WO2014035196A1 - 금속 구조체 및 이의 제조방법 - Google Patents
금속 구조체 및 이의 제조방법 Download PDFInfo
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- WO2014035196A1 WO2014035196A1 PCT/KR2013/007857 KR2013007857W WO2014035196A1 WO 2014035196 A1 WO2014035196 A1 WO 2014035196A1 KR 2013007857 W KR2013007857 W KR 2013007857W WO 2014035196 A1 WO2014035196 A1 WO 2014035196A1
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- metal
- layer
- color control
- control layer
- metal structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44F—SPECIAL DESIGNS OR PICTURES
- B44F1/00—Designs or pictures characterised by special or unusual light effects
- B44F1/08—Designs or pictures characterised by special or unusual light effects characterised by colour effects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Definitions
- the present specification relates to a metal structure and a method for manufacturing the same.
- the present application claims the benefit of the application date of Korean Patent Application No. 10-2012-0096649 filed with the Korea Intellectual Property Office on August 31, 2012, the entire contents of which Included in the specification.
- the color is realized by a coating solution using a dye or a color is realized by a plating method.
- Such a conventional method requires an additional process in addition to the manufacturing process of the metal layer, which causes problems in terms of cost and process economy.
- the thickness of the metal layer becomes thick because the thickness is about several tens of micrometers, there was a problem in that the resistance properties of the para-metal is also reduced.
- the problem to be solved by the present application is to provide a metal structure for implementing a metal layer having a variety of colors.
- Metal layer provides a metal structure comprising a color control layer.
- One embodiment of the present application to form a metal layer on a substrate; And it provides a method for producing a metal structure comprising forming a color control layer on the metal layer.
- One embodiment of the present application to form a color control layer on the substrate; And forming a metal layer on the color control layer.
- One embodiment of the present application provides a bezel of a display substrate including the metal structure.
- An embodiment of the present application provides a touch screen panel including the metal structure. Ball.
- One embodiment of the present application provides a display device including the metal structure.
- the metal structure according to the embodiment of the present application may implement various colors while having a thin thickness, and the resistance characteristics of the metal layer are not deteriorated. Therefore, when applied to the bezel of the display substrate using the metal structure of the present application has an excellent decorative effect, it can also be applied to touch screen panels and display devices.
- FIG. 1 is a view illustrating a laminated structure of a metal structure including a color control layer as an embodiment of the present application.
- FIG. 2 illustrates CIE L * a * b * color coordinate reference brightness values (L *), color values (a *), and saturation values (b *) of the metal structures of Examples 1 to 6 and Comparative Example 1.
- FIG. 2 illustrates CIE L * a * b * color coordinate reference brightness values (L *), color values (a *), and saturation values (b *) of the metal structures of Examples 1 to 6 and Comparative Example 1.
- Figure 3 shows the reflectance of the metal structure at the full wavelength of visible light of Examples 1 to 6 and Comparative Example 1.
- Figure 4 shows the "Examples 7-11 and CIE L * a metal structure of Comparative Example 2 a * b * color coordinate standard name dogap (L *), the color values (a *), a saturation value (b *).
- FIG. 5 shows reflectances of the metal structures at all wavelengths of visible light in Examples 7 to 11 and Comparative Example 2.
- FIG. 6 illustrates CIE L * a * b * color coordinate reference brightness values (L *), color values (* a), and saturation values (* b) of the metal structures according to Examples 12 to 15 and Comparative Example 3.
- FIG. 6 illustrates CIE L * a * b * color coordinate reference brightness values (L *), color values (* a), and saturation values (* b) of the metal structures according to Examples 12 to 15 and Comparative Example 3.
- FIG. 7 shows reflectances at all wavelengths of visible light of the metal structures according to Examples 12-15 and Comparative Example 3.
- FIG. 8 shows transmittances at all wavelengths of visible light of the metal structures according to Examples 12 to 15 and Comparative Example 3.
- FIG. 8 shows transmittances at all wavelengths of visible light of the metal structures according to Examples 12 to 15 and Comparative Example 3.
- the display device is a term referring to a TV or a computer monitor, and includes a display element for forming an image and a case for supporting the display element.
- the display device may include a plasma display panel (PDP), a liquid crystal display (LCD), an electrophoretic display. (Electrophoret ic display), Cathode ray tube (Cathode_Ray Tube
- the display device may be provided with an RGB pixel pattern and an additional optical filter for implementing an image.
