WO2014030393A1 - 抵抗変化素子、および抵抗変化素子の製造方法 - Google Patents
抵抗変化素子、および抵抗変化素子の製造方法 Download PDFInfo
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
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- H10N70/20—Multistable switching devices, e.g. memristors
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- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
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- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
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- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
Definitions
- the present invention relates to a variable resistance nonvolatile switching element (hereinafter referred to as “resistance variable element”) and a method of manufacturing the same.
- a resistance change element formed inside the multilayer wiring layer a memory composed of the resistance change element formed inside the multilayer wiring layer, and a resistance change element formed inside the multilayer wiring layer
- the present invention relates to a semiconductor device including a field programmable gate array (FPGA) configured by using the method and a method of forming a resistance change element in a multilayer wiring layer.
- FPGA field programmable gate array
- MOSFET Metal Oxide Semiconductor Field Effect Transistor
- the cause of the soaring lithography process is the soaring manufacturing equipment price and mask set price. Further, factors that determine the physical limit of the device dimension include an operation limit caused by miniaturization of the device dimension and a dimension variation limit.
- a “back-end device” is an active element mounted in a multilayer wiring layer of ULSI.
- MRAM Magnetic Random
- PRAM phase change random access memory
- ReRAM resistive random access memory
- a “back-end device” composed of variable resistance switching elements can be used as a non-volatile memory or as a non-volatile switch. It is expected as a means for reducing power consumption of a semiconductor device by omitting power required for maintenance.
- Back-end devices for example, non-volatile memories composed of resistance change elements such as MRAM, PRAM, and ReRAM increase the mounting capacity as semiconductor devices become smaller and have a larger storage capacity. It is expected that.
- FPGA rewritable programmable logic device
- the FPGA performs “switching of switching elements” after manufacturing the “logic device” chip, and allows the customer to select an arbitrary circuit configuration. It is expected that such “logic circuit switching” in the FPGA is performed by using a variable resistance element mounted in a multilayer wiring layer as a variable resistance nonvolatile switching element.
- an FPGA is configured using variable resistance elements that can be mounted in a multilayer wiring layer, the power consumption can be reduced while improving the degree of freedom of the circuit.
- variable resistance nonvolatile switching element suitable for the use of a “logic circuit switching” switch in an FPGA
- a resistance change element using an ionic conductor constituting a ReRAM that is, NanoBridge (NanoBridge ( NEC registered trademark).
- the ion conductor used in the variable resistance element is a solid electrolyte in which ions can freely move by an applied electric field.
- FIG. 14, FIG. 15, and FIG. 17 show an example of the configuration of the MRAM, PRAM, and ReRAM.
- FIG. 16 shows an example of the configuration of an FRAM (Ferroelectric RAM).
- MRAM uses the property that magnetization generated in a ferromagnetic body by a magnetic field applied from the outside remains in the ferromagnetic body even after the external magnetic field is removed.
- a structure in which two magnetic layers are stacked with an insulator interposed therebetween is used.
- the magnetization direction of one magnetic layer (fixed layer) is set as the reference magnetization direction, and the magnetization direction of the other magnetic layer (free layer) is changed according to stored data.
- the magnetoresistance varies depending on the coincidence / mismatch of the magnetization directions between the two ferromagnetic layers. Data is stored by utilizing the fact that the value of the current flowing through the storage element portion varies depending on the difference in magnetic resistance.
- the magnetization direction of the magnetic layer for data storage (free layer) is set according to the data to be stored, and the direction of the magnetic field applied from the outside to the magnetic layer for data storage (free layer) To decide.
- a current is supplied to a “write wiring” provided separately from the memory cell, and a magnetic field generated by the current flowing through the “write wiring” is changed to the magnetic layer for data storage (free Layer).
- a magnetic field generated by the current flowing through the “write wiring” is changed to the magnetic layer for data storage (free Layer).
- the direction of the current flowing through the “write wiring” is reversed, the direction of the generated magnetic field is also reversed.
- a method using a magnetic field generated by a current flowing through the “write wiring” is called a current magnetic field writing method.
- the magnetization direction of the magnetization free layer (free layer) due to the spin torque injected from the magnetization invariant layer (fixed layer) by passing a current directly through the structure in which two magnetic layers are stacked with an insulating film in between The “spin injection magnetization reversal method” is also used.
- the PRAM utilizes the characteristic that the resistance value changes as a result of the phase change material changing to a crystalline state (low resistance) or an amorphous state (high resistance) by an externally applied current.
- a structure having a phase change layer sandwiched between two electrodes is used.
- the resistivity varies greatly depending on the difference between the crystalline / amorphous phases of the “resistance change element film” made of the phase change material.
- Data is stored by utilizing the fact that the current flowing through the storage element varies with the difference in resistivity between the two phases of crystal / amorphous.
- Data writing is performed according to the data to be stored, phase change from “low resistance crystalline state” to “high resistance amorphous state”, or “high resistance amorphous state” to “low resistance crystalline state”.
- the current value and the pulse width that cause the phase change to are determined and set to either the “low resistance crystalline state” or the “high resistance amorphous state”.
- phase change material may be mentioned chalcogenide alloy, germanium, antimony, chalcogenide alloys (Ge 2 Sb 2 Te 5) consisting of tellurium is that typically, in general, the phase change material (Ge 2 Sb 2 Te 5 ) is described as “GST”.
- phase change material when the phase change material (GST) is in the “low resistance crystalline state”, it represents “1” and is called “set state”, and the phase change material (GST) is in the “high resistance amorphous state”. Represents “0” and is referred to as “reset state”.
- the set programming current pulse or the reset programming current pulse is applied to the storage element, thereby rewriting from the “reset state” to the “set state” and from the “set state” to the “reset state”. Reversible to reversibly.
- ReRAM ReRAM
- a conductive path is formed inside the variable resistance element film due to the voltage and current applied from the outside, and is turned on. Conversely, the conductive material formed inside the variable resistance element film The characteristic that the resistance value changes depending on whether the sexual path disappears and is set to the “OFF” state is used.
- the ReRAM cell a structure having a resistance change element film sandwiched between two electrodes is used. Utilizing the electric field induced giant resistance change effect (Colosal Electro-Resistance), for example, an electric field is applied to generate a filament inside a resistance change element film made of a metal oxide, or to conduct between two electrodes. The sexual path is formed and set to the “ON” state.
- Colosal Electro-Resistance Colosal Electro-Resistance
- the filament disappears, or the conductive path formed between the two electrodes disappears, and an “OFF” state is set.
- switching between the “ON” state and the “OFF” state in which the resistance values between the two electrodes are greatly different, is performed.
- Data is stored by utilizing the fact that the current flowing through the storage element differs according to the difference in resistance value between the “ON” state and the “OFF” state.
- select the voltage value, current value, and pulse width that cause the transition from the “OFF” state to the “ON” state and the transition from the “ON” state to the “OFF” state according to the data to be stored. Generation or disappearance of a filament for data storage, or formation or disappearance of a conductive path.
- Non-Patent Document 1 discloses a non-volatile switching element that reversibly changes and performs switching.
- the nonvolatile switching element disclosed in Non-Patent Document 1 includes an “ion conductive layer” made of an ionic conductor and a “first electrode” and a “first electrode” provided in contact with each of the two surfaces of the “ion conductive layer”. Second electrode ”.
- the “first metal” constituting the “first electrode” and the “second metal” constituting the “second electrode” constituting the nonvolatile switching element oxidize the metal and generate metal ions.
- the standard generation Gibbs energy ⁇ G in the process is different.
- the “bias voltage” that causes the transition from the “OFF” state to the “ON” state is applied between the “first electrode” and the “second electrode”, the “first electrode” and the “ion conduction layer” At the interface, the “first metal” constituting the “first electrode” is oxidized by an electrochemical reaction induced by an applied “bias voltage” to generate metal ions, and “ion conduction” A metal that can supply metal ions to the layer is employed.
- transition process from the “OFF” state to the “ON” state
- the first electrode and the ion conductive layer have the first electrode at the interface.
- the metal of the electrode becomes metal ions and dissolves in the ion conductive layer.
- metal ions in the ion conductive layer are deposited as metal in the ion conductive layer.
- a metal bridge structure is formed by the metal deposited in the ion conductive layer, and finally, a metal bridge connecting the first electrode and the second electrode is formed.
- transition process reset process
- the second electrode is grounded and a negative voltage is applied to the first electrode with respect to the switch in the “ON” state
- the metal constituting the metal becomes metal ions and dissolves in the ion conductive layer.
- a part of the “metal cross-linking structure” constituting the metal cross-linking is cut.
- the “metal bridge structure” constituting the conduction path becomes narrower, the resistance between the first electrode and the second electrode increases, and the first electrode and the ion conductive layer At the interface, the dissolved metal ions are reduced and deposited as metal, so the concentration of metal ions contained in the “ion conductive layer” decreases and the inter-electrode capacitance changes as the relative permittivity changes.
- the electrical characteristics change from the stage before the electrical connection is completely disconnected, and the electrical connection is finally disconnected.
- the transition process (set process) to the state proceeds. That is, in the metal bridge type resistance change element, the transition process (set process) from the “OFF” state to the “ON” state and the transition process (reset process) from the “ON” state to the “OFF” state are reversible. Can be done automatically.
- Non-Patent Document 1 discloses a configuration of a two-terminal switching element in which two electrodes are arranged via an ion conductor to control a conduction state between the two electrodes, and a switching operation thereof. ing.
- the two-terminal switching element to which the variable resistance element described above is applied has a feature that it is smaller in size than a semiconductor switch such as a MOSFET and has a small resistance in the “ON” state. This feature is considered promising for application to programmable logic devices. Further, in the resistance change type switching element, the conductive state (“ON” state or [OFF] state) is maintained as it is without applying the voltage used for the set operation and the reset operation after the set operation and the reset operation. The Therefore, the variable resistance switching element can be applied as a switching element constituting a nonvolatile memory element.
- a memory cell When configuring a non-volatile memory element, for example, a memory cell is configured with one selection element such as a transistor and one switching element as a basic unit. A plurality of the memory cells are arranged in the vertical direction and the horizontal direction, respectively, to form a “cell matrix”. Arranging memory cells in a matrix makes it possible to select an arbitrary memory cell from among a plurality of memory cells arranged in a matrix with word lines and bit lines. Then, the conduction state (“ON” state or [OFF] state) of the switching element of the selected memory cell is sensed, and information “1” or “0” is determined based on the “ON” state or [OFF] state of the switching element. It is possible to read which is stored. A non-volatile memory can be realized.
- Non-Patent Document 1 describes metal ion movement in an ion conductor (a solid electrolyte in which ions can move according to an applied electric field), and electrochemical reaction, that is, generation of metal ions by oxidation of metal (oxidation reaction).
- a switching element solid electrolyte switch
- the switching element disclosed in Non-Patent Document 1 includes an ion conductive layer, and a first electrode (active electrode) and a second electrode (inactive electrode) provided to face each other across the ion conductive layer. .
- the first electrode serves to supply metal ions to the ion conductive layer.
- the “dissolution of metal bridge” process generation of metal ions (oxidation reaction) due to oxidation of the metal constituting the second electrode does not occur, and generation of metal ions due to oxidation of the metal constituting the metal bridge proceeds.
- the MRAM is a magnetoresistive element that uses the magnetoresistive effect illustrated in FIG.
- a phase change material for example, Ge 2 Sb 2 Te 5
- an oxygen deficient resistance change element or a resistance change film made of a solid electrolyte using a resistance change film made of a metal oxide exhibiting an electric field induced giant resistance change effect illustrated in FIG.
- Is a metal bridge type resistance change element Is a metal bridge type resistance change element.
- Magnetic material used in a magnetoresistive element;
- Phase change material eg, Ge 2 Sb 2 Te 5
- Metal used in an oxygen deficient resistance change element
- Metal electrode that forms a metal / "metal oxide” junction with the "oxide” and the “metal oxide”
- solidelectrolyte used as an "ion conducting layer” in a metal bridge type resistance change element, "ion supply”
- the “first electrode” used as the “layer” and the “second electrode” for injecting electrons into the “ion conduction layer” lose their physical properties when subjected to “oxidation”, for example, and the desired resistance The characteristics of the changing element may not be achieved.
- the “porous membrane” used as the “ion conductive layer” in the metal bridge type resistance change element absorbs humidity (moisture), the absorbed moisture is a factor of “leakage current” in the “OFF” state
- the resistance variable switching element is formed by a passivation film (protective insulating film) excellent in insulation, oxidation resistance, and moisture resistance. Covering structure is adopted.
- a passivation film protecting insulating film
- the periphery of the metal bridge type resistance change element is covered with a SiN film excellent in insulation, oxidation resistance, and moisture resistance. We are trying to improve moisture resistance.
- the process itself for forming the passivation film must be free from the fear of causing "oxidation” or "moisture absorption". Also, since it covers the side wall surface of the resistance variable switching element, step coverage is required. It is necessary to be able to form using an isotropic deposition method that excels in resistance. Therefore, by applying the plasma CVD method, which is an isotropic deposition method, and using no oxygen-containing raw material, the deposited SiN film and SiCN film are suitable insulating materials as a passivation film (protective insulating film). It is.
- the excellent passivation performance of the SiN film and SiCN film deposited by applying the plasma CVD method for example, the effect of improving the oxidation resistance and moisture resistance is due to the high density of the formed SiN film and SiCN film. This is because moisture can be prevented from passing through the SiN film and the SiCN film.
- High density SiN films and SiCN films are used as insulating barrier films for preventing copper diffusion by utilizing the property of low membrane permeability.
- the relative dielectric constant k of the high-density SiN film and SiCN film is higher than that of the SiO 2 film and SiOC film used as the interlayer insulating film.
- the relative dielectric constant of the SiN film is 7.
- the passivation film constitutes the interlayer insulating film
- the effective relative dielectric constant k eff of the interlayer insulating film is increased. It has been found that due to the increase in the effective relative dielectric constant k eff of the interlayer insulating film, the parasitic capacitance between the wirings of the copper multilayer wiring increases, causing a signal delay and an increase in power consumption.
- Non-Patent Document 1 when a SiN film is used as a passivation film (protective insulating film) in the metal bridged resistance change element described in Non-Patent Document 1, the parasitic capacitance between wirings of a multilayer wiring layer on which the metal bridged resistance change element is mounted. Has been found to have a problem of increasing.
- an object of the present invention is to provide a passivation film (protective insulating film) for improving resistance to oxidation and moisture by covering the resistance change element with respect to the resistance change element arranged in the multilayer wiring layer.
- a passivation film protecting insulating film
- the resistance change of a new configuration that can be made a highly reliable resistance change element while keeping the inter-wiring parasitic capacitance of the multilayer wiring layer on which the resistance change element is mounted low.
- the inventors of the present application employ, for example, a SiN film as a passivation film (protective insulating film) that covers the variable resistance element and improves oxidation resistance and moisture resistance.
- a SiN film as a passivation film (protective insulating film) that covers the variable resistance element and improves oxidation resistance and moisture resistance.
- the inventors have thought that it is effective to remove a portion of the passivation film (protective insulating film) that is not used for covering the resistance change element, except for a portion used for covering the resistance change element.
- the passivation film is used as one of a plurality of insulating films constituting the interlayer insulating film.
- variable resistance element a portion used for covering the variable resistance element remains, and an interlayer insulating film is formed so as to cover the remaining passivation film (protective insulating film). It can be provided in the upper wiring layer.
- the inventors of the present application completed the present invention and solved the problem based on the knowledge described above with respect to the problem they found.
- variable resistance element is A resistance change element provided in a wiring layer on a semiconductor substrate,
- the wiring layer has a first interlayer insulating film and a second interlayer insulating film located on the first interlayer insulating film,
- the variable resistance element is A resistance change film formed on the first interlayer insulating film;
- a first electrode formed in contact with the upper surface of the variable resistance film;
- a protective insulating film that covers at least the side surface of the resistance change film is formed on the side surface of the resistance change element that includes the resistance change film and the first electrode.
- At least the protective insulating film formed on the side surface of the variable resistance element is covered with a second interlayer insulating film, In the variable resistance element, the second interlayer insulating film and the first interlayer insulating film are in direct contact with each other.
- the protective insulating film is formed of a SiN film, the effect of the present invention is remarkable.
- the wiring constituting the wiring layer is a copper wiring
- the first interlayer insulating film is preferably in contact with the upper surface of the lower copper wiring.
- the first interlayer insulating film has an opening, It is preferable that the variable resistance film of the variable resistance element is in contact with the upper surface of the lower copper wiring through the opening.
- the first interlayer insulating film is preferably formed of a SiN film or a SiCN film.
- the first electrode is made of a metal mainly composed of Ru
- the variable resistance film may be configured to be a film made of a solid electrolyte.
- the membrane made of the solid electrolyte is preferably a porous membrane.
- variable resistance film may also employ a configuration including an oxide.
- the second interlayer insulating film is preferably a SiO 2 film.
- an upper surface protective film is formed on the upper surface of the first electrode, It is desirable to select a configuration in which the protective insulating film covers the side surfaces of the resistance change film, the first electrode, and the upper surface protective film.
