WO2013175934A1 - Dispositif d'application, et système ainsi que procédé de traitement de substrat - Google Patents

Dispositif d'application, et système ainsi que procédé de traitement de substrat Download PDF

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Publication number
WO2013175934A1
WO2013175934A1 PCT/JP2013/062353 JP2013062353W WO2013175934A1 WO 2013175934 A1 WO2013175934 A1 WO 2013175934A1 JP 2013062353 W JP2013062353 W JP 2013062353W WO 2013175934 A1 WO2013175934 A1 WO 2013175934A1
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WO
WIPO (PCT)
Prior art keywords
substrate
cleaning
coating
liquid
cleaning liquid
Prior art date
Application number
PCT/JP2013/062353
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English (en)
Japanese (ja)
Inventor
吉浩 稲尾
純一 桂川
修吾 対馬
Original Assignee
東京応化工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京応化工業株式会社 filed Critical 東京応化工業株式会社
Publication of WO2013175934A1 publication Critical patent/WO2013175934A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating

Definitions

  • the present invention relates to a coating apparatus that applies a coating liquid to a substrate, and more particularly to a coating apparatus that rotates the substrate and spreads the coating liquid on the substrate surface.
  • Patent Document 1 discloses a coating apparatus in which a substrate is placed on a spindle chuck disposed in a case, and the coating liquid dropped on the substrate surface is uniformly spread by rotating the substrate by the spindle chuck.
  • a cylindrical wall portion is provided on the bottom surface of the case to store the spindle chuck with the top surface exposed, and a rectifying member is disposed outside the cylindrical wall portion, and the rectifying member is fixed to the case.
  • An application device is described in which an opening for breathing is formed in the horizontal portion, and a mist guard is disposed below the opening for breathing. According to such a technique, there is provided a coating apparatus in which the mist-like coating liquid is hardly contained in the airflow passing through the back side of the substrate, and the coating liquid does not adhere to the back side of the substrate.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2006-086204 (published March 30, 2006)”
  • the coating liquid scattered by the centrifugal force of the rotation of the substrate can adhere not only to the back side of the substrate but also to the inside of the coating apparatus. Since the coating liquid adhering to the inside of the coating apparatus is difficult to flow and tends to accumulate in the coating apparatus, various problems such as clogging of the waste liquid line occur. Therefore, frequent maintenance (for example, cleaning with the cup removed) is required. In particular, when using a highly viscous coating solution, this problem becomes significant.
  • the present invention has been made in view of the above problems, and in a coating apparatus that rotates a substrate and spreads the coating liquid on the substrate surface, it is possible to suppress the occurrence of problems due to the adhesion of the coating liquid to the inside of the coating apparatus.
  • the main purpose is to provide technology.
  • a coating apparatus is a coating apparatus that coats a substrate with a coating liquid, a cup that surrounds the substrate, a nozzle that discharges the coating liquid onto the substrate, a rotating unit that rotates the substrate, A discharge path for discharging the coating liquid from the cup and a cleaning means for supplying a cleaning liquid to at least one of the inner wall of the cup and the discharge path are provided.
  • the substrate processing method includes a coating process in which a coating liquid is applied to a substrate placed in a cup and the substrate is rotated.
  • the coating liquid is applied from the inner wall of the cup and the cup.
  • the cleaning liquid is supplied to at least one of the discharge paths for discharging the water.
  • the cleaning liquid can be supplied into the coating apparatus and the coating liquid can be washed away, it is possible to suppress the occurrence of problems due to the adhesion of the coating liquid to the inside of the coating apparatus.
  • FIG. 1 is a side sectional view showing a schematic configuration of a coating apparatus 10 according to an embodiment of the present invention.
  • the coating device 10 is a device that applies a coating solution to the substrate 1, and includes a cup 11 that surrounds the substrate 1, a nozzle 12 that discharges the coating solution to the substrate 1, a nozzle receiver 13 that stores the nozzle 12, and a cup 11.
  • a gas-liquid separation unit 15 that separates the droplet-shaped coating liquid discharged from the cup 11 from the discharged gas is provided in the discharge path 14.
  • the placement unit 21 may be configured to fix the substrate 1 and may be, for example, a suction unit such as a vacuum chuck that sucks the substrate 1.
  • the cup 11 should just surround the board
  • the coating liquid is a substance to be applied on the substrate 1 in order to obtain a desired effect, and is not particularly limited, and examples thereof include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and elastomers. obtain.
  • the nozzles 12 may be one or a plurality of nozzles as long as they are adapted to discharge the coating liquid.
  • the nozzle 12 is preferably stored in the nozzle receiver 13 when the coating liquid is not discharged.
  • the coating apparatus 10 spreads the coating liquid on the substrate 1.
  • the discharge of the coating liquid from the nozzle 12 and the rotation of the substrate 1 by the rotating unit 18 may be performed simultaneously or sequentially.