- bezel means at least one edge included in the display substrate.
- the bezel may be included in an area other than the effective screen unit.
- a sensor unit, a camera unit, a logo unit, a button unit or an open unit may be included in the edge region.
- the color of the bezel is often implemented using a silkscreen method.
- the silkscreen method produces a color several micrometers thick.
- the metal structure according to the embodiment of the present application is applied to the bezel, since the color may be expressed using a color control layer having a thickness of 5 nm to 500 nm, the height of the bezel is lowered, thereby improving the problem of poor contact of the screen.
- the bezel part and the electrode layer may be implemented in one process.
- the metal structure according to an embodiment of the present application is a substrate; Metal layer; And it provides a metal structure comprising a color control layer.
- the color control layer may be provided on at least one surface of the metal layer. For example, it may be provided on only one side of the metal layer, and may be provided on both sides of the metal layer.
- the metal layer may be provided between the substrate and the color control layer.
- the color control layer may be provided between the substrate and the metal layer.
- Metal structure according to an embodiment of the present application is a substrate; A metal layer provided on the substrate; It may include a color control layer provided on the metal layer.
- Metal structure according to an embodiment of the present application is a substrate; '
- Color control layer It may include a metal layer on the color control layer.
- Metal structure according to an embodiment of the present application is a substrate; A color control layer provided on the substrate; A metal layer provided on the color control layer; It may include a color control layer provided on the metal layer.
- the metal layer or the color control layer may be patterned.
- the metal dance may be a patterned metal layer or a metal pattern layer
- the color control layer may be a patterned color control layer or a color control pattern layer. The pattern form will be described later.
- the inventors of the present application while the thickness is thin, can implement a variety of colors, and to develop a metal structure that does not degrade the resistance characteristics of the metal layer.
- a color control layer including the same metal as the metal layer on one surface of the metal layer can realize various colors.
- various colors can be implemented by varying the thickness of the color control layer differently.
- the thickness of the color control layer can be adjusted in the range of 500 nm or less, specifically 300 nm or less, more specifically 100 nm or less.
- the thickness of the color control layer is 500 nm or less, specifically 300 nm or less, the thickness may be sufficient to control various colors, which is advantageous in terms of process productivity and process economy.
- the thickness of the color control layer is preferably 5nm or more, specifically lOnm or more. If the thickness of the color control layer is less than 5nm is too thin, the effect of the color adjustment is insignificant.
- the sheet resistance of the metal layer or the color control layer before patterning in the metal structure may be adjusted according to the thickness of the metal worm or the color control layer.
- the metal structure may have a refractive index n greater than 0 and less than or equal to 3.
- an extinction coefficient k of the color control layer may be 0.2 to 2.5.
- the extinction coefficient k is 0.2 or more, it is possible to implement various colors.
- the extinction coefficient k also called absorption coefficient, is a measure that can define how strongly the metal structure absorbs light at a specific wavelength, and determines the transmittance of the metal structure. For example, in the case of transparent dielectric materials, the k value is very small with k ⁇ 0.2. However, the metal inside the material As the component increases, the k value increases. If more ⁇
- the absorption of light occurs according to the n and k values, thereby reducing color reflectance of the metal layer and simultaneously implementing colors.
- the n and k values of the color control layer affect the destructive interference and lower the reflectance of a specific wavelength in the reflection spectrum, thereby realizing the color.
- the reflectance is a visible light wavelength incident to the surface to be measured at 90 ° after treating the surface opposite to the surface to be measured with a per feet black, specifically, the wavelength 300 It may mean a reflectance for light of ⁇ 800 nm, more specifically 380-780 nm.
- the reflectance may be measured when the metal layer is provided between the substrate and the color control layer, in a direction opposite to the surface where the color control layer is in contact with the metal layer. Specifically, when the color control layer includes a first surface in contact with the metal layer and a second surface facing the first surface, it may be measured in the direction of two surfaces.
- the reflectance may be measured at the substrate side when the color control layer is provided between the metal layer and the substrate.
- the total reflectance is measured based on a wavelength value of 300-800 nm, specifically 380-780 nm of reflected light reflected by a target pattern layer or a metal structure to which light is incident when the incident light is 100%. It can be one value.
- the color control layer may include a first surface in contact with the metal layer and a second surface facing the first surface.