- variable resistance element By adopting the configuration of the variable resistance element according to the present invention, upper and lower wiring layers constituting a multilayer wiring layer while maintaining high reliability of the variable resistance element provided in the wiring layer on the semiconductor substrate.
- the parasitic capacitance can be reduced.
- FIG. 1 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the first embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 2 is a cross-sectional view schematically showing a configuration example of a variable resistance element according to the second embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 3 is a cross-sectional view schematically showing a configuration example of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- FIG. 1 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the first embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 2 is a cross-section
- FIG. 4 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the fourth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 5 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the fifth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 6 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the sixth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 5 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the fifth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 6 is a
- FIG. 7 is a cross-sectional view schematically showing the configuration of the first embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- FIG. FIG. 8 is a cross-sectional view schematically showing the configuration of the second embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- FIG. FIG. 9 is a cross-sectional view schematically showing the configuration of the third embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- FIG. 10 shows a case where the first interlayer insulating film and the second interlayer insulating film are used in the “third embodiment” shown in FIG. It is sectional drawing which shows typically the structure which employ
- FIG. 11 is a cross-sectional view schematically showing the configuration of the fourth embodiment in the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- FIG. FIG. 12A shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- FIG. 12B shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows typically step B2 in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12C shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows typically step B3 in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12D shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B4 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12E shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B5 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12D shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B5 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12F shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows typically step B6 in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12G shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B7 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12H shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B8 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 12I shows an example of a process for manufacturing a variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. It is sectional drawing which shows step B9 typically in a series of processes of the manufacturing process of a resistance change element.
- FIG. 13 is a diagram for explaining the switching process in the copper filament variable resistance element.
- FIG. 14 is a diagram schematically illustrating an example of the configuration of an MRAM (Magnetic RAM).
- FIG. 15 is a diagram schematically illustrating an example of the configuration of a PRAM (Phase-change RAM).
- FIG. 16 is a diagram schematically illustrating an example of a configuration of an FRAM (Ferroelectric RAM).
- FIG. 17 is a diagram schematically illustrating an example of the configuration of a ReRAM (Resistive RAM).
- FIG. 1 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the first embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- the resistance change element 199 is formed in a wiring layer on a semiconductor substrate (not shown).
- the multilayer wiring layer provided with the variable resistance element 199 includes a first interlayer insulating film 101 and a second interlayer insulating film 102 located above the first interlayer insulating film 101.
- the resistance change element 199 is formed on the first interlayer insulating film 101 and includes the first electrode 104 and the resistance change film 103.
- the side surfaces of the first electrode 104 and the variable resistance film 103 are covered with a protective insulating film 106.
- the second interlayer insulating film 102 located above the first interlayer insulating film 101 and the first interlayer insulating film 101 are in direct contact with each other.
- the resistance change film 103 is formed on the surface of a lower wiring layer (not shown) through a hole opened in the first interlayer insulating film 101 (not shown because it is located in the front or back direction). It touches. Therefore, in the opened hole portion, the lower surface of the resistance change film 103 is in contact with the lower wiring layer, and the upper surface of the resistance change film 103 is in contact with the first electrode 104.
- the lower wiring layer When the resistance change film 103 is formed of a solid electrolyte and the lower wiring layer is a copper wiring layer, the lower wiring layer generates copper ions by an electrochemical reaction and supplies ions into the resistance change film 103. Functions as a supply layer. That is, the copper filament deposition in which the resistance change film 103 is an “ion conductive layer”, the lower wiring layer is a “first electrode” that functions as an “ion supply layer”, and the first electrode 104 is a “second electrode” A variable resistance element of the type is configured.
- the resistance change film 103 is made of a solid electrolyte that functions as an ion conductor to which copper ions can move. It is a film.
- a solid electrolyte that constitutes the resistance change film 103 it can be used TaO, TaSiO, SiO 2, ZrO 2, HfO 2, TiO 2, Al 2 O 3, an organic polymer film, or an organic polymer film containing SiO.
- the first electrode 104 is an electrode including a metal whose absolute value of the standard generation Gibbs energy ⁇ G of oxidation (a process in which metal ions are generated from a metal) is smaller than that of copper.
- the first electrode 104 may constitute a laminated structure composed of a lower layer portion that is in contact with the resistance change film 103 and an upper layer portion laminated on the lower layer portion. It is formed of a metal having a small absolute value of standard generation Gibbs energy ⁇ G of oxidation (a process in which metal ions are generated from metal).
- a stacked structure of Ru (lower layer) / Ta (upper layer) may be used as the first electrode 104.
- the resistance change element 199 is formed of a laminated structure of a lower wiring layer, a resistance change film 103, and a first electrode 104 formed in a hole portion opened in the first interlayer insulating film 101.
- the first interlayer insulating film 101 covers the upper surface of the lower wiring layer.
- the first interlayer insulating film 101 can be composed of a SiN film, a SiCN film, a SiC film, or a stacked film thereof, or a stacked film of these films and another insulating film.
- the second interlayer insulating film 102 can be composed of a SiO 2 film or a SiOC film.
- the second interlayer insulating film 102 is formed so as to cover the upper surfaces of the resistance change element 199 and the first interlayer insulating film 101. Therefore, the second interlayer insulating film 102 and the first interlayer insulating film 101 are It is in the form of direct contact.
- the side surfaces of the first electrode 104 and the resistance change film 103 are covered with a protective insulating film 106.
- the protective insulating film 106 can be formed using a SiN film.
- the intruded moisture (H 2 O) is oxidized on the copper filament formed inside the resistance change film 103, and the resistance change film 103.
- This causes oxidation of the upper surface of the lower wiring layer in contact (copper wiring layer) or oxidation of the lower surface of the first electrode 104 in contact with the resistance change film 103. That is, the oxidation caused by the invading moisture (H 2 O) is one of the causes of the failure that causes the resistance state of the resistance change element 199 to fluctuate.
- the protective insulating film 106 moisture can be prevented from entering the solid electrolyte from the side surface of the resistance change film 103, and the occurrence of the defect can be suppressed.
- the resistance change element 199 is formed of a laminated structure of a lower wiring layer, a resistance change film 103, and a first electrode 104 formed in a hole portion opened in the first interlayer insulating film 101.
- programming switching
- FIG. 2 is a cross-sectional view schematically showing a configuration example of a variable resistance element according to the second embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- the resistance change element 299 according to the second embodiment is formed in a wiring layer on a semiconductor substrate (not shown).
- the multilayer wiring layer in which the resistance change element 299 is provided includes a first interlayer insulating film 201 and a second interlayer insulating film 202 located on the first interlayer insulating film 201.
- the resistance change element 299 is formed on the first interlayer insulating film 201 and includes a first electrode 204, a resistance change film 203, and a second electrode 205. Side surfaces of the first electrode 204, the resistance change film 203, and the second electrode 205 constituting the resistance change element 299 are covered with a protective insulating film 206.
- the second interlayer insulating film 202 located on the first interlayer insulating film 201 and the first interlayer insulating film 201 are in direct contact with each other.
- the resistance change film 203 is made of an oxide that functions as a solid electrolyte.
- the resistance change film 203 can be formed using TaO, TaSiO, ZrO 2 , HfO 2 , TiO 2 , SiO 2 , Al 2 O 3, or a laminated structure thereof.
- the first electrode 204 in contact with the upper surface of the resistance change film 203 and the second electrode 205 in contact with the lower surface of the resistance change film 203 are, for example, Pt, Ru, Ir, Ti, Ta, Hf, Zr, Al, W, Can be formed using these nitrogen compounds.
- the side surfaces of the first electrode 204, the resistance change film 203, and the second electrode 205 constituting the resistance change element 299 are covered with a protective insulating film 206.
- the first interlayer insulating film 201 in contact with the second electrode 205 includes a SiN film, a SiCN film, a SiC film, Alternatively, they are formed by a laminated film of those films or a laminated film of an insulating film different from those films.
- the second interlayer insulating film 202 covering the upper surface of the first electrode 204 is formed of a SiO 2 film or a SiOC film.
- the second interlayer insulating film 202 is formed by forming the protective insulating film 206 using the SiN film, oxidation occurs from the side surface of the first electrode 204 and the side surface of the second electrode 205. It is possible to prevent the metal oxide from being generated on the lower surface of the first electrode 204 that is in contact with the upper surface of the resistance change film 203 and the upper surface of the second electrode 205 that is in contact with the lower surface of the resistance change film 203. .
- the resistance change element 299 is an oxygen deficient resistance change element including a stacked structure of the second electrode 205, the resistance change film 203, and the first electrode 204, the second electrode 205 and the first electrode Programming (switching) can be performed by applying a predetermined programming voltage between the electrodes 204.
- FIG. 3 is a cross-sectional view schematically showing a configuration example of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device.
- the resistance change element 399 is formed in a wiring layer on a semiconductor substrate (not shown).
- the multilayer wiring layer in which the variable resistance element 399 is provided includes a first interlayer insulating film 301 and a second interlayer insulating film 302 located on the first interlayer insulating film 301.
- the resistance change element 399 is formed on the first interlayer insulating film 301 and includes a first electrode 304 and a resistance change film 303.
- an upper surface protective film 307 that covers the upper surface of the first electrode 304 is provided.
- the protective insulating film 306 also covers the side surface of the upper surface protective film 307.
- the second interlayer insulating film 302 located on the first interlayer insulating film 301 and the first interlayer insulating film 301 are in direct contact with each other.
- the resistance change film 303 is formed on the surface of the lower wiring layer (not shown) through a hole opened in the first interlayer insulating film 301 (not shown because it is located in the front or back direction). Touching. Therefore, in the opened hole portion, the lower surface of the resistance change film 303 is in contact with the lower wiring layer, and the upper surface of the resistance change film 303 is in contact with the first electrode 304.
- the lower wiring layer When the resistance change film 303 is formed of a solid electrolyte and the lower wiring layer is a copper wiring layer, the lower wiring layer generates copper ions by an electrochemical reaction and supplies ions into the resistance change film 303. Functions as a supply layer. That is, the copper filament deposition in which the resistance change film 303 is an “ion conduction layer”, the lower wiring layer is a “first electrode” that functions as an “ion supply layer”, and the first electrode 304 is a “second electrode” A variable resistance element of the type is configured.
- variable resistance element except for the upper surface protective film 307 and the protective insulating film 306, the configuration of the variable resistance element according to the third embodiment shown in FIG. 3 is the same as that of the first embodiment shown in FIG.
- the configuration of the variable resistance element can be selected to be substantially the same.
- the resistance change element 399 includes a laminated structure of a lower wiring layer, a resistance change film 303, and a first electrode 304, which is formed in a hole portion opened in the first interlayer insulating film 301.
- the first interlayer insulating film 301 covers the upper surface of the lower wiring layer.
- the first interlayer insulating film 301 can be composed of a SiN film, a SiCN film, a SiC film, or a stacked film thereof, or a stacked film of these films and another insulating film.
- the second interlayer insulating film 302 can be composed of a SiO 2 film or a SiOC film.
- the second interlayer insulating film 302 is formed so as to cover the upper surfaces of the resistance change element 399 and the first interlayer insulating film 301. Therefore, the second interlayer insulating film 302 and the first interlayer insulating film 301 are It is in the form of direct contact.
- the protective insulating film 306 is made of a SiN film, like the protective insulating film 106 of the variable resistance element according to the first embodiment shown in FIG. 1. It is preferable to form by using.
- the protective insulating film 306 when the second interlayer insulating film 302 is formed, oxidation proceeds from the side surface of the first electrode 304, and on the lower surface of the first electrode 304 in contact with the resistance change film 303. A situation in which a metal oxide is generated can be prevented.
- the invaded moisture (H 2 O) is oxidized by the copper filaments formed inside the resistance change film 303, and the resistance change film 303.
- the protective insulating film 306 moisture can be prevented from entering the solid electrolyte from the side surface of the resistance change film 303, and the occurrence of the defect can be suppressed.
- an upper surface protective film 307 covering the upper surface of the first electrode 304 is provided, and the second interlayer insulating film 302 is formed.
- the upper surface protective film 307 is preferably formed using a SiN film.
- FIG. 4 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the fourth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- the resistance change element 499 is formed in a wiring layer on a semiconductor substrate (not shown).
- the multilayer wiring layer in which the variable resistance element 499 is provided includes a first interlayer insulating film 401 and a second interlayer insulating film 402 located on the first interlayer insulating film 401.
- the resistance change element 499 is formed on the first interlayer insulating film 401 and includes a first electrode 404 and a resistance change film 403.
- variable resistance elements 499 at least the side surfaces of the variable resistance film 403 are covered with a protective insulating film 406. As shown in FIG. 4, the protective insulating film 406 also covers the lower side surface of the first electrode 404 in contact with the upper surface of the resistance change film 403.
- the second interlayer insulating film 402 located on the first interlayer insulating film 401 and the first interlayer insulating film 401 are in direct contact with each other.
- the resistance change film 403 is formed on the surface of the lower wiring layer (not shown) through a hole opened in the first interlayer insulating film 401 (not shown because it is located in the front or back direction). It touches. Therefore, in the opened hole portion, the lower surface of the resistance change film 403 is in contact with the lower wiring layer, and the upper surface of the resistance change film 403 is in contact with the first electrode 404.
- the lower wiring layer When the resistance change film 403 is formed of a solid electrolyte and the lower wiring layer is a copper wiring layer, the lower wiring layer generates copper ions by an electrochemical reaction and supplies ions into the resistance change film 403. Functions as a supply layer. That is, the copper filament deposition in which the resistance change film 403 is an “ion conduction layer”, the lower wiring layer is a “first electrode” that functions as an “ion supply layer”, and the first electrode 404 is a “second electrode” A variable resistance element of the type is configured.
- variable resistance element according to the fourth embodiment shown in FIG. 4 is the same as that of the first embodiment shown in FIG.
- the configuration of the variable resistance element according to the above can be selected to be substantially the same.
- variable resistance element In the variable resistance element according to the fourth embodiment, at least the upper part of the first electrode 404 excluding the lower part of the first electrode 404 in contact with the upper surface of the variable resistance film 403 does not require protection against oxidation. Consists of conductive material. For example, when the entire first electrode 404 or the upper portion of the first electrode 404 is formed of a metal having excellent oxidation resistance such as Pt, the upper portion of the first electrode 404 needs to be protected against oxidation. And not.
- the protective insulating film 406 is formed of an SiN film, similar to the protective insulation film 106 of the resistance change element according to the first embodiment shown in FIG. 1. It is preferable to form by using.
- the protective insulating film 406 when the second interlayer insulating film 402 is formed, oxidation proceeds from the lower side surface of the first electrode 404, and the first electrode 404 in contact with the resistance change film 403 is formed. A situation in which metal oxide is generated on the lower surface can be prevented.
- the intruded moisture (H 2 O) is oxidized by the oxidation of the copper filament formed inside the resistance change film 403, and the resistance change film 403.
- the protective insulating film 406 moisture can be prevented from entering the solid electrolyte from the side surface of the resistance change film 403, and the occurrence of the defect can be suppressed.
- FIG. 5 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the fifth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- the resistance change element 599 is mounted in a copper wiring layer formed on a semiconductor substrate.
- the multilayer wiring layer in which the variable resistance element 599 is provided includes a first interlayer insulating film 501 and a second interlayer insulating film 502 located above the first interlayer insulating film 501.
- the resistance change element 599 is formed on the first interlayer insulating film 501 and includes a first electrode 504 and a resistance change film 503.
- the copper wiring layer 510 formed on the semiconductor substrate has a structure in which a side surface and a bottom surface that are in contact with the wiring groove are covered with a barrier metal 509 in a wiring groove provided in a lower interlayer insulating film, and copper is a main component.
- a copper wiring 508 made of metal is formed.
- the barrier metal 509 used for the production of the copper wiring layer 510 is composed of a refractory metal such as Ta, Ti, or W, a nitrogen compound thereof, or a stacked structure of these metals and a nitrogen compound.
- the first interlayer insulating film 501 is formed so as to cover the upper surface of the copper wiring layer 510, and also has a function as an insulating barrier film for preventing diffusion of copper from the copper wiring layer 510.
- the first interlayer insulating film 501 is formed of a SiN film, a SiCN film, a SiC film or the like or a stacked structure thereof.
- the interlayer insulating film 502 can be composed of a SiO 2 film or a SiOC film.
- variable resistance element 599 is also formed on the first interlayer insulating film 501, and includes the first electrode 504 and the variable resistance film 503. It has.
- the resistance change film 503 When the resistance change element 599 according to the fifth embodiment constitutes a copper filament deposition type resistance change element, the resistance change film 503 has a hole opened in the first interlayer insulating film 501 (front side or back side). And is in contact with the surface of the lower-layer copper wiring layer 510. Therefore, in the opened hole portion, the lower surface of the resistance change film 503 is in contact with the lower copper wiring layer 510, and the upper surface of the resistance change film 503 is in contact with the first electrode 504.
- the lower copper wiring layer 510 functions as an ion supply layer that generates copper ions by electrochemical reaction and supplies the copper ions into the resistance change film 503.