  • substrate 1 suitably, For example, 10 rpm or more and 5000 rpm or less, Preferably it can be 10 rpm or more and 3000 rpm or less.
  • the coating liquid is scattered by the centrifugal force of the rotation of the substrate 1 and adheres to the inside of the coating apparatus 10.
  • such scattered coating liquid is difficult to flow, and therefore the inside of the apparatus, in particular, the inner wall of the cup 11 (A in the figure), the gas-liquid separation unit 15 (B in the figure), etc. It is easy to collect in. If the coating liquid accumulates on the inner wall of the cup 11, the gas-liquid separator 15, etc., a problem such as clogging of the discharge path 14 occurs and frequent maintenance is required.
  • the high-viscosity coating solution refers to a coating solution having a viscosity of 1000 cp or more measured at 25 ° C. with an E-type (cone & plate type) viscometer.
  • the coating apparatus 10 includes a device cleaning unit 16 that supplies the cleaning liquid to the inner wall of the cup 11 and a device cleaning unit 17 that supplies the cleaning liquid to the discharge path 14.
  • a device cleaning unit 16 that supplies the cleaning liquid to the inner wall of the cup 11
  • a device cleaning unit 17 that supplies the cleaning liquid to the discharge path 14.
  • cleaning part 17 supplies a washing
  • the gas-liquid separation unit 15 is a tank having at least one inlet and at least two outlets, and separates the droplet-like coating liquid and the exhaust gas flowing from the cup 11 through the inlet.
  • the coating liquid is discharged from one discharge port, and the discharged gas is discharged from the other discharge port.
  • the coating liquid tends to accumulate inside. Therefore, when the apparatus cleaning unit 17 supplies the cleaning liquid to the gas-liquid separation unit 15, the coating liquid adhering to the inside of the coating apparatus 10 can be cleaned more suitably.
  • the mode in which the apparatus cleaning units 16 and 17 supply the cleaning liquid to each unit in the coating apparatus 10 is not particularly limited, but may be, for example, a pressurized pressure feeding, a pump supply, or the like.
  • the supply amount of the cleaning liquid in the apparatus cleaning units 16 and 17 is not particularly limited, and can be, for example, about 5 mL per substrate.
  • the cleaning liquid used in the present embodiment is not particularly limited as long as it can dissolve the coating liquid, and may be an aqueous solvent or an organic solvent. In this case, p-menthane or the like can be used. Further, when the coating solution is acrylic, PGMEA or the like can be used.
  • Ketones polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol; compounds having an ester bond such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol monoacetate, Monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether of the polyhydric alcohol or the compound having an ester bond
  • polyhydric alcohols such as compounds having an ether bond, such as monoalkyl ethers or monophenyl ethers of which propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); dioxane Cyclic ethers such as: esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate,
  • the coating apparatus 10 includes a cover member 19 in order to prevent the coating liquid from adhering to the back surface of the substrate 1. This is because, particularly when a high-viscosity coating liquid is used, a thread-shaped coating liquid stretched by the centrifugal force accompanying the rotation of the substrate 1 is generated and may adhere to the back surface of the substrate 1.
  • the cover member 19 is provided so as to face the back surface of the substrate 1 (the surface opposite to the surface on which the coating solution is applied), and such a thread-like coating solution reaches the back surface of the substrate 1. Can be prevented.
  • the cover member 19 is also preferably cleaned with a cleaning liquid.
  • the apparatus cleaning unit 16 supplies the cleaning liquid to the cover member 19 together with the inner wall of the cup 11. Thereby, the coating liquid adhering to the inside of the coating apparatus 10 can be suitably washed, and the maintenance cycle can be improved.
  • the coating apparatus 10 may include a back surface cleaning unit 20 that supplies a cleaning liquid to the back surface of the substrate 1 and cleans the coating liquid attached to the back surface of the substrate 1.
  • the coating liquid may be dried at the nozzle 12. Therefore, in one embodiment, it is preferable that the cleaning liquid is supplied to the nozzle receiver 13 that houses the nozzle 12. In other words, it is preferable that the nozzle receiver 13 includes a storage unit that stores the cleaning liquid, and the nozzle 12 is stored in the storage unit. By comprising in this way, it can suppress that a coating liquid dries in the nozzle 12.
  • FIG. The amount of the cleaning liquid supplied to the nozzle receiver 13 is not particularly limited, but may be 5 to 10 mL per substrate, for example.
  • FIG. 3 is a block diagram showing a schematic configuration of the substrate processing system 100 according to one embodiment of the present invention. As shown in FIG. 3, the substrate processing system 100 according to the present embodiment uses, in addition to the coating apparatus 10, a cleaning apparatus 30 and a cleaning apparatus 30 that clean the back surface and the peripheral portion of the substrate 1 coated with the coating liquid.