- the total reflectance (Rt) of the metal structure may be calculated by Equation 1 below.
- Total reflectance (Rt) reflectance of the substrate + closure rate X reflectance of the color control layer
- the total reflectance Rt of the metal structure may be calculated by the following Equation 2.
- Total reflectance (Rt) reflectance of the substrate + closure rate X reflectance of the color control layer X2
- the total reflectance of the substrate may be a reflectance of the touch tempered glass, and when the surface is a film, it may be a reflectance of the film.
- the closure rate is based on the plane of the metal structure.
- the thickness of the color control layer it is possible to implement the color while lowering the reflection of a specific wavelength of the metal structure measured by the above method.
- the material of the metal layer resistivity 1X1 coming 6 ⁇ ⁇ ⁇ within 30X10- not and the material of 6 ⁇ ⁇ cm as appropriate, preferably 1 ⁇ 10 _6 ⁇ - cm to 7X10- 6 ⁇ ⁇ cm days can be.
- specific examples of the material of the metal layer are aluminum (A1), copper (Cu), nickel (Ni), vanadium (V), tungsten (, tantalum (Ta), molybdenum (Mo), neo It may include one or more selected from the group consisting of dimium (Nd), titanium (Ti), iron (Fe), chromium (Cr), cobalt (Co), gold (Au) and silver (Ag). for example, it may be two or more alloys selected from the inside of the gold. more specifically may 'comprise molybdenum, aluminum or copper. the metal layer may be a single film or a multilayer film.
- the thickness of the metal layer may be 1 nanometer to 10 micrometers, which may have a better effect in terms of the conductivity of the metal layer and the economics of the pattern forming process.
- the metal layer may be usually opaque, but the thickness of the metal layer may be Very thin diameters up to several nanometers In the case where the metal layer is opaque, an opaque metal structure having various colors including a color control layer in the opaque metal layer can be obtained, and in the case where the metal layer is transparent, various colors in which the color control layer is included in the transparent metal layer can be obtained.
- the metal layer when the metal layer is AI, when the thickness of the metal layer is 20 nanometers to 10 micrometers, the reflectivity is high and the transmittance is very small, so that the metal layer may be opaque. In the case of 1 nanometer to 20 nanometers, the total reflectance in the visible light region is 50% or less, and the average transmittance is 50% or less, and thus may be transparent.
- the color control layer may be provided directly on the substrate or directly on the metal worm without interposing the adhesive layer or the adhesive layer.
- the adhesive layer or adhesive layer may affect durability or optical properties.
- the metal structure according to the embodiment of the present application is completely different in the manufacturing method compared to the case using the adhesive layer or the adhesive layer. Moreover, it is comparable when using an adhesive layer or an adhesive.
- the interfacial properties of the filling and color control layers are excellent.
- the color control layer is a single
- the color control layer may be used including one or two or more selected from the group consisting of metal oxides, metal nitrides, metal oxynitrides and metal carbides. Oxides, nitrides, oxynitrides or carbides of the metal may be formed by deposition conditions set by those skilled in the art.
- the metal included in the color control layer is aluminum (A1), copper (Cu), nickel ( ⁇ ), vanadium (V), tungsten (W), tantalum (Ta), molybdenum (Mo), neodymium (Nd) And one or more alloys selected from the group consisting of titanium (Ti), iron (Fe), crumb (Cr), cobalt (Co), gold (Au) and silver (Ag).
- the color control layer may include Ni and Mo at the same time.
- the color control layer may include Ni 50 to 98 atomic% and Mo 2 to 50 atomic 3 ⁇ 4>, and may further include 0.01 to 10 atomic% of other metals such as Fe, Ta, Ti, etc. have.
- the color control layer if necessary, may further comprise 0.01 to 30 atomic% nitrogen or 4 atomic% or less oxygen and carbon.
- the color control layer is Ti0 2 - x , Si0 2 - x , MgF 2 - x and
- Dielectric material selected from SiN ⁇ -lxl) and / or aluminum (A1), copper (Cu), nickel (Ni), vanadium (V), tungsten (W), tantalum (Ta), molybdenum (Mo), neodymium Metals selected from the group consisting of (Nd), titanium (Ti), iron (Fe), crumb (Cr), cobalt (Co), gold (Au) and silver (Ag) and / or two or more alloys selected from these It may also include.