- the resistance change film 503 is an “ion conductive layer”
- the lower copper wiring layer 510 is a “first electrode” that functions as an “ion supply layer”
- the first electrode 504 is a “second electrode”.
- a filament deposition type resistance change element is configured.
- the side surfaces of the first electrode 504 and the resistance change film 503 are covered with a protective insulating film 506.
- the protective insulating film 506 can be formed using a SiN film.
- the intruded moisture (H 2 O) comes into contact with the oxidation of the copper filament formed inside the resistance change film 503 and the resistance change film 503.
- the oxidation due to the invading moisture (H 2 O) is one of the causes of a defect that causes the resistance state of the resistance change element 599 to fluctuate.
- the protective insulating film 506 moisture can be prevented from entering the solid electrolyte from the side surface of the resistance change film 503, and the occurrence of the defect can be suppressed.
- the first interlayer insulating film 501 is formed of a SiN film having a large relative dielectric constant
- the second interlayer insulating film 502 is formed of a SiO 2 film or a SiOC film having a small relative dielectric constant
- FIG. 6 is a cross-sectional view schematically showing a configuration example of a resistance change element according to the sixth embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- variable resistance element 699 As shown in FIG. 6, the variable resistance element 699 according to the sixth embodiment is mounted in a copper wiring layer formed on a semiconductor substrate.
- the multilayer wiring layer in which the variable resistance element 699 is provided includes a first interlayer insulating film 601 and a second interlayer insulating film 602 located on the first interlayer insulating film 601.
- the resistance change element 699 constitutes a copper filament deposition type resistance change element.
- the resistance change film 603 is in contact with the surface of the lower copper wiring layer 610 through a hole opened in the first interlayer insulating film 601. Therefore, in the opened hole portion, the lower surface of the resistance change film 603 is in contact with the lower copper wiring layer 610, and the upper surface of the resistance change film 603 is in contact with the first electrode 604.
- the copper wiring 608 of the lower copper wiring layer 610 functions as an “ion supply layer” that generates copper ions by electrochemical reaction and supplies them into the resistance change film 603.
- the resistance change film 603 serves as an “ion conductive layer”
- the copper wiring 608 of the lower copper wiring layer 610 functions as an “ion supply layer”
- the first electrode 604 serves as a “second electrode”.
- a copper filament deposition type resistance change element is configured.
- a copper wiring layer 610 formed on a semiconductor substrate has a structure in which a side surface and a bottom surface that are in contact with the wiring groove are covered with a barrier metal 609 in a wiring groove provided in a lower interlayer insulating film, and copper is a main component.
- a copper wiring 608 made of metal is formed.
- the barrier metal 609 used for the production of the copper wiring layer 610 is composed of a refractory metal such as Ta, Ti, or W, a nitrogen compound thereof, or a laminated structure of these metals and a nitrogen compound.
- the copper wiring 608 of the lower copper wiring layer 610 functions as an “ion supply layer” for supplying copper ions.
- the “copper” forming the copper wiring 608 may contain metals such as Al, Ti, tin (Sn), and Mg as impurities.
- the resistance change film 603 is formed of a solid electrolyte capable of conducting copper ions, and is used as an “ion conductive layer”.
- a solid electrolyte capable of conducting copper ions it can be used TaO, TaSiO, SiO 2, ZrO 2, HfO 2, TiO 2, Al 2 O 3, an organic polymer film, or an organic polymer film containing SiO.
- the first interlayer insulating film 601 is formed so as to cover the upper surface of the copper wiring layer 610 and also functions as an insulating barrier film for preventing copper diffusion from the upper surface of the lower copper wiring layer 610. .
- the first interlayer insulating film 601 is formed of a SiN film, a SiCN film, a SiC film or the like or a stacked structure thereof.
- the lower surface of the resistance change film 603 is formed on the surface of the copper wiring 608 of the lower copper wiring layer 610 through the hole opened in the first interlayer insulating film 601. Touching.
- the upper surface of the resistance change film 603 is in contact with the first electrode 604.
- the metal material forming the first electrode 604 is preferably Ru or platinum (Pt).
- the side surfaces of the first electrode 604 and the resistance change film 603 are covered with a protective insulating film 606.
- the side surface of the resistance change film 603 formed in the hole opened in the first interlayer insulating film 601 is in contact with the side wall surface of the hole.
- the first interlayer insulating film 601 also has a function as an insulating barrier film for preventing copper diffusion from the copper wiring 608 of the lower copper wiring layer 610, so that the upper part of the first interlayer insulating film 601
- the second interlayer insulating film 602 located at can be composed of a SiO 2 film or a SiOC film.
- the protective insulating film 606 covering the side surfaces of the first electrode 604 and the resistance change film 603 can be formed using a SiN film.
- oxidation proceeds from the side surface of the first electrode 604, and is formed on the lower surface of the first electrode 604 in contact with the resistance change film 603. A situation in which a metal oxide is generated can be prevented.
- the intruded moisture (H 2 O) is oxidized by the copper filament formed inside the resistance change film 603, and the resistance change film 603.
- This causes oxidation of the upper surface of the copper wiring 608 of the lower copper wiring layer 610 that is in contact with it, or oxidation of the lower surface of the first electrode 604 that is in contact with the resistance change film 603.
- the oxidation due to the invading moisture (H 2 O) is one of the causes of a defect that causes the resistance state of the resistance change element 699 to fluctuate.
- the protective insulating film 606 moisture can be prevented from entering the solid electrolyte from the side surface of the resistance change film 603, and the occurrence of the defect can be suppressed.
- the resistance change element 699 is a copper filament deposition type resistance change element.
- the resistance change element 699 has a copper wiring layer 610 that is a lower layer from the lower surface of the first electrode 604.
- a “copper filament” that reaches the upper surface of the copper wiring 608 is generated, resulting in a “low resistance” state, resulting in an “ON” state.
- the “copper filament” generated in the resistance change film 603 is dissolved, and the lower surface of the first electrode 604 and the upper surface of the copper wiring 608 of the lower copper wiring layer 610 pass through the “copper filament”.
- the “high resistance” state is entered, resulting in an “OFF” state.
- the “copper filament” is generated by the deposited copper. That is, when the deposited copper generates a “protrusion” on the surface of the “second electrode”, electric field concentration occurs in the “protrusion” portion, and the supply of electrons proceeds more preferentially. Preferential copper deposition occurs at the tip of the part. As a result, it grows into a “copper filament” starting from the “projection” portion generated on the surface of the “second electrode”.
- the tip of the “copper filament” growing from the “second electrode” side approaches the surface of the “first electrode”, and the diameter of the “copper filament” increases in parallel.
- the current passing through the “copper filament” causes an “ion conduction current” due to the “ion conduction” of the copper ions in the solid electrolyte. Replace and rapidly transition to the “low resistance” state.
- the deposition process of the “copper filament” includes oxidation of copper to copper ions due to an applied electric field at the interface between the copper wiring 608 of the lower copper wiring layer 610 and the resistance change film 603 made of a solid electrolyte, This can be explained by a migration model formula of the generated copper ions into the “resistance change film” 603.
- the threshold voltage (threshold electric field E th ) of the switching operation varies. Variations in the threshold voltage (threshold electric field E th ) of the resistance change operation (switching operation) cause a malfunction of the “resistance change element”.
- the “resistance change film” 603 of the “resistance change element” and the “passivation film” that prevents contact with moisture in the surrounding environment, that is, the protective insulating film 606 It is necessary to cover the side surface of the “resistance change film” 603 to protect the “resistance change film” 603 from moisture.
- FIG. 7 is a cross-sectional view schematically showing a first embodiment of a variable resistance element according to a third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device. .
- the resistance change element of the first embodiment shown in FIG. 7 is configured in the form of a two-terminal solid electrolyte switch.
- the resistance change film 703 uses the copper wiring 708 of the lower copper wiring layer (first copper wiring) 710 as a “first electrode” that functions as an “ion supply layer”.
- the resistance change film 703 is formed of a solid electrolyte and functions as an “ion conductive layer”.
- a “first electrode” 704 in contact with the upper surface of the resistance change film 703 has a laminated structure including a first upper electrode 704a and a second upper electrode 704b. Of the “first electrode” 704, the first upper electrode 704 a is in contact with the upper surface of the resistance change film 703.
- An upper surface protective film 707 is provided on the upper surface of the “first electrode” 704, that is, on the upper surface of the second upper electrode 704 b.
- the resistance change film 703 and the “first electrode” 704 of the resistance change element 799 are formed on the upper surface of the first interlayer insulating film 701.
- the resistance change film 703 is in contact with the surface of the copper wiring 708 of the lower copper wiring layer (first copper wiring) 710 through a hole opened in the first interlayer insulating film 701. Accordingly, in the opened hole portion, the lower surface of the resistance change film 703 is in contact with the “first electrode” functioning as the “ion supply layer”, and the upper surface of the resistance change film 703 functions as the “second electrode”.
- One electrode 704 is in contact with the structure. Accordingly, the resistance change element 799 constitutes a copper filament deposition type resistance change element.
- the side surfaces of the resistance change film 703, the first upper electrode 704a and the second upper electrode 704b, and the upper surface protective film 707 are covered with a protective insulating film 706.
- a protective insulating film 706 As a result, at least the side surfaces of the resistance change film 703, the first upper electrode 704a, and the second upper electrode 704b are covered with the protective insulating film 706, and the upper surface of the second upper electrode 704b is covered with the upper surface protective film 707. It has become.
- the first upper electrode 704a can be formed using Ru, and the second upper electrode 704b can be formed using Ta or TaN.
- the upper surface protective film 707 is preferably formed using the same material as the protective insulating film 706.
- the protective insulating film 706 and the upper surface protective film 707 prevent the resistance change film 703, the first upper electrode 704a, and the second upper electrode 704b from being oxidized by oxygen in the process of forming the second interlayer insulating film 702.
- the insulating film has a function of preventing moisture from entering.
- the protective insulating film 706 is an insulating film having a function of preventing desorption of oxygen from the solid electrolyte. It is.
- the protective insulating film 706 and the upper surface protective film 707 are preferably formed using, for example, a SiN film, a SiCN film, or the like.
- the lower copper wiring layer (first copper wiring) 710 is made of a copper wiring 708 embedded in a wiring groove formed in the lower interlayer insulating film 711 via a barrier metal 709.
- a first interlayer insulating film 701 is formed on the upper surface of the lower copper wiring layer (first copper wiring) 710.
- the first interlayer insulating film 701 also functions as an insulating barrier film for preventing copper diffusion from the upper surface of the lower copper wiring layer 710.
- the second interlayer insulating film 702 is in direct contact with the first interlayer insulating film 701.
- An upper copper wiring layer (second copper wiring) 715 is formed on the second interlayer insulating film 702.
- the upper copper wiring layer (second copper wiring) 715 includes a copper wiring 714 embedded in a wiring groove and a via hole formed in the second interlayer insulating film 702 via a barrier metal 713.
- a via hole provided in the upper copper wiring layer (second copper wiring) 715 is opened to the second upper electrode 704 b through an opening formed in the upper surface protective film 707.
- a SiO 2 film, a SiOC film, a SiOCH film, a low dielectric constant film, or the like can be used.
- the surface of the upper copper wiring layer (second copper wiring) 715 is covered with an insulating barrier film 712 to prevent copper diffusion from the copper wiring 714 of the upper copper wiring layer (second copper wiring) 715. It is covered. Similar to the first interlayer insulating film 701, the insulating barrier film 712 is preferably formed using a SiN film, a SiCN film, or the like.
- the barrier metal 709 of the lower copper wiring layer (first copper wiring) 710 is made of copper, which is the main component of the copper wiring 708 of the lower copper wiring layer (first copper wiring) 710, as the lower interlayer insulating film 711. In order to prevent diffusion into the conductive film, the conductive film has a barrier property and covers the side and bottom surfaces of the copper wiring 708.
- the barrier metal 713 of the upper copper wiring layer (second copper wiring) 715 is made of copper, which is the main component of the copper wiring 714 of the upper copper wiring layer (first copper wiring) 715, as the second metal. In order to prevent diffusion in the interlayer insulating film 702 and the second upper electrode 704b through which the via hole is opened, the conductive film has a barrier property and covers the side and bottom surfaces of the copper wiring 714.
- the barrier metal 709 of the lower copper wiring layer (first copper wiring) 710 and the barrier metal 713 of the upper copper wiring layer (second copper wiring) 715 include a conductive film having a barrier property against copper diffusion,
- a refractory metal such as tantalum (Ta), tantalum nitride (TaN), titanium nitride (TiN), tungsten carbonitride (WCN), a nitride thereof, or a laminated film thereof is used.
- FIG. 8 is a cross-sectional view schematically showing a second embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device. .
- the resistance change element of the second embodiment shown in FIG. 8 is configured in the form of a two-terminal solid electrolyte switch.
- the resistance change element 899 uses the copper wiring 808 of the lower copper wiring layer (first copper wiring) 810 as a “first electrode” that functions as an “ion supply layer”.
- the resistance change film 803 is formed of a solid electrolyte and functions as an “ion conductive layer”.
- the “first electrode” 804 in contact with the upper surface of the variable resistance film 803 has a laminated structure including a first upper electrode 804a and a second upper electrode 804b. Of the “first electrode” 804, the first upper electrode 804 a is in contact with the upper surface of the resistance change film 803.
- An upper surface protective film 807 is provided on the upper surface of the “first electrode” 804, that is, on the upper surface of the second upper electrode 804 b.
- the resistance change film 803 and the “first electrode” 804 of the resistance change element 899 are formed on the upper surface of the first interlayer insulating film 801.
- the resistance change film 803 is in contact with the surface of the copper wiring 808 of the lower copper wiring layer (first copper wiring) 810 through a hole opened in the first interlayer insulating film 801. Therefore, in the opened hole portion, the lower surface of the resistance change film 803 is in contact with the “first electrode” that functions as the “ion supply layer”, and the upper surface of the resistance change film 803 functions as the “second electrode”.
- One electrode 804 is in contact with the structure. Therefore, the resistance change element 899 constitutes a copper filament deposition type resistance change element.
- the side surfaces of the resistance change film 803, the first upper electrode 804a and the second upper electrode 804b, and the upper surface protective film 807 are covered with a protective insulating film 806.
- a protective insulating film 806 As a result, at least the resistance change film 803, the side surfaces of the first upper electrode 804a and the second upper electrode 804b are covered with the protective insulating film 806, and the upper surface of the second upper electrode 804b is covered with the upper surface protective film 807. It has become.
- the first upper electrode 804a can be formed using Ru, and the second upper electrode 804b can be formed using Ta or TaN.
- the upper surface protective film 807 is preferably formed using the same material as the protective insulating film 806.
- the protective insulating film 806 and the upper surface protective film 807 prevent the resistance change film 803, the first upper electrode 804a, and the second upper electrode 804b from being oxidized by oxygen in the process of forming the second interlayer insulating film 802.
- the insulating film has a function of preventing moisture from entering.
- the protective insulating film 806 is an insulating film having a function of preventing desorption of oxygen from the solid electrolyte. It is.
- the protective insulating film 806 and the upper surface protective film 807 are preferably formed using, for example, a SiN film, a SiCN film, or the like.
- the lower copper wiring layer (first copper wiring) 810 includes a copper wiring 808 embedded in a wiring groove formed in the lower interlayer insulating film 811 with a barrier metal 809 interposed therebetween.
- a first interlayer insulating film 801 is formed on the upper surface of the lower copper wiring layer (first copper wiring) 810.
- the first interlayer insulating film 801 also functions as an insulating barrier film for preventing copper diffusion from the upper surface of the lower copper wiring layer 810.
- the second interlayer insulating film 802 is in direct contact with the first interlayer insulating film 801. Further, a third interlayer insulating film 816 is formed on the second interlayer insulating film 802. At that time, the third interlayer insulating film 816 is in direct contact with the second interlayer insulating film 802.
- An upper copper wiring layer (second copper wiring) 815 is formed on the third interlayer insulating film 816.
- An upper copper wiring layer (second copper wiring) 815 formed in the third interlayer insulating film 816 is formed integrally with a via portion formed in the second interlayer insulating film 802.
- the upper copper wiring layer (second copper wiring) 815 and the via part are formed in a barrier metal 813 in a wiring groove formed in the third interlayer insulating film 816 and a via hole formed in the second interlayer insulating film 802. It consists of a copper wiring 814 embedded via.
- a via hole provided in the upper copper wiring layer (second copper wiring) 815 is opened to the second upper electrode 804 b through an opening formed in the upper surface protective film 807.
- the surface of the upper copper wiring layer (second copper wiring) 815 is an insulating barrier film 812 to prevent copper diffusion from the copper wiring 814 of the upper copper wiring layer (second copper wiring) 815. It is covered. Similar to the first interlayer insulating film 801, the insulating barrier film 812 is preferably formed using a SiN film, a SiCN film, or the like.
- the barrier metal 809 of the lower copper wiring layer (first copper wiring) 810 is composed of copper, which is the main component of the copper wiring 808 of the lower copper wiring layer (first copper wiring) 810, as the lower interlayer insulating film 811. In order to prevent diffusion into the conductive film, it is a conductive film having a barrier property that covers the side surface and the bottom surface of the copper wiring 808.