  • the substrate cleaning liquid tank 50 for storing the substrate cleaning liquid to be used, the used cleaning liquid tank 51 for storing the used substrate cleaning liquid discharged from the cleaning apparatus 30, the unused cleaning liquid tank 52 for storing the unused cleaning liquid, and the waste liquid discharged from the coating apparatus 10 And a valve (cleaning liquid supply means) 54 for controlling which of the used cleaning liquid tank 51 and the unused cleaning liquid tank 52 supplies the cleaning liquid to the coating apparatus 10.
  • the substrate processing system 100 includes a pipe (cleaning liquid supply means) for connecting each tank and each apparatus, and a pump (for supplying a cleaning liquid etc. to each tank and each apparatus in the pipe ( Cleaning liquid supply means) and the like.
  • the cleaning device 30 is a device that performs cleaning of the back surface of the substrate 1 coated with the coating solution (back rinse) and cleaning of the peripheral portion (edge rinse).
  • the cleaning device 30 encloses the substrate 1 and the substrate cleaning solution on the substrate 1.
  • the EBR nozzle 32 that discharges to the peripheral edge, the discharge path 34 that discharges the coating liquid from the cup 31, the rotating section 38 that rotates the substrate 1, and the surface of the substrate 1 opposite to the surface on which the coating liquid is applied.
  • the cover member 39 is provided, a back surface cleaning unit 40 for supplying a substrate cleaning liquid to the back surface of the substrate 1, and a mounting unit 41 for mounting the substrate 1.
  • a gas-liquid separator 35 that separates the droplet-shaped coating liquid discharged from the cup 31 from the discharged gas is provided in the discharge path 34.
  • the cleaning device 30 supplies the substrate cleaning liquid from the EBR nozzle 32 to the peripheral portion of the substrate 1 from the back surface cleaning unit 40 to the back surface of the substrate 1 while rotating the substrate 1 by the rotating unit 38. The back surface and peripheral edge of the substrate 1 are cleaned.
  • the substrate cleaning liquid used in the cleaning apparatus 30 is not particularly limited, and the same cleaning liquid as used in the coating apparatus 10 described above can be used. However, it is preferable to use an unused substrate cleaning solution. In one embodiment, the unused substrate cleaning liquid is stored in the substrate cleaning liquid tank 50 and is supplied from the substrate cleaning liquid tank 50 to the cleaning apparatus 30.
  • the coating apparatus 10 reuses the used substrate cleaning liquid stored in the used cleaning liquid tank 51 as a cleaning liquid supplied to the inside of the coating apparatus 10. Thereby, the inside of the coating apparatus 10 can be cleaned without increasing the amount of cleaning liquid used in the entire system.
  • the used substrate cleaning liquid discharged from the cleaning apparatus 30 is relatively clean. Therefore, the used substrate cleaning liquid can be suitably reused as a cleaning liquid used for cleaning the inside of the coating apparatus 10.
  • the amount of the used substrate cleaning liquid discharged from the cleaning apparatus 30 is about 50 mL per substrate in one example, and can sufficiently cover the cleaning liquid used in the coating apparatus 10.
  • the coating apparatus 10 first cleans the inside of the apparatus using an unused cleaning liquid, and after the sufficient amount of used substrate cleaning liquid has accumulated in the used cleaning liquid tank 51, the coating apparatus 10 is used. It can be configured to clean the inside of the apparatus by reusing the used substrate cleaning liquid. For example, in one embodiment, when the amount of the used substrate cleaning liquid stored in the used cleaning liquid tank 51 is less than a predetermined threshold, the coating apparatus 10 uses the unused cleaning liquid tank 52 stored in the unused cleaning liquid tank 52. When the amount of the used substrate cleaning liquid stored in the used cleaning liquid tank 51 is equal to or greater than the above threshold, the used substrate cleaning liquid stored in the used cleaning liquid tank 51 is used. ing.
  • an unused cleaning liquid is supplied from the unused cleaning liquid tank 52 to the coating apparatus 10 according to the amount of the used substrate cleaning liquid stored in the used cleaning liquid tank 51 or is used. It may control whether the used substrate cleaning liquid is supplied from the cleaning liquid tank 51 to the coating apparatus 10. Thereby, washing
  • the control of whether the cleaning liquid is supplied from the used cleaning liquid tank 51 or the unused cleaning liquid tank 52 to the coating apparatus 10 may be performed by, for example, the valve 54, but is not particularly limited, and a known technique is used. What is necessary is just to control the flow of each washing
  • the waste liquid containing the used cleaning liquid and the coating liquid discharged from the coating apparatus 10 is discarded into the waste liquid tank 53.
  • the cleaning apparatus 30 spin-cleans the substrate 1 with the substrate cleaning liquid, and the coating apparatus 10 applies the used substrate cleaning liquid used by the cleaning apparatus 30. It is used as a cleaning liquid for supplying the inside of the apparatus 10 (for example, at least one of the inner wall of the cup 11 and the discharge path 14).
  • the inside of the coating apparatus 10 is cleaned without increasing the amount of the cleaning liquid used in the entire system, and the coating liquid is applied to the inside of the coating apparatus. Occurrence of problems due to adhesion can be suppressed.
  • the present invention can be used in the substrate processing field and the substrate processing apparatus manufacturing field.