- the color adjusting layer may be made of only the dielectric material.
- the dielectric material and the metal and / or alloy are included together, the dielectric material is distributed to decrease gradually away from the direction in which external light is incident, and the metal and alloy components are vice versa. It is preferable. At this time, the content of the dielectric material is 20 to 50 weight 3 ⁇ 4>, the content of the metal is preferably 50 to 80 weight 3 ⁇ 4.
- the color control layer preferably contains 10 to 30 weight 3 ⁇ 4 of dielectric material, 50 to 80% by weight of metal and 5 to 40 weight 3 ⁇ 4 of alloy.
- the color control layer may be formed of a thin film including any one or more of an alloy of nickel and vanadium, an oxide of nickel and vanadium, nitride and oxynitride.
- vanadium is contained in 26 to 52 atomic%, and the atomic ratio of vanadium to nickel is preferably 26/74 to 52/48.
- the color control layer has two or more elements, one The ratio of elemental composition of 100 is negative depending on the direction of incident light.
- one element is ⁇ 3 ⁇ 4 ( ⁇ ), vananium (V), 3 ⁇ 4 stainless steel (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), titanium (Ti), iron (Fe), chromium ( It may be a metal element such as Cr), cobalt (Co), aluminum (A1) or copper (Cu), and elements other than the metal element may be oxygen, nitrogen or carbon.
- the color control layer may include a first chromium oxide layer, a metal layer, a second chromium oxide layer and a creme mirror, and replace nickel (Ni) and vanadium (V) in place of this chromium.
- Metals selected from tungsten (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), titanium (Ti), iron (Fe), cobalt (Co), aluminum (A1) and copper (Cu) can do.
- the metal layer has a thickness of 10 to 30 nm
- the first chromium oxide layer is 35 to 41 nm
- the second oxide layer has a thickness of 37 to 42 nm.
- a lamination structure of an alumina (A1 2 0 3 ) layer, a creme oxide (Cr 2 0 3 ) layer, and a cr (Cr) layer may be used as the color control layer.
- the alumina layer has an improvement in reflection characteristics and light diffusion prevention characteristics, and the chromium oxide layer may improve contrast characteristics by reducing mirror reflectance.
- the color control layer may use a laminated structure consisting of aluminum nitride (AlNx) and A1.
- AlNx aluminum nitride
- AlNx aluminum or nitride
- the metal layer may include aluminum and the color control layer may include an oxynitride of aluminum.
- the thickness of the color control layer can be obtained a metal structure having a variety of desired colors.
- the color of the color control layer can be adjusted to make the color of blue light.
- by adjusting the thickness of the color control layer may be a color of light often jumps.
- by adjusting the thickness of the color control layer can be made a gold color.
- the metal layer may include copper, and the color control layer may include an oxide of copper.
- the thickness of the color control layer can be obtained a metal structure having a variety of desired colors.
- the thickness of the color control layer may be adjusted to give a light brown color.
- the thickness of the color control layer can make the color of the dark sky light.
- the thickness of the color control layer can make the color of blue light.
- the thickness of the color control layer may be adjusted to give a violet color. or
- to adjust the thickness of the color control layer to adjust the thickness of the color control layer,
- the color control layer may be patterned simultaneously or separately with the metal layer.
- the patterned color control layer and the pretty turned metal layer may form a laminated structure by a simultaneous or separate patterning process.
- the structure in which at least a part of the light absorbing material is recessed or dispersed in the conductive pattern or the conductive pattern of a single layer may be differentiated from the structure in which a part of the surface side is physically or chemically modified by additional surface treatment.
- the color control layer may have a pattern of the same shape as the metal layer.
- the pattern scale of the patterned color control insect need not be exactly the same as the patterned metal layer, and the line width of the pattern in the patterned color control layer is narrower than the line width of the pattern in the patterned metal layer.
- the line width of the pattern in the patterned color control layer may be 80% to 120% of the line width of the pattern in the patterned metal layer.
- the patterned color control layer may have an area of 80% to 120% of the area provided with the patterned metal layer.
- the pattern of the color control layer is preferably in the form of a pattern having a line width equal to or larger than the line width of the pattern of the metal layer.