- the barrier metal 813 of the upper copper wiring layer (second copper wiring) 815 is made of copper, which is the main component of the copper wiring 814 of the upper copper wiring layer (first copper wiring) 815, as the third metal.
- a barrier covering the side and bottom surfaces of the copper wiring 814 It is a conductive film having properties.
- the barrier metal 809 of the lower copper wiring layer (first copper wiring) 810 and the barrier metal 813 of the upper copper wiring layer (second copper wiring) 815 include a conductive film having a barrier property against copper diffusion,
- a refractory metal such as tantalum (Ta), tantalum nitride (TaN), titanium nitride (TiN), tungsten carbonitride (WCN), a nitride thereof, or a laminated film thereof is used.
- the second interlayer insulating film 802 and the third interlayer insulating film 816 are formed of different insulating materials.
- the third interlayer insulating film 816 and the insulating barrier film 812 are formed of different insulating materials.
- the lower interlayer insulating film 811 and the first interlayer insulating film 801 functioning as an insulating barrier film are formed of different insulating materials.
- the first interlayer insulating film 801 and the second interlayer insulating film 802 are formed of different insulating materials.
- the first interlayer insulating film 801 functioning as an insulating barrier film and the insulating barrier film 812.
- a SiO 2 film, a SiOC film, a SiOCH film, a low dielectric constant film, or the like can be used to form the lower interlayer insulating film 811.
- a SiN film or a SiCN film used for manufacturing the protective insulating film 806 and the upper surface protective film 807 does not show oxygen permeability and does not show moisture permeability, so that the second interlayer insulating film 802 is formed.
- the resistance change film 803, the first upper electrode 804a, and the second upper electrode 804b are protected.
- insulating materials used for forming the first interlayer insulating film 801, the protective insulating film 806, and the upper surface protective film 807 for example, a SiN film, a SiCN It is preferable to select an insulating material having a relative dielectric constant smaller than that of the film.
- an insulating material for forming the third interlayer insulating film 816 an insulating material having a relative dielectric constant smaller than that of the insulating material used for forming the second interlayer insulating film 802 is preferably selected.
- the relative dielectric constant is expressed as follows: “insulating material used for forming the first interlayer insulating film 801”> “insulating material used for forming the second interlayer insulating film 802”> “third interlayer insulating film” It is preferable that the condition “insulating material for forming the film 816” be satisfied.
- an insulating material having a high relative dielectric constant (k 7), for example, a SiN film or a SiCN film, as the “insulating material used for forming the first interlayer insulating film 801”.
- the “insulating material used for forming the second interlayer insulating film 802” also has the effect of reducing hygroscopicity.
- the “insulating material used for forming the protective insulating film 806 and the upper surface protective film 807” is a denser film than the “insulating material used for forming the first interlayer insulating film 801”, “protection” is obtained.
- the characteristics are superior and preferable.
- the relative dielectric constant of “the insulating material used for forming the protective insulating film 806 and the upper surface protective film 807” is equal to the ratio of “the insulating material used for forming the first interlayer insulating film 801”. It is preferable to select the insulating material so as to be higher than the dielectric constant.
- a SiN film is used as the “insulating material used for forming the protective insulating film 806 and the upper surface protective film 807”, and a SiCN film is used as the “insulating material used for forming the first interlayer insulating film 801”. It is preferable to do.
- FIG. 9 is a cross-sectional view schematically showing a third embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device. .
- the resistance change element of the third embodiment shown in FIG. 9 is configured in the form of a three-terminal solid electrolyte switch.
- the resistance change element 999 shown in FIG. 9 includes two copper wirings 908a in a lower copper wiring layer (first copper wiring) 910a and a copper wiring 908b in a lower copper wiring layer (first copper wiring) 910b.
- Each wiring is used as a “first electrode” that functions as an “ion supply layer” to form a three-terminal solid electrolyte switch.
- the resistance change film 903 is formed of a solid electrolyte and functions as an “ion conductive layer”.
- the “first electrode” 904 in contact with the upper surface of the variable resistance film 903 has a laminated structure including a first upper electrode 904a and a second upper electrode 904b.
- the first upper electrode 904 a is in contact with the upper surface of the resistance change film 903.
- An upper surface protective film 907 is provided on the upper surface of the “first electrode” 904, that is, on the upper surface of the second upper electrode 904 b.
- the resistance change film 903 and the “first electrode” 904 of the resistance change element 999 are formed on the upper surface of the first interlayer insulating film 901.
- the resistance change film 903 is formed on the surface of the copper wiring 908a of the lower copper wiring layer (first copper wiring) 910a and the lower copper wiring layer (through the holes opened in the first interlayer insulating film 901).
- the first copper wiring is in contact with the surface of the copper wiring 908b of 910b. Therefore, in the opened hole portion, the lower surface of the resistance change film 903 is the “first electrode” functioning as the “ion supply layer”, that is, the copper wiring 908a of the lower copper wiring layer (first copper wiring) 910a.
- the lower copper wiring layer (first copper wiring) 910b is in contact with the copper wiring 908b
- the upper surface of the resistance change film 903 is in contact with the first electrode 904 functioning as the “second electrode”.
- the resistance change element 999 is a three-terminal solid electrolyte switch having a configuration in which two “copper filament deposition type resistance change elements” are connected in parallel via the “second electrode”.
- the side surfaces of the resistance change film 903, the first upper electrode 904a and the second upper electrode 904b, and the upper surface protective film 907 are covered with a protective insulating film 906.
- a protective insulating film 906 As a result, at least the side surfaces of the resistance change film 903, the first upper electrode 904a, and the second upper electrode 904b are covered with the protective insulating film 906, and the upper surface of the second upper electrode 904b is covered with the upper surface protective film 907. It has become.
- the first upper electrode 904a can be formed using Ru, and the second upper electrode 904b can be formed using Ta or TaN.
- the upper surface protective film 907 is preferably formed using the same material as the protective insulating film 906.
- the protective insulating film 906 and the upper surface protective film 907 prevent the resistance change film 903, the first upper electrode 904a, and the second upper electrode 904b from being oxidized by oxygen in the process of forming the second interlayer insulating film 902.
- the insulating film has a function of preventing moisture from entering.
- the protective insulating film 906 is an insulating film having a function of preventing the desorption of oxygen from the solid electrolyte. It is.
- the protective insulating film 906 and the upper surface protective film 907 are preferably formed using, for example, a SiN film, a SiCN film, or the like.
- the lower copper wiring layer (first copper wiring) 910a is composed of a copper wiring 908a embedded in a first wiring groove formed in the lower interlayer insulating film 911 via a barrier metal 909a.
- the lower copper wiring layer (first copper wiring) 910b is composed of a copper wiring 908b embedded in a second wiring groove formed in the lower interlayer insulating film 911 via a barrier metal 909b.
- a first interlayer insulating film 901 is formed on the upper surfaces of the lower copper wiring layer (first copper wiring) 910a and the lower copper wiring layer (first copper wiring) 910b.
- the first interlayer insulating film 901 is an insulating barrier for preventing copper diffusion from the upper surface of the lower copper wiring layer (first copper wiring) 910a and the lower copper wiring layer (first copper wiring) 910b. It also has a function as a film. In order to provide a function as an insulating barrier film, it is preferable to use a SiN film, a SiCN film, or the like for forming the first interlayer insulating film 901.
- the second interlayer insulating film 902 is in direct contact with the first interlayer insulating film 901. Further, a third interlayer insulating film 916 is formed on the second interlayer insulating film 902. At that time, the third interlayer insulating film 916 is in direct contact with the second interlayer insulating film 902.
- An upper copper wiring layer (second copper wiring) 915 is formed on the third interlayer insulating film 916.
- An upper copper wiring layer (second copper wiring) 915 formed in the third interlayer insulating film 916 is formed integrally with a via portion formed in the second interlayer insulating film 902.
- An upper copper wiring layer (second copper wiring) 915 and a via portion are formed in a barrier metal 913 in a wiring groove formed in the third interlayer insulating film 916 and a via hole formed in the second interlayer insulating film 902. It consists of copper wiring 914 embedded via
- a via hole provided in the upper copper wiring layer (second copper wiring) 915 is opened to the second upper electrode 904 b through an opening formed in the upper surface protective film 907.
- the surface of the upper copper wiring layer (second copper wiring) 915 is made of an insulating barrier film 912 to prevent copper diffusion from the copper wiring 914 of the upper copper wiring layer (second copper wiring) 915. It is covered. Similar to the first interlayer insulating film 901, the insulating barrier film 912 is preferably formed using a SiN film, a SiCN film, or the like.
- the barrier metal 909a of the lower copper wiring layer (first copper wiring) 910a is composed of copper, which is the main component of the copper wiring 908a of the lower copper wiring layer (first copper wiring) 910a, as the lower interlayer insulating film 911. In order to prevent diffusion into the conductive film, it is a conductive film having a barrier property that covers the side surface and the bottom surface of the copper wiring 908a.
- the barrier metal 909b of the lower copper wiring layer (first copper wiring) 910b is composed of copper, which is the main component of the copper wiring 908b of the lower copper wiring layer (first copper wiring) 910b, as the lower interlayer insulating film 911.
- the conductive film has a barrier property and covers the side and bottom surfaces of the copper wiring 908b.
- the barrier metal 913 of the upper copper wiring layer (second copper wiring) 915 is composed of copper, which is the main component of the copper wiring 914 of the upper copper wiring layer (first copper wiring) 915, as the third metal.
- a barrier covering the side and bottom surfaces of the copper wiring 914 It is a conductive film having properties.
- the barrier metal 913 includes a conductive film having a barrier property against copper diffusion, such as a refractory metal such as tantalum (Ta), tantalum nitride (TaN), titanium nitride (TiN), and tungsten carbonitride (WCN).
- a refractory metal such as tantalum (Ta), tantalum nitride (TaN), titanium nitride (TiN), and tungsten carbonitride (WCN).
- the nitride or the like or a laminated film thereof is used.
- the second interlayer insulating film 902 and the third interlayer insulating film 916 are formed of different insulating materials.
- the third interlayer insulating film 916 and the insulating barrier film 912 are formed of different insulating materials.
- the lower interlayer insulating film 911 and the first interlayer insulating film 901 functioning as an insulating barrier film are formed of different insulating materials.
- the first interlayer insulating film 901 and the second interlayer insulating film 902 are formed of different insulating materials.
- the first interlayer insulating film 901 functioning as an insulating barrier film and the insulating barrier film 912.
- a SiO 2 film, a SiOC film, a SiOCH film, a low dielectric constant film, or the like can be used to form the lower interlayer insulating film 911.
- a SiN film or a SiCN film used for manufacturing the protective insulating film 906 and the upper surface protective film 907 does not show oxygen permeability and does not show moisture permeability, so that the second interlayer insulating film 902 is formed.
- the resistance change film 903, the first upper electrode 904a, and the second upper electrode 904b are protected.
- insulating materials used for forming the first interlayer insulating film 901, the protective insulating film 906, and the upper surface protective film 907 for example, a SiN film, a SiCN It is preferable to select an insulating material having a relative dielectric constant smaller than that of the film.
- an insulating material for forming the third interlayer insulating film 916 an insulating material having a relative dielectric constant smaller than that of the insulating material used for forming the second interlayer insulating film 902 is preferably selected.
- the relative dielectric constant is expressed as follows: “insulating material used for forming the first interlayer insulating film 901”> “insulating material used for forming the second interlayer insulating film 902”> “third interlayer insulating It is preferable that the condition “insulating material for forming the film 916” be satisfied.
- an insulating material having a high relative dielectric constant (k 7), for example, a SiN film or a SiCN film, as the “insulating material used for forming the first interlayer insulating film 901”.
- the “insulating material used for forming the second interlayer insulating film 902” has an effect of reducing hygroscopicity.
- the “insulating material used for forming the protective insulating film 906 and the upper surface protective film 907” is a denser film than the “insulating material used for forming the first interlayer insulating film 901”, “protection” is obtained.
- the characteristics are superior and preferable.
- the relative dielectric constant of “the insulating material used for forming the protective insulating film 906 and the upper surface protective film 907” is equal to the ratio of “the insulating material used for forming the first interlayer insulating film 901”. It is preferable to select the insulating material so as to be higher than the dielectric constant.
- an SiN film is used as the “insulating material used for forming the protective insulating film 906 and the upper surface protective film 907”, and an SiCN film is used as the “insulating material used to form the first interlayer insulating film 901”. It is preferable to do.
- the lower copper wiring layer (first copper wiring) 910a and the lower copper wiring layer (first copper wiring) 910b are formed in the hole region opened in the first interlayer insulating film 901.
- the underlying interlayer insulating film 911 is also exposed.
- a part of the exposed lower interlayer insulating film 911 is also removed by etching to form a recess.
- a resistance change film 903 is formed so as to fill the recess.
- the resistance change film 903 formed in the recess includes a barrier metal 909a of the lower copper wiring layer (first copper wiring) 910a or a barrier metal 909b of the lower copper wiring layer (first copper wiring) 910b. Touch. At that time, the resistance change film 903 includes the first electrode 904 functioning as the “second electrode”, the barrier metal 909a of the lower copper wiring layer (first copper wiring) 910a, or the lower copper wiring layer ( The structure sandwiched between the barrier metal 909b of the first copper wiring) 910b does not function as a resistance change element of a metal filament deposition type.
- the resistance change film 903 is sandwiched between the first electrode 904 functioning as the “second electrode” and the copper wiring 908a of the lower copper wiring layer (first copper wiring) 910a, and the resistance change film 903
- the configuration sandwiched between the first electrode 904 functioning as the “second electrode” and the copper wiring 908b of the lower copper wiring layer (first copper wiring) 910b is an independent “copper filament deposition type”. It functions as a “resistance change element”.
- a portion where the resistance change film 903 is sandwiched between the first electrode 904 functioning as the “second electrode” and the copper wiring 908 a of the lower copper wiring layer (first copper wiring) 910 a.
- the area Sb of the region sandwiched between the first electrode 904 functioning as the “second electrode” and the copper wiring 908b of the lower copper wiring layer (first copper wiring) 910b. Can be set independently.
- the resistance change film 903 includes a “copper filament” composed of a portion sandwiched between the first electrode 904 functioning as the “second electrode” and the copper wiring 908a of the lower copper wiring layer (first copper wiring) 910a.
- the resistance value of the “deposition type resistance change element” in the “ON” state, the first electrode 904 in which the resistance change film 903 functions as the “second electrode”, and the lower copper wiring layer (first copper wiring) 910b The resistance value in the “ON” state of the “copper filament deposition type resistance change element” composed of the portion sandwiched between the copper wirings 908b can be set independently.
- the lower copper wiring layer (first copper wiring) 910a and the lower copper wiring layer (first copper wiring) 910b are electrically separated, and a voltage can be applied independently to each other. .
- variable resistance element 999 of the third embodiment shown in FIG. 9 has a three-terminal configuration in which two “copper filament deposition type variable resistance elements” are connected in parallel via the “second electrode”. In this case, the two “copper filament deposited resistance change elements” can be switched independently of each other.
- the resistance change element 999 of the third embodiment shown in FIG. 9 the side surfaces of the resistance change film 903, the first upper electrode 904a and the second upper electrode 904b, and the upper surface protective film 907 are covered with the protective insulating film 906. ing. Therefore, the second interlayer insulating film 902 is in direct contact with the first interlayer insulating film 901. Further, a third interlayer insulating film 916 is formed on the second interlayer insulating film 902. At that time, the third interlayer insulating film 916 is in direct contact with the second interlayer insulating film 902.
- FIG. 10 is a cross-sectional view schematically showing a configuration of a conventional resistance change element used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
- the conventional variable resistance element shown in FIG. 10 is also configured in the form of a three-terminal solid electrolyte switch.
- the side surfaces of the resistance change film 1003, the first upper electrode 1004a and the second upper electrode 1004b, and the upper surface protective film 1007 are covered with the protective insulating film 1005.
- the protective insulating film 1005 includes the resistance change film 1003, the first upper electrode 1004a and the second upper electrode 1004b, the upper surface of the upper surface protective film 1007, the upper surface of the upper surface protective film 1007, and the first interlayer insulating film 1001. The top surface is also covered.
- the second interlayer insulating film 1002 is formed so as to cover the protective insulating film 1005.
- the protective insulating film 1005 is inserted between the first interlayer insulating film 1001 and the second interlayer insulating film 1002.
- the thickness of the protective insulating film 1005 inserted between the first interlayer insulating film 1001 and the second interlayer insulating film 1002 is selected to be 20 nm.
- Select 80 nm;
- variable resistance element 999 of the third embodiment shown in FIG. 9 the “first wiring” corresponding to the lower copper wiring layer (first copper wiring) in the lower interlayer insulating film 911 is used.
- a comb capacitance measurement pattern and a comb capacitance measurement pattern for “second wiring” are produced.
- the wiring height of the “same-layer wiring” formed in the lower interlayer insulating film 911 is selected to be 150 nm.
- a pattern and a comb-type capacitance measurement pattern for “second wiring” are produced.
- the wiring height of the “same-layer wiring” produced in the lower interlayer insulating film 1011 is selected to be 150 nm.