Abstract

Le dispositif d'application (10) de l'invention est équipé : d'un godet (11) entourant un substrat (1); d'une buse (12) déchargeant un liquide d'application sur le substrat (1); d'une partie rotation (18) mettant le substrat (1) en rotation; d'un chemin d'évacuation (14) évacuant le liquide d'application du godet (11); et de parties nettoyage de dispositif (16, 17) qui alimentent en liquide de nettoyage la paroi interne du godet (11) et/ou le chemin d'évacuation (14).
PCT/JP2013/062353 2012-05-22 2013-04-26 Dispositif d'application, et système ainsi que procédé de traitement de substrat WO2013175934A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012117002A JP5982176B2 (ja) 2012-05-22 2012-05-22 基板処理システムおよび基板処理方法
JP2012-117002 2012-05-22

Publications (1)

Publication Number Publication Date
WO2013175934A1 true WO2013175934A1 (fr) 2013-11-28

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Application Number Title Priority Date Filing Date
PCT/JP2013/062353 WO2013175934A1 (fr) 2012-05-22 2013-04-26 Dispositif d'application, et système ainsi que procédé de traitement de substrat

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JP (1) JP5982176B2 (fr)
TW (1) TW201404473A (fr)
WO (1) WO2013175934A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6883462B2 (ja) * 2017-04-11 2021-06-09 東京エレクトロン株式会社 基板処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201707A (ja) * 1993-12-27 1995-08-04 Dainippon Screen Mfg Co Ltd 回転式塗布装置
JP2000164491A (ja) * 1998-11-26 2000-06-16 Sony Corp レジスト塗布装置
JP2001093804A (ja) * 1999-09-20 2001-04-06 Sony Corp 半導体製造装置
JP2002205021A (ja) * 2001-01-09 2002-07-23 Seiko Epson Corp スピンコーターカップの洗浄方法
JP2003080159A (ja) * 2001-09-10 2003-03-18 Dainippon Screen Mfg Co Ltd 回転塗布装置

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JPS4884857U (fr) * 1972-01-14 1973-10-15
JPS5923517A (ja) * 1982-07-30 1984-02-07 Hitachi Ltd レジスト除去方法および装置
JPS5967930U (ja) * 1982-10-28 1984-05-08 富士通株式会社 レジスト塗布装置
JP3824057B2 (ja) * 2000-09-13 2006-09-20 東京エレクトロン株式会社 液処理装置
JP2006086204A (ja) * 2004-09-14 2006-03-30 Tokyo Ohka Kogyo Co Ltd 塗布装置
JP4748683B2 (ja) * 2006-10-20 2011-08-17 東京エレクトロン株式会社 液処理装置
JP5375793B2 (ja) * 2010-10-14 2013-12-25 東京エレクトロン株式会社 液処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201707A (ja) * 1993-12-27 1995-08-04 Dainippon Screen Mfg Co Ltd 回転式塗布装置
JP2000164491A (ja) * 1998-11-26 2000-06-16 Sony Corp レジスト塗布装置
JP2001093804A (ja) * 1999-09-20 2001-04-06 Sony Corp 半導体製造装置
JP2002205021A (ja) * 2001-01-09 2002-07-23 Seiko Epson Corp スピンコーターカップの洗浄方法
JP2003080159A (ja) * 2001-09-10 2003-03-18 Dainippon Screen Mfg Co Ltd 回転塗布装置

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JP2013243317A (ja) 2013-12-05
JP5982176B2 (ja) 2016-08-31
TW201404473A (zh) 2014-02-01

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