- the patterned color control layer When the patterned color control layer has a pattern shape having a line width larger than the line width of the pattern in the patterned metal layer, the patterned color control layer covers the patterned metal layer when the user looks at it. Since it can be larger, the effect of the gloss or reflection of the patterned metal layer itself can be effectively blocked. However, even if the line width of the pattern in the patterned color control layer is the same as the line width of the pattern in the patterned metal layer, the present invention can achieve the desired effect.
- the line width of the pattern in the patterned metal layer may be greater than 0 micrometer and less than or equal to 10 micrometers, specifically, greater than or equal to 0.1 micrometer and less than or equal to 10 micrometer, more specifically 0.2 micrometer It may be at least 8 micrometers, and more specifically, may be at least 0.5 micrometers and at most 5 micrometers.
- the opening ratio of the patterned metal layer that is, the area ratio not covered by the pattern may be 70% or more, 85% or more, and 95% or more.
- the opening ratio of the patterned metal layer may be 90 to 99.9%, but is not limited thereto.
- the pattern of may be a regular pattern or an irregular pattern.
- a pattern form in the art such as a mesh pattern may be used.
- the irregular pattern is not particularly limited, but may be in the form of a boundary line of figures constituting the Voronoi diagram.
- the diffraction pattern of the reflected light due to the directional illumination may be removed by the irregular pattern, and light scattered by the patterned color control layer. Minimize the effect by the various colors can be adjusted.
- a transparent substrate may be used as the substrate, but is not particularly limited.
- glass, a plastic substrate, a plastic film, and the like may be used.
- FIG. 1 illustrates a stacking order of a substrate, a metal layer, and a color control layer, and may be a front layer or a pattern when applied to a bezel of a display substrate.
- the substrate 100, the metal layer 200, and the color control layer 300 are arranged in order.
- the metal layer may be a patterned metal layer and the color control layer may be a patterned color control layer.
- the structure of the metal structure is the structure of the substrate / color cutting layer / metal layer, the structure of the substrate / metal layer / color control layer, of the substrate / color control layer / metal layer / color control layer Structure, base material / color control layer / metal layer / color control layer / metal layer / structure of the color control layer, substrate / color control layer / metal layer / color control layer / metal layer / structure of the color control layer and the like.
- the metal layer may be a patterned metal layer
- the color control layer may be a patterned color control layer.
- Method of manufacturing a metal structure comprises the steps of forming a metal layer on a substrate; And it may include the step of forming a color control layer on the metal layer.
- Method of manufacturing a metal structure comprises the steps of forming a color control layer on a substrate; And forming a metal layer on the color control layer.
- Method of manufacturing a metal structure is a color tone on the metal layer Forming a cut layer; And one of the metal layer or the color control layer
- the manufacturing method may further include patterning the metal layer and the color control layer, respectively or at the same time.
- Method of manufacturing a metal structure comprises the steps of forming a patterned metal layer on the substrate; And forming a color control layer before, after, or before and after forming the patterned metal layer.
- the manufacturing method of the metal structure may include forming a patterned color control layer on a substrate, and forming a patterned metal layer after forming the patterned color control layer. Can be.
- Method of manufacturing a metal structure comprises the steps of forming a patterned color control layer on the patterned metal layer; And laminating one side of the patterned metal layer or the patterned color control layer and the substrate.
- the description of the substrate, the metal worm, the color control layer is as described above.
- Formation of the metal layer may use a method known in the art. For example, it may be formed by evaporation, sputtering, wet coating, evaporation, electrolytic plating or electroless plating, lamination of metal foil, and specifically, by sputtering. Can be.
- Formation of the color control layer may also use a method known in the art.
- it can be formed by a method such as evaporation, sputtering, wet coating, evaporation, electrolytic plating or electroless plating, lamination of metal foil, and specifically, semi-ungous sputtering method. can do.
- a method of reactive sputtering using an A1 metal target may be performed by controlling the partial pressure of semi-aqueous gas such as 0 2 and N 2 .
- an inert gas such as a sputtering gas
- a gas such as Ar
- the method of forming the patterned metal layer is not particularly limited, and the patterned metal worm may be formed by a direct printing method, or the method of patterning the metal layer after forming the metal layer may be performed. It is available.
- an ink or paste of a conductive material may be used, and the paste may further include a binder resin, a solvent, a glass frit, etc., in addition to the conductive material. It may be included.
- a material having an etching resist property may be used.
- the patterning of the metal layer may use a method using an etching resist pattern.