- the inter-layer wiring capacitance between the “first wiring” and the “second wiring” was measured at 10 kHz.
- the capacitance between the same layer wirings was 150 fF / mm.
- variable resistance element 999 of the third embodiment shown in FIG. 9 the capacitance between the same layer wirings was 135 fF / mm.
- the inter-layer wiring capacitance is reduced by 10%.
- the reliability of the resistance change element was evaluated by a PCT (Pressure Cooker Test) test at 120 ° C. and a humidity of 100 RH% for 300 hours.
- PCT Pressure Cooker Test
- the presence or absence of “defect” was evaluated based on the presence or absence of an increase in “leakage current”.
- FIG. 11 is a cross-sectional view schematically showing a fourth embodiment of the variable resistance element according to the third embodiment of the present invention, which is used as a nonvolatile switching element provided in the multilayer wiring layer of the semiconductor device. .
- the resistance change element of the fourth embodiment shown in FIG. 11 is configured in the form of a three-terminal solid electrolyte switch.
- the resistance change element 1199 shown in FIG. 11 includes two copper wirings: a copper wiring 1108a of a lower copper wiring layer (first copper wiring) 1110a and a copper wiring 1108b of a lower copper wiring layer (first copper wiring) 1110b.
- Each wiring is used as a “first electrode” that functions as an “ion supply layer” to form a three-terminal solid electrolyte switch.
- the resistance change film 1103 is formed of a solid electrolyte and functions as an “ion conductive layer”.
- a “first electrode” 1104 in contact with the upper surface of the resistance change film 1103 has a laminated structure including a first upper electrode 1104a and a second upper electrode 1104b.
- the first upper electrode 1104 a is in contact with the upper surface of the resistance change film 1103.
- An upper surface protective film 1107 is provided on the upper surface of the “first electrode” 1104, that is, on the upper surface of the second upper electrode 1104 b.
- the resistance change film 1103 and the “first electrode” 1104 of the resistance change element 1199 are formed on the upper surface of the first interlayer insulating film 1101.
- the resistance change film 1103 is connected to the surface of the copper wiring 1108a of the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (through the hole opened in the first interlayer insulating film 1101).
- First copper wiring) 1110b is in contact with the surface of the copper wiring 1108b. Therefore, in the opened hole portion, the lower surface of the resistance change film 1103 is the “first electrode” functioning as the “ion supply layer”, that is, the copper wiring 1108a of the lower copper wiring layer (first copper wiring) 1110a.
- the upper surface of the resistance change film 1103 is in contact with the first electrode 1104 functioning as the “second electrode”, in contact with the copper wiring 1108b of the lower copper wiring layer (first copper wiring) 1110b.
- the resistance change element 1199 is a three-terminal solid electrolyte switch having a configuration in which two “copper filament deposition type resistance change elements” are connected in parallel via the “second electrode”.
- the side surfaces of the resistance change film 1103, the first upper electrode 1104a and the second upper electrode 1104b, and the upper surface protective film 1107 are covered with a protective insulating film 1106.
- a protective insulating film 1106 As a result, at least the side surfaces of the resistance change film 1103, the first upper electrode 1104a, and the second upper electrode 1104b are covered with the protective insulating film 1106, and the upper surface of the second upper electrode 1104b is covered with the upper surface protective film 1107. It has become.
- the first upper electrode 1104a can be formed using Ru, and the second upper electrode 1104b can be formed using Ta or TaN.
- the upper surface protective film 1107 is preferably formed using the same material as the protective insulating film 1105.
- the protective insulating film 1105 and the upper surface protective film 1107 prevent the resistance change film 1103, the first upper electrode 1104a, and the second upper electrode 1104b from being oxidized by oxygen in the process of forming the second interlayer insulating film 1102.
- the insulating film has a function of preventing moisture from entering.
- the protective insulating film 1105 is an insulating film having a function of preventing desorption of oxygen from the solid electrolyte. It is.
- the protective insulating film 1105 and the upper surface protective film 1107 are preferably formed using, for example, a SiN film.
- the lower copper wiring layer (first copper wiring) 1110a is composed of a copper wiring 1108a embedded in a first wiring groove formed in the lower interlayer insulating film 1111 via a barrier metal 1109a.
- the lower copper wiring layer (first copper wiring) 1110b is formed of a copper wiring 1108b embedded in a second wiring groove formed in the lower interlayer insulating film 1111 via a barrier metal 1109b.
- a first interlayer insulating film 1101 is formed on the upper surfaces of the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (first copper wiring) 1110b.
- the first interlayer insulating film 1101 has an insulating barrier for preventing copper diffusion from the upper surface of the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (first copper wiring) 1110b. It also has a function as a film. In order to provide a function as an insulating barrier film, a SiCN film or the like is preferably used for forming the first interlayer insulating film 1101.
- the second interlayer insulating film 1102 is in direct contact with the first interlayer insulating film 1101. Further, a third interlayer insulating film 1116 is formed on the second interlayer insulating film 1102. At that time, the third interlayer insulating film 1116 is in direct contact with the second interlayer insulating film 1102.
- an upper copper wiring layer (second copper wiring) 1115a and an upper copper wiring layer (second copper wiring) 1115b are formed.
- An upper copper wiring layer (second copper wiring) 1115a formed in the third interlayer insulating film 1116 penetrates the second interlayer insulating film 1102 and the first interlayer insulating film 1101, and is formed as a lower copper wiring layer. (First copper wiring) It is formed integrally with a contact plug portion reaching the surface of 1110a.
- An upper copper wiring layer (second copper wiring) 1115b formed in the third interlayer insulating film 1116 passes through the second interlayer insulating film 1102 and the first interlayer insulating film 1101, and is formed as a lower copper wiring layer.
- the upper copper wiring layer (second copper wiring) 1115a and the contact plug portion include a wiring groove formed in the third interlayer insulating film 1116, a second interlayer insulating film 1102, and a first interlayer insulating film 1101. It consists of a copper wiring 1114a embedded through a barrier metal 1113a in a contact hole portion that penetrates and reaches the surface of the lower copper wiring layer (first copper wiring) 1110a.
- the upper copper wiring layer (second copper wiring) 1115b and the contact plug portion include a wiring groove formed in the third interlayer insulating film 1116, a second interlayer insulating film 1102, and a first interlayer insulating film 1101. A copper wiring 1114b embedded through a barrier metal 1113b in a contact hole portion that penetrates and reaches the surface of the lower copper wiring layer (first copper wiring) 1110b.
- the contact plug portion formed integrally with the upper copper wiring layer (second copper wiring) 1115 a has a shape in which a part of the side wall is in contact with the protective insulating film 1105.
- the contact plug portion formed integrally with the upper copper wiring layer (second copper wiring) 1115 b also has a shape in which a part of the side wall is in contact with the protective insulating film 1105.
- the surface of the upper copper wiring layer (second copper wiring) 1115a and the surface of the upper copper wiring layer (second copper wiring) 1115b are the copper wiring of the upper copper wiring layer (second copper wiring) 1115a.
- the insulating barrier film 1112 is covered. Similar to the first interlayer insulating film 1101, it is preferable to use a SiCN film or the like for the formation of the insulating barrier film 1112.
- the barrier metal 1109a of the lower copper wiring layer (first copper wiring) 1110a is composed of copper, which is the main component of the copper wiring 1108a of the lower copper wiring layer (first copper wiring) 1110a, as the lower interlayer insulating film 1111. In order to prevent diffusion into the conductive film, it is a conductive film having a barrier property that covers the side surface and the bottom surface of the copper wiring 1108a.
- the barrier metal 1109b of the lower copper wiring layer (first copper wiring) 1110b is composed of copper, which is the main component of the copper wiring 1108b of the lower copper wiring layer (first copper wiring) 1110b, as the lower interlayer insulating film 1111.
- the barrier metal 1113a of the upper copper wiring layer (second copper wiring) 1115a is made up of copper as the main component of the copper wiring 1114a of the upper copper wiring layer (first copper wiring) 1115a.
- the barrier layer covers the side and bottom surfaces of the copper wiring 1114 a. It is a conductive film.
- the barrier metal 1113b of the upper copper wiring layer (second copper wiring) 1115b is made of copper as the main component of the copper wiring 1114b of the upper copper wiring layer (first copper wiring) 1115b.
- the barrier metal 1113a and the barrier metal 1113b of the upper copper wiring layer (second copper wiring) 1115b include a conductive film having a barrier property against copper diffusion, such as tantalum (Ta), tantalum nitride (TaN), nitride
- a refractory metal such as titanium (TiN) or tungsten carbonitride (WCN), a nitride thereof, or a laminated film thereof is used.
- the second interlayer insulating film 1102 and the third interlayer insulating film 1116 are formed of different insulating materials.
- the third interlayer insulating film 1116 and the insulating barrier film 1112 are formed of different insulating materials.
- the lower interlayer insulating film 1111 and the first interlayer insulating film 1101 functioning as an insulating barrier film are formed of different insulating materials.
- the first interlayer insulating film 1101 and the second interlayer insulating film 1102 are formed of different insulating materials.
- the SiCN film or the like for forming the first interlayer insulating film 1101 functioning as an insulating barrier film and the insulating barrier film 1112.
- a SiO 2 film, a SiOC film, a SiOCH film, a low dielectric constant film, or the like can be used for forming the lower interlayer insulating film 1111.
- a SiN film used for manufacturing the protective insulating film 1105 and the upper surface protective film 1107 does not exhibit oxygen permeability and does not exhibit moisture permeability.
- the resistance change film 1103, the first upper electrode 1104a, and the second upper electrode 1104b are protected.
- insulating materials used for forming the first interlayer insulating film 1101, the protective insulating film 1105, and the upper surface protective film 1107 for example, a SiN film, a SiCN It is preferable to select an insulating material having a relative dielectric constant smaller than that of the film.
- insulating material for forming the third interlayer insulating film 1116 it is preferable to select an insulating material having a relative dielectric constant smaller than that of the insulating material used for forming the second interlayer insulating film 1102.
- the relative dielectric constant is expressed as follows: “insulating material used for forming the first interlayer insulating film 1101”> “insulating material used for forming the second interlayer insulating film 1102”> “third interlayer insulation” It is preferable that the condition “insulating material for forming the film 1116” is satisfied.
- an insulating material having a high relative dielectric constant (k 7), for example, a SiCN film, as the “insulating material used for forming the first interlayer insulating film 1101”,
- the “insulating material used for forming the second interlayer insulating film 1102” also has an effect of reducing hygroscopicity.
- the “insulating material used for forming the protective insulating film 1105 and the upper surface protective film 1107” is a denser film than the “insulating material used for forming the first interlayer insulating film 1101”, “protection” is obtained.
- the characteristics are superior and preferable.
- the relative dielectric constant of “the insulating material used for forming the protective insulating film 1105 and the upper surface protective film 1107” is equal to the ratio of “the insulating material used for forming the first interlayer insulating film 1101”. It is preferable to select the insulating material so as to be higher than the dielectric constant.
- a SiN film is used as the “insulating material used to form the protective insulating film 1105 and the upper surface protective film 1107”, and a SiCN film is used as the “insulating material used to form the first interlayer insulating film 1101”. It is preferable to do.
- the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (first copper wiring) 1110b are formed in the hole region opened in the first interlayer insulating film 1101.
- the underlying interlayer insulating film 1111 is also exposed.
- a part of the exposed lower interlayer insulating film 1111 is also removed by etching to form a recess.
- a resistance change film 1103 is formed so as to fill the recess.
- the resistance change film 1103 formed in the recess includes the barrier metal 1109a of the lower copper wiring layer (first copper wiring) 1110a or the barrier metal 1109b of the lower copper wiring layer (first copper wiring) 1110b. Touch. At that time, the resistance change film 1103 includes the first electrode 1104 functioning as the “second electrode”, the barrier metal 1109a of the lower copper wiring layer (first copper wiring) 1110a, or the lower copper wiring layer ( The structure sandwiched between the barrier metal 1109b of the (first copper wiring) 1110b does not function as a resistance change element of a metal filament deposition type.
- the resistance change film 1103 is sandwiched between the first electrode 1104 functioning as the “second electrode” and the copper wiring 1108a of the lower copper wiring layer (first copper wiring) 1110a, and the resistance changing film 1103.
- the configuration sandwiched between the first electrode 1104 functioning as the “second electrode” and the copper wiring 1108b of the lower copper wiring layer (first copper wiring) 1110b is an independent “copper filament deposition type”. It functions as a “resistance change element”.
- the resistance change film 1103 is sandwiched between the first electrode 1104 functioning as the “second electrode” and the copper wiring 1108 a of the lower copper wiring layer (first copper wiring) 1110 a.
- the area Sb of the region sandwiched between the first electrode 1104 functioning as the “second electrode” and the copper wiring 1108b of the lower copper wiring layer (first copper wiring) 1110b. Can be set independently.
- the resistance change film 1103 includes a “copper filament” composed of a portion sandwiched between the first electrode 1104 functioning as the “second electrode” and the copper wiring 1108a of the lower copper wiring layer (first copper wiring) 1110a.
- the resistance value of the “deposition type resistance change element” in the “ON” state, the first electrode 1104 in which the resistance change film 1103 functions as the “second electrode”, and the lower copper wiring layer (first copper wiring) 1110b The resistance value in the “ON” state of the “copper filament deposition type resistance change element” composed of the portion sandwiched between the copper wirings 1108b can be set independently.
- the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (first copper wiring) 1110b are electrically separated, and a voltage can be applied independently of each other. .
- a lower copper wiring layer (first copper wiring) 1110a is connected to an upper copper wiring layer (first copper wiring) 1115a via a contact plug, and a lower copper wiring layer (first copper wiring).
- 1110b is connected to an upper copper wiring layer (first copper wiring) 1115b through a contact plug.
- the contact plug can be provided at a position close to the resistance change element 1199. That is, the resistance change element 1199 of the fourth embodiment is independent of the lower copper wiring layer (first copper wiring) 1110a and the lower copper wiring layer (first copper wiring) 1110b.
- the upper copper wiring layer (first copper wiring) 1115a and the upper copper wiring layer (first copper wiring) 1115b for supplying voltage can be arranged with high density.
- variable resistance element 1199 of the fourth embodiment shown in FIG. 11 has a three-terminal configuration in which two “copper filament deposition type variable resistance elements” are connected in parallel via the “second electrode”.
- the two “copper filament deposited resistance change elements” can be switched independently of each other.
- the second interlayer insulating film 1102 in the process of forming a contact hole that penetrates the first interlayer insulating film 1101 and reaches the surface of the lower copper wiring layer (first copper wiring) 1110b, the second interlayer insulating film 1102 is etched,
- a SiCN film is selected as “an insulating material used for forming the first interlayer insulating film 1101”, and “insulation used for forming the second interlayer insulating film 1102” is selected.
- the protective insulating film 1105 is used to form the top insulating film 1107 ", selecting the SiN film, processing election etching It is possible to increase the ratio. As a result, in the process of forming the contact hole portion, a reduction in film thickness of the protective insulating film 1105 and the upper surface insulating film 1107 due to side etching can be avoided.
- variable resistance element An example of an embodiment of a semiconductor device using a variable resistance element according to a third embodiment of the present invention as a nonvolatile switching element provided in a multilayer wiring layer and a manufacturing process thereof will be described with reference to the drawings.
- FIG. 12A to 12I show a fifth embodiment of a variable resistance element according to a third embodiment of the present invention, which is used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device, and a manufacturing process thereof. It is sectional drawing shown typically.
- FIGS. 12A to 12I show the manufacturing process, and the variable resistance element of the fifth embodiment is configured in the form of a two-terminal solid electrolyte switch.
- a semiconductor element (not shown) constituting the semiconductor device itself is formed on the surface of the semiconductor substrate prior to the production of the multilayer wiring layer.
- a semiconductor device is formed on the surface of the semiconductor device substrate 1, and is used as a multilayer wiring layer and a nonvolatile switching element provided in the multilayer wiring layer. Steps B1 to B9 of the manufacturing process of the variable resistance element according to the embodiment will be described.
- Step B1 is a “first electrode” used as a “first electrode” that functions as an “ion supply layer” in the production of the “first wiring” corresponding to the lower wiring layer and the resistance change element shown in FIG. 12A. This is a step of forming an opening in the insulating barrier film 7 covering the surface of “1 wiring”.
- an interlayer insulating film 2, a barrier insulating film 3, and an interlayer insulating film 4 are formed in this order on the semiconductor device substrate 1.
- the “insulating material used for forming the interlayer insulating film 2” a silicon oxide film having a thickness of 300 nm is used, and as the “insulating material used for forming the barrier insulating film 3”, a SiN film having a thickness of 50 nm is used.
- the insulating material used for forming the interlayer insulating film 4 a 200 nm thick SiO 2 film is selected.
- a wiring groove for forming a “first wiring” is formed in the interlayer insulating film 4, the barrier insulating film 3, and the interlayer insulating film 2.
- the wiring groove forming process A resist mask formation processing step of forming a resist mask having openings of a predetermined pattern on the interlayer insulating film 4 by using a photolithography method; Using the resist mask as an etching mask layer and performing anisotropic etching on the laminated film by dry etching; and an etching process step; A resist removal processing step of removing the resist mask after forming the wiring trench by anisotropic etching is included.
