した孔部を設けずに、ヒートパイプの加熱部を金属板に直接密着させた。加熱領域の最大厚さを0.4mmとするために、加熱部を薄く扁平加工し、その厚さを0.2mmとした。他の条件は、上述した本発明例1および2と同様にし、加熱領域に発熱体の代用として、出力の調整可能なヒータを接触させ、ヒータの出力を3W、4W、5Wとした場合の加熱部の温度を測定した。温度の測定結果を表1に示してある。
Claims (2)
- 発熱体が密着させられる金属板にヒートパイプが添わせて取り付けられ、前記金属板の前記発熱体が密着させられている加熱領域の熱を前記ヒートパイプによって前記金属板の前記加熱領域から離れた箇所に伝達する携帯型電子機器用熱拡散板において、
前記ヒートパイプは、金属製のパイプによってコンテナが形成され、前記コンテナの前記加熱領域に配置される部分が加熱部とされ、前記コンテナの前記加熱領域から離れた部分が前記金属板に放熱する放熱部とされ、
前記加熱部は、前記コンテナを押し潰して扁平状に形成されるとともに、前記放熱部は、前記扁平状の加熱部より厚く形成され、
前記金属板は、前記加熱領域に相当する部分に形成された所定長さの孔部を有し、
前記扁平状の前記加熱部は、前記孔部の内部に配置されるとともに、前記放熱部は、前記金属板の前記加熱領域から離れた箇所の表面に密着させられ、
前記加熱領域において前記発熱体から前記金属板と前記加熱部とに熱を伝達するように構成されている
ことを特徴とする携帯型電子機器用熱拡散板。 - 前記加熱領域において、前記扁平状に形成された前記加熱部の表面に接触しかつ前記孔部を閉じるように伝熱材が設けられ、
前記伝熱材に前記発熱体が熱伝達可能に接触するように構成されている
ことを特徴とする請求項1に記載の携帯型電子機器用熱拡散板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015162134A JP5945047B1 (ja) | 2015-08-19 | 2015-08-19 | 携帯型電子機器用熱拡散板 |
TW105124643A TWI602498B (zh) | 2015-08-19 | 2016-08-03 | 攜帶型電子機器用熱擴散板 |
US15/236,781 US10314202B2 (en) | 2015-08-19 | 2016-08-15 | Heat spreading module for portable electronic device |
CN201610670221.9A CN106470538B (zh) | 2015-08-19 | 2016-08-15 | 便携式电子设备用散热板 |
EP16184449.3A EP3133364B1 (en) | 2015-08-19 | 2016-08-17 | Heat spreading module for portable electronic device |
Applications Claiming Priority (1)
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JP2015162134A JP5945047B1 (ja) | 2015-08-19 | 2015-08-19 | 携帯型電子機器用熱拡散板 |
Publications (2)
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JP5945047B1 true JP5945047B1 (ja) | 2016-07-05 |
JP2017041530A JP2017041530A (ja) | 2017-02-23 |
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US (1) | US10314202B2 (ja) |
EP (1) | EP3133364B1 (ja) |
JP (1) | JP5945047B1 (ja) |
CN (1) | CN106470538B (ja) |
TW (1) | TWI602498B (ja) |
Cited By (1)
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CN106790797A (zh) * | 2016-12-13 | 2017-05-31 | 奇酷互联网络科技(深圳)有限公司 | 终端设备的中框及其制备方法和移动终端 |
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WO2018157545A1 (zh) * | 2017-03-02 | 2018-09-07 | 华为技术有限公司 | 导热部件和移动终端 |
CN107168493A (zh) * | 2017-06-01 | 2017-09-15 | 曙光节能技术(北京)股份有限公司 | 一种cpu散热方法和装置 |
CN110891729B (zh) | 2017-07-28 | 2022-04-19 | 达纳加拿大公司 | 用于对准激光焊接用部件的设备和方法 |
DE112018003831T5 (de) | 2017-07-28 | 2020-04-09 | Dana Canada Corporation | Ultradünne wärmetauscher für das wärmemanagement |
CN111034380A (zh) * | 2017-08-08 | 2020-04-17 | Nec平台株式会社 | 散热结构 |
CN108966587B (zh) * | 2017-10-13 | 2019-06-21 | 邹昊雄 | 一种散热装置 |
US20190234691A1 (en) * | 2018-01-26 | 2019-08-01 | Taiwan Microloops Corp. | Thermal module |
CN110365815B (zh) * | 2018-03-26 | 2021-03-30 | 华为技术有限公司 | 导热组件及终端 |
US10823969B1 (en) * | 2018-12-14 | 2020-11-03 | Google Llc | Heat transfer through frame component of head-mounted device |
JP6828085B2 (ja) * | 2019-05-09 | 2021-02-10 | レノボ・シンガポール・プライベート・リミテッド | 熱輸送装置および電子機器 |
WO2021114146A1 (zh) * | 2019-12-11 | 2021-06-17 | 瑞声声学科技(深圳)有限公司 | 热管和扬声器装置 |
JPWO2021186686A1 (ja) * | 2020-03-19 | 2021-09-23 | ||
US11553621B2 (en) * | 2020-04-29 | 2023-01-10 | Auras Technology Co., Ltd. | Heat dissipation base |
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2015
- 2015-08-19 JP JP2015162134A patent/JP5945047B1/ja active Active
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2016
- 2016-08-03 TW TW105124643A patent/TWI602498B/zh active
- 2016-08-15 CN CN201610670221.9A patent/CN106470538B/zh active Active
- 2016-08-15 US US15/236,781 patent/US10314202B2/en active Active
- 2016-08-17 EP EP16184449.3A patent/EP3133364B1/en active Active
Patent Citations (3)
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JP2014165596A (ja) * | 2013-02-22 | 2014-09-08 | Toshiba Home Technology Corp | 携帯情報端末 |
JP2015211056A (ja) * | 2014-04-24 | 2015-11-24 | 日本電気株式会社 | 電子機器 |
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CN106790797A (zh) * | 2016-12-13 | 2017-05-31 | 奇酷互联网络科技(深圳)有限公司 | 终端设备的中框及其制备方法和移动终端 |
CN106790797B (zh) * | 2016-12-13 | 2019-11-19 | 奇酷互联网络科技(深圳)有限公司 | 终端设备的中框及其制备方法和移动终端 |
Also Published As
Publication number | Publication date |
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EP3133364A1 (en) | 2017-02-22 |
CN106470538A (zh) | 2017-03-01 |
TWI602498B (zh) | 2017-10-11 |
CN106470538B (zh) | 2019-03-05 |
JP2017041530A (ja) | 2017-02-23 |
TW201717737A (zh) | 2017-05-16 |
US10314202B2 (en) | 2019-06-04 |
EP3133364B1 (en) | 2018-10-17 |
US20170055372A1 (en) | 2017-02-23 |
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