- the etching resist pattern can be formed by printing, photolithography, photography, using a mask or by laser transfer, for example, thermal transfer imaging. The printing or photolithography The law is more desirable but not limited to this.
- the conductive thin film layer is etched and patterned using the etching resist pattern, and the etching resist pattern may be easily removed by a strip process.
- One embodiment of the present application provides a bezel of a display substrate including the metal structure.
- the bezel is included in the metal structure, various colors can be implemented, and have an excellent decorative effect, and the sheet resistance of the metal layer is also lowered.
- One embodiment of the present application provides a display substrate including the metal structure.
- One embodiment of the present application provides a touch screen panel including the metal structure.
- the metal structure according to the embodiment of the present application may be used as a touch sensitive electrode substrate.
- One embodiment of the present application provides a display device including the touch screen panel.
- the touch screen panel according to the exemplary embodiment of the present application may further include an additional structure in addition to the metal structure including the above-described substrate, the patterned metal layer, and the patterned color control layer.
- the two structures may be arranged in the same direction.
- the two structures may be installed in opposite directions.
- the additional structure may not include the patterned color control layer.
- the layer laminated structure in two or more structures may mutually differ.
- an insulating layer may be provided between them. At this time, the insulating layer may be further provided with the function of the adhesive layer.
- the touch screen panel includes a lower substrate; And an electrode layer provided on any one or both surfaces of the upper substrate, and a surface in contact with the upper substrate of the lower substrate, and a surface in contact with the lower substrate of the upper substrate.
- the electrode layer may perform X-axis position detection and Y-axis position detection, respectively.
- an electrode layer provided on a surface of the lower substrate and the upper substrate of the lower substrate; And one or both electrode layers provided on the upper substrate and the surface in contact with the lower substrate of the upper substrate may be a metal structure according to the above-described embodiment of the present application. If only one of the electrode layers is a metal structure according to the present application, the other may have a conductive pattern known in the art.
- an insulating layer or a spacer between the lower substrate and the upper substrate so as to maintain a constant gap between the electrode layers and prevent connection may be provided.
- the insulating layer may include an adhesive or UV or thermosetting resin.
- the touch screen panel may further include a ground part connected to the pattern of the metal layer in the metal structure described above.
- the ground portion may be formed at an edge portion of a surface on which the pattern of the metal layer of the substrate is formed.
- at least one surface of the laminate including the metal structure may be provided with at least one of an antireflection film, a polarizing film, or an anti-fingerprint film.
- a touch screen panel may be a display such as a 0LED display panel, a liquid crystal display (LCD), a cathode-ray tube (CRT), or a plasma display panel (PDP). It can be applied to the device.
- LCD liquid crystal display
- CRT cathode-ray tube
- PDP plasma display panel
- a patterned metal layer and a patterned color control layer may be provided on both surfaces of the substrate, respectively.
- Touch screen panel according to an embodiment of the present application is c
- the effective screen unit, the electrode unit, and the pad unit may be configured of the same conductor.
- the patterned color control layer may be provided on the side of the user.
- One embodiment of the present application provides a display device including the metal structure.
- the present application and a metal structure may be used in a color filter substrate or a thin film transistor substrate, a bezel pattern of a touch panel, a bridge pattern of a touch sensor, an electrode pattern of a touch sensor, and the like. Anywhere a metal structure according to one embodiment of the present application can be used.
- the thickness of the color control layer is 60nm thick (Example 1), 50nm thick (Example 2), 40nm thick (Example 3), 30nm thick (Example 4), 20nm thick (Example Example 5), A metal structure was prepared with a thickness of 10 nm (Example 6).
- a Cu layer having a thickness of 100 nm, which is a metal layer was prepared by a sputtering method.
- nitrogen, a semi-amorphous gas was added to form a Cu0x (0.5 ⁇ x ⁇ 1.5) layer by reactive sputtering.
- the thickness was adjusted by changing the deposition time of CuOx.
- the thickness of the color control layer is 100 nm thick (Example 7), thickness 75nm (Example 8), thickness 50nm (Example 9), thickness 40nm (Example 10), thickness 30nm (implementation) Example 11) was prepared as a metal structure.
- Example 1 lowered the reflectance of the wavelength of 550 ⁇ 650nm to about 03 ⁇ 4, blue light blue, and Example 2 lowered the reflectivity of the 500 ⁇ 600nm wavelength to about 03 ⁇ 4, red light Sensitivity was a mauve color.