- the metal 5 is buried in the wiring groove through the barrier metal 6 to form the “first wiring”.
- the metal 5 of the “first wiring” is used as an “ion supply layer”. Therefore, the metal material which has copper as a main component, for example, copper, is used.
- the barrier metal 6 prevents the diffusion of copper used for the metal 5. Therefore, for example, a stacked structure of TaN (film thickness 5 nm) / Ta (film thickness 5 nm) is used as the barrier metal 6.
- a barrier metal 6 having a laminated structure of TaN (film thickness 5 nm) / Ta (film thickness 5 nm) is coated on the bottom and side walls of the wiring groove with a uniform film thickness. Therefore, an isotropic deposition method, for example, an RF sputtering method is used to form a deposited film having the laminated structure on the upper surface of the interlayer insulating film 4, the bottom portion of the wiring groove, and the side wall portion. Copper used for the metal 5 uses the barrier metal 6 as an underlayer, and is formed so as to bury the inside of the wiring trench by using, for example, a plating method.
- the stacked structure of copper and TaN (film thickness 5 nm) / Ta (film thickness 5 nm) formed on the upper surface of the interlayer insulating film 4 is removed.
- the upper surface of the “first wiring” formed in the wiring groove is planarized.
- an insulating barrier film 7 covering the upper surface of the “first wiring” and the upper surface of the interlayer insulating film 4 is formed.
- the insulating barrier film 7 prevents the diffusion of copper used for the metal 5 of the “first wiring”. Therefore, for example, a 30 nm-thick SiCN film is selected as the “insulating material used for forming the insulating barrier film 7”.
- the “first wiring” used as the “first electrode” functioning as the “ion supply layer” when the variable resistance element is manufactured An opening is formed in the insulating barrier film 7 covering the surface of the metal 5 of “one wiring”.
- step B1 when step B1 is completed, the “first wiring” corresponding to the lower wiring layer, except for some “first wirings” used for the production of the variable resistance element, is the insulating barrier film 7. It is held in a state covered with.
- the resist mask having the opening is used to expose the opening of the resist mask.
- the insulating barrier film 7 is isotropically etched by using an isotropic dry etching method, for example, a reactive dry etching method.
- Etching of the sidewall surface of the opening formed in the SiCN film proceeds by using the reactive dry etching method. Therefore, side etching of the upper part of the SiCN film, which is covered with the resist mask, around the opening of the resist mask proceeds, and the side wall surface of the formed opening has a tapered shape. At that time, by reducing the source power or increasing the substrate bias power, the ⁇ ionicity '' at the time of etching is improved, and the contribution of the ⁇ reactive ion etching '' process increases. The “taper angle” of the side wall surface of the “taper shape” can be reduced.
- the etching time is reduced when the SiCN film having a film thickness of 30 nm is etched.
- the time when the film can be etched by 35 nm can be set. That is, the “taper angle” of the “tapered” side wall surface can be reduced by setting the etching time to a time during which “over-etching” proceeds and increasing the side etching amount on the upper part of the SiCN film. .
- the “over-etching process” for reducing the “taper angle” of the “tapered” side wall surface can also be performed using the “etch-back” method.
- the substrate is heated to 350 ° C. under a reduced pressure atmosphere, and the “etching and etching” of the SiCN film exposed on the side wall surface of the opening to be formed is performed.
- "Back” can be performed.
- heat treatment can be performed in a reduced pressure atmosphere to perform the desired “etch back”.
- etching back the SiCN film exposed on the side wall surface of the opening to be formed using an RF etching method using a non-reactive gas.
- the etching time of the desired SiCN film is set by setting the 2 nm SiO 2 film to an etching time. Is achieved.
- the opening is provided with a metal Ti film, a solid electrolyte film 9, a first When a laminated structure including the upper electrode 10 and the second upper electrode 11 is formed, “step coverage” on the side wall surface of the opening can be improved.
- Step B2 includes a titanium oxide film 8 for preventing oxidation of the surface of the metal (copper wiring) 5 of the “first wiring” and a solid electrolyte film used as an “ion conductive layer” when the resistance change element shown in FIG. 12B is manufactured.
- a 1 nm-thick metal Ti film is deposited by DC sputtering.
- the metal Ti film functions as an “oxidation sacrificial layer” that prevents the surface of the metal (copper) 5 of the “first wiring” from being oxidized during the process of forming the solid electrolyte film 9.
- the solid electrolyte membrane 9 used as the “ion conductive layer” is a “porous polymer membrane” made of a porous polymer mainly composed of silicon, oxygen, and carbon.
- a “porous polymer film” made of a porous polymer mainly composed of silicon, oxygen, and carbon is, for example, an RF plasma method using, as a raw material, a cyclic siloxane type organic monomer disclosed in International Publication No. 2011/058947. Is deposited by a “polymerization reaction” of the organic monomer. In the process of “polymerization reaction” of the organic monomer by the RF plasma method, oxygen plasma is generated due to decomposition of the organic monomer. The generated oxygen plasma acts on the metal Ti film and is converted into the titanium oxide film 8.
- a “porous polymer film” made of a porous polymer mainly composed of silicon, oxygen, and carbon is deposited on the titanium oxide film 8 converted from the metal Ti film.
- the deposition conditions are RF power 50 to 300 W, temperature 350 ° C., mixed gas with He, pressure 1.0 to 6.0 [Torr]. You can choose from a range.
- the oxidizing power by oxygen plasma may exceed the oxidizing power in the above-described deposition conditions.
- the surface of the metal (copper) 5 of the “first wiring” can be prevented from being oxidized by increasing the thickness of the metal Ti film that functions as the “oxidation sacrificial layer”.
- the deposition conditions that suppress the generation of oxygen plasma for example, the RF power is lowered or the flow rate of the raw material is increased, the generation of oxygen plasma accompanying the decomposition of the raw material organic monomer is suppressed.
- the thickness of the metal Ti film that functions as the “oxidation sacrificial layer” is reduced, the oxidation of the surface of the metal (copper) 5 of the “first wiring” can be suppressed.
- the “first wiring” metal (during the “porous polymer film” deposition process, even if the deposition of the metal Ti film is omitted.
- the oxidation of the surface of (copper) 5 does not proceed substantially. That is, when the surface of the metal (copper) 5 is covered with the thin film of the “porous polymer film” while the oxidation of the surface of the metal (copper) 5 of the “first wiring” does not proceed substantially, The oxygen plasma can no longer act on the surface of the metal (copper) 5.
- the oxidation of the surface of the metal (copper) 5 of the “first wiring” does not substantially proceed during the deposition process of the “porous polymer film”.
- the first upper electrode 10 and the second upper electrode 11 are formed on the solid electrolyte film 9. They are formed in this order.
- the first upper electrode 10 in contact with the upper surface of the solid electrolyte membrane 9 functions as a “second electrode” of the resistance change element.
- a Ru film having a thickness of 10 nm is used for manufacturing the first upper electrode 10.
- the second upper electrode 11 covers the upper surface of the first upper electrode 10, and “etching stop layer” is formed in the etching process for forming a hole in the SiN film used for forming the upper surface protective film 12 in the via hole forming process described later. Function as. Therefore, for example, a Ta film having a film thickness of 25 nm is used for manufacturing the second upper electrode 11.
- the “porous polymer film” made of a porous polymer mainly composed of silicon, oxygen, and carbon used as the solid electrolyte film 9 induces desorption of contained oxygen when held at a high temperature under reduced pressure. There is a case.
- an interface film layer of “RuO 2 ” is formed at the interface between the first upper electrode 10 and the solid electrolyte film 9.
- An interface coating layer of “RuO 2 ” is formed at the interface between the first upper electrode 10 functioning as the “second electrode” of the copper filament deposition type resistance change element and the solid electrolyte film 9 functioning as the “ion conductive layer”. Is formed, it inhibits “precipitation of copper atoms”. Accordingly, a Ru film having a thickness of 10 nm is selected by selecting a deposition condition that does not induce desorption of oxygen contained in a “porous polymer film” made of a porous polymer mainly composed of silicon, oxygen, and carbon. Film deposition is performed.
- the DC sputtering method is applied, the conditions of DC power 0.2 kW, Ar gas, and pressure 0.27 [Pa] are selected using Ru as a target, and the Ru film is deposited at room temperature.
- the DC sputtering method is applied, and the conditions of DC power 0.2 kW, Ar gas, and pressure 0.27 [Pa] are selected using Ta as a target. And at room temperature.
- the solid electrolyte film 9 having a thickness of 5 nm
- the first upper electrode 10 having a thickness of 10 nm
- the second upper electrode 11 having a thickness of 25 nm
- all are isotropic.
- a simple deposition method is adopted. Accordingly, as shown in FIG. 12B, the bottom surface of the opening formed in the insulating barrier film 7 having a thickness of 30 nm, the “tapered” sidewall surface of the opening, and the upper surface of the insulating barrier film 7 are covered.
- a laminated structure having a total film thickness of 42 nm is formed uniformly.
- Step B3 is the second upper electrode among the first upper electrode 10 and the second upper electrode 11 constituting the first electrode functioning as the “second electrode” when the variable resistance element shown in FIG. 12C is manufactured. 11, a SiN film deposition process, and a titanium oxide film 8, a solid electrolyte film 9, a first upper electrode 10, a second upper electrode 11, and an upper surface protective film 12 used for forming an upper surface protective film 12 provided on the upper surface of
- This patterning step includes a step of depositing a SiO 2 film (hard mask film) 13 used as a hard mask.
- the SiN film having a thickness of 30 nm used for forming the upper surface protective film 12 can be deposited by using a plasma CVD method using SiH 4 and N 2 as source gases. At that time, the film formation temperature in the plasma CVD method can be selected in the range of 200 ° C. to 400 ° C., but is selected to be 200 ° C., and the SiN film is formed using high-density plasma. Yes. As a result of selecting this deposition condition, isotropic deposition is performed, and the film of the SiN film deposited on the bottom surface of the opening, the “tapered” sidewall surface of the opening, and the insulating barrier film 7 is deposited. The thickness is substantially equal.
- a 200 nm thick SiO 2 film (hard mask film) 13 used as a hard mask film is also deposited by plasma CVD.
- the growth temperature is selected to be 200 ° C.
- the deposited film thickness is 200 nm, which is much thicker than the step 30 nm between the bottom surface region of the opening and the upper region of the insulating barrier film 7, and therefore, as shown in FIG.
- the step is buried, and the thickness of the bottom region of the opening is larger than the thickness of the region above the insulating barrier film 7.
- Step B4 uses the hard mask made of the SiO 2 film (hard mask film) 13 to form the upper surface protective film 12, the second upper electrode 11, the first upper electrode 10, the solid electrolyte film 9, and the titanium oxide film 8, It comprises a step of sequentially performing selective etching and patterning, and then a step of selectively etching away the SiO 2 film (hard mask film) 13 used as a hard mask. Finally, when the patterning of the upper surface protective film 12, the second upper electrode 11, the first upper electrode 10, the solid electrolyte film 9, and the titanium oxide film 8 is completed, the stacked structure shown in FIG. To be formed in the opening region.
- a photoresist mask (not shown) matching the patterning shape of the resistance change element portion is formed.
- the SiO 2 film (hard mask film) 13 is dry-etched until the surface of the SiN film used for forming the upper surface protective film 12 appears. Thereafter, oxygen plasma ashing and organic peeling are performed to remove the photoresist mask.
- the SiO 2 film (hard mask film) 13 patterned in accordance with the patterning shape of the variable resistance element portion is used as a hard mask in the subsequent patterning process.
- a dry etching method in which side etching does not proceed that is, an anisotropic dry etching method is employed.
- a general parallel plate type dry etching apparatus can be used for the dry etching process of the SiO 2 film (hard mask film) 13.
- a condition having selectivity with respect to the SiN film used for forming the upper surface protective film 12 is selected.
- the etching is preferably stopped on the upper surface of the SiN film having a thickness of 30 nm.
- an etching time during which a part of the 30 nm-thickness SiN film is also etched can be selected.
- an oxygen plasma ashing method is used.
- the upper surface of the second upper electrode 11, the first upper electrode 10, and the ion conductive layer 9, which are covered with the SiN film 12, are subjected to oxygen plasma. There is no exposure.
- the patterned SiO 2 film (hard mask film) 13 is used as a hard mask to protect the upper surface protective film 12, the second upper electrode 11, the first upper electrode 10, and the solid electrolyte film 9
- the titanium oxide film 8 is sequentially selectively etched and patterned.
- a dry etching method in which side etching does not proceed that is, an anisotropic dry etching method is adopted even in a dry etching process of a 30 nm-thickness SiN film used for forming the upper surface protective film 12.
- an etching condition having selectivity is selected for the metal Ta film having a film thickness of 25 nm used for forming the second upper electrode 11.
- a dry etching method in which side etching does not proceed that is, an anisotropic dry etching method is adopted even in the dry etching process of the metal Ta film having a film thickness of 25 nm used for forming the second upper electrode 11. Further, an etching condition having selectivity is selected for the metal Ru film having a film thickness of 10 nm used for forming the first upper electrode 10.
- a dry etching method in which side etching does not proceed that is, an anisotropic dry etching method is employed even in a dry etching process of a 10 nm-thick metal Ru film used for forming the first upper electrode 10.
- an etching condition having selectivity is selected for the “porous polymer film” having a film thickness of 5 nm used for forming the solid electrolyte film 9.
- the substrate bias power can be 100 W.
- the selectivity to the SiCN film having a film thickness of 30 nm, which is used for forming the lower insulating barrier film 7, is increased, so that the sub-trench or the like Occurrence is suppressed.
- the “porous” film having a film thickness of 5 nm is formed on the upper surface of the insulating barrier film 7 excluding the resistance change element forming region.
- the high-quality polymer film ”and the 2.0 nm-thick titanium oxide film 8 do not remain.
- the patterned SiO 2 film (hard mask film) 13 used as a hard mask is selectively removed by etching.
- the film thickness of the patterned SiO 2 film (hard mask film) 13 is slightly larger than the film thickness in the resistance change element forming region, particularly in the central region of the opening.
- the selective etching of the SiO 2 film (hard mask film) 13 is performed under a condition having high selectivity with respect to the SiCN film used for forming the exposed insulating barrier film 7.
- the SiCN film used for forming the insulating barrier film 7 may be slightly etched but is exposed.
- the conditions for selective etching of the SiO 2 film (hard mask film) 13 are selected so that the film thickness of the SiCN film is in the range of 20 to 30 nm.
- the film thickness of the patterned SiO 2 film (hard mask film) 13 is slightly larger than the film thickness in the resistance change element forming region, particularly in the central region of the opening. Therefore, while the SiO 2 film (hard mask film) 13 in the central region of the opening is removed by etching, in the surrounding region, the surface of the SiN film used for forming the upper surface protective film 12 is exposed for a certain period of time. Become. At that time, the SiN film exposed for a certain period of time may be subjected to slight etching, but the SiO 2 film is so formed that the thickness of the etched SiN film is at least in the range of 20 to 30 nm. Conditions for selective etching of (hard mask film) 13 are selected.
- the substrate bias power can be 700 W.
- a laminated structure including the film 9 and the titanium oxide film 8 is formed in the opening region where the variable resistance element is manufactured.
- the angle formed between the side wall surface of the laminated structure and the upper surface of the underlying insulating barrier film 7 is approximately 90 °.
- Step B5 In step B5, as shown in FIG. 12E, the upper surface and the side wall surface of the laminated structure including the patterned upper surface protective film 12, the second upper electrode 11, the first upper electrode 10, the solid electrolyte film 9, and the titanium oxide film 8,
- this is a step of depositing a protective insulating film 14 that covers the upper surface of the insulating barrier film 7 exposed around the periphery.
- a 30 nm-thickness SiN film is used as the protective insulating film 14.
- the protective insulating film 14 uses an isotropic deposition method so as to cover the upper surface and the side wall surface of the laminated structure and the upper surface of the insulating barrier film 7 exposed in the periphery with a uniform film thickness. Is deposited.
- a SiN film having a thickness of 30 nm used as the protective insulating film 14 is formed using a plasma CVD method, using SiH 4 and N 2 as source gases, using a high-density plasma at a substrate temperature of 200 ° C. be able to.
- a reducing gas such as NH 3 or H 2
- H is composed of a porous polymer mainly composed of silicon, oxygen, and carbon, which is used as the solid electrolyte film 9 in the film forming gas stabilization process immediately before film formation.
- H acts on oxygen (O), in avoiding the occurrence of the reaction that is converted to H 2 O.
- the SiN film used as the protective insulating film 14 is excellent in adhesion with the SiCN film used as the insulating barrier film 7 and the SiN film used as the upper surface protective film 12. Specifically, Si—N bonds are formed at the interface with the SiN film deposited on the surface of the SiCN film used as the insulating barrier film 7, and the two can be integrated. Also, Si—N bonds are formed at the interface between the SiN film used as the upper surface protective film 12 and the SiN film deposited on the upper and end surfaces of the SiN film, and the two are integrated.
- the protective insulating film 14 covering the side wall surface of the laminated structure is integrated with the SiCN film used as the insulating barrier film 7 and the SiN film used as the upper surface protective film 12. It effectively prevents moisture penetration, oxygen penetration, or oxygen detachment from the side wall surface of the structure. Therefore, it is possible to improve the yield and reliability of the resistance change element finally manufactured.
- Step B6 In step B6, as shown in FIG. 12F, the protective insulating film 14 covering the side wall surface of the laminated structure is left, the upper surface of the upper protective film 12, and the insulating barrier film 7 around the laminated structure are formed. This is a step of removing the SiN film covering the upper surface by etching.
- the etching of the SiN film covering the side wall surface of the laminated structure does not proceed, and the upper surface of the upper surface protective film 12 and the upper surface of the insulating barrier film 7 around the laminated structure are covered.
- an anisotropic dry etching method is employed.
- an “anisotropic etch-back” method is adopted, and the upper surface of the upper protective film 12 and the insulating barrier film 7 around the laminated structure are formed. It is also possible to use a method of selectively etching back the SiN film covering the upper surface and leaving the SiN film covering the side wall surface of the laminated structure.
- step B7 to be described later after removing the SiN film excluding the SiN film covering the side wall surface of the laminated structure, the second interlayer insulating film is utilized by plasma CVD.
- a SiO 2 film to be used for the fabrication is deposited. It is possible to perform "anisotropic etchback" by introducing Ar gas into the growth reactor and applying a substrate bias using a plasma CVD apparatus used for depositing the SiO 2 film. If so, it is possible to obtain the form shown in FIG. 12F by performing an “anisotropic etchback” process prior to the deposition of the SiO 2 film.
- Step B7 covers the upper surface protective film 12 of the laminated structure, the protective insulating film 14 covering the sidewall surface of the laminated structure, and the upper surface of the insulating barrier film 7 around the laminated structure, This is a step of forming a second interlayer insulating film 15 that has been subjected to planarization.
- the insulating barrier film 7 is also used as a first interlayer insulating film, and the second interlayer insulating film 15 is in direct contact with the first interlayer insulating film (insulating barrier film 7). .
- the upper surface protective film 12 having a laminated structure and the protective insulating film 14 covering the side wall surface of the laminated structure are formed using a SiN film, and a first interlayer insulating film (insulating) is formed.
- the conductive barrier film 7) is formed using a SiCN film, while the second interlayer insulating film 15 is formed using a silicon oxide (SiO 2 ) film.
- a silicon oxide film is deposited using a plasma CVD method (not shown).
- the film thickness of the silicon oxide film deposited on the upper surface of the central part of the laminated structure and the outer edge part of the laminated structure and the surrounding first interlayer insulating film (insulating barrier film 7) having a difference in height is as follows: , At least five times the step ⁇ h 1 , for example, about 450 nm. At this time, as the thickness of the step increases, the step of filling gradually progresses. Therefore, the difference in height (step) remaining on the upper surface of the deposited silicon oxide film is reduced, but the planarization is not performed. Not complete.
- the surface of the deposited silicon oxide film is subjected to a flattening process, for example, a polishing process using a CMP method.
- the conditions used for depositing the SiO 2 film (hard mask film) 13 in step B3 can be employed.
- the polishing amount is set to about 300 nm for the silicon oxide film having a film thickness of about 450 nm, and the silicon after the polishing process is set.
- the thickness of the oxide film can be adjusted to 150 nm on the upper surface portion of the first interlayer insulating film (insulating barrier film 7).
- Step B8 In step B8, as shown in FIG. 12H, a third interlayer insulating film 16 and a fourth interlayer insulating film 17 are formed on the upper surface of the second interlayer insulating film 15 made of the planarized silicon oxide film. It is a process to do.
- a silicon oxide (SiO 2 ) film having a thickness of 150 nm is adopted as the second interlayer insulating film 15, while the third interlayer insulating film 16 has For example, a SiOC film with a thickness of 150 nm is used, and a SiO 2 film with a thickness of 100 nm is used for the fourth interlayer insulating film 17.
- Both the SiOC film used for forming the third interlayer insulating film 16 and the SiO 2 film used for forming the fourth interlayer insulating film 17 can be deposited using the plasma CVD method. .
- step B9 In step B9, as shown in FIG. 12I, an upper wiring layer formed on the third interlayer insulating film 16 and the fourth interlayer insulating film 17 stacked on the second interlayer insulating film 15 is formed.
- second wiring” Fabrication of “plug” 19b integrated with “wiring” 18b and second insulating properties covering the upper surfaces of “second wiring” 18a, “second wiring” 18b, and fourth interlayer insulating film 17 This is a step of forming a barrier film (fifth interlayer insulating film) and a sixth interlayer insulating film stacked on the second insulating barrier film (fifth interlayer insulating film).
- the “plug” 19 a integrated with the “second wiring” 18 a is in contact with the upper surface of the second upper electrode 11 through the opening provided in the upper surface protective film 12, and the “second wiring” 18 a and the resistance change element The first electrode functioning as the “second electrode” is electrically connected.
- the “plug” 19b integrated with the “second wiring” 18b is connected to the “first wiring” corresponding to the lower wiring layer through an opening provided in the first interlayer insulating film (insulating barrier film 7). In contact with the surface of the metal (copper wiring) 5b, the "second wiring” 18b and the “first wiring” are electrically connected.
- the via-first method of the dual damascene method is applied to manufacture the “plug” 19a integrated with the “second wiring” 18a and the “plug” 19b integrated with the “second wiring” 18b.
- an opening corresponding to the shape of the bottom of the via hole used for forming the “plug” 19a is provided at a position corresponding to the central portion of the upper surface protective film 12, and corresponds to the lower wiring layer.
- the fourth interlayer insulating film 17, the third interlayer insulating film 16, and the second interlayer insulating film 15 are sequentially anisotropically etched by a dry etching method to form a fourth interlayer insulating film.
- the fourth interlayer insulating film 17 and the third interlayer insulating film 16 are anisotropically etched stepwise by a dry etching method. In “stepwise dry etching”, the etching condition of the SiOC film forming the third interlayer insulating film 16 is selected from the conditions having selectivity with respect to the SiO 2 film.
- the second interlayer insulating film 15 made of the SiO 2 film functions as an etching stopper layer in the etching process of the SiOC film forming the third interlayer insulating film 16. Further, in the etching process of the SiOC film forming the third interlayer insulating film 16, the progress of the side etching with respect to the side wall surface of the fourth interlayer insulating film 17 made of the SiO 2 film is suppressed. As a result, the “second wiring” 18 b and the “second wiring” 18 b are formed by “stepwise dry etching” of the fourth interlayer insulating film 17 and the third interlayer insulating film 16. A wiring trench is formed.
- the resist mask used for forming the wiring trench is removed. Thereafter, a condition having selectivity with respect to the SiOC film and the SiO 2 film is selected, and the upper surface protective film 12 made of the SiN film and the first interlayer insulating film made of the SiCN film exposed at the bottom of the via hole
- the (insulating barrier film 7) is dry-etched to expose the upper surface of the second upper electrode 11 and the surface of the metal (copper wiring) 5b of the “first wiring” at the bottom of the via hole.
- the via hole integrated with the formed wiring trench is filled with a metal via a barrier metal, and integrated with the “plug” 19a and the “second wiring” 18b integrated with the “second wiring” 18a.
- the formed “plug” 19b is formed.
- the metal material used for forming the “plug” 19a integrated with the “second wiring” 18a and the “plug” 19b integrated with the “second wiring” 18b corresponding to the upper wiring layer includes copper. Is used as a main component, for example, copper. Barrier metal prevents copper diffusion. Therefore, for example, a stacked structure of TaN (film thickness 5 nm) / Ta (film thickness 5 nm) is used as the barrier metal.
- a barrier metal having a laminated structure of TaN (film thickness 5 nm) / Ta (film thickness 5 nm) is coated with a uniform film thickness on the side wall and bottom of the via hole integrated with the wiring groove. Therefore, by using an isotropic deposition method, for example, RF sputtering, the deposited film having the laminated structure is formed on the upper surface of the fourth interlayer insulating film 17 and the side wall of the via hole integrated with the wiring groove. Form on the bottom and bottom.
- the copper used for the metal is formed so as to fill the inside of the via hole integrated with the wiring groove by using, for example, a plating method using a barrier metal as a base layer.
- a laminated structure of copper and TaN (film thickness 5 nm) / Ta (film thickness 5 nm) formed on the upper surface of the fourth interlayer insulating film 17 is formed.
- the upper surface of the “second wiring” formed in the wiring trench is flattened by removing.
- a second insulating barrier film (fifth interlayer insulating film) that covers the upper surface of the “second wiring” and the upper surface of the fourth interlayer insulating film 17 is formed.
- the second insulating barrier film prevents diffusion of copper used for the metal of the “second wiring”. Therefore, as the “insulating material used for forming the second insulating barrier film (fifth interlayer insulating film)”, for example, a SiCN film and a SiN film with a film thickness of 30 nm are selected.
- the “insulating material used for forming the sixth interlayer insulating film” to be laminated on the second insulating barrier film (fifth interlayer insulating film) for example, a SiO 2 film or a SiOC film is selected.
- the SiCN film or SiN film used for forming the second insulating barrier film (fifth interlayer insulating film), and the SiO 2 film or SiOC film used for forming the sixth interlayer insulating film, Can also be deposited using plasma CVD.
- adopted with the resistance change element concerning this invention can be confirmed from the state after manufacture. Specifically, the cross section of the device of the product adopting the variable resistance element is observed with a TEM to confirm that the variable resistance element is formed in the multilayer wiring layer. Furthermore, it is confirmed by cross-sectional TEM observation that a resistance change film constituting the resistance change element or a protective insulating film is formed on the side surface of the electrode. Further, it is confirmed that the protective insulating film does not extend in the horizontal direction, and it is confirmed that the protective insulating film is not used as an interlayer insulating film.
- a protective insulating film is obtained by performing composition analysis such as EDX (Energy Dispersive X-ray Spectroscopy), EELS (Electron Energy-Loss Spectroscopy). It is possible to confirm the insulating material used as EDX (Energy Dispersive X-ray Spectroscopy), EELS (Electron Energy-Loss Spectroscopy). It is possible to confirm the insulating material used as
- the resistance change element formed on the copper wiring is a switching element using a resistance change film made of a solid electrolyte
- the solid electrolyte film functioning as the “ion conductive layer” is oxygen
- the element is used to determine whether the material described in this specification is used. Judgment is made by analyzing the composition of the cross section.
- the protective insulating film is formed on the side surface of the laminated structure constituting the variable resistance element and identifying whether it is a SiN film, it is preferable to perform the composition analysis by surface analysis. . Further, it is possible to identify from the cross-sectional structure that the first interlayer insulating film and the second interlayer insulating film located above the first interlayer insulating film have a direct contact with each other.
- ReRAM using a “copper filament deposition type resistance change element” that employs a solid electrolyte layer as the resistance change film, or a resistance change film made of a metal oxide is employed.
- the present invention is described in detail for the case of constructing a defective ReRAM.
- a resistance change element employing a film other than a solid electrolyte or metal oxide as the resistance change film for example, a resistance change element using a magnetic material, an MRAM or a spin element, or a phase change element
- the present invention may be applied to a configuration of a PRAM or the like that employs a variable resistance change layer (GST).
- GST variable resistance change layer
- variable resistance element and the method for manufacturing the variable resistance element according to the present invention.
- these embodiments and the embodiments are technical It is an example selected for the purpose of specifically explaining the principle, and the technical scope of the present invention is not meant to be limited to these specific examples.
- CMOS circuit which is a field of use that is the background of the invention made by the present inventor, will be described in detail, and a mode in which a resistance change element is formed on a copper wiring on a semiconductor substrate will be described.
- the technical idea of the present invention is not limited to the “form in which the resistance change element is formed on the copper wiring on the semiconductor substrate”.
- the technical idea of the present invention is a memory circuit such as DRAM (Dynamic RAM), SRAM (Static RAM), flash memory, FRAM (Ferro Electric RAM), MRAM (Magnetic RAM), resistance change memory, bipolar transistor, etc.
- the present invention can also be applied to a semiconductor product having a logic circuit, a semiconductor product having a logic circuit such as a microprocessor, or a copper wiring of a board or a package on which these are listed simultaneously.
- variable resistance element according to the present invention is bonded to a semiconductor device such as an electronic circuit device, an optical circuit device, a quantum circuit device, a micromachine, or MEMS (Micro Electro Mechanical Systems). It can also be applied to.
- a semiconductor device such as an electronic circuit device, an optical circuit device, a quantum circuit device, a micromachine, or MEMS (Micro Electro Mechanical Systems). It can also be applied to.
- the variable resistance element according to the present invention has been described with a focus on the case where the switch function is used. However, the variable resistance element according to the present invention is used for a memory element using both non-volatility and variable resistance characteristics. You can also.
- the resistance change element according to the present invention can be used as a nonvolatile switching element provided in a multilayer wiring layer of a semiconductor device.