- Example 3 the reflectance of the 400-500nm wavelength was reduced to about 0%, and the color of gold was reflected.
- Example 4 the reflectance of the 300-400nm wavelength was reduced to about 0%, and the lightness of the light was reflected.
- the gray color of dark gray was obtained by lowering the reflectance of short wavelengths of 500 nm or less.
- Comparative Example 1 had a light gray color of the original A1.
- Example 7 lowers the reflectance of short wavelengths of 500 nm or less and long wavelengths of 700 nm or more to 30% or less, resulting in light brown indigo, and Example 8 lowers the reflectance of long wavelengths of 600 nm or more to 20% or less. By giving it a dark sky light color.
- Example 9 the reflectance of the 600 ⁇ 700nm wavelength was reduced to about 0%, and blue light was reflected.
- the reflectivity of the 550 to 600nm wavelength was reduced to about 0%. Floated color.
- Example 11 the color of the light appeared frequently by lowering the reflectance of the short wavelength of 600 nm or less to 10% or less.
- Comparative Example 2 had the original color of Cu.
- Example 12 To a thickness of 80 nm (Example 12), a thickness of 60 nm (Example 13), a thickness of 40 nm (Example 14), and a thickness of 20 nm (Example 15).
- An A1 layer (Comparative Example 3) having a thickness of 5 nm as a metal layer on a PET substrate was prepared by a sputtering method.
- CIE Commission Internationale de ⁇ 'Eclairage
- L * a * b * brightness value (L *), color value (* a), Saturation value (* b) is shown in FIG. 7 shows the reflectances of the metal structures of Examples 12 to 15 and Comparative Example 3 at the visible light wavelength, and shows the transmittances of the metal structures of Examples 12 to 15 and Comparative Example 3 at the visible light wavelength. 8 is shown.
- Example 12 shows a dark sky color by lowering the reflectance of the long wavelength of 600nm or more to less than 20%
- Example 13 by lowering the reflectance of the 600 ⁇ 700nm wavelength to 0% lightly The color of blue light was shown, and
- Example 14 lowered the reflectance of the wavelength of 550 to 600 nm to 0%, and the color of violet was reflected.
- Example 15 lowered the reflectance of the wavelength of 380 to 500 nm to 203 ⁇ 4 or less. By giving it a light brown color.
- Comparative Example 3 had a light gray color of the original A1. 8, the transmittance of the metal structures according to Examples 12 to 15 and Comparative Example 3 can be confirmed.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US14/416,993 US9903989B2 (en) | 2012-08-31 | 2013-08-30 | Metal structure for decorative bezel and method for manufacturing same |
CN201380044019.XA CN104602909B (zh) | 2012-08-31 | 2013-08-30 | 金属结构体及其制造方法 |
JP2015528410A JP6183628B2 (ja) | 2012-08-31 | 2013-08-30 | ディスプレイ基板のベゼルおよびこの製造方法 |
EP13833250.7A EP2891554B1 (en) | 2012-08-31 | 2013-08-30 | Metal structure and method for manufacturing same |
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KR20120096649 | 2012-08-31 | ||
KR10-2012-0096649 | 2012-08-31 |
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US (1) | US9903989B2 (ko) |
EP (1) | EP2891554B1 (ko) |
JP (1) | JP6183628B2 (ko) |
KR (1) | KR101512236B1 (ko) |
CN (1) | CN104602909B (ko) |
TW (1) | TWI549814B (ko) |
WO (1) | WO2014035196A1 (ko) |
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Publication number | Publication date |
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EP2891554A4 (en) | 2016-03-16 |
US20150212244A1 (en) | 2015-07-30 |
EP2891554A1 (en) | 2015-07-08 |
EP2891554B1 (en) | 2018-01-31 |
CN104602909A (zh) | 2015-05-06 |
KR20140029333A (ko) | 2014-03-10 |
KR101512236B1 (ko) | 2015-04-16 |
TWI549814B (zh) | 2016-09-21 |
US9903989B2 (en) | 2018-02-27 |
JP2015533678A (ja) | 2015-11-26 |
JP6183628B2 (ja) | 2017-08-23 |
CN104602909B (zh) | 2017-04-26 |
TW201433452A (zh) | 2014-09-01 |
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