Abstract
Description
MRAMでは、図14に例示する磁気抵抗効果を利用する磁気抵抗素子であり、
PRAMでは、図15に例示する「高抵抗な非晶質状態」と「低抵抗な結晶状態」の間で可逆的な相変化を起こす、相変化物質(例えば、Ge2Sb2Te5)を利用する、相変化型抵抗変化素子であり、
ReRAMでは、図17に例示する電界誘起巨大抵抗変化効果(Colosal Electro-Resistance)を示す金属酸化物からなる抵抗変化膜を利用する、酸素欠損型抵抗変化素子、あるいは、固体電解質からなる抵抗変化膜を利用する、金属架橋型抵抗変化素子である。磁気抵抗素子で利用される「磁性材料」;相変化型抵抗変化素子で利用される「相変化物質(例えば、Ge2Sb2Te5)」;酸素欠損型抵抗変化素子で使用される「金属酸化物」と該「金属酸化物」と金属/「金属酸化物」接合を形成する「金属電極」;金属架橋型抵抗変化素子で「イオン伝導層」として利用する「固体電解質」、「イオン供給層」として利用する「第1電極」と「イオン伝導層」に電子注入を行う「第2電極」は、例えば、「酸化」を受けると、利用されている物性が失われ、目的とする抵抗変化素子の特性が達成されない場合がある。また、金属架橋型抵抗変化素子で「イオン伝導層」として利用される「多孔質膜」が湿度(水分)を吸収すると、吸収された水分は、「OFF」状態において、「リーク電流」の要因となる。
半導体基板上の配線層内に設けられる抵抗変化素子であって、
前記配線層は、第一の層間絶縁膜と、第一の層間絶縁膜の上部に位置する第二の層間絶縁膜を有し、
前記抵抗変化素子は、
第一の層間絶縁膜上に形成されている抵抗変化膜と、
該抵抗変化膜の上面に接して形成されている第一の電極を具えており、
前記抵抗変化膜と第一の電極を具える、該抵抗変化素子の側面には、少なくとも、抵抗変化膜の側面を被覆する保護絶縁膜が形成されており、
少なくとも、前記抵抗変化素子の側面に形成されている保護絶縁膜は、第二の層間絶縁膜で被覆され、
前記第二の層間絶縁膜と第一の層間絶縁膜とが直接接している
ことを特徴とする抵抗変化素子である。
前記第一の層間絶縁膜は、下層の銅配線の上面に接することが好ましい。
前記第一の層間絶縁膜は、開口部を有し、
該開口部を介して、抵抗変化素子の抵抗変化膜が、下層の銅配線の上面と接していることが好ましい。
前記抵抗変化膜は、固体電解質からなる膜である構成を採用することができる。
前記抵抗変化膜は、酸化物を含む構成を採用することもできる。
前記保護絶縁膜は、抵抗変化膜、第一の電極、上面保護膜の側面を被覆している構成を選択することが望ましい。
本発明の第1の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図1は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第1の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
本発明の第2の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図2は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第2の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図3は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
本発明の第4の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図4は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第4の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
本発明の第5の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図5は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第5の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
本発明の第6の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、図面を参照して、説明する。図6は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第6の実施形態に係る抵抗変化素子の一構成例を模式的に示す断面図である。
t:抵抗変化(「銅フィラメント」の先端が銅配線608表面に達する)までの時間;
E:電界(当初、固体電解質中に印加されている電界);
H:湿度(固体電解質と接する気相中の水分濃度);
Ea:活性化エネルギー(金属Cuから銅イオンCu2+へのイオン化過程の活性化エネルギー);
k:ボルツマン定数、T:温度(銅配線608と抵抗変化膜603の界面の温度)
このモデルによれば、「抵抗変化素子」の抵抗変化動作(スイッチング動作)は、動作電圧(電界E)だけでなく、湿度H(固体電解質と接する気相中の水分濃度)にも大きく依存することを示している。すなわち、動作環境の変化によって、湿度H(固体電解質と接する気相中の水分濃度)が変化すると、「抵抗変化素子」の抵抗変化動作(スイッチング動作)が完了するまでの時間tが変化する。換言すると、「抵抗変化素子」の抵抗変化動作(スイッチング動作)が完了するまでの時間tを一定に保つためには、(Eγ・Hn)を一定に保つ必要がある。動作環境の変化によって、湿度H(固体電解質と接する気相中の水分濃度)が変化することに伴って、所定の時間tで抵抗変化動作(スイッチング動作)を完了するための、抵抗変化動作(スイッチング動作)の閾値電圧(閾値電界Eth)が変動することになる。抵抗変化動作(スイッチング動作)の閾値電圧(閾値電界Eth)の変動は、「抵抗変化素子」の誤動作を引き起こす要因になる。「抵抗変化素子」の誤動作を防止するため、「抵抗変化素子」の「抵抗変化膜」603と、周辺環境中の水分との接触を防止する「パッシベーション膜」、すなわち、保護絶縁膜606により、「抵抗変化膜」603の側面を被覆して、水分から「抵抗変化膜」603を保護することが必要である。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、その実施態様の一例を図面を参照して、説明する。図7は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の第1の実施態様を模式的に示す断面図である。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、その実施態様の一例を図面を参照して、説明する。図8は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の第2の実施態様を模式的に示す断面図である。
「第二の層間絶縁膜802の形成に利用する絶縁材料」として、比誘電率が中程度(k=3.5~4.5)程度の絶縁材料、例えば、SiO2膜を選択し、
「第三の層間絶縁膜816を形成する絶縁材料」として、比誘電率が低い(k=2.5~3.5)の絶縁材料、例えば、SiOCH膜を選択することが好ましい。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、その実施態様の一例を図面を参照して、説明する。図9は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の第3の実施態様を模式的に示す断面図である。
「第二の層間絶縁膜902の形成に利用する絶縁材料」として、比誘電率が中程度(k=3.5~4.5)程度の絶縁材料、例えば、SiO2膜を選択し、
「第三の層間絶縁膜916を形成する絶縁材料」として、比誘電率が低い(k=2.5~3.5)の絶縁材料、例えば、SiOCH膜を選択することが好ましい。
図9に示す、第3の実施態様の抵抗変化素子999においては、抵抗変化膜903、第1上部電極904aと第2上部電極904b、上面保護膜907の側面は、保護絶縁膜906で被覆されている。従って、第二の層間絶縁膜902は、第一の層間絶縁膜901と直接接している。さらに、第二の層間絶縁膜902の上部に、第三の層間絶縁膜916が形成されている。その際、第三の層間絶縁膜916は、第二の層間絶縁膜902と直接接している。
「第一の層間絶縁膜901の形成に利用する絶縁材料」に、比誘電率k1=4.9のSiCN膜を採用し、第一の層間絶縁膜901の膜厚は、d1=30nmに選択し;
「第二の層間絶縁膜902の形成に利用する絶縁材料」に、比誘電率k2=4.2のSiO2膜を採用し、第二の層間絶縁膜902の膜厚は、d2=100nmに選択し;
「下層の層間絶縁膜911を形成する絶縁材料」として、比誘電率k3=2.7のSiOCH膜を採用している。
「第一の層間絶縁膜1001の形成に利用する絶縁材料」に、比誘電率k1=4.9のSiCN膜を採用し、第一の層間絶縁膜1001の膜厚は、d1=30nmに選択し;
「保護絶縁膜1005の形成に利用する絶縁材料」に、比誘電率kP=7.0のSiN膜を採用し、保護絶縁膜1005の膜厚は、dP=20nmに選択し;
「第二の層間絶縁膜1002の形成に利用する絶縁材料」に、比誘電率k2=4.2のSiO2膜を採用し、第二の層間絶縁膜1002の膜厚は、d'2=80nmに選択し;
「下層の層間絶縁膜1011を形成する絶縁材料」として、比誘電率k3=2.7のSiOCH膜を採用している。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、その実施態様の一例を図面を参照して、説明する。図11は、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の第4の実施態様を模式的に示す断面図である。
「第二の層間絶縁膜1102の形成に利用する絶縁材料」として、比誘電率が中程度(k=3.5~4.5)程度の絶縁材料、例えば、SiO2膜を選択し、
「第三の層間絶縁膜1116を形成する絶縁材料」として、比誘電率が低い(k=2.5~3.5)の絶縁材料、例えば、SiOCH膜を選択することが好ましい。
本発明の第3の実施形態に係る抵抗変化素子を、多層配線層中に設ける不揮発性スイッチング素子として利用する半導体装置について、その実施態様の一例と、その製造プロセスを図面を参照して、説明する。図12A~図12Iは、半導体装置の多層配線層中に設ける不揮発性スイッチング素子として利用される、本発明の第3の実施形態に係る抵抗変化素子の第5の実施態様と、その製造プロセスを模式的に示す断面図である。
ステップB1は、図12Aに示す、下層の配線層に相当する「第1配線」の作製と、抵抗変化素子の作製に際し、「イオン供給層」として機能する「第1電極」として利用する「第1配線」の表面を被覆する絶縁性バリア膜7に、開口部を形成する工程である。
フォトリソグラフィ法を用いて、層間絶縁膜4の上に所定のパターンの開口を有する、レジスト・マスクを形成する、レジスト・マスク形成処理ステップ;
レジスト・マスクをエッチング・マスク層として利用し、ドライエッチング法により、積層された膜に異方性エッチングを施す、エッチング処理ステップ;および、
異方性エッチングにより配線溝を形成した後、レジスト・マスクを除去する、レジスト除去処理ステップを含む。
ステップB2は、図12Bに示す、抵抗変化素子の作製に際し、「第1配線」の金属(銅配線)5表面の酸化を防止する酸化チタン膜8、「イオン伝導層」として利用する固体電解質膜9、「第2電極」として機能する第一の電極を構成する、第1上部電極10、第2上部電極11を、絶縁性バリア膜7の上面と、形成した開口部に、順次形成する工程である。
ステップB3は、図12Cに示す、抵抗変化素子の作製に際し、「第2電極」として機能する第一の電極を構成する、第1上部電極10、第2上部電極11のうち、第2上部電極11の上面に設ける、上面保護膜12の形成に利用される、SiN膜の堆積工程と、酸化チタン膜8、固体電解質膜9、第1上部電極10、第2上部電極11、上面保護膜12のパターニング工程において、ハードマスクとして利用する、SiO2膜(ハードマスク膜)13の堆積工程からなる。
ステップB4は、SiO2膜(ハードマスク膜)13からなるハードマスクを利用して、上面保護膜12、第2上部電極11、第1上部電極10、固体電解質膜9、酸化チタン膜8を、順次選択エッチングし、パターニングを行う工程と、その後、ハードマスクとして利用する、SiO2膜(ハードマスク膜)13を選択的にエッチング除去する工程からなる。最終的に、上面保護膜12、第2上部電極11、第1上部電極10、固体電解質膜9、酸化チタン膜8のパターニングを完了すると、図12Dに示す積層構造が、抵抗変化素子の作製を行う、開口部領域に形成される。
ステップB5は、図12Eに示すように、パターニングされた上面保護膜12、第2上部電極11、第1上部電極10、固体電解質膜9、酸化チタン膜8からなる積層構造の上面と側壁面、ならびに、その周囲に露呈している絶縁性バリア膜7の上面を被覆する、保護絶縁膜14を堆積する工程である。保護絶縁膜14として、例えば、膜厚30nmのSiN膜が利用される。
ステップB6は、図12Fに示すように、積層構造の側壁面を被覆している、保護絶縁膜14を残し、上面保護膜12の上面、ならびに、該積層構造の周囲の絶縁性バリア膜7の上面を覆っている、SiN膜をエッチング除去する工程である。
ステップB7は、図12Gに示すように、積層構造の上面保護膜12、積層構造の側壁面を被覆する保護絶縁膜14、ならびに、該積層構造の周囲の絶縁性バリア膜7の上面を覆い、平坦化処理を施された第二の層間絶縁膜15を形成する工程である。絶縁性バリア膜7は、第一の層間絶縁膜としても利用されており、第二の層間絶縁膜15は、第一の層間絶縁膜(絶縁性バリア膜7)と直接接する形態とされている。
ステップB8は、図12Hに示すように、平坦化処理を施したシリコン酸化膜からなる第二の層間絶縁膜15の上面に、第三の層間絶縁膜16ならびに第四の層間絶縁膜17を形成する工程である。
(ステップB9)
ステップB9は、図12Iに示すように、第二の層間絶縁膜15上に積層される、第三の層間絶縁膜16と第四の層間絶縁膜17中に形成される、上層の配線層に相当する「第2配線」18a、「第2配線」18b、ならびに、第二の層間絶縁膜15中に形成される、「第2配線」18aと一体化された「プラグ」19a、「第2配線」18bと一体化された「プラグ」19bの作製と、「第2配線」18a、「第2配線」18b、ならびに、第四の層間絶縁膜17の上面を被覆する、第2の絶縁性バリア膜(第五の層間絶縁膜)と、該第2の絶縁性バリア膜(第五の層間絶縁膜)上に積層される、第六の層間絶縁膜の形成を行う工程である。
以上、実施形態(及び実施例)を参照して本願発明を説明したが、本願発明は上記実施形態(及び実施例)に限定されものではない。本願発明の構成や詳細には、本願発明のスコープ内で当業者が理解し得る様々な変更をすることができる。
Claims (10)
- 半導体基板上の配線層内に設けられる抵抗変化素子であって、
前記配線層は、第一の層間絶縁膜と、第一の層間絶縁膜の上部に位置する第二の層間絶縁膜を有し、
前記抵抗変化素子は、
第一の層間絶縁膜上に形成されている抵抗変化膜と、
該抵抗変化膜の上面に接して形成されている第一の電極を具えており、
前記抵抗変化膜と第一の電極を具える、該抵抗変化素子の側面には、少なくとも、抵抗変化膜の側面を被覆する保護絶縁膜が形成されており、
少なくとも、前記抵抗変化素子の側面に形成されている保護絶縁膜は、前記第二の層間絶縁膜で被覆され、
前記第二の層間絶縁膜と第一の層間絶縁膜とが直接接している
ことを特徴とする抵抗変化素子。 - 前記保護絶縁膜は、SiN膜で形成されている
ことを特徴とする請求項1に記載の抵抗変化素子。 - 前記配線層を構成する配線は、銅配線であり、
前記第一の層間絶縁膜は、下層の銅配線の上面に接する
ことを特徴とする請求項1に記載の抵抗変化素子。 - 前記第一の層間絶縁膜は、開口部を有し、
該開口部を介して、抵抗変化素子の抵抗変化膜が、下層の銅配線の上面と接している
ことを特徴とする請求項3に記載の抵抗変化素子。 - 前記第一の層間絶縁膜は、SiN膜、あるいはSiCN膜で形成されている
ことを特徴とする請求項4に記載の抵抗変化素子。 - 前記第一の電極は、Ruを主成分とする金属で形成されており、
前記抵抗変化膜は、固体電解質からなる膜である
ことを特徴とする請求項1~5のいずれか一項に記載の抵抗変化素子。 - 前記固体電解質からなる膜は、多孔質膜である
ことを特徴とする請求項6に記載の抵抗変化素子。 - 前記抵抗変化膜は、酸化物を含む
ことを特徴とする請求項1または2に記載の抵抗変化素子。 - 前記第二の層間絶縁膜は、SiO2膜である
ことを特徴とする請求項1~6のいずれか一項に記載の抵抗変化素子。 - 前記第一の電極の上面に、上面保護膜が形成されており、
前記保護絶縁膜は、抵抗変化膜、第一の電極、上面保護膜の側面を被覆している
ことを特徴とする請求項1または2に記載の抵抗変化素子。
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Cited By (10)
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CN106298832A (zh) * | 2015-06-11 | 2017-01-04 | 复旦大学 | 一种非易失性存储元件及制造方法 |
KR20170039567A (ko) * | 2015-09-24 | 2017-04-11 | 램 리써치 코포레이션 | 칼코게나이드 재료를 캡슐화하기 위한 방법 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20150037047A (ko) * | 2013-09-30 | 2015-04-08 | 에스케이하이닉스 주식회사 | 전자 장치 및 그 제조 방법 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008001712A1 (fr) * | 2006-06-26 | 2008-01-03 | Nec Corporation | Élément de commutation, dispositif à semi-conducteurs, circuit intégré logique réinscriptible et élément de mémoire |
JP2009021524A (ja) * | 2007-07-13 | 2009-01-29 | Panasonic Corp | 抵抗変化素子とその製造方法ならびに抵抗変化型メモリ |
WO2011115188A1 (ja) * | 2010-03-19 | 2011-09-22 | 日本電気株式会社 | 抵抗変化素子とそれを含む半導体装置及びこれらの製造方法 |
WO2012105139A1 (ja) * | 2011-02-02 | 2012-08-09 | 日本電気株式会社 | スイッチング素子、半導体装置およびそれぞれの製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042804A (ja) * | 2005-08-02 | 2007-02-15 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP5488458B2 (ja) * | 2008-04-07 | 2014-05-14 | 日本電気株式会社 | 抵抗変化素子及びその製造方法 |
US20100109085A1 (en) * | 2008-11-05 | 2010-05-06 | Seagate Technology Llc | Memory device design |
US8586958B2 (en) * | 2009-01-09 | 2013-11-19 | Nec Corporation | Switching element and manufacturing method thereof |
-
2013
- 2013-04-26 US US14/419,520 patent/US20150221865A1/en not_active Abandoned
- 2013-04-26 JP JP2014531520A patent/JPWO2014030393A1/ja active Pending
- 2013-04-26 WO PCT/JP2013/062399 patent/WO2014030393A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008001712A1 (fr) * | 2006-06-26 | 2008-01-03 | Nec Corporation | Élément de commutation, dispositif à semi-conducteurs, circuit intégré logique réinscriptible et élément de mémoire |
JP2009021524A (ja) * | 2007-07-13 | 2009-01-29 | Panasonic Corp | 抵抗変化素子とその製造方法ならびに抵抗変化型メモリ |
WO2011115188A1 (ja) * | 2010-03-19 | 2011-09-22 | 日本電気株式会社 | 抵抗変化素子とそれを含む半導体装置及びこれらの製造方法 |
WO2012105139A1 (ja) * | 2011-02-02 | 2012-08-09 | 日本電気株式会社 | スイッチング素子、半導体装置およびそれぞれの製造方法 |
Cited By (21)
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JPWO2015182074A1 (ja) * | 2014-05-29 | 2017-04-20 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US9905758B2 (en) | 2014-05-29 | 2018-02-27 | Nec Corporation | Semiconductor device and method for manufacturing same |
WO2015182074A1 (ja) * | 2014-05-29 | 2015-12-03 | 日本電気株式会社 | 半導体装置およびその製造方法 |
CN106298832A (zh) * | 2015-06-11 | 2017-01-04 | 复旦大学 | 一种非易失性存储元件及制造方法 |
KR20170039567A (ko) * | 2015-09-24 | 2017-04-11 | 램 리써치 코포레이션 | 칼코게나이드 재료를 캡슐화하기 위한 방법 |
JP2017092455A (ja) * | 2015-09-24 | 2017-05-25 | ラム リサーチ コーポレーションLam Research Corporation | カルコゲナイド材料を封止する方法 |
KR102637938B1 (ko) | 2015-09-24 | 2024-02-16 | 램 리써치 코포레이션 | 칼코게나이드 재료를 캡슐화하기 위한 방법 |
JPWO2017126544A1 (ja) * | 2016-01-20 | 2018-11-22 | 日本電気株式会社 | 再構成可能回路、再構成可能回路システム、および再構成可能回路の動作方法 |
WO2017126544A1 (ja) * | 2016-01-20 | 2017-07-27 | 日本電気株式会社 | 再構成可能回路、再構成可能回路システム、および再構成可能回路の動作方法 |
JPWO2017126664A1 (ja) * | 2016-01-22 | 2018-12-27 | 新日鐵住金株式会社 | 微小スイッチおよびそれを用いる電子デバイス |
CN108496251A (zh) * | 2016-01-22 | 2018-09-04 | 新日铁住金株式会社 | 微小开关及使用其的电子设备 |
US11127898B2 (en) | 2016-01-22 | 2021-09-21 | Nippon Steel Corporation | Microswitch and electronic device in which same is used |
CN108496251B (zh) * | 2016-01-22 | 2022-08-12 | 日本制铁株式会社 | 微小开关及使用其的电子设备 |
WO2017126664A1 (ja) * | 2016-01-22 | 2017-07-27 | 新日鐵住金株式会社 | 微小スイッチおよびそれを用いる電子デバイス |
US11404275B2 (en) | 2018-03-02 | 2022-08-02 | Lam Research Corporation | Selective deposition using hydrolysis |
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US11239420B2 (en) | 2018-08-24 | 2022-02-01 | Lam Research Corporation | Conformal damage-free encapsulation of chalcogenide materials |
US11832533B2 (en) | 2018-08-24 | 2023-11-28 | Lam Research Corporation | Conformal damage-free encapsulation of chalcogenide materials |
KR20210020741A (ko) * | 2019-08-16 | 2021-02-24 | 연세대학교 산학협력단 | 멀티 입력 기반의 저항 변화 메모리 소자 |
KR102294284B1 (ko) * | 2019-08-16 | 2021-08-26 | 연세대학교 산학협력단 | 멀티 입력 기반의 저항 변화 메모리 소자 